JP2006286757A - Heat dissipation structure of electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the heat dissipation structure of an electronic apparatus which is compact and can keep high heat dissipation. <P>SOLUTION: The electronic apparatus is comprised of a circuit board 2 wherein a plurality of heat generators 21 and 22 are mounted on the front and rear surfaces thereof, and an enclosure 1 which can houses a plurality of circuit boards 2 that are faced each other. The enclosure 1 is used for heat dissipation of the heat generators 21 and 22. In such a heat dissipation structure, the enclosure 1 is provided with an internal partition 11 made integral with the side surface 12 of the enclosure in its inside, and two circuit boards 2 are provided in a manner to pinch both sides of the internal partition 11. When the heat generators 21 and 22 mounted on the front and rear sides of the circuit board 2 are pressed down to the internal partition 11, a heat of the heat generators 21 and 22 are transmitted to the internal partition 11, and it is radiated to the outside. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  An electronic device comprising a circuit board on which heat generating electronic components are mounted on the front and back sides and a housing having thermal conductivity capable of storing a plurality of the circuit boards facing each other, and each heat generating electronic component is radiated by the case Relates to the heat dissipation structure.

2. Description of the Related Art Conventionally, an electronic device includes a circuit board on which various electronic components are mounted and a casing that houses them. Some electronic components mounted on the circuit board generate heat when the circuit is operated, and these have a structure in which heat is transferred to the casing and heat is radiated to the outside. For example, such structures include those shown in FIGS.
FIG. 4 is a cross-sectional view showing the heat dissipation structure of the electronic device according to the first prior art.
In the figure, 101 is a case, 102 is one side wall, 103 is a semiconductor element, 104 is a circuit board, and 105 is an elastic member having high thermal conductivity.
When the circuit operation generates heat from the semiconductor element 103 and the space in the case 101 becomes high temperature due to the heat, the operation of the circuit board 104 becomes unstable. An elastic member 105 is provided so that heat generated from the semiconductor element 103 can be dissipated outside the case 101 through the elastic member 105 (see, for example, Patent Document 1).
FIG. 5 is a cross-sectional view showing a heat dissipation structure of an electronic device according to the second prior art.
In the figure, 111 is a circuit board, 112 is a high heat generating electronic component, 113 is a low heat generating electronic component, 114 is a case, and 115 is a heat conducting member.
The case 114 houses a circuit board 111 on which a plurality of high heat generation electronic components 112 having a large heat generation amount and a plurality of low heat generation electronic components 113 having a small heat generation amount are mounted. Specifically, a heat conduction member 115 that physically joins the high heat generation electronic component 112 and the case 114 is individually interposed between the high heat generation electronic component 112 and the case 114, and the high heat generation electronic component 112 and the low heat generation electronic device are interposed. The component 113 is separated, and only the high heat generation electronic component 112 is mounted on one surface of the circuit board 111, and only the low heat generation electronic component 113 is mounted on the surface opposite to the mounting surface of the high heat generation electronic component 112. (For example, see Patent Document 2).
JP 2002-271067 A (page 3, FIG. 1) JP 2003-152368 A (Page 4, FIG. 1)

Since the heat dissipation structure of the electronic device according to the first conventional technique and the second conventional technique is configured to dissipate heat from the heat-generating electronic component mounted on the circuit board only from one side of the circuit board, the circuit board When it is necessary to mount the heat generating electronic components on both sides, there is a problem that heat dissipation of the heat generating electronic components becomes very difficult.
In addition, when a plurality of circuit boards are housed in a housing and a heat generating electronic component is mounted on each circuit board, there are heat generating electronic components facing each other without facing the inner wall of the housing. However, there was a problem that good heat dissipation could not be performed.
The present invention has been made in view of such a problem, and an object of the present invention is to provide a small heat dissipation structure for a plurality of heat generating electronic components inside an electronic device while maintaining high heat dissipation.

In order to solve the above problem, the present invention is configured as follows.
The invention according to claim 1 comprises a circuit board on which a plurality of heat generating electronic components are mounted on the front and back sides, and a casing having thermal conductivity capable of accommodating a plurality of the circuit boards facing each other. In the heat dissipation structure of an electronic device that dissipates heat from each heat generating electronic component, the casing has an internal partition, and at least two circuit boards are attached so as to sandwich both surfaces of the internal partition. The heat generated from the heat generating electronic component is transferred to the internal partition wall by pressing the plurality of heat generating electronic components mounted on the front and back of the circuit board against the internal partition wall, and is radiated to the outside. It is said.
According to a second aspect of the present invention, in the heat dissipation structure for an electronic device according to the first aspect, a part of the inner partition wall has a concave groove.
According to a third aspect of the present invention, in the electronic device heat dissipation structure according to the first aspect, a plurality of the casings and the circuit boards are alternately stacked.
According to a fourth aspect of the present invention, in the heat dissipation structure for an electronic device according to the third aspect, a heat insulating material is provided between the casings so that the plurality of casings do not transfer heat to each other. It is said.
According to a fifth aspect of the present invention, in the heat dissipation structure for an electronic device according to any one of the first to fourth aspects, a heat sink for heat dissipation is provided in the housing.

According to the first aspect of the present invention, all the heat generating electronic components mounted on the circuit board can be radiated favorably by the casing.
In addition, according to the second aspect of the present invention, the distance between the circuit boards can be shortened, and the electronic apparatus can be downsized.
In addition, according to the third aspect of the present invention, it is possible to favorably dissipate all the heat generating electronic components mounted on a larger number of circuit boards by the housing.
In addition, according to the fourth aspect of the present invention, it is possible to prevent the influence of heat between the plurality of casings, and to perform heat dissipation of the heat generating electronic component satisfactorily.
Further, according to the invention described in claim 5, it is possible to increase the heat dissipation area of the electronic device and to perform heat dissipation satisfactorily.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a side sectional view of a heat dissipation structure for a heat generating electronic component mounted on an electronic apparatus according to a first embodiment of the present invention.
In the figure, 1 is a housing, 11 is an internal partition wall, 12 is a side surface of the housing, 13 is a groove portion, 2 is a circuit board, 21 is a heat generating electronic component, 22 is a heat generating electronic component having a high component height, 23 is a connector, 3 Is a lid having thermal conductivity.
The present invention is different from the prior art in that the housing 1 has an internal partition wall 11 integrated with the side surface 12 of the housing, and two circuit boards 2 are attached so as to sandwich both surfaces of the internal partition wall 11. The heat generating electronic components 21 and 22 mounted on the front and back of the circuit board 2 are pressed against the internal partition wall 11 to transfer the heat of the heat generating electronic components 21 and 22 to the internal partition wall 11 and to the outside. This is the point of heat dissipation.
Also, when the heat generating electronic component 22 having a higher component height than the heat generating electronic component 21 is housed in the housing 1, a part of the inner partition wall 11 is concave so that it can be easily pushed into the inner partition wall 11. And the depth of the groove 13 is adjusted in accordance with the height of the component.
The connector 23 is used to electrically connect the circuit boards 2 and is mounted on each board 2. Then, a lid 3 is attached to the upper part of the housing 1 so that the heat generating electronic component 21 mounted on the opposing circuit board 2 is pressed.

Next, the movement of heat inside the electronic apparatus will be described with reference to FIG.
In the figure, the heat of the heat generating electronic component 21 mounted on the circuit board 2 facing the lid 3 is radiated to the outside through the lid 3. On the other hand, the heat of the heat generating electronic component 21 mounted between the circuit boards 2 and the heat generating electronic component 22 having a high component height is transferred to the opposing internal partition wall 11 and further transferred to the side surface 12 of the housing, Heat dissipation is performed. Here, the heat-generating electronic component 22 having a high component height is pressed against the bottom surface of the concave groove portion 13 and can transfer heat to the internal partition wall 11 like the other heat-generating electronic components 21.
A heat conductive elastic body may be used between the lid 3 and the internal partition wall 11 and the heat generating electronic component 21 and the heat generating electronic component 22 in order to provide electrical insulation and to obtain good heat transfer. Further, if 22 is not a heat generating electronic component, the 13 concave grooves may be cut through, and the space between the circuit boards can be narrowed until no contact is made with the components mounted on the opposing circuit board.

The first embodiment of the present invention comprises a circuit board on which a plurality of heat generating electronic components are mounted on the front and back sides, and a case having thermal conductivity capable of accommodating a plurality of circuit boards facing each other. In the heat dissipation structure of an electronic device that radiates heat generating electronic components, the housing has an internal partition, and at least two circuit boards are attached so as to sandwich both surfaces of the internal partition, By pressing a plurality of heat generating electronic components mounted on the front and back of the board against the internal partition, the heat of the heat generating electronic component is transferred to the internal partition and dissipated to the outside. All the heat generating electronic components that are present can be radiated well by the housing.
In addition, since a part of the inner partition wall of the housing is formed into a concave groove, the distance between the circuit boards can be shortened, and the electronic device can be downsized.

FIG. 2 is a side sectional view of a heat dissipation structure for an electronic device showing a second embodiment of the present invention.
In the figure, the difference from the prior art is that the casings 1 and the circuit boards 2 are alternately overlapped and three circuit boards are accommodated, and the heat insulating material 4 is sandwiched between the casings 1. Since the heat transfer is the same as that in the first embodiment, the description thereof is omitted.

In the second embodiment of the present invention, the casing 1 and the circuit board are alternately stacked. Therefore, the heat generating electronic component mounted on any circuit board always faces the internal partition wall or the lid. Heat can be dissipated in the same way as
In addition, since the heat insulating material is sandwiched between the housings, heat transfer between the housings is prevented, and the heat of the heat generating electronic components mounted on one circuit board is mounted on the other circuit board. Heat can be prevented from being transmitted to the heat generating electronic component.
Here, three circuit boards are accommodated in the figure, but the number of circuit boards is not particularly limited.

FIG. 3 is a side sectional view of a heat dissipation structure for an electronic device according to a third embodiment of the present invention.
In the figure, the difference from the other embodiments is that a heat sink 5 is provided on each side surface 12 of the casing.
By providing a heat sink on the side of each case, the heat dissipation area increases, and the heat of the heat generating electronic components mounted on the circuit board is dissipated on both the heat sink and the side of the case where the heat sink is not attached. Can do.
Note that the heat sinks may be collectively provided on the side surfaces of the respective housings without being individually attached as long as there is no influence of heat between the side surfaces of the housings.

  In the third embodiment of the present invention, since the heat sink is separately provided in the housing, the heat radiation area of the electronic device can be increased and the heat radiation can be performed satisfactorily.

  The present invention can be applied to all electronic devices that house a plurality of circuit boards on which heat generating electronic components are mounted.

1 is a side sectional view of a heat dissipation structure of an electronic device showing a first embodiment of the present invention. Side sectional view of the heat dissipation structure of the electronic device showing the second embodiment of the present invention Side sectional view of the heat dissipation structure of the electronic equipment showing the third embodiment of the present invention Side sectional view of heat dissipation structure of electronic device showing first prior art Side sectional view of heat dissipation structure of electronic device showing second prior art

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Case 2 Circuit board 3 Lid 4 Heat insulating material 5 Heat sink 11 Internal partition 12 Case side surface 13 Groove part 21 Heat generating electronic component 22 Heat generating electronic component (electronic component with high component height)
23 Connector

Claims (5)

A circuit board having a plurality of heat generating electronic components mounted on the front and back and a housing having thermal conductivity capable of accommodating a plurality of the circuit boards facing each other, and the heat dissipation of each heat generating electronic component by the housing. In the heat dissipation structure of electronic equipment to be performed,
The housing has an internal partition inside.
At least two of the circuit boards are attached so as to sandwich both surfaces of the internal partition wall,
An electronic device characterized in that heat of the heat generating electronic component is transferred to the internal partition wall and is radiated to the outside by pressing the plurality of heat generation electronic components mounted on the front and back of the circuit board against the internal partition wall. Equipment heat dissipation structure.   2. A heat dissipation structure for an electronic device according to claim 1, wherein a part of the inner partition wall has a concave groove.   2. The heat dissipation structure for an electronic device according to claim 1, wherein a plurality of the casings and the circuit boards are alternately stacked.   The heat dissipation structure for an electronic device according to claim 3, wherein a heat insulating material is provided between the plurality of housings so that the plurality of housings do not transfer heat to each other.   The heat dissipation structure for an electronic device according to any one of claims 1 to 4, wherein a heat sink for heat dissipation is provided in the casing.

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