JP2006256209A - Molded body having laminated film - Google Patents
Molded body having laminated film Download PDFInfo
- Publication number
- JP2006256209A JP2006256209A JP2005079012A JP2005079012A JP2006256209A JP 2006256209 A JP2006256209 A JP 2006256209A JP 2005079012 A JP2005079012 A JP 2005079012A JP 2005079012 A JP2005079012 A JP 2005079012A JP 2006256209 A JP2006256209 A JP 2006256209A
- Authority
- JP
- Japan
- Prior art keywords
- group
- molded body
- laminated film
- contain
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 44
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 44
- 125000003118 aryl group Chemical group 0.000 claims abstract description 40
- 239000010409 thin film Substances 0.000 claims abstract description 34
- 125000005843 halogen group Chemical group 0.000 claims abstract description 21
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 18
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 18
- 239000004417 polycarbonate Substances 0.000 claims abstract description 18
- 230000009477 glass transition Effects 0.000 claims abstract description 9
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 45
- 238000007740 vapor deposition Methods 0.000 claims description 29
- 239000010408 film Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 25
- 125000004432 carbon atom Chemical group C* 0.000 claims description 24
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 10
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 9
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 150000003384 small molecules Chemical class 0.000 claims description 5
- 230000037303 wrinkles Effects 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 238000012360 testing method Methods 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 10
- 230000008021 deposition Effects 0.000 abstract description 3
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- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 238000000034 method Methods 0.000 description 40
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 27
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 27
- 238000006243 chemical reaction Methods 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 150000002430 hydrocarbons Chemical group 0.000 description 13
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 150000002989 phenols Chemical class 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- -1 ITO Chemical compound 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000007733 ion plating Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000008346 aqueous phase Substances 0.000 description 4
- 238000007664 blowing Methods 0.000 description 4
- 150000004650 carbonic acid diesters Chemical class 0.000 description 4
- GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
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- 238000004381 surface treatment Methods 0.000 description 4
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000005809 transesterification reaction Methods 0.000 description 3
- OWEYKIWAZBBXJK-UHFFFAOYSA-N 1,1-Dichloro-2,2-bis(4-hydroxyphenyl)ethylene Chemical compound C1=CC(O)=CC=C1C(=C(Cl)Cl)C1=CC=C(O)C=C1 OWEYKIWAZBBXJK-UHFFFAOYSA-N 0.000 description 2
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 208000023514 Barrett esophagus Diseases 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000003480 eluent Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- MQSVWTXCKSCUBT-UHFFFAOYSA-N 2-ethyl-4-[9-(3-ethyl-4-hydroxyphenyl)fluoren-9-yl]phenol Chemical compound C1=C(O)C(CC)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(CC)C(O)=CC=2)=C1 MQSVWTXCKSCUBT-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- KCIVBLNHLBBZFE-UHFFFAOYSA-N 4-(9h-fluoren-1-yl)-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C=2C3=C(C4=CC=CC=C4C3)C=CC=2)=C1 KCIVBLNHLBBZFE-UHFFFAOYSA-N 0.000 description 1
- UJCYBTZHUJWCMB-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-4-propan-2-ylcyclohexyl]phenol Chemical compound C1CC(C(C)C)CCC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UJCYBTZHUJWCMB-UHFFFAOYSA-N 0.000 description 1
- WCUDAIJOADOKAW-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)pentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCC)C1=CC=C(O)C=C1 WCUDAIJOADOKAW-UHFFFAOYSA-N 0.000 description 1
- ZJNKCNFBTBFNMO-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-5,7-dimethyl-1-adamantyl]phenol Chemical compound C1C(C)(C2)CC(C3)(C)CC1(C=1C=CC(O)=CC=1)CC23C1=CC=C(O)C=C1 ZJNKCNFBTBFNMO-UHFFFAOYSA-N 0.000 description 1
- FVIAPUZAEIMEEW-UHFFFAOYSA-N 4-[4-(4-hydroxyphenyl)phenyl]phenol Chemical compound C1=CC(O)=CC=C1C1=CC=C(C=2C=CC(O)=CC=2)C=C1 FVIAPUZAEIMEEW-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- WLHJCCUFRCTNRZ-UHFFFAOYSA-N C(CC1)CCC1(c1ccccc1)c1ccccc1 Chemical compound C(CC1)CCC1(c1ccccc1)c1ccccc1 WLHJCCUFRCTNRZ-UHFFFAOYSA-N 0.000 description 1
- XFVQRPIVLYHIKD-UHFFFAOYSA-N CCC(C)(CC)[NH+]([O-])OC Chemical compound CCC(C)(CC)[NH+]([O-])OC XFVQRPIVLYHIKD-UHFFFAOYSA-N 0.000 description 1
- FPCYFMDNIDLTSH-UHFFFAOYSA-N CCCC(C)(C)[NH+]([O-])OC Chemical compound CCCC(C)(C)[NH+]([O-])OC FPCYFMDNIDLTSH-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N beta-monoglyceryl stearate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QLVWOKQMDLQXNN-UHFFFAOYSA-N dibutyl carbonate Chemical compound CCCCOC(=O)OCCCC QLVWOKQMDLQXNN-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
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- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 230000007062 hydrolysis Effects 0.000 description 1
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- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000000752 ionisation method Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
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- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
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- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
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- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical compound OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 1
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
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- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Laminated Bodies (AREA)
- Polyesters Or Polycarbonates (AREA)
Abstract
Description
本発明は、ポリカーボネート樹脂からなる成形体に薄膜を形成した成形体に関する。さらに詳しくは、ガラス転移温度が一定値以上のポリカーボネート樹脂、特に特定の組成の芳香族ジヒドロキシ成分からなるポリカーボネート樹脂を用いた成形体に、基板温度が１３０℃〜Ｔｇ−１０℃となる条件で、蒸着により薄膜を形成した成形体に関する。 The present invention relates to a molded body in which a thin film is formed on a molded body made of polycarbonate resin. More specifically, in a molded body using a polycarbonate resin having a glass transition temperature of a certain value or more, particularly a polycarbonate resin composed of an aromatic dihydroxy component having a specific composition, the substrate temperature is 130 ° C. to Tg−10 ° C. The present invention relates to a molded body in which a thin film is formed by vapor deposition.
従来、ポリカーボネートはその耐熱性や機械特性、成形性、寸法安定性などのバランスに優れ、そのポリカーボネートからなる成形体に反射膜を形成した自動車等のランプレンズリフレクターや、光学ミラーといった成形部品などにも広く使用されている。しかしながら、ポリカーボネートからなる成形体に単に蒸着を行うだけでは、形成した薄膜の十分な密着性を得ることは困難である。密着性を高める為には蒸着時の基板温度を高める必要があることが一般に知られているが、従来のポリカーボネート樹脂からならなる成形体では、耐熱性が足りず、樹脂が変形したりする問題があった。このため、蒸着層の下に密着性を向上させるためのプライマー層を塗膜したり、成形体表面をプラズマ処理するなどの表面処理を行うことにより低温での蒸着でも密着性が得られるような前処理を行う必要があるが、設備やコストがかかることが大きな問題であり、簡便に且つ高い密着性が得られる薄膜形成の手法が求められている。 Conventionally, polycarbonate has an excellent balance of heat resistance, mechanical properties, moldability, dimensional stability, etc., and it is used for molded parts such as lamp lens reflectors for automobiles, etc. in which a reflective film is formed on a molded body made of the polycarbonate, and optical mirrors. Are also widely used. However, it is difficult to obtain sufficient adhesion of the formed thin film by simply performing vapor deposition on a molded body made of polycarbonate. It is generally known that it is necessary to increase the substrate temperature during vapor deposition in order to improve the adhesion, but the conventional molded body made of polycarbonate resin has insufficient heat resistance and the resin may be deformed. was there. For this reason, it is possible to obtain adhesion even at low temperature deposition by coating a primer layer for improving adhesion under the vapor deposition layer, or by performing surface treatment such as plasma treatment of the surface of the molded body. Although it is necessary to perform pretreatment, it is a big problem that the equipment and the cost are high, and there is a demand for a method of forming a thin film that can easily and have high adhesion.
また、前処理を行う必要がないように、樹脂自身を改良することで密着性を改良しようとする提案もなされているが、熱安定性の低下により良好な成形体を得ることが困難であるという問題や、基板温度を上げることで変形が生じてしまうという問題は解決できていなかった（例えば特許文献１〜３参照）。 In addition, proposals have been made to improve the adhesion by improving the resin itself so that it is not necessary to perform a pretreatment, but it is difficult to obtain a good molded product due to a decrease in thermal stability. However, the problem that the deformation occurs when the substrate temperature is raised has not been solved (see, for example, Patent Documents 1 to 3).
本発明の目的は、薄膜密着性の向上したポリカーボネート樹脂からなる成形体を得ることにある。本発明者は、様々な検討を積み重ねた結果、ガラス転移温度が１５０℃以上であるポリカーボネート樹脂、特に特定の組成の芳香族ジヒドロキシ成分からなるポリカーボネート樹脂を用いた成形体に、一定の基板温度範囲内で、蒸着により薄膜を形成することにより、上記目的が達成されることを見出し、本発明に到達した。 An object of the present invention is to obtain a molded body made of a polycarbonate resin having improved thin film adhesion. As a result of various investigations, the present inventor has found that a molded body using a polycarbonate resin having a glass transition temperature of 150 ° C. or higher, particularly a polycarbonate resin comprising an aromatic dihydroxy component having a specific composition, has a certain substrate temperature range. In particular, the inventors have found that the above object can be achieved by forming a thin film by vapor deposition, and have reached the present invention.
すなわち、本発明によれば、ガラス転移温度が１５０℃以上であるポリカーボネート樹脂を用いた成形体に、基板温度が１３０℃〜Ｔｇ−１０℃となる条件で、蒸着により薄膜を形成した成形体が提供される。ポリカーボネート樹脂のガラス転移温度は１６０℃以上であることがより好ましく、１６５℃以上であることがさらに好ましい。ガラス転移温度が１５０℃よりも低い場合、蒸着により薄膜を形成する際に、基板の温度が上昇することで成形体が大きく変形したり、基板樹脂表面が応力緩和により収縮することで蒸着した薄膜が部分的に寄り集まって微細なしわが生じたり、逆に基板樹脂表面が膨張することで蒸着した薄膜に微細なクラックが生じる恐れがあるため好ましくない。 That is, according to the present invention, a molded body in which a thin film is formed by vapor deposition on a molded body using a polycarbonate resin having a glass transition temperature of 150 ° C. or higher under a condition that the substrate temperature is 130 ° C. to Tg−10 ° C. Provided. The glass transition temperature of the polycarbonate resin is more preferably 160 ° C. or higher, and further preferably 165 ° C. or higher. When the glass transition temperature is lower than 150 ° C., when forming a thin film by vapor deposition, the molded body is greatly deformed by increasing the temperature of the substrate, or the thin film deposited by shrinking the substrate resin surface due to stress relaxation. This is not preferable because there is a risk that fine wrinkles will be caused by partial gathering and fine wrinkles will occur in the deposited thin film due to the expansion of the substrate resin surface.
この成形体としてはランプレンズリフレクター、ミラー、レンズ、プリズム等に用いられる板状成形体、球面あるいは非球面レンズ状成形体、液晶ディスプレイのバックライトの反射板、反射フィルム等に用いられるシート、フィルム等が挙げられるがこれらに限定されるものではない。 As this molded article, a plate-like molded article used for lamp lens reflectors, mirrors, lenses, prisms, etc., a spherical or aspherical lens-like molded article, a reflector for a backlight of a liquid crystal display, a sheet or film used for a reflective film, etc. However, it is not limited to these.
本発明のポリカーボネート樹脂から成形体を得る方法としては、射出成形，圧縮成形，射出圧縮成形，押し出し成形、ブロー成形等が用いられる。フィルムやシートを製造する方法としては、例えば溶剤キャスト法、溶融押出し法、カレンダー法等が挙げられるが、効率的な方法としては溶融押出し法が好ましく用いられる。 As a method for obtaining a molded body from the polycarbonate resin of the present invention, injection molding, compression molding, injection compression molding, extrusion molding, blow molding or the like is used. Examples of a method for producing a film or sheet include a solvent casting method, a melt extrusion method, a calendar method, and the like. As an efficient method, a melt extrusion method is preferably used.
本発明の成形体に用いられる薄膜の厚みは１ｎｍ〜３００ｎｍが好ましく、５ｎｍ〜２００ｎｍがより好ましく、３０ｎｍ〜１５０ｎｍが最も好ましい。 The thickness of the thin film used in the molded product of the present invention is preferably 1 nm to 300 nm, more preferably 5 nm to 200 nm, and most preferably 30 nm to 150 nm.
本発明における成形体の密着性は成形板の蒸着面にカッターナイフで１ｍｍ間隔の１００個の碁盤目を作りニチバン製粘着テープ（商品名“セロテープ”）を圧着し、次いで密着したセロファンテープを直角にかつ急激に剥離した際に剥離せずに残った碁盤目の目数の割合（％）で定義され、本願の成形体ではその密着性が８０％以上である事が好ましく、９５％以上であることがより好ましい。 In the present invention, the adhesiveness of the molded body is determined by making 100 grids with a 1 mm interval on the vapor deposition surface of the molding plate, press-bonding Nichiban adhesive tape (trade name “cello tape”), and then right-angle the adhered cellophane tape. Furthermore, it is defined by the ratio (%) of the number of grids remaining without peeling when abruptly peeling, and in the molded product of the present application, the adhesion is preferably 80% or more, and 95% or more. More preferably.
また、本発明の成形体については基板樹脂表面が応力緩和により収縮することで蒸着した薄膜が部分的に寄り集まって生じる微細なしわや、逆に基板樹脂表面が膨張することで蒸着した薄膜に生じる微細なクラックが１ｍｍ２当たり１０ヶ以下であることが好ましく、５ケ以下がより好ましく、１ケ以下であることが最も好ましい。 In addition, the molded body of the present invention is a fine wrinkle produced by the thin film deposited due to the substrate resin surface contracting due to stress relaxation, and conversely the thin film deposited by the expansion of the substrate resin surface. The number of fine cracks generated is preferably 10 or less per 1 mm 2 , more preferably 5 or less, and most preferably 1 or less.
また、本発明の成形体のうち反射機能を持った成形体は蒸着性の指標となる正反射率が８０％以上、拡散反射率が２．０％以下であることが好ましく、正反射率が８５％以上、拡散反射率が１．５％以下であることがより好ましい。基板が熱変形等を起こし、薄膜に上記の微細なしわやクラックが発生し拡散反射率が大きくなると表面が白濁したように観察されるため、正反射率が８０％以下、拡散反射率が２．０％以上であるとミラー等の反射機能を持った部品としては不適当である。 Of the molded products of the present invention, the molded product having a reflective function preferably has a regular reflectance of 80% or more and a diffuse reflectance of 2.0% or less, which are indicators of vapor deposition, and has a regular reflectance. More preferably, it is 85% or more and the diffuse reflectance is 1.5% or less. When the substrate undergoes thermal deformation or the like, the fine wrinkles or cracks occur in the thin film and the diffuse reflectance increases, the surface is observed as white turbidity. Therefore, the regular reflectance is 80% or less, and the diffuse reflectance is 2 If it is 0.0% or more, it is not suitable as a part having a reflection function such as a mirror.
本発明のポリカーボネート樹脂からなる成形体に薄膜を形成する方法は、物理蒸着法である。物理蒸着法には大きく分けて、通常の真空蒸着、イオンプレーティング、スパッタリング法があるが、いずれかの方法に限定されるものではない。 A method of forming a thin film on a molded body made of the polycarbonate resin of the present invention is a physical vapor deposition method. Physical vapor deposition methods can be broadly classified into ordinary vacuum vapor deposition, ion plating, and sputtering methods, but are not limited to any of these methods.
イオンプレーティングとは、蒸発原子をイオン化により加速させて成形体などの基板に打ち込む蒸着法をいう。イオンプレーティング法としては、そのイオン化法などにより種々の方法があり、特に限定されるものではないが、例えば、直流放電励起法、多陰極熱電子照射法、高周波励起法（ＲＦ法）、ホローカソード法（ＨＣＤ法）、クラスターイオンビーム法（ＩＣＢ法）、活性化反応蒸着法（ＡＲＥ法）、マルチアーク方式（アーク放電，ＡＩＰ法）、イオンビームアシスト蒸着、電子ビーム励起プラズマイオンプレーティングなどが挙げられる。また、蒸着成分によってはプラズマガスに反応性ガスや有機モノマーガスを用いた、反応性イオンプレーティングも行うことができる。その中でも直流放電励起法、高周波励起法あるいはホローカソード法が好ましい。 Ion plating refers to a vapor deposition method in which evaporated atoms are accelerated by ionization and driven into a substrate such as a molded body. The ion plating method includes various methods depending on the ionization method, and is not particularly limited. For example, a direct current discharge excitation method, a multi-cathode thermal electron irradiation method, a high frequency excitation method (RF method), a hollow method, and the like. Cathode method (HCD method), cluster ion beam method (ICB method), activated reaction deposition method (ARE method), multi-arc method (arc discharge, AIP method), ion beam assisted deposition, electron beam excited plasma ion plating, etc. Is mentioned. Depending on the vapor deposition component, reactive ion plating using a reactive gas or an organic monomer gas as the plasma gas can also be performed. Among these, a direct current discharge excitation method, a high frequency excitation method, or a hollow cathode method is preferable.
スパッタリング法とは、高エネルギー粒子を、薄膜を形成する母材に当てることで、母材の構成原子がたたき出されるいわゆるスパッタリング現象を利用して蒸着を行う方法である。スパッタリング法としては、例えば、高周波スパッタリング法、マグネトロンスパッタリング法、イオンビームスパッタリング法（ＩＢＳ法）などが挙げられる。また、蒸着成分によってはスパッタガスに反応性ガスを用いた、反応性スパッタリングも行うことができる。 The sputtering method is a method of performing vapor deposition using a so-called sputtering phenomenon in which constituent atoms of a base material are knocked out by applying high energy particles to the base material forming a thin film. Examples of the sputtering method include a high frequency sputtering method, a magnetron sputtering method, and an ion beam sputtering method (IBS method). Further, depending on the vapor deposition component, reactive sputtering using a reactive gas as a sputtering gas can also be performed.
本発明の成形体に蒸着を行う際、基板を形成するポリカーボネート樹脂のガラス転移温度をＴｇとすると、基板温度は１３０℃〜Ｔｇ−１０℃であることが好ましく、１４０℃〜Ｔｇ−２０℃がより好ましい。また、１４５℃〜Ｔｇ−２５℃が最も好ましい。基板温度が１３０℃よりも低い場合、蒸着した薄膜の密着性が悪化することがあるため好ましくない。また基板温度がＴｇ−１０℃を越えてしまうと、蒸着の際に成形体が熱変形を起こしてしまうことがあるため好ましくない。 When vapor deposition is performed on the molded article of the present invention, when the glass transition temperature of the polycarbonate resin forming the substrate is Tg, the substrate temperature is preferably 130 ° C to Tg-10 ° C, and 140 ° C to Tg-20 ° C. More preferred. Moreover, 145 degreeC-Tg-25 degreeC are the most preferable. When the substrate temperature is lower than 130 ° C., the adhesion of the deposited thin film may deteriorate, which is not preferable. On the other hand, if the substrate temperature exceeds Tg-10 ° C., the molded body may be thermally deformed during vapor deposition, which is not preferable.
本発明の成形体に蒸着する薄膜成分としては、特に限定されるものではないが、例えば、Ａｌ，Ｔｉ，Ｃｒ，Ａｇ，Ａｕ，Ｆｅ，Ｇａ，Ｚｒ，Ｎｂ，Ｍｏ，Ｌａ，Ｔａ，Ｗ，Ｍｎ，Ｒｅ，Ｓｒ，Ｃｏ，Ｒｈ，Ｐｄ，Ｉｒ，Ｐｔ，ＭｇＦ２，ＳｉＯ２，ＭｇＯ，ＨｆＯ２，Ｔａ２Ｏ５，ＣｅＯ２，ＴｉＯ２，ＴｉＮ，ＴｉＣ，ＣｒＮ，Ａｌ２Ｏ３，ＡｌＮ，ＧａＮ，ＩＴＯ，ＺｎＯ，ＧａＡｓ，各種有機モノマーなどが挙げられる。 Although it does not specifically limit as a thin film component vapor-deposited on the molded object of this invention, For example, Al, Ti, Cr, Ag, Au, Fe, Ga, Zr, Nb, Mo, La, Ta, W, Mn, Re, Sr, Co, Rh, Pd, Ir, Pt, MgF 2, SiO 2, MgO, HfO 2, Ta 2 O 5, CeO 2, TiO 2, TiN, TiC, CrN, Al 2 O 3, AlN , GaN, ITO, ZnO, GaAs, and various organic monomers.
本発明の成形体に蒸着する反射膜としては、金属元素、例えば上記成分の中でＡｌ、Ｃｒ、Ａｇ、Ａｕ、Ｆｅ、Ｔｉ、Ｐｔ等を単独で、あるいは複合させて用いることができる。そのうちＡｌおよびＡｕを単独で使用するか、もしくは０．５重量％以上１０重量％以下、特に好ましくは３．０重量％以上１０重量％以下のＴｉを含有するＡｌ合金、０．５重量％以上１０重量％以下のＣｒを含有するＡｌ合金を使用するのが好ましい。 As a reflective film deposited on the molded article of the present invention, a metal element, for example, Al, Cr, Ag, Au, Fe, Ti, Pt, etc. among the above components can be used alone or in combination. Among them, Al and Au are used alone, or Al alloy containing 0.5 wt% or more and 10 wt% or less, particularly preferably 3.0 wt% or more and 10 wt% or less of Ti, 0.5 wt% or more It is preferable to use an Al alloy containing 10 wt% or less of Cr.
また、本発明の成形体に蒸着する反射防止膜としては、使用する樹脂の屈折率などを考慮しながら、金属酸化物や金属ハロゲン化物、例えば上記成分の中でＭｇＦ２，ＳｉＯ２，ＭｇＯ，ＨｆＯ２，Ｔａ２Ｏ５，ＣｅＯ２，ＴｉＯ２，Ａｌ２Ｏ３等を単独で、あるいは複合させて用いることができる。 Moreover, as an antireflection film deposited on the molded article of the present invention, metal oxides and metal halides, for example, MgF 2 , SiO 2 , MgO, HfO 2 , Ta 2 O 5 , CeO 2 , TiO 2 , Al 2 O 3 and the like can be used alone or in combination.
本発明のポリカーボネート樹脂を用いた成形体に、請求項１に示した温度範囲内で蒸着により薄膜を形成した成形体は、密着性が良好であるために、特に密着性を高めることを目的にアンダーコートや表面処理などを施すことなしに、直接蒸着することができるが、アンダーコートや表面処理を施した成形体を用いても差し支えない。この場合、アンダーコートとしてはシリコン系アンダーコート、アクリル系アンダーコート等が挙げられ、表面処理としてはプラズマ処理、溶剤による洗浄等を挙げることができる。 The molded body in which the thin film is formed by vapor deposition within the temperature range shown in claim 1 on the molded body using the polycarbonate resin of the present invention has good adhesion, so that the adhesion is particularly improved. Although direct vapor deposition can be performed without applying an undercoat or a surface treatment, a molded body subjected to an undercoat or a surface treatment may be used. In this case, examples of the undercoat include a silicon undercoat and an acrylic undercoat, and examples of the surface treatment include plasma treatment and cleaning with a solvent.
上記のポリカーボネート樹脂としては下記一般式[１]〜[５]で表される繰り返し単位を含む芳香族ポリカーボネート樹脂が好ましい。 The polycarbonate resin is preferably an aromatic polycarbonate resin containing a repeating unit represented by the following general formulas [1] to [5].
その中でも下記一般式［１］
で表される繰り返し単位（Ａ）及び下記一般式［６］
Among them, the following general formula [1]
A repeating unit (A) represented by the following general formula [6]
で表される繰り返し単位（Ｂ）よりなり、全カーボネート繰り返し単位における単位（Ａ）と単位（Ｂ）の割合がモル比で（Ａ）：（Ｂ）＝５：９５〜９５：５の範囲である芳香族ポリカーボネート共重合体を用いた成形体に、基板温度が１３０℃〜Ｔｇ−１０℃となる条件で、蒸着により薄膜を形成した成形体が提供される。
The ratio of the unit (A) to the unit (B) in all carbonate repeating units is in a molar ratio of (A) :( B) = 5: 95 to 95: 5. There is provided a molded body in which a thin film is formed by vapor deposition on a molded body using an aromatic polycarbonate copolymer under the condition that the substrate temperature is 130 ° C to Tg-10 ° C.
上記の共重合体は全カーボネート繰り返し単位における単位（Ａ）と単位（Ｂ）の割合がモル比で（Ａ）：（Ｂ）＝１５：８５〜６０：４０の範囲である請求項１記載のポリカーボネート共重合体であることが更に好ましい。 2. The copolymer according to claim 1, wherein the ratio of the units (A) to the units (B) in the total carbonate repeating unit is in the range of (A) :( B) = 15: 85 to 60:40 in terms of molar ratio. More preferably, it is a polycarbonate copolymer.
本発明のポリカーボネート共重合体において用いられる下記一般式［７］で表されるフルオレン系ビスフェノールとしては、例えば９，９―ビス（４−ヒドロキシフェニル）フルオレン、下記式［８］で表される９，９−ビス（４−ヒドロキシ−３−メチルフェニル）フルオレン（ビスクレゾールフルオレン）、９，９−ビス（４−ヒドロキシ−３−エチルフェニル）フルオレン、９，９−ビス（４−ヒドロキシ−２−メチルフェニル）フルオレン等が挙げられ、中でも９，９−ビス（４−ヒドロキシ−３−メチルフェニル）フルオレンが好ましい。 Examples of the fluorene-based bisphenol represented by the following general formula [7] used in the polycarbonate copolymer of the present invention include 9,9-bis (4-hydroxyphenyl) fluorene and 9 represented by the following formula [8]. , 9-bis (4-hydroxy-3-methylphenyl) fluorene (biscresol fluorene) , 9,9-bis (4-hydroxy-3-ethylphenyl) fluorene, 9,9-bis (4-hydroxy-2-) Methylphenyl) fluorene and the like, and 9,9-bis (4-hydroxy-3-methylphenyl) fluorene is preferred.
本発明のポリカーボネート共重合体において用いられる下記一般式［９］で表される他の芳香族ジヒドロキシ成分としては、通常芳香族ポリカーボネートのジヒドロキシ成分として使用されているものであればよく、例えば４，４′−ビフェノール、１，１−ビス（４−ヒドロキシフェニル）エタン、２，２−ビス（４−ヒドロキシフェニル）プロパン（ビスフェノールＡ）、２，２−ビス（４−ヒドロキシ−３−メチルフェニル）プロパン（ビスフェノールＣ）、２，２−ビス（４−ヒドロキシフェニル）ブタン、１，１−ビス（４−ヒドロキシフェニル）−１−フェニルエタン、１，１−ビス（４−ヒドロキシフェニル）シクロヘキサン（ビスフェノールＺ）、１，１−ビス（４−ヒドロキシフェニル）−３，３，５−トリメチルシクロヘキサン、２，２−ビス（４−ヒドロキシフェニル）ペンタン、４，４′−（ｐ−フェニレンジイソプロピリデン）ジフェノール、α，α′−ビス（４−ヒドロキシフェニル）−ｍ−ジイソプロピルベンゼン（ビスフェノールＭ）、１，１−ビス（４−ヒドロキシフェニル）−４−イソプロピルシクロヘキサンなどが挙げられ、なかでもビスフェノールＡ、ビスフェノールＣ、ビスフェノールＺ、ビスフェノールＭが好ましく、特にビスフェノールＡが好ましい。 The other aromatic dihydroxy component represented by the following general formula [9] used in the polycarbonate copolymer of the present invention may be any aromatic dihydroxy component that is usually used as a dihydroxy component of an aromatic polycarbonate. 4'-biphenol, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) propane (bisphenol A) , 2,2-bis (4-hydroxy-3-methylphenyl) Propane (bisphenol C) , 2,2-bis (4-hydroxyphenyl) butane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 1,1-bis (4-hydroxyphenyl) cyclohexane (bisphenol Z), 1,1-bis (4-hydroxyphenyl) -3,3,5 Torimechirushiku Hexane, 2,2-bis (4-hydroxyphenyl) pentane, 4, 4 '- (p-phenylene) diphenol, alpha,. Alpha .'- bis (4-hydroxyphenyl)-m-diisopropylbenzene (bisphenol M) , 1,1-bis (4-hydroxyphenyl) -4-isopropylcyclohexane and the like. Among them, bisphenol A, bisphenol C, bisphenol Z and bisphenol M are preferable, and bisphenol A is particularly preferable.
本発明のポリカーボネート樹脂は、本発明の趣旨を損なわない範囲で、芳香族ジカルボン酸、例えばテレフタル酸、イソフタル酸、ナフタレンジカルボン酸あるいはその誘導体を共重合したポリエステルカーボネートであってもよい。また少量の３官能化合物を共重合した分岐ポリカーボネートであってもよい。 The polycarbonate resin of the present invention may be a polyester carbonate copolymerized with an aromatic dicarboxylic acid, for example, terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid or a derivative thereof, as long as the gist of the present invention is not impaired. Moreover, the branched polycarbonate which copolymerized a small amount of trifunctional compounds may be sufficient.
本発明におけるポリカーボネート樹脂は、そのポリマーを塩化メチレンに溶解した溶液での２０℃における比粘度が０.２〜１．２の範囲が好ましく、０.２５〜１．０の範囲がより好ましく、０.２７〜０．８０の範囲がさらに好ましい。比粘度が上記範囲内であれば成形体やフィルムの強度が十分強く、溶融粘度および溶液粘度が適当で、取り扱いが容易であり好ましい。 The polycarbonate resin in the present invention preferably has a specific viscosity at 20 ° C. in a solution of the polymer dissolved in methylene chloride in the range of 0.2 to 1.2, more preferably in the range of 0.25 to 1.0. The range of .27 to 0.80 is more preferable. If the specific viscosity is within the above range, the strength of the molded product or film is sufficiently strong, the melt viscosity and the solution viscosity are appropriate, and handling is easy and preferable.
本発明のポリカーボネート樹脂は、低分子量化合物が１．０％以下であることが好ましく、０．８％以下が更に好ましく、０．６％以下が特に好ましい。低分子化合物が１．０％を越えると、成形体の表面に存在する低分子化合物の量も必然的に増加し、このため蒸着した薄膜の密着性が損なわれてしまうため、好ましくない。なお、この低分子量化合物の含有率の値は下記方法により測定された値である。すなわち、東ソー（株）製、ＴＳＫｇｅｌＧ２０００ＨＸＬとＧ３０００ＨＸＬカラム各１本ずつ直列に繋いで溶離液としてクロロホルムを用い、流量０．７ｍｌ／分で安定化した後、該ポリカーボネート樹脂のクロロホルム溶液を注入する方法を用い、それにより得られた波長２５４ｎｍの光源で検出したＧＰＣチャートのリテンションタイムが１９分以降のピーク面積の合計の全ピーク面積に対する割合を低分子量化合物の含有率とした。 In the polycarbonate resin of the present invention, the low molecular weight compound is preferably 1.0% or less, more preferably 0.8% or less, and particularly preferably 0.6% or less. If the amount of the low-molecular compound exceeds 1.0%, the amount of the low-molecular compound present on the surface of the molded body inevitably increases, which is not preferable because the adhesion of the deposited thin film is impaired. In addition, the value of the content rate of this low molecular weight compound is a value measured by the following method. That is, a method in which a TSKgel G2000HXL and a G3000HXL column, manufactured by Tosoh Corporation, are connected in series one by one with chloroform as an eluent, stabilized at a flow rate of 0.7 ml / min, and then injected with a chloroform solution of the polycarbonate resin. The ratio of the total peak area with a retention time of 19 minutes or more after the retention time of the GPC chart detected with a light source with a wavelength of 254 nm obtained thereby was taken as the content of the low molecular weight compound.
本発明のポリカーボネート樹脂は、通常のポリカーボネート樹脂を製造するそれ自体公知の反応手段、例えば芳香族ジヒドロキシ成分にホスゲンや炭酸ジエステルなどのカーボネート前駆物質を反応させる方法により製造される。次にこれらの製造方法について基本的な手段を簡単に説明する。 The polycarbonate resin of the present invention is produced by a reaction means known per se for producing an ordinary polycarbonate resin, for example, a method of reacting an aromatic dihydroxy component with a carbonate precursor such as phosgene or carbonic acid diester. Next, basic means for these manufacturing methods will be briefly described.
カーボネート前駆物質として、例えばホスゲンを使用する反応では、通常酸結合剤および溶媒の存在下に反応を行う。酸結合剤としては、例えば水酸化ナトリウム、水酸化カリウムなどのアルカリ金属水酸化物またはピリジンなどのアミン化合物が用いられる。溶媒としては、例えば塩化メチレン、クロロベンゼンなどのハロゲン化炭化水素が用いられる。また反応促進のために例えば第三級アミンまたは第四級アンモニウム塩などの触媒を用いることもできる。その際、反応温度は通常０〜４０℃であり、反応時間は数分〜５時間である。 In a reaction using, for example, phosgene as a carbonate precursor, the reaction is usually performed in the presence of an acid binder and a solvent. As the acid binder, for example, an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide or an amine compound such as pyridine is used. As the solvent, for example, halogenated hydrocarbons such as methylene chloride and chlorobenzene are used. In order to accelerate the reaction, a catalyst such as a tertiary amine or a quaternary ammonium salt can also be used. In that case, reaction temperature is 0-40 degreeC normally, and reaction time is several minutes-5 hours.
カーボネート前駆物質として炭酸ジエステルを用いるエステル交換反応は、不活性ガス雰囲気下所定割合の芳香族ジヒドロキシ成分を炭酸ジエステルと加熱しながら撹拌して、生成するアルコールまたはフェノール類を留出させる方法により行われる。反応温度は生成するアルコールまたはフェノール類の沸点などにより異なるが、通常１２０〜３００℃の範囲である。反応はその初期から減圧にして生成するアルコールまたはフェノール類を留出させながら反応を完結させる。 The transesterification reaction using a carbonic acid diester as a carbonate precursor is performed by a method in which an aromatic dihydroxy component in a predetermined ratio is stirred with a carbonic acid diester while heating with an inert gas atmosphere to distill the generated alcohol or phenols. . The reaction temperature varies depending on the boiling point of the alcohol or phenol produced, but is usually in the range of 120 to 300 ° C. The reaction is completed while distilling off the alcohol or phenol produced under reduced pressure from the beginning.
また、反応を促進するために通常エステル交換反応に使用される触媒を使用することもできる。前記エステル交換反応に使用される炭酸ジエステルとしては、例えばジフェニルカーボネート、ジナフチルカーボネート、ビス（ジフェニル）カーボネート、ジメチルカーボネート、ジエチルカーボネート、ジブチルカーボネートなどが挙げられる。これらのうち特にジフェニルカーボネートが好ましい。 Moreover, in order to accelerate | stimulate reaction, the catalyst normally used for transesterification can also be used. Examples of the carbonic acid diester used in the transesterification include diphenyl carbonate, dinaphthyl carbonate, bis (diphenyl) carbonate, dimethyl carbonate, diethyl carbonate, and dibutyl carbonate. Of these, diphenyl carbonate is particularly preferred.
本発明の芳香族ポリカーボネート樹脂は、その重合反応において、末端停止剤として通常使用される単官能フェノール類を使用することができる。殊にカーボネート前駆物質としてホスゲンを使用する反応の場合、単官能フェノール類は末端停止剤として分子量調節のために一般的に使用され、また得られた芳香族ポリカーボネート樹脂は、末端が単官能フェノール類に基づく基によって封鎖されているので、そうでないものと比べて熱安定性に優れている。 In the aromatic polycarbonate resin of the present invention, monofunctional phenols which are usually used as a terminal terminator can be used in the polymerization reaction. Particularly in the case of a reaction using phosgene as a carbonate precursor, monofunctional phenols are generally used as a terminator for controlling the molecular weight, and the resulting aromatic polycarbonate resin has a terminal monofunctional phenol. Since it is blocked by a group based on, it is superior in thermal stability as compared to those not.
かかる単官能フェノール類としては、芳香族ポリカーボネート樹脂の末端停止剤として使用されるものであればよく、一般にはフェノール或いは低級アルキル置換フェノールであって、下記一般式で表される単官能フェノール類を示すことができる。 Such monofunctional phenols only need to be used as a terminal terminator for aromatic polycarbonate resins, and are generally phenols or lower alkyl-substituted phenols, and monofunctional phenols represented by the following general formula: Can show.
本発明において、前記ポリカーボネート樹脂に、リン酸、亜リン酸、ホスホン酸、亜ホスホン酸およびこれらのエステルよりなる群から選択された少なくとも１種のリン化合物が、その樹脂に対して０.０００１〜０.０５重量％、好ましくは０．０００５〜０．０２重量％、より好ましくは０．００１〜０．０１重量％の割合で配合することができる。このリン化合物を配合することにより、かかるポリカーボネート樹脂の熱安定性が向上し、成形時における分子量の低下や色相の悪化が防止される。なお、配合量が０.０００１重量％未満では上記効果が得られ難く、０.０５重量％を超えると、逆に該ポリカーボネート樹脂の熱安定性に悪影響を与え、また耐加水分解性も低下するので好ましくない。 In the present invention, the polycarbonate resin contains at least one phosphorus compound selected from the group consisting of phosphoric acid, phosphorous acid, phosphonic acid, phosphonous acid and esters thereof from 0.0001 to It can mix | blend in the ratio of 0.05 weight%, Preferably 0.0005-0.02 weight%, More preferably, 0.001-0.01 weight%. By blending this phosphorus compound, the thermal stability of such a polycarbonate resin is improved, and a decrease in molecular weight and a deterioration in hue during molding are prevented. If the blending amount is less than 0.0001% by weight, it is difficult to obtain the above effect. If the blending amount exceeds 0.05% by weight, the thermal stability of the polycarbonate resin is adversely affected, and the hydrolysis resistance also decreases. Therefore, it is not preferable.
また、本発明のポリカーボネート樹脂には、酸化防止の目的で通常知られた酸化防止剤を添加することができる。
さらに本発明の芳香族ポリカーボネート樹脂には、必要に応じて一価または多価アルコールの高級脂肪酸エステルを加えることもできる。
Moreover, the antioxidant normally known for the purpose of antioxidant can be added to the polycarbonate resin of this invention.
Furthermore, higher fatty acid esters of mono- or polyhydric alcohols can be added to the aromatic polycarbonate resin of the present invention as necessary.
かかるアルコールと高級脂肪酸とのエステルの配合量は、該ポリカーボネート樹脂に対して０.０１〜２重量％が好ましく、０.０１５〜０.５重量％がより好ましく、０.０２〜０.２重量％がさらに好ましい。配合量がこの範囲内であれば離型性に優れ、また離型剤がマイグレートし金属表面に付着することもなく好ましい。 The amount of the ester of the alcohol and higher fatty acid is preferably 0.01 to 2% by weight, more preferably 0.015 to 0.5% by weight, and 0.02 to 0.2% by weight based on the polycarbonate resin. % Is more preferable. If the blending amount is within this range, it is preferable that the release property is excellent and the release agent does not migrate and adhere to the metal surface.
本発明のポリカーボネート樹脂には、さらに着色剤、帯電防止剤、滑剤、拡散剤、充填剤などの添加剤や他のポリカーボネート樹脂、他の熱可塑性樹脂を本発明の目的を損なわない範囲で少割合添加することもできる。 In the polycarbonate resin of the present invention, additives such as colorants, antistatic agents, lubricants, diffusing agents, fillers, other polycarbonate resins, and other thermoplastic resins are contained in a small proportion within a range that does not impair the purpose of the present invention. It can also be added.
本発明のポリカーボネート共重合体を用いた成形体に基板温度が１３０℃〜Ｔｇ−１０℃となる条件で蒸着により薄膜を形成した成形体は、薄膜の外観が良好であり、また密着性が非常に高いため、液晶ディスプレイのバックライトの反射板、自動車等のランプレンズリフレクター、光学ミラー、プラスチックミラーなどの光反射機能をもった部品や、表面に蒸着によりハードコートや反射防止コートや耐候性薄膜コートを施したレンズやプリズム等の光学部品や、成形板として好適に使用される。 The molded body in which the thin film is formed by vapor deposition on the molded body using the polycarbonate copolymer of the present invention under the condition that the substrate temperature is 130 ° C. to Tg−10 ° C. has a good appearance of the thin film and has very good adhesion. Therefore, it has a light reflecting function such as a reflector for LCD backlights, lamp lens reflectors for automobiles, optical mirrors, plastic mirrors, etc., and hard coating, antireflection coating and weather resistant thin film by vapor deposition on the surface. It is suitably used as an optical component such as a coated lens or prism, or a molded plate.
以下、実施例を挙げて本発明をより詳細に説明するが、本発明はこれに限定されるものではない。実施例中、「部」は「重量部」を意味している。なお、評価は下記の方法により実施した。 EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited to this. In the examples, “parts” means “parts by weight”. Evaluation was carried out by the following method.
（Ｉ）評価項目
（１）比粘度
ポリマー０.７ｇを１００ｍｌの塩化メチレンに溶解し２０℃の温度で測定した。
（２）ガラス転移点（Ｔｇ）
ティー・エイ・インスツルメント・ジャパン（株）社製２９１０型ＤＳＣを使用し、昇温速度２０℃／ｍｉｎにて測定した。
（３）オリゴマー量
東ソー（株）製、ＴＳＫｇｅｌＧ２０００ＨＸＬとＧ３０００ＨＸＬカラム各１本ずつ直列に繋いで溶離液としてクロロホルムを用い、流量０．７ｍｌ／分で安定化した後、該ポリカーボネート樹脂のクロロホルム溶液を注入する方法を用い、それにより得られた波長２５４ｎｍの光源で検出したＧＰＣチャートのリテンションタイムが１９分以降のピーク面積の合計の全ピーク面積に対する割合を低分子量化合物の含有率（％）とした。
（４）蒸着性
実施例に記載の方法で作成したＡｌ膜を蒸着した成形角板を装置から取り出し、１時間室温にて静置した後、村上色彩技術研究所（株）製反射率計ＨＲ−１００を用いて全反射率と拡散反射率を測定し、その差から正反射率を求める方法で調べた。
（５）密着性
蒸着性を評価した成形板のＡｌ蒸着面にカッターナイフで１ｍｍ間隔の１００個の碁盤目を作りニチバン製粘着テープ（商品名“セロテープ”）を圧着し、次いで密着したセロファンテープを直角にかつ急激に剥離した。このとき剥離せずに残った碁盤目の目数を数え、全目数１００に対し何個残ったかで下記の判定を行った。
◎（塗膜密着性 最良）：残り目数１００〜９５個（ほとんど残っている）
○（塗膜密着性 良好）：残り目数９４〜８０個（部分的に剥離）
△（あまり密着していない）：残り目数７９〜５０（かなり剥離）
×（密着していない）：残り目数４９個以下（ほとんど剥離）
（６）耐熱性
実施例に記載した方法で作成したＡｌ膜を蒸着した成形角板を１４０℃にて２４時間放置した後、上記蒸着性、密着性の評価を行った。
(I) Evaluation Items (1) Specific Viscosity 0.7 g of polymer was dissolved in 100 ml of methylene chloride and measured at a temperature of 20 ° C.
(2) Glass transition point (Tg)
A 2910 type DSC manufactured by TS Instruments Japan Co., Ltd. was used, and the temperature was increased at a rate of 20 ° C./min.
(3) Amount of oligomers Tosoh Co., Ltd., TSKgel G2000HXL and G3000HXL columns connected in series, using chloroform as the eluent and stabilizing at a flow rate of 0.7 ml / min, then injecting a chloroform solution of the polycarbonate resin The ratio of the total peak area with a retention time of 19 minutes or later on the GPC chart detected with a light source having a wavelength of 254 nm obtained as a result of the measurement was defined as the content (%) of the low molecular weight compound.
(4) Vapor deposition property After removing the molded square plate on which the Al film created by the method described in the examples was deposited from the apparatus and allowing it to stand at room temperature for 1 hour, the reflectometer HR manufactured by Murakami Color Research Laboratory Co., Ltd. The total reflectance and diffuse reflectance were measured using -100, and the regular reflectance was determined from the difference.
(5) Adhesiveness Nichiban adhesive tape (trade name “cello tape”) was pressure-bonded to the Al vapor-deposited surface of the molded plate that was evaluated for vapor deposition with 100 mm grids with a cutter knife, and then adhered to cellophane tape. Were peeled off at right angles and suddenly. At this time, the number of grids remaining without peeling was counted, and the following determination was performed based on the number of grids remaining with respect to the total number of 100.
◎ (Coating film adhesion best): Number of remaining eyes 100 to 95 (mostly remaining)
○ (Coating film adhesion good): 94 to 80 remaining eyes (partially peeled)
Δ (not very closely adhered): 79 to 50 remaining eyes (pretty peeling)
× (not in close contact): 49 or less remaining eyes (almost peeled)
(6) Heat resistance The formed square plate deposited with the Al film prepared by the method described in the examples was allowed to stand at 140 ° C. for 24 hours, and then the above-described deposition property and adhesion were evaluated.
（II）ポリカーボネート樹脂の合成
◎本発明のポリカーボネート共重合体の製造−その１
温度計、攪拌機、還流冷却器付き反応器にイオン交換水９７９０部、４８％水酸化ナトリウム水溶液２２４３部を入れ、２，２−ビス（４−ヒドロキシフェニル）プロパン（以下、ビスフェノールＡと略記することがある）１４１７部、９，９−ビス（４−ヒドロキシ−３−メチルフェニル）フルオレン（以下、ビスクレゾールフルオレンと略記することがある）５８７部およびハイドロサルファイト６．８部を溶解し、塩化メチレン６６０５部を加えた後、攪拌しながら１８〜２２℃でホスゲン１０００部を６０分を要して吹き込んだ。ホスゲン吹き込み終了後、ｐ−ｔｅｒｔ−ブチルフェノール４６．６部と４８％水酸化ナトリウム水溶液３２０部を加え、さらにトリエチルアミン２．０部を添加して２４〜３２℃で４０分間攪拌して反応を終了した。反応終了後、生成物を塩化メチレンで希釈して水洗したのち塩酸酸性にして水洗し、水相の導電率がイオン交換水とほぼ同じになったところで、ニーダーにて塩化メチレンを蒸発して、ビスフェノールＡとビスクレゾールフルオレンの比がモル比で８０：２０の比粘度が０.３４６、Ｔｇが１６９℃である薄黄色のポリマー（“ＥＸ−ＰＣ１”と略する）２１７０部を得た（収率９６％）。
(II) Synthesis of Polycarbonate Resin Production of Polycarbonate Copolymer of the Present Invention—Part 1
Into a reactor equipped with a thermometer, a stirrer, and a reflux condenser, 9790 parts of ion-exchanged water and 2243 parts of a 48% sodium hydroxide aqueous solution are placed, and 2,2-bis (4-hydroxyphenyl) propane (hereinafter abbreviated as bisphenol A). 1417 parts, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene (hereinafter may be abbreviated as biscresol fluorene) 587 parts and hydrosulfite 6.8 parts, After adding 6605 parts of methylene, 1000 parts of phosgene was blown in at a temperature of 18-22 ° C. for 60 minutes while stirring. After completion of the phosgene blowing, 46.6 parts of p-tert-butylphenol and 320 parts of 48% aqueous sodium hydroxide solution were added, and 2.0 parts of triethylamine was further added, followed by stirring at 24-32 ° C. for 40 minutes to complete the reaction. . After completion of the reaction, the product was diluted with methylene chloride, washed with water, acidified with hydrochloric acid, washed with water, and when the conductivity of the aqueous phase became almost the same as that of ion-exchanged water, the methylene chloride was evaporated with a kneader, As a result, 2170 parts of a light yellow polymer (abbreviated as “EX-PC1”) having a molar ratio of bisphenol A and biscresol fluorene of 80:20, a specific viscosity of 0.346, and a Tg of 169 ° C. were obtained. Rate 96%).
◎本発明のポリカーボネート共重合体の製造−その２
ビスフェノールＡを５３２部、ビスクレゾールフルオレンを２０５６部とする以外はＥＸ−ＰＣ１と同様の手順にて合成を行い、ビスフェノールＡとビスクレゾールフルオレンの比がモル比で３０：７０の比粘度が０.２６８、Ｔｇが２１０℃である薄黄色のポリマー（“ＥＸ−ＰＣ２”と略する）２６７０部を得た（収率９４％）。
◎ Production of polycarbonate copolymer of the present invention-2
The synthesis was performed in the same procedure as EX-PC1 except that 532 parts of bisphenol A and 2056 parts of biscresol fluorene were used, and the specific viscosity of bisphenol A and biscresol fluorene was 30:70 in terms of molar ratio was 0.7. 268, 2670 parts of a light yellow polymer (abbreviated as “EX-PC2”) having a Tg of 210 ° C. was obtained (yield 94%).
◎本発明のポリカーボネート共重合体の製造−その３
温度計、攪拌機、還流冷却器付き反応器にイオン交換水９７９０部、４８％水酸化ナトリウム水溶液２２４３部を入れ、ビスフェノールＡ８８６部、ビスクレゾールフルオレン１４６９部およびハイドロサルファイト６．８部を溶解し、塩化メチレン６６０５部を加えた後、攪拌しながら１８〜２２℃でホスゲン１０００部を６０分を要して吹き込んだ。ホスゲン吹き込み終了後、ｐ−ｔｅｒｔ−ブチルフェノール４６．６部と４８％水酸化ナトリウム水溶液３２０部を加え、さらにトリエチルアミン２．０部を添加して２４〜３２℃で４０分間攪拌して反応を終了した。反応終了後、生成物を塩化メチレンで希釈して水洗したのち塩酸酸性にして水洗し、水相の導電率がイオン交換水とほぼ同じになるまで水洗した。続いて、塩化メチレン相を濃縮してポリカーボネート濃度１０％の溶液を得、これに３倍量のイソプロパノールを加え、重合物を沈澱させた。沈殿物をろ過後、乾燥機にて乾燥してビスフェノールＡとビスクレゾールフルオレンの比がモル比で５０：５０の比粘度が０.２８０、Ｔｇが１９５℃である薄黄色のポリマー（“ＥＸ−ＰＣ３”と略する）２４７０部を得た（収率８７％）。
◎ Production of polycarbonate copolymer of the present invention-3
In a reactor equipped with a thermometer, a stirrer and a reflux condenser, 9790 parts of ion-exchanged water and 2243 parts of a 48% aqueous sodium hydroxide solution were added, and 886 parts of bisphenol A, 1469 parts of biscresol fluorene and 6.8 parts of hydrosulfite were dissolved. After adding 6605 parts of methylene chloride, 1000 parts of phosgene was blown in at a temperature of 18 to 22 ° C. for 60 minutes while stirring. After completion of the phosgene blowing, 46.6 parts of p-tert-butylphenol and 320 parts of 48% aqueous sodium hydroxide solution were added, and 2.0 parts of triethylamine was further added, followed by stirring at 24-32 ° C. for 40 minutes to complete the reaction. . After completion of the reaction, the product was diluted with methylene chloride, washed with water, acidified with hydrochloric acid, washed with water, and washed with water until the conductivity of the aqueous phase was almost the same as ion-exchanged water. Subsequently, the methylene chloride phase was concentrated to obtain a solution having a polycarbonate concentration of 10%, and 3 times the amount of isopropanol was added thereto to precipitate a polymer. The precipitate was filtered and then dried in a drier to form a light yellow polymer ("EX-") having a molar ratio of bisphenol A to biscresol fluorene of 50:50, a specific viscosity of 0.280, and a Tg of 195 ° C. 2470 parts (abbreviated as PC3 ″) were obtained (yield 87%).
◎本発明のポリカーボネート樹脂の製造−その４
温度計、撹拌機、還流冷却機付き反応器にイオン交換水９２００部、４８％水酸化ナトリウム水溶液１０５６部を仕込み、１，３−ビス（４−ヒドロキシフェニル）−５，７−ジメチルアダマンタン１５２０部、およびハイドロサルファイト３．２部を溶解し、塩化メチレン６４８０部を加え、撹拌しながら１５〜２５℃でホスゲン５６４部を６０分を要して吹込んだ。ホスゲン吹き込み終了後、ｐ−ｔｅｒｔ−ブチルフェノール２８．４部と４８％水酸化ナトリウム水溶液１１６部を添加し、さらにトリエチルアミン３．２部を添加して２８〜３３℃で２時間撹拌して反応を終了した。反応終了後、生成物を塩化メチレンで希釈して水洗したのち塩酸酸性にして水洗し、水相の導電率がイオン交換水とほぼ同じになったところでニーダーにて塩化メチレンを蒸発して、比粘度が０．２３６、Ｔｇが２４３℃あるポリマー（“ＥＸ−ＰＣ４”と略する）１６００部を得た（収率９８％）。
◎ Production of polycarbonate resin of the present invention-Part 4
A reactor equipped with a thermometer, a stirrer, and a reflux condenser was charged with 9200 parts of ion-exchanged water and 1056 parts of a 48% aqueous sodium hydroxide solution, and 1520 parts of 1,3-bis (4-hydroxyphenyl) -5,7-dimethyladamantane. Then, 3.2 parts of hydrosulfite was dissolved, 6480 parts of methylene chloride was added, and 564 parts of phosgene was blown in at a temperature of 15 to 25 ° C. for 60 minutes while stirring. After the completion of phosgene blowing, 28.4 parts of p-tert-butylphenol and 116 parts of 48% aqueous sodium hydroxide solution were added, and 3.2 parts of triethylamine was further added, followed by stirring at 28 to 33 ° C. for 2 hours to complete the reaction. did. After completion of the reaction, the product was diluted with methylene chloride, washed with water, acidified with hydrochloric acid, washed with water, and when the conductivity of the aqueous phase became almost the same as that of ion-exchanged water, methylene chloride was evaporated in a kneader, 1600 parts of a polymer (abbreviated as “EX-PC4”) having a viscosity of 0.236 and Tg of 243 ° C. was obtained (yield 98%).
◎比較のためのポリカーボネート樹脂の製造
温度計、攪拌機、還流冷却器付き反応器にイオン交換水９４８６部、４８％水酸化ナトリウム水溶液１８１１部を入れ、ビスフェノールＡ２００３部、およびハイドロサルファイト７．６部を溶解し、塩化メチレン７４６６部を加えた後、攪拌しながら２０〜２３℃でホスゲン１０００部を６０分を要して吹き込んだ。ホスゲン吹き込み終了後、ｐ−ｔｅｒｔ−ブチルフェノール６５．９部と４８％水酸化ナトリウム水溶液３６２部を加え、さらにトリエチルアミン２．２部を添加して２５〜３２℃で４０分間攪拌して反応を終了した。反応終了後、生成物を塩化メチレンで希釈して水洗したのち塩酸酸性にして水洗し、水相の導電率がイオン交換水とほぼ同じになったところで、ニーダーにて塩化メチレンを蒸発して、比粘度が０.３６０、Ｔｇが１４６℃である白色のビスフェノールＡホモポリマー（“ＣＥＸ−ＰＣ１”と略する）２２３０部を得た（収率９７％）。
◎ Manufacture of polycarbonate resin for comparison In a reactor equipped with a thermometer, a stirrer, and a reflux condenser, 9486 parts of ion-exchanged water and 1811 parts of 48% sodium hydroxide aqueous solution were added, and 2003 parts of bisphenol A and 7.6 parts of hydrosulfite After adding 7466 parts of methylene chloride, 1000 parts of phosgene was blown in at 20-23 ° C. for 60 minutes while stirring. After completion of the phosgene blowing, 65.9 parts of p-tert-butylphenol and 362 parts of 48% aqueous sodium hydroxide solution were added, and 2.2 parts of triethylamine was further added, followed by stirring at 25 to 32 ° C. for 40 minutes to complete the reaction. . After completion of the reaction, the product was diluted with methylene chloride, washed with water, acidified with hydrochloric acid, washed with water, and when the conductivity of the aqueous phase became almost the same as that of ion-exchanged water, the methylene chloride was evaporated with a kneader, 2230 parts of a white bisphenol A homopolymer (abbreviated as “CEX-PC1”) having a specific viscosity of 0.360 and a Tg of 146 ° C. were obtained (yield 97%).
［実施例１〜６、比較例１〜３］
上記で得られたポリカーボネート共重合体及びポリカーボネート樹脂にトリス（２,４−ジ−ｔｅｒｔ−ブチルフェニル）ホスファイト０．０５０％、ステアリン酸モノグリセリド０．０５０％加え、タンブラーを使用して均一に混合した後、３０ｍｍφベント付き二軸押出機（神戸製鋼（株）製ＫＴＸ−３０）により、シリンダー温度３１０℃（実施例１〜５、比較例１〜３）または３２０℃（実施例６）、１０ｍｍＨｇの真空度で脱気しながらペレット化し、得られたペレットを１２０℃で５時間乾燥後、射出成形機（住友重機械工業（株）製ＳＧ１５０Ｕ型）を使用し、シリンダー温度３３０℃（実施例１〜５、比較例１〜３）または３４０℃（実施例６）、金型温度１００℃の条件で大きさ１００ｍｍ×１００ｍｍ、厚さ３ｍｍの試験用角板を作成した。
[Examples 1-6, Comparative Examples 1-3]
Add 0.050% tris (2,4-di-tert-butylphenyl) phosphite and 0.050% stearic acid monoglyceride to the polycarbonate copolymer and polycarbonate resin obtained above, and mix evenly using a tumbler. After that, the cylinder temperature was 310 ° C. (Examples 1 to 5, Comparative Examples 1 to 3) or 320 ° C. (Example 6), 10 mmHg by a twin screw extruder with a 30 mmφ vent (KTX-30 manufactured by Kobe Steel Co., Ltd.). The pellets were degassed at a vacuum of 5 ° C., and the obtained pellets were dried at 120 ° C. for 5 hours, and then used an injection molding machine (SG150U type manufactured by Sumitomo Heavy Industries, Ltd.), and the cylinder temperature was 330 ° C. (Example) 1-5, Comparative Examples 1-3) or 340 ° C. (Example 6), mold size 100 mm × 100 mm, thickness 3 mm test under conditions of 100 ° C. It has created a square plate.
この見本板に表１に示した基板温度にて、下記の方法で真空蒸着法によりアルミニウム薄膜を形成した後、この成形体の蒸着性ならびに密着性を評価した。その結果を表１に示す。なお、比較例１及び比較例３の密着性については、蒸着時に基板樹脂の耐熱性が足りず、成形体表面が変形し蒸着面が荒れてしまったため、評価できなかった。 An aluminum thin film was formed on the sample plate by the vacuum deposition method at the substrate temperature shown in Table 1 by the following method, and then the vapor deposition property and adhesion of the molded product were evaluated. The results are shown in Table 1. In addition, about the adhesiveness of the comparative example 1 and the comparative example 3, since the heat resistance of board | substrate resin was insufficient at the time of vapor deposition, and the molded object surface deform | transformed and the vapor deposition surface became rough, it was not able to evaluate.
○真空蒸着条件：真空度７．５×１０-6Ｔｏｒｒ、蒸発源Ｗワイヤー、処理時間１分間にて、アルミニウムを膜厚が４０〜５０ｎｍになるように真空蒸着した。なお、蒸着を行う基板は蒸着装置内に設置した赤外線ランプにより所定の温度まで加熱し、基板表面の温度は基板近くに設置した熱電対にて評価した。 ○ Vacuum deposition conditions: The degree of vacuum was 7.5 × 10 −6 Torr, the evaporation source W wire, and the processing time was 1 minute, and aluminum was vacuum deposited so that the film thickness was 40 to 50 nm. In addition, the board | substrate which vapor-deposits was heated to the predetermined temperature with the infrared lamp installed in the vapor deposition apparatus, and the temperature of the board | substrate surface was evaluated with the thermocouple installed near the board | substrate.
それぞれの比較で明らかな如く、本発明のポリカーボネート共重合体を用いた成形体に基板温度が１３０℃〜Ｔｇ−１０℃となる条件で、蒸着により薄膜を形成した成形体は、蒸着性及び密着性が良好である。 As is apparent from each comparison, a molded body in which a thin film is formed by vapor deposition on a molded body using the polycarbonate copolymer of the present invention under conditions where the substrate temperature is 130 ° C. to Tg-10 ° C. Good properties.
Claims (12)
（１）膜厚が１〜３００ｎｍ
（２）成形体との密着性が８０％以上
であることを特徴とする積層膜付成形体。 A molded body using a polycarbonate resin having a glass transition temperature of 150 ° C. or higher and a molded body with a laminated film comprising a thin film provided thereon, wherein the thin film has (1) a film thickness of 1 to 300 nm.
(2) A molded body with a laminated film, characterized in that the adhesiveness with the molded body is 80% or more.
で表される繰り返し単位（Ａ）及び下記一般式［６］
で表される繰り返し単位（Ｂ）よりなり、全カーボネート繰り返し単位における単位（Ａ）と単位（Ｂ）の割合がモル比で（Ａ）：（Ｂ）＝５：９５〜９５：５の範囲である、芳香族ポリカーボネート共重合体である請求項１〜７のいずれかに記載の積層膜付成形体。 Polycarbonate resin is represented by the following general formula [1]
A repeating unit (A) represented by the following general formula [6]
The ratio of the unit (A) to the unit (B) in all carbonate repeating units is in a molar ratio of (A) :( B) = 5: 95 to 95: 5. It is an aromatic polycarbonate copolymer, The molded object with a laminated film in any one of Claims 1-7.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0336632A (en) * | 1989-06-26 | 1991-02-18 | Internatl Business Mach Corp <Ibm> | Optimizing method at time of compile |
| JPH06130202A (en) * | 1992-10-15 | 1994-05-13 | Toray Ind Inc | Heat resistant optical resin plate |
| JPH0776048A (en) * | 1993-09-08 | 1995-03-20 | Toray Ind Inc | Manufacture of molded product |
| JP2000336196A (en) * | 1999-03-23 | 2000-12-05 | Dainippon Printing Co Ltd | Production of laminate film, and reflection-preventing film |
| JP2002121301A (en) * | 2000-10-19 | 2002-04-23 | Dainippon Ink & Chem Inc | Film substrate for display and its production method |
| JP2003240902A (en) * | 2002-02-13 | 2003-08-27 | Canon Inc | Antireflection optical article |
| JP2005018551A (en) * | 2003-06-27 | 2005-01-20 | Teijin Ltd | Touch panel having electromagnetic wave shielding function and transparent lamination film to be used for touch panel |
| JP2005060628A (en) * | 2003-08-20 | 2005-03-10 | Teijin Chem Ltd | Polycarbonate resin having excellent reflow resistance |
-
2005
- 2005-03-18 JP JP2005079012A patent/JP4700379B2/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0336632A (en) * | 1989-06-26 | 1991-02-18 | Internatl Business Mach Corp <Ibm> | Optimizing method at time of compile |
| JPH06130202A (en) * | 1992-10-15 | 1994-05-13 | Toray Ind Inc | Heat resistant optical resin plate |
| JPH0776048A (en) * | 1993-09-08 | 1995-03-20 | Toray Ind Inc | Manufacture of molded product |
| JP2000336196A (en) * | 1999-03-23 | 2000-12-05 | Dainippon Printing Co Ltd | Production of laminate film, and reflection-preventing film |
| JP2002121301A (en) * | 2000-10-19 | 2002-04-23 | Dainippon Ink & Chem Inc | Film substrate for display and its production method |
| JP2003240902A (en) * | 2002-02-13 | 2003-08-27 | Canon Inc | Antireflection optical article |
| JP2005018551A (en) * | 2003-06-27 | 2005-01-20 | Teijin Ltd | Touch panel having electromagnetic wave shielding function and transparent lamination film to be used for touch panel |
| JP2005060628A (en) * | 2003-08-20 | 2005-03-10 | Teijin Chem Ltd | Polycarbonate resin having excellent reflow resistance |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009286929A (en) * | 2008-05-30 | 2009-12-10 | Konica Minolta Holdings Inc | Transparent polycarbonate film and method for producing transparent polycarbonate film |
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