JP2006253572A - Stage apparatus, exposure apparatus, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage apparatus the degradation of control accuracy of which is prevented, an exposure apparatus transferring a mask pattern on a substrate on the stage apparatus without incurring deterioration in the exposure accuracy, and a device manufacturing method for using the exposure apparatus to manufacture devices. <P>SOLUTION: A wafer stage WST is configured to include a wafer stage main body 26 and a self-weight canceller 56, and the wafer stage main body 26 is configured to be movable on a base board 21 by the support of the self-weight canceller 56. Similarly, a measurement stage WST is configured to be movable on the base board 21 by the support of a self-weight canceller 57. The self-weight cancellers 56, 57 are respectively fitted to the wafer stage main body 26 and the measurement stage main body 46 via an adaptor 60 to adjust the position of the gravity center of the wafer stage WST. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a stage apparatus configured to be movable by placing an object, an exposure apparatus including the stage apparatus, and a device manufacturing method for manufacturing a device using the exposure apparatus.

  In a lithography process, which is one of the manufacturing processes of devices such as semiconductor elements, liquid crystal display elements, imaging devices (CCD (Charge Coupled Device)), thin film magnetic heads, etc., a reticle pattern as a mask is An exposure apparatus is used to transfer and expose a wafer (or a glass plate or the like) coated with a photoresist as a substrate through a projection optical system. As this exposure apparatus, a batch exposure type (stationary exposure type) projection exposure apparatus such as a stepper for performing exposure in a state where a mask stage for holding a mask and a substrate stage for holding a substrate are positioned in a predetermined positional relationship, or A scanning exposure type projection exposure apparatus (scanning type exposure apparatus) such as a scanning stepper for performing exposure while relatively moving (scanning) the mask stage and the substrate stage relatively synchronously is used.

  The substrate stage provided in the exposure apparatus includes a table for holding the substrate, a substrate stage main body that holds the table and moves two-dimensionally on a highly flat base member, and a support mechanism that supports the substrate stage main body on the base member. And a drive mechanism for driving the substrate stage main body. As the drive mechanism, a linear motor system using a linear motor as a drive source is mainly used. The table is connected to the substrate stage main body through a fine movement mechanism such as three voice coil motors or three EI cores, and the fine adjustment of the tilt and height position of the table is performed by the fine movement mechanism. Is possible.

The support mechanism includes a piston portion attached to the substrate stage main body and a cylinder portion that urges the piston portion downward in the gravitational direction. A predetermined pressure is applied to the cylinder portion. The substrate stage is supported on the base member. Since this support mechanism is set to have low rigidity, the substrate stage main body is supported so as not to transmit vibration from the base member to the substrate stage main body. Refer to the following Patent Document 1 for details of the substrate stage having such a configuration.
JP 2004-311459 A

  Incidentally, in recent years, particularly in the manufacture of semiconductor devices, it has been desired to improve throughput (the number of substrates that can be exposed per unit time). In order to meet this demand, the maximum acceleration and maximum speed of the substrate stage are required. Has been raised. With the increase in the speed and acceleration of the substrate stage, the substrate stage is required to have extremely high control accuracy. As described above, the substrate stage is driven by the linear motor. However, in the configuration in which the permanent magnet of the linear motor is attached to the substrate stage body as a mover, the mounting position of the support mechanism is attached to the substrate stage body. If the position is shifted from the center of gravity of the permanent magnet, there is a problem that when the substrate stage is driven, a moment is generated and the control accuracy of the substrate stage is lowered.

  Further, as described above, the support mechanism supplies a gas having a predetermined pressure to the inside of the cylinder portion to support the substrate stage body in the direction of gravity (the axial direction of the cylinder portion), and vibration from the base member is applied to the substrate stage. In order not to communicate, it was necessary to reduce the rigidity of the support mechanism. For this reason, there has been a problem that the volume of the cylinder portion has to be increased and the apparatus becomes larger.

  The present invention has been made in view of the above circumstances, a stage apparatus capable of preventing a reduction in control accuracy of the stage apparatus, and a mask pattern transferred to the substrate on the stage apparatus without causing deterioration in exposure precision. It is an object of the present invention to provide an exposure apparatus capable of performing the above and a device manufacturing method for manufacturing a device using the exposure apparatus.

The present invention adopts the following configuration associated with each figure shown in the embodiment. However, the reference numerals in parentheses attached to each element are merely examples of the element and do not limit each element.
In order to solve the above problems, a stage apparatus according to a first aspect of the present invention includes a stage body (26) configured to be movable on a predetermined reference surface (21a), and the stage attached to the stage body. In a stage apparatus (WST) including a support mechanism (56) for supporting a main body on the predetermined reference plane, an adjustment member (60) for adjusting the position of the center of gravity of the stage main body including the support mechanism is provided. It is characterized by.
According to this invention, the position of the center of gravity of the stage main body including the support mechanism is adjusted by the adjusting member.
In order to solve the above problems, a stage apparatus according to a second aspect of the present invention includes a stage body (26) configured to be movable on a predetermined reference surface (21a), and the stage attached to the stage body. In a stage apparatus (WST) including a support mechanism (56) for supporting a main body on the predetermined reference plane, the support mechanism is a first space to which a first gas from a first supply path (71b) is supplied. (RM1), and a cylinder portion (70a) provided in the stage body, and having a second space (RM2) at least partially disposed in the first space and communicating with the first space; A piston portion (70b) inserted into two spaces and movable relative to the cylinder portion; and supporting the weight of the stage main body portion by the first gas supplied to the second space. It is characterized.
According to the present invention, the first gas supplied to the first space provided in the cylinder portion is supplied to the second space communicating with the first space and pushes the piston portion inserted into the second space, The weight of the stage body is supported.
An exposure apparatus according to the present invention is characterized in that, in an exposure apparatus (EX) for exposing a substrate (W), the stage apparatus is provided as a stage for holding the substrate.
The device manufacturing method of the present invention is characterized in that a device is manufactured using the above exposure apparatus.

According to the present invention, since the position of the center of gravity of the stage main body including the support mechanism is adjusted by the adjustment member, there is an effect that it is possible to prevent a reduction in control accuracy of the stage apparatus.
Further, according to the present invention, the first gas is supplied because the first space is provided in communication with the second space in addition to the second space into which the piston portion is inserted. The volume of the space can be increased to reduce the rigidity of the self-weight canceller. As a result, transmission of vibration from the reference surface to the stage main body is prevented, and there is an effect that deterioration in control accuracy of the stage apparatus can be prevented.
In addition, according to the present invention, since the stage device having high control accuracy is provided, the mask pattern can be transferred onto the substrate on the stage device without causing deterioration of the exposure accuracy.
Furthermore, according to the present invention, since the mask pattern can be transferred onto the substrate without deteriorating the exposure accuracy, a device having a fine pattern can be efficiently produced.

  Hereinafter, a stage apparatus, an exposure apparatus, and a device manufacturing method according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a side view showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. The exposure apparatus EX shown in FIG. 1 moves the pattern formed on the reticle R to the wafer W while moving the reticle R as a mask and the wafer W as a substrate relative to the projection optical system PL in FIG. Is a step-and-scan type scanning exposure type exposure apparatus that sequentially transfers to the substrate.

  In the following description, if necessary, an XYZ orthogonal coordinate system is set in the drawing, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system shown in FIG. 1 is set such that the X axis and the Y axis are included in a plane parallel to the moving surface of the wafer W, and the Z axis is set in a direction along the optical axis AX of the projection optical system PL. Yes. In this embodiment, the direction (scanning direction) in which the reticle R and the wafer W are moved synchronously is set to the Y direction.

  As shown in FIG. 1, the exposure apparatus EX of the present embodiment includes an illumination optical system ILS, a reticle stage RST that holds a reticle R, a projection unit PU, a wafer stage WST that holds a wafer W, and a measurement stage MST. The ST is configured to include these control systems. The illumination optical system ILS illuminates a slit-shaped illumination area on the reticle R defined by a reticle blind (not shown) with the exposure light IL with a substantially uniform illuminance. Here, as the exposure light IL, for example, ArF excimer laser light (wavelength 193 nm) is used.

  On reticle stage RST, reticle R having a pattern formed on the pattern surface (the surface on the −Z side in FIG. 1) is held, for example, by vacuum suction. Reticle stage RST is finely driven in an XY plane perpendicular to the optical axis of illumination optical system ILS (matching optical axis AX of projection optical system PL described later) by a reticle stage drive unit (not shown) including a linear motor, for example. It is possible to drive at a scanning speed specified in the scanning direction (Y direction).

  The position of the reticle stage RST within the stage moving surface (including rotation around the Z axis) is moved by a laser interferometer (hereinafter referred to as a reticle interferometer) 12 by a moving mirror 13 (actually a reflecting surface orthogonal to the Y axis). For example, with a resolution of about 0.5 to 1 nm. Measurement values of the reticle interferometer 12 are output to a main control device (not shown), and the main control device uses the measurement values of the reticle interferometer 12 to perform the X direction, Y direction, and θZ of the reticle stage RST. The position (and speed) of the reticle stage RST is controlled by calculating the position in the direction (the rotation direction around the Z axis) and controlling the reticle stage drive unit based on the calculation result.

  Above the reticle stage RST, a pair of reticle alignment detection systems 14a and 14b made of a TTR (Through The Reticle) alignment system using light having an exposure wavelength is provided at a predetermined distance in the X direction. The reticle alignment detection systems 14a and 14b simultaneously observe a pair of reticle alignment marks on the reticle R and a conjugate image of the pair of reference marks on the measurement stage MST corresponding thereto via the projection optical system PL. is there. As these reticle alignment detection systems 14a and 14b, those having the same configuration as that disclosed in, for example, Japanese Patent Laid-Open No. 7-176468 (corresponding US Pat. No. 5,646,413) is used. .

  The projection unit PU is configured to include a lens barrel 15 and a projection optical system PL including a plurality of optical elements held in the lens barrel 15 in a predetermined positional relationship. As the projection optical system PL, for example, a refractive optical system including a plurality of lenses (lens elements) having a common optical axis AX in the Z direction is used.

  In addition, since the exposure apparatus EX of the present embodiment performs exposure using a liquid immersion method, the most image surface side (wafer W side) lens (hereinafter also referred to as a front lens) GL of the projection optical system PL. In the vicinity, a liquid supply nozzle 18a and a liquid recovery nozzle 18b constituting the liquid immersion device 17 are provided. The liquid supply nozzle 18a is connected to a liquid supply apparatus (all not shown) via a liquid supply pipe, and the liquid recovery nozzle 18b is connected to a liquid recovery apparatus (all not shown) via a liquid recovery pipe. Yes.

  As the liquid, ultrapure water (hereinafter simply referred to as “water” unless otherwise required) through which ArF excimer laser light (light having a wavelength of 193 nm) is transmitted is used here. Ultrapure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like and does not adversely affect the photoresist, optical lens, and the like coated on the wafer W. Here, the refractive index n of water is approximately 1.44, and in this water, the wavelength of the exposure light IL is shortened to 193 nm × 1 / n = about 134 nm.

  The liquid supply apparatus opens a valve connected to the liquid supply pipe at a predetermined opening according to an instruction from the main controller, and supplies water between the leading ball GL and the wafer W via the liquid supply nozzle 18a. Supply. Further, the liquid recovery apparatus opens a valve connected to the liquid recovery pipe at a predetermined opening according to an instruction from the main controller, and from between the front lens GL and the wafer W via the liquid recovery nozzle 18b. Water is recovered inside the liquid recovery device (liquid tank). At this time, the main control device always ensures that the amount of water supplied from the liquid supply nozzle 18a between the front lens GL and the wafer W is equal to the amount of water recovered through the liquid recovery nozzle 18b. To the liquid supply device and the liquid recovery device. Accordingly, a certain amount of water Lq (see FIG. 1) is held between the front lens GL and the wafer W. The water Lq held between the front lens GL and the wafer W is always replaced.

  As described above, the liquid immersion device 17 included in the exposure apparatus of the present embodiment includes a liquid supply device, a liquid recovery device, a supply tube, a recovery tube, a liquid supply nozzle 18a, a liquid recovery nozzle 18b, and the like. It is a local immersion apparatus. Even when the measurement stage MST is positioned below the projection unit PU, it is possible to fill water between the measurement table MTB and the front lens GL as described above.

  The stage device ST is, for example, a frame caster FC disposed on the floor surface FL of a semiconductor factory, a base board (surface plate) 21 provided on the frame caster FC, and an upper surface of the base board 21 disposed above the base board 21. (Predetermined reference plane) Wafer stage WST and measurement stage MST moving along 21a, interferometers 22 and 23 for detecting the positions of these stages WST and MST, and a stage drive unit for driving stages WST and MST (illustrated) (Omitted).

  The wafer stage WST includes a wafer stage main body 26 disposed on the base board 21 and a wafer table WTB mounted on the wafer stage main body 26, and exposes the pattern of the reticle R onto the wafer W. In order to transfer, the wafer W is held and moved. The wafer stage main body 26 is configured by a hollow member having a rectangular cross section and extending in the X direction. A self-weight canceller 56 as a support mechanism for supporting the wafer stage main body 26 on the base board 21 is provided on the lower surface of the wafer stage main body 26.

  On the other hand, the measurement stage MST includes a measurement stage main body 46 and a measurement table MTB mounted on the measurement stage main body 46, and the wafer stage WST is positioned at a loading position for exchanging the wafer W. During this time, various measurements are performed by being positioned below the projection optical system PL. The measurement stage main body 46 has the same configuration as the wafer stage main body 26, and a self-weight canceller mechanism 57 as a support mechanism for supporting the measurement stage main body 46 on the base board 21 is provided on the lower surface thereof. The details of the self-weight canceller 56 provided for the wafer stage main body 26 and the self-weight canceller mechanism 57 provided for the measurement stage main body 46 will be described later.

  Next, the configuration of the stage apparatus ST will be described in detail. FIG. 2 is a perspective view showing the configuration of the stage apparatus ST. As shown in FIG. 2, the frame caster FC has a substantially flat plate shape in which protrusions FCa and FCb projecting upward with the Y direction as the longitudinal direction are integrally formed in the vicinity of the ends of one side and the other side in the X direction. It consists of The base board (surface plate) 21 is disposed on a region sandwiched between the protrusions FCa and FCb of the frame caster FC. The upper surface 21a of the base board 21 is finished with extremely high flatness, and serves as a guide surface when the wafer stage WST and the measurement stage MST are moved along the XY plane.

  Wafer stage WST drives wafer stage main body 26 in the X direction with a long stroke, and at the same time, Y direction, Z direction, θx (rotation direction around X axis), θy (rotation direction around Y axis), θz (Z axis) A first drive system 27 that is finely driven in the surrounding rotation direction), and second drive systems 28a and 28b that drive the wafer stage body 26 and the first drive system 27 in the Y direction with a long stroke. Further, wafer stage WST includes a tube carrier 29 that moves at a constant speed in the X direction, and a 6-degree-of-freedom pipe (not shown) that transmits a use force such as vacuum or air from tube carrier 29 to wafer stage body 26 in a non-contact manner. ing. Here, the reason why the tube carrier 29 moves at a constant speed in the X direction is to reduce the influence of the reaction force generated by driving the tube carrier 29 on the wafer stage main body 26.

  Three openings are respectively formed on the side surface on the + X side and the side surface on the −X side of the wafer stage main body 26. A Y-axis stator 33 having a plurality of coils is provided so as to penetrate the wafer stage main body 26 through an opening formed in a substantially central portion of each side surface of these openings. Of the three openings formed on each side surface, the wafer stage main body 26 is moved through each of the two openings formed so as to sandwich the opening through which the Y-axis stator 33 passes in the Y direction. Two X-axis stators 34a and 34b are provided so as to penetrate. Furthermore, permanent magnets 35 are provided in openings through which the Y-axis stator 33 passes, and permanent magnets 36a, 36b are provided in openings through which the X-axis stators 34a, 34b pass. ing. These permanent magnets 33 and permanent magnets 36 a and 36 b are arranged symmetrically with respect to the center of gravity of the wafer stage main body 26.

  The Y-axis stator 33 cooperates with the permanent magnet 35 provided in the opening through which the Y-axis stator 33 penetrates to finely drive the wafer stage main body 26 in the Y direction. The two X-axis stators 34a and 34b drive the wafer stage body 26 with a long stroke in the X direction in cooperation with the permanent magnets 36a and 36b provided in the openings therethrough. To do. Here, the wafer stage main body 26 can be rotated in the θz direction by varying the drive amounts of the X-axis stators 34a and 34b.

  That is, the first drive system 27 is a moving magnet type linear motor composed of a Y-axis stator 33 and a permanent magnet 35, and a moving magnet type composed of an X-axis stator 34a, 34b and permanent magnets 36a, 36b. And a linear motor. Here, a case where a moving magnet type linear motor is provided will be described as an example, but a moving coil type linear motor may be provided. Further, as described above, wafer stage WST is a guideless stage that does not have a guide member for guiding the movement in the X direction.

  Further, two Z-axis stators (not shown) extending in the X direction are provided below the wafer stage main body 26, and the Z-axis is provided on the bottom surface of the wafer stage main body 26 corresponding to these Z-axis stators. Four permanent magnets 37a to 37d (see FIG. 3) are provided as the mover for use. One Z-axis stator is provided with two permanent magnets 37a and 37b, and the other Z-axis stator is provided with the remaining two permanent magnets 37c and 37d. These permanent magnets 37 a to 37 d are also arranged symmetrically with respect to the center of gravity of the wafer stage main body 26.

  Each of the two Z-axis stators is provided with a coil. By controlling the current supplied to these coils, the thrust in the Z direction generated between the corresponding permanent magnets 37a to 37d is changed. Therefore, the wafer stage main body 26 can be driven in the Z direction, θx, and θy directions. In order to drive the tube carrier 29 in the X direction, a stator TX extending in the X direction is also provided as shown in FIG. The Y-axis stator 33, the X-axis stators 34a and 34b, the two Z-axis stators (not shown), and the stator TX are movable at both ends constituting the second drive systems 28a and 28b. It is being fixed to child 39a, 39b, respectively.

  Above the protrusions FCa and FCb of the frame caster FC, Y-axis stators 38a and 38b extending in the Y direction and constituting the second drive systems 28a and 28b are disposed, respectively. These Y-axis stators 38a and 38b are levitated and supported above the protrusions FCa and FCb via a predetermined clearance by a static gas bearing (not shown) provided on each lower surface, for example, an air bearing. Yes. This is because the stators 38a and 38b move in the opposite direction as Y counter masses in the Y direction due to the reaction force generated by the movement of the wafer stage WST and the measurement stage MST in the Y direction. This is to offset.

  Between the stators 38a and 38b, the wafer stage main body 26 and the like described above are disposed, and the Y-axis stator 33, the X-axis stators 34a and 34b, the Z-axis stator, and the stator TX are arranged. Movable elements 39a and 39b fixed to both ends are inserted from the inside of the stators 38a and 38b, respectively. The stators 38a and 38b are provided with permanent magnets arranged along the Y direction, and the movers 39a and 39b are provided with coils arranged along the Y direction. That is, the second drive systems 28a and 28b include a moving coil type linear motor that drives the wafer stage WST in the Y direction. Here, the case where a moving coil type linear motor is provided will be described as an example, but a moving magnet type linear motor may be provided.

  Wafer stage WST has a guide member for guiding the movement in the Y direction except for the electromagnetic coupling between stator 38a and mover 39a and the electromagnetic coupling between stator 38b and mover 39b. It ’s a guideless stage. Note that the reaction force when the wafer stage WST is driven in the X direction is not caused by electromagnetic coupling between the stators 38a and 38b provided in the second drive systems 28a and 28b and the movers 39a and 39b. It is transmitted to the X counter mass shown in the figure. The X counter mass is provided between the projections FCa and FCb of the frame caster FC and the stators 38a and 38b, and supports the stators 38a and 38b used as the counter mass in the Y direction in the X direction. It is configured to be movable and moves in the opposite direction to the movement of wafer stage WST and measurement stage MST in the X direction to cancel the reaction force when wafer stage WST is driven in the X direction.

  A wafer holder 40 that holds the wafer W is provided on the wafer table WTB. The wafer holder 40 includes a plate-like main body portion and an auxiliary plate having liquid repellency (water repellency) fixed to the upper surface of the main body portion and having a circular opening larger than the diameter of the wafer W at the center thereof. Yes. A large number (a plurality) of pins are arranged in the region of the main body portion inside the circular opening of the auxiliary plate, and the wafer W is vacuum-sucked while being supported by the large number of pins. In this case, in a state where the wafer W is vacuum-sucked, the surface of the wafer W and the surface of the auxiliary plate are formed to have substantially the same height. Note that liquid repellency may be imparted to the surface of wafer table WTB without providing an auxiliary plate.

  Further, as shown in FIG. 2, a reflection surface 41X orthogonal to the X direction (extending in the Y direction) is formed by mirror finishing at one end (+ X side end) of the wafer table WTB in the X direction. A reflection surface 41Y orthogonal to the Y direction (extending in the X direction) is similarly formed by mirror finishing at one end (+ Y side end) in the direction. Interferometer beams (beams) from the X-axis interferometer 42 and the Y-axis interferometer 44 are respectively projected onto the reflecting surfaces 41X and 41Y. The X-axis interferometer 42 and the Y-axis interferometer 44 shown in FIG. 2 are collectively shown as the interferometer 23 in FIG.

  The X-axis interferometer 42 and the Y-axis interferometer 44 receive the reflected light from the reflecting surfaces 41X and 41Y, respectively, so that the reference positions of the reflecting surfaces 41X and 41Y (generally, the projection unit PU side surface and projection optics). A displacement in the measurement direction is detected from a fixed mirror disposed on the side surface of the off-axis alignment system 45 (see FIG. 1) disposed on the + Y direction side of the system PL. The reflecting surfaces 41X and 41Y, instead of the configuration formed on the end surface of the wafer table WTB, extend on the top surface of the wafer table WTB and have a reflecting surface extending in the X direction and in the Y direction. It is good also as a structure which each provides X movement mirror which has a reflective surface.

  The X-axis interferometer 42 measures the measurement axis parallel to the X axis passing through the projection center (optical axis AX, see FIG. 1) of the projection optical system PL, and passing through the measurement visual field center of the alignment system 45 and parallel to the X axis. The position of the wafer table WTB in the X direction is detected by a length measurement axis that passes through the projection center position of the projection optical system PL during exposure, and the alignment system 45 during enhanced global alignment (EGA). The position in the X direction of the wafer table WTB is measured with a length measurement axis passing through the center of the measurement visual field. Further, the X-axis interferometer 42 measures the position of the measurement table MTB in the X direction by appropriately using two measurement axes according to the measurement of the baseline amount and the measurement contents of various measuring instruments provided in the measurement stage MST. To do.

  That is, the X-axis interferometer 42 can measure the position in the X direction of the wafer table WTB or the measurement table MTB at each of the projection center position and the alignment center position in the Y direction. The baseline amount is an amount indicating the positional relationship of wafer stage WST with respect to the projection image of the pattern projected by projection optical system PL. Specifically, the measurement is performed by projection center of projection optical system PL and alignment system 45. The distance from the center of the field of view. Y-axis interferometer 44 has a measurement axis parallel to the Y-axis connecting the projection center (optical axis AX, see FIG. 1) of projection optical system PL and the measurement field center of alignment system 45, and Y-axis of wafer table WTB. The direction position is mainly detected.

  Measurement stage MST has substantially the same configuration as wafer stage WST except for tube carrier 29 and a six-degree-of-freedom pipe (not shown). That is, as shown in FIG. 2, a measurement stage main body 46 disposed on the base board 21 and a measurement table MTB mounted on the measurement stage main body 46 are provided. In addition, the measurement stage main body 46 is driven with a long stroke in the X direction, and a first drive system 47 that finely drives in the Y direction, Z direction, θx, θy, and θz, and the measurement stage main body 46 and the first drive system 47 are provided. Second drive systems 48a and 48b that drive in the Y direction with a long stroke are provided.

  The first drive system 47, like the first drive system 27 provided for the wafer stage WST, has a pair disposed at each of the three openings provided on the end surface in the ± X direction of the measurement stage main body 46. A permanent magnet formed, and one Y-axis stator and two X-axis stators each including a plurality of coils so as to penetrate the measurement stage main body 46 in the X direction through each of the openings. . The permanent magnet provided in the measurement stage main body 46 is arranged symmetrically with respect to the center of gravity of the measurement stage main body 46.

  These permanent magnets, the X-axis stator and the Y-axis stator drive the measurement stage main body 46 with a long stroke in the X direction, slightly drive it in the Y direction, and further rotate it in the θz direction. The first drive system 47 includes a permanent magnet provided on the bottom surface of the measurement stage main body 46 and a Z-axis stator that generates thrust in cooperation with the permanent magnet. This permanent magnet is also arranged symmetrically with respect to the center of gravity of the measurement stage main body 46. The measurement stage main body 46 can be driven in the Z direction, θx, and θy directions by these permanent magnets and the Z-axis stator. Here, the case where the first drive system 47 includes a moving magnet type linear motor will be described as an example. However, the first drive system 47 may include a moving coil type linear motor.

  The second drive systems 48a and 48b are arranged below the stators 38a and 38b, the X-axis stator and the Y-axis stator that penetrate the measurement stage main body 46 in the X direction, and the measurement stage main body 46 (−Z direction). The movable elements 49a and 49b are fixed to both ends of the Z-axis stator that is arranged, and the movable elements 49a and 49b are inserted from the inner sides of the stators 38a and 38b, respectively. The movers 49a and 49b include coils arranged along the Y direction, and generate thrust in the Y direction in cooperation with the stators 38a and 38b including permanent magnets arranged along the Y direction. . That is, the second drive systems 48a and 48b include a moving coil type linear motor that drives the measurement stage MST in the Y direction. Here, the case where a moving coil type linear motor is provided will be described as an example, but a moving magnet type linear motor may be provided.

  The first drive system 27 and the second drive systems 28a and 28b that drive the wafer stage WST described above, and the drive system of the stage apparatus ST by the first drive system 47 and the second drive systems 48a and 48b that drive the measurement stage MST. Is configured. This drive system is controlled by the above-described main controller, and for example, the movement of the measurement stage MST before exposure of the wafer W and the movement of the wafer stage WST during exposure are controlled.

  The measurement table MTB is made of, for example, a low thermal expansion material such as Zerodur (registered trademark) manufactured by Shot Japan Co., Ltd., and its upper surface has liquid repellency (water repellency). The measurement table MTB is held on the measurement stage main body 46 by, for example, vacuum suction, and is configured to be exchangeable. The height of the surface of measurement table MTB is set to be substantially the same as the height of the surface of wafer holder 40 provided on wafer table WTB. At one end (+ X side end) of the measurement table MTB in the X direction, a reflecting surface 51X orthogonal to the X direction (extending in the Y direction) is formed by mirror finishing, and one end in the Y direction (−Y side) At the end, a reflective surface 51Y orthogonal to the Y direction (extending in the X direction) is similarly formed by mirror finishing.

  Interferometer beams (beams) from the X-axis interferometer 42 and the Y-axis interferometer 52 are projected onto the reflecting surfaces 51X and 51Y, respectively. The X-axis interferometer 42 and the Y-axis interferometer 52 shown in FIG. 2 are collectively shown as the interferometer 22 in FIG. The X-axis interferometer 42 and the Y-axis interferometer 52 receive the reflected light from the reflecting surfaces 51X and 51Y, respectively, so that the reference positions of the reflecting surfaces 51X and 51Y (generally, the side surfaces of the projection unit PU and off-axis) A displacement in the measurement direction is detected from a fixed mirror disposed on the side surface of the mold alignment system 45 (see FIG. 1).

  The reflecting surfaces 51X and 51Y, instead of the configuration formed on the end surface of the measurement table MTB, are a Y movable mirror having a reflecting surface extending in the X direction on the upper surface of the measurement table MTB and extending in the Y direction. It is good also as a structure which each provides X movement mirror which has a reflective surface. Similar to the Y-axis interferometer 44, the Y-axis interferometer 52 measures in parallel with the Y-axis connecting the projection center of the projection optical system PL (optical axis AX, see FIG. 1) and the measurement field center of the alignment system 45. It has a long axis and detects the position of the measurement table MTB in the Y direction except when the wafer stage WST is positioned at the loading position for exchanging the wafer W.

  In addition, the measurement stage MST includes a measuring instrument group for performing various measurements related to exposure. Examples of the measuring instrument group include an aerial image measuring device, a wavefront aberration measuring device, and an exposure detecting device. The aerial image measurement device measures an aerial image projected on the measurement table MTB through water by the projection optical system PL. As the wavefront aberration measuring apparatus, for example, a wavefront aberration measuring apparatus disclosed in International Publication No. 99/60361 pamphlet (corresponding specification of European Patent No. 1,079,223) or the like can be used.

  Further, the exposure detection apparatus described above is a detection apparatus that detects information (light quantity, illuminance, illuminance unevenness, etc.) relating to exposure energy of exposure light irradiated onto the measurement table MTB via the projection optical system PL. Nonuniformity measuring instrument disclosed in Japanese Laid-Open Patent Publication No. 57-117238 (corresponding US Pat. No. 4,465,368) and the like, and for example, Japanese Patent Laid-Open No. 11-16816 (corresponding US Patent Application Publication No. 2002 / No. 0061469) and the like can be used.

  At a predetermined position on the upper surface of the measurement table MTB, a reference plate 53 is provided as a measurement pattern portion on which various marks used in these measuring instrument groups or the alignment system 45 (see FIG. 1) are formed. The reference plate 53 is made of a low thermal expansion material, and the upper surface has liquid repellency (water repellency), and is configured to be replaceable with respect to the measurement table MTB.

  Returning to FIG. 1, the off-axis type alignment system 45 provided on the holding member that holds the projection unit PU is used for an object mark (an alignment mark formed on the wafer W, a reference mark formed on the reference plate 53, etc.). Measure the position. The alignment system 45 irradiates the target mark with a broadband detection light beam that does not sensitize the resist on the wafer W, and the target mark image formed on the light receiving surface by reflected light from the target mark and an index (not shown) An image processing type FIA (Field Image Alignment) system that captures an image of an index pattern on an index plate provided in the alignment system 45 using an image sensor (CCD or the like) and outputs the image signals. It is an alignment sensor. The imaging signal from the alignment system 45 is supplied to the main controller described above.

  Furthermore, although not shown in the drawing, the exposure apparatus EX of the present embodiment is provided with a focal position detection system including an irradiation system and a light receiving system. This focal position detection system is disclosed in, for example, Japanese Patent Laid-Open No. Hei 6-283403 (corresponding US Pat. No. 5,448,332) and the like. From the irradiation system to the exposure region (projection region of the projection optical system PL). By irradiating each of a plurality of detection points set in the detection direction from an oblique direction and receiving the reflected light by a light receiving system, for example, the position and orientation in the Z direction of the wafer W (X axis and Y axis) Rotation around) is detected.

  Next, details of the self-weight canceller 56 provided for the wafer stage main body 26 and the self-weight canceller mechanism 57 provided for the measurement stage main body 46 will be described. FIG. 3 is a bottom perspective view of the wafer stage main body 26. Since the self-weight canceller 56 provided for the wafer stage main body 26 and the self-weight canceller mechanism 57 provided for the measurement stage main body 46 have substantially the same configuration, the wafer stage main body 26 will be described in the following description. Only the self weight canceller 56 provided for the measurement stage M will be described, and the description of the self weight canceller mechanism 57 provided for the measurement stage MST will be omitted.

  As shown in FIG. 3, the permanent magnets 37a to 37d described above are provided at the four corners of the bottom surface of the wafer stage main body 26, whereas the self-weight canceller 56 is attached to the center of the bottom surface of the wafer stage main body 26. The self-weight canceller 56 is not directly attached to the wafer stage main body 26 but is attached to the wafer stage main body 26 via an adapter 60 as an adjustment member. The adapter 60 is attached between the wafer stage main body 26 and the self-weight canceller 56 in order to adjust the position of the center of gravity of the wafer stage main body 26 including the self-weight canceller 56. By providing the adapter 60, the wafer stage main body is provided. The position of the self weight canceller 56 with respect to 26 in the X direction and the Y direction can be adjusted.

  4 is a bottom view showing a state where the adapter 60 and the self-weight canceller 56 are attached to the wafer stage main body 26, and FIG. 5 is a perspective view showing a state where the adapter 60 and the self-weight canceller 56 are separated from the wafer stage main body 26. . As shown in FIGS. 4 and 5, the adapter 60 is a flat plate member made of, for example, aluminum and having a thickness of about 5 to 10 mm, and a circular hole 61 is formed at the center thereof. The thickness of the adapter 60 can be set as appropriate according to the difference between the height of the self-weight canceller 56 and the height position of the bottom surface of the wafer stage body 26. As shown in FIG. 4, holes 62 a to 62 d are formed at the four corners of the adapter 60, and the adapter 60 is fastened and fixed to the wafer stage main body 26 by bolts B <b> 1 through each of these holes 62 a to 62 d. .

  The holes 62a to 62d formed in the adapter 60 are longitudinal holes having a length of about 1 cm. Among the holes 62a to 62d, the holes 62a and 62c formed on one diagonal are longitudinal holes extending in a direction perpendicular to the diagonal, and the holes 62b and 62d formed on the other diagonal are It is a longitudinal hole extending in the direction of the diagonal line. As shown in FIG. 4, the adapter 60 is attached to the wafer stage main body 26 with one diagonal line along the X axis and the other diagonal line along the Y axis, so that the longitudinal directions of the holes 62a to 62d are all in the Y direction. Will be along. Thereby, the position of the adapter 60 in the Y direction with respect to the wafer stage main body 26 can be adjusted within a range of about ± 5 mm. As shown in FIG. 5, screw holes 63 a to 63 d for attaching the self-weight canceller 56 to the adapter 60 are formed in the adapter 60 at four positions forming 45 ° with respect to the diagonal line.

  Further, holes 66a to 66d are formed at the four corners of the mounting portion 65 having an outer shape of a rectangular flat plate provided at the upper end portion of the self-weight canceller 56, and a bolt through each of the holes 66a to 66d. The self-weight canceller 56 is fixed to the adapter 60 by fastening B2 to each of the screw holes 63a to 63d formed in the adapter 60. The holes 66a to 66d formed in the attachment portion 65 of the self-weight canceller 56 are longitudinal holes extending in a direction along one of the two pairs of sides of the attachment portion 65, and the length thereof is It is about 1 cm. In the example shown in FIG. 4, the longitudinal direction of the holes 66a to 66d is set in a direction along a pair of sides extending in the X direction. The self-weight canceller 56 is attached to the adapter 60 such that the longitudinal direction of the holes 66 a to 66 d formed in the attachment part 65 is perpendicular to the longitudinal direction of the holes 62 a to 62 d formed in the adapter 60. For this reason, the longitudinal direction of the holes 66a to 66d is along the X direction. Thereby, it is possible to adjust the position of the self weight canceller 56 in the X direction with respect to the adapter 60 within a range of about ± 5 mm.

  For this reason, by attaching the self-weight canceller 56 to the wafer stage main body 26 via the adapter 26, the position of the self-weight canceller 56 in the X direction and the position in the Y direction relative to the wafer stage main body 26 can be adjusted. As a result, it is possible to adjust the position of the center of gravity of the wafer stage main body 26 including the self-weight canceller 56 on the base board 21. For this reason, even if the wafer stage WST is increased in speed and acceleration, it can be controlled with high accuracy.

  Next, the configuration of the self-weight canceller 56 will be described in detail. 6-8 is sectional drawing which shows the structure of the self-weight canceller 56, Comprising: The relationship of these figures is as follows. That is, FIG. 7 is a cross-sectional perspective view taken along the line AA in FIG. 6, FIG. 6 is a cross-sectional view taken along the line BB in FIG. FIG. 8 is a sectional view taken along the line. As shown in FIG. 6, the self-weight canceller 56 roughly includes a cylinder part 70a attached to the wafer stage main body 56 via an adapter 60, and a piston part 70b movable relative to the cylinder part 70a. Consists of.

  The cylinder part 70 a includes a housing member 71, a cylinder member 72, and a top plate member 73. The housing member 71 is a substantially cylindrical member that is hollow inside and opened upward, and has an attachment portion 65 described with reference to FIG. 4 and FIG. A circular opening 71a is formed at the center of the bottom surface. Further, a through hole 71b that connects the internal space and the outside is formed in the wall surface on the + Y direction side of the housing member 71.

  One end of an air supply pipe (not shown) is connected to the through hole 71b, and the other end of the air supply pipe is connected to a gas supply device (not shown). This gas supply device is a device for supplying a rare gas such as helium, an inert gas such as nitrogen, or a gas such as air (first gas), and the supplied gas penetrates through a supply pipe (not shown). It is supplied to the hole 71b. In addition, the pressure of the gas supplied to the through hole 71b is set to about 0.3 Mpa.

  The cylinder member 72 is a substantially cylindrical member in which a fixing member 72a is formed on a part of the outer peripheral surface over the entire outer peripheral surface. The cylinder member 72 is inserted into an opening 71a formed in the housing member 71 until a fixing member 72a formed on a part of the outer peripheral surface comes into contact with the bottom surface of the housing member 71. 72 is fixed. The formation position of the fixing member 72a on the outer peripheral surface of the cylinder member 72 is appropriately set according to the distance between the base board 21 and the wafer stage main body 26, the length of the housing member 72 in the Z direction, and the like.

  Further, as shown in FIG. 7, eight supply pipes H <b> 11 to H <b> 18 are formed in the cylinder member 72 at intervals of a central angle of 45 °. These air supply lines H11 to H18 extend from the vicinity of the lower end of the cylinder member 72 to the upper end, and open at the upper end of the cylinder member 72. Injection holes N11 to N18 communicating with the inner peripheral surface of the cylinder member 72 are formed in the vicinity of the lower ends of the air supply pipes H11 to H18. Ejection holes N21 to N28 communicating with the peripheral surface (however, only the ejection holes N21 and N25 are shown in FIG. 6 and the ejection holes N22 to N24 and N26 to N28 are not shown) are formed.

  In the vicinity of the lower end of the cylinder member 72 and on the wall surface on the −Y direction side, an air supply port 72 b that connects the air supply line H <b> 11 and the outer peripheral surface of the cylinder member 72 is formed. By this air supply port 72b, only the air supply line H11 of the air supply lines H11 to H18 communicates with the outer peripheral surface of the cylinder member 72, and the air supply port 72b is connected to the other air supply lines H12 to H18. Since the through hole corresponding to is not formed, the air supply conduits H12 to H18 do not communicate with the outer peripheral surface of the cylinder member 72.

  One end of an air supply pipe (not shown) is connected to the air supply port 72b, and the other end of the air supply pipe is connected to a gas supply device (not shown). This gas supply device is a device for supplying a rare gas such as helium, an inert gas such as nitrogen, or a gas such as air (second gas), and the supplied gas is supplied via a supply pipe (not shown). It is supplied to the air mouth 72b. In addition, the pressure of the gas supplied to the air supply port 72b is higher than the pressure of the gas supplied to the through hole 71b formed in the housing member 71 described above as an example, for example, about 0.3 to 0.4 Mpa. Set to

  Further, in the cylinder member 72, two recovery pipes H21 and H22 are formed at intervals of a central angle of 180 ° at positions different from the formation positions of the air supply pipes H11 to H18. In the example shown in FIG. 7, the recovery pipe H21 is formed at a position that forms a central angle of 22.5 ° with each of the air supply pipes H12 and H13, and the recovery pipe H22 has a central angle with each of the air supply pipes H16 and H17. It is formed at a position forming 22.5 °. Unlike the air supply pipes H11 to H18, the recovery pipes H21 and H22 extend from the vicinity of the upper end of the cylinder member 72 to the lower end, and open at the lower end of the cylinder member 72.

  A recovery port 72c communicating with the inner peripheral surface of the cylinder member 72 is formed at the upper end of the recovery pipe H21, and a recovery port 72d communicating with the inner peripheral surface of the cylinder member 72 is formed at the upper end of the recovery pipe H22. Is formed (see FIG. 8). In the recovery pipes H21 and H22, those corresponding to the ejection holes N11 to N18 and N21 to N28 communicating with the inner peripheral surface of the cylinder member 72 formed in the air supply pipes H11 to H18 are not formed.

  An annular cap member 74 having an outer diameter and an inner diameter substantially the same as the outer diameter and inner diameter of the cylinder member 72 and having an opening communicating with the first space RM1 is attached to the upper end portion of the cylinder member 72. ing. A groove portion 74 a is formed on one side surface of the cap member 74 along the circumferential direction. The cap member 74 is formed on the upper end portion of the cylinder member 72 with the side surface formed with the groove portion 74 a facing the cylinder member 72. It is attached. As described above, the supply pipes H11 to H18 are open at the upper end of the cylinder member 72, but the recovery pipes H21 and H22 are open at the lower end of the cylinder member 72 and are not open at the upper end. For this reason, only the air supply pipes H11 to H18 of the air supply pipes H11 to H18 and the recovery pipes H21 and H22 are in communication with each other via the groove 74a formed in the cap member 74.

  The top plate member 73 is attached to the upper end of the housing member 71 so as to close the released upper portion of the housing member 71. With the above configuration, the cylinder portion 70a has the first space RM1 formed by the housing member 71 and the top plate member 73 and the second space (internal space of the cylinder member 72) RM2 formed by the cylinder member 72. is doing. Since the cylinder member 72 has a substantially cylindrical shape and the cap member 74 has an annular shape, the second space RM2 communicates with the first space RM1, and a part of the cylinder member 72 is in the first space RM1. Since it is arranged, at least a part of the second space RM2 is arranged in the first space RM1. The first space RM1 and the second space RM2 are filled with the gas (first gas) supplied through the through hole 71b formed in the housing member 71.

  The piston part 70 b includes a piston member 75, a pedestal member 76, and a ball seat member 77. The piston member 75 is a cylindrical member whose outer diameter is slightly smaller than the inner diameter of the cylinder member 72, and in a state in which a predetermined clearance is formed between the piston member 75 and the inner peripheral surface of the cylinder member 72. It is inserted into the second space RM2 formed by the member 72. The cylinder member 72 is fixedly attached to the upper surface of the base member 76. The length of the piston member 75 in the axial direction is set to be approximately the same as the length of the cylinder member 72 in the axial direction.

  The pedestal member 76 is a substantially cylindrical member that is integrated with the piston member 75 and moves relative to the cylinder portion 70a. A convex portion having a circular planar shape having a diameter similar to the inner diameter of the piston member 75 is formed at the center portion of the upper surface of the pedestal member 76, and the lower end portion of the piston member 75 is the upper surface of the pedestal member 76. It is fixed and attached in a state where it is fitted to the convex part formed on. The bottom surface of the pedestal member 76 is formed in a concave shape in accordance with the spherical shape of the ball seat member 77. At the center of the pedestal member 76, an ejection hole 76a that connects the upper surface and the bottom surface thereof is formed.

  The ball seat member 77 is a member having a flat bottom surface and a convex upper surface. The ball seat member 77 is fitted to the bottom surface of the pedestal member 76 in a state in which a predetermined clearance is formed between the bottom surface of the pedestal member 76 disposed above. At the center of the ball seat member 77, a Z-direction vent pipe 77a extending from the top surface to the bottom surface is formed. The air duct 77a communicates with both the groove 77b formed on the upper surface of the ball seat member 77 and the groove 77c formed on the bottom surface. The groove 77b has a cross shape orthogonal to the center of the upper surface of the ball seat member 77, and the groove 77c has a cross shape orthogonal to the center of the bottom of the ball seat member 77. The ball seat member 77 has a hollow interior for weight reduction. In addition, the vent conduit 77a formed in the central portion of the ball seat member 77 is set to be wide in the vicinity of the central portion, but is set to be narrow in the vicinity of the top surface and the bottom surface.

  Next, the operation of the self-weight canceller 56 having the configuration described above will be described. 9 and 10 are cross-sectional views for explaining the operation of the self-weight canceller 56. 9 is a cross-sectional view taken along the line BB in FIG. 7 similar to FIG. 6, and FIG. 10 is a cross-sectional view taken along the line CC in FIG. 7 similar to FIG. FIG. Gas (first gas) is supplied to the first weight canceller 56 from a gas supply device (not shown) through the through hole 71b formed in the housing member 71 of the cylinder portion 70a. At the same time, a gas (second gas) having a pressure higher than that of the first gas is supplied from the gas supply device (not shown) to the air supply line H11 through the air supply port 72b formed in the cylinder member 72 of the cylinder part 70a. Has been.

  As shown in FIGS. 7 and 8, the first gas supplied to the first space RM1 is also supplied to the second space RM2 communicating with the first space RM1. In addition, since the cylindrical piston member 75 is inserted into the second space RM2 formed by the cylinder member 72, the first gas supplied from the first space RM1 to the second space RM2 is in the piston member 75. Flows into the interior. Since the injection hole 76a is formed in the center part of the base member 76 to which the lower end part of the piston member 75 is fixed, the first gas flowing into the piston member 75 is indicated by an arrow A1 in FIG. A flow in the Z direction occurs. When the first gas having the flow indicated by the arrow A1 flows into the ejection hole 76a, the first gas is ejected from the lower end portion of the ejection hole 76a toward the upper surface of the ball seat member 77.

  When the first gas is ejected toward the upper surface of the ball seat member 77, the flow in the direction along the groove 77b formed on the upper surface of the ball seat member 77 (the flow indicated by the arrow A2), and the center of the ball seat member 77 Flows into the ventilation duct 77a formed in the section and flows in the -Z direction (flow indicated by arrow A3). The first gas having the flow indicated by the arrow A2 reaches the entire groove 77b and is ejected from the entire groove 77b along the upper surface of the ball seat member 77. As a result, a predetermined pressure between the bottom surface of the pedestal member 76 and the top surface of the ball seat member 77 due to the static pressure (pressure in the gap) of the first gas between the bottom surface of the pedestal member 76 and the top surface of the ball seat member 77. A clearance ΔL1 is formed. That is, a kind of gas hydrostatic bearing is substantially formed on the bottom surface of the pedestal member 76, and the pedestal member 76 can be moved in the direction along the top surface of the ball seat member 77. Is supported in a non-contact manner. Hereinafter, this static gas bearing is also referred to as a “θ bearing”.

  The first gas having the flow indicated by the arrow A3 is jetted toward the upper surface 21a of the base board 21 through the ventilation duct 77a and flows in a direction along the groove 77c formed on the bottom surface of the ball seat member 77 (arrow). A flow indicated by A4) occurs. The first gas having the flow indicated by the arrow A4 reaches the entire groove 77c and is ejected from the entire groove 77bc along the upper surface 21a of the base board 21. As a result, the static pressure of the first gas between the bottom surface of the ball seat member 77 and the upper surface 21 a of the base board 21 (pressure in the gap) causes the gap between the bottom surface of the ball seat member 77 and the upper surface 21 a of the base board 21. A predetermined clearance ΔL2 is formed. That is, a kind of gas hydrostatic bearing is substantially formed on the bottom surface of the ball seat member 77, and the ball seat member 77 is movable in the direction along the upper surface 21 a of the base plate 21. It is supported in a floating manner in a non-contact manner above. Hereinafter, this static gas bearing is also referred to as a “thrust bearing”.

  On the other hand, the second gas is supplied to the air supply line H11 via the air supply port 72b formed in the cylinder member 72 of the cylinder part 70a. Here, since the air supply port 72b is formed at the lower end portion of the supply pipe H11, a flow in the + Z direction indicated by the arrow B1 in the drawing is generated in the second gas, and the air supply pipe H11 is filled. . The second gas filled in the air supply conduit H11 is ejected from the ejection holes N11 and N21 formed in the air supply conduit H11 toward the outer peripheral surface of the piston member 75. In addition, the second gas filled in the air supply line H11 has a flow in a direction along the groove 74a formed in the cap member 74, and the air supply lines H12 to H18 communicate with the air supply line H11 through the groove 74a. Are supplied respectively.

  The second gas supplied to the air supply lines H12 to H18 through the grooves 74a formed in the cap member 14 causes a flow in the −Z direction, and is filled in each of the air supply lines H12 to H18. In FIG. 9, the flow of the second gas supplied to the air supply line H15 is indicated by an arrow B2 in the drawing. The second gas filled in the air supply conduits H12 to H18 is ejected toward the outer peripheral surface of the piston member 75 from each of the ejection holes N12 to N18 and N22 to N28 formed in the air supply conduits H12 to H18. Note that FIG. 9 illustrates only the flow of the second gas that is ejected toward the outer peripheral surface of the piston member 75 via the ejection holes N15 and N25 supplied to the air supply line H15.

  The second gas is ejected from each of the ejection holes N11 to N18 and N21 to N28 of the air supply pipes H11 to H18 toward the outer peripheral surface of the piston member 75, so that the first gas between the cylinder member 72 and the piston member 75 is discharged. A predetermined clearance ΔL3 is formed between the inner peripheral surface of the cylinder member 72 and the outer peripheral surface of the piston member 75 by the static pressure of the two gases (pressure in the gap). That is, a kind of gas hydrostatic bearing is substantially formed on the inner wall of the cylinder member 72, and the cylinder member 72 and the piston member 75 are not in contact with each other. Hereinafter, this static gas bearing is also referred to as a “radial bearing”.

  As shown in FIG. 10, the second gas ejected from the ejection holes N <b> 11 to N <b> 18 and N <b> 21 to N <b> 28 of the air supply pipes H <b> 11 to H <b> 18 toward the outer circumferential surface of the piston member 75 It spreads over the entire gap between the outer peripheral surface of the piston member 75. The second gas in the gap flows into the recovery pipes H21 and H22 from the recovery ports 72c and 72d formed on the inner peripheral surface of the cylinder member 72. In the second gas flowing into the recovery pipes H21 and H22, a flow in the −Z direction indicated by the arrow C1 in the figure is generated, and from the lower ends of the recovery pipes H21 and H22 opened at the lower end edge of the cylinder member 72. It is discharged outside.

  According to the self-weight canceller 56 described above, when the wafer stage body 26 is supported by the upper end portion thereof, the self-weight is supported by the positive pressure of the space composed of the first space RM1 and the second space RM2. In order to reduce the rigidity of the self-weight canceller 56 and prevent the transmission of vibration from the base board 21 to the wafer stage main body 26, the volume of the space composed of the first space RM1 and the second space RM2 may be increased as much as possible. desirable. Further, the clearance ΔL1 is always maintained between the pedestal member 76 and the ball seat member 77 by the action of the θ bearing, and between the ball seat member 77 and the upper surface 21a of the base board 21 is always kept by the action of the thrust bearing. Clearance ΔL2 is maintained.

  Further, when a force to tilt the wafer stage main body 26 in the tilt direction (θx, θy direction) is generated, the clearance ΔL3 is maintained by the action of the radial bearing, and the clearance L1 is maintained by the action of the θ bearing. The pedestal member 76 moves along the upper surface of the ball seat member 77 as it is. For this reason, it is very easy to incline the posture of the wafer stage main body 26. The self-weight canceller 56 of the present embodiment supports the wafer stage body 26 with six degrees of freedom in the X direction, Y direction, Z direction, θX direction, θy direction, and θz direction.

  The self-weight canceller 56 of the present embodiment uses the pressure of the second gas supplied to a bearing (radial bearing) for preventing collision between the cylinder member 72 of the cylinder portion 70a and the piston member 75 of the piston portion 70b. It is set higher than the pressure of the first gas used for the bearings (thrust bearings and θ bearings) for supporting 26. Therefore, the rigidity of the self-weight canceller 56 can be lowered to prevent the vibration from the base board 21 to the wafer stage main body 26, and at the same time, even if the wafer stage WST is increased in speed and acceleration, the cylinder member 72 Collision with the piston member 75 can be prevented.

  The self-weight canceller 56 described above is attached to the wafer stage main body 26 via the adapter 60, and the center of gravity position in the XY plane of the wafer stage main body 26 including the self-weight canceller 26 can be adjusted by the adapter 60. Yes. Adjustment of the position of the center of gravity in the Z direction can be realized by attaching the weight canceller 56 with a weight. FIG. 11 is a side view of the self-weight canceller 56 to which a weight for adjusting the position of the center of gravity in the Z direction is attached.

  In order to adjust the center-of-gravity position in the Z direction of the wafer stage main body 26 including the self-weight canceller 26, for example, as shown in FIG. 11A, a weight 80 is provided on the bottom surface of the housing member 71 forming a part of the cylinder portion 70a. Install. As shown in FIG. 11B, the weight 80 is an annular member having an inner diameter larger than the outer diameter of the cylinder member 72 or the outer diameter of the fixing member 72 a provided on the cylinder member 72. A hole 80a is formed in the weight 80 at a position having a central angle of 90 °, and the weight 80 is attached to the bottom surface of the housing member 71 using, for example, a bolt through the hole 80a.

  By attaching the weight 80, the center of gravity position in the Z direction of the wafer stage main body 26 including the self-weight canceller 26 can be lowered in the -Z direction. . Although the weight 80 may be directly attached to the bottom surface of the housing member 71, the center of gravity position in the Z direction can be further lowered by attaching the weight 80 via a spacer. As described above, since the center of gravity in the Z direction of the wafer stage main body 26 including the self-weight canceller 26 can be adjusted, high-precision control is possible even if the wafer stage WST is increased in speed and acceleration.

  Next, the operation of the exposure apparatus EX will be briefly described. When the exposure process is started, wafer stage WST moves to a predetermined loading position, and wafer W to be subjected to the exposure process is loaded and held on wafer holder 40. While the wafer W is being loaded, the measurement stage MST moves below the projection optical system PL or the alignment system 45 (−Z direction) and performs various measurements. As this measurement, for example, the measurement of the baseline amount of the alignment system 45 performed after the reticle exchange on the reticle stage RST is given as an example.

  When the loading of the wafer W and the measurement of the measurement stage MST using various measuring instruments are completed, the measurement stage MST moves to a predetermined retraction position set on the base board 21 and the wafer stage WST moves below the alignment system 45. Moving to (−Z direction), EGA measurement is performed. In this EGA measurement, several representative alignment marks formed on the wafer W are measured, and an array of all shot areas set on the wafer W is obtained by statistical calculation.

  When the EGA measurement is completed, exposure is performed on each shot area set on the wafer W. In this process, first, the first drive system 27 and the second drive systems 28a and 28b provided on the wafer stage WST are driven by a control device (not shown), and the shot area to be exposed first is arranged at the movement start position. Wafer stage WST is moved. At the same time, reticle stage RST is also arranged at the start of movement. When the above arrangement is completed, the main controller starts to move the reticle stage RST and wafer stage WST, and after the reticle stage RST and wafer stage WST reach a predetermined speed, the settling time (of the reticle stage RST and wafer stage WST) is reached. The exposure light IL is irradiated onto the reticle R after the elapse of time (which is provided for accommodating vibrations generated by acceleration), and exposure of the shot area is started. When the exposure process for one shot area is completed, main controller moves wafer stage WST stepwise in the X direction, and places the next shot area to be exposed at the movement start position. Thereafter, the exposure of all shot areas on the wafer W is similarly performed.

The embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and can be used for an exposure apparatus to which the liquid immersion method is not applied. In the above embodiment, the case where ArF excimer laser light is used has been described as an example. However, for example, g-line (wavelength 436 nm), i-line (wavelength 365 nm), or KrF excimer laser light (wavelength 248 nm). F ₂ laser light (wavelength 157 nm), Kr ₂ laser light (wavelength 146 nm), YAG laser light, or a semiconductor laser high frequency can be used. Furthermore, a single wavelength laser beam oscillated from a DFB semiconductor laser or fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and yttrium), and a nonlinear optical crystal is obtained. It is also possible to use harmonics that have been converted into ultraviolet light. For example, when the oscillation wavelength of a single wavelength laser is in the range of 1.51-1.59 μm, the generated wavelength is in the range of 189 to 199 nm, the eighth harmonic, or the generated wavelength is in the range of 151 to 159 nm. A 10th harmonic is output.

  The present invention can also be applied to a twin stage type exposure apparatus provided with a plurality of wafer stages. The structure and exposure operation of a twin stage type exposure apparatus are described in, for example, Japanese Patent Laid-Open Nos. 10-163099 and 10-214783 (corresponding US Pat. Nos. 6,341,007, 6,400,441, 6,549). , 269 and 6,590,634), JP 2000-505958 (corresponding US Pat. No. 5,969,441) or US Pat. No. 6,208,407. Furthermore, the present invention may be applied to the wafer stage disclosed in Japanese Patent Application No. 2004-168482 filed earlier by the present applicant.

  In addition, as a board | substrate hold | maintained at a moving stage in said each embodiment, it is used with not only the semiconductor wafer for semiconductor device manufacture but the glass substrate for display devices, the ceramic wafer for thin film magnetic heads, or exposure apparatus. A mask or reticle master (synthetic quartz, silicon wafer) or the like is applied. As the exposure apparatus EX, a scanning exposure apparatus that does not use an immersion method, or a step-and-repeat method in which the pattern of the reticle R is collectively exposed while the reticle R and the wafer W are stationary, and the wafer W is sequentially moved stepwise. The present invention can also be applied to a projection exposure apparatus (stepper). The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the wafer W. The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the wafer W, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing a reticle, a mask or the like.

  As described above, the exposure apparatus EX of the present embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room in which the temperature, cleanliness, etc. are controlled.

  FIG. 12 is a flowchart showing an example of a manufacturing process of a microdevice (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.). As shown in FIG. 12, a microdevice such as a semiconductor device includes a step (S11) for designing a function / performance of the microdevice, a step (S12) for producing a mask (reticle) based on the design step, and a substrate (device substrate). Wafer S), exposure processing step S14 in which the mask pattern is transferred to the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, and packaging process) S15, and inspection step S16. And so on.

It is a side view which shows schematic structure of the exposure apparatus by one Embodiment of this invention. It is a perspective view which shows the structure of the stage apparatus ST. 4 is a bottom perspective view of the wafer stage main body 26. FIG. 4 is a bottom view showing a state where an adapter 60 and a self-weight canceller 56 are attached to the wafer stage main body 26. FIG. 4 is a perspective view showing a state in which an adapter 60 and a self-weight canceller 56 are separated from a wafer stage main body 26. FIG. 3 is a cross-sectional view showing a configuration of a self-weight canceller 56. FIG. 3 is a cross-sectional view showing a configuration of a self-weight canceller 56. FIG. 3 is a cross-sectional view showing a configuration of a self-weight canceller 56. FIG. 6 is a cross-sectional view for explaining the operation of the self-weight canceller 56. FIG. 6 is a cross-sectional view for explaining the operation of the self-weight canceller 56. FIG. It is a side view of the self-weight canceller 56 which attached the weight for adjusting the gravity center position of a Z direction. It is a flowchart which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

21a Upper surface of base board (predetermined reference surface)
26 Wafer stage body (stage body)
34a, 34b X-axis stator (stator)
36a, 36b Permanent magnet (mover)
46 Measurement stage body (stage body)
56,57 Self-weight canceller (support mechanism)
60 Adapter (Adjustment member)
70a Cylinder part 70b Piston part 71 Housing member (cylinder part)
71b Through hole (first supply path)
72 Cylinder member (cylinder part)
72b Air supply port (second supply path)
73 Top plate member (cylinder part)
75 Piston member (piston part)
76 Base member (piston part)
77 Ball seat member (piston part)
EX exposure apparatus H11 to H18 Air supply line (first supply path)
H21, H22 Recovery pipeline (common recovery channel)
MST measurement stage (stage device)
RM1 first space RM2 second space ST stage device W wafer (substrate)
WST wafer stage (stage equipment)

Claims (12)

In a stage apparatus comprising a stage main body configured to be movable on a predetermined reference plane, and a support mechanism attached to the stage main body and supporting the stage main body on the predetermined reference plane.
A stage apparatus comprising an adjustment member for adjusting the position of the center of gravity of the stage main body including the support mechanism.   The stage apparatus according to claim 1, wherein the adjustment member is provided between the stage main body and the support mechanism.   The stage device according to claim 1, wherein the adjustment member adjusts a position of a center of gravity of the stage main body including the support mechanism on the predetermined reference surface. A linear motor including a plurality of movers provided in the stage main body and a plurality of stators cooperating with the plurality of movers;
4. The stage apparatus according to claim 1, wherein the plurality of movable elements are arranged symmetrically with respect to a center of gravity of the stage main body including the support mechanism. 5. In a stage apparatus comprising a stage main body configured to be movable on a predetermined reference plane, and a support mechanism attached to the stage main body and supporting the stage main body on the predetermined reference plane.
The support mechanism includes a first space to which a first gas from a first supply path is supplied, and a second space at least a part of which is disposed in the first space and communicates with the first space, A cylinder portion provided in the stage body; and a piston portion inserted into the second space and movable relative to the cylinder portion;
The stage apparatus, wherein the weight of the stage main body is supported by the first gas supplied to the second space.   The stage apparatus according to claim 5, wherein the support mechanism includes a plurality of bearing portions that support the stage main body with six degrees of freedom.   The stage apparatus according to claim 6, wherein a part of the plurality of bearing portions supports the stage body using the first gas.   Of the plurality of bearing portions, the bearing portion that supports the stage main body along a direction orthogonal to the predetermined reference plane uses a second gas from a second supply path different from the first supply path. The stage apparatus according to claim 6 or 7, wherein   The stage apparatus according to claim 8, wherein the pressure of the second gas is higher than the pressure of the first gas.   The said some bearing part is a fluid bearing, It provided with the common collection | recovery path which collect | recovers the fluid supplied to these bearing parts, The Claim 6 characterized by the above-mentioned. Stage device. In an exposure apparatus that exposes a substrate,
An exposure apparatus comprising the stage device according to any one of claims 1 to 10 as a stage for holding the substrate. A device manufacturing method, wherein a device is manufactured using the exposure apparatus according to claim 11.

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