JP2006237199A - Lens for light emitting diode and light emitting diode light source - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a lens for LED in which UV-rays not converted by an LED light source is prevented from leaking to the outside of the LED light source, and impact of UV-rays on the peripheral members, e. g. deterioration of acryl resin, ABS resin, and the like, used in car components due to leaked UV-rays, can be prevented effectively, and to provide an LED light source excellent in heat resistance, weatherability such as UV-resistance, and stability with time and capable of emitting light with stabilized color tone. <P>SOLUTION: A lens 1 for light emitting diode being used as the lens of a light emitting diode light source 2 with lens comprises a lens body 11 formed of a material having heat resistance and UV-resistance, and a UV-ray absorption layer 12 employing a material having heat resistance and UV-resistance as a substrate and containing a UV-ray absorbing material wherein the UV-ray absorption layer 12 is the lens 1 for light emitting diode provided on the light emitting diode light source side of the lens body 11. The light emitting diode light source 2 employing the lens 1 for light emitting diode is also provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light-emitting diode lens and a light-emitting diode light source device, and more particularly, to a light-emitting diode lens used as a lens of a light-emitting diode light source device with a lens, and comprising an ultraviolet absorbing layer containing an ultraviolet absorber. The present invention relates to a light-emitting diode lens and a light-emitting diode light source device using the same.

  A light-emitting diode (hereinafter abbreviated as LED) is a product in which an LED die itself emits light when an electric current is passed through the LED die (light-emitting element). Traffic lights, stop lamps, displays, general lighting, automotive parts ( Recently, so-called high-power LEDs have been developed, and for example, a high-power LED light source device as shown in FIG. 2 has been developed.

  The high-power LED light source device shown in FIG. 2 is a so-called resin-sealed LED light source device with a lens. In the figure, 1 'is an LED lens, and 2' is an LED light source device. The LED lens 1 ′ is formed of a transparent material into a substantially dome shape having a flange portion 11 a on the bottom surface. The LED light source device 2 ′ includes a housing 21 made of a light-shielding material, having an upper surface opened, and a stepped portion 21b provided on the lower side wall of the opening 21a. The bottom surface of the housing 21 has a recess 22a. A heat sink 22 is incorporated. The LED die 24 is bonded to the upper surface of the recess 22 a of the heat sink 22 with silver paste or the like, and the surface electrode of the LED die 24 is connected to the electrode 23 inserted from the side wall of the housing 21 by the conductive wire 25. The LED die 24 is covered with the coating part 4. The housing 21 is filled with the resin mold 26 so as not to form a gap between the lower surface of the LED lens 1 ′ and the upper surface of the step portion 21b of the housing 21 is filled with the LED lens 1 ′. The bottom surface of is attached.

  The coating portion 4 is obtained by dispersing a phosphor in a translucent resin such as an epoxy resin. This phosphor converts the wavelength of the light generated by the LED die and emits light having a wavelength different from that of the LED die. For example, a white LED light source device used for general illumination includes: YAG phosphors are used for blue LED dies, and R, G, B (red, green, blue) phosphors are used for ultraviolet LED dies.

  Conventionally, polymethyl methacrylate (PMMA), polycarbonate, optical nylon, epoxy resin, cyclic olefin copolymer, and the like have been used as a sealing material and a lens material for such an LED light source device. However, there is a problem that light transmission characteristics are likely to deteriorate with time. For example, epoxy resins that are widely used among these are severely deteriorated by heat and ultraviolet rays, and brown or yellow is obtained by a heating test at 150 ° C. for 700 hours. Discolored. When such discoloration occurs, light with a stable color tone cannot be obtained. Therefore, a translucent material that has excellent heat resistance and UV resistance in place of epoxy resin, etc., and excellent light transmission over time is desired. It was rare. The LED die increases proportionally as the current is supplied, but the amount of heat generated increases proportionally. On the other hand, the amount of heat generation increases significantly. In order to obtain it, it was important that the materials used for the sealing material and the lens material were excellent in heat resistance and ultraviolet resistance.

Accordingly, various techniques have been proposed in response to such demands. For example, Patent Document 1 proposes forming an ultraviolet absorbing layer along the outer peripheral surface of a cap member covering a blue LED chip. Yes.
Japanese Patent Laid-Open No. 9-27642

  However, in the case of the LED light source device, if the ultraviolet light emitted from the device leaks to the outside, there is a possibility that peripheral members when the LED light source device is attached may deteriorate, or the ultraviolet light emitted from the device may cause the ultraviolet light on the lens. Although there is a problem that the influence of heat is likely to occur, in the conventional technology, there was a technique that considered reducing the influence of heat and ultraviolet rays on the lens due to external ultraviolet rays, but such problems are considered Was not. Particularly in the case of an ultraviolet LED light source device, the amount of ultraviolet light emitted from the device increases.

  The present invention has been made in view of the above circumstances, and it is possible to prevent an ultraviolet light emitted from an LED light source device, particularly an ultraviolet LED light source device, from leaking to the outside of the device, prevent deterioration of peripheral members, and an LED. LED lens that can reduce the influence of heat and ultraviolet rays on the lens caused by the ultraviolet light coming out of the light source device, especially the ultraviolet LED light source device, and by using this LED lens, it is excellent in heat resistance and ultraviolet resistance and stable. An object of the present invention is to provide an LED light source device that can emit light with the above-described color tone and can reduce the influence on peripheral members.

  As a result of intensive studies to achieve the above object, the present inventor, as a material of a lens body used as a sealing material and a lens of a resin-sealed LED light source device with a lens, silicone resin, silicone rubber, fluororesin In addition to using a translucent resin excellent in heat resistance and ultraviolet resistance, etc., a base material is a translucent resin excellent in heat resistance and ultraviolet resistance, and an ultraviolet absorbing layer containing an ultraviolet absorber is formed on the lens body. By providing it on the lower surface side (LED light source device side), it is possible to prevent ultraviolet rays coming out of the LED light source device from leaking to the outside of the device, and to prevent the influence of ultraviolet rays on the peripheral members, as well as the LED light source. It is possible to reduce the influence of heat and ultraviolet rays on the lens caused by ultraviolet rays coming out of the device, and an LED lens having excellent heat resistance and ultraviolet resistance can be obtained. And it found that it becomes possible to release to the outside a stable color tone light emitted from the ED die, leading to the completion of the present invention.

  That is, the present invention is (1) a lens for LED used as a lens of an LED light source device with a lens, a lens body formed of a material having heat resistance and ultraviolet resistance, and heat resistance and ultraviolet resistance. A lens for an LED, comprising an ultraviolet absorbing layer containing an ultraviolet absorbing material, the ultraviolet absorbing layer being provided on the LED light source device side of the lens body, and (2 An LED light source device using the LED lens described in (1) above is provided.

  Here, as the LED lens, it is more preferable that the material of the lens body is a silicone resin, a silicone rubber, and / or a fluororesin having a transmittance of 80% or more in a region of 350 nm to 800 nm. . Furthermore, it is more preferable that the surface of the lens body is a grained surface or a pear ground, or the lens body contains a diffusing material.

  The ultraviolet absorbing layer of the LED lens may be formed integrally with the lens body. For example, the ultraviolet absorbing layer formed separately from the lens body may be integrated with the lens body. Thus, it is more preferable that the lens body and the ultraviolet absorbing layer that are separately molded are integrated. In this case, if the material of the lens body and the base material of the ultraviolet absorbing layer are made of a combination of a silicone resin or silicone rubber and a fluororesin, a silicone resin or silicone rubber is crosslinked and bonded to the fluororesin It is more preferable that

  Furthermore, the ultraviolet absorbing layer provided in the LED lens of the present invention may be a single layer, for example, two or more layers having different concentrations of ultraviolet absorbing material are laminated, The ultraviolet absorbing material contained in the first ultraviolet absorbing layer and the ultraviolet absorbing material contained in the second layer may have two or more ultraviolet absorbing layers so that the types and combinations thereof are different. it can.

  Furthermore, the LED lens is more suitable if it is used for a light-emitting diode light source device in which the main peak of the emission spectrum of the LED (die) is set in the range of 350 nm to 570 nm.

  The LED lens of the present invention comes out of the LED light source device even if the phosphor is dispersed in the lens body or the phosphor layer is laminated on the surface of the lens body (lens surface). The influence of heat and ultraviolet rays on the phosphor due to ultraviolet rays can be reduced.

  ADVANTAGE OF THE INVENTION According to this invention, it can prevent that the ultraviolet-ray which was not converted with the LED light source device leaks outside the LED light source device, for example, the acrylic resin and ABS resin which are used for the components of a car by the leaked ultraviolet-ray It is possible to effectively prevent the influence of ultraviolet rays on peripheral members such as deterioration of the lens, etc., so that it is particularly useful as an LED lens to be attached to an LED light source device used as an indicator for a car or an interior light, for example. At the same time, it is possible to reduce the influence of heat and ultraviolet rays on the lens due to ultraviolet rays coming out of the LED light source device, so that an LED lens having excellent heat resistance and ultraviolet resistance can be obtained, and further, heat resistance, ultraviolet resistance, etc. It is possible to obtain an LED light source device that has excellent weather resistance and stability over time and can emit light with a stable color tone.

  Hereinafter, the present invention will be described in more detail with reference to the drawings. FIG. 1 is a schematic longitudinal sectional view showing a configuration example of an LED light source device for explaining the LED lens and the LED light source device of the present invention. 1 shows a high power LED light source device. In FIG. 1, 1 is an LED lens, and 2 is an LED light source device. The LED lens 1 has both a function as a sealing material and a function as a lens of a resin-sealed LED light source device 2 with a lens. The LED lens 1 includes a lens body 11 and an ultraviolet absorption layer 12 provided on the lower surface side of the lens body 11. The lens body 11 is formed of a translucent resin material having heat resistance and ultraviolet resistance so as to have a substantially dome shape having a flat surface portion 11b that forms a flange portion 11a on the bottom surface (LED light source device 2 side). ing. The ultraviolet absorbing layer 12 is made of a translucent resin material having heat resistance and ultraviolet resistance as a base material, and the ultraviolet absorbing material is dispersed in the base material.

  The LED light source device 2 is made of a light-shielding material and includes a housing 21 having an upper surface opened. A lower peripheral edge 12a of the phosphor layer 12 of the LED lens 1 is formed on the lower side wall of the opening 21a of the housing 21. A stepped portion 21b that abuts is provided. The bottom surface of the housing 21 is formed by a heat sink 22 having a recess 22a. The tip end side 23 a of the electrode 23 is inserted into the side wall of the housing 21, and the LED die (light emitting element) 24 is placed on the upper surface of the recess 22 a of the heat sink 22. The LED die 24 is bonded to a silicon substrate installed on the upper surface of the recess 22a of the heat sink 22 with silver paste or the like. The surface electrode is electrically connected to the electrode 23 by the conductive wire 25 and allows a current to flow through the LED die. The heat sink 22 is made of copper or the like having high electrical conductivity, and absorbs and dissipates excess heat generated by light emission.

  The casing 21 is filled with a resin mold 26 made of a transparent elastic material such as silicone gel or silicone rubber so that no gap is formed between the lower surface of the LED lens 1 (the lower surface of the ultraviolet absorbing layer 12). Has been. The LED light source device 2 attaches the LED lens 1 by bringing the lower surface peripheral portion 12a of the ultraviolet absorbing layer 12 of the LED lens 1 into contact with the upper surface of the stepped portion 21b of the housing 21 and adhering it in a conventional manner. It is a thing. The structure of the LED lens and the LED light source device of the present invention is not limited to the configuration shown in FIG. 1. For example, the lens body of the LED lens shown in FIG. The lens body of the present invention may have a dome shape having no collar. Further, for example, the ultraviolet absorbing layer of the LED lens in FIG. 1 has a diameter larger than that of the lower surface portion (planar portion) of the lens body, and the step portion of the LED light source device is fitted to the step portion of the housing. Although it has the same size as the diameter, the ultraviolet absorption layer of the present invention can cover the opening of the housing and can be appropriately sized so long as the diameter is not smaller than the bottom surface of the lens body.

  In the LED lens, an ultraviolet absorbing layer is provided on the lower surface side (LED light source device side) of the lens body to prevent ultraviolet rays from the LED light source device from affecting the lens body or leaking out of the device. Is possible.

  Here, in the LED lens, the material of the lens body having heat resistance and ultraviolet resistance is not particularly limited as long as it is a translucent material having such characteristics. Considering that it is desirable that the material of the lens body is a transparent resin excellent in light transmittance, 80% or more, preferably 85% or more, more preferably 90% or more in the wavelength region of 350 nm to 800 nm. A silicone resin, silicone rubber and / or fluororesin having a transmittance is more preferable. More specifically, as silicone resins and silicone rubbers, for example, curing of addition reaction curable silicone resin compositions, condensation reaction curable silicone resin compositions, peroxide curable silicone resin compositions, and the like that are cured by heating or the like. More specifically, one or more selected from a methyl group, a phenyl group and a 1,1,1-trifluoropropyl group as an organic group, particularly a methyl group, a phenyl group or both Cured products such as an addition reaction curable silicone resin composition, a condensation reaction curable silicone resin composition, and a peroxide curable silicone resin composition containing an organopolysiloxane having the above are more preferable.

  As such a silicone resin composition, a commercially available product can be used. For example, as an addition reaction curable type, KJR9022, 9050, 9031,632 manufactured by Shin-Etsu Chemical Co., Ltd., XE14-907 manufactured by GE Toshiba Silicone Co., Ltd. SR7010 manufactured by Toray Dow Corning Silicone Co., Ltd. can be used. Moreover, SR-2410, SE-9140 (made by Toray Dow Corning Silicone Co., Ltd.) etc. can be used as a condensation reaction hardening type silicone resin composition.

  In the present invention, as will be described later, when cross-linking adhesion to a fluororesin, if an addition reaction curable silicone resin composition or a condensation reaction curable silicone resin composition is used as the silicone resin composition, It is preferable that the silicone resin composition contains a small amount of peroxide. The type of the peroxide is not particularly limited, and any of inorganic peroxides and organic peroxides can be used. For example, lauroyl peroxide, dibenzoyl peroxide, bis- Diacyl peroxides represented by 3,5,5-trimethylhexanoyl peroxide, dicumyl peroxide, 2,5-dimethyl-2,5-ditertiary butyl peroxyhexane, ditertiary butyl peroxide, Dialkyl peroxides typified by dibutyl cumyl peroxide, alkyl peresters typified by t-butyl peroxybenzoate, t-butyl peroxyisobutyrate, and other peroxyketals, percarbonates, etc. The organic peroxide is more preferable. These can be added singly or in combination of two or more.

  The addition reaction curable silicone resin composition or the condensation reaction curable silicone resin composition containing such a peroxide is a silicone resin composition not containing a peroxide, for example, the above-described commercially available addition reaction curing. It can be prepared by adding a peroxide to a silicone resin composition of a mold type or a silicone resin composition of a condensation reaction curing type and mixing them. In addition, the addition amount of the peroxide is preferably 0.01 to 20% by mass, more preferably 0.05 to 10% by mass, and particularly preferably 0.1 to 5% by mass with respect to the total amount of the silicone resin composition. It is preferable to add such that If the amount of peroxide added is too small, it may be difficult to obtain the desired improvement in adhesive strength. If it is too large, the silicone resin and silicone rubber portions may become brittle.

  Further, in the present invention, as described later, when cross-linking with a fluororesin, when using an addition reaction curable silicone resin composition or a condensation reaction curable silicone resin composition as the silicone resin composition, a reactive radical is used. Those containing a compound capable of generating. The type of such a compound is not particularly limited, and examples thereof include azo compounds such as azobisisobutyronitrile, persulfates such as ammonium persulfate, and persulfides. It can be added singly or in combination of two or more.

  An addition reaction curable silicone resin composition or a condensation reaction curable silicone resin composition containing such a compound is a silicone resin composition that does not contain a compound that generates a reactive radical, such as the above-mentioned commercially available products. It can be prepared by adding and mixing a compound that generates a reactive radical to the addition reaction curable silicone resin composition or condensation reaction curable silicone resin composition. In addition, the addition amount of the compound which generates a reactive radical is preferably 0.01 to 20% by mass, more preferably 0.05 to 10% by mass, and particularly preferably 0.1% with respect to the total amount of the silicone resin composition. It is preferable to add so as to be ˜5% by mass. If the amount added is too small, it may be difficult to obtain the desired improvement in adhesive strength, and if it is too large, the strength of the lens may be affected.

  Examples of the fluororesin include polytetrafluoroethylene (PTFE), polychlorotrifluoroethylene (PCTFE), ethylene-tetrafluoroethylene copolymer (ETFE), ethylene-chlorotrifluoroethylene copolymer (ECTFE), tetra Fluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA, Mexfuron), polyvinylidene fluoride (PVDF), chlorotrifluoroethylene-alkyl vinyl ether copolymer, A top, Teflon AF, etc. are mentioned, These can be used individually by 1 type or in combination of multiple.

  The manufacturing method of the lens body of the present invention is not particularly limited. For example, when molding separately from the ultraviolet absorbing layer, the material before curing is poured into a molding die or the like according to a conventional method and cured. It is manufactured by molding. Here, the lens body of the present invention may have a flat surface, but if the surface of the pear is a fine wrinkle, a wrinkled wrinkle surface, or a pear surface without any real skin, the light is It is more preferable because it can diffuse and make it difficult to see from the outside the colored portion that may occur depending on the concentration and type of the ultraviolet absorber. Here, examples of the method for processing the surface of the lens body on the surface of the lens body or processing the pear surface include methods such as sand blasting, bead blasting, and chemical etching.

  Further, even if the lens body contains a diffusing material, it is more preferable because it can diffuse light in the same manner and make it difficult to see even if a colored portion occurs. Examples of the diffusing material include titanium oxide, zinc oxide, silica, calcium carbonate, magnesium carbonate, aluminum oxide, and barium sulfate. These can be used alone or in combination of two or more. In addition, when a diffusing material is contained in the lens body, the content is not particularly limited, but usually, it is preferably 0.1 to 10% by mass, more preferably 0.8% with respect to the total amount of the lens body. 5 to 5% by mass, more preferably 1 to 3% by mass is preferable. If the content of the diffusing material is too large, the brightness may become dark, and if it is too small, the desired effect may not be obtained.

Furthermore, as described above, the phosphor may be dispersed in the lens body, or a phosphor layer in which the phosphor is dispersed in a base material made of a translucent resin material may be laminated on the lens body. The type of the phosphor is not particularly limited as long as it can convert the wavelength of the light generated by the LED die, and the type of LED die of the LED device to be used and the target color tone are not limited. The YAG phosphor, RGB phosphor (red Y ₂ O ₂ S: Eu, green ZnS: Cu, Al, blue (Ba, Mg, blue Al ₁₀ O ₁₇ : Eu), for example, can be selected as appropriate. , CaS: Eu, SrS: Eu, etc., and these can be used alone or in appropriate combination of two or more thereof. For example, YAG (yttrium, aluminum, garnet) phosphors for blue LED die (INGaN) and R, G, B (red, green, blue) for ultraviolet LED die (INGaN) ) The combination of the phosphor also, if white color tone of interest, it is preferable combination of a YAG phosphor.

  When the lens body of the present invention contains a phosphor, the content of the phosphor is not particularly limited. For example, when the phosphor layer is molded separately from the lens body, the total amount of the phosphor layer The phosphor is preferably dispersed in the base material so that the phosphor is preferably 5 to 80% by mass, more preferably 10 to 60% by mass, and still more preferably 20 to 50% by mass. If the phosphor content is too large, it may be fragile, and if it is too small, it may be difficult to obtain a desired color tone.

  As described above, the ultraviolet absorbing layer of the present invention is obtained by dispersing an ultraviolet absorbing material in a base material made of a translucent resin material, and the base material is the same as the material of the lens body. Silicone resin, silicone rubber having a transmittance of 80% or more, preferably 85% or more, more preferably 90% or more in the wavelength region of 350 nm to 800 nm exemplified as a suitable material of the lens body. In addition to the fluororesin, a translucent silicone resin such as KE951 manufactured by Shin-Etsu Chemical Co., Ltd., a silicone rubber and / or a fluororesin can be suitably used. The ultraviolet absorbing layer may be formed by dispersing an ultraviolet absorbing material in a portion which becomes the bottom surface side (LED device side) of the lens body when the lens body is molded, and the lens body is molded. At the same time, apart from the lens body, the ultraviolet absorber is dispersed in the base material made of the above-described translucent resin before curing, molded into a sheet shape or a film shape, and cut into a circular shape of a desired size, It may be laminated on the lower surface of the lens body by appropriate means. Furthermore, a dispersion liquid in which an ultraviolet absorbing material is dispersed in a base material made of the above-mentioned translucent resin before curing is applied to the bottom surface (surface on the LED device side) of the molded lens body and cured to cure the ultraviolet absorbing layer. It may be what. In these cases, as described above, the translucent material as the base material may be the same as or different from the material of the lens body, but a combination of silicone resin or silicone rubber and fluororesin. In this case, it is more preferable that the material of the lens body is silicone resin or silicone rubber, and the base material of the ultraviolet absorbing layer is a fluororesin.

  The type of the ultraviolet absorbing material contained in the ultraviolet absorbing layer of the present invention is not particularly limited. For example, ultrafine zinc oxide, titanium oxide, salicylic acid derivative, benzophenone, benzotriazole, hindered amine, etc. These UV absorbers can be used, and these can be used singly or in appropriate combination of two or more. Moreover, the near ultraviolet absorber which consists of each pigment, such as an inorganic pigment and an organic pigment mentioned later, can also be used as the ultraviolet absorber of the present invention. In addition, when a fine particle is used as the ultraviolet absorbing material, a transparent ultraviolet absorbing layer can be obtained. The content of the ultraviolet absorbing material in the ultraviolet absorbing layer of the present invention is not particularly limited. For example, when dispersed while being unevenly distributed in the lens body, the total amount of the lens body (including the ultraviolet absorbing layer). The ultraviolet absorber is preferably 0.05 to 10% by mass, more preferably 0.1 to 5% by mass, and still more preferably 0.2 to 2% by mass. For example, when the ultraviolet absorbing layer is molded separately from the lens body, the ultraviolet absorbing material is preferably 1 to 200 parts by weight, more preferably 1 to 100 parts by weight, more preferably 100 parts by weight of the base material of the ultraviolet absorbing layer. It is preferable to disperse in the upper substrate so that the amount is preferably 1 to 50 parts by mass. If the content of the ultraviolet absorbing material is too large, it may be easily brittle, and if it is too small, it may be difficult to obtain a desired ultraviolet absorbing effect.

  As long as the ultraviolet absorbing layer is formed on the LED light source device side of the lens body, the containing form, containing position, and containing method of the ultraviolet absorbing material are not particularly limited. For example, as described above, the lens It may be dispersed so as to be unevenly distributed on the LED light source device side in the body, or an ultraviolet absorber is dispersed in the translucent resin before curing and cured to form an ultraviolet absorbing sheet or film, which is used as a lens body. It may be laminated on the lower surface (LED light source device side) as an ultraviolet absorbing layer, and the bottom surface (LED light source device side) of the lens body may be coated with the ultraviolet absorbing material.

  The thickness of the UV absorbing layer may be uniform or non-uniform, but when the UV absorbing layer is molded separately from the lens body, the uniform UV absorbing layer thickness is more productive. On the other hand, when an ultraviolet absorber is unevenly distributed in the lens body, an ultraviolet absorbing layer having a non-uniform thickness is more easily obtained. The layer thickness of the ultraviolet absorbing layer of the present invention is not particularly limited. For example, when the ultraviolet absorbing layer is molded separately from the lens body, the thickness (average thickness) of the ultraviolet absorbing layer is preferably It is preferable that the thickness is 1 to 1000 μm, more preferably 10 to 500 μm, and still more preferably 10 to 400 μm. If the ultraviolet absorbing layer is too thick, the dimension may be too large, and if it is too thin, it may be liable to break during molding or the dimensional accuracy may be deteriorated.

  As described above, the UV absorbing layer of the LED lens may be integrally formed with the lens body. For example, the UV absorbing material is previously formed into a sheet or film using the translucent resin material. A UV-absorbing layer cut into a circular shape of a desired size from this molded body and bonded to a separately molded lens body and laminated, and the lens body material is cured and molded in a pre-molded UV-absorbing layer What is sometimes adhered, what is applied to the lower surface of the pre-formed lens body, such as a UV-absorbing layer that has not been cured or poured, and in this state the UV-absorbing layer is cured and adhered to the lens body, etc. When the separately molded lens body and the UV absorbing layer are integrated, the concentration of the UV absorbing material in the UV absorbing layer and the thickness of the UV absorbing layer can be easily adjusted. In, it is more preferable.

  In this case, if the material of the lens body and the base material of the ultraviolet absorbing layer are made of a combination of the silicone resin, silicone rubber and the fluororesin, in particular, since heat resistance and ultraviolet resistance are excellent, Although more effective, in this case, for example, if an attempt is made to integrate with an adhesive, an adhesive that does not impair the object of the present invention must be selected, and the selection may be difficult. In addition, sufficient adhesion strength may not be obtained by heat bonding. In contrast, if the fluororesin is made by cross-linking silicone resin and silicone rubber, the lens body and the ultraviolet absorbing layer can be integrated with sufficient adhesive force without using an adhesive. Therefore, it is more preferable.

  More specifically, for example, when the base material of the ultraviolet absorbing layer is a fluororesin and the material of the lens body is a silicone resin, the ultraviolet absorbing layer (fluororesin) previously formed into a circular sheet (film) Surface treatment is applied to the adhesive surface. On the other hand, an uncured silicone resin composition molded as a lens body is poured into a predetermined molding die or the like, and laminated so that the surface treatment surface of the UV absorbing layer becomes an adhesive surface on the upper surface (lower surface as a lens body) Then, the silicone resin composition is cross-linked and bonded, and the cured and molded lens body is bonded to the ultraviolet absorbing layer based on the fluororesin. On the other hand, for example, when the base material of the ultraviolet absorbing layer is made of silicone resin or silicone rubber, and the lens body is made of fluororesin, the lower surface of the lens body previously molded with fluororesin is surface-treated. Then, an ultraviolet absorbing layer before curing is laminated on this surface, the silicone resin composition is crosslinked and bonded, and the ultraviolet absorbing layer as a cured and molded product is bonded to a lens body made of a fluororesin. Hereinafter, a method for crosslinking and adhering a silicone resin and silicone rubber to the fluororesin will be described in more detail.

  The surface treatment is not particularly limited as long as it is a treatment method that enables the above-mentioned cross-linking adhesion. For example, discharge treatment such as UV treatment, plasma discharge treatment or corona discharge treatment, wet-type sodium metal, etc. / Naphthalene liquid treatment. These treatments can be performed by known methods. For example, by using Tetra H (trade name, manufactured by Junko Co., Ltd.) as the metal sodium / naphthalene solution, the adhesive surface can be treated according to the usual method, whereby the metal sodium / naphthalene solution treatment can be performed on the adhesive surface. .

  A primer treatment is also suitable as the surface treatment. Primer treatment can be performed according to a conventional method. When the primer treatment is performed, the surface of the fluororesin that has not been surface-treated can be treated, but the surface of the fluororesin that has been previously subjected to plasma discharge treatment, corona discharge treatment, metal sodium / naphthalene liquid treatment, etc. is further primed Processing is more effective. More specifically, for example, a silicone primer (FES-1 manufactured by Shin-Etsu Chemical Co., Ltd.) is applied to the surface of a fluororesin such as ETFE that has been subjected to corona discharge treatment, metal sodium / naphthalene liquid treatment, etc. as described above. It is more effective to apply a thin film with a brush or the like, then dry in a thermostatic bath at room temperature or about 50 ° C., and then cross-link and bond with the silicone resin composition.

  A silicone resin composition is laminated on a fluororesin whose surface has been subjected to surface treatment as described above, and is crosslinked and bonded. For example, an uncured silicone resin composition is applied to a surface-treated fluororesin. By making it adhere and heat-curing, the cured silicone resin adheres to the fluororesin during the curing process, and an LED lens in which the fluororesin, the silicone resin, and the silicone rubber are integrated is manufactured.

  As a method of cross-linking and adhering the silicone resin composition to the fluororesin, for example, if the material of the lens body is a silicone resin or silicone rubber and the base material of the ultraviolet absorbing layer is a fluororesin, the following method can be used. . That is, a silicone resin composition to which a compound generating a peroxide or a reactive radical, a diffusing material, a phosphor or the like is added as needed is poured into a lens body mold heated to a predetermined temperature. A UV-absorbing layer having a resin as a base material and surface-treated is placed. Cross-linking adhesion is possible even if the inside of the mold is not in a reduced pressure state, but the inside of the mold is preferably 10 kPa or less, more preferably 100 Pa to 10 kPa, with a decompression pump. If the degree of vacuum is insufficient, the air present between the fluororesin and the silicone resin composition cannot be completely removed, resulting in poor adhesion. The molding pressure is preferably 3 to 50 MPa, more preferably 5 to 30 MPa. If the molding pressure is too small, the material flow may be insufficient and the surface smoothness may deteriorate.

  The temperature and time for cross-linking adhesion are arbitrarily selected depending on the type of silicone resin composition, the type of peroxide or a compound generating a reactive radical, and the cross-linking temperature is preferably 80 to 250 ° C., 100 to 200 ° C is more preferred. If the crosslinking temperature is too low, crosslinking may be insufficient and the adhesive strength may be reduced. If it is too high, scorching of silicone resin or silicone rubber may occur. The molding time (crosslinking time) is preferably 2 to 60 minutes, more preferably 5 to 60 minutes. If the molding time is too short, insufficient crosslinking and insufficient adhesion may occur. It is also preferable that the molded product is subjected to secondary crosslinking (after-curing) using a thermal oven or the like after the cross-linking adhesive molding. When a silicone resin composition containing a peroxide is used, there is no special change due to secondary crosslinking as long as 90% or more of the peroxide can be crosslinked and decomposed in the mold.

  As described above, the UV absorbing layer of the LED lens of the present invention may be one layer, but if it has two or more UV absorbing layers, one layer has a shorter wavelength. The second layer may absorb near ultraviolet light close to the visible region, and the second layer may be an inorganic pigment, an organic pigment having excellent heat resistance and ultraviolet resistance, phthalocyanine-based, azo-based, quinacridone-based, Each pigment such as isoindolinone, perylene, and anthraquinone can also be used as the near-ultraviolet absorbing layer.

  Furthermore, the LED lens is used in a light emitting diode light source device in which the main peak of the emission spectrum of the LED die is set in the range of 350 nm to 570 nm, more preferably 360 to 500 nm, and still more preferably 380 to 480 nm. Those are more preferred. More specifically, for example, lenses used for LED dies such as INGaN, ZnCdSe, AlGaN, ZnS, and ZnO.

  The manufacturing method of the LED lens of the present invention is not particularly limited. As described above, for example, if a separately molded lens body and an ultraviolet absorbing layer are integrated, a conventional method for each resin is used. The lens body molded into a predetermined shape according to the above and the ultraviolet absorbing layer can be bonded using, for example, an adhesive such as a silicone-based adhesive, or integrated by the above-described cross-linking adhesion. On the other hand, if the lens body and the ultraviolet absorbing layer are integrally formed, for example, the lens portion or the ultraviolet absorbing layer portion may be formed by two-color molding, and then the ultraviolet absorbing layer portion or the lens portion may be integrally formed.

  In the LED light source device of the present invention, the LED lens body is attached to a housing that houses the LED die, and the above-described LED die is preferably used as the type of the LED die. In the case of the present invention, it is particularly useful as a high-power LED light source device, a white LED light source device, and an LED light source device that is used, for example, as an indicator for a vehicle or an interior lamp. The method for attaching the LED lens to the housing is not particularly limited, and can be attached by appropriate means such as bonding using an appropriate adhesive.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated more concretely, this invention is not limited to the following Example.

[Example 1]
As an ultraviolet absorbing layer, 1 part by mass of ultrafine zinc oxide manufactured by Sumitomo Osaka Cement Co., Ltd. was added to 100 parts by mass of KE951 (0.7% by mass of peroxide C-8A added) manufactured by Shin-Etsu Chemical Co., Ltd. Then, an ultraviolet absorbing sheet having a thickness of 300 μm was prepared by compression molding under conditions of 170 ° C. × 10 minutes using a mold. A silicone primer (FES-1 manufactured by Shin-Etsu Chemical Co., Ltd.) was applied to one surface of the ultraviolet absorbing sheet and dried at room temperature. The lens mold is filled with a fixed amount of silicone resin KJR632 manufactured by Shin-Etsu Chemical Co., Ltd., and an ultraviolet ray absorbing sheet is placed on the mold so that no air bubbles enter, and compression molding is performed under the conditions of 170 ° C. × 30 minutes. And an ultraviolet absorbing sheet were adhered to obtain a lens with an ultraviolet absorbing layer (LED lens).

[Example 2]
A silicone resin KJR632 manufactured by Shin-Etsu Chemical Co., Ltd. was quantitatively filled into a mold, and a lens (lens body) under conditions of 170 ° C. × 30 minutes was produced. 50 parts by mass of ultrafine zinc oxide manufactured by Sumitomo Osaka Cement Co., Ltd. is added to 100 parts by mass of a base material obtained by diluting KJR632 manufactured by Shin-Etsu Chemical Co., Ltd. with toluene 1: 2 as an ultraviolet absorbing layer, and a coating material is prepared. It was prepared, the entire lens was coated by dipping, and heated at 170 ° C. for 30 minutes to obtain an ultraviolet absorbing layer having a thickness of about 10 μm, and a lens with an ultraviolet absorbing layer (LED lens) was obtained.

[Example 3]
A silicone resin KJR632 manufactured by Shin-Etsu Chemical Co., Ltd. was quantitatively filled into a mold, and a lens (lens body) was produced under the conditions of 170 ° C. × 30 minutes. As a UV absorbing layer, Lumiflon manufactured by Asahi Glass Co., Ltd. is used as a base material, 100 parts by mass of ultrafine zinc oxide manufactured by Sumitomo Osaka Cement Co., Ltd. is added to 100 parts by mass of the base material, and a coating material is prepared. The bottom surface was coated by brushing and dried to obtain an ultraviolet absorbing layer having a thickness of about 20 μm, and a lens with an ultraviolet absorbing layer (LED lens) was obtained.

[Example 4]
In Example 1, as a convex lens, a silicone resin KJR632 manufactured by Shin-Etsu Chemical Co., Ltd. was quantitatively filled into a mold subjected to sandblast No. 100 treatment, and compression molded under conditions of 170 ° C. × 30 minutes. A lens with an ultraviolet absorbing layer (LED lens) was obtained in the same manner as in Example 1 except that a convex lens (lens body) having φ10 was formed. This lens with a phosphor layer was used as a light bulb colored LED package (LED light source device) using a light bulb colored LED package.

[Example 5]
The lens with an ultraviolet absorbing layer prepared in Example 3 is covered with a 0.3 mm thick silicone rubber cap that is lightly colored with an isoindolinone pigment to obtain a lens with an ultraviolet absorbing layer with a cap (LED lens). It was.

[Example 6]
A silicone resin KJR632 manufactured by Shin-Etsu Chemical Co., Ltd. was quantitatively filled into a mold, and a lens (lens body) was produced under the conditions of 170 ° C. × 30 minutes. Using a silicone-based adhesive (KE1825 manufactured by Shin-Etsu Chemical Co., Ltd.), a silicone rubber color sheet having a thickness of 0.3 mm, which is lightly colored with a bismuth vanadate pigment as a near-ultraviolet absorbing layer, is adhered to the lens bottom surface, Furthermore, using the coating material used in Example 3 as the ultraviolet absorbing layer, an ultraviolet absorbing layer having a thickness of about 20 μm was formed to obtain a lens with two ultraviolet absorbing layers (LED lens).

  According to the lens for LED of the said Example, all can prevent effectively that the ultraviolet-ray from an LED light source device leaks out of the LED light source device.

  The use of the LED lens of the present invention is not particularly limited. For example, each color indicator such as a blue indicator, a yellow indicator, a red indicator, a stop lamp, and a display of a traffic signal, a light source for general illumination It can be suitably used as a lens for an LED light source device used as an automotive part such as a device, various displays in an automobile, an interior light, etc., and more effective when used as a lens for a high output LED light source device. Among these, it is more useful as a lens for a white LED light source device used as a white light source for general illumination, a white display for various uses, and the like. And the LED light source device of this invention can be used conveniently as various light source devices, such as a traffic signal apparatus, a display, the object for general illumination, and components for motor vehicles.

It is a schematic sectional drawing of the LED light source device apparatus explaining the example of 1 structure of this invention. It is a schematic sectional drawing of the conventional LED light source device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1 'LED lens 2, 2' LED light source device 11 Lens body 12 Ultraviolet absorption layer 24 LED die (light emitting element)

Claims (9)

A lens for a light-emitting diode used as a lens of a light-emitting diode light source device with a lens, comprising a lens body formed of a material having heat resistance and ultraviolet resistance, and a material having heat resistance and ultraviolet resistance as a base material And a UV absorbing layer containing an UV absorbing material, wherein the UV absorbing layer is provided on the LED light source device side of the lens body. The lens for a light emitting diode according to claim 1, wherein the material of the lens body is a silicone resin, silicone rubber and / or fluororesin having a transmittance of 80% or more in a region of 350 nm to 800 nm. The lens for a light emitting diode according to claim 1 or 2, wherein the surface of the lens body is a textured surface or a pear ground. The light emitting diode lens according to claim 1, wherein the lens body contains a diffusing material. The light emitting diode lens according to any one of claims 1 to 4, wherein the lens body and the ultraviolet absorbing layer that are separately molded are integrated. 6. The light-emitting diode device according to claim 5, wherein the material of the lens body and the base material of the ultraviolet absorbing layer are made of a combination of a silicone resin or a silicone rubber and a fluororesin, and the silicone resin or the silicone rubber is crosslinked and bonded to the fluororesin. lens. The lens for light emitting diodes of any one of Claims 1 thru | or 6 which has the said ultraviolet absorption layer of two or more layers. The lens for light emitting diodes of any one of Claims 1 thru | or 7 used for the light emitting diode light source device by which the main peak of the emission spectrum of a light emitting diode was set in the range of 350 nm-570 nm. A light-emitting diode light source device using the light-emitting diode lens according to claim 1.

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