JP2006222501A - Imaging unit, imaging device and process for manufacturing imaging unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the matter of the method for packaging an imaging element mounting an optical element such as an optical low-pass filter or an infrared cut filter where an optical filter is held by a holding frame and a fixing member mounting the imaging element is screwed while keeping positional relationship with the imaging element that reduction in size is difficult because a space for screwing is required and the cost is increased because the number of components is increased. <P>SOLUTION: Since an optical element such as an optical low-pass filter or an infrared cut filter is dropped into a holding frame and an imaging element is pushed into the arm part of the holding frame by utilizing resiliency thereof (so-called "snapping") and secured in place, space, components and man-hour for screw stop are eliminated resulting in an imaging unit which can be assembled easily and surely and suitable for reducing in size and cost. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an imaging unit, an imaging apparatus, and a method for manufacturing an imaging unit. In particular, the present invention relates to an imaging unit having a simple and reliable positioning structure with an optical element, an imaging apparatus, and a method for manufacturing the imaging unit.

  In recent years, imaging devices such as digital cameras and video cameras have been reduced in size and price. In addition, an imaging unit is mounted on a mobile phone or the like, and further downsizing and cost reduction have been demanded in this field.

  On the other hand, since a high-quality image is required even in a small and low-priced image pickup apparatus, it is necessary to mount not only the image pickup element but also an optical element such as an optical low-pass filter and an infrared cut filter in the image pickup unit. Must be positioned and mounted efficiently.

Therefore, a method has been proposed in which the optical filter is held by a holding frame and the mounting member on which the image sensor is mounted is screwed while maintaining the positional relationship with the image sensor (see, for example, Patent Document 1).
JP-A-5-292380

  However, the method proposed in Patent Document 1 requires a space for screwing and is not suitable for downsizing, and the number of parts increases, and thus costs are increased.

  The present invention has been made in view of the above circumstances, and provides an imaging unit that can be simply and reliably positioned by directly stopping an imaging element and an optical element, and is suitable for downsizing and cost reduction. With the goal.

  The object of the present invention can be achieved by the following constitution.

(Claim 1)
An image sensor for imaging a subject;
An imaging optical system that forms a subject image on an imaging surface of the imaging element;
An optical element that performs optical processing on a subject image formed by the imaging optical system;
In an imaging unit having the imaging element and a holding frame that holds the optical element,
The holding frame has an optical element storage portion that stores the optical element, and a pair of opposing arm portions that are elastically deformable and have engaging claws at the tip,
An imaging unit, wherein each of the engaging claws of the pair of arm portions is engaged with a package of the imaging device to hold the imaging device.

(Claim 2)
The imaging element has terminals for electrical connection with an external circuit on two surfaces facing each other among four side surfaces perpendicular to the imaging surface,
2. The engagement claw of the pair of arm portions engages on the other two side surfaces facing each other among the four side surfaces perpendicular to the imaging surface of the imaging element. Imaging unit.

(Claim 3)
The imaging element has a heat sink that contacts the back surface of the imaging surface,
The imaging unit according to claim 1, wherein the heat radiating plate is provided with a cutout portion that avoids the pair of arm portions.

(Claim 4)
The imaging unit according to claim 3, wherein the engaging claws of the pair of arm portions are engaged with the heat radiating plate to hold the optical element, the imaging element, and the heat radiating plate.

(Claim 5)
A circuit board disposed near the back surface of the imaging surface of the imaging device;
The image sensor is electrically connected to the circuit board,
The imaging unit according to claim 1, wherein the circuit board is provided with a hole that avoids the pair of arm portions.

(Claim 6)
The imaging unit according to claim 1, wherein the holding frame has a contact portion with the imaging element for positioning the imaging element.

(Claim 7)
The imaging unit according to any one of claims 1 to 6, further comprising an elastic material between at least one of the holding frame and the optical element and between the optical element and the imaging element.

(Claim 8)
An imaging apparatus comprising the imaging unit according to claim 1.

(Claim 9)
An image sensor for imaging a subject;
An imaging optical system that forms a subject image on an imaging surface of the imaging element;
An optical element that performs optical processing on a subject image formed by the imaging optical system;
In a manufacturing method of an imaging unit having the imaging element and a holding frame that holds the optical element,
The holding frame has an optical element storage portion that stores the optical element, and a pair of opposing arm portions that are elastically deformable and have engaging claws at the tip,
A storing step of storing the optical element in the optical element storing unit;
A method of manufacturing an imaging unit, comprising: a fixing step of engaging and engaging the engaging claws of the pair of arm portions with a package of the imaging device to hold and fix the imaging device.

  According to the first aspect of the present invention, the imaging element and the optical element are integrally engaged and held via the arm portion of the holding frame, so that simple and reliable positioning is possible, and the size and cost are reduced. It is possible to provide an imaging unit suitable for the conversion.

  According to the second aspect of the present invention, it is possible to engage without interfering with the terminal by engaging with the side without the terminal of the image sensor, and simple and reliable positioning is possible. An imaging unit suitable for downsizing and cost reduction can be provided.

  According to the invention of claim 3, by making a hole in the heat sink of the image sensor, it is possible to engage without interfering with the arm portion of the holding frame, and simple and reliable positioning is possible. An imaging unit suitable for downsizing and cost reduction can be provided.

  According to the fourth aspect of the present invention, the imaging element, the optical element, and the heat radiating plate are integrally engaged and held via the arm portion of the holding frame, so that simple and reliable positioning is possible, and the size is reduced. An imaging unit suitable for lowering the price can be provided.

  According to the invention described in claim 5, by making a hole in the circuit board of the image sensor, it is possible to engage without interfering with the arm portion of the holding frame, and simple and reliable positioning is possible. An imaging unit suitable for downsizing and cost reduction can be provided.

  According to the sixth aspect of the present invention, it is possible to perform simple and reliable positioning by bringing the imaging element into contact with the holding frame, and it is possible to provide an imaging unit suitable for downsizing and cost reduction.

  According to the invention described in claim 7, by inserting an elastic material between at least one or both between the holding frame and the optical element and between the optical element and the imaging element, it is possible to suppress backlash due to component errors, Simple and reliable positioning is possible, and an imaging unit suitable for downsizing and cost reduction can be provided.

  According to the invention described in claim 8, by mounting the imaging unit described in any one of claims 1 to 7, it is possible to provide a small and low-priced imaging apparatus.

  According to the ninth aspect of the invention, the optical element is housed in the optical element housing portion of the holding frame, and the image pickup device is integrally engaged and held via the arm portion of the holding frame. It is possible to provide an imaging unit that can be positioned and held, is small, is inexpensive, and is easy to disassemble.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1A and 1B are schematic views showing a first embodiment of an imaging unit 100 according to the present invention, FIG. 1A is an exploded perspective view, FIG. 1B is a horizontal sectional view along an optical axis 200, FIG. 1C is a partially enlarged view of the holding frame 101, the arm portion 101a, and the engaging claw 101b of the portion (A) of FIG. 1B, and FIG. 1D is a portion (A) of FIG. FIG. 10 is a partially enlarged view showing another embodiment of the engagement state of the arm portion 101a, the engagement claw 101b, and the package 103b.

  The optical element holding unit 101c of the holding frame 101 having the opening 101e is made of an optical low-pass filter, an infrared cut filter, or the like, and an optical element 102 for performing optical processing on the subject image is brought into contact therewith, so that the holding frame 101 is imaged. The image sensor 103 is brought into contact with the element holding unit 101d, and is held on the back surface of the imaging surface of the two sides 103e without the terminal 103c of the package 103b of the image sensor 103 using the elasticity of the arm portion 101a of the holding frame 101. The imaging unit 100 is configured by hooking and engaging the engaging claws 101b of the arm portions 101a provided on the frame 101 and sandwiching the two sides 103e of the package 103b. Thereby, the image sensor 103 can be positioned easily.

  The holding frame 101 is made of, for example, a plastic such as polycarbonate reinforced with glass fiber. The holding frame 101 is manufactured by an injection molding method or the like in which a resin material is injected into a mold and then cooled. The provided engaging claws 101b are engaged and held on the back surface of the imaging surface of the package 103b of the image sensor 103, and the side surfaces of the package 103b are held by the arm portions 101a.

  The arm portion 101a is deformed so that the tip is spread outward when the package 103b of the image sensor 103 is inserted into the arm portion 101a, returns to its original state after insertion, and elastic enough to hold the side surface of the package 103b. Is granted.

As shown in FIG. 1 (c), the material and thickness d1 of the holding frame 101, the width d2 and thickness d3 of the arm portion 101a, and the nail engagement d4 of the engaging claw 101b are:
(1) When the package 103b of the image sensor 103 is inserted into the arm portion 101a, the arm portion 101a needs to be deformed corresponding to the engagement allowance d4 of the engaging claw 101b, but the stress generated by this deformation Therefore, the holding frame 101 should not be cracked or broken.
(2) In addition, the arm portion 101a must have sufficient force to sandwich the side surface of the package 103b after the package 103b of the image sensor 103 is inserted into the arm portion 101a.
These two conditions are set to be satisfied.

  Further, as shown in FIG. 1C, by chamfering the tip 101b-1 on the side where the package 103b of the engagement claw 101b is inserted, the insertion of the package 103b is facilitated.

  Further, as shown in FIG. 1 (d), the engagement claw 101b and the package 103b are brought into contact with each other by chamfering the tip 101b-2 on the contact side after the package 103b of the engagement claw 101b is inserted. Thus, the package 103b can be inserted more easily, and the package 103b can be held by the elasticity of the arm portion 101a.

  Taking the above conditions into consideration, the holding frame 101 can be made the best by balancing the shape dimensions and materials of the holding frame 101, the arm portion 101a, the engaging claw 101b, and the like.

  The holding frame 101 is desirably matte black at least in the vicinity of the opening 101e in order to minimize the influence of optical flare and the like.

  In actual assembly, the optical element 102 is dropped into the holding frame 101, and the image sensor 103 is pushed into the arm 101a by using the elasticity of the arm 101a (so-called “patching”), which is a special tool. Is unnecessary and the work time is completed in an instant.

  By adopting this configuration, the space, parts, work man-hours, etc. for screwing shown in the above-mentioned Patent Document 1 and the like are no longer necessary, and it is easily and reliably assembled, suitable for downsizing and cost reduction. An imaging unit can be provided. In addition, since no screws or adhesives are used, the image pickup unit 100 can be easily disassembled by removing the engaging claw 101b using the elasticity of the arm portion 101a. The dust on the surface of the protective glass 103d can be easily removed, and when the image pickup unit is discarded in the future, separation and disposal can be easily performed, so that an image pickup unit considering the environment can be provided.

  FIG. 2 is an exploded perspective schematic view showing a second embodiment of the imaging unit 100 according to the present invention. In the figure, the same parts as those in FIG.

  The lens barrel 104 is provided with an arm part 101a, an engaging claw 101b, an optical element holding part 101c, an imaging element holding part 101d, and an opening 101e. As in FIG. 1, an optical low-pass filter is provided in the optical element holding part 101c. The optical element 102 made of an infrared cut filter or the like is brought into contact, the image pickup element 103 is brought into contact with the image pickup element holding portion 101d, and the arm 103 is placed on the opposite two surfaces 103e of the package 103b of the image pickup element 103 without the terminal 103c. The imaging unit 100 is configured by hooking and engaging the engaging claws 101b of the portion 101a.

  In actual assembly, as in FIG. 1, this is fixed by dropping the optical element 102 into the lens barrel 104 and pushing the image sensor 103 into the arm 101a using the elasticity of the arm 101a. No tools are required and work time is completed in an instant.

  According to the present embodiment, by directly constructing the portion corresponding to the holding frame 101 of FIG. 1 in the lens barrel 104, the holding frame 101 can also be omitted, so that it can be easily and reliably assembled, downsized, An imaging unit suitable for cost reduction can be provided, and optical axis alignment with a photographing lens is easy.

  FIGS. 3A and 3B are schematic views showing a third embodiment of the imaging unit 100 according to the present invention, FIG. 3A is an exploded perspective view, and FIG. 3B is a horizontal sectional view along the optical axis 200. is there. In the figure, the same parts as those in FIGS.

  The optical element 102 is brought into contact with the optical element holding portion 101c of the holding frame 101 via an elastic material 106 made of rubber or soft plastic, and the imaging element 103 is brought into contact with the imaging element holding portion 101d of the holding frame 101. . When the image pickup element 103 is brought into contact with the image pickup element holding portion 101d, the image pickup element 103 is brought into contact with the upper end or lower end contact portion 101g of the image pickup element holding portion 101d so as to contact the image pickup element holding portion 101d. Positioning in the vertical direction can be easily performed.

  A heat radiating plate 105 for radiating heat generated by the image sensor chip 103a is in contact with the back surface of the image pickup surface of the package 103b of the image sensor 103. The heat radiating plate 105 is provided with a terminal opening 105a to avoid interference with the terminal 103c.

  The heat radiating plate 105 is also provided with a notch 105 b at a portion that interferes with the arm portion 101 a of the holding frame 101. And using the elasticity of the arm portion 101a of the holding frame 101, the engagement claw 101b of the arm portion 101a is hooked on the back surface 105c of the surface of the heat radiating plate 105 in contact with the image sensor 103, and the package 103b. The imaging unit 100 is configured by sandwiching the two sides 103e. Thereby, the image sensor 103 can be easily positioned in the left-right direction.

  The elastic object 106 is pushed by the optical element 102, the imaging element 103, and the heat radiating plate 105 and elastically deformed by the optical element holding unit 101 c, and the backlash generated due to each component error of the holding frame 101, the optical element 102, and the imaging element 103. It functions as a “backlash gathering member”. As a result, an imaging unit without backlash can be assembled easily and reliably, and an imaging unit suitable for downsizing and cost reduction can be provided.

  The elastic object 106 is not limited to be placed between the holding frame 101 and the optical element 102, but may be placed between the optical element 102 and the imaging element 103, or both.

  Further, the end surface 101f of the opening 101e of the holding frame 101 is tapered toward the image pickup element as illustrated in FIG. 3B, and light rays incident near parallel to the optical axis 200 are reflected by the end surface 101f. Thus, it is configured to prevent the light from entering the image sensor 103 as a flare.

  Furthermore, the holding frame 101 is configured to surround the optical element 102 and the imaging element 103 with the optical element holding part 101c and the imaging element holding part 101d. It is designed to prevent the entry of garbage.

  4A and 4B are schematic views showing a fourth embodiment of the imaging unit 100 according to the present invention. FIG. 4A is an exploded perspective view, and FIG. 4B is a horizontal sectional view along the optical axis 200. is there. In the figure, the same parts as those in FIGS.

  In FIG. 4, in addition to FIG. 3, a circuit board 107 on which a circuit (not shown) for driving the image sensor is mounted is disposed on the back surface of the heat radiating plate 105. The circuit board 107 is provided with a terminal hole 107a for inserting the terminal 103c of the image sensor 103 and electrically connecting it with solder or the like. In addition, as shown in FIG. 3, when the engagement claw 101 b of the arm portion 101 a is hooked on the back surface 105 c of the surface of the heat radiating plate 105 in contact with the image sensor 103, the circuit board 107, the arm portion 101 a, and the engagement claw 101 b The engaging claw escape hole 107b is provided at the part where the interference occurs, and the elastic body 106, the optical element 102, the image sensor 103, and the heat radiating plate 105 are fitted into the holding frame 101 in this order, and the arm portion 101a of the holding frame 101 is inserted. The hook 103b of the arm 101a is hooked and held on the back surface 105c of the surface of the heat radiating plate 105 in contact with the image sensor 103, and the two sides 103e of the package 103b are sandwiched between the terminals 103c. The imaging unit 100 can be configured with a simple structure by being inserted into the terminal hole 107a of the circuit board 107 and electrically connected by solder or the like. That.

  FIG. 5 is a schematic vertical cross-sectional view of the digital camera 1 that functions as an imaging apparatus according to the present invention. In the figure, the same parts as those in FIGS.

  The digital camera 1 includes a body 10 and a lens barrel 104, and a lens 201 that forms a subject image on an image sensor is disposed in the lens barrel 104.

  The imaging unit 100 is disposed on the optical axis of the lens 201 in the body. In this example, the imaging unit 100 shown in FIG. 4 is used. As described above, the imaging unit 100 sequentially inserts each component into the holding frame 101 and uses the elasticity of the arm portion 101a of the holding frame 101 to engage the arm portion 101a with the back surface 105c of the heat radiating plate 105. It has a very simple, reliable, small size and low price structure that catches and holds the claw 101b. By using this for the digital camera 1 that functions as an imaging device, a small and low-priced camera can be provided.

  Although the imaging unit, the configuration of the imaging apparatus, and the manufacturing method of the imaging unit according to the present invention have been described above, the detailed configuration of each configuration related to the imaging unit, the configuration of the imaging apparatus, and the manufacturing method of the imaging unit according to the present invention, and The detailed operation can be changed as appropriate without departing from the spirit of the present invention.

It is a mimetic diagram showing a 1st embodiment of an image pick-up unit concerning the present invention. It is a disassembled perspective schematic diagram which shows 2nd Embodiment of the imaging unit which concerns on this invention. It is a schematic diagram which shows 3rd Embodiment of the imaging unit which concerns on this invention. It is a schematic diagram which shows 4th Embodiment of the imaging unit which concerns on this invention. It is a longitudinal cross-sectional schematic diagram of the digital camera which functions as an imaging device which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Digital camera 10 Body 100 Imaging unit 101 Holding frame 101a Arm part 101b Engagement claw 101c Optical element holding | maintenance part 101d Imaging element holding | maintenance part 101e Opening part 101f End surface 101g Contact part 102 Optical element 103 Imaging element 103a Imaging element chip 103b Package 103c Terminal 103d Protective glass 104 Lens barrel 105 Heat sink 105a Terminal opening 105b Notch 105c Back surface 106 Elastic object 107 Circuit board 107a Terminal hole 107b Engagement claw relief hole 200 Optical axis 201 Lens

Claims (9)

An image sensor for imaging a subject;
An imaging optical system that forms a subject image on an imaging surface of the imaging element;
An optical element that performs optical processing on a subject image formed by the imaging optical system;
In an imaging unit having the imaging element and a holding frame that holds the optical element,
The holding frame has an optical element storage portion that stores the optical element, and a pair of opposing arm portions that are elastically deformable and have engaging claws at the tip,
An imaging unit, wherein each of the engaging claws of the pair of arm portions is engaged with a package of the imaging device to hold the imaging device. The imaging element has terminals for electrical connection with an external circuit on two surfaces facing each other among four side surfaces perpendicular to the imaging surface,
2. The engagement claw of the pair of arm portions engages on the other two side surfaces facing each other among the four side surfaces perpendicular to the imaging surface of the imaging element. Imaging unit. The imaging element has a heat sink that contacts the back surface of the imaging surface,
The imaging unit according to claim 1, wherein the heat radiating plate is provided with a cutout portion that avoids the pair of arm portions. The imaging unit according to claim 3, wherein the engaging claws of the pair of arm portions are engaged with the heat radiating plate to hold the optical element, the imaging element, and the heat radiating plate. A circuit board disposed near the back surface of the imaging surface of the imaging device;
The image sensor is electrically connected to the circuit board,
The imaging unit according to claim 1, wherein the circuit board is provided with a hole that avoids the pair of arm portions. The imaging unit according to claim 1, wherein the holding frame has a contact portion with the imaging element for positioning the imaging element. The imaging unit according to any one of claims 1 to 6, further comprising an elastic material between at least one of the holding frame and the optical element and between the optical element and the imaging element. An imaging apparatus comprising the imaging unit according to claim 1. An image sensor for imaging a subject;
An imaging optical system that forms a subject image on an imaging surface of the imaging element;
An optical element that performs optical processing on a subject image formed by the imaging optical system;
In a manufacturing method of an imaging unit having the imaging element and a holding frame that holds the optical element,
The holding frame has an optical element storage portion that stores the optical element, and a pair of opposing arm portions that are elastically deformable and have engaging claws at the tip,
A storing step of storing the optical element in the optical element storing unit;
A method of manufacturing an imaging unit, comprising: a fixing step of engaging and engaging the engaging claws of the pair of arm portions with a package of the imaging device to hold and fix the imaging device.

Images