JP2006179352A - Manufacturing method of spontaneous light emitting panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simplify a process by the use of a solid sealing material and prevent generation of foam between the sealing material and a sealing base material. <P>SOLUTION: The manufacturing method includes a first sticking process of sticking a support substrate 104 supporting a spontaneous light emitting element 103 equipped with a light-emitting layer pinched between a pair of electrodes opposed to each other and a sheet-shaped sealing material 106 so as to seal the light-emitting element, a second sticking process of sticking the support substrate 104 stuck with the sealing material 106 to the sealing base material 105 in a decompressed state through the sealing material 106, and an integrating process of integrating the support substrate 104 and the sealing base material 105 stuck together through the sealing material. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a self-luminous panel.

  Conventionally, a self-luminous element comprising a pair of opposed electrodes and a light-emitting layer sandwiched between the electrodes, a support substrate that supports the self-light-emitting element, and a sealing substrate that faces the support substrate via the light-emitting layer And sealing the self-luminous element provided between the support substrate and the sealing substrate and bonding the support substrate and the sealing substrate in a state of being filled between the support substrate and the sealing substrate. And a self-luminous panel.

  As sealing of such a self-light-emitting panel, for example, there is a sealing method in which a self-light-emitting element is sealed using a sheet (film) -like sealing material. In this sealing method, a sheet-like sealing material is bonded to a support substrate so as to seal the self-light emitting element, and then the support substrate to which the sealing material is bonded and the sealing base material are bonded together. And integrate. Note that the sealing base material to which the sealing material is bonded may be bonded to the support substrate.

  When a sealing method (for example, refer to Patent Document 1) in which a light emitting layer is sealed with a liquid resin by using a sheet (film) -like sealing material for sealing a self-luminous element. As a result, the process can be simplified. In the sealing method using this sheet (film) -like sealing material, for example, the sealing material formed by thermosetting resin is used to heat the sealing material, thereby sealing the self-luminous element. The base material is integrated with the sealing material.

JP 2002-216950 A

  However, when sealing a self-luminous element using a sheet (film) -shaped sealing material, the sealing material is a solid that maintains a certain shape such as a sheet shape or a film shape. As an example, there is a problem in that bubbles are formed between the bonded sealing material and the support substrate when there are irregularities on the bonded surface.

  Further, when heating is performed to cure the sealing material at the time of integration, the solvent, water, or reaction product gas mixed in the material forming the sealing material is vaporized, and the sealing material and the support substrate or the self-luminous element An example of the problem is that bubbles are generated between the two. Similarly, when the sealing material is affixed to the sealing substrate, there is a problem that bubbles remain between the sealing material and the support substrate. Furthermore, the above-mentioned vaporized solvent, water, reaction product gas, and the like may be a deterioration factor of the self-luminous element.

  In addition, when such bubbles are generated between the sealing material and the self-light-emitting element, a problem that the solvent or moisture contained in the bubbles adversely affects the light-emitting layer and lowers the light-emitting performance of the self-light-emitting panel is an example. Can be mentioned. The various problems described above also occur when the sealing material is attached to the sealing substrate.

  According to a first aspect of the present invention, there is provided a self-luminous panel manufacturing method comprising: a support substrate; a self-luminous element including a pair of electrodes opposed to the support substrate; and a light-emitting layer sandwiched between the pair of electrodes; A sealing base material facing the substrate via the self-light-emitting element; and a sealing material provided between the support substrate and the sealing base material for sealing the self-light-emitting element. In the method for manufacturing a light-emitting panel, in the first bonding step, the sealing material and the support substrate are bonded to seal the self-light-emitting element, and the sealing material is used in the first bonding step. A second bonding step of bonding the supporting substrate and the sealing base material bonded together in a reduced pressure state through the sealing material, and the support bonded in the second bonding step A substrate and the sealing substrate; Characterized in that it comprises a and a integration step of integrating through.

  According to a second aspect of the present invention, there is provided a self-luminous panel manufacturing method comprising: a support substrate; a self-luminous element including a pair of electrodes opposed to the support substrate; and a light-emitting layer sandwiched between the pair of electrodes; A sealing base material facing the substrate via the self-light-emitting element; and a sealing material provided between the support substrate and the sealing base material for sealing the self-light-emitting element. In the manufacturing method of a light emitting panel, the 1st bonding process which bonds the said sealing material and the said sealing base material, and the sealing base material on which the said sealing material was bonded together in the said 1st bonding process And the support substrate are bonded together in the second bonding step, a second bonding step in which the self-luminous element is sealed through the sealing material in a reduced pressure state. A supporting substrate and the sealing substrate, the sealing material Characterized in that it comprises a and a integration step of integrating over.

  Exemplary embodiments of a method for manufacturing a self-luminous panel according to the present invention will be described below in detail with reference to the accompanying drawings.

(Embodiment)
First, the configuration of the self-luminous panel according to the embodiment of the present invention will be described. FIG. 1 is a side view showing an example of the configuration of the self-luminous panel according to the embodiment of the present invention. As shown in FIG. 1, a self-luminous panel 100 includes a self-luminous element 103 including a pair of electrodes 101 (101a and 101b) and a light-emitting layer 102, a support substrate 104, a sealing substrate 105, and a sealing material. 106.

  The self-light-emitting element 103 includes a pair of electrodes 101 facing each other and a light-emitting layer 102 sandwiched between the pair of electrodes 101. The pair of electrodes 101 and the light emitting layer 102 are provided on the support substrate 104. The pair of electrodes 101 are provided so as to face each other along the thickness direction of the support substrate 104. For this reason, the pair of electrodes 101 and the light emitting layer 102 are supported by the support substrate 104 in a state of being stacked along the thickness direction of the support substrate 104. The sealing substrate 105 is disposed to face the self-light emitting element 103 side of the support substrate 104.

  The sealing material 106 is provided between the support substrate 104 and the sealing base material 105 and seals the light emitting element 103. For example, when an organic EL element is used as the self light emitting element 103, it is necessary to seal the self light emitting element 103 from the outside air in order to protect the self light emitting element 103 from oxygen and moisture contained in the atmosphere. In this embodiment mode, the self-luminous element 103 is sealed by bonding over the entire surface using the sealing base material 105 and the sealing material 106.

  By using a solid sealing material, the process can be simplified as compared with a sealing method in which the self-light-emitting element 103 is sealed using a liquid (which is difficult to maintain the shape). The sealing material 106 of the present embodiment is formed into a sheet (film) shape.

  Next, a method for manufacturing the self-luminous panel 100 according to the embodiment of the present invention will be described. Although illustration is omitted, when the self-luminous panel 100 is manufactured, first, one electrode 101 a of the pair of electrodes 101 is formed on the support substrate 104. A light-emitting layer 102 is formed over the electrode 101 a, and the other electrode 101 b of the pair of electrodes 101 is formed over the light-emitting layer 102 to form the self-light-emitting element 103.

  FIGS. 2-1 is a side view which shows the 1st bonding process concerning embodiment of this invention. FIGS. As illustrated in FIG. 2A, a sealing material 106 is attached to the support substrate 104 on which the self light emitting element 103 is formed using a laminator or the like so as to cover the self light emitting element 103 from the upper surface of the self light emitting element 103. Match.

  FIGS. 2-2 is a side view which shows the 2nd bonding process concerning embodiment of this invention. FIGS. As shown in FIG. 2-2, in the second bonding step, the support substrate 104 and the sealing base material 105 to which the sealing material 106 is bonded in the first bonding step are replaced with the sealing material 106. Pasted together under reduced pressure. In the second bonding step, pressure is applied in a direction in which the support substrate 104 and the sealing base material 105 are in close contact with each other. In the second bonding step, the support substrate 104 and the sealing base material 105 are held so that the surfaces 201 and 202 to be bonded to each other are parallel and face each other. And the support substrate 104 and the sealing base material 105 are bonded together in the direction in which the opposing surfaces 201 and 202 approach.

FIG. 2-3 is a side view showing the integration process according to the embodiment of the present invention. As illustrated in FIG. 2C, the support substrate 104 and the sealing base material 105 that are bonded together in the second bonding step are integrated via the sealing material 106. This integration step is performed under reduced pressure. Here, the reduced pressure state is a pressure state in a range of 10 to 10 ⁻⁶ Pa including a vacuum state. Usually, a pressure state in the range of about 10 −10 ⁻² Pa is called a negative pressure state, and a pressure state in the range of about 10 ⁻² to 10 ⁻⁶ Pa is called a vacuum state. Moreover, after the specific gas component discharged | emitted from the sealing material 106 becomes below a regulation amount, it can also change from a pressure reduction state to atmospheric pressure. This integration step is performed in an inert gas set to a reduced pressure state or an atmospheric pressure, or an inert gas set to a reduced pressure state, or in an environment where they are sequentially combined. Furthermore, in the integration step, the support substrate 104 and the sealing base material 105 may be pressurized in a direction in close contact.

  As described above, according to the above manufacturing method, in the second bonding step, the support substrate 104 and the sealing base material 105 to which the sealing material 106 is bonded are placed in a vacuum via the sealing material 106. The process can be simplified by bonding together. Further, generation of bubbles between the sealing material 106 and the sealing base material 105 can be prevented. As a result, it is possible to prevent poor adhesion due to a decrease in the bonding area between the sealing material 106 and the sealing substrate 105 and a decrease in light transmission efficiency.

  Further, according to the manufacturing method described above, when the supporting substrate 104 and the sealing base material 105 are pressed in a close contact direction in the second bonding step, the supporting substrate 104 and the sealing base material 105 Can be adhered more favorably through the sealing material 106. Further, in the second bonding step, the facing surfaces 201 and 202 approach each other while holding the support substrate 104 and the sealing base material 105 so that the surfaces 201 and 202 to be bonded to each other are parallel and facing each other. When the supporting substrate 104 and the sealing base material 105 are bonded in the direction, the sealing material 106 is not distorted during the bonding. Thereby, it is possible to prevent the surface of the sealing material 106 from being uneven due to distortion of the sealing material 106, and to more reliably prevent the generation of bubbles between the sealing material 106 and the sealing base material 105. Can do.

  In particular, when manufacturing a large self-luminous panel 100, the method of bending the sealing base material 105 requires a large bonding apparatus because the sealing base material 105 is large, as described above. According to the manufacturing method in which the support substrate 104 and the sealing substrate 105 are bonded in parallel, the support substrate 104 and the sealing substrate 105 can be bonded without bending the sealing substrate 105. Such a large-scale bonding apparatus can be dispensed with.

  By the way, in the method in which the sealing substrate 105 is bent and pasted, when the self-luminous panel 100 is enlarged, the bending of the sealing substrate 105 itself may damage the sealing substrate 105. According to the above manufacturing method, since the sealing substrate 105 can be performed without being bent, the sealing material 106 and the sealing substrate 105 can be used even for a large self-luminous panel 100 such as a large TV. Generation of bubbles between the two can be prevented more reliably. Note that the method for bonding is not limited to the manufacturing method in which the support substrate 104 and the sealing substrate 105 are bonded in parallel, and a method for manufacturing the self-luminous panel 100 by bending the sealing substrate 105 is also possible. Various known techniques can be used.

  As described above, according to the method for manufacturing self-luminous panel 100 of the present embodiment, when the integration process is performed in a reduced pressure state, the heat is generated from the resin forming sealing material 106 during thermosetting. Since the specific gas component can be drawn out from between the sealing material 106 and the support substrate 104 or the sealing base material 105, air bubbles between the sealing material 106 and the support substrate 104 or the sealing base material 105 can be extracted. Occurrence can be prevented more reliably.

  Further, in the integration process, when the specific gas component discharged from the sealing material 106 becomes equal to or less than the specified amount and then the pressure is changed from the reduced pressure state to the atmospheric pressure, the heat to the sealing material 106 is improved. Be able to communicate. That is, in the reduced pressure state, the heat source must be brought into direct contact with the support substrate 104 and the sealing base material 105, but the gas (air or inert gas) around the self-luminous panel 100 is heated by setting the atmospheric pressure. Thus, the sealing material 106 can be heated, and the heating can be performed efficiently. Furthermore, excessive consumption of energy for heating can be prevented, and an increase in manufacturing cost can be suppressed.

  By the way, in this Embodiment, although said integration process was performed in the pressure-reduced state, it does not restrict to this. For example, in the case where the integration process is performed in an inert gas set to atmospheric pressure, oxygen or water enters before the self-light-emitting element 103 is completely sealed, and the light-emitting performance of the self-light-emitting element 103 Can be prevented. Further, in the present embodiment, the integration process is performed in a reduced pressure state, but is not limited to this, for example, when the integration process is performed in an inert gas set in a negative pressure state In particular, the specific gas component generated from the resin forming the sealing material 106 at the time of thermosetting can be drawn out from between the sealing material 106 and the support substrate 104 or the sealing base material 105. Generation of bubbles between the material 106 and the support substrate 104 or the sealing substrate 105 can be prevented more reliably.

  Note that the present invention is not limited to the step of bonding the support base material 105 after the sheet-like sealing material 106 is bonded to the support substrate 104 as described above. First, the sheet-like sealing material 106 may be bonded to the sealing substrate 105. That is, the first bonding step in which the sheet-like sealing material 106 is bonded to the sealing substrate 105, the sealing substrate 105 in which the sealing material 106 is bonded, and the support substrate 104 are used as the sealing material. A second bonding step of bonding in a reduced pressure state through 106, and an integration step of integrating the bonded support substrate 104 and sealing base material 105 through the sealing material 106. The self-luminous panel 100 may be manufactured by a manufacturing method that is characterized.

  Thus, in the first bonding step, a sheet-like sealing material is bonded to the sealing substrate, and in the second bonding step, the sealing substrate and the support substrate are decompressed via the sealing material. By bonding in a state, it is possible to prevent generation of bubbles between the sealing material 106 and the support substrate and the self-light emitting element 103 while realizing simplification of the process by using a solid sealing material. . Accordingly, it is possible to prevent adhesion failure due to a decrease in the bonding area between the sealing material 106 and the support substrate and the self-light-emitting element 103 and a decrease in light transmission efficiency.

  As described above, according to the method for manufacturing self-luminous panel 100 of the embodiment of the present invention, a solid sealing material is used by performing the second bonding step in which bubbles are easily generated in a reduced pressure state. Simplification of the process can be realized. In addition, generation of bubbles in the self-light emitting element 103 can be prevented. Further, poor adhesion of each member to the sealing material 106 and a decrease in light transmission efficiency due to the presence of bubbles can be prevented.

(Configuration of self-luminous panel)
Next, the structure of the self-luminous panel according to the embodiment of the present invention will be described. Since the external configuration of the self-light-emitting panel according to the embodiment of the present invention is the same as that of the self-light-emitting panel shown in FIG. 1 described above, the illustration is omitted here, and description will be made using the reference numerals according to FIG.

  First, the self-light-emitting element 103 included in the self-light-emitting panel 100 in this embodiment will be described. The self-light-emitting element 103 included in the self-light-emitting panel 100 according to the present embodiment has an EL (Electro Luminescence) that emits the applied electric field energy in the form of light when, for example, electric field energy generated by applying a voltage is applied. An element etc. are mentioned. The EL element includes an inorganic EL element and an organic EL element. In this embodiment, an example in which the organic EL element is a self-luminous element 103 is shown.

  The organic EL element may be referred to as an organic EL (OEL) device, an organic light emitting diode (OLED) device, or an electroluminescent light source, but will be described as an organic EL element in this embodiment. Organic EL elements include those formed using high molecular materials and those formed using low molecular materials. Hereinafter, in this example, an example in which an organic EL element formed using a low molecular material is used as the self-luminous element 103 will be described as an example. In this embodiment, an element structure including the pair of electrodes 101 and the light emitting layer 102 between the pair of electrodes 101 is referred to as an “organic EL element”.

  In general, an organic EL element has a structure in which an organic layer is sandwiched between an anode (anode, hole injection electrode) and a cathode (cathode, electron injection electrode). Here, the organic layer includes a light emitting layer. In the organic EL element, by applying a voltage to both electrodes, holes injected / transported from the anode into the organic layer and electrons injected / transported from the cathode into the organic layer are transmitted in the organic layer (light emitting layer). ), And light generated upon this recombination is obtained. Currently, products using low molecular weight materials in the organic layer have been commercialized as full-color displays due to the progress of material development and manufacturing process development, etc. .

  The organic EL element has a structure in which a plurality of layers having various functions are stacked. The laminated structure of each layer in the organic EL element is in the order of “lower electrode (anode) / hole injection layer / hole transport layer / organic EL light emitting layer / electron transport layer / electron injection layer / upper electrode (cathode)”. A laminated structure is common. In this embodiment, the lower electrode is realized by the electrode 101a, and the upper electrode is realized by the electrode 101b.

  Each layer in the organic EL element may be formed of a single organic material, may be formed by mixing a plurality of materials (mixed layer), or organic in a polymer binder. A material in which a functional material of inorganic type or inorganic type is dispersed may be used. Examples of the functional material include a charge transport function, a light emission function, a charge blocking function, and an optical function.

  Each layer in the organic EL element is generated by a buffer function for preventing the light emitting layer 102 from being damaged when the electrode 101b is formed on the upper side of the light emitting layer 102 by sputtering, or by a film forming process of the light emitting layer 102. A layer having a planarizing function for preventing irregularities on the surface of the light emitting layer 102 to be protected, a protective layer such as an inorganic film of SiN or SiON, for example, and a plurality of layers made of these layers are included. Also good.

  In addition, the organic EL element has an electrode located above the light emitting layer 102 as an anode and an electrode located below the light emitting layer 102 as a cathode, or a light emitting layer 102 composed of a plurality of layers. A stack of a plurality of light emitting layers 102 having different emission colors (SOLED: Stacked OLED), a structure in which a charge generation layer (not shown) is interposed between a cathode and an anode (multiphoton element), a hole transport layer, etc. There are those in which the layers are omitted, those in which a plurality of layers are laminated, and those in which the element structure is composed of only one organic layer (each functional layer is formed continuously, in which the layer boundary is eliminated). In addition, this invention does not limit the structure of an organic EL element.

  Next, the sealing substrate 105 will be described. The sealing substrate 105 is disposed to face the light emitting layer 102 side of the support substrate 104. As a material for forming the sealing substrate 105, glass substrates such as soda glass, lead glass, and hard glass, plastic substrates such as polyethylene, polypropylene, polyethylene terephthalate, and polymethyl methacrylate, and metal substrates such as aluminum and stainless steel. Various materials such as can be used. As a material for forming the sealing substrate 105, a suitable material can be appropriately selected according to the configuration of the self-light-emitting element 103.

  For example, when the light-emitting element 103 is an organic EL element having a top emission structure that extracts light from the side opposite to the support substrate 104 side, or a TOLED structure that extracts light from both sides of the support substrate 104 side and the opposite side thereof. In the case of an organic EL element, it is preferable to use a highly transparent material as a material for forming the sealing substrate 105 and to have a thickness having a high transmittance as the thickness of the sealing substrate. is there. On the other hand, for example, when the self-light-emitting element 103 is an organic EL element having a bottom emission structure that extracts light from the support substrate 104 side, the sealing base material 105 is formed of a metal base material that is subjected to transparency. It may be used as a material.

  Next, the sealing material 106 will be described. The sealing material 106 is provided between the support substrate 104 and the sealing base material 105. The sealing material 106 is formed by molding a resin into a sheet (film) shape. The sealing material 106 preferably has no flatness (or less) on the surface and is excellent in flatness. By using a sealing material having excellent flatness, when the sealing material 106 is bonded to the supporting substrate 104 or the sealing substrate 105, the adhesive surface is in close contact with the supporting substrate 104 or the sealing substrate 105. In addition, bubbles can be prevented from being mixed between the support substrate 104 or the sealing base material 105 and the sealing material 106.

  The thickness of the sealing material 106 is preferably set so that the residual stress is as small as possible. For example, if a large amount of internal stress is left when the sealing material 106 is formed, a part of the stress expands or contracts with time. When such a sealing material 106 is used, the sealing material 106 exerts stress on the self-luminous element (organic EL element) 103, and each layer of the self-luminous panel 100 is changed by the change of the sealing material 106 with time. There is a concern that various problems such as collapse of the laminated state, and poor sealing due to a decrease in the adhesion of the sealing material 106 to the support substrate 104 and the sealing substrate 105 may occur. That is, such a problem can be avoided by setting the thickness of the sealing material 106 so that the residual stress becomes as small as possible. Furthermore, it is also possible to set the thickness so as to reduce as much as possible other factors that determine the thickness of the sealing material, for example, the amount of water remaining in the sealing material.

  As the resin forming the sealing material 106, for example, a radically radically polymerizable resin mainly composed of various acrylates such as polyester acrylate, polyether acrylate, epoxy acrylate, polyurethane acrylate, or a resin mainly composed of epoxy, vinyl ether, or the like. Photo-curing polymerizable resin, photo-curing resin such as thiol / ene addition type resin, polyethylene, polypropylene, polyethylene terephthalate, polymethyl methacrylate, polystyrene, polyethersulfone, polyarylate, polycarbonate, polyurethane, acrylic resin, Polyacrylonitrile, polyvinyl acetal, polyamide, polyimide, diacryl phthalate resin, cellulosic plastic, polyvinyl acetate, polyvinyl chloride, polyvinyl chloride And the like den, and thermoplastic resins such as those of two or more copolymers, such as thermosetting resins.

  The resin forming the sealing material 106 does not generate a gas that causes deterioration during the production of the self-luminous panel 100 (or generates a small amount), and is deformed / shrinked / expanded over time or at an ambient temperature. If there is almost no change, it will not be specifically limited. However, from the viewpoint of good adhesion and adhesion to the support substrate 104 and the sealing substrate 105, the resin forming the sealing material 106 is a thermosetting resin that cures when heated. Is preferred. Hereinafter, in this embodiment, a case where a sealing material 106 formed of a thermosetting resin that is cured by heating is used will be described.

(Self-luminous panel manufacturing method)
Next, an example of a method for manufacturing the self-luminous panel 100 according to the embodiment of the present invention will be described. FIG. 3A is a side view showing the self-luminous element forming step according to the embodiment of the present invention. In manufacturing the self-light-emitting panel 100, first, a self-light-emitting element forming step for forming the self-light-emitting element 103 on the support substrate 104 is performed. In the self light emitting element forming step, first, the electrode 101a is formed on the support substrate 104, and the light emitting layer 102 and the electrode 101b are sequentially stacked thereon. Since the formation of the self-light-emitting element 103 on the support substrate 104 is a known technique, the description thereof is omitted here.

  FIG. 3-2 is a side view showing the first bonding step according to the embodiment of the present invention. Next, the 1st bonding process which bonds the sheet-like sealing material 106 so that the self-light-emitting element 103 may be sealed with respect to the support substrate 104 in which the self-light-emitting element 103 was formed is performed. The surface on which the sealing material 106 is bonded to the support substrate 104 is a surface on which the self-light emitting element 103 is formed. The first bonding step is performed in any state of an inert gas set to a reduced pressure state, an atmospheric pressure, or an inert gas set to a reduced pressure state. In this embodiment, the operation is performed under reduced pressure.

  The support substrate 104 and the sealing material 106 are bonded to each other, for example, by overlapping the support substrate 104 and the sealing material 106 and from the center in the width direction with respect to the overlapped support substrate 104 and the sealing material 106. This is done by applying pressure towards the periphery. At this time, in addition to pressurization, the overlapped support substrate 104 and sealing material 106 may be heated. The first bonding step can be performed using, for example, a technique disclosed in Japanese Patent Application Laid-Open No. 2002-361742. However, bubbles and foreign substances are not formed on the contact surface between the support substrate 104 and the sealing material 106. The method is not particularly limited as long as it can prevent mixing.

  In the first bonding step, the support substrate 104 and the sealing material 106 are pressurized in a direction in which they are in close contact with each other. For example, in the first bonding step, a pair of rollers 301 facing each other is used to pass the overlapped support substrate 104 and sealing material 106 between the rollers 301, thereby supporting each of them in close contact with each other. The substrate 104 and the sealing material 106 are pressurized. In the first bonding step in this embodiment, the bonding between the support substrate 104 and the sealing material 106 is performed in an inert gas set to a reduced pressure state, an atmospheric pressure, or an inert gas set to a reduced pressure state. Perform in any state in gas.

  FIG. 3C is a side view of the second bonding step according to the embodiment of the present invention. Next, a second bonding step is performed in which the support substrate 104 to which the sealing material 106 is bonded in the first bonding step and the sealing base material 105 are bonded in a reduced pressure state. In this embodiment, the second bonding process is performed under reduced pressure. In the second bonding step, the opposing surfaces 201 and 202 approach each other while holding the support substrate 104 and the sealing base material 105 so that the surfaces 201 and 202 to be bonded to each other are parallel and facing each other. The support substrate 104 and the sealing substrate 105 are bonded together in the direction.

  The support substrate 104 and the sealing substrate 105 in the second bonding step can be bonded using, for example, a technique disclosed in Japanese Patent Application Laid-Open No. 2002-216958. The method is not particularly limited to this method as long as it is a method capable of preventing air bubbles and foreign matters from entering the contact surface between the sealing substrate 106 and the sealing substrate 105. In addition, the sealing material 106 is heated in the second bonding step. The temperature at the time of heating is not so high as to cause a thermosetting reaction to the sealing material 106, but to the extent that the support substrate 104 and the sealing base material 105 are apparently integrated by the sealing material 106. It is sufficient that the sealing material 106 is heated to a temperature at which the sealing material 106 is softened.

  FIGS. 3-4 is a side view which shows the integration process concerning the Example of this invention. FIGS. Next, an integration process is performed in which the support substrate 104 and the sealing base material 105 bonded in the second bonding process are integrated via the sealing material 106.

  Since the sealing material 106 of this embodiment is formed of a thermosetting resin, the resin forming the sealing material 106 undergoes a thermosetting reaction when the sealing material 106 is heated in the integration process. In this thermosetting reaction process, the thermosetting resin forming the sealing material 106 is cured while adhering to the support substrate 104, the self-light-emitting element 103, and the sealing base material 105. The provided support substrate 104 and the sealing base material 105 are integrated via the sealing material 106. By thus curing the sealing material 106 (in this embodiment, thermosetting), it is possible to eliminate (or reduce) the temporal change of the sealing material 106. In this embodiment, this integration step is performed under reduced pressure.

  The sealing material 106 is heated by heating the sealing material 106 through the sealing base material 105 brought into contact with a heat source such as a hot plate or by irradiating the sealing base material 105 with infrared rays. For example, the sealing material 106 is heated by heating 105, or the sealing material 106 is heated by warming the room in which the integration process is performed with a heater or the like. The heating method of the sealing material 106 is not particularly limited to the above-described heating method as long as the residual volatile components discharged from the material forming the sealing material 106 can be removed by heating and sealing reaction. However, among the methods described above, a method of contacting a heat source such as a hot plate is preferable because heat can be applied closest to the sealing material 106.

  Further, in the integration process in the present embodiment, the atmosphere is set to atmospheric pressure with an inert gas after the specific gas component discharged from the sealing material 106 becomes equal to or less than the specified amount. Here, the specific gas component forms the sealing material 106 among the gas components generated when the resin forming the sealing material 106 is subjected to a thermosetting reaction (crosslinking reaction) by heating in the integration step. It is a gas component having a specific molecular weight set according to the type of resin. The gas component generated during the thermosetting reaction of the thermosetting resin varies depending on the type of resin forming the sealing material 106, but is mainly a residual solvent or moisture used during the synthesis of the resin. . Specific examples of gas components generated during the thermosetting reaction of the resin include, for example, methyl ethyl ketone, toluene, water, decomposition products of resins and additives, and the like.

  Furthermore, in the integration step, pressure is applied in a direction in which the support substrate 104 and the sealing base material 105 are in close contact with each other (see FIG. 3-4). At this time, pressure is applied uniformly over the entire surface of the support substrate 104 and the sealing substrate 105 perpendicular to the surface direction of the support substrate 104 and the sealing substrate 105. The pressurization time, pressure value, and the like can be appropriately adjusted depending on the degree of bubble generation and are not particularly limited.

  In the present embodiment, the integration process is started in a reduced pressure state, but is not limited to this, and is performed in an inert gas set to atmospheric pressure or in an inert gas set to reduced pressure. May be. Furthermore, for example, when the integration step is started in an inert gas set to atmospheric pressure, the pressure may be reduced after reaching the thermosetting temperature. On the other hand, for example, when the integration step is started in an inert gas set in a reduced pressure state, the vacuum process may be performed after the specific gas component has fallen below a specified amount. The timing and time of the negative pressure state and the vacuum state can be appropriately adjusted depending on the degree of bubble generation and are not particularly limited.

  FIG. 4 is a process diagram showing a plurality of steps that can be taken by the method for manufacturing the self-luminous panel 100 of the present embodiment. In the method for manufacturing the self-luminous panel of this embodiment, the first bonding step is performed either in a reduced pressure state, in an inert gas set at atmospheric pressure, or in an inert gas set in a reduced pressure state. It can be done in one environment. On the other hand, in the method for manufacturing the self-luminous panel 100 of the present embodiment, the second bonding step is performed only in a reduced pressure state.

  In the method for manufacturing the self-luminous panel 100 according to the present embodiment, the integration step is performed by any one of an inert gas set to a reduced pressure state, an atmospheric pressure, or an inert gas set to a reduced pressure state. Perform in the environment. When the integration process is performed in a reduced pressure state, the process is performed in the reduced pressure state as it is until the end, the inert gas atmosphere set in the reduced pressure state from the middle, or the inert gas atmosphere set in the atmospheric pressure. There are three procedures that can be used: an active gas atmosphere. On the other hand, when the integration step is performed in an inert gas set to atmospheric pressure, two procedures can be taken: setting the reduced pressure state to a negative pressure state or reducing the pressure to a vacuum state. . In addition, when the integration process is performed in an inert gas set to a reduced pressure state, a procedure for reducing the pressure to a vacuum state or setting an inert gas atmosphere set to an atmospheric pressure can be taken.

  Thus, according to the manufacturing method of the self-luminous panel 100 of the present embodiment, the self-luminous element 103 is encapsulated with the sheet-like encapsulant 106 and the support substrate 104 in the first bonding step. The supporting substrate 104 and the sealing base material 105 to which the sealing material 106 is bonded in the second bonding process are bonded together in a reduced pressure state through the sealing material 106, and the integration process is performed. The support substrate 104 and the sealing substrate 105 bonded in the second bonding step are integrated through the sealing material 106. By using such a sealing method, it is possible to prevent the generation of bubbles between the sealing material 106 and the sealing substrate 105 while realizing simplification of the process. As a result, it is possible to prevent poor adhesion due to a decrease in the bonding area between the sealing material 106 and the sealing substrate 105 and a decrease in light transmission efficiency.

  Then, in the second bonding step, the sealing material 106 is pressed immediately after the sealing material 106 and the sealing base material 105 are bonded together by applying pressure in a direction in which the support substrate 104 and the sealing material 106 are in close contact with each other. Even when bubbles are formed between the sealing member 105 and the sealing substrate 105, the bubbles can be pushed out from between the sealing material 106 and the sealing substrate 105.

  FIG. 5-1 is a side view when the sealing substrate is bonded to the support substrate in an inclined state, and FIG. 5-2 illustrates a state where the sealing substrate 105 is bonded to the support substrate. It is a side view. As shown in FIG. 5A, when the sealing base material 105 is inclined with respect to the support substrate 104 and is gradually pasted from the end, the sealing material 106 is pushed from one side to the other side. Bonding is performed while being done. For this reason, as shown in FIG. 5B, the sealing material 106 may be distorted to form irregularities on the surface of the sealing material 106, and bubbles 501 may be generated.

  On the other hand, in the second bonding step of the present embodiment, the supporting substrate 104 and the sealing base material 105 are held so that the surfaces 201 and 202 to be bonded are parallel to each other and facing each other. The support substrate 104 and the sealing base material 105 are bonded together in a direction in which the surfaces 201 and 202 to be approached. Thereby, since the sealing material 106 is not distorted, the surface of the sealing material 106 is prevented from being uneven, and the sealing material 106 and the sealing base material 105 are bonded together in a reduced pressure state. It is possible to more reliably prevent the generation of bubbles between the two.

  FIG. 5-3 is a side view illustrating another state in which the sealing base material is bonded to the support substrate. As illustrated in FIG. 5A, when the sealing base material 105 is inclined with respect to the support substrate 104 and is gradually pasted from the end portion, as illustrated in FIG. The thickness of the panel may be different between the panel end and the center. If the thickness of the sealing material 106 varies depending on the location of one self-luminous panel 100, the light-emitting performance varies depending on the location, which in turn causes the quality of the self-luminous panel 100 to deteriorate.

  On the other hand, in the second bonding step of the present embodiment, the supporting substrate 104 and the sealing base material 105 are held so that the surfaces 201 and 202 to be bonded are parallel to each other and facing each other. By bonding the support substrate 104 and the sealing base material 105 in a direction in which the surfaces 201 and 202 to be approached, the thickness of the sealing material 106 can be made uniform over the entire self-luminous panel 100.

  By the way, there is a method in which the sealing base material 105 is gradually bonded to the support substrate 104 from the end, while the sealing base material 105 is bent. In order to manufacture a large-scale sealing base material 105, a large-scale laminating apparatus is required to bend, or the large-sized sealing base material 105 is bent to be sealed. There is a concern that 105 may be damaged.

  On the other hand, the manufacturing method of the present embodiment can bond the support substrate 104 and the sealing base material 105 without causing the sealing base material 105 to bend. Even in the case of manufacturing the light emitting panel 100, it is possible to eliminate the need for a large bonding apparatus for bending the sealing substrate 105 having a large size. In addition, the self-luminous panel 100 with good quality can be manufactured without worrying about the damage of the sealing substrate 105 caused by bending the large-sized sealing substrate 105.

  That is, according to the method for manufacturing the self-luminous panel 100 of the present embodiment, the generation of bubbles between the sealing material 106 and the sealing substrate 105 is not affected by the size of the self-luminous panel 100 to be manufactured. Thus, the self-luminous panel 100 with good quality can be obtained. The manufacturing method is not limited to the manufacturing method in which the support substrate 104 and the sealing base material 105 are bonded in parallel, and includes a method of manufacturing the self-luminous panel 100 by bending the sealing base material 105. Various known techniques can be used.

  In this embodiment, the sealing material 106 formed of a thermosetting resin is used, and the sealing material 106 is heated in a reduced pressure state in the integration step. As a result, the specific gas component generated from the resin forming the sealing material 106 at the time of thermosetting can be drawn out from between the sealing material 106 and the support substrate 104 or the sealing base material 105. Generation of bubbles between the material 106 and the support substrate 104 or the sealing substrate 105 can be prevented more reliably.

  And in this integration process, after the specific gas component discharged | emitted from the sealing material 106 becomes below a regulation amount, it can be favorably transferred with respect to the sealing material 106 by setting it as atmospheric pressure. In other words, in the reduced pressure state, the heat source must be brought into direct contact with the support substrate 104 and the sealing base material 105. However, by setting the atmospheric pressure, the gas around the self-luminous panel 100 (air or inert gas) is passed. By transferring the heat, the sealing material 106 can be heated, and the heating can be performed efficiently. Furthermore, it is possible to prevent excessive consumption of energy for heating and suppress an increase in manufacturing cost.

  FIG. 6 is a chart showing a change with time of the specific component gas amount. The figure shows the change over time in the amount of the specific component gas discharged from the sealing material 106 when the support substrate 104 and the sealing base material 105 are bonded together and then brought into contact with a heat source. When measuring the change with time of the specific component gas amount, first, the support substrate 104 in the self-luminous panel 100 is brought into contact with a heat source set at about 40 ° C. The amount of gas discharged immediately after contact is defined as 1.0, and the time is defined as 0. FIG. 6 shows the change over time in the amount of gas detected when the temperature of the heat source is increased from time 0 to the curing temperature of the sealing material of about 100 ° C. and held at the curing temperature of the sealing material. As can be seen from FIG. 6, the amount of the specific component gas discharged from the sealing material 106 increases for a certain period and gradually decreases after the peak point of 10 minutes, and becomes substantially constant after 40 minutes.

  According to the manufacturing method of the self-luminous panel 100 of the present embodiment, for example, from the sealing material 106 by the thermosetting reaction by maintaining the reduced pressure state for 10 minutes or 10 to 40 minutes when the specific component gas amount reaches the peak. While discharging | emitting the specific gas component to generate | occur | produce outside and making it atmospheric pressure after that, the heat | fever from a heat source can be efficiently conducted to the self-light-emitting panel 100 whole, and a favorable thermosetting reaction can be performed.

  The integration step is not limited to being performed in a reduced pressure state. For example, while using the sealing material 106 formed of a thermosetting resin, the integration step is performed in an inert gas set to atmospheric pressure. By heating the sealing material 106 in this manner, it is possible to prevent the light emitting performance of the self light emitting element 103 from being deteriorated by oxygen or water entering before the self light emitting element 103 is completely sealed.

  Similarly, the integration process is not limited to being performed in a reduced pressure state. For example, a sealing material 106 formed of a thermosetting resin is used, and in the integration process, an unset pressure state is set. By heating the sealing material 106 in the active gas, a specific gas component generated from the resin that forms the sealing material 106 during thermosetting is transferred between the sealing material 106 and the support substrate 104 or the sealing substrate 105. Therefore, the generation of bubbles between the sealing material 106 and the support substrate 104 or the sealing base material 105 can be more reliably prevented.

  Further, in the integration step, the specific gas component generated from the resin forming the sealing material 106 at the time of thermosetting is pressurized by pressing in the direction in which the support substrate 104 and the sealing base material 105 are in close contact with each other. When the path that has passed through to escape from between the support substrate 104 and the sealing substrate 105 is formed in the sealing material 106 that is being cured, the path can be crushed. It is possible to prevent a path (path) through which the specific gas component has passed through 106 from remaining.

  In addition, according to the method for manufacturing the self-luminous panel 100 of the present embodiment, the first bonding step is performed in a reduced pressure state, thereby preventing generation of bubbles between the support substrate 104 and the sealing material 106. be able to. The first bonding step is not limited to being performed in a reduced pressure state. For example, when the first bonding step is performed in an inert gas set at atmospheric pressure, the first substrate is sealed with the support substrate 104. It can be prevented that oxygen, water, or the like enters between the material 106 and the light emitting performance of the self light emitting element 103 is deteriorated.

  In addition, for example, when the first bonding step is performed in an inert gas set in a negative pressure state, bubbles including oxygen, water, and the like are generated between the sealing material 106 and the support substrate 104. It is possible to prevent the light emitting performance of the self light emitting element 103 from being deteriorated by oxygen or water contained in the bubbles.

  The self-luminous panel 100 may be manufactured consistently in the same work space, or the work space may be different for each process. Therefore, it is preferable that the first and second bonding processes are performed in the same work space, and the integration process is performed in another work space. In manufacturing the self-luminous panel 100, for example, after the sealing material 106 is bonded to the support substrate 104 in a room under an atmospheric pressure filled with an inert gas, the working space is pressurized to enhance the adhesion. As described above, the pressure in the same work space may be changed.

  In this embodiment, the sealing material is bonded to the support substrate 104 provided with the self-light-emitting element 103, and then the sealing base material 105 is bonded, but the manufacturing method of the self-light-emitting panel 100 is this step. The order is not limited, and the support substrate 104 provided with the self-light-emitting element 103 may be bonded after the sealing material 106 is bonded to the sealing base material 105. In this case, the same effect as described above can be obtained by bonding the sealing substrate 105 and the support substrate 104 together in a reduced pressure state.

(Concrete example)
Below, the manufacturing method of the self-luminous panel 100 as a specific example of this invention is demonstrated. The self light emitting panel 100 according to the specific example of the present invention has the same structure as the self light emitting panel 100 shown in FIG.

(Specific example 1)
In Example 1 of the present invention, a glass substrate was used as the support substrate 104. Hereinafter, the glass substrate will be described with reference numeral 104. In manufacturing the self-luminous panel 100 according to the first specific example, first, a pretreatment process is performed. In the pretreatment step, a transparent and conductive indium tin oxide film (ITO) is formed on the glass substrate 104 by a sputtering method. Subsequently, patterning is performed on the deposited ITO using a photolithography method. In addition, a light emitting region is previously patterned on ITO using positive polyimide. On the other hand, using a negative resist, a film is formed on the insulating film using a spin coating method and patterned to provide a rib. Next, the glass substrate with ITO is subjected to UV ozone cleaning. As a result, an electrode (anode) 101 a is formed on the glass substrate 104.

Subsequently, a film forming process is performed. In the film forming process, first, the glass substrate 104 after the above-described pretreatment process is carried into a vacuum film forming apparatus evacuated to 10 ⁻⁴ Pa. On this glass substrate 104, CuPc is laminated with a thickness of 50 nm as a hole injection layer, NPD is laminated with a thickness of 50 nm as a hole transport layer, and further, a blue light emitting layer and an orange are laminated as a white organic EL layer. A color light emitting layer was laminated.

When laminating the white organic EL layer, first, a blue light emitting layer is laminated. In this specific example, a blue light emitting layer in which 1 wt% of BCzVBi as a dopant was mixed with DPVBi as a host material was formed to a thickness of 50 nm by co-evaporation. In this specific example, an orange light emitting layer in which 1 wt% of DCM as a dopant was mixed with Alq ₃ as a host material was formed to a thickness of 50 nm by co-evaporation.

Further, in the film forming step, Alq ₃ was laminated as an electron transport layer with a thickness of 20 nm on the white organic EL layer, and Al was deposited as a cathode with a thickness of 150 nm by vapor deposition. Thereby, an organic EL layer which is the light emitting layer 103 is formed on the electrode (anode) 101a.

  The glass substrate 104 that has undergone the film formation process is transported from a vacuum chamber to a vacuum sealing chamber. In addition, since it is a well-known technique about each apparatus used when manufacturing the self-light-emitting panel 100 including a sealing chamber, illustration and description are abbreviate | omitted here.

  In addition, the sealing material 106 and the sealing base material 105 are carried into the sealing chamber before the glass substrate 104 is transferred into the sealing chamber. In this specific example, a 35 μm-thick film formed of an epoxy resin was used as the sealing material 106, and a 0.7 mm thick glass substrate (sealing glass substrate) was used as the sealing substrate 105. Hereinafter, the sealing glass substrate will be described with reference numeral 105.

Then, a film as the sealing material 106 is bonded to the sealing glass substrate 105 by using a laminator so that bubbles are not mixed into the contact surface. Hereinafter, the film will be described with reference numeral 106. The glass substrate 105 for sealing and the sealing material 106 were bonded together by setting the laminator roll temperature to 90 ° C. After the film 106 and the sealing glass substrate 105 are bonded together, the substrate stage temperature is set so that the substrate temperature becomes 40 ° C., the N ₂ gas in the sealing chamber is exhausted, and the pressure is reduced to 10 ⁻² Pa. To do. In addition, at the stage where pressure reduction was completed, it was confirmed visually that there was no bubble in the contact | adherence surface of the film 106 and the glass substrate 105 for sealing.

  The sealing glass substrate 105 and the glass substrate 104 that has undergone the film formation process are overlapped and integrated so that the film 106 and the film formation surface face each other in a reduced pressure state. For the integration, a dedicated bonding apparatus was used. As this bonding apparatus, various known bonding apparatuses can be used, and a description thereof is omitted in this specific example 1.

  After the integration, the pressure is increased from vacuum to 10 Pa, the temperature is further increased to 90 ° C., and only both the substrates are pressurized in a negative pressure state. When the pressurization was completed, it was visually confirmed that there were no bubbles in the contact surface between the sealing glass substrate 105 and the glass substrate 104 that had undergone the film formation process.

Next, the integrated organic EL display device is transferred to a heating chamber in which a hot plate is installed. After the transfer, the inside of the heating chamber is evacuated and decompressed to a vacuum state of 10 ⁻⁴ Pa. When the vacuum state is reached, the glass substrate 105 for sealing is brought into contact with a hot plate stabilized at 100 ° C., the film 106 is heated, and the film 106 is sufficiently deaerated and cured. When the film 106 is completely degassed and cured, the self-luminous panel 100 is detached from the hot plate. The self light emitting panel 100 is sufficiently cooled, and then the self light emitting panel 100 is transported from the heating chamber to the sealing chamber. And the self-luminous panel 100 which confirmed that there was no sealing defect in the sealing chamber was taken out in air | atmosphere.

  In the present specific example 1, by manufacturing as described above, it was possible to obtain a self-luminous panel 100 having no light bubbles and good luminous performance.

(Specific example 2)
In the second specific example, a self-luminous panel 100 having a bottom emission structure among active panels will be described. In addition, description is abbreviate | omitted about the same part as the specific example 1 mentioned above. The same applies to the following specific examples.

In Example 2 of the present invention, first, a polycrystalline silicon thin film was formed on a glass substrate 104 by solid phase growth, and this polycrystalline silicon thin film was processed into an island shape to form a silicon active layer. A gate insulating film formed of SiO ₂ and a gate electrode formed of Al were formed on the silicon active layer. Next, the silicon active layer was doped with impurities to form a source region, a channel formation region, and a drain region. An interlayer insulating film of SiO ₂ was formed on the entire upper surface of these. Then, an opening portion for organic EL light emission was opened in the interlayer insulating film by an etching process, and an ITO pixel electrode (lower electrode) was formed by sputtering.

Next, a titanium nitride film was formed to a thickness of 100 nm. This was etched, and a barrier metal made of a titanium nitride film and a metal for adhesion were formed at the same time in the portion of the source region and drain region connected to ITO. Subsequently, an Al film was formed to a thickness of 600 nm, and this Al film was etched to form Al wirings for the source electrode and the drain electrode. Thereafter, a protective film of SiO ₂ was formed so as to cover the TFT. Thereafter, an organic EL element was formed on the upper surface of the electrode 101a on the glass substrate 104 by a manufacturing process similar to that of Example 1, and sealing was performed.

  In this specific example 2, by manufacturing as described above, it was possible to obtain a self-luminous panel 100 having no light bubbles and good light emitting performance.

(Specific example 3)
In the third specific example, a self-luminous panel 100 having a top emission structure among active panels will be described.

  In Example 3 of the present invention, a reflective layer formed of Cr and an electrode 101a as an anode (pixel electrode) formed of ITO are laminated on an interlayer insulating film, and an electrode 101b as a cathode Was the same as Example 2 except that the Al film thickness was 2 nm and IZO was laminated by sputtering.

  In this specific example 3, by producing as described above, a self-luminous panel having no light bubbles and good luminous performance could be obtained.

(Specific example 4)
In this specific example 4, deaeration was carried out by heating at atmospheric pressure or negative pressure for a specific time, and further, the heating temperature was raised and the deaeration was completely carried out by making a vacuum state, followed by curing. Specifically, in this specific example 4, the processes up to the step of integrating the glass substrate 104 and the sealing glass substrate 105 that have undergone the film forming process are performed in the same manner as in the above-described specific example 2 and integrated. The heated glass substrate 104 and the sealing glass substrate 105 are transported to a heating chamber, the chamber atmosphere is filled with an inert gas, and the internal pressure of the chamber is exhausted to about 10 Pa. Then, the hot plate is stabilized at 90 ° C. The film 106 was heated by bringing the sealing glass substrate 105 into surface contact.

Subsequently, while the temperature of the hot plate was gradually raised to 120 ° C., the inert gas in the chamber was exhausted, and the pressure was reduced until the internal pressure reached 10 ⁻⁴ Pa. After sufficiently reaching a vacuum state of 10 ⁻⁴ Pa, the self-luminous panel 100 was detached from the hot plate, sufficiently cooled, and then transferred to the sealing chamber. After confirming that there was no sealing failure in the sealing chamber, the self-luminous panel 100 was taken out into the atmosphere.

  In the present specific example 4, by producing as described above, it was possible to obtain the self-luminous panel 100 having no emission of bubbles and good light emitting performance.

It is a side view which shows an example of a structure of the self-light-emitting panel concerning embodiment of this invention. It is a side view which shows the 1st bonding process concerning embodiment of this invention. It is a side view which shows the 2nd bonding process concerning embodiment of this invention. It is a side view which shows the integration process concerning embodiment of this invention. It is a side view which shows the self-light-emitting element formation process concerning the Example of this invention. It is a side view which shows the 1st bonding process concerning the Example of this invention. It is a side view which shows the 2nd bonding process concerning the Example of this invention. It is a side view which shows the integration process concerning the Example of this invention. It is process drawing which shows the several process which the manufacturing method of the self-light-emitting panel of a present Example can take. It is a side view at the time of bonding together in the state which inclined the sealing base material with respect to the support substrate. It is a side view which shows the state which bonded the sealing base material with respect to the support substrate. It is a side view which shows the other state which bonded the sealing base material with respect to the support substrate. It is a graph which shows the time-dependent change of specific component gas amount.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Self-light emitting panel 101 A pair of electrode 102 Light emitting layer 103 Self-light-emitting element 104 Support substrate 105 Sealing base material 106 Sealing material

Claims (13)

A self-light-emitting element comprising a support substrate, a pair of opposing electrodes formed on the support substrate, and a light-emitting layer sandwiched between the pair of electrodes; and a seal facing the support substrate via the self-light-emitting element In a method for manufacturing a self-luminous panel, comprising a stop base material, a sealing material provided between the support substrate and the sealing base material and sealing the self-luminous element,
A first laminating step of laminating the sealing material and the support substrate so as to seal the self-luminous element;
A second bonding step in which the support substrate to which the sealing material is bonded in the first bonding step and the sealing base material are bonded in a reduced pressure state through the sealing material;
An integration step of integrating the support substrate and the sealing base material bonded together in the second bonding step via the sealing material;
The manufacturing method of the self-light-emitting panel characterized by including this. A self-light-emitting element comprising a support substrate, a pair of opposing electrodes formed on the support substrate, and a light-emitting layer sandwiched between the pair of electrodes; and a seal facing the support substrate via the self-light-emitting element In a method for manufacturing a self-luminous panel, comprising a stop base material, a sealing material provided between the support substrate and the sealing base material and sealing the self-luminous element,
A first bonding step of bonding the sealing material and the sealing substrate;
The sealing substrate to which the sealing material is bonded in the first bonding step and the support substrate are bonded together in a reduced pressure state so as to seal the self-luminous element through the sealing material. A second bonding step;
An integration step of integrating the support substrate and the sealing base material bonded together in the second bonding step via the sealing material;
The manufacturing method of the self-light-emitting panel characterized by including this.   3. The method for manufacturing a self-luminous panel according to claim 1, wherein in the second bonding step, pressure is applied in a direction in which the support substrate and the sealing base material are in close contact with each other.   The second bonding step includes holding the support substrate and the sealing substrate so that the surfaces to be bonded to each other are parallel and facing each other, and the support in the direction in which the surfaces to be bonded to each other approach each other. The method for manufacturing a self-luminous panel according to any one of claims 1 to 3, wherein a substrate and the sealing base material are bonded together. The sealing material is formed of a thermosetting resin that is cured by being heated,
The said integration process is performed in a pressure-reduced state, The manufacturing method of the self-light-emitting panel as described in any one of Claims 1-4 characterized by the above-mentioned.   6. The method for manufacturing a self-luminous panel according to claim 5, wherein the integration step changes the reduced pressure state to the atmospheric pressure after the specific gas component discharged from the sealing material becomes a specified amount or less. . The sealing material is formed of a thermosetting resin that is cured by being heated,
The said integration process is performed in the inert gas set to atmospheric pressure, The manufacturing method of the self-light-emitting panel as described in any one of Claims 1-4 characterized by the above-mentioned. The sealing material is formed of a thermosetting resin that is cured by being heated,
The self-luminous panel manufacturing method according to claim 1, wherein the integration step is performed in an inert gas set in a reduced pressure state.   The method for manufacturing a self-luminous panel according to any one of claims 5 to 8, wherein in the integration step, pressure is applied in a direction in which the support substrate and the sealing material are in close contact with each other.   The method for manufacturing a self-luminous panel according to any one of claims 1 to 9, wherein the first bonding step is performed in a reduced pressure state.   The self-luminous panel manufacturing method according to any one of claims 1 to 9, wherein the first bonding step is performed in an inert gas set to atmospheric pressure.   The self-luminous panel manufacturing method according to claim 1, wherein the first bonding step is performed in an inert gas set in a reduced pressure state. The method for manufacturing a self-luminous panel according to any one of claims 1 to 12, wherein the self-luminous element is an organic EL element.

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