JP2006178282A - Optical waveguide resin film and optical wiring member using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical wave guide resin film flexible enough for connecting between devices and between boards in a device, capable of easily and optically connecting between chips in the board, and capable of easily aligning the optical axes for attaining effective optical connection between mounted light emitting device or light receiving element and the optical waveguides. <P>SOLUTION: The optical waveguide resin film is composed of a clad layer of refractive index n<SB>1</SB>, a core layer of refractive index n<SB>c</SB>, and a clad layer of refractive index n<SB>2</SB>successively laminated in this order, and the inequalities n<SB>1</SB><n<SB>c</SB>, n<SB>2</SB><n<SB>c</SB>are satisfied. Moreover, the resin film has a recess for mounting the light emitting device and/or a recess for mounting the light receiving element, and a mirror in the core layer for reflecting the coming optically waveguided light to the light receiving element and/or transmitting the light emitted from the light emitting device. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical waveguide resin film that can easily achieve alignment for optical coupling between a light receiving and emitting element and an optical waveguide, and realizes optical interconnection between devices, between boards in a device, and within a board at low cost. To do.

  With the advancement of IT due to the progress of broadband such as FTTH (Fiber to the Home), the light of interconnection between devices / devices in devices that perform high-speed and large-capacity signal processing such as routers. Transmission is progressing.

  In addition, advances in LSI technology have increased the information processing speed and integration scale, and the performance of microprocessors and the capacity of memory chips have increased rapidly. Along with this, various electronic devices such as personal computers using these functions, information appliances mainly using video information such as hard disk recorders and DVD recorders have appeared on the market.

  Therefore, in signal transmission over a relatively short distance such as between boards in a device or between chips in a board, which has been performed by conventional electrical signals, (1) For high speed, CR (C: Signal capacitance due to wiring capacitance, R: wiring resistance) time constant becomes a problem, and (2) EMI (Electromagnetic Interference) noise and crosstalk between channels are a problem for increasing the density of electrical wiring. Therefore, it has become difficult to further increase the speed and density.

  Therefore, as one of the techniques for solving these problems, there is an optical wiring (optical interconnection) technique. The optical wiring can be applied to various places such as between devices, between boards in the device, or between chips in the board. It is useful to use a flexible optical wiring material for optical connection between devices and between boards straddling movable parts in the device. Devices that have board-to-board connections that straddle the movable part include foldable mobile phones and notebook computers.

  Such an optical signal transmission system requires a light emitting element for converting an electrical signal into an optical signal and a light receiving element for converting an optical signal into an electrical signal. Accurate optical axis alignment is necessary to achieve efficient optical coupling between these elements and the optical waveguide. In addition, an electric signal for controlling the light emitting element and the light receiving element and a power supply for driving are required, and an electric wiring system is also required for the optical interconnection system.

  On the other hand, as a conventional optical waveguide resin film, a clad layer is provided on a substrate such as silicon by a coating method such as spin coating, and then a core layer is provided on the clad and a core is formed by channel processing. Further, there are those manufactured by forming an optical waveguide resin film by providing a cladding so as to cover the core next, and finally peeling this film from the substrate (see Patent Documents 1, 2, and 3). .

Further, as a method of mounting the light emitting / receiving element on the optical waveguide, there is a method of performing flip chip bonding on a substrate on which both an electric circuit and an optical waveguide are formed (Patent Documents 4 and 5).
JP 2001-166166 A (Claims) JP-A-7-239422 (Claims) JP 2004-287396 A (Claims) JP 2002-368334 A (Claims) JP 2004-327484 A (Claims)

  However, in the method of mounting the light emitting / receiving element on the substrate on which both the electric circuit and the optical waveguide are formed by flip chip bonding, the electrical connection is performed while aligning the optical axes of the light emitting / receiving element and the optical waveguide. Very accurate alignment is required during bonding.

  In view of such a situation, the present invention is a flexible and easy optical connection between devices, between boards in the device, and between chips in the board, and can achieve efficient optical coupling between the mounted light emitting element or light receiving element and the optical waveguide. Provided is an optical waveguide resin film that allows easy alignment of axes.

That is, the present invention, the cladding layer having a refractive index of n _1, the core layer a refractive index n _c, cladding layer having a refractive index of n ₂ are laminated in this _{order, n 1 <n c, n} 2 < an optical waveguide resin film satisfying n _c, the light-emitting element and / or depressions for mounting the light receiving element is on said film has a mirror on the core layer, the mirror reflects the guided light propagating the light-receiving element And / or a mirror that propagates the light emitted from the light emitting element.

  According to the optical waveguide resin film of the present invention, it is easy to optically connect between devices, between boards in the device, and between chips in the board, and achieve efficient optical coupling between the mounted light emitting element or light receiving element and the optical waveguide. The alignment of the optical axis is accurate and simple.

  Compared with electrical signal transmission, optical signal transmission has advantages such as higher speed, less susceptible to noise, and less susceptible to crosstalk. Compared with the electrical transmission where the signal processing devices are connected by conductor wiring, the optical transmission converts the electrical signal of the sending side signal processing device into an optical signal and guides the optical signal to the optical waveguide to the receiving side signal processing device. A process of converting to an electrical signal is required before input. For efficient optical coupling between signal processing devices and optical waveguides, it is important to accurately align the optical axis, which is one of the reasons for reducing the cost of optical wiring technology. It is the key. Therefore, it is important to develop a technology that can achieve this by a simple method and at a low cost.

In the present invention, the recess for mounting the light emitting element or the light receiving element on the resin film is a recess extending from the surface of the optical waveguide resin film to the cladding layer, as indicated by reference numeral 1 in FIGS. This depression may or may not penetrate the cladding layer.
The mirror is formed in the core layer and converts the optical path of the guided light to the light receiving element or converts the optical path of the light emitting element to the optical waveguide. In the optical path conversion of the waveguide, the propagation direction of the guided light is set to enter from the optical axis of the optical waveguide to the optical axis of the light receiving element, or the traveling direction of the emitted light from the light emitting element is changed to the optical axis direction of the waveguide. The angle of the emitted light is set so as to be converted. In either case, the angle of the mirror is set so as to achieve the above-described incidence and emission. For example, when the optical axis of the optical waveguide and the light receiving surface of the light receiving element having a flat light receiving surface are parallel, the angle formed by the mirror normal and the light receiving surface normal of the light receiving element is 45 °. Further, since the scattering of the reflected light is reduced, the mirror surface is preferably smooth. A metal layer or the like may be formed on the mirror surface, but the process is likely to be complicated to form, and it is preferable to form the mirror with a resin. When the mirror is formed of resin, it is preferable that the light incident on the mirror is incident at an angle satisfying the total reflection condition from a medium having a refractive index smaller than that of the mirror material such as air.
The method of forming the mirror is not particularly limited, but a method of cutting the core layer so that the angle of the cut surface becomes a desired one using a dicing saw, or an indenter having a desired angle is pressed into the core layer for deformation. And a method of molding using a mold having a desired shape.

For optical waveguide resin film functions as an optical waveguide for propagating confined light to the core layer, cladding layer having a refractive index of n ₁ (hereinafter referred to as cladding layers 1), the core layer a refractive index n _c, cladding layer having a refractive index of n ₂ (hereinafter referred to as cladding layer 2) are laminated in this order, n 1 _{<n c,} and it is necessary to satisfy a relation n ₂ <n _c.

  Recesses for mounting light-emitting elements and light-receiving elements on the optical waveguide resin film are processed into the same shape as the recesses for mounting the light-emitting elements and light-receiving elements to achieve efficient optical coupling when the light-emitting elements and light-receiving elements are mounted. The optical axis alignment for the purpose is to be achieved passively. Therefore, although the shape of the hollow opening is not particularly limited, it is preferable to make the light emitting element or the light receiving element easily processed, for example, a square, a rectangle, a pentagon, a hexagon, an octagon, or the like. Can do.

  Further, the angle θ formed between the wall surface of the recess for mounting the light emitting element and the light receiving element and the surface of the optical waveguide resin film is an angle indicated by reference numeral 7 in FIG. In order to easily and accurately mount the light emitting element and the light receiving element, this angle is preferably 90 ° or more and 170 ° or less. If it is smaller than 90 °, it becomes difficult to mount a light emitting element or a light receiving element in the recess, and if it is larger than 170 °, the alignment of the optical axis tends to be insufficient. The case of 100 ° or more and 160 ° or less is preferable because alignment can be easily performed with high accuracy.

  As a method of mounting the light receiving element and the light emitting element in the depression, there is a method in which each individual element is fitted into each depression by a robot arm or the like. In addition, there is a method of immersing the optical waveguide resin film in a liquid such as water, applying a flow to the liquid, placing a light receiving element or a light emitting element on the flow, and fitting the light receiving element or the light emitting element into the recess, etc. In this case, by fitting the optical waveguide resin film, it is possible to make the insertion into the depression more efficient.

  The angle processing of the end face of the light receiving element or the light emitting element is performed by anisotropic etching using the crystal orientation direction of the light receiving element or the light emitting element material, or dicing using a blade set at a desired angle φ as shown in FIG. It can be performed by processing with a saw.

  The optical waveguide is not particularly limited, such as a slab type or a channel type. However, by confining the guided light within a limited range, the transmission distance can be increased and the signal intensity at the light receiving surface can be increased. A mold is preferred.

  When multiple optical waveguides are formed in a single optical waveguide resin film, multi-channel optical transmission is possible, so that it is possible to transmit broadband signals with a single optical waveguide resin film. This is preferable because optical parts such as wave filters and wavelength filters can be built.

  The material of the optical waveguide resin film is not particularly limited, and UV curable resin, thermoplastic resin, thermosetting resin, and the like can be used.

  It is preferable to use a thermoplastic resin because a simple method such as embossing can be used to form a recess for mounting a light emitting element or a light receiving element, and a highly flexible film is easily obtained. In the present invention, PMMA (polymethyl methacrylate), polycarbonate, polystyrene, polyetherimide, cycloolefin, polyphenylene ether, polyphenylene sulfide, polyether sulfone and the like can be mentioned.

  Thermosetting resins include polyimide, fluorinated polyimide, deuterated polyimide, polynorbornene, epoxy resin, epoxy-novolak resin, cyanate resin, BT (bismaleimide / triazine) resin, benzocyclobutene, fluorinated benzocyclobutene, Examples include polysiloxane, deuterated polysiloxane, alkyl-substituted siloxane, silicone resin, deuterated silicone resin, fluorinated polyether, and polyfluoromethacrylate.

  Examples of the UV curable resin include a UV curable epoxy resin, a UV curable acrylic resin, and a UV curable halogenated acrylic resin.

In addition, an aramid resin, a fluorinated aramid resin, a sulfonated aramid resin, or the like can also be used. In addition, an electrical connection from the outside to the light receiving element or the light emitting element is necessary for exchanging electric signals for driving and supplying power. For electrical connection to these elements, it is effective to provide a conductor layer on the surface of the cladding layer 1 or the cladding layer 2 opposite to the core layer side. The conductive layer is not particularly limited, and a conductive paste cured material, a metal, a highly conductive semiconductor, a conductive oxide such as ITO or ZnO, or the like can be used. As the metal, copper, aluminum, chromium, gold, silver, nickel, titanium, tungsten, or the like can be used. When using a metal foil, copper, aluminum, gold, silver, stainless steel, or the like can be used. Among them, copper or an alloy containing copper can be preferably used because of its low electric resistance and high versatility as an electric circuit material. As the copper foil, a known rolled foil, electrolytic foil, or the like for a wiring board can be used. The thickness of the conductor layer is preferably 2 μm or more and 50 μm or less. If it is less than 2 μm, the resistance value may be too large, and if it is thicker than 50 μm, the flexibility of the optical waveguide resin film may be impaired. In the case of a metal foil, it can be provided on the cladding layer 1 or the cladding layer 2 by, for example, laminating on an optical waveguide resin film.

  The optical waveguide resin film of the present invention is provided with a recess for mounting a light emitting element and a light receiving element, and a mirror, and the mirror reflects the guided light propagating around the core layer to change the optical path to the light receiving element. Since the guiding and / or mirror is formed so as to guide the light emitted from the light emitting element to propagate through the core layer, the light emitting element and / or the light receiving element are mounted as shown in FIG. Formed as one unit. In this unit, photoelectric conversion is performed on the optical waveguide resin film, and connection between devices, between devices, and between LSIs is performed by electrical connection, so that connection can be easily performed at low cost. Furthermore, for the connection between the light emitting element and the conductor layer, or between the light receiving element and the conductor layer, wire bonding, connection using a conductive paste, bump connection using a bump such as gold, and the like can be performed.

  The light emitting element mounted on the optical waveguide resin film of the present invention is not particularly limited, and a surface emitting semiconductor laser, an edge emitting semiconductor laser, a photodiode, or the like can be used. A surface-emitting semiconductor laser is preferably used because the light-emitting beam is circular, the divergence angle is relatively small, and arraying is easy. Surface emitting semiconductor lasers include those with an oscillation wavelength of 850 nm band and 780 nm band made of AlGaAs (aluminum, gallium, arsenic) materials, etc., and are sold by Fuji Xerox Co., Ltd. In addition, the development of one having an oscillation wavelength of 1.3 μm band and 1.5 to 1.6 μm band has been actively conducted.

  The light receiving element mounted on the optical waveguide resin film of the present invention is not particularly limited, and depending on the corresponding wavelength, sensitivity, response speed, etc., materials such as Si and InGaAs, MSM (Metal Semiconductor Metal) type, PIN Select a type photodiode structure and method, and use one that matches your application. These photodiodes are sold by Kosei Electronics Co., Ltd. and Hamamatsu Photonics Co., Ltd.

  When the optical waveguide resin film is flexible, when it is used for inter-device connection, inter-board connection within the device, and inter-chip connection within the board, wiring can be routed with a high degree of freedom. It is preferable because the constraint conditions such as

If necessary, an inorganic filler may be added to the cladding layer or core layer of the optical waveguide resin film. The inorganic filler is preferably at least one selected from materials containing any one of Si—O bonds, Mg—O bonds, and Al—O bonds. A material having a Si—O bond, a Mg—O bond, and an Al—O bond is chemically stable. Therefore, many materials have a large energy gap in a solid state, that is, are transparent. Moreover, many things which are between 1.4-1.8 which is the refractive index area | region of resin used for a film in a solid state are preferable. For example, there are SiO ₂ , Al ₂ O ₃ , MgO, MgAl ₂ O ₄ , Al and Si, Mg and Al, Mg and Si double oxides and solid solutions, and further, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Se, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, Ag, In, Sn, Sb, Te, Cs, Ba, Hf, Ta, W, Re, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, etc. Can be used. Other inorganic materials can be suitably used alone or in a form combined with the oxide as long as the refractive index is in the range of 1.4 to 2.4.

  A method of forming a recess or a mirror for mounting a light emitting element or a light receiving element on the optical waveguide resin film is not particularly limited. However, a drum or stamper having a protrusion corresponding to the recess or mirror shape on the heated optical waveguide resin film is used. It can be performed by a method of pressing under pressure, a laser ablation method, a wet etching method using photolithography, a dry etching method, a mechanical grinding method using a dicing blade or the like.

  Examples of the present invention will be described below, but the present invention is not limited to these examples.

The measurement method and conditions for each characteristic are as follows.
<Refractive index>
Measurement was performed at 25 ° C. using a prism coupler device 2010 manufactured by Metricon and a dedicated P-1 prism.
<Optical propagation loss measurement>
The cutback method was performed according to the JPCA standard (JPCA-PE02-05-01S-2004).

Example 1
A polysiloxane (trade name “PSB-K31”, manufactured by Toray Industries, Inc.) was applied onto a 0.5 mm thick copper substrate using a spin coater, and dried in an atmosphere at 80 ° C. for 10 minutes. Thereafter, heating was performed in nitrogen at 300 ° C. for 1 hour to obtain a film having a thickness of 15 μm and a cladding layer having a refractive index of 1.498 at a wavelength of 850 nm. Hereinafter, this is referred to as a cladding layer 1.

Next, a positive photosensitive polyimide (trade name “Photo Nice” manufactured by Toray Industries, Inc.) is applied, dried in the atmosphere at 120 ° C. for 5 minutes using an ordinary photolithography, and then subjected to FIG. Then, exposure and development were performed so as to form a linear waveguide pattern having a width of 20 μm at a pitch of 5 mm. The exposure was performed using an i-line stepper NSR-1755-i7A manufactured by Nikon Corporation, setting a reticle with a cut pattern, and an exposure amount of 2.5 J / cm ² (intensity of 365 nm). Development was performed by paddle development using a 2.38% aqueous solution of tetramethylammonium hydroxide for 50 seconds × 3 times. Then, curing was performed by heat treatment at 140 ° C. for 30 minutes and 300 ° C. for 1 hour in nitrogen using an oven. The film thickness after curing was 20 μm. This was used as a core layer. Further, the refractive index at a wavelength of 850 nm of the cured film without exposure and development was 1.594.

  As shown in FIG. 6, dicing was performed using a blade whose blade surface angle was 45 ° with respect to the center line, and a mirror was formed on the core layer.

  Subsequently, an N, N-dimethylformamide solution of polymethyl methacrylate is applied from above and dried at 160 ° C. to obtain a 100 μm-thick cladding layer (hereinafter referred to as “cladding layer 2”), thereby producing an optical waveguide. did. A polymethylmethacrylate film was formed on a quartz plate using the same solution, coating and drying method, and the refractive index measured at a wavelength of 850 nm was 1.491.

  Next, a pattern was formed by photolithography using a positive photoresist so that a 500 μm square photoresist remained on the cladding layer 2 so that the mirror of the core layer would be the center. After depositing a 0.2 μm aluminum layer from above, the photoresist was peeled off. That is, aluminum is vapor-deposited in parts other than the place where the depression is formed. Using this aluminum layer as a mask, pattern etching of polymethyl methacrylate was performed using acetone as an etching solution, and the etching was stopped when the mirror was completely exposed. The angle θ between the surface of the polymethyl methacrylate layer (cladding layer 2) and the wall of the hole opened by etching was 110 °.

  Next, a 0.1 μm thick Ni—Cr layer, a 1 μm thick Cu layer, and a 0.05 μm thick gold layer are formed next to a hole formed by etching by sputtering, and a 200 μm wide wiring is formed by mask vapor deposition. Formation was performed. The shape after wiring formation is shown in FIG.

  A hole formed by cutting a wafer on which a surface emitting laser of 850 nm is cut with a dicing saw into a 500 μm square so that the wall surface angle is 70 ° is formed in the polymethyl methacrylate layer (cladding layer 2) under a microscope. It was inserted with the light emitting surface facing down. The surface emitting laser and the wiring were connected by a wire bonding method. After forming a resist layer on the entire surface of the surface emitting laser mounting surface, the copper substrate is etched with a mixed aqueous solution of iron chloride, copper chloride and hydrochloric acid, and then the resist is peeled off to obtain an optical waveguide resin film on which the surface emitting laser is mounted. It was.

  When the surface emitting laser was emitted and the core layer was observed with an infrared video camera, the streak of propagating light was confirmed from the core layer, and it was confirmed that the light from the surface emitting laser was propagating through the core layer.

  Further, the optical propagation loss at a wavelength of 850 nm was measured at a portion where no mirror was sandwiched, and it was 0.1 dB / cm.

Example 2
An optical waveguide resin film was prepared in the same manner as in Example 1 except that the etching solution was changed from acetone to N, N-dimethylformamide solvent, and pattern etching of polymethyl methacrylate was performed in the same manner as in Example 1. The angle θ between the surface of the polymethyl methacrylate layer and the wall of the hole opened by etching was 80 °.

  In the same manner as in Example 1, wiring was formed beside the hole opened by etching. The wafer processing of the surface emitting laser was performed in the same manner as in Example 1 except that the wall surface angle of the wafer on which the surface emitting laser was manufactured was 110 °. This surface-emitting laser was inserted into the hole in the same manner as in Example 1, and the wiring produced in the same manner as in Example 1 was connected by the wire bonding method. When the surface emitting laser was emitted and the core layer was observed with an infrared video camera, streak light from the propagation light of the core layer was confirmed, and it was confirmed that the light from the surface emitting laser was propagating through the core layer. In addition, a strong halo due to optical coupling loss was observed from the end face of the core layer where the light from the mirror enters.

  When the optical propagation loss at a wavelength of 850 nm of the optical waveguide was measured at a portion where the mirror was not sandwiched, it was 0.1 dB / cm.

Example 3
As shown in FIG. 8, the silicon wafer is anisotropically etched to form a slope with a slope of 45 ° with respect to the silicon wafer surface by a MEMS (Micro Electro Mechanical System) manufacturing technique, so as to correspond to the mirror. A recess having a depth of 60 μm at the deepest part was formed. Next, a groove forming a 90 ° wall with respect to the silicon wafer surface was dug by RIE (reactive ion etching). Both the depth and width of the groove were 50 μm. Next, as shown in FIG. 9, polydimethylsiloxane is applied to this silicon wafer, cured by performing a heat treatment at 300 ° C. for 1 hour in nitrogen, separated from the silicon wafer, and subsequently used as a release layer. An aluminum layer having a thickness of 0.1 μm was deposited to obtain a mold A (FIG. 10).

  As shown in FIG. 11, polydimethylsiloxane (symbol 16 in FIG. 11) was applied onto a glass substrate, and the mold A was pressed against the glass substrate and cured by heat treatment at 300 ° C. for 1 hour in nitrogen. Thereafter, the aluminum in the release layer was dissolved with dilute hydrochloric acid to obtain polydimethylsiloxane on the glass substrate. Furthermore, an aluminum layer having a thickness of 0.1 μm was vapor-deposited so as to form a release layer for the next step, thereby producing a mold. This was designated as type B (FIG. 12).

  A sufficient amount of a phenol novolac-type UV curable epoxy resin (hereinafter referred to as epoxy resin a) is applied on the mold B to fill the depression of the mold B, and the clad produced in the same manner as in Example 1 is applied thereon. The epoxy resin a was cured by pressing on the bonding layer 1 and irradiating UV light from the glass plate side of the mold B. Thereafter, the mold B was separated to obtain a core layer (corresponding to the epoxy resin a) formed on the cladding layer 1 (reference numeral 4 in FIG. 13) (FIG. 13). The subsequent process was performed in exactly the same manner as in Example 1, and the cladding layer 2 was provided to obtain an optical waveguide resin film.

  A hole formed by cutting a wafer on which a surface-emitting laser of 850 nm is cut into a 500 μm square with a dicing saw so that the wall surface angle is 70 ° is formed in the polymethyl methacrylate layer (cladding layer 2) under the microscope. It was inserted with the light emitting surface facing down. The surface emitting laser and the wiring were connected by a wire bonding method. After forming a resist layer on the entire surface of the surface emitting laser mounting surface, the copper substrate is etched with a mixed aqueous solution of iron chloride, copper chloride and hydrochloric acid, and then the resist is peeled off to obtain an optical waveguide resin film on which the surface emitting laser is mounted. It was.

  When the optical propagation loss at a wavelength of 850 nm of the optical waveguide of the obtained film was measured, it was 0.1 dB / cm. Further, when a surface emitting laser was emitted and the core layer was observed with an infrared video camera, the streak of propagating light was confirmed from the core layer, and it was confirmed that the light from the surface emitting laser was propagating through the core layer.

  Separately from this, only this epoxy resin a was formed on a quartz plate, UV-cured, and the refractive index was measured at a wavelength of 850 nm, which was 1.584.

Top view of optical waveguide resin film Side view of optical waveguide resin film One aspect of angle processing of light receiving element and end face of light emitting element by dicing saw using blade set to desired angle φ Side view of optical waveguide resin film mounted with light receiving element and / or light emitting element A perspective view of the cladding layer 1 and the core layer formed on the substrate Explanatory drawing of mirror formation method to core layer by dicing saw Top view of optical waveguide resin film with wiring formed in Example 1 Perspective view of etched silicon wafer of Example 3 Mold A production process diagram of Example 3 The perspective view of type | mold A of Example 3 Mold B production process diagram of Example 3 Perspective view of mold B of Example 3 Perspective view of optical waveguide resin film in which core layer and mirror are formed on cladding layer 1

Explanation of symbols

1 Indentation 2 Optical Waveguide 3 Mirror 4 Cladding Layer 1
5 Core layer 6 Cladding layer 2
7 Angle θ between the wall of the dent and the optical waveguide resin film surface
8 Dicing saw blade 9 Light emitting element or light receiving element wafer 10 Light emitting element or light receiving element 11 Conductive layer 12 Substrate 13 Silicon 14 Polydimethylsiloxane 15 type A (polydimethylsiloxane layer and aluminum layer)
16 Polydimethylsiloxane 17 Glass substrate 18 Type B (Polydimethylsiloxane layer and aluminum layer)
19 Copper substrate

Claims (9)

Cladding layer having a refractive index of n _1, the core layer a refractive index n _c, cladding layer having a refractive index of n ₂ are laminated in this order, n 1 _{<n c,} optical satisfying n ₂ <n _c A waveguide resin film having a recess for mounting the light emitting element and / or the light receiving element on the film, having a mirror in the core layer, and reflecting the guided light propagated by the mirror to guide the light receiving element; Alternatively, an optical waveguide resin film in which a mirror propagates light emitted from a light emitting element. 2. The optical waveguide resin film according to claim 1, wherein an angle θ formed by a wall surface of a recess formed in the resin film and the surface of the optical waveguide resin film is 90 ° or more and 170 ° or less. 2. The optical waveguide resin film according to claim 1, wherein the mirror is made of a resin material. 2. The optical waveguide resin film according to claim 1, wherein the structure of the formed optical waveguide is a channel waveguide. 5. The optical waveguide resin film according to claim 4, wherein a plurality of embedded channel waveguides are formed. 2. The optical waveguide resin film according to claim 1, wherein at least one of the cladding layer and the core layer is formed of a thermoplastic resin. at _least on a cladding layer having a refractive index of n ₁ and on a surface opposite to the core layer, or on a cladding layer having a refractive index of n ₂ and opposite to the core layer The optical waveguide resin film according to claim 1, wherein a metal layer is formed on one surface. The optical waveguide resin film according to claim 7, wherein the metal layer includes copper. An optical wiring member comprising a light emitting element and / or a light receiving element mounted on the optical waveguide resin film according to claim 1.

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