JP2006155571A - Ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To invalidate an IC tag after use surely to prevent unauthorized use of the IC tag. <P>SOLUTION: The IC tag comprises: a substrate 2; a plane coil circuit part 6; a surface circuit part consisting of counter electrodes 16 and 18; and an IC inlet 110 for forming notch broken line forming terminals 24 and 26 wider than a conductor on a conductor which constitutes the surface circuit part of a non-contact IC inlet 110 having an IC chip 22 mounted connected to the counter electrodes and forming a notch broken line 28 by putting through the notch broken line forming terminal, the substrate, and the circuit part. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a non-contact IC tag used for personal authentication, merchandise management, logistics management, and the like.

  2. Description of the Related Art In recent years, non-contact IC tags that are attached to managed persons or products (adherents) and manage the distribution of these managed objects have become widespread. This IC tag can store data in a built-in IC chip, and can exchange data to be managed with an interrogator by communicating with the interrogator without contact.

  IC tags are used in a wide variety of fields, such as commuter pass tickets for various transportation facilities, entry / exit management at companies, etc., inventory management of goods, and logistics management. There are various types of IC tags according to these fields of use.

  For example, disposable IC tags are attached to merchandise and lined up in stores, and when the merchandise is sold, data stored in the IC chip is read by the interrogator, thereby completing the role of the IC tag.

  Since this disposable IC tag remains as it is, data stored in the IC chip remains, so management of data stored in the IC chip after use of the IC tag is important. For example, it is conceivable that an IC tag once attached to a product and used properly is removed from the product, data stored in the IC chip is read, and this data is used for unauthorized use. It is also possible to tamper with the stored data of the discarded IC tag and use it for unauthorized use.

  In order to prevent such unauthorized use, a method of disabling by generating an induced current in a resonance circuit that constitutes an IC tag using a terminator that generates a high output electric field is disclosed (Patent Document 1). In the case of this method, the resonance performance may be restored after the invalidation process. Furthermore, according to this method, there is a problem that it is not possible to visually confirm that it has expired.

In addition, by forming portions with different peel forces on the base material of the IC tag and separating the IC tag attached to the product from the product and collecting it, the electronic circuit of the IC tag is configured to be destroyed, A method for invalidating an IC tag has been proposed (Patent Document 2). In this proposal, since breakage occurs due to a difference in peeling force, stable control of the peeling force is important, and a process for forming a peeling layer is required, which increases the number of manufacturing steps.
JP 2002-185281 A (paragraph number 0002) JP 2000-57292 A (Claim 1)

  While various studies have been made to solve the above problems, the present inventors have formed notched broken lines (perforations) in advance in the electronic circuit portion that constitutes the IC tag. When the IC tag is revoked after use, the destruction of the electronic circuit of the IC tag surely proceeds along the formed notch broken line, and as a result, the IC tag can be reliably revoked. The formation can be incorporated into the process of cutting into individual tag sizes at the time of manufacture of the IC tag, and in this case, it is known that there is no need to add any special process, and a patent application has been filed. Application 2004-195949). In the present invention, there is an advantage that it is possible to further visually confirm that it is in a revoked state without requiring any special device for revocation.

  However, when forming a notched broken line, if the processing accuracy is low, the circuit may be destroyed. In such a case, the reliability of the IC tag is impaired.

  As a result of various studies to solve the above problems, the present inventors have formed a notch broken line forming terminal on the conductive wire of the electronic circuit forming the notched broken line, and formed a notched broken line on this terminal. As a result, it has been found that the processing accuracy required for forming the notched broken line can be remarkably eased, and that the formation of this terminal can be performed at the same time when the circuit is manufactured, and that no additional process is required.

  The present invention has been completed as a result of the above considerations. The purpose of the present invention is to simplify the manufacturing process, to ensure that it can be revoked during use, and to eliminate the need for special equipment. It is to provide an IC tag that can expire.

  The present invention which achieves the above object is described below.

  [1] Formed on a surface, a surface circuit portion comprising a base material, a planar coil circuit portion formed on the base material and at least a pair of counter electrodes connected to the planar coil circuit portion, and a conductive wire constituting the surface circuit portion At least one notched broken line forming terminal, and a notched broken line having at least one uncut portion passing through the base material and the surface circuit portion and passing through the notched broken line forming terminal. An antenna circuit comprising:

  [2] The lead wire on which the notched broken line forming terminal is formed is at least a pair of lead portions that connect each counter electrode and the planar coil circuit portion, and the notched broken line forming terminal is formed on the lead portion. In addition, the antenna circuit according to [1], wherein the notched broken line forming terminal is formed with a closed notched broken line having at least one uncut portion passing therethrough.

  [3] The antenna circuit according to [1] or [2], wherein the notched broken line forming terminal is formed in a shape having a dimension capable of including at least a circle having a diameter of 1 mm.

  [4] The antenna circuit according to any one of [1] to [3], wherein the notched broken line has a non-cut portion having a length of 0.08 to 1.5 mm.

  [5] An IC inlet, wherein an IC chip is connected to and mounted on the counter electrode of the antenna circuit according to any one of [1] to [4].

  [6] An IC tag, wherein an adhesive layer is formed on the surface circuit portion forming surface and / or the opposite surface of the substrate of the IC inlet according to [5].

  [7] The IC tag according to [6], wherein the adhesive layer is formed in a region other than the closed cut-out broken line formation region.

  [8] The IC tag according to [7], wherein an adhesive layer is formed on at least a part of the closed notch broken line formation region.

  [9] The IC according to [6], wherein an adhesive layer is formed in at least the planar circuit portion region of the substrate, and an adhesive layer is formed on at least a part of the peripheral edge of the remaining region of the substrate. tag.

  [10] The IC tag according to [9], wherein an adhesive layer is formed on at least a part of the closed cut-off line forming region of the substrate.

  [11] A surface protective layer is formed on the surface circuit portion forming surface and / or the opposite surface of the IC tag according to any one of [6] to [10], and the notched broken line penetrates the surface protective layer. IC tag.

  [12] The IC tag according to [11], wherein the surface protective layer has print compatibility.

  According to the present invention, the notched broken line forming terminal is formed in the circuit, and the notched broken line is formed in this terminal. Therefore, the processing accuracy when forming the notched broken line can be reduced. As a result, an IC tag can be manufactured with high mass productivity, and the obtained IC tag is highly reliable. Furthermore, when the adhesive layer is provided on the back surface of the IC tag, the IC tag can be more reliably expired after the IC tag is used by setting the application form of the adhesive layer to a predetermined configuration.

  The formation of notched broken lines can be avoided by increasing the number of processes by incorporating them into the process of cutting into individual tag sizes when manufacturing IC tags.

  With regard to the expiration of the IC tag of the present invention, since the absence of the area of the IC chip cut along the broken broken line can be visually confirmed, the presence or absence of the expiration can be easily and reliably determined.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Antenna circuit)
FIG. 1 is a plan view showing an example of an antenna circuit of the present invention.

  In FIG. 1, 100 is an antenna circuit, and 2 is a base material. This base material 2 functions as a support for holding a planar coil circuit section, an IC chip and the like which will be described later.

  As the substrate 2, paper such as high-quality paper and coated paper, a synthetic resin film, and the like are preferable. The resin material constituting the synthetic resin film is not particularly limited. Polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyester, polyvinyl acetate, polybutene, polyacrylic ester, polymethacrylic ester, polyacrylonitrile, polyimide, polycarbonate And polyamide, ethylene-vinyl acetate copolymer, polyvinyl acetal, polyethylene terephthalate, acrylonitrile-butadiene-styrene copolymer, and the like.

  10-200 micrometers is preferable and, as for the thickness of the base material 2, 25-125 micrometers is especially preferable.

  An external extraction electrode 4 is formed on one corner side of the substrate 2.

  Reference numeral 6 denotes a planar coil circuit portion which is formed in a rectangular spiral shape on one surface of the substrate 2, and the external extraction electrode 4 and the planar coil circuit portion 6 are formed apart from each other. One end inside the planar coil circuit portion 6 is connected to the internal extraction electrode 8.

  An insulating layer 10 is formed in the vicinity of the external extraction electrode 4 so as to cover the upper surface of the planar coil circuit portion 6. The internal extraction electrode 8 inside the planar coil circuit portion 6 and the external extraction electrode 4 are electrically connected by a jumper 12 formed on the upper surface of the insulating layer 10. However, the jumper 12 is insulated from the planar coil circuit unit 6 by the insulating layer 10.

  FIG. 2 shows a configuration of a circuit pattern before the insulating layer 10 and the jumper 12 are formed in FIG.

  One lead portion 14 connects the external extraction electrode 4 and one counter electrode 16.

  The other counter electrode 18 is formed at a predetermined distance from the one counter electrode 16.

  The other counter electrode 18 and the other end 19 outside the planar coil circuit portion 6 are connected by the other lead portion 20.

  The lead portions 14 and 20 are formed with a pair of notched broken line forming terminals 24 and 26 formed in a substantially fan shape. As shown in FIG. 2, the notched broken line forming terminals 24 and 26 have a width P larger than the line width of the lead portions 14 and 20, preferably 1 to 20 mm. Further, the length Q is preferably 1 mm or more, particularly 1 to 20 mm in consideration of processing accuracy and the like. These notched broken line forming terminals 24 and 26 are electrically connected to the pair of lead portions 14 and 20 so as to surround an IC chip 22 described later.

  In FIG. 1, reference numeral 28 denotes a notched broken line (perforation), which is formed in a substantially circular shape that passes through the pair of notched broken line forming terminals 24 and 26 and surrounds an IC chip described later. The IC chip 22 to be described later is separated from the other region 31 of the antenna circuit 100 by a closed region 30 formed by the cutout broken line 28 closed in a circle.

  The notch of the notched broken line 28 is formed so as to penetrate both the notched broken line forming terminals 24 and 26 and the substrate 2.

  This notched broken line 28 indicates that, in a mass production process, a plurality of antenna circuits are manufactured integrally and then the antenna circuit 100 is cut into each tag size, and at the same time, a perforated cutting blade is formed. It is preferable to form by using.

  As shown in FIG. 1, the lengths a and b of the notched broken lines passing through the notched broken line forming terminals 24 and 26 are each preferably 1 mm or more, and more preferably 1 to 20 mm. When the lengths a and b of the cut-out broken lines are less than 1 mm, the response sensitivity of the IC tag may be lowered.

  FIG. 3 is a partially enlarged view of the notched broken line 28. The notched broken line 28 includes a notched cut portion 32 (cut portion length X) and a non-cut portion 34 (non-cut portion length Y).

  The ratio of the non-cut portion length Y to the cut portion length X of the cut broken line 28 is preferably 1: 1 to 1:20, and more preferably 1: 2 to 1:15.

  The non-cut portion length Y of the notched broken line 28 is preferably 0.08 to 1.5 mm, more preferably 0.2 to 1 mm, and still more preferably 0.4 to 0.8 mm. When the non-cut portion length Y is less than 0.08 mm, it is difficult to form the non-cut portion 34 accurately, and the non-cut portion is easily broken. When the non-cut portion length Y exceeds 1.5 mm, the IC tag circuit may not be reliably destroyed during the IC tag revocation operation described later.

  In the present invention, the extraction electrodes 4 and 8, the planar coil circuit section 6, one counter electrode 16, the other counter electrode 18, the jumper 12, the lead sections 14 and 20, and the notched broken line forming terminals 24 and 26. Constitutes an electronic circuit, and these are hereinafter collectively referred to as a surface circuit portion.

  The surface circuit portion is formed on one surface of the substrate 2 with a conductive metal such as gold, silver, copper, or aluminum, or a conductive paste such as silver paste or conductive ink. As a method for manufacturing the surface circuit portion, a normal electronic method such as a method of manufacturing by screen printing using a conductive paste or conductive ink, or a method of forming a surface circuit pattern by etching using a resist or the like is used. Various methods for circuit manufacture can be arbitrarily adopted.

  As a method for producing a surface circuit portion using a resist, specifically, after printing a resist pattern for forming a surface circuit portion on a copper foil surface of a laminate film obtained by bonding a copper foil and a polyethylene terephthalate film, A method of removing the unnecessary copper foil portion to form the surface circuit portion by etching the copper foil portion can be mentioned.

  Further, unnecessary copper foil portions of part of the surface circuit portion, for example, the notched broken line forming terminals 24 and 26 may be removed by etching, and then these may be separately formed with silver paste or the like. In addition, 5-100 micrometers is preferable and, as for the thickness of a surface circuit part, 10-50 micrometers is especially preferable.

  In the present invention, as shown in FIG. 1, the substrate 2 and the surface circuit portion formed on at least one surface of the substrate 2 are collectively referred to as an antenna circuit 100. The antenna circuit 100 is before the IC chip 22 is mounted. As will be described later, when an IC chip is mounted on the antenna circuit 100, an IC inlet described below is obtained.

  In the above description, an example in which a pair of counter electrodes are formed has been described. Thus, the inductance of the coil may be arbitrarily selected, and a jumper may be formed on the opposite surface of the base material through a through hole formed in the base material. Surface circuits may be formed on both sides.

(IC inlet)
FIG. 5 is a plan view showing an example of the IC inlet 110, and an IC chip 22 is mounted between the opposing electrodes 16 and 18 of the antenna circuit 100 shown in FIG. The IC chip 22 and the opposing electrodes 16 and 18 are electrically connected.

  For mounting the IC chip 22, for example, an adhesive material such as anisotropic conductive adhesive (ACP) is applied or pasted to the counter electrode in the surface circuit portion, and the IC chip is provided with wire bumps and plating bumps so as to face each other in the surface circuit portion. Attach to the electrode. As a method for fixing the IC chip, for example, thermocompression bonding can be mentioned.

  Regardless of the above description, the configurations of the antenna circuit 100 and the IC inlet 110 may be variously changed without departing from the gist of the present invention. For example, the shape of the notched broken line forming terminals 24 and 26 is not particularly limited, and may be any shape such as a circle, a rectangle, a triangle, or an indefinite shape.

  The size of the notched broken line forming terminals 24 and 26 is not limited, but it is preferable to have a dimension capable of including at least a circle having a diameter of 1 mm in consideration of normal processing accuracy in the manufacturing process. Further, the number of notched broken line forming terminals is arbitrary, and at least one notched broken line forming terminal may be formed on an arbitrary conductive wire.

  The notched broken line is not necessarily a curved line, and may be configured by a straight line like the IC inlet 120 shown in FIG. FIG. 6 shows another example of the IC inlet of the present invention. In this example, a single rectangular notch broken line forming terminal 62 is formed only on the other lead portion 20, and the formed notched broken line forming terminal 62 is divided into two regions. The notch broken line 64 is formed.

  In the present invention, those obtained by further processing the IC inlet are collectively referred to as IC tags described below.

(IC tag of the first form)
FIG. 7 is a side sectional view showing an example of the IC tag according to the first embodiment. In FIG. 7, reference numeral 130 denotes an IC tag formed in a so-called label shape, which covers the substrate 2 of the IC inlet 110 shown in FIG. 5 and the surface circuit portion and the IC chip 22 formed on one surface 2A of the substrate 2. Thus, an adhesive layer 52 is formed. Further, a release material 54 is detachably attached to the upper surface of the adhesive layer 52.

  In the present invention, the adhesive is a concept including a normal adhesive and a pressure-sensitive adhesive.

  As an adhesive used for the adhesive layer 52, a known adhesive can be used without limitation. Specific examples include acrylic adhesives, urethane adhesives, natural rubber and synthetic rubber adhesives, silicone resin adhesives, polyolefin adhesives, polyester adhesives, ethylene-vinyl acetate adhesives, etc. it can.

  As the adhesive layer 52, a double-sided tape in which an intermediate substrate (not shown) is used as a core and an adhesive is provided on both surfaces of the intermediate substrate can be used. As the intermediate substrate, those used in the substrate 2 can be used. As the adhesive, the adhesive used in the adhesive layer 52 can be used. In this case, it is preferable to form the notched broken line 28 after laminating the adhesive layer 52 on the IC inlet. The notched broken line 28 needs to penetrate through the intermediate base material.

The adhesive layer 52 is formed by applying an adhesive on the release treatment surface of the release material 54 and bonding the adhesive layer 52 to the formation surface (one surface 2A) of the surface circuit portion of the substrate 2. Illustrated. The coating amount of the adhesive is preferably ^{5~100g / m 2, 5~50g / m} 2 is particularly preferred.

  Any material may be used as the release material 54. For example, films made of various resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene, polypropylene, polyarylate, polyethylene laminated paper, polypropylene laminated paper, clay coat Various paper materials such as paper, resin-coated paper, glassine paper and the like can be used as the base material, and the surface of the base material bonded to the adhesive layer can be peeled off if necessary. In this case, examples of the release treatment include formation of a release agent layer made of a release agent such as a silicone resin, a long-chain alkyl resin, or a fluorine resin. The thickness of the release material is not particularly limited and may be appropriately selected.

  As a method of applying the adhesive to the release material 54, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a curtain coater, a die coater, a knife coater, a screen coater, a Mayer bar coater, a kiss coater, etc. The method of drying is mentioned.

  Next, a method of using the IC tag will be described using the IC tag 130 shown in FIG. 7 as an example.

  First, the release material 54 of the IC tag 130 is peeled off from the adhesive layer 52, and this IC tag is attached to an adherend (not shown) that is a data management object. After the adherend circulates in this state, the data of the IC chip 22 is referred to and predetermined data management is performed. As a result, the role of the IC tag 130 regarding data management ends.

  Thereafter, the IC tag attached to the adherend is peeled off and discarded from the adherend. In this case, since the notch broken line 28 is formed in advance in the IC tag, the base material 2, the lead parts 14 and 20, and the both notched broken line forming terminals 24 along the notched broken line surrounding the IC chip 22. 26 are cut, and the closed region 30 including the IC chip is left on the adherend. As a result, the electronic circuit formed on the substrate 2 is destroyed, and the IC tag is reliably expired.

  Since the closed region 30 including the IC chip left on the adherend is small, it is practically impossible to restore the electronic circuit even if the closed region 30 is pasted to the original IC tag again. Therefore, the revocation operation is executed reliably and cannot be restored.

  In the above usage method, the part other than the IC chip is peeled off from the adherend, and the closed region 30 including the IC chip is left on the adherend, but the present invention is not limited to this. That is, the closed region 30 including the IC chip may be cut along the broken line 28 and peeled off from the adherend. In this case, since the IC chip remains at hand, there is no possibility that data in the IC chip is tampered with by others, and safety is improved.

  The method of using an IC tag manufactured using the IC inlet 120 shown in FIG. 6 is the same as described above. However, in this case, since the IC chip 22 is not included in the closed region 30a formed by the notched broken line 64, the IC chip 22 moves together with the base material.

  FIG. 8 shows still another example of the IC tag of the present invention. In the example of the IC tag 140, the adhesive layer 72 whose region is indicated by a dashed line 71 is formed only in the vicinity of the planar coil circuit portion 6 among the surface circuit portions formed on one surface of the substrate 2. It is not formed around the IC chip 22. By adopting a configuration in which the adhesive layer 72 is formed in the vicinity of the planar coil circuit portion in this way, the IC chip 22 can be easily recovered. In addition, 74 is a notch broken line, and other reference symbols indicate the same parts as described above.

  FIG. 9 shows still another example of the IC tag of the present invention. In the IC tag 150 of this example, the adhesive layer 82 whose area is indicated by a dashed line 81 is formed in the vicinity of the planar coil circuit portion 6, and at least partially around the IC chip 22, that is, An adhesive layer is formed partially (in FIG. 9, a plurality of strip-shaped adhesive layers 84 are formed). The shape of the partially formed adhesive layer is not particularly limited, and any shape such as a dot shape, a lattice shape, or a linear shape can be adopted. The ratio between the part where the adhesive layer is formed and the part where the adhesive layer is not formed is not particularly limited, and an arbitrary ratio can be adopted. Thus, the IC chip 22 can be easily recovered by partially forming the adhesive layer 84 and keeping the IC chip temporarily attached to the adherend with an adhesive force weaker than the others.

  FIG. 10 shows still another example of the IC tag of the present invention. In the IC tag 160 of this example, the adhesive layer 102 whose region is indicated by the one-dot broken line 101 is formed in the vicinity of the planar coil circuit portion 6, and includes the IC chip 22, the lead portions 14 and 20, and the notched broken line. Edge adhesive layers 104 and 106 are formed along the width direction edge on the base material 2 on the forming terminals 24 and 26 side. By partially forming the edge adhesive layers 104 and 106 in this way, the IC chip can be easily recovered.

  FIG. 11 shows still another example of the IC tag of the present invention. In the IC tag 170 of this example, the adhesive layer 112 whose region is indicated by a dashed line 111 is formed in the vicinity of the planar coil circuit portion 6. On the other hand, in the vicinity of the IC chip, two belt-like adhesive layers 184 and 184 are formed with the IC chip 22 interposed therebetween, and further, the IC chip 22, the lead portions 14 and 20, and the notched broken line forming terminal 24. , 26 are formed, edge adhesive layers 114 and 116 and an end side adhesive layer 118 are formed. By partially forming the adhesive layer in this manner, when the IC tag is peeled off from the adherend, the IC chip can be left temporarily attached to the adherend. It can be easily recovered.

  FIG. 12 shows still another example of the adhesive layer formed on the IC tag of the present invention. In the IC tag 180 shown in this example, the adhesive layer is not formed in the closed region 30 to which the IC chip is attached, and is the surface to which the IC chip is attached. An adhesive layer 122 is formed in the region. Thus, by partially forming the adhesive layer, the IC chip (not shown) in the closed region 30 can be easily recovered.

  FIG. 13 shows still another example of the adhesive layer formed on the IC tag of the present invention. In the IC tag 190 of this example, two belt-like adhesive layers 284 and 284 are formed in the closed region 30 to which the IC chip is attached, and the adhesive is formed in a region other than the closed region 30. Layer 132 is formed. By partially forming the adhesive layer in this way, the IC chip (not shown) in the closed region 30 can be left temporarily attached to the adherend, and the IC chip can be easily recovered. can do.

  FIG. 14 shows still another example of the IC tag of the first form. In this example, the surface circuit portion 6 is formed, and the adhesive layer 74 is formed on the other surface 2B which is the opposite surface to the one surface of the substrate 2 on which the IC chip 22 is mounted. 75 is a release material adhered to the adhesive layer 74, 76 is an adhesive layer formed on the one surface 2 </ b> A side of the substrate 2, and 78 is a surface protective layer laminated on the adhesive layer 74. The materials of the adhesive layers 74 and 76 and the release material 75 are the same as described above.

  For the surface protective layer 78, the same paper, resin film, resin sheet and the like as the substrate 2 are used.

  The surface protective layer is preferably a substrate having print compatibility. Alternatively, the surface of the surface protective layer may be subjected to a print matching process. Examples of the print adaptation process include a process in which an ink receiving layer is formed. The ink receiving layer itself is formed by a known method.

  The notched broken line needs to penetrate the surface protective layer.

  The formation pattern of the adhesive layer 74 may be the pattern described with reference to FIGS.

(IC tag of the second form)
The IC tag of the present invention can be further configured as described below.

  In other words, in the second embodiment, the IC inlet is housed in a bag-like surface protective layer and has a so-called card shape. In this embodiment, unlike the first embodiment, the adhesive layer may not be provided.

  FIG. 15 shows an IC tag of the second form. In this example, the IC tag is formed in the form of an IC card.

  In an IC tag 200 of the second form, an IC inlet 110 shown in FIG. 5 is sealed between two surface base materials 92 and 94. The surface base material 92, the IC inlet 110, and the surface base material 94 are formed with a circular notch broken line 98 penetrating them. As the surface base materials 92 and 94, those similar to the base material 2 can be used.

  This IC card can be revoked by pressing it along the broken line 98 of the IC card.

  Also in this embodiment, since the shape of the broken line and others are the same as those in the first embodiment, the same parts are denoted by the same reference numerals and the description thereof is omitted.

  FIG. 16 shows another example of the IC tag of the second form. In this example, an IC tag 210 in the shape of an IC card is configured using the IC inlet 110 shown in FIG.

  Both surfaces of the IC inlet 110 are embedded in a resin layer 204 and formed into a card shape. This resin layer 204 functions as a surface protective layer of the inlet 110.

  The resin layer 204 is preferably formed by injection molding. The injection molding conditions themselves are known. The resin used for the resin layer 204 is preferably polyethylene terephthalate, polycarbonate, polyacrylonitrile-butadiene, polyethylene, polypropylene, or the like.

  The notched broken line 99 is formed in a cylindrical shape penetrating the resin layer 204, the notched broken line forming terminals 24 and 26 (not shown), and the base material 2.

Example 1
The IC inlet shown in FIG. 5 was manufactured, and further, the IC tag shown in FIG. 7 was manufactured by the method described below using this IC inlet.

  First, a product name Nikaflex (Cu / PET = 35 μm / 50 μm, manufactured by Nikkan Kogyo Co., Ltd.) obtained by bonding a copper foil and a polyethylene terephthalate film (PET) to the external extraction electrode 4, the planar coil circuit unit 6, the A resist pattern for forming the extraction electrode 8, the counter electrodes 16 and 18, the lead portions 14 and 20, and the notched broken line forming terminals 24 and 26 was printed. By etching this, unnecessary copper foil portions were removed to produce an integrated wiring pattern shown in FIG.

  The line width of the circuit was 0.2 mm.

  Next, an insulating layer 10 was formed between the extraction electrode 4 and the internal extraction electrode 8 so as to cover the planar coil circuit portion 6 using an insulating resist ink (ML25089 manufactured by Nippon Atson Co., Ltd.). Further, the extraction electrode 4 and the internal extraction electrode 8 were connected by a jumper 12 using a silver paste (DW250L-1 manufactured by Toyobo Co., Ltd.). The insulating layer 10 and the jumper 12 were formed using a screen printing method.

  An RFID-IC chip (manufactured by Philips, ICode) was mounted on the fabricated circuit. For the mounting, a flip chip mounting machine (manufactured by Kyushu Matsushita, FB30T-M) was used. An anisotropic conductive adhesive (manufactured by Kyocera Chemical Co., TAP0402E) was used as the adhesive material, and thermocompression bonded under the conditions of 220 ° C., 1.96 N (200 gf), 7 seconds to form an IC inlet.

Thereafter, an acrylic adhesive (PA-T1 manufactured by Lintec) was applied to the release-treated surface of the release material (SP-8KX, 80 μm thick by Lintec Co., Ltd., in which a silicone resin was applied to glassine paper). An IC tag was prepared by pasting the one coated with a screen coater so as to be m ² to the entire circuit forming surface of the substrate 2 on which the circuit was formed. The IC tag was produced in a continuous process, and a 20 m roll comprising 500 IC tags having a size of 35 × 75 mm was produced.

Operation Confirmation Method Operation confirmation of the manufactured IC tag was performed by a Read / Write test using an I Code evaluation kit SLEV400 manufactured by Philips.

  When cutting a large number of the manufactured circuits to the tag size, a notched broken line 28 having a diameter of 17 mm was formed simultaneously with cutting by using a spring blade with notched broken line perforations. In this way, 20 IC tags were produced. The notched broken line forming terminals 24 and 26 forming the notched broken line 28 have a length of 4 mm (corresponding to Q in FIG. 2), and the notched broken line formed on each of the notched broken line forming terminals 24 and 26. The length (corresponding to a and b in FIG. 1) was 13 mm each.

  The notched broken line 28 was a non-cut portion 34 length Y: a notch cut portion 32 length X = 1: 3, and a non-cut portion length Y was 0.5 mm.

  The notched broken line forming terminals 24 and 26 have low processing accuracy when the perforation is made, and even when the perforated line moves 0.5 mm in an arbitrary plane direction, the notched broken line is surely formed by the notched broken line forming terminal. It is a size that can fit all within the terminal. In fact, it was possible to form notched broken lines in the terminals for all tags. After laminating the adhesive layer 52 and the release material 54 on the substrate 2, the operation of the obtained IC tag as an RFID circuit was confirmed using SLEV 400.

  The release material of the IC tag was peeled off, and the adhesive layer 52 was attached to a polypropylene resin plate. When the IC tag was peeled off from the resin plate after 24 hours, 20 IC tags were cut out along the broken line, and the circuit was physically destroyed.

Example 2
Twenty IC tags were produced in the same manner as in Example 1 except that the notched broken line forming terminals 24 and 26 were formed using silver paste. The notched broken line forming terminals 24 and 26 made of this silver paste were formed by screen printing at the same time as the jumper 12 was produced. After mounting the IC chip and confirming the RFID function in the same manner as in Example 1, the IC tag was attached to the polypropylene resin plate. When the IC tag was peeled off from the resin plate after 24 hours, 20 IC tags were cut out along the broken line, the circuit was physically destroyed, and the RFID function was invalidated.

Example 3
Twenty IC tags were produced by the same method as in Example 1. However, as shown in FIG. 6, a quadrilateral notched broken line forming terminal 62 having a length of 10 mm and a width of 15 mm is formed in the lead portion 20, and the formed notched broken line forming terminal 62 is divided into two by 15 mm in length. A closed quadrilateral cutaway line 64 having a width of 5 mm was formed. The four notched broken lines constituting each side of the quadrilateral notched broken line 64 are linearly formed as shown in FIG. 4, and the uncut portion 34 length Y: the cut portion 32 length X = 1: 2 and the non-cut portion 34 length Y was 0.5 mm.

  In the same manner as in Example 1, an acrylic adhesive applied to the release treatment surface of the release material with a screen coater was bonded to the entire surface of the substrate 2 on which the circuit was formed.

  After confirming the RF-ID function, this IC tag was attached to a polypropylene resin plate. When the IC tag was peeled off from the resin plate after 24 hours, 20 IC tags were cut out along the broken line, and the circuit was physically destroyed.

Example 4
Twenty IC tags were produced in the same manner as in Example 1. In the same manner as in Example 1, an adhesive layer 72 was formed with a screen coater using an acrylic adhesive and a release material, and then bonded to the substrate 2. However, as shown in FIG. 8, the adhesive layer 72 is formed only on the planar coil circuit portion 6 forming side, and the adhesive layer is formed on the IC chip 22, lead portions 14, 20 and notched broken line forming terminals 24, 26 side. Did not form.

  After confirming the RFID function, an IC tag was attached to a polypropylene resin plate. When the IC chip portion was pressed with a finger after 24 hours, the IC chip was cut along the broken line, and all 20 IC chips were easily collected. The circuit was physically destroyed and the RFID function was revoked.

Example 5
Twenty IC tags were produced by the same method as in Example 1. However, as shown in FIG. 9, an adhesive layer 82 was formed on the entire surface where the planar coil circuit portion 6 was formed. Further, three strip adhesive layers 84 having a width of 5 mm and a length of 15 mm were formed around the IC chip 22 with an interval of 2 mm. The adhesive layer 82 and the belt-like adhesive layer 84 were simultaneously formed with a screen coater using the same acrylic adhesive and release material as in Example 1. After confirming the RFID function, this IC tag was attached to a polypropylene resin plate. When the IC tag was peeled off from the resin plate after 24 hours, the base material 2 was easily cut along the broken line, and the IC chip remained temporarily fixed to the resin plate. The temporarily fixed IC chip could be easily removed, and all 20 IC chips were easily recovered. The circuit was physically destroyed and the RFID function was revoked.

Example 6
Twenty IC tags were produced by the same method as in Example 1. However, as shown in FIG. 10, an adhesive layer 102 was formed on the entire surface of the planar coil circuit portion 6. Further, the substrate 2 on the side of the IC chip 22, the lead portions 14 and 20, and the cut-out broken line forming terminal side has two rectangular (width 5 mm, length 15 mm) edge portions along the width direction edge portion of the substrate 2. Adhesive layers 104 and 106 were formed. The adhesive layer 102 and the edge adhesive layers 104 and 106 were formed simultaneously with a screen coater using the same acrylic adhesive and release material as in Example 1.

  After confirming the RFID function, this IC tag was attached to a polypropylene resin plate. After 24 hours, the IC tag was peeled off from the resin plate while pressing the IC chip part with a finger. As a result, the IC tag was easily cut along the broken broken line, and all 20 IC chips were easily collected. The circuit was physically destroyed and the RFID function was revoked.

Example 7
Twenty IC tags were produced by the same method as in Example 1. However, as shown in FIG. 11, an adhesive layer 112 was formed on the entire surface of the planar coil circuit portion 6. Further, the substrate 2 on the side of the IC chip 22, the lead portions 14 and 20, and the cut-out broken line forming terminal side has two rectangular (width 5 mm, length 15 mm) edge portions along the width direction edge portion of the substrate 2. Adhesive layers 114 and 116 were formed. Further, an end-side adhesive layer 118 having a rectangular shape (width 5 mm, length 15 mm) was formed on the end portion side in the length direction of the substrate 2. Further, two strip adhesive layers 184 and 184 having a width of 5 mm and a length of 15 mm were formed with the IC chip 22 interposed therebetween.

  The adhesive layer 112, the edge adhesive layers 114 and 116, the end side adhesive layer 118, and the two strip adhesive layers 184 and 184 are formed using the same acrylic adhesive and release material as in Example 1. And formed simultaneously with a screen coater.

  After confirming the RFID function, this IC tag was attached to a polypropylene resin plate. When the IC tag was peeled off from the resin plate after 24 hours, the substrate 2 was easily cut along the broken line, and the IC chip remained temporarily fixed to the resin plate. The temporarily fixed IC chip could be easily removed, and all 20 IC chips were easily recovered. The circuit was physically destroyed and the RFID function was revoked.

Example 8
Twenty IC tags were produced by the same method as in Example 1. In the same manner as in Example 1, the adhesive layer 122 was formed with a screen coater using an acrylic adhesive and a release material, and then bonded to the substrate 2. FIG. 12 shows the formed adhesive layer 122. However, the adhesive layer was not formed in the closed notch broken line formation region (closed region 30).

  After confirming the RFID function, this IC tag was attached to a polypropylene resin plate. After 24 hours, the IC tag was peeled from the resin plate, and when the IC chip portion was pressed with a finger, it was cut along the broken line, and all 20 IC chips were easily recovered. The circuit was physically destroyed and the RFID function was revoked.

Example 9
Twenty IC tags were produced by the same method as in Example 1. In the same manner as in Example 1, an adhesive layer 132 was formed. However, as shown in FIG. 13, in the closed notch broken line formation region (closed region 30), two band-like adhesive layers 284 having a width of 5 mm and a length of 15 mm are formed with the IC chip interposed therebetween. Did not form an adhesive layer.

  The adhesive layer 132 and the two strip adhesive layers 284 were formed by using the same acrylic adhesive and release material as in Example 1 and simultaneously forming them using a screen coater.

  After confirming the RFID function, this IC tag was attached to a polypropylene resin plate. When the IC tag was peeled off from the resin plate after 24 hours, the substrate 2 was easily cut along the broken line, and the IC chip remained temporarily fixed to the resin plate. The temporarily fixed IC chip could be easily removed, and all 20 IC chips were easily recovered. The circuit was physically destroyed and the RFID function was revoked.

Example 10
Twenty IC tags without an adhesive layer were produced in the same manner as in Example 1 except that no adhesive layer was formed. Using a hot-melt agent (hot melt adhesive), a white polyethylene terephthalate film (thickness 125 μm) was bonded to both sides of the IC tag with a hot press to obtain an IC card. Thereafter, as in Example 1, when cutting and separating into 20 cards, a broken line 98 was formed in the vicinity of the IC chip to produce the IC card shown in FIG. The formed notched broken line 98 penetrates the notched broken line forming terminal, the base material, the polyethylene terephthalate film, and the like.

  After confirming that the operation of the 20 IC cards was normal, the IC card was cut along the broken broken line to destroy the circuit. When the operation of the destroyed card was confirmed, physical destruction was found in all 20 IC cards, and the function of the IC card was invalidated.

Example 11
The IC inlet shown in FIG. 5 was manufactured in the same manner as in Example 1. However, notched broken lines were not formed. On the other hand, an acrylic adhesive (PA-T1 manufactured by Lintec Co., Ltd.) was applied to the release treated surface of a release material (SP-8KX, 80 μm thick manufactured by Lintec Co., Ltd. in which a silicone resin was applied to glassine paper). It was prepared which was applied by screen coater such that m ^2. The prepared pressure-sensitive adhesive layer was bonded to the entire surface of the IC inlet base material opposite to the circuit forming surface.

An acrylic adhesive (PA-T1 manufactured by Lintec Co., Ltd.) was applied to the back surface of a white polyethylene terephthalate film (Chrisper K2411 manufactured by Toyobo Co., Ltd., 50 μm thick) so that the coating amount after drying was 25 g / m ² . Next, this crisper K2411 was bonded to the entire circuit forming surface of the base material to form a surface protective layer. After that, surrounding the IC chip, a notch broken line similar to the example is formed from the surface protective layer side through the surface protective layer, the notched broken line forming terminal, the base material, and the release material, as shown in FIG. An IC tag was obtained.

  This IC tag was able to print the production number and the like on the surface protective layer.

Comparative Example 1
Twenty IC tags were produced in the same manner as in Example 1 except that notched broken lines were not formed. After confirming the operation as an RFID circuit using SLEV400, it was attached to a polypropylene resin plate. After peeling off from the resin plate after 24 hours, all 19 circuits could be peeled without breaking. When the operation as an RFID circuit was confirmed by SLEV400, 19 units normally operated. One of them had a circuit breakage, which was thought to be due to an excessively strong adhesion to the polypropylene resin plate. From the above, it was found that the IC tag of Comparative Example 1 has insufficient revocation effect.

Comparative Example 2
Twenty IC tags were produced in the same manner as in Example 1. However, notched broken lines were formed in the same manner as in Example 1 without forming notched broken line forming terminals.

  In the 17 IC tags, when the notched broken line formation perforation was made, the lead portion was cut by the spring used, and the IC tag did not operate. In the remaining three IC tags, the lead portion of the IC tag was partially cut by the mainspring blade, and the communication distance was remarkably reduced, but it could be used as an RFID circuit. When these three IC tags were affixed to a polypropylene resin plate and then peeled, circuit destruction was observed.

It is a top view which shows an example of a structure of the antenna circuit of this invention. It is explanatory drawing of the manufacturing process of the antenna circuit of FIG. It is an enlarged view which shows an example of a notch broken line. It is explanatory drawing which shows the other example of a notch broken line. It is a top view which shows an example of the IC inlet of this invention. It is a top view which shows the other example of IC inlet of this invention. It is side surface sectional drawing which shows an example of the IC tag of this invention. It is a top view which shows the other example of the IC tag of this invention. It is a top view which shows other example of the IC tag of this invention. It is a top view which shows the further another example of the IC tag of this invention. It is a top view which shows the further another example of the IC tag of this invention. It is a back view which shows an example of the formation part of the adhesive bond layer of the IC tag of this invention. It is a back view which shows the other example of the formation part of the adhesive bond layer of the IC tag of this invention. It is a top view which shows the other example of the IC tag of this invention. It is a side view which shows an example of the different form of the IC tag of this invention. It is a side view which shows the other example of a different form of the IC tag of this invention.

Explanation of symbols

2 Substrate 2A One surface 2B Other surface 4 External extraction electrode 6 Planar coil circuit portion 8 Internal extraction electrode 10 Insulating layer 12 Jumper 14 One lead portion 16 One counter electrode 18 The other counter electrode 19 The other outer end 20 The other lead Part 22 IC chip 24, 26, 62 Notched broken line forming terminal P Width Q Length 28, 64, 74, 98, 99 Notched broken line 30, 30a Closed area 31 Other area 32 Notched cut part 34 Uncut part X cutting section length Y non-cutting section length 71, 81, 101, 111 one-dot broken line a, b notched broken line length 54, 75 release material 78 surface protective layer 52, 72, 74, 76, 82, 102, 112, 122, 132 Adhesive layer 84, 184, 284 Strip adhesive layer 92, 94 Surface substrate 104, 106, 114, 116 Edge adhesive layer 118 End side adhesive layer 100 Antenna circuit 110, 120 IC inlet 130, 140, 150, 160, 170, 180, 190, 200, 210, 220 IC tag 204 Resin layer

Claims (12)

A surface circuit portion composed of a base material, a planar coil circuit portion formed on the base material and at least a pair of counter electrodes connected to the planar coil circuit portion, and at least formed on a conductive wire constituting the surface circuit portion A notched broken line forming terminal, and a notched broken line having at least one uncut portion passing through the base material and the surface circuit portion and passing through the notched broken line forming terminal. An antenna circuit characterized by that. The conducting wire in which the notched broken line forming terminal is formed is at least a pair of lead parts connecting each counter electrode and the planar coil circuit part, and the notched broken line forming terminal is formed in the lead part, 2. The antenna circuit according to claim 1, wherein the notched broken line forming terminal is formed with a closed notched broken line having at least one uncut portion passing therethrough. The antenna circuit according to claim 1 or 2, wherein the notched broken line forming terminal is formed in a shape having a dimension capable of including at least a circle having a diameter of 1 mm. The antenna circuit according to any one of claims 1 to 3, wherein the notched broken line has an uncut portion having a length of 0.08 to 1.5 mm. An IC inlet, wherein an IC chip is connected to and mounted on the counter electrode of the antenna circuit according to claim 1. 6. An IC tag, wherein an adhesive layer is formed on the surface circuit portion forming surface of the substrate of the IC inlet according to claim 5 and / or the opposite surface thereof. The IC tag according to claim 6, wherein the adhesive layer is formed in a region other than a closed cut-out broken line formation region. The IC tag according to claim 7, wherein an adhesive layer is formed on at least a part of the closed notch broken line formation region. The IC tag according to claim 6, wherein an adhesive layer is formed on at least the planar circuit portion region of the substrate, and an adhesive layer is formed on at least a part of the peripheral portion of the remaining region of the substrate. The IC tag according to claim 9, wherein an adhesive layer is formed on at least a part of a closed notch broken line forming region of the substrate. 11. The IC tag according to claim 6, wherein a surface protective layer is formed on the surface circuit portion forming surface of the IC tag according to claim 6 and / or the opposite surface, and the notched broken line penetrates the surface protective layer. The IC tag according to claim 11, wherein the surface protective layer has print compatibility.

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