JP2006098180A - Manufacturing method for electronic clinical thermometer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic clinical thermometer allowing manufacturing without disconnecting a lead wire, and preventing effectively heat from being lost from a thermistor to the lead wire. <P>SOLUTION: An outer case 5, an inner case 4 and an intermediate member 3 are molded integrally to form a main body case 2 having a probe part 20a, a circuit component is mounted on a circuit board 6, the lead wire 12 is thereafter connected to the thermistor 11, and the lead wire 12 is connected to the circuit board 6. A liquid crystal display, an operation switch and a battery spring are assembled inside the main body case 2, the lead wire 12 is projected by a projection length L3 (longer than a cavity length l1) from an insertion through passage 3b of the probe part 20a to draw out the thermistor 11 and the lead wire 12, a semi-spherical part 13a of a sensor cap 13 is thereafter filled with an adhesive 18, and the sensor cap 13 is attached to the prove part 20a. A lower case 9 is attached to the main body case 2, and a battery 19 and a battery lid 10 are attached. The lead wire 12 is deformed (buckled) in the vicinity of the thermistor 11 to contact with an inner wall 13d of the sensor cap 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electronic thermometer.

  Electronic thermometers that are currently widely used are powered by a button-type battery, and a probe is brought into contact with the armpit or sublingual tongue, and changes in resistance of a temperature sensing element (thermistor) placed therein are detected and converted into temperature values. And what displays a body temperature on a liquid crystal display part is common. These electronic thermometers incorporate a power battery, a measurement circuit, a liquid crystal display device, operation switches, and the like in a case made of synthetic resin. A probe is formed at one end of the body of the electronic thermometer, and the probe has a probe body in which an insertion passage through which a lead wire connected to the thermistor is inserted, and a sensor cap attached to the probe body. The thermistor is placed in contact with the inner wall of the sensor cap and filled with an adhesive and held. An electronic thermometer configured as described above has been proposed. (For example, see Patent Document 1, Patent Document 2, and Patent Document 3)

  As shown in FIG. 13, the electronic thermometer disclosed in Patent Literature 1 includes a probe main body 32 and a sensor cap 33 having a hollow end fixed to the probe main body 32. The sensor cap 33 has a heat contact surface 33a and a cavity 33b surrounded by the heat contact surface 33a. The thermistor 34 is fixed to the position of the inner tip 33 c of the thermal contact surface 33 a of the sensor cap 33. A set of lead wires 35 connects to the thermistor 34 and transmits a temperature signal. A part 35 a of the lead wire 35 is fixed inside the thermal contact surface 33 a of the sensor cap 33. The lead wire 35 in the vicinity of the thermistor 34 is not in contact with the inner wall 33 c of the sensor cap 33. An intermediate portion away from the thermistor 34 is in close contact with the thermal contact surface 33 a of the sensor cap 33.

  As shown in FIGS. 14 and 15, the electronic thermometer disclosed in Patent Document 2 described above has a thermistor 42 and a lead wire 43 disposed inside the sensor cap 41. The thermistor 42 is fixed to the inner wall of the tip of the sensor cap 41 with an adhesive 44. One end of the lead wire 43 is connected to the thermistor 42, and the other end is connected to an IC (not shown) in the case outside the electronic thermometer. The sensor cap 41 is filled with a heat insulator 45 that is difficult to transmit heat, and the thermistor 42 and the lead wire 43 are firmly fixed in the sensor cap 41. As described above, by filling the sensor cap with the heat insulator, the entire lead wire in the sensor cap including the vicinity of the thermistor is in close contact with the inner wall of the sensor cap cavity.

Patent Document 3 discloses two electronic thermometers. One of them is shown in FIGS. 16 and 17, in which a lead wire 53 connected to a thermistor 52 is locked to the tip of a probe 51 that houses a circuit board 50 on which circuit components for temperature measurement are mounted. A locking claw 51 a for positioning at the center position is formed, and the locking claw 51 a is integrally formed with the probe 51. The locking claw 51 a is formed so that the thermistor 52 contacts the inner bottom surface of the sensor cap 54 when the sensor cap 54 is fitted to the probe 51. The thermistor 52 is connected to the lead wire, and is fixed to the inner bottom surface of the sensor cap 54 with an adhesive 56. 57 is a battery, and 55 is a battery cover.
The other is shown in FIG. 18 and has the same configuration as the electronic thermometer shown in FIGS. 16 and 17 except that the lead wire 53 of the thermistor 52 is not locked in the sensor cap 54. is there.

Patent Document 3 describes these manufacturing methods.
When assembling the electronic thermometer shown in FIGS. 16 and 17, first, the lead wire 53 of the thermistor 52 is connected to the circuit of the circuit board 50. Next, with the battery 54 and battery cover 55 located behind the probe 51 removed, the thermistor 42 and the circuit board 50 are inserted from the rear of the probe 51, and the lead wire 53 of the thermistor 52 that appears in front of the probe 51 is inserted. Lock to the locking claw 51a. Then, the front of the probe 51 is fixed to a sensor cap 54 containing a small amount of adhesive 56. The probe 51 and the sensor cap 54 are fixed by an adhesive 56. The thermistor 52 is fixed in contact with the inner bottom surface of the sensor cap 53.

In the electronic thermometer shown in FIG. 18, after connecting the lead wire 53 of the thermistor 52 to the circuit board 50, these are inserted from the back of the probe 51. The thermistor 52 is fixed by an adhesive 56 so as to contact the inner wall surface of the sensor cap 54.
Utility Model Registration No. 3096508 (page 9, FIG. 3) Utility Model Registration No. 3094041 (Pages 5-6, FIGS. 3 and 4) Japanese Utility Model Publication No. 62-170537 (pages 1 to 4, FIGS. 1 to 3)

  In the electronic thermometer described in Patent Document 1, since the lead wire in the vicinity of the thermistor is not in contact with the sensor cap, the heat of the thermistor escapes to the lead wire not in contact, the temperature rise is slow, and the measurement time is long. There was a problem of becoming longer.

  In the electronic thermometer described in Patent Document 2, the thermistor to which the lead wire is connected is fixed to the inner wall of the tip portion of the sensor cap with an adhesive, and then the heat insulator is put into the sensor cap. If the heat insulator is inserted in a state where the lead wire is free, the lead wire is pressed against the inner wall of the sensor cap by the outer surface of the heat insulator, and the lead wire is dragged into the sensor cap more than necessary while being dragged. When the lead wire protruding outside the sensor cap is fixed and the insulation is inserted so that the lead wire is not pulled into the sensor cap, tension is generated in the lead wire, and at least one of the fixed parts from the thermistor There was a risk of stress concentration on the part and the lead wire breaking.

  Furthermore, the structure and manufacturing method of the electronic thermometer described in Patent Document 3 described above has a problem that the lead wire cannot be brought into close contact with the inner wall of the sensor cap, and a desired high-speed electronic thermometer cannot be manufactured.

  The present invention eliminates the above-described drawbacks, and an object of the present invention is to provide a method for manufacturing an electronic thermometer that can be manufactured without disconnecting the lead wire and effectively prevents heat dissipation from the thermistor to the lead wire. It is to provide.

In order to achieve the above object, a method of manufacturing an electronic thermometer according to the present invention includes a temperature sensing element, a lead wire connected to the temperature sensing element, and a probe portion in which an insertion passage through which the lead wire is inserted is formed. A main body case, a circuit board to which the lead wire is connected, a sensor cap having a cavity with one end opened and the other end closed, and a lead wire protruding from the insertion path, In the method of manufacturing an electronic thermometer in which the temperature sensitive element is housed in the sensor cap, the step of attaching the temperature sensitive element to the lead wire, the step of connecting the lead wire to the circuit board, and the circuit board In the main body case, and after the lead wire protrudes from the insertion passage of the probe portion, the sensor key is attached to the tip of the lead wire. And attaching the sensor cap to the probe portion, and the lead wire in the vicinity of the temperature sensing element comes into contact with the inner wall of the cavity by attaching the sensor cap. It is characterized in that the length is set so as to obtain.

  In addition, the method includes a step of filling an adhesive in the vicinity of the closed end in the sensor cap.

  Further, the step of filling the adhesive is performed before the sensor cap is attached to the probe portion.

  Further, in the step of filling the adhesive, the adhesive is filled in an amount for fixing only the temperature sensitive element and the lead wire in the vicinity of the temperature sensitive element.

  Further, in the step of attaching the sensor cap to the probe portion, the temperature sensing element is configured to rotate when the inner wall of the closed end of the cavity is pressed against the temperature sensing element. Is.

  Further, the step of attaching the sensor cap to the probe portion is performed in a state where at least a part other than the protruding part of the lead wire is fixed.

  Further, the cavity is characterized in that the tip with which the temperature sensing element abuts is formed in a substantially hemispherical shape or a substantially semi-elliptical spherical shape.

  The electronic thermometer manufacturing method of the present invention can be manufactured without disconnecting the lead wire, and an electronic thermometer that effectively prevents heat dissipation from the thermistor to the lead wire can be easily manufactured.

  The manufacturing method of the electronic thermometer of this invention is demonstrated based on drawing.

  1 to 5 relate to an embodiment of the present invention, FIG. 1 is an external view of an electronic thermometer of the present invention, FIG. 2 is a partial sectional view of a probe of the electronic thermometer of FIG. 1, and FIG. FIG. 4 is a sectional view of a sensor cap, and FIG. 5 is an external view of a thermistor to which a lead wire is connected.

  1 to 3, the electronic thermometer 1 of the present embodiment has a main body case 2, and the main body case 2 is composed of a flexible outer case 5 made of a thermoplastic elastomer, an ABS resin, and the like. The intermediate member 3 and the inner case 4 are formed by an integral molding method described later. The probe member 20 a is configured by the intermediate member 3, a part of the outer case 5 on the intermediate member 3 side, and a part of the inner case 4 on the intermediate member 3 side. In the main body case 2, a power battery 19, a circuit board 6, a liquid crystal display device 7, an operation switch 8 and the like are incorporated. A front panel 21 made of acrylic or the like is attached to the main body case 2.

  9 is a lower case and 10 is a battery lid. A buzzer 22 is attached to the lower case 9. 11 is a thermistor, and 12 is a lead wire connected to the thermistor 11. A concave portion 3a is formed at the tip of the intermediate member 3, and a sensor cap 13 is formed by injecting an epoxy adhesive or the like into the concave portion 3a and drawing a material having a high thermal conductivity, such as a stainless steel material. Is fixed.

By using a thermoplastic elastomer material as the material of the outer case 5 and making it flexible, the probe portion 20a is deformed according to the shape of the temperature measuring part of the living body, and it becomes easy to measure by closely contacting the temperature measuring part. Since this heat-sparing elastomer has poor adhesion to metal, the intermediate member 3 having good adhesiveness is integrally formed in the outer case 5 without directly attaching the sensor cap 13 to the outer case 5. The sensor cap 13 is adhered. The material of the intermediate member 3 may be a hard resin such as PP, PE, PC other than ABS. Further, when the probe 20 does not need flexibility, the probe portion 20a may be formed only by ABS.

  The two types of materials to be integrally molded are as follows. First, a hard resin material is supplied into a molding die, the inner case 4 and the intermediate member 3 are molded separately, and then these molded products are separated into different molds. And the elastomer resin is filled in the remainder of the cavity. In the process, at least the latter material is melted in the molding die and contacts the surface of the former molding material. As a result, the two materials are firmly joined to obtain a predetermined shape as a whole.

As shown in FIGS. 2 to 5, an insertion passage 3 b through which the lead wire 12 connected to the thermistor 11 is inserted is formed in the probe portion 20 a. The insertion passage 3b is formed in the intermediate member 3, the outer case 5, and the inner case 5 constituting the probe portion 20a, and they are connected to form one insertion passage.
In FIG. 4, the sensor cap 13 has a semi-spherical shape or a semi-elliptical spherical shape at the tip, and is composed of a hemispherical portion 13 a and a cylindrical portion 13 b. A cavity 13 c is formed in the sensor cap 13. The length of the cavity is L1 + L2 for the sensor cap 13 alone. When the intermediate member 3 protrudes from the outer case 5 with a length L2 and the sensor cap 13 is attached to the intermediate member 3, the intermediate member 3 enters the portion of the hollow L2. Accordingly, the length from the protruding end of the intermediate member 3 to the inner wall 13d of the hemispherical portion 13a of the sensor cap 13 is L1.

5A is a top view of the thermistor 11 with the lead wire 12 connected thereto, and FIG. 5B is a side view of FIG. 5A. Two lead wires 12 are connected to the thermistor 11.
In the thermistor 11, lead wires 12 are soldered to two electrode portions formed in a chip-type element (not shown), and an insulating coating is applied thereon with an epoxy resin or the like.
The lead wire is also coated with an epoxy resin or the like except for the chip-type element and both ends soldered to the circuit board 6. The end of the thermistor 11 opposite to the side to which the lead wire 12 is connected is substantially spherical and rounded, so that it is easy to rotate when it contacts the inner wall of the sensor cap 13. .

  Next, a method for manufacturing the electronic thermometer shown in FIG. 1 will be described with reference to FIGS. 1 to 12 relate to an embodiment of the present invention, FIG. 6 is an explanatory diagram of a process of connecting the lead wire of FIG. 5 to a circuit board, and FIG. 7 is a liquid crystal display device, operation switch, battery in a main body case. FIG. 8 is an explanatory diagram of the circuit board assembly and lead wire insertion process, FIG. 9 is a sectional view of the sensor cap filled with an adhesive, and FIG. 10 is an attachment of the sensor cap. FIG. 11 is an explanatory diagram of the process for attaching the lower case to the main body case, and FIG. 12 is a flowchart for explaining the assembly process.

In step S1 of FIG. 12, the intermediate member 3, the inner case 4, and the outer case 5 are integrally molded as described above.
In step S2 of FIG. 12, circuit components such as an IC and a chip capacitor are mounted on the circuit board 6. In step S3 in FIG. 12, the lead wire 12 is connected to the thermistor 11 as shown in FIG. For example, a lead wire 12 coated with a resin on the other side than the both ends is soldered to an electrode of a chip-type element (not shown), and the chip-type element is immersed in a molten insulating member layer made of an epoxy resin and resin-coated.

  In step S4 of FIG. 12, the lead wire 12 is soldered to the lead wire connecting electrode 6b of the circuit board 6 with the thermistor 11 connected to one end of the two lead wires 12, as shown in FIG. Connect.

  In step S5 of FIG. 12, as shown in FIGS. 7A and 7B, the liquid crystal display device mounting hole 2a and the operation switch mounting hole 2b formed in the inner case 5 constituting the main body case 2 are respectively provided. A liquid crystal display device 7 and an operation switch 8 are incorporated. Then, a connector 22 for connecting an electrode (not shown) of the liquid crystal display device 7 and an electrode (not shown) of the circuit board 6 and a spacer 23 are incorporated at predetermined positions shown in FIG. Next, the columnar projections 2ce and 2c for attaching the minus spring and the columnar projections 2de and 2d for attaching the plus spring, which are formed inside the inner case 5, are inserted into the attachment hole and the plus spring attachment hole of the minus spring. Thereafter, the minus spring 14 and the plus spring 15 are fixed by caulking the minus spring and the columnar protrusions 2c and 2d for attaching the plus spring. 2e is a columnar protrusion for mounting the substrate, and 16 is a battery presser that holds the side of the battery.

  In step S6 of FIG. 12, as shown in FIGS. 8A and 8B, the thermistor 11 is inserted from the opening 3c inside the main body case 2 so that the thermistor 11 passes through the insertion passage 3b. The substrate 6, the lead wire 12, and the thermistor 11 are moved, and the substrate mounting columnar protrusions 2e, 2de, 2ce formed in the inner case 5 are inserted into the circuit substrate mounting hole 6a formed in the circuit substrate 6. To do. 2ce and 2de serve not only as a negative spring and a columnar protrusion for attaching a positive spring but also as a columnar protrusion for mounting a substrate. Thereafter, the circuit board 6 is fixed by caulking the board mounting columnar protrusions 2e, 2de, and 2ce. Then, an adhesive 17 is filled in the opening 3 c on the circuit board 6 side of the insertion path 3 b of the main body case 2 to fix the lead wire 12. Here, L2 is the projection length of the intermediate member 3 described above, and L3 is the length from the opening (the tip of the intermediate member) of the insertion passage 3b on the thermistor 11 side to the tip of the thermistor 11 (projection length of the thermistor 11). In the state where the lead wire 12 is attached to the circuit board 6, the thermistor 11 protrudes by L3 from the opening (the tip of the intermediate member) on the thermistor 11 side of the insertion passage 3b. The length is set. Here, L3 is longer than L1 (cavity length) described above, and the sensor cap 13 is attached, so that the lead wire 12 in the vicinity of the thermistor 11 undergoes buckling, which will be described later, on the inner wall 13d of the cavity 13c. The length is such that it can be touched.

  In step S7 of FIG. 12, as shown in FIG. 9, only the hemispherical portion 13a of the cavity 13c of the sensor cap 13 is filled with, for example, an epoxy adhesive 18. Next, as shown in FIG. 10 (a), the tip of the thermistor 11 protrudes from the tip of the insertion path 3b of the upper case 2 by a predetermined length L3. Next, as shown in FIG. 10 (b), With the thermistor 11 attached to the tip of the lead wire 12, the sensor cap 13 is attached by being adhered to the intermediate member 3 constituting the probe portion 20a. At that time, the inner wall 13d of the tip of the sensor cap 13 abuts on the thermistor 11, and the thermistor 11 becomes a rotating end. Furthermore, when the sensor cap 13 is pushed in, one end fixed and other end rotation type buckling occurs. That is, as shown in FIG. 10C, one of the lead wires 12 is fixed (fixed at one end) with the adhesive 17 at the opening 3c of the insertion path 3b on the circuit board side, and the thermistor 11 is fixed on the other side. Since the inner wall 13d of the sensor cap 13 is in contact with the inner wall 13d in a rotatable state (the other end is rotated), when the sensor cap 13 is pushed in, the thermistor 11 rotates and the lead wire 12 in the vicinity thereof is deformed ( Buckled) and comes into contact with the inner wall 13d of the hemispherical portion 13a of the sensor cap 13. When the sensor cap 13 is further pushed in and reaches the predetermined position where all the protruding portions of the intermediate member 3 are inserted into the sensor cap 13, the thermistor 11 and the lead wire 12 are arranged as shown in FIG. Fixed by.

  As shown in FIG. 2, the lead wire 12 is in contact with and fixed to the inner wall 13d of the cavity 13c in the vicinity of the thermistor 11 at a position from the thermistor 11 to the opening on the intermediate member 3 side of the insertion passage 3b. And a non-fixed portion 12b that is not fixed to the sensor cap 13 or the probe portion 4 at a location from the thermistor 11 to the insertion passage 3b. Of the non-fixed portion 12b, a portion close to the contact / fixed portion is not fixed, but is in contact with the inner wall of the cylindrical portion 13b of the sensor cap 13.

  In step S8 of FIG. 12, the buzzer 22 is attached to the lower case 9 made of ABS resin or the like, and the buzzer 22 and the circuit board 6 are connected with a lead wire (not shown). Then, as shown in FIG. Attach to the back side with adhesive. Thereafter, the battery 5 is accommodated in step S5 of FIG. 12, and the battery lid 10 is mounted in step S10 of FIG.

  The operation and effect of the method for manufacturing the electronic thermometer having the above-described configuration will be described. The lead wire to which the thermistor is connected is fixed at one end and rotated at the other end, and L3 (projection length from the intermediate member to the thermistor tip) is L1 (length from the intermediate member to the inner wall 13d of the sensor cap 13). ), The lead wire in the vicinity of the thermistor can be brought into contact with the inner wall of the substantially hemispherical or substantially semi-elliptical sphere-shaped portion of the sensor cap. Therefore, there is no temperature difference between the thermistor and the lead wire in the vicinity of the thermistor, and the body temperature measurement time is shortened by effectively preventing the heat dissipation from the thermistor to the lead wire.

  In addition, since only the hemispherical portion 13a of the cavity 13c of the sensor cap 13 is filled with the epoxy adhesive 18, only the portion of the thermistor and the lead wire in the vicinity thereof that needs to be bonded is bonded, and the rest Since the portion is not filled with adhesive, the heat capacity of the sensor cap 13 is reduced.

Further, since only the lead wire in the vicinity of the thermistor is fixed and has a free non-fixed portion, it is not necessary to manufacture the heat insulator by a method such as pushing it into the sensor cap, and the lead wire does not break.
Further, since the adhesive agent 18 is filled in the vicinity of the closed end in the sensor cap 13, the thermistor 11 and the lead wire 12 can be fixed to the vicinity of the closed end of the sensor cap 13 and the tip of the sensor cap 13. The strength of the part can be reinforced.
Further, since the step of filling the adhesive in the vicinity of the closed end in the sensor cap 13 is performed before the sensor cap 13 is attached to the probe portion 20a, before the thermistor 11 and the lead wire 12 are disposed in the sensor cap 13. The adhesive 18 can be filled, and the filling of the adhesive 18 is easy.
Further, in the step of attaching the sensor cap 13 to the probe portion 20a, the thermistor 11 is configured to rotate by pressing the inner wall 13d at the closed end of the cavity 13c of the sensor cap 13 against the thermistor 11, and thus the thermistor. By causing the lead wire 12 near 11 to buckle, it can be easily deformed so as to contact the inner wall of the sensor cap 13.
In addition, the cavity 13c of the sensor cap 13 has a tip that abuts the thermistor 11 in a substantially hemispherical shape or a substantially semi-elliptical spherical shape, so that the lead wire 12 in the vicinity of the thermistor 11 bent in an arc shape due to buckling is formed. The contact portion has the same shape as the arc-shaped lead wire, and the lead wire 12 in the vicinity of the thermistor 11 is easy to contact.

In the manufacturing process shown in FIGS. 6 to 12, the circuit board 6 is incorporated in the main body case 2 after the lead wire 12 is connected to the circuit board 6. Before the lead wire 12 is connected to the circuit board 6, The lead wire 6 may be connected to the circuit board 6 after the 6 is incorporated into the main body case 2. That is, after performing the process of attaching the circuit board 6 to the main body case 2, the process of pulling out the thermistor 11 and the lead wire 12 from the opening of the insertion path 3b of the probe section 20a may be performed. In that case, for example, the circuit board 6 is incorporated as shown in FIG. 8B (however, the lead wire 12 is not yet connected to the circuit board 5), and the lead wire 12 is connected to the thermistor. The opposite end of the insertion path 3b is inserted through the opening on the intermediate member 3 side, the lead wire 12 is drawn out from the opening on the circuit board 6 side, and is connected to the lead wire connection electrode 6b on the circuit board 6. You may do it.

It is an external view of the electronic thermometer of this invention. It is a fragmentary sectional view of the probe part of the electronic thermometer of FIG. It is an AA line sectional view of the electronic thermometer of FIG. It is sectional drawing of the sensor cap of FIG. It is an external view of the thermistor of FIG. It is explanatory drawing of the process of connecting the lead wire of FIG. 5 to a circuit board. It is explanatory drawing of the process of incorporating a liquid crystal display device, an operation switch, and a battery spring in a main body case. It is explanatory drawing of the assembly | attachment of a circuit board, and a lead wire penetration process. It is sectional drawing of the state which filled the sensor cap with the adhesive agent. It is explanatory drawing of the attachment process of a sensor cap. It is explanatory drawing of the process of attaching a lower case to a probe main body. It is a flowchart explaining an assembly process. It is a fragmentary sectional view of the probe part of the conventional electronic thermometer. It is a partial notch perspective view of the probe part of the other conventional electronic thermometer. It is a fragmentary sectional view of the probe part of FIG. It is sectional drawing of the other conventional electronic thermometer. It is a principal part expansion perspective view of the electronic thermometer of FIG. It is sectional drawing of the other conventional electronic thermometer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic thermometer 2 Main body case 3 Intermediate member 3b Insertion passage 3c Insertion board side opening 4 Inner case 5 Outer case 6 Circuit board 7 Liquid crystal display device 8 Operation switch 9 Lower case 10 Battery cover 11 Thermistor (thermosensitive element)
12 Lead wire 12a Contact / fixed portion 12b Non-fixed portion 13 Sensor cap 13a Hemispherical portion 13b Cylindrical portion 13c Cavity 13d Inner wall 14 Negative spring 15 Plus spring 16 Battery holder 17, 18 Adhesive 20 Probe 20a Probe portion L1 Cavity length L2 Intermediate member Projection length L3 Length from the intermediate member to the thermistor tip

Claims (7)

  A temperature sensing element; a lead wire connected to the temperature sensing element; a main body case having a probe portion formed with an insertion passage through which the lead wire is inserted; a circuit board to which the lead wire is connected; and one end Of an electronic thermometer having a sensor cap formed with a cavity having an opening and a closed end, the lead wire protruding from the insertion passage and the temperature sensing element being housed in the sensor cap In the method, a step of attaching the temperature sensing element to the lead wire, a step of connecting the lead wire to the circuit board, a step of incorporating the circuit board into the body case, and inserting the lead wire into the probe portion. A step of attaching the sensor cap to the probe part in a state where the temperature sensing element is attached to the tip of the lead wire after protruding from the passage, The protruding length of the line, the electronic clinical thermometer manufacturing method of the lead wire of the temperature sensitive element near by the sensor cap is mounted is characterized by being set to a length enough to be in contact with the inner wall of the cavity.   The method for manufacturing an electronic thermometer according to claim 1, further comprising a step of filling an adhesive near the closed end in the sensor cap.   3. The method of manufacturing an electronic thermometer according to claim 2, wherein the step of filling the adhesive is performed before the sensor cap is attached to the probe portion.   4. The method according to claim 2, wherein in the step of filling the adhesive, the adhesive is filled in an amount for fixing only the temperature sensitive element and a lead wire in the vicinity of the temperature sensitive element. The manufacturing method of the electronic thermometer as described in 1 ..   The step of attaching the sensor cap to the probe unit is configured such that the temperature sensing element rotates when an inner wall of a closed end of the cavity is pressed against the temperature sensing element. The manufacturing method of the electronic thermometer of any one of 1-4.   The electronic thermometer according to any one of claims 1 to 5, wherein the step of attaching the sensor cap to the probe portion is performed in a state in which at least a part other than the protruding portion of the lead wire is fixed. Production method. The electronic thermometer according to any one of claims 1 to 6, wherein a tip of the cavity is formed in a substantially hemispherical shape or a substantially hemispherical sphere shape at which the temperature sensing element abuts. Method.

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