JP2006093030A - Manufacturing method of image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an image display device capable of surely cutting and separating a metal back layer, preventing breakage or deterioration of electron emission elements and a fluorescent screen, and of displaying bright and quality images. <P>SOLUTION: Shielding layers 5b1, 5b2 are patterned on a front substrate 2 faced to a back substrate 1 on which many electron emission elements are arranged, a phosphor layer 6a is patterned in a part where the shielding layer is not present, a resin film 7p is installed on the phosphor layer, a wire cutter 40 having a plurality of wires 42 arranged substantially in parallel is aligned to the front substrate so that each wire 42 is adjacently arranged 1 to 1 to a plurality of planned cutting lines extending in the short side or the long side direction of the front substrate, wires are pressed to the wire resin film with a hot press roller, the hot press roller is moved in the length direction of the wire relative to the wire, the resin film 7p is cut and separated along the planned cutting line with the hot press, and the metal back layer 7a functioning as an anode is formed on the cut resin film. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a flat-type image display device using an electron-emitting device.

  Recently, as a next-generation image display device, development of a flat-type image display device in which a large number of electron-emitting devices are arranged so as to be opposed to a phosphor screen has been advanced. There are various types of electron-emitting devices, all of which basically use field emission, and display devices using these electron-emitting devices are generally called field emission displays (hereinafter referred to as FED). )is called. A display device using a surface conduction electron-emitting device among FEDs is also called a surface conduction electron-emission display (hereinafter referred to as SED). In this specification, the display device is generally called FED. Use terminology.

  In order to obtain practical display characteristics in the FED, it is necessary to use a phosphor similar to a normal cathode ray tube and a phosphor screen in which an aluminum thin film called a “metal back” is formed on the phosphor. It becomes. The purpose of the metal back is to increase the luminance by reflecting light traveling toward the electron source among the light emitted from the phosphor by the electrons emitted from the electron source to the front substrate side.

  However, the gap between the front substrate and the rear substrate of the FED cannot be so large from the viewpoint of the resolution and the characteristics of the support member, and needs to be set to about 1 to 2 mm. For this reason, in the FED, a strong electric field is formed in a narrow gap between the front substrate and the rear substrate, and when an image is formed over a long period of time, discharge (surface discharge between metal back films; vacuum arc discharge) is likely to occur between the two substrates. Become. When a discharge occurs, a large discharge current ranging from several amperes to several hundred amperes flows instantaneously, so that the electron-emitting device in the cathode part and the phosphor screen in the anode part may be destroyed or damaged. Such a discharge that leads to the occurrence of a defect is not allowed as a product. Therefore, in order to put the FED into practical use, it is necessary to prevent damage caused by discharge over a long period of time.

Patent Documents 1 and 2 each disclose a technique of dividing a metal back layer used as an anode electrode into a plurality of divided regions in order to alleviate damage when a discharge occurs.
Japanese Patent Laid-Open No. 10-326583 JP 2003-242911 A

  However, in the array of pixels on the FED phosphor screen, the interval between the planned dividing lines is very narrow, and it is difficult to reliably divide the metal back layer by that interval without being displaced.

  Further, although it is conceivable to divide the metal back layer using a laser cutting technique or a laser ablation technique, there is a problem in that the edge portion of the divided metal back layer is turned (warped).

  The present invention has been made to solve the above-described problems, and can reliably divide the metal back layer, prevent destruction and deterioration of the electron-emitting device and the phosphor screen due to discharge, and has high luminance and high quality. An object of the present invention is to provide a method for manufacturing an image display device capable of displaying the above.

  The method for manufacturing an image display device according to the present invention includes: (i) patterning a light-shielding layer on a front substrate disposed opposite to a rear substrate on which a large number of electron-emitting devices are arranged, and fluorescent light on a portion without the light-shielding layer. A body layer is patterned, (ii) a resin film is provided on the phosphor layer, and (iii) a wire cutter comprising a plurality of wires arranged substantially in parallel, each of the wires being the front surface Relative positioning with respect to the front substrate so as to be close to each other in a one-to-one relationship with a plurality of predetermined dividing lines extending in the short side or long side direction of the substrate, and (iv) the wire by a hot press roller Is pressed against the resin film, the hot press roller is moved relative to the wire in the longitudinal direction of the wire, and the resin film is hot-press cut along the planned cutting line, (v ) Divided And characterized by forming a metal back layer that serves as an anode electrode on the resin film.

  In step (iv), after the wire is heated to a depth corresponding to the film thickness of the resin film by the hot press roller and held for a predetermined time, the hot press roller can be pulled away from the wire while the wire is heated. desirable. When the wire is pushed in this way, it is divided over the entire thickness of the resin film by a so-called hot press effect due to the synergistic action of heat and pressure. In this case, if the wire is held for a predetermined time in a state where the wire is pushed to a depth exceeding the thickness of the resin film layer, the resin film is more reliably divided. In addition, although the molten resin may adhere to the wire surface, the wire can always be kept in a clean state by performing a cleaning process on the wire surface every time when the maintenance unit is divided or periodically.

  In a state where a round wire having a diameter of 10 to 500 μm, or a different diameter wire having a long diameter of 10 to 500 μm and an elliptical or elliptical cross section is heated to a temperature range of 50 to 200 ° C. by a hot press roller, It is preferable to press the resin film with pressure. When the wire diameter is less than 10 μm, not only is it difficult to reliably cut the resin film over the entire thickness, but breakage is likely to occur during hot pressing. On the other hand, if the wire diameter exceeds 500 μm, the dividing width of the resin film becomes excessive, and both shoulders of the phosphor layer corresponding to the lower layer are deformed beyond the target width of the planned dividing line (usually 30 to 200 μm). This is because there is a risk of heat damage.

  The wire heating temperature is preferably 50 to 200 ° C, and most preferably 100 to 140 ° C. When the wire heating temperature is below 50 ° C., even if the pressing force is increased, the heat press effect due to the synergistic action of heat and pressure is lost, and the resin film cannot be divided reliably. In addition, when the wire heating temperature is lower than 100 ° C., even when the pressing force is increased, the heat pressing effect is small, and it becomes difficult to completely cut the resin film. On the other hand, when the wire heat generation temperature exceeds 200 ° C., the thermal influence on the peripheral portion becomes large, the division width of the resin film exceeds the target width value, and a part of the phosphor layer is exposed. At the same time, the wire is easily broken. Further, if the wire heat generation temperature exceeds 140 ° C., it is difficult not only to make the dividing width of the resin film equal to the target width value, but also to have a short life that cannot withstand repeated use.

  The wire pressing force by the hot press roller is preferably in the range of 20 to 50 kgf, and most preferably in the range of 30 to 40 kgf. By adjusting the pressing force of the wire against the resin film with high accuracy, it is possible to effectively avoid the occurrence of damage to the light shielding layer and the substrate due to the excessive pressing force. When the wire pressing force is less than 20 kgf, even if the heating temperature is increased, the heat pressing effect due to the synergistic action of heat and pressure is lost, and the resin film cannot be divided reliably. Further, when the wire pressing force is less than 30 kgf, even if the heating temperature is increased, the heat pressing effect is small, and it becomes difficult to completely cut the resin film. On the other hand, when the wire pressing force exceeds 100 N, the wire is excessively pushed to damage the underlying light shielding layer and the glass substrate, and the wire may be broken. Further, if the wire pressing force exceeds 80 N, the underlying light shielding layer and glass substrate may be damaged, and the wire will have a short life that cannot withstand repeated use.

  The hot press roller has both a heating function that heats the wire to a predetermined temperature and a pressure function that applies a predetermined pressing force to the wire, and also has high rigidity and surface hardness to allow the wire to bite into the resin film. And As a heating function of the hot press roller, an induction heating method or a resistance heating method can be used. Further, a ball screw mechanism or a cylinder mechanism can be used as a pressure function of the hot press roller.

  The surface roughness of the hot press roller is preferably in the range of Rmax = 10 to 50 μm in terms of maximum height. This is because making the roller surface roughness less than Rmax 10 μm itself is difficult in terms of manufacturing technology. On the other hand, if the roller surface roughness exceeds Rmax 50 μm, it becomes difficult for the wire to be pressed against the substrate following the warping or bending of the front substrate, and it becomes difficult to reliably cut the resin film.

  For the wire of the wire cutter, iron materials such as heat-resistant alloy steel and stainless steel, or various non-ferrous metal materials such as copper, tungsten, molybdenum, nickel, titanium, aluminum, and alloys thereof can be used.

  The dividing line is set corresponding to each of the vertical dividing lines that divide the phosphor layer into pixels. Further, the planned dividing line may be set corresponding to each of the vertical dividing lines that divide the phosphor layer for each unit of RGB pixels, or a plurality of RGB pixel intervals (for example, two pixel pitch intervals or You may make it set corresponding to the vertical division line of 3 pixel pitch intervals).

  The mounting table can function not only as a relative alignment unit but also as a relative movement unit, but is mainly used as a relative alignment unit between the substrate to be processed and the wire cutter in the XY plane. For such a mounting table, an XYZθ table provided with a linear drive mechanism that moves the table in each of the X, Y, and Z directions and further provided with a θ rotation drive mechanism that rotates the table about the Z axis is used. preferable. When dividing the resin film, only the hot press roller may be moved in the Y-axis direction (short side direction of the substrate to be processed), only the XYZθ table may be moved in the Y-axis direction, or hot press Both the roller and the XYZθ table may be moved in the Y direction.

  According to the present invention, since the resin film can be surely divided by the combination of the hot press roller and the wire cutter, the peak value of the discharge current when the discharge is suppressed and the discharge is generated in the image display device. And the destruction, damage and deterioration of the electron-emitting device and the phosphor screen can be prevented.

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings.

  As shown in FIG. 1, a thin film cutting device 30 used for manufacturing an image display device of the present invention includes an XYZθ table 31, a standby unit 32, a maintenance unit 33, a wire cutter 40, a press unit 50, a heater unit 60, and a table drive. A unit 70, a position sensor 72, a cutter transport unit 80, a controller 90, and other peripheral devices not shown are provided. The entire apparatus 30 is controlled by the controller 90 as a whole.

  The XYZθ table 31 has a role as a mounting table on which the front substrate 2 as a substrate to be processed is mounted. The XYZθ table 31 has a rectangular upper surface slightly larger than the rectangular substrate 2, and the substrate 2 is disposed on the upper surface. A plurality of vacuum suction holes for adsorbing and holding are opened. The substrate 2 is sucked and held by the XYZθ table 31 so that the long side is in the X-axis direction and the short side is in the Y-axis direction. A plurality of position sensors 72 are provided above the XYZθ table 31, and the alignment marks 2 a formed at the corners of the substrate 2 are optically detected by the respective sensors 72. The sensor 72 is fixed at a predetermined position so as not to be displaced with respect to each drive system.

  The XYZθ table 31 is moved in each of the X, Y, and Z directions by three linear drive mechanisms (not shown), and is further rotated about the Z axis by a θ rotation drive mechanism (not shown). Each operation of these drive mechanisms is controlled by the controller 90 controlling the table drive unit 70 based on the alignment mark detection signal from the position sensor 72.

  The XYZθ table 31 is provided in the standby unit 32. The standby unit 32 is the home position of the wire cutter 40 and is a place where the wire cutter 40 immediately before use is made to wait. A maintenance unit 33 is provided in the vicinity of the standby unit 32. The maintenance unit 33 includes a cleaning nozzle (not shown) or a cleaning tank (not shown) for injecting the cleaning liquid onto the wire cutter 40 immediately after use, and a drain pipe (not shown) for discharging waste liquid together with foreign substances. Yes.

  As shown in FIGS. 1 and 3, the wire cutter 40 includes a number of wires 42 stretched in a rectangular frame 41. These wires 42 are stretched in parallel to the short side (Y-axis direction) of the frame 41 by fastening both ends to the long side of the frame 41. The rectangular frame 41 is one size larger than the substrate 2 to be processed on the mounting table 31. In addition, although the example of the wire cutter for longitudinal division which divides | segments a resin film to a Y-axis direction was shown in this embodiment, the present invention can be applied also to the wire cutter for lateral division | segmentation which divides a resin film to an X-axis direction. Of course.

  A predetermined tension is applied to each wire 42 of the wire cutter in advance. The wire tension is adjusted within a predetermined optimum range confirmed in advance by experiments in accordance with the thickness and hardness of the metal back layer and the wire pressing force. Specifically, as shown in FIG. 3, each wire 42 passes through a pore 41 a penetrating the frame 41, and is wound around a screw-type tension adjusting tool 43 on one end side, individually or in several groups. Each is adjusted separately.

  The press unit 50 that movably supports the hot press roller 51 includes two pairs of left and right linear guides 56 and a ball screw 52. As shown in FIG. 2, each of the linear guide 56 and the ball screw 52 extends in the Z-axis direction, a nut 54 is screwed into the ball screw 52, and a holder 55 that holds the heat press roller 51 is further fitted to the nut 54. Are connected at one end. The vicinity of both ends of the holder 55 is slidably supported by two pairs of left and right linear guides 56. In addition, a limit switch (not shown) is provided at the end of the linear guide 56 together with a stopper 58, and the lifting / lowering stroke of the hot press roller 40 by the press unit 50 is limited.

  The press unit 50 is backed up by a controller 90 and controls the start / stop timing of the hot press roller 51, the stop / stop timing, and the pressing force. As shown in FIG. 2A, the hot press roller 51 has a home position above the XYZθ table 31. When the hot press roller 51 is lowered as shown in FIG. 2B, the hot press roller 51 presses the wire 42 against the substrate 2 without interfering with the frame 41 as shown in FIG. . The hot press roller 51 may be a drive roll that is rotationally driven by a motor or the like, or may be a free roll that is driven to rotate by contact friction with a counterpart member. When the hot press roller 51 is a drive roll, the rotation drive system is controlled by the controller 90.

  Note that the hot press roller 51 may be divided into a plurality of pieces and individually supported, and the resin film may be divided into several regions and divided into hot presses. The number of divisions of the hot press roller can be two, three, or four. However, if the number of divisions is 5 or more, the support structure becomes complicated and the apparatus becomes heavy, which is not preferable. Each dividing roller divides the resin film while slightly moving up and down following the subtle surface irregularities of the resin film. In addition, since the hot press roller 51 is pressed against the resin film at a predetermined pressure (weak pressure) by an air cylinder, a compression spring or the like (not shown), there is no possibility of damaging the light shielding layer below the hot press roller 51.

  It becomes possible to adjust the pressing force against the substrate to be processed with high accuracy, and it is possible to effectively avoid the occurrence of cut damage to the light shielding layer and the substrate due to the excessive pressing force.

  As shown in FIG. 6, the wire 42 is a round line having a diameter d <b> 1 (the cross section is almost a perfect circle). The wire diameter d1 is appropriately selected within the range of 10 μm to 500 μm according to the film thickness of the resin film and the size of the pixel pattern. The dividing width of the resin film tends to be equal to or slightly wider than the wire diameter d1. The material of the frame 41 and the holder 55 is preferably a hard resin material or a high-strength / high-rigidity metal material such as stainless steel that does not easily deform and hardly generate particles.

Next, the case where the resin film is cut using the above-described thin film cutting apparatus will be described.
The substrate 2 to be processed is placed on the XYZθ table 31 by a transfer robot (not shown). Since the upper surface of the XYZθ table 31 has a self-alignment structure, the target substrate 2 is automatically roughly aligned with the XYZθ table 31. The substrate 2 to be processed is a front substrate for FED, and one side is covered with a metal back layer 7 made of an Al film. The substrate 2 is placed on the XYZθ table 31 so that the Al metal back layer 7 becomes the upper surface, and is vacuum-sucked and held by a vacuum chuck.

  Next, the position sensor 72 optically detects the alignment marks 2 a formed at the corners of the substrate 2, and the controller 90 controls the drive unit 70 based on the detection signal, so that the XYZθ table 31 is within the XY plane. Are finely adjusted, and the height position in the Z direction is also finely adjusted. As a result, the substrate to be processed 2 is precisely aligned with respect to the wire cutter 40 and the hot press roller 51, and as a result, the planned dividing line of the substrate-side metal back layer is aligned with the wire 42 so as to correspond one-to-one. .

  When the relative alignment between the substrate 2 / the wire cutter 40 / the hot press roller 51 is completed, the controller 90 sends a signal to each of the units 50, 60 to start the power supply to the heater of the hot press roller 51 and the hot press roller. 51 is lowered. Thus, the wire 42 is pressed with a predetermined pressing force in a state where the heat press roller 51 generates heat to a predetermined temperature in the range of 50 to 200 ° C. That is, the hot press roller 51 bites each wire 42 into the resin film 7p on the substrate 2 while being guided by the two left and right linear guides 56, and the resin film 7p is moved in the vertical direction (Y axis (Direction). The resin film 7p is heated and pressurized by pressing the wire 42 heated by the hot press roller 51, and the resin film 7p is divided over the entire thickness by the so-called hot press effect by the synergistic action of heat and pressure.

  In the division of the metal back layer according to the present embodiment, the wire 42 is held to a depth corresponding to the film thickness of the resin film 7p for a predetermined time, and then pulled away from the resin film 7p while being heated. . When the wire 42 is pushed in this way, the adhesion of foreign matter to the wire surface is effectively prevented. In this case, if the wire 42 is held for a predetermined time while being pushed to a depth exceeding the thickness of the resin film layer 7p, the resin film layer 7p is more reliably divided.

  In addition, although the molten resin may adhere to the surface of the wire 42, the wire 42 can always be kept in a clean state by performing a cleaning process on the surface of the wire every time it is divided or in the maintenance unit 33. . The wire cutter 40 is moved from the standby unit 32 to the maintenance unit 33, and in the maintenance unit 33, the cleaning liquid is sprayed onto the wire 42 to remove the Al coagulum adhering to the tip end portion 42 a of the heater wire 42. The removed Al coagulum is received together with the cleaning liquid in a cup container (not shown) and discharged to the outside through a drain pipe (not shown). Next, the wire 40 is energized and heated to dry, and after drying, the wire 42 is returned from the maintenance unit 33 to the standby unit 32. During the cleaning and drying of the wire 42, the front substrate 2 is picked up from the table 31 by the transfer robot and carried out to the next process. In this way, the substrate 2 to be processed successively carried into the apparatus 30 is processed, and the resin film 7p is divided by using the wire 42 that is always kept in a clean state.

  Next, a method for manufacturing the FED as the image display apparatus of the present embodiment will be described with reference to FIG.

  The glass substrate 2 which is the front substrate of the FED is cleaned using a predetermined chemical solution to obtain a desired clean surface. A light shielding layer forming solution containing a light absorbing material such as a black pigment is applied to the inner surface of the cleaned front substrate 2. After the coating film is heated and dried, it is exposed using a screen mask having openings at positions corresponding to the matrix pattern, and developed to form matrix pattern light shielding layers 5b1 and 5b2 shown in FIG. did.

  Next, phosphor layers 6a of three colors of red (R), green (G), and blue (B) were formed by patterning in a conventional manner in areas where the matrix pattern light shielding layers 5b1 and 5b2 were not present. As shown in FIG. 5B, a phosphor screen was obtained in which phosphor layers 6a having a rectangular or strip-shaped three-color pattern were regularly arranged vertically and horizontally. For example, in the case of a square pixel with a pitch of 600 μm, the X direction width of the vertical division line of the phosphor layer 6a is set to a range of 20 to 50 μm, for example. In addition, the Y direction width | variety of the horizontal division line (stripe) of the fluorescent substance layer 6a shall be the range of 50-250 micrometers, for example. These vertical and horizontal division lines have a matrix pattern light-shielding layer, and are shielded so that light does not leak to the front substrate 2.

  Next, the resistance adjusting material 11 was selectively laminated on the pattern light shielding layer 5b2 having the narrower spacing among the matrix pattern light shielding layers on which the phosphor layer 6a was not stacked, by a CVD film forming method using photolithography. The resistance adjusting material 11 was stacked so as to be substantially flush with the phosphor layer 6a.

  Next, the resin film was transferred onto the phosphor layer 6a by a printing method to form a resin film layer 7p having a predetermined thickness as shown in FIG. The resin film layer 7p is made of a thin film of about several μm to several tens of μm made of an organic resin such as nitrocellulose, and is made of an Al film to be a metal back layer by smoothing the irregularities on the surface of the phosphor layer 6a. It has a role of flattening the shape. The resin film layer 7p can also be formed by using a spray method or a photolithography method in addition to the printing method. The resin film layer 7p can be decomposed and removed by heating and firing together with the front substrate 2 in a later step.

  Next, after the hot press roller 51 is heated to a predetermined temperature in the range of 100 to 140 ° C. using the thin film cutting device 30 described above and held for a predetermined time in a state where it is pressed to a depth corresponding to the film thickness of the resin film 7p. Then, the wire 42 was pulled away from the resin film 7p while being heated, and the resin film 7p was subjected to hot press cutting along the planned cutting line. Thus, the resin film 7p was divided for each RGB pixel unit, and a resin film 7p divided at the dividing portion 12 as shown in FIG. 5D was obtained.

  Next, as shown in FIG. 5 (e), an Al metal back layer 7a was formed on the entire surface of the resin film 7p by a vacuum deposition method. The metal back layer 7a is stacked on the resin film 7p or the light shielding layer 5b1, but does not adhere to the side wall of the phosphor layer 6a. As a result, the metal back layers 7a that are electrically separated from each other are formed.

  Subsequently, the resistance adjusting material 13 was laminated | stacked on the pattern light shielding layer 5b1 with the larger space | interval exposed to the parting part 12. FIG. The resistance adjusting member 13 was stacked so as to be substantially flush with the phosphor layer 6a as shown in FIG.

  Next, the phosphor screen 6 thus formed is placed in a vacuum envelope together with the electron-emitting device. For this, a method is adopted in which the front substrate 2 having the phosphor screen 6 and the rear substrate 1 having the plurality of electron-emitting devices 8 are vacuum-sealed with frit glass or the like to form a vacuum container. Further, a predetermined getter material is deposited from above the pattern in the vacuum envelope, and a getter material deposition film is formed in the region of the Al metal back layer 7a.

  In the FED manufactured in this way, since the gap between the front substrate 2 and the rear substrate 1 is extremely narrow, discharge (dielectric breakdown) easily occurs between the two substrates. However, in the FED formed in this embodiment, the pattern is Since the formed phosphor layer 6a is divided for each pixel segment in a state in which the metal back layer 7 is formed, the peak value of the discharge current when the discharge occurs is suppressed, and the instantaneous energy is reduced. Concentration is avoided. As a result of the reduction of the maximum value of the discharge energy, destruction, damage and deterioration of the electron-emitting device and the phosphor screen are prevented.

Next, examples will be described.
Example 1
A resin film having a film thickness t1 (= 3 to 20 μm) was divided using a wire 42 having a circular cross section (substantially perfect circle) shown in FIG. 6 as the wire cutter of Example 1. The wire diameter d1 was 30 μm, the wire heating temperature was 140 ° C., the downward wire protrusion length C1 was 3 to 10 μm, and the distance L1 from the lower end of the wire to the glass substrate 2 was 10 to 100 μm with a margin.

  According to this example, the resin film 7p could be longitudinally divided into 18 μm with an average division width without turning over at the end of the division region. Further, the relative alignment between the wire cutter and the substrate could be made with high accuracy, and the position of each wire could be suppressed within only a few μm from the planned cutting line.

(Example 2)
A resin film having a film thickness t1 (= 3 to 20 μm) was divided using a wire 42A having an elliptical cross section shown in FIG. 7 as the wire cutter of Example 2. The wire short diameter d1 is 30 μm, the wire long diameter d2 is 60 μm, the wire heating temperature is 140 ° C., the downward wire protrusion length C2 is 5 to 20 μm, and the distance L2 from the lower end of the wire to the glass substrate 2 is 10 with a margin. ˜100 μm. If the resin film 7p is hot-press divided with the wire long axis as the thickness direction (Z direction) of the resin film 7p, the wire penetration length C2 becomes longer, and the resin film 7p can be more reliably divided.

  According to this example, the resin film 7p could be longitudinally divided to 21 μm with an average division width without turning up at the end of the division region. Further, the relative alignment between the wire cutter and the substrate could be made with high accuracy, and the position of each wire could be suppressed within only a few μm from the planned cutting line.

  In this embodiment, the cross section of the wire has an oval shape, but it may have an elliptical shape or a pseudo-elliptical shape.

  Next, FIGS. 10 and 11 show the structure of the FED common to this embodiment. The FED has a front substrate 2 and a rear substrate 1 each made of rectangular glass, and the substrates 1 and 2 are arranged to face each other with an interval of 1 to 2 mm. The front substrate 2 and the back substrate 1 constitute a flat rectangular vacuum envelope 4 whose peripheral portions are joined to each other via a rectangular frame-shaped side wall 3 and the inside is maintained at a high vacuum.

  A phosphor screen 6 is formed on the inner surface of the front substrate 2. The phosphor screen 6 includes a phosphor layer 6a that emits light of three colors of red (R), green (G), and blue (B) and a matrix-shaped light shielding layer 5b. On the phosphor screen 6, a metal back layer 7 is formed which functions as an anode electrode and functions as a light reflecting film for reflecting the light of the phosphor layer 6a. During the display operation, a predetermined anode voltage is applied to the metal back layer 7 by a circuit (not shown).

  On the inner surface of the back substrate 1, a large number of electron-emitting devices 8 that emit an electron beam for exciting the phosphor layer 6 a and the metal back layer 7 are provided. These electron-emitting devices 8 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. The electron-emitting devices 8 are driven by wiring (not shown) arranged in a matrix. In addition, a large number of plate-like or columnar spacers 10 are provided between the rear substrate 1 and the front substrate 2 as reinforcement in order to withstand the atmospheric pressure acting on the substrates 1 and 2. .

  An anode voltage is applied to the phosphor screen 6 through the metal back layer 7, and the electron beam emitted from the electron emitter 8 is accelerated by the anode voltage and collides with the phosphor screen 6. As a result, the corresponding phosphor layer 6a emits light and an image is displayed.

  FIG. 8 shows the structure of the front substrate 2, particularly the phosphor screen 6, common to the embodiments of the present invention. The phosphor screen 6 has a number of rectangular phosphor layers that emit red (R), green (G), and blue (B). When the longitudinal direction of the front substrate 2 is the X axis and the width direction perpendicular to the X axis is the Y axis, the phosphor layers R, G, B are repeatedly arranged at a predetermined gap interval in the X axis direction, and the Y axis direction Are arranged repeatedly at predetermined gap intervals. Note that the gap distance between the phosphor layers 6a in the XY plane is allowed because the gap distance is allowed to vary within a manufacturing error range or within a design tolerance range. Although it cannot be said that is a constant value, it is assumed here that it is a substantially constant value for convenience.

  The phosphor screen 6 includes a light shielding layer 5. As shown in FIG. 9, the light shielding layer 5 includes a rectangular frame light shielding layer 5a extending along the peripheral edge of the front substrate 2 and a phosphor layer R, G, B between the rectangular frame light shielding layer 5a. And a matrix pattern light shielding layer 5b extending in a matrix.

  On the matrix pattern light-shielding layer 5b, a resistance layer 13 is provided along a vertical division line 13V extending in the Y direction, and a resistance layer is provided along a horizontal division line 13H extending in the X direction. The segment phosphors RGB are separated from each other by a resistance layer 11 extending in the Y direction. Each of the vertical division lines 13V and the horizontal division lines 13H is formed by a conventional photolithography method using a material having metal oxide fine particles having a predetermined resistance as a base material.

The block top view which shows the outline | summary of the thin film cutting device used for manufacture of the image display apparatus of this invention, and a to-be-processed substrate. (A) is a side view which shows the outline | summary of the thin film cutting apparatus and to-be-processed substrate of a standby state, (b) is a side view which shows the outline | summary of the thin-film cutting apparatus at the time of hot press cutting | disconnection, and a to-be-processed substrate. The perspective view which shows the outline | summary of a hot press roller, a wire cutter, and a to-be-processed substrate. The side view which shows the hot press roller at the time of metal back layer parting, a wire cutter, and a to-be-processed substrate. (A)-(f) is process drawing which shows the manufacturing method of the image display apparatus which concerns on embodiment of this invention. Sectional drawing which expands and shows the wire of the wire cutter at the time of metal back layer parting | segmenting. Sectional drawing which expands and shows the wire of the wire cutter at the time of metal back layer parting | segmenting. The top view which shows a fluorescent screen and a metal back layer of a front substrate by cutting out a part of an image display device (FED). 1 is a partially enlarged plan view showing an image display device according to an embodiment of the present invention. The perspective view which shows the outline | summary of an image display apparatus (FED). Sectional drawing cut | disconnected along the AA line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Back substrate, 2 ... Front substrate, 2a ... Alignment mark, 3 ... Side wall,
5a, 5b, 5b1, 5b2 ... light-shielding layer, 6 ... phosphor screen, 6a ... phosphor layer,
7 ... Metal back layer,
7a: a divided metal back layer (metal back pattern),
7p ... resin film,
8 ... electron-emitting device,
11, 13V ... resistance adjusting material,
12: Dividing part,
13V ... Vertical section line (partition planned line),
13H: Horizontal section line (scheduled dividing line, stripe)
30 ... Thin film cutting device,
31 ... XYZθ stage (mounting table, relative moving means),
32 ... standby unit,
33. Maintenance department,
40 ... Wire cutter, 41 ... Frame, 42 ... Wire,
50 ... Press unit,
51 ... Heat press roller,
52 ... Ball screw, 54 ... Nut, 55 ... Holder,
56 ... Linear guide, 58 ... Stopper,
60 ... heater unit,
70 ... Table drive unit (relative movement means), 72 ... Position sensor,
80: Cutter conveyance unit (relative movement means), 90: Controller.

Claims (7)

Patterning a light-shielding layer on a front substrate disposed opposite to a rear substrate on which a large number of electron-emitting devices are arranged, and patterning a phosphor layer on a portion without the light-shielding layer;
A resin film is provided on the phosphor layer,
A wire cutter having a plurality of wires arranged substantially in parallel is brought close to a predetermined plurality of dividing lines each extending in the short side or long side direction of the front substrate in a one-to-one relationship. Align relative to the front substrate to be placed,
In a state where the wire is pressed against the resin film by a hot press roller, the hot press roller is moved relative to the wire in the longitudinal direction of the wire, and the resin film is heated along the planned dividing line. Press divide,
A method of manufacturing an image display device, comprising forming a metal back layer functioning as an anode electrode on the divided resin film. After heating and holding the wire to a depth corresponding to the film thickness of the resin film by the hot press roller for a predetermined time, the hot press roller is pulled away from the wire while the wire is heated. The method of claim 1, characterized in that: After holding the wire to a depth exceeding the thickness of the resin film by the hot press roller for a predetermined time, the hot press roller is pulled away from the wire while the wire is heated. The method according to claim 1. The wire is a round wire having a diameter of 10 to 500 μm, and is pressed into the resin film with a pressing force of 20 to 50 kgf in a state where the wire is heated to a temperature range of 50 to 200 ° C. by the hot press roller. The method according to any one of claims 1 to 3. The wire is a different diameter wire having an elliptical cross section or an elliptical cross section having a major axis of 10 to 500 μm, and is pressed into the resin film with a pressing force of 20 to 50 kgf in a state where the wire is heated to a temperature range of 50 to 200 ° C. 4. A method according to any one of claims 1 to 3, characterized in that The method according to claim 1, wherein the hot press roller has a surface roughness of 10 to 50 μm at a maximum height indication Rmax. The method according to any one of claims 1 to 6, wherein the planned dividing line is set in correspondence with a vertical dividing line for dividing the phosphor layer into pixel units.

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