JP2006086432A - Method and apparatus of creating inspecting data of packaging substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of creating the inspection data of a packaging substrate which can simply verify and correct the inspecting data. <P>SOLUTION: When the photographed image, obtained by photographing the packaging substrate P in which an electronic component E has been carried, is compared and collated with reference data included in the inspection data and inspected, the object is the method of creating the inspecting data. The method includes a data-creating step of creating the reference data by the artificial data including the numeric data, showing the shape, an image display step of creating with the artificial data including the numerical value data showing the shape, and image display step of graphic displaying the artificial image specified by the artificial data, and a verifying step of verifying the artificial data, based on the artificial image in which graphic display is performed and correcting, as needed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mounting board inspection data creation method and a creation apparatus for creating inspection data when, for example, a mounting board on which electronic components are mounted by a mounting machine is inspected by an inspection apparatus.

  2. Description of the Related Art As a mounting board inspection apparatus on which electronic components are mounted, an apparatus that images a board to be inspected and inspects the mounting state of the electronic parts on the board based on the imaging data is well known.

In such an inspection apparatus, in general, a substrate with a relatively good mounting state is imaged as a master substrate, and the image (master image) is used as an inspection reference and compared with the captured image to be inspected to determine whether the mounting state is appropriate. Judgment is made (Patent Documents 1 to 4, etc.).
Japanese Patent Laid-Open No. 7-63686 Japanese Patent No. 3250309 Japanese Patent No. 338129 Japanese Patent No. 2745476

  In the conventional inspection apparatus described above, it is necessary to create inspection data including a master image as an inspection reference before starting inspection. Therefore, conventionally, in order to further improve work efficiency and inspection accuracy, it is desired to develop a technique capable of easily and accurately creating inspection data.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a mounting board inspection data creation method and creation apparatus capable of easily and accurately creating inspection data.

  The present invention provides the following means.

[1] A method of creating the inspection data when inspecting an image obtained by imaging a mounting board on which an electronic component is mounted by comparing with reference data included in the inspection data.
A data creation step of creating the reference data by artificial data including numerical data indicating a shape;
An image display step for graphically displaying an artificial image specified by the artificial data;
And a verification step of verifying the artificial data based on the graphically displayed artificial image and correcting the artificial data as necessary.

[2] Before performing the image display step, the substrate to be inspected is imaged to obtain a captured image,
2. The mounting substrate inspection data creation method according to item 1, wherein the captured image is displayed as an image in the image display step.

  [3] The mounting board inspection data generation method according to the above item 2, wherein the displayed artificial image and the displayed captured image are superimposed in the image display step.

  [4] The mounting board inspection data creation method according to any one of [1] to [3], wherein the artificial data includes artificial part data corresponding to a part of an electronic component to be inspected.

  [5] The mounting board inspection data creation method according to any one of [1] to [4], wherein the artificial data includes artificial part data corresponding to an electronic part to be inspected.

  [6] The mounting board inspection data creation method according to any one of [1] to [5], wherein the artificial data includes artificial board data corresponding to a mounting board on which an electronic component to be inspected is mounted. .

  [7] The method for creating inspection data for a mounting board according to the item 2 or 3, wherein the board to be inspected is configured by a mounting board on which an electronic component is mounted.

[8] An apparatus that creates the inspection data when inspecting an image obtained by imaging a mounting board on which an electronic component is mounted by comparing with reference data included in the inspection data.
Data creation means for creating the reference data by artificial data including numerical data indicating a shape;
Image display means for graphically displaying an artificial image specified by the artificial data;
A mounting board inspection data creation device, comprising: verification means for verifying the artificial data based on the graphically displayed artificial image and correcting the artificial data as necessary.

  According to the mounting board inspection data creation method according to the above invention [1], the artificial data constructed based on the numerical data is adopted as the reference data serving as the inspection reference. It can be obtained, and the inspection accuracy by the inspection apparatus can be improved.

  In addition, since artificial data composed of numerical data is displayed graphically, artificial data can be captured with a shape image, artificial data can be created easily and accurately, and work efficiency and inspection standard accuracy can be improved. Can be improved.

  According to the mounting substrate inspection data creation method according to the above invention [2], the displayed artificial image can be created while being compared with the actually captured image, making the creation of the artificial data easier and Can be done accurately.

  According to the mounting substrate inspection data creation method according to the above invention [3], the displayed artificial image can be overlaid with the actually captured image for comparison, making the creation of the artificial data much easier. And can be done accurately.

  According to the mounting substrate inspection data creation method of the invention [4], it is possible to create a highly accurate inspection standard for each part of the electronic component.

  According to the mounting substrate inspection data creation method according to the invention [5], it is possible to create a highly accurate inspection standard for each electronic component.

  According to the mounting substrate inspection data creation method according to the invention [6], it is possible to create a highly accurate inspection standard for each substrate of the mounting substrate.

  According to the mounting substrate inspection data creation method according to the invention [7], since the displayed artificial image can be compared with the captured image of the mounting substrate on which the electronic component is actually mounted, the artificial data can be further verified. Can be done accurately.

  According to the above invention [8], it is possible to provide a mounting substrate inspection data creation device that exhibits the same effects as described above.

  FIG. 1 is a front view of an inspection apparatus according to an embodiment of the present invention. FIG. 2 is a side sectional view of the apparatus, and FIGS. 3 to 5 are block diagrams showing the internal structure of the inspection apparatus. As shown in these drawings, this inspection apparatus inspects the mounting state of the electronic component on the mounting board P on which the electronic component is mounted by the mounting machine.

  This inspection apparatus includes a frame (not shown) that is supported by a leg member, and a housing 1 is formed on the frame by a plurality of panels that are detachably attached by bolts. In the housing 1, an internal conveyor 2 is provided on the frame along the substrate transfer line XL (see FIG. 3). As shown in FIGS. 3 to 5, the inner conveyor 2 is configured to be movable by a Y-axis moving unit 20 along a Y-axis direction (front-rear direction) orthogonal to the transport line XL in a horizontal plane. That is, the inner conveyor 2 is attached to a pair of rails 22 arranged along the Y-axis direction so as to be slidable along the rail length direction. Further, the inner conveyor 2 is screwed to a ball screw 23 arranged along the Y-axis direction. When the ball screw 23 is driven to rotate by driving of the motor 24, the inner conveyor 2 moves in the Y-axis direction. It is configured to be. Thus, the internal conveyor 2 is configured to be moved along the Y-axis direction by the Y-axis moving means 20 between the conveyance line XL and the rear part (back part) in the housing 1.

  In addition, on the transfer line XL on both sides of the internal conveyor 2, a carry-in conveyor and a carry-out conveyor (not shown) respectively covered with conveyor covers 11 and 12 are provided. The housing 1 is provided with openings (not shown) through which the carry-in conveyor and the carry-out conveyor pass, respectively. In a state where the internal conveyor 2 is disposed on the transfer line XL, the mounting board P is transferred from the outside of the housing 1 to the internal conveyor 2 by the carry-in conveyor, and the board P on the internal conveyor 2 is transferred to the internal conveyor 2. And it is comprised so that it may carry out to the exterior of the housing 1 with the carrying-out conveyor.

  A camera 3 as an image pickup unit is disposed behind (inner part of) the inner conveyor 2 in the housing 1. The camera 3 is configured to be movable along the X-axis direction parallel to the transport line XL by the X-axis moving means 30. That is, the support member 31 that supports the camera 3 is attached to a pair of rails 32 arranged along the X-axis direction so as to be slidable along the rail length direction. Further, the camera support member 31 is screwed to a ball screw 33 arranged along the X-axis direction. When the ball screw 33 is driven to rotate by driving of the motor 34, the camera 3 is moved in the X-axis direction. It is configured to be moved.

  The camera support member 31 is provided with an illuminating device 35 for illuminating an area imaged by the camera 3.

  FIG. 6 is a block diagram showing a main control system constituted by a computer or the like of the inspection apparatus. As shown in the figure, in this apparatus, the CPU 5 controls the driving of each driving unit and the like, and the operation described in detail later is automatically executed. In the figure, an input device 41 such as a keyboard is for inputting various information related to the inspection to the inspection device, and a display device 42 such as a CRT display is for displaying various information. . Furthermore, the storage device 43 stores various data necessary for inspection.

  The image frame memory 51 also includes divided imaging data (divided images) obtained via the image input port 52, wide-area imaging data (wide-area images) obtained by processing the divided imaging data (inspection parts). Data) and the like. The memory 53 temporarily stores various data necessary for inspection. Further, the illumination controller 54 controls the driving of the illumination device 35 during imaging by the camera 3, and the motor controller 55 and the motor amplifier 56 control the driving of the X-axis moving unit 30 and the Y-axis moving unit 20 to control the camera. 3 is moved relative to the mounting substrate P in the XY-axis direction. Further, the CPU 5 is configured to be able to send and receive data with peripheral devices via various I / O ports 57.

  FIG. 7 shows an example of a captured image obtained by imaging the mounting board P to be inspected in this inspection apparatus.

  In this inspection apparatus, the number of times of imaging necessary for divided imaging, the imaging position, and the like are calculated from the substrate size and the camera field of view (imaging range), and the inspection target area of the mounting substrate P is in a grid pattern in the vertical and horizontal directions (XY axis directions) The image is divided into a plurality of image areas Pg.

  In this inspection apparatus, the image of the substrate to be inspected in this way is not compared with the master image obtained by imaging the master substrate or the like, but with the artificial component data in which the shape of each electronic component E is represented by artificial numerical data Further, whether or not the electronic component E is mounted on the board to be inspected is determined by comparing with mounting position data indicating a position where each electronic component E is to be mounted.

  Artificial part data (reference part data), mounting position data, and the like constitute part of the inspection data.

  The artificial part data is compared and collated with a captured image obtained by imaging a substrate to be inspected, and constitutes an inspection standard that serves as a criterion for determining the quality.

  The artificial part data is created by a computer provided in the inspection apparatus or an external computer that can execute a program for creating the artificial part data. In addition, each data constituting the artificial part data may be input by an operator or the like for the creation of inspection data, but the board manufacturing process and mask preparation process upstream of the inspection apparatus, cream solder application process, Alternatively, necessary data may be extracted and configured based on a manufacturing program used in the electronic component mounting process or the like. A data communication device with an input device such as a keyboard or a mouse provided in the inspection device or a device that performs an upstream process functions as data creation means for creating inspection data. A display device such as a display provided in the inspection device or the external computer functions as an image display unit and a verification unit.

  The artificial part data includes one to a plurality of artificial part data corresponding to the inspection target part of the electronic component, and arrangement data specifying the position and angle of the artificial part data. The arrangement data designates the position and angle in the component coordinate system with each component center as the origin.

  Further, the artificial part data includes color data, and the color tone and brightness of the electronic component can be expressed by, for example, RGB gradation.

  The artificial part data having the data configuration as described above is configured based on numerical data, and is configured from data that is numerically input. For this reason, an inspection standard without error can be obtained.

  The numerical input of this data is not limited to the time of creating inspection data, but as described above, the inspection data is created using production data in the upstream production process, electronic catalog data created by the parts manufacturer, and the like. In some cases, it may be performed at the time of inputting such data.

  The inspection data includes mounting position data indicating a position where an electronic component is to be mounted on the mounting board.

  In this inspection apparatus, a captured image obtained by imaging a substrate to be inspected is compared and collated with artificial component data to detect the position of the substrate of each electronic component, but the mounting position data is detected in this way. It is determined whether or not the position of the electronic component on the substrate is in an allowable position. For this reason, the mounting position data together with the artificial part data serves as an inspection standard for the mounting state of the electronic component.

  In this embodiment, the mounting position data is not extracted from a master image obtained by imaging a master substrate or the like, but is input and set as artificial numerical data. Thus, since the mounting position data also employs artificial numerical data, it is possible to obtain an inspection standard with no error regarding the mounting position of the electronic component.

  The mounting position data is also created in a computer provided in the inspection apparatus or an external computer capable of executing a program for creating artificial part data. Also, even if the mounting position data is input by an operator or the like to create inspection data, the board manufacturing process, mask preparation process, cream solder application process, or electronic component mounting upstream of the inspection apparatus Based on the manufacturing program used in the process or the like, necessary data may be extracted from this and configured.

  The inspection data includes substrate data. The board data is a data unit corresponding to the mounting board to be inspected, and one board data corresponds to one mounting board.

  In addition, each said artificial data, such as artificial part data, mounting position data, board | substrate data, artificial site | part data, arrangement | positioning data, and color data, comprises an inspection reference | standard and is contained in reference | standard data.

  Next, a method for creating inspection data in the present embodiment will be described. When creating the inspection data, the operator causes the computer of the inspection apparatus to execute a program for creating inspection data, and creates the inspection data according to the program.

  First, the entire area of the mounting substrate P such as a sample substrate on which the electronic component E is mounted is divided into a plurality of imaging regions Pg as shown in FIG. Then, the captured images are connected on the memory to create a mounting board captured image corresponding to the entire mounting board P.

  Next, the operator creates artificial part data according to the inspection item. The inspection items include, for example, the mounting state of the electronic component on the substrate, the position and orientation of the body portion of the electronic component E, the type of the component, etc. Here, the mounting of the electronic component on the substrate in the lead portion A case where the state is an inspection item will be described as an example. 8 to 13 below, Eb represents a body portion of the electronic component E in the captured image, El represents a lead portion of the electronic component E, and Pe represents an electrode for mounting the lead portion provided on the substrate. Further, Ge represents an artificial part image, and Gl represents an artificial part image.

  When creating artificial part data, the operator first inputs artificial part data corresponding to the lead mounting portion as numerical data. For example, data relating to the shape, dimensions, and color is input as numerical data. By this input, the numerical data is displayed as a number on the display device. Further, the numerical data is combined and processed by the computer, and the artificial image G1 indicated by the numerical data is automatically displayed on the display device as shown in FIG. The artificial image Gl may be displayed each time the input data is displayed, and may be displayed from the stage during image creation. After the artificial part data is input, the artificial image Gl may be displayed in units (elements). Anyway.

  Next, the electronic component E to be inspected is cut out from the captured image of the mounting board, and the electronic component image is displayed as an image on the display device.

  Subsequently, the artificial part image Gl displayed graphically is superimposed on the lead mounting part (inspection target part) El in the image of the electronic component E cut out as shown in FIG.

  Then, the artificial part image Gl is verified and confirmed in a state of being superimposed on the taken part image (El), and is corrected and finely adjusted as necessary. Needless to say, the correction work is performed by changing numerical data.

  As described above, in the present embodiment, since the inspection reference part made up of numerical data is displayed in a graphic form, the operator can grasp the shape, color, position, etc. with the shape image, compared with the case of capturing with the numerical image. Thus, the reference part can be confirmed easily and accurately, the accuracy of the inspection standard can be improved, and consequently the inspection accuracy can be improved. Furthermore, human input errors can be greatly reduced, and the inspection efficiency can be greatly improved.

  Moreover, in the present embodiment, the display image Gl of the inspection reference part is superimposed on the display image El of the part to be inspected, so that both comparisons can be accurately performed and the illegal part can be accurately grasped, Correction and confirmation work can be performed efficiently and accurately.

  In the present embodiment, a substrate on which an electronic component is actually mounted is used as a substrate to be imaged. However, the present invention is not limited to this, and in the present invention, an empty substrate on which no electronic component is mounted is imaged. The captured image and the image of the artificial part may be compared to verify or correct the artificial part data. That is, even if it is an empty substrate, the mounting position of the lead portion can be grasped, and therefore, the artificial part data may be verified or confirmed based on the mounting position. Furthermore, since the type, position, orientation, etc. of the electronic component can be grasped even with a blank substrate, the verification is performed in comparison with the captured image of the blank substrate when verifying the shape and position of the following artificial component data. be able to. However, since the actual electronic component image can be compared with the artificial image by using the mounting substrate, verification and correction can be performed more accurately.

  Following the above artificial part data input correction operation, necessary artificial part data is created by inputting numerical data. Here, the shape represented by the artificial part data is copied and developed and arranged, and artificial part data corresponding to all of the lead mounting parts (test target parts) is created. At this time, similarly to the above, the numerical value data and the image G1 indicated by the data are graphically displayed on the display device as shown in FIG.

  The module data as one examination unit is created by combining the artificial part data of all the lead mounting portions thus created.

  Next, an image of the imaged electronic component E is displayed, and the artificial part image indicated by the module data is superimposed on the image as shown in FIG. 11 to verify the artificial part data, and if necessary, Adjust the shape, position, color, etc.

  The artificial part data (module data) created in this way is configured as one piece of artificial part data (model data).

  When other inspection items, such as body position and orientation, and part type, are used as inspection items, reference data on these items is input and combined with the module data to create one artificial part data. Is done. Data input in this case is also performed by inputting numerical data, and the shape or the like indicated by the data is graphically displayed on the display device as necessary. Further, a corresponding captured image is displayed as an image, and both display images are superimposed, and input data is verified and corrected.

  Subsequently, in the same manner as described above, artificial part data is created for each type of part mounted on the mounting board to be inspected.

  Subsequently, the board data corresponding to the mounting board and the mounting position data indicating the mounting position of each artificial part data on the board are input as numerical data to create the artificial board data. Also at the time of this input, as described above, numerical data is displayed on the display device, and as shown in FIG. 12, artificial part data (artificial part data) in which the board represented by the numerical data is associated with the position with respect to the board. The image Ga) is displayed graphically. It should be noted that the shape and the like represented by the artificial part data can also be copied and deployed in the input of the mounting position data.

  By inputting the mounting position data of all the parts in this way, artificial board data in which the artificial parts are mounted on the board is created, and an image corresponding to the data is displayed graphically on the display device.

  Next, the image of the mounted substrate to be inspected is displayed as an image on a display device, and the artificial substrate image is superimposed on the image and displayed as shown in FIG. In this state, the position of the component of the artificial board image is verified / confirmed, corrected as necessary, and finely adjusted. This adjustment operation is also performed by changing the numerical data.

  Also in this adjustment operation, the operator can grasp the part position and the like with the shape image, and can easily and accurately check the reference data such as the part position and can further improve the inspection accuracy.

  Moreover, in this embodiment, since the image of the imaging board and the image of the artificial board are superimposed, the comparison between the two can be performed accurately, and the illegal portion can be accurately grasped, so that the confirmation and correction work can be performed efficiently. Can be done well.

  In the above-described embodiment, the mounting position data of all components is input to create artificial board data, and then compared with the image of the imaging board. However, the present invention is not limited to this, and in this embodiment, 1 Each time a plurality of mounting position data are input, the image may be verified and corrected each time compared with the image on the imaging board.

  In the present embodiment, using inspection data such as artificial substrate data created as described above, substrate inspection is performed by an inspection apparatus as will be described below.

  First, inspection data including artificial part data and mounting position data is acquired. The acquisition of the inspection data may be created by inputting and setting each data as described above, or may be created by processing production data used in the upstream process.

  If inspection data is set in the inspection device, an image processing test based on actual inspection is performed using a sample substrate or the like, the inspection data is finally checked, and then the substrate to be actually inspected is inspected. Executed.

  That is, as shown in FIG. 14, the inspection target substrate is imaged, and a captured image of the inspection target is acquired (step S11). In this imaging, as described above, the substrate is divided into a lattice pattern, and the entire inspection target substrate is imaged by moving the camera relative to each area, and the divided images are combined to obtain a wide area image of the entire substrate. FIG. 7 is an example of the wide area image obtained in this way.

  When the substrate is thus imaged, the inspection range is cut out from the wide area image obtained by combining the divided images (step S12). This cutout range is included in the inspection data in advance.

  Next, the cut-out captured image and the artificial image (inspection standard) created as the artificial component data are compared and collated by image processing, and the mounting state of the electronic component is inspected (step S13). In this inspection, the pass / fail of the position, angle posture, color, etc. of the inspection target portion of the electronic component in the captured image, and the position, angle posture, etc. of the electronic component are determined based on the deviation from the artificial image.

  Subsequently, all the electronic components on the board to be inspected are inspected in the same manner as described above (step S14: No). When the inspection of all electronic components is completed (step S14: Yes), the inspection result is output, and the result is output to the display device and accumulated.

  Thus, the inspection for one inspection target substrate is completed.

  Note that the inspection data created by the present invention is not limited to the inspection apparatus of the above-described embodiment, and can be applied to other inspection apparatuses. For example, the inspection data of the present invention can be applied to an inspection apparatus in which a substrate to be inspected is imaged for each electronic component and image processing is sequentially performed on the captured image for each component.

It is a front view of the inspection device concerning one embodiment of this invention. It is side surface sectional drawing which shows the inspection apparatus of embodiment. It is a top view which shows roughly the internal structure in the inspection apparatus of embodiment. It is a front view which shows roughly the internal structure in the inspection apparatus of embodiment. It is a side view which shows roughly the internal structure in the inspection apparatus of embodiment. It is a block diagram which shows the main control system of the inspection apparatus of embodiment. It is a top view which divides | segments and shows a mounting board | substrate in an imaging area in embodiment. It is a top view which shows the artificial part image displayed graphically in embodiment. It is a top view in the state where an artificial part image was superimposed and displayed on an imaging part image in an embodiment. It is a top view which shows the artificial part image displayed graphically in embodiment. It is a top view in the state where the artificial part image was superimposed and displayed on the imaging part image in the embodiment. It is a top view which shows the artificial board | substrate image displayed graphically in embodiment. It is a top view in the state where an artificial board image was superimposed and displayed on an imaging board picture in an embodiment. It is a flowchart which shows the test | inspection procedure by the test | inspection apparatus of embodiment.

Explanation of symbols

E Electronic parts Ge Artificial part image Gl Artificial part image P Mounting board

Claims (8)

An image obtained by imaging a mounting board on which electronic components are mounted is a method of creating the inspection data when inspecting and comparing with reference data included in the inspection data,
A data creation step of creating the reference data by artificial data including numerical data indicating a shape;
An image display step for graphically displaying an artificial image specified by the artificial data;
And a verification step of verifying the artificial data based on the graphically displayed artificial image and correcting the artificial data as necessary. Before performing the image display step, image the inspection target substrate to obtain the captured image,
2. The mounting board inspection data creation method according to claim 1, wherein in the image display step, the captured image is displayed as an image.   3. The mounting board inspection data creation method according to claim 2, wherein the displayed artificial image and the displayed captured image are superimposed in the image display step.   4. The mounting board inspection data creation method according to claim 1, wherein the artificial data includes artificial part data corresponding to a part of an electronic component to be inspected.   5. The method for creating inspection data for a mounting board according to claim 1, wherein the artificial data includes artificial part data corresponding to an electronic part to be inspected.   6. The mounting board inspection data creation method according to claim 1, wherein the artificial data includes artificial board data corresponding to a mounting board on which an electronic component to be inspected is mounted.   4. The mounting substrate inspection data creation method according to claim 2, wherein the inspection target substrate is configured by a mounting substrate on which electronic components are mounted. An apparatus for creating the inspection data when inspecting the image obtained by imaging the mounting board on which the electronic component is mounted by comparing with reference data included in the inspection data,
Data creation means for creating the reference data by artificial data including numerical data indicating a shape;
Image display means for graphically displaying an artificial image specified by the artificial data;
A mounting board inspection data creation device, comprising: verification means for verifying the artificial data based on the graphically displayed artificial image and correcting the artificial data as necessary.