JP2006067621A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To connect a signal wiring of a functional module to a coaxial cable, without being affected by external noise. <P>SOLUTION: The functional module 101 has a first signal pad 104, and a first reference potential pad 107 enclosing the first signal pad. A multilayered circuit board has a second signal pad 111 electrically connected to the first signal pad, a second reference potential pad 114, which is electrically connected to the first reference potential pad and encloses the second signal pad, a first wiring 109 for a signal formed within the board, and second wiring, third wiring 113 for the reference potential respectively provided on surface, inside of the board, such that they sandwich the first wiring. The multilayered circuit board has a signal via 110 connecting the second signal pad to the first wiring, and a plurality of reference potential vias 112, connecting the second reference potential pad to the third wiring, and the signal via is enclosed by a plurality of the reference potential vias. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic device, and more particularly to an electronic device including a functional module such as a sensor and a multilayer circuit board for relay connection of output signal wiring of the functional module to a coaxial cable.

  A configuration shown in FIG. 21 will be described as a conventional sensor device. FIG. 21 is a perspective view of a conventional sensor device. In the sensor module 2001 as a functional module, one end of the signal wiring 2003 of the multilayer wiring portion formed in a thin film on the substrate surface is connected to the signal pad 2004, and one end of the ground wiring 2005 of the multilayer wiring portion is connected to the ground pad 2006. Has been. Here, when the signal wiring 2003 is in the inner layer, the signal wiring 2003 is led to the uppermost layer through the via. In the multilayer circuit board 2002, one end of the signal wiring 2007 is connected to the signal pad 2008, the other end of the signal wiring 2007 is connected to the signal pad 2013, and one end of the ground wiring 2009 is connected to the ground pad 2010. The other end of the ground wiring 2009 is connected to the ground pad 2014. Further, the sensor module 2001 is fixed to the multilayer circuit board 2002, the signal pad 2004 and the signal pad 2008 are connected by the bonding wire 2011, and the ground pad 2006 and the ground pad 2010 are connected by the bonding wire 2012. Yes. The center conductor 2016 of the semi-rigid coaxial cable 2015 is connected to the signal pad 2013 using solder or the like, and the outer conductor 2017 of the semi-rigid coaxial cable 2015 is connected to the ground pad 2014 using solder or the like.

Examples of the connection configuration between the multilayer circuit board and the semi-rigid coaxial cable are shown in Patent Document 1 and Patent Document 2.
JP 2001-102817 A JP 2001-320208 A

  However, in the configuration of the conventional sensor device shown in FIG. 21, the multilayer wiring portion of the sensor module 2001 and the signal wiring, pads, and bonding wires of the multilayer circuit board 2002 are exposed, so that they are affected by external noise. In addition, there is a problem that high-frequency signal transmission characteristics are likely to deteriorate due to the influence of the resistance and inductance of the bonding wire, and soldering is attempted even if the sensor module 2001 and the semi-rigid coaxial cable 2015 are directly soldered. There is a problem that the sensor module 2001 is weak against a mechanical shock accompanying attachment, and further, a process for fixing the sensor module 2001 to the multilayer circuit board 2002 is required.

  The present invention has been made in view of such a problem, and the signal wiring that is the inner layer wiring of the multilayer wiring part formed with a thin film of a functional module such as a sensor is not affected by external noise and has a good high frequency. An object of the present invention is to provide an electronic device that is connected to a coaxial cable with signal transmission characteristics, and at the same time, its functional module is firmly fixed to a multilayer circuit board.

The electronic device according to the present invention includes a first signal pad formed on a first surface of a substrate and a first reference potential formed on the first surface so as to surround the first signal pad. A functional module having a pad,
An insulating substrate, electrically connected to the first signal pad, electrically connected to the second signal pad formed on the second surface of the insulating substrate, and the first reference potential pad A second reference potential pad connected to the second surface so as to surround the second signal pad; a first signal wiring formed inside the insulating substrate; A third signal pad electrically connected to the second signal pad via the first wiring, and the second surface of the insulating substrate or the second wiring so as to sandwich the first wiring; A second wiring for reference potential provided inside, a third wiring for reference potential provided inside the insulating substrate, and the second wiring via the second wiring and the third wiring. And a third reference potential pad electrically connected to the reference potential pad And the road board,
A coaxial cable having a center conductor and an outer conductor surrounding the center conductor, the center conductor being connected to the third signal pad, and the outer conductor being connected to the third reference potential pad;
An electronic device comprising:
The multilayer circuit board includes a plurality of reference potentials for connecting the second reference potential pad and the third wiring, and a signal via for connecting the second signal pad and the first wiring. For vias,
The signal via is an electronic device surrounded by the plurality of reference potential vias.

In the electronic device of the present invention, the substrate of the functional module is a substrate having a multilayer wiring portion,
A fourth wiring provided in the multilayer wiring portion and electrically connected to the first signal pad;
A fifth wiring for reference potential provided on the first surface and a sixth wiring for reference potential provided inside the multilayer wiring portion so as to sandwich the fourth wiring;
A second signal via for connecting the fourth wiring and the first signal pad;
A plurality of second reference potential vias for connecting the first reference potential pad and the sixth wiring;
It is desirable that the second signal via is surrounded by the plurality of second reference potential vias.

In the electronic device of the present invention, the second wiring is provided inside the insulating substrate,
The second reference potential pad and the second wiring are connected by a third reference potential via,
It is preferable that the signal via is surrounded by the plurality of reference potential vias and the third reference potential via.
In the electronic device of the present invention, a sensor module can be used as the functional module.

The effect of the present invention is that the signal wiring of a functional module such as a sensor is connected to a coaxial cable with good high-frequency signal transmission characteristics without being affected by external noise, and at the same time, the functional module is firmly fixed to the multilayer circuit board. It is possible to realize an electronic device.
Further, in the present invention, the shielding performance of the via layer portion can be improved by surrounding the signal via with the reference potential via.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  Next, the configuration of the electronic device according to the first embodiment of the present invention will be described with reference to FIGS. 1 is an exploded perspective view of an electronic device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the electronic device according to the present embodiment, and FIG. 3 is a multilayer wiring portion in FIG. FIG. 4A is a plan view of a pad portion of the multilayer wiring portion in FIG. 3, and FIG. 4B is a cross-sectional view of the pad portion of the multilayer circuit substrate. 5A is a cross-sectional view of the via portion of the multilayer wiring portion in FIG. 3, FIG. 5B is a cross-sectional view of the via portion of the multilayer circuit board, and FIG. ) Is a cross-sectional view of the signal wiring and ground wiring portion of the multilayer wiring portion in FIG. 3, and FIG. 6B is a cross-sectional view of the signal wiring and ground wiring portion of the multilayer circuit board.

  As shown in FIG. 1, the electronic device according to the first embodiment of the present invention includes a sensor module 101 as a functional module and a multilayer circuit board 108 made of a dielectric material, and the sensor module 101 is a multilayer circuit. One end of a semi-rigid coaxial cable 120 that is electrically connected and fixed to one end of the surface of the substrate 108 and connected to an external measuring device is connected to the other end of the surface of the multilayer circuit substrate 108, and further, a conductor case The connection part of the semi-rigid coaxial cable 120 is surrounded by 125.

  As shown in FIG. 3, the sensor module 101 includes a substrate 129 that is a glass substrate, a sapphire substrate, a silicon substrate, and the like, and a multilayer wiring portion 130 that is formed as a thin film on the surface of the substrate 129.

  The multilayer wiring section 130 includes a signal wiring 102 as an inner layer wiring, a signal via 103, a signal pad 104, a ground via 105 as a reference potential via, and two ground wirings 106 as reference potential wirings. And a ground pad 107 as a reference potential pad.

  One of the two ground wirings 106, the signal pad 104, and the ground pad 107 is provided in the same layer on the surface of the multilayer wiring part 130.

  The signal pad 104 is provided with bumps 115 as conductors for connection, and the ground pad 107 is provided with bumps 116 as conductors for connection.

  As shown in FIGS. 2 and 3, the multilayer circuit board 108 includes a signal wiring 109 which is an inner layer wiring, a signal via 110, a signal pad 111, a ground via 112 as a reference potential via, and a reference Two ground wirings 113 as potential wirings, a ground pad 114 as a reference potential pad, a signal pad 121, a ground pad 122, a signal via 132, and a ground via 133 are provided.

  A signal pad 111 and a ground pad 114 are provided at one end of the multilayer circuit board 108, and a signal pad 121 and a ground pad 122 are provided at the other end of the multilayer circuit board 108.

  One of the two ground wirings 113, the signal pad 111, the ground pad 114, the signal pad 121, and the ground pad 122 are provided in the same layer on the surface of the multilayer circuit board 108. The other of the two ground wirings 113 is provided in the inner layer of the multilayer circuit board 108.

  First, the configuration of the connection portion between the sensor module 101 and the multilayer circuit board 108 will be described.

  An output signal of the sensor element formed on the substrate 129 is transmitted to one end of the signal wiring 102, and a reference potential of the output signal of the sensor element is transmitted to one end of the ground wiring 106.

  The other end of the signal wiring 102 is connected to the signal pad 104 through the signal via 103. The other end of the surface side ground wiring 106 is connected to the ground pad 107, and the other end of the inner layer side ground wiring 106 is connected to the ground pad 107 via the ground via 105.

  On the other hand, one end of the signal wiring 109 is connected to the signal pad 111 via the signal via 110, and the other end of the signal wiring 109 is connected to the signal pad 121 via the signal via 132.

  One end of the surface side ground wiring 113 is connected to the ground pad 114, and the other end of the surface side ground wiring 113 is connected to the ground pad 122. One end of the ground wiring 113 on the inner layer side is connected to the ground pad 114 via the ground via 112, and the other end of the ground wiring 113 on the inner layer side is connected to the ground pad 122 via the ground via 133. The

  The signal pad 104 and the signal pad 111 are connected by the bump 115, and the ground pad 107 and the ground pad 114 are connected by the bump 116.

  The size and position of the bump 115 are set so that they do not protrude from the signal pad 104 and the signal pad 111 after connection and are short-circuited with the bump 116, the ground pad 107, and the ground pad 114.

  As shown in FIG. 4A, the ground pad 107 surrounds the signal pad 104 in the multilayer wiring portion 130. Bumps 115 are provided on the surface of the signal pad 104, and a plurality (eight in this case) of bumps 116 are provided on the surface of the ground pad 107. As shown in FIG. 4B, in the multilayer circuit board 108, a ground pad 114 surrounds the signal pad 111.

  It is preferable that the signal pad 104 and the signal pad 111 have the same size. In addition, the distance between the signal pad 104 and the ground pad 107 and the distance between the signal pad 111 and the ground pad 114 are preferably the same. As a result, alignment at the time of bump connection is facilitated, and disturbance of the electromagnetic field is suppressed by maintaining the continuity of the wiring structure as much as possible after connection, thereby improving high-frequency characteristics.

  As for the number and arrangement of the bumps 115 provided on the signal pad 104, it is preferable to arrange the bumps 115 symmetrically with respect to the center of the pad in the case of one, and symmetrical with respect to the center point of the pad in the case of plural.

  In addition, the plurality of bumps 116 provided on the ground pad 107 are disposed so as to surround the bump 115, but the plurality of bumps 116 are preferably disposed such that adjacent bumps 116 are equally spaced. .

  FIG. 5A is a cross-sectional view of the via portion at the position of the alternate long and short dash line 131 of the multilayer wiring portion 130, and seven ground vias 105 connected to the ground pad 107 surround the signal via 103. . Here, the ground via 105 is not disposed in the passage portion of the signal wiring 102 so that the signal wiring 102 and the ground via 105 are not short-circuited. FIG. 5B is a cross-sectional view of the via portion at the position of the one-dot chain line 117 of the multilayer circuit board 108, and seven ground vias 112 connected to the ground pad 114 surround the signal via 110. . Here, the ground via 112 is not disposed in the passage portion of the signal wiring 109 so that the signal wiring 109 and the ground via 112 are not short-circuited.

  The number and arrangement of the ground vias 105 and the ground vias 112 are not limited as described above. It is preferable that the number of ground vias 105 and the number of ground vias 112 be as large as possible.

  FIG. 6A is a cross-sectional view of the signal wiring 102 and the ground wiring 106 at the position of the one-dot chain line 118 of the multilayer wiring section 130, and the signal wiring 102 is sandwiched between two ground wirings 106 that are upper and lower conductor layers. Stripline structure. Here, the pattern width of the ground wiring 106 is set larger than the pattern width of the signal wiring 102. FIG. 6B is a cross-sectional view of the signal wiring 109 and the ground wiring 113 at the position of the one-dot chain line 119 of the multilayer circuit board 108. The signal wiring 109 is sandwiched between two ground wirings 113 that are upper and lower conductor layers. Stripline structure. Here, the pattern width of the ground wiring 113 is set larger than the pattern width of the signal wiring 109.

  Next, the configuration of the connection portion between the multilayer circuit board 108 and the semi-rigid coaxial cable 120 will be described.

  As shown in FIGS. 1 and 2, the central conductor 123 of the semi-rigid coaxial cable 120 is soldered to the signal pad 121 by solder 126, and the outer conductor 124 of the semi-rigid coaxial cable 120 is soldered to the ground pad 122. Connected.

  Further, the conductor case 125 is soldered and connected to the ground pad 122 by solder 127 so that the conductor case 125 covers and surrounds the connection portion of the center conductor 123, and the conductor case 125 is soldered by the solder 128. 124 is connected by soldering. Here, it is preferable that the ground pad 122, the outer conductor 124, and the conductor case 125 are soldered and connected to each other without a gap.

  Next, the effect by this Embodiment is demonstrated. First, since the sensor module 101 and the multilayer circuit board 108 are connected by the bumps 115 and 116, a space for mounting the sensor module 101 on the multilayer circuit board 108 can be reduced. Further, since the connection is made at an extremely short distance, transmission loss or delay due to the inductance component and resistance component of the bonding wire generated in the conventional example can be suppressed. In addition, since the electrical connection and fixing (mechanical connection) of the sensor module 101 and the multilayer circuit board 108 are simultaneously performed by the bump 115 and the bump 116, the sensor module required in the conventional example is fixed on the multilayer circuit board. The assembly process for this can be made unnecessary.

  Further, the signal pad 104 connected to the signal wiring 102 is surrounded by the ground pad 107 connected to the ground wiring 106, and the signal pad 111 connected to the signal wiring 109 is surrounded by the ground pad 114 connected to the ground wiring 113. Thus, electromagnetic interference between the sensor output signal and external noise or another wiring signal can be suppressed. Further, since the bumps 115 and the bumps 116 can be provided in a concentrated manner, the stability of conduction and the mechanical strength can be increased.

  Next, the bump 115 connected to the signal wiring 102 and the signal wiring 109 is surrounded by the bump 116 connected to the ground wiring 106 and the ground wiring 113, so that the shield performance of the bump connection portion is improved, and the sensor Electromagnetic interference between the output signal and external noise or another wiring signal can be suppressed. The bumps 116 connected to the ground wiring 106 and the ground wiring 113 are preferably arranged close to each other because the smaller the distance from the adjacent bump, the greater the suppression effect.

  Next, the signal via 103 connected to the signal wiring 102 is surrounded by the ground via 105, and the signal via 110 connected to the signal wiring 109 is surrounded by the ground via 112. The shield performance is improved, and electromagnetic interference between the sensor output signal and external noise or another wiring signal can be suppressed. The ground vias 105 connected to the ground wiring 106 and the ground vias 112 connected to the ground wiring 113 are arranged closer to each other because the smaller the distance between adjacent vias, the greater the suppression effect. It is preferable to do.

  In the present embodiment, the signal via is surrounded by the ground via in both of the multilayer wiring part 130 and the multilayer circuit board 108. However, at least one of the multilayer wiring part 130 and the multilayer circuit board 108 is used. On the other hand, the signal via can be surrounded by the ground via, and the corresponding effect can be obtained.

  Further, by providing a large number of bumps 115 and bumps 116 for connection, the impedance of the connection portion can be lowered, and the stability and mechanical strength of the circuit operation can be increased.

  Next, the signal wiring 102 in the inner layer of the multilayer wiring part 130 is sandwiched between two ground wirings 106 that are the upper and lower conductor layers to form a strip line structure, and the signal wiring 109 in the inner layer of the multilayer circuit board 108 is By adopting a strip line structure sandwiched between two ground wirings 113 which are conductor layers, the shield performance of the relay wiring portion is improved, and electromagnetic interference between the sensor output signal and external noise or another wiring signal is reduced. Can be suppressed. In addition, since the characteristic impedance of the wiring can be easily designed, reflection loss due to impedance mismatching can be suppressed and high-frequency signal transmission characteristics can be improved.

  In this embodiment, both the multilayer wiring part 130 and the multilayer circuit board 108 have a stripline structure in which the signal wiring is sandwiched between two ground wirings. In at least one of them, a signal line can be sandwiched between two ground lines to form a stripline structure, and the above-described effects can be obtained.

  Next, since the connection portion between the signal pad 121 of the multilayer circuit board 108 and the central conductor 123 of the semi-rigid coaxial cable 120 is enclosed by the conductor case 125 and sealed, the shielding performance against external noise is improved. be able to. Further, since the conductor case is connected to the ground pad 122 of the multilayer circuit board 108 and the outer conductor 124 of the semi-rigid coaxial cable 120, the shielding performance can be further improved. In addition, since the conductor case 125 functions as part of the ground wiring, impedance matching is good, the ground potential is stabilized, and high-frequency signal transmission characteristics can be improved. Further, the mechanical strength of the connecting portion of the semi-rigid coaxial cable 120 can be increased.

  As described above, the signal wiring that is the inner layer wiring of the multilayer wiring portion formed of the thin film of the functional module such as the sensor is connected to the coaxial cable with good high frequency signal transmission characteristics without being affected by external noise, and at the same time An electronic device in which the functional module is firmly fixed to the multilayer circuit board is realized.

  Next, the configuration of the electronic device according to the second embodiment of the present invention will be described with reference to FIGS. FIG. 7 is an exploded perspective view of the electronic device according to the second embodiment of the present invention, and FIG. 8 is a cross-sectional view of the electronic device according to the second embodiment of the present invention.

  The difference between the configuration of the electronic device of the present embodiment and the configuration of the electronic device of the first embodiment of the present invention shown in FIGS. 1 to 6 is that the connection configuration of the semi-rigid coaxial cable 120 is changed, Since the multilayer circuit board 108 is only the part that has been changed to the multilayer circuit board 108a and the other components are the same, the configuration shown in FIGS. 7 and 8 and the configuration shown in FIGS. The same components are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 7, the electronic device according to the second embodiment of the present invention includes a sensor module 101 and a multilayer circuit board 108a. The sensor module 101 is electrically connected to one end of the surface of the multilayer circuit board 108a. One end of the semi-rigid coaxial cable 120 connected to and fixed to the external measuring device is connected to the other end of the surface of the multilayer circuit board 108a, and the connection portion of the semi-rigid coaxial cable 120 is further connected by the conductor case 203 Is a configuration surrounded by

  As shown in FIG. 8, the multilayer circuit board 108 a includes a signal pad 201 that replaces the signal pad 121, a ground pad 202 that replaces the ground pad 122, and a signal that replaces the signal via 132. A via 207 for ground and a ground via 208 instead of the ground via 133.

  The other end of the signal wiring 109 is connected to the signal pad 201 via the signal via 207. The other end of the ground wiring 113 on the front side is connected to the ground pad 202. The other end of the ground wiring 113 on the inner layer side is connected to the ground pad 202 via the ground via 208.

  The center conductor 123 of the semi-rigid coaxial cable 120 is soldered and connected to the signal pad 201 by solder 204. Then, the semi-rigid coaxial cable 120 is passed through the hollow portion of the hollow cylindrical conductor case 203 so that the end of the conductor case 203 is in close contact with the ground pad 202 so that the conductor case 203 covers and surrounds the connection portion of the center conductor 123. Thus, the conductor case 203 and the ground pad 202 are soldered and connected by the solder 205, and the conductor case 203 and the outer conductor 124 of the semi-rigid coaxial cable 120 are soldered and connected by the solder 206. In this case, it is preferable to solder the conductor case 203 without a gap.

  In the configuration shown in FIGS. 7 and 8, the semi-rigid coaxial cable 120 is connected at an angle of 90 degrees so as to abut against the multilayer circuit board 108a vertically, but is not limited to this angle. The semi-rigid coaxial cable 120 may be abutted obliquely at an arbitrary angle with respect to the multilayer circuit board 108a, and the conductor case 203 may be formed in a hollow cylindrical shape whose end is obliquely cut so as to match it.

  As described above, according to the electronic device of the second embodiment of the present invention, an effect that the electronic device of the first embodiment of the present invention can be formed in an L shape is obtained.

  Next, the configuration of the electronic device according to the third embodiment of the present invention will be described with reference to FIGS. FIG. 9 is an exploded perspective view of the electronic device according to the third embodiment of the present invention, and FIG. 10 is a cross-sectional view of the electronic device according to the third embodiment of the present invention.

  The difference between the configuration of the electronic device of the present embodiment and the configuration of the electronic device of the first embodiment of the present invention shown in FIGS. 1 to 6 is that the connection configuration of the semi-rigid coaxial cable 120 is changed, Since the multilayer circuit board 108 is only the part that has been changed to the multilayer circuit board 108b and the other components are the same, the configuration shown in FIGS. 9 and 10 and the configuration shown in FIGS. The same components are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 9, the electronic device according to the third embodiment of the present invention includes a sensor module 101 and a multilayer circuit board 108b. The sensor module 101 is electrically connected to one end of the surface of the multilayer circuit board 108b. One end of the semi-rigid coaxial cable 120 connected to and fixed to the external measuring device is connected to the other end of the surface of the multilayer circuit board 108b, and the connection portion of the semi-rigid coaxial cable 120 is connected by the conductor case 304 Is a configuration surrounded by

  The multilayer circuit board 108b includes a staircase structure 301 formed near the center of one end. As shown in FIG. 10, the multilayer circuit board 108b includes a signal pad 302 instead of the signal pad 121, and a ground pad. And a ground pad 303 and a ground pad 305 instead of 122.

  A signal pad 302 is provided on the staircase surface one step below the surface of the multilayer circuit board 108 b in the staircase structure 301. A ground pad 303 is provided on the step surface two steps below the surface of the multilayer circuit board 108 b in the staircase structure 301.

  The other end of the signal wiring 109 is connected to the signal pad 302. The other end of the ground wiring 113 on the front side is connected to the ground pad 305. The other end of the ground wiring 113 on the inner layer side is connected to the ground pad 303.

  The central conductor 123 of the semi-rigid coaxial cable 120 is soldered and connected to the signal pad 302 by solder 306. Further, the outer conductor 124 of the semi-rigid coaxial cable 120 is soldered to the ground pad 303 by soldering. The conductor case 304 and the ground pad 305 are soldered and connected by the solder 307 so that the conductor case 304 covers and surrounds the connection portion of the center conductor 123, and the conductor case 304 and the semi-rigid coaxial cable 120 are connected by the solder 308. The outer conductor 124 is connected by soldering. In this case, it is preferable to solder the conductor case 304 without a gap.

  As described above, according to the electronic device of the third embodiment of the present invention, there is an effect that the electronic device of the first embodiment of the present invention can be made thinner.

  Next, the configuration of the electronic device according to the fourth embodiment of the present invention will be described with reference to FIGS. FIG. 11 is an exploded perspective view of the electronic device according to the fourth embodiment of the present invention, and FIG. 12 is a cross-sectional view of the electronic device according to the fourth embodiment of the present invention.

  The difference between the configuration of the electronic device of the present embodiment and the configuration of the electronic device of the first embodiment of the present invention shown in FIGS. 1 to 6 is that the connection configuration of the semi-rigid coaxial cable 120 is changed, Since the multilayer circuit board 108 is only the part that has been changed to the multilayer circuit board 108c and the other components are the same, the configuration shown in FIGS. 11 and 12 and the configuration shown in FIGS. The same components are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 11, the electronic device according to the fourth embodiment of the present invention includes a sensor module 101 and a multilayer circuit board 108c, and the sensor module 101 is electrically connected to one end of the surface of the multilayer circuit board 108c. One end of the semi-rigid coaxial cable 120 connected to and fixed to the external measuring device is connected to the end surface of the multilayer circuit board 108c, and the connection portion of the semi-rigid coaxial cable 120 is surrounded by the conductor case 404. It is a configuration.

  As shown in FIG. 12, the multilayer circuit board 108 c includes a signal pad 401 that replaces the signal pad 121, a ground pad 403 and a ground pad 405 that replaces the ground pad 122, and a ground via 133. A ground via 402 instead of the above.

  A signal pad 401 is provided on the end surface of the multilayer circuit board 108c. A ground pad 403 is provided on the surface of the multilayer circuit board 108c opposite to the ground wiring 113 on the front surface side.

  The other end of the signal wiring 109 is connected to the signal pad 401. The other end of the ground wiring 113 on the front side is connected to the ground pad 405. The other end of the ground wiring 113 on the inner layer side is connected to the ground pad 403 through the ground via 402.

  The center conductor 123 of the semi-rigid coaxial cable 120 is soldered and connected to the signal pad 401 with solder 406. A hole is provided in the conductor case 404, and the end of the conductor case 404 is connected to the ground pad 403 and the ground so that the semi-rigid coaxial cable 120 passes through the hole and the conductor case 404 covers and surrounds the connection portion of the center conductor 123. The conductor case 404 and the ground pad 403 and the ground pad 405 are soldered and connected to a part of the pad 405 for soldering, and the conductor case 404 and the outer conductor 124 of the semi-rigid coaxial cable 120 are connected to each other by the solder 408. Solder connection. In this case, it is preferable to solder the conductor case 404 without a gap.

  As described above, according to the electronic device of the fourth embodiment of the present invention, an effect that the electronic device of the third embodiment of the present invention can be made thinner is obtained.

  Next, the configuration of the electronic device according to the fifth embodiment of the present invention will be described with reference to FIGS. 13 is a cross-sectional view of a connection portion between a multilayer wiring portion and a multilayer circuit board in an electronic device according to a fifth embodiment of the present invention. FIG. 14 is a cross-sectional view of a via portion of the multilayer circuit board in FIG. It is.

  The difference between the configuration of the electronic device according to the fifth embodiment of the present invention and the configuration of the electronic device according to the first embodiment of the present invention shown in FIG. 1 to FIG. Since the ground wiring 113 is changed to the inner wiring as shown in FIG. 13 and the multilayer circuit board 108 is changed to the multilayer circuit board 108d, and the other components are the same. The same reference numerals are given to the same components of the configuration shown in FIG. 14 and the configurations shown in FIGS. 1 to 6, and the description thereof will be omitted.

  FIG. 14 is a cross-sectional view of the via portion at the position of the alternate long and short dash line 501 of the multilayer circuit board 108 d, and eight ground vias 112 surround the signal via 110. Here, since the upper ground wiring 113 is an inner layer wiring below the ground via 112, there is no possibility of a short circuit between the signal wiring 109 and the ground via 112, and the first embodiment of the present invention shown in FIG. More ground vias 112 can be provided than in the configuration of the electronic device of the first embodiment, and the shield performance of the via layer portion is further improved.

  Note that the number and arrangement of the ground vias 112 are not limited as described above, and it is preferable that the number of ground vias 112 be as large as possible and provided at equal intervals.

  As described above, according to the electronic device of the fifth embodiment of the present invention, it is possible to obtain an effect that the high-frequency signal transmission characteristics are better than those of the electronic device of the first embodiment of the present invention. It is done.

  Next, the configuration of the electronic device according to the sixth embodiment of the present invention will be described with reference to FIGS. 15 and 16. 15 is a cross-sectional view of a connection portion between a multilayer wiring portion and a multilayer circuit board in an electronic device according to a sixth embodiment of the present invention. FIG. 16A is a pad portion of the multilayer wiring portion in FIG. FIG. 16B is a plan view of the pad portion of the multilayer circuit board.

  The difference between the configuration of the electronic device of the sixth embodiment of the present invention and the configuration of the electronic device of the first embodiment of the present invention shown in FIGS. 1 to 6 is as shown in FIG. In the region 601, the multilayer wiring portion 130a includes the pad 602, the multilayer circuit board 108e includes the pad 603 facing the pad 602, and further includes the bump 604 as a conductor connecting the pad 602 and the pad 603. Since the sensor module 101 and the multilayer wiring part 130 are changed to the sensor module 101a and the multilayer wiring part 130a, only the part where the multilayer circuit board 108 is changed to the multilayer circuit board 108e, and the other components are the same. 15 and FIG. 16 and the configurations shown in FIG. 1 to FIG. 6 are assigned the same reference numerals and explanations thereof are omitted. .

  As shown in FIG. 16A, a pad 602 formed in the same layer as the ground pad 107 is connected to the ground pad 107 in the region 601 of the multilayer wiring portion 130a. Further, as shown in FIG. 16B, in a region 601 of the multilayer circuit board 108e, a pad 603 formed in the same layer as the ground pad 114 is connected to the ground pad 114. Then, the pad 602 and the pad 603 are connected by a plurality of (here, six) bumps 604.

  By providing the pads 602 and 603 connected to the ground wiring and increasing the number of bumps for ground connection, the ground potential at the bump connection portion is stabilized and the stability of the circuit operation of the sensor module 101a is further improved. As the adhesion between the multilayer wiring part 130a and the multilayer circuit board 108e increases, the mechanical strength is further improved and the connection state of the bumps can be kept good. In addition, since the heat generated by the sensor module 101a can be released through a large number of bumps, heat dissipation is further improved.

  Note that the number and arrangement of the bumps 604 are not limited as described above, and it is preferable to provide as many as possible.

  As described above, according to the electronic device of the sixth embodiment of the present invention, the electronic device of the first embodiment of the present invention has better high-frequency signal transmission characteristics, and the sensor module and The effect that the multilayer circuit board is firmly fixed is obtained.

  Next, the configuration of the electronic device according to the seventh embodiment of the present invention will be described with reference to FIGS. 17 and 18. 17 is a cross-sectional view of a connection portion between a multilayer wiring portion and a multilayer circuit board in an electronic device according to a seventh embodiment of the present invention. FIG. 18A is a pad portion of the multilayer wiring portion in FIG. FIG. 18B is a plan view of the pad portion of the multilayer circuit board.

  The difference between the configuration of the electronic device of the seventh embodiment of the present invention and the configuration of the electronic device of the first embodiment of the present invention shown in FIGS. 1 to 6 is as shown in FIG. In the region 701, the multilayer wiring part 130 b includes a pad 702, the multilayer circuit board 108 f includes a pad 703 facing the pad 702, and further includes a bump 704 as a conductor that connects the pad 702 and the pad 703. Since the sensor module 101 and the multilayer wiring part 130 are changed to the sensor module 101b and the multilayer wiring part 130b, only the part where the multilayer circuit board 108 is changed to the multilayer circuit board 108f, and the other components are the same. The same reference numerals are given to the same components of the configuration shown in FIGS. 17 and 18 and the configuration shown in FIGS. 1 to 6, and the description thereof will be omitted. .

  As shown in FIG. 18A, a plurality (six in this case) of pads 702 that are formed in the same layer as the ground pads 107 and are not electrically connected to any of the regions 701 of the multilayer wiring portion 130b are provided. . Further, as shown in FIG. 18B, a pad 703 formed in the same layer as the ground pad 114 is connected to the ground pad 114 in the region 701 of the multilayer circuit board 108f. A plurality (six here) of pads 702 and a pad 703 are connected by a plurality (six here) of bumps 704. One bump 704 is provided on each of the plurality of pads 702.

  Each pad 702 corresponds to the pad 602 in FIG. 16A divided into a plurality of bumps so as to correspond to the bumps.

  By dividing, it is possible to facilitate alignment during bump mounting in the assembly process. Needless to say, a single pad 702 that is not electrically connected to any one of the pads 602 in FIG.

  By increasing the number of bumps for mechanical connection, the degree of adhesion between the multilayer wiring portion 130b and the multilayer circuit board 108f is increased, so that the mechanical strength is further improved and the connection state of the bumps can be kept good. Become. In addition, since the heat generated by the sensor module 101b can be released through a large number of bumps, heat dissipation is further improved.

  Note that the number and arrangement of the pads 702 and bumps 704 are not limited as described above, and it is preferable to provide as many as possible. However, at least the number of bumps 704 is required for the pad 702.

  In the present embodiment, a pad that is not electrically connected to either is provided on the multilayer wiring portion 130b side, and a pad connected to the ground wiring is provided on the multilayer circuit board 108f side. On the other hand, a pad connected to the ground wiring can be provided on the multilayer wiring portion 130b side, and a pad not electrically connected to either can be provided on the multilayer circuit board 108f side.

  As described above, according to the electronic device of the seventh embodiment of the present invention, it is easier to align the bump mounting in the assembly process than the electronic device of the sixth embodiment of the present invention. The effect that it can be made is obtained.

  Next, the configuration of the electronic device according to the eighth embodiment of the present invention will be described with reference to FIGS. 19 and 20. 19 is a cross-sectional view of a connection portion between a multilayer wiring portion and a multilayer circuit board in an electronic device according to an eighth embodiment of the present invention, and FIG. 20A is a pad portion of the multilayer wiring portion in FIG. FIG. 20B is a plan view of the pad portion of the multilayer circuit board.

  The difference between the configuration of the electronic device of the eighth embodiment of the present invention and the configuration of the electronic device of the first embodiment of the present invention shown in FIGS. 1 to 6 is as shown in FIG. In the region 801, the multilayer wiring part 130c includes a pad 802, the multilayer circuit board 108g includes a pad 803 facing the pad 802, and further includes a bump 804 as a conductor that connects the pad 802 and the pad 803. Since the sensor module 101 and the multilayer wiring portion 130 are changed to the sensor module 101c and the multilayer wiring portion 130c, only the portion where the multilayer circuit board 108 is changed to the multilayer circuit board 108g, and the other components are the same. 19 and FIG. 20 and the configuration shown in FIG. 1 to FIG. 6 are assigned the same reference numerals, and the description thereof is omitted. .

  As shown in FIG. 20A, in the region 801 of the multilayer wiring portion 130c, a plurality (six in this case) of pads 802 that are formed in the same layer as the ground pad 107 and are not electrically connected to any one are provided. . As shown in FIG. 20B, in the region 801 of the multilayer circuit board 108g, a plurality (six in this case) of pads 803 that are formed in the same layer as the ground pad 114 and are not electrically connected to any of them are formed. Provided. A plurality of (here, six) pads 802 and a plurality (here, six) pads 803 are connected one-to-one by a plurality of (here, six) bumps 804. One bump 804 is provided on each of the plurality of pads 802.

  Note that each pad 802 corresponds to the pad 602 in FIG. 16A divided into a plurality of bumps so as to correspond to the bumps, and each pad 803 corresponds to the pad 603 in FIG. It corresponds to what was divided into multiple parts so as to correspond.

  By dividing each of the pad 802 and the pad 803 into a plurality of parts, it is possible to facilitate alignment at the time of bump mounting in the assembly process as compared with the electronic device according to the seventh embodiment of the present invention. Of course, it can be a single pad 802 that is not electrically connected to any of the pads 602 in FIG. 16A, or the pad 603 in FIG. One pad 803 that is not electrically connected to any one of them may be used.

  By increasing the number of bumps for mechanical connection, the degree of adhesion between the multilayer wiring part 130c and the multilayer circuit board 108g is increased, so that the mechanical strength is further improved and the connection state of the bumps can be kept good. Become. In addition, since the heat generated by the sensor module 101c can be released through a large number of bumps, heat dissipation is further improved.

  Note that the number and arrangement of the pads 802, the pads 803, and the bumps 804 are not limited as described above, and it is preferable to provide as many as possible. However, at least the number of bumps 804 is required for the pad 802 and the pad 803.

  As described above, according to the electronic device of the eighth embodiment of the present invention, it is easier to align the bump mounting in the assembly process than the electronic device of the seventh embodiment of the present invention. The effect that it can be made is obtained.

  In any of the embodiments, the periphery of the bump connected to the signal pad and the bump connected to the ground pad is sealed with resin, so that the multilayer wiring portion and the multilayer circuit board are sealed. The mechanical strength of the connection can be increased, and a highly reliable electrical connection can be ensured.

  In addition, by sealing only the periphery of the bump connected to the ground pad with resin, the mechanical strength of the connection between the multilayer wiring part and the multilayer circuit board is increased, and the electrical connection is highly reliable. Can be secured. At this time, the effect of suppressing electromagnetic interference can be improved by adding a conductive material to the resin used for sealing.

  In any of the embodiments, the bumps are used to connect the signal pads and the ground pads. However, solder balls may be used, or the entire pad surface may be formed by reflow soldering using printed solder. It can also be set as the structure connected by solder. By using solder, the connection strength can be improved and the effect of suppressing electromagnetic interference can be improved.

1 is an exploded perspective view of an electronic device according to a first embodiment of the present invention. It is sectional drawing of the electronic device of the 1st Embodiment of this invention. It is sectional drawing of the connection part of the multilayer wiring part and multilayer circuit board in FIG. 4A is a plan view of the pad portion of the multilayer wiring portion in FIG. 3, and FIG. 4B is a plan view of the pad portion of the multilayer circuit board. 5A is a cross-sectional view of the via portion of the multilayer wiring portion in FIG. 3, and FIG. 5B is a cross-sectional view of the via portion of the multilayer circuit board. 6A is a cross-sectional view of the signal wiring and ground wiring portion of the multilayer wiring portion in FIG. 3, and FIG. 6B is a cross-sectional view of the signal wiring and ground wiring portion of the multilayer circuit board. It is a disassembled perspective view of the electronic device of the 2nd Embodiment of this invention. It is sectional drawing of the electronic device of the 2nd Embodiment of this invention. It is a disassembled perspective view of the electronic device of the 3rd Embodiment of this invention. It is sectional drawing of the electronic device of the 3rd Embodiment of this invention. It is a disassembled perspective view of the electronic device of the 4th Embodiment of this invention. It is sectional drawing of the electronic device of the 4th Embodiment of this invention. It is sectional drawing of the connection part of the multilayer wiring part and multilayer circuit board in the electronic device of the 5th Embodiment of this invention. It is sectional drawing of the via part of the multilayer circuit board in FIG. It is sectional drawing of the connection part of the multilayer wiring part and multilayer circuit board in the electronic device of the 6th Embodiment of this invention. 16A is a plan view of the pad portion of the multilayer wiring portion in FIG. 15, and FIG. 16B is a plan view of the pad portion of the multilayer circuit board. It is sectional drawing of the connection part of the multilayer wiring part and multilayer circuit board in the electronic device of the 7th Embodiment of this invention. 18A is a plan view of the pad portion of the multilayer wiring portion in FIG. 17, and FIG. 18B is a plan view of the pad portion of the multilayer circuit board. It is sectional drawing of the connection part of the multilayer wiring part and multilayer circuit board in the electronic device of the 8th Embodiment of this invention. 20A is a plan view of the pad portion of the multilayer wiring portion in FIG. 19, and FIG. 20B is a plan view of the pad portion of the multilayer circuit board. It is a perspective view of the sensor apparatus of a prior art example.

Explanation of symbols

101 sensor module 101a sensor module 101b sensor module 101c sensor module 102 signal wiring 103 signal via 104 signal pad 105 ground via 106 ground wiring 107 ground pad 108 multilayer circuit board 108a multilayer circuit board 108b multilayer circuit board 108c multilayer circuit board 108d Multilayer Circuit Board 108e Multilayer Circuit Board 108f Multilayer Circuit Board 108g Multilayer Circuit Board 109 Signal Wiring 110 Signal Via 111 Signal Pad 112 Ground Via 113 Ground Wiring 114 Ground Pad 115 Bump 116 Bump 117 Dotted Line 118 Dotted Line 119 Single Point Chain line 120 Semi-rigid coaxial cable 121 Signal pad 122 Ground pad 123 central conductor 124 outer conductor 125 conductor case 126 solder 127 solder 128 solder 129 substrate 130 multilayer wiring section 130a multilayer wiring section 130b multilayer wiring section 130c multilayer wiring section 131 one-dot chain line 132 signal via 133 ground via 201 signal pad 202 ground Pad 203 conductor case 204 solder 205 solder 206 solder 207 signal via 208 ground via 301 step structure 302 signal pad 303 ground pad 304 conductor case 305 ground pad 306 solder 307 solder 308 solder 401 signal pad 402 via 403 Ground pad 404 Conductor case 405 Ground pad 406 Solder 407 Solder 408 Solder 501 Dotted line 601 region 602 pad 603 pad 604 bump 701 area 702 pad 703 pad 704 bump 801 area 802 pad 803 pad 804 bump 2001 sensor module 2002 multilayer circuit board 2003 signal wiring 2004 signal pad 2005 ground pad 2007 ground pad 2007 2009 Ground Wiring 2010 Ground Pad 2011 Bonding Wire 2012 Bonding Wire 2013 Signal Pad 2014 Ground Pad 2015 Semi-Rigid Coaxial Cable 2016 Center Conductor 2017 Outer Conductor

Claims (4)

A function having a first signal pad formed on the first surface of the substrate and a first reference potential pad formed on the first surface so as to surround the first signal pad. Module,
An insulating substrate, electrically connected to the first signal pad, electrically connected to the second signal pad formed on the second surface of the insulating substrate, and the first reference potential pad A second reference potential pad connected to the second surface so as to surround the second signal pad; a first signal wiring formed inside the insulating substrate; A third signal pad electrically connected to the second signal pad via the first wiring, and the second surface of the insulating substrate or the second wiring so as to sandwich the first wiring; A second wiring for reference potential provided inside, a third wiring for reference potential provided inside the insulating substrate, and the second wiring via the second wiring and the third wiring. And a third reference potential pad electrically connected to the reference potential pad And the road board,
A coaxial cable having a center conductor and an outer conductor surrounding the center conductor, the center conductor being connected to the third signal pad, and the outer conductor being connected to the third reference potential pad;
An electronic device comprising:
The multilayer circuit board includes a plurality of reference potentials for connecting the second reference potential pad and the third wiring, and a signal via for connecting the second signal pad and the first wiring. For vias,
An electronic device in which the signal via is surrounded by the plurality of reference potential vias. The substrate of the functional module is a substrate having a multilayer wiring part,
A fourth wiring provided in the multilayer wiring portion and electrically connected to the first signal pad;
A fifth wiring for reference potential provided on the first surface and a sixth wiring for reference potential provided inside the multilayer wiring portion so as to sandwich the fourth wiring;
A second signal via for connecting the fourth wiring and the first signal pad;
A plurality of second reference potential vias for connecting the first reference potential pad and the sixth wiring;
The electronic device according to claim 1, wherein the second signal via is surrounded by the plurality of second reference potential vias. The second wiring is provided inside the insulating substrate;
The second reference potential pad and the second wiring are connected by a third reference potential via,
The electronic device according to claim 1, wherein the signal via is surrounded by the plurality of reference potential vias and the third reference potential via.   The electronic device according to claim 1, wherein the functional module is a sensor module.

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