JP2006054364A - Substrate-chucking device and exposure device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate-chucking device, in which a mounting surface can be worked smoothly by using machining work, and working operation at machining work is simplified. <P>SOLUTION: The substrate-chucking device 10 has the mounting surface 11 on which a substrate which is to be set correctly by smoothing is mounted, and a recessed part 12 formed on the mounting surface 11 is depressurized lower than the atmosphere to absorb the rear surface of the substrate. The outer peripheral part of the mounting surface 11 is constituted by an upper surface 15a of an outer frame part 15, acting as a pressure-reducing sealing member for the recessed part 12 and upper surfaces 17a of a plurality of extending parts 17, extending from the outer frame part 15 inwardly in a comb-like manner. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an apparatus for flatly sucking and holding a substrate such as a wafer for manufacturing a semiconductor device or a glass plate for manufacturing a liquid crystal device.

  2. Description of the Related Art Conventionally, in an apparatus for processing this type of substrate, such as an exposure apparatus or a laser repair apparatus, it is necessary to flatten the substrate with high accuracy. For example, in the case of an exposure apparatus, the NA is increasing for the purpose of obtaining a high resolving power, and the depth of focus tends to be reduced accordingly. If the substrate is warped or uneven, it is difficult to focus on the exposure region on the substrate, and the exposure accuracy may be reduced.

  In general, the substrate adsorption device adsorbs and holds the back surface of the substrate by reducing the concave portion formed on the placement surface of the holder on which the substrate is placed, to be lower than the atmospheric pressure. When the back surface of the adsorbed / held substrate contacts the mounting surface of the holder, the substrate is flattened (flatness corrected) following the mounting surface.

  By the way, in the substrate suction device, since it is not sucked and held outside the outer peripheral portion of the substrate, the plate falls at the inner suction portion so that the substrate tends to warp in the direction away from the mounting surface at the outer peripheral portion of the substrate. . Similarly, if there is a transport hole or the like other than the outer peripheral portion, the flatness changes in the same manner as the warpage of the outer peripheral portion.

  As a technique for suppressing warpage of the outer peripheral portion of the substrate, among the plurality of concave portions formed concentrically on the mounting surface of the holder, the arrangement interval of the concave portions of the outermost peripheral portion is made narrower than others, or the outermost peripheral portion There is a technique for narrowing the width of the recesses compared to the other, or for narrowing the arrangement pitch of the support (support pins) of the holder forming the mounting surface at the outer periphery compared to the center (for example, (See Patent Documents 1 and 2).

In addition, as a technique for suppressing the warpage of the outer peripheral portion of the substrate, there is a technique for lowering the height of the outer frame portion (or edge support) of the holder, which serves as a decompression seal member, than the inner mounting surface ( For example, see Patent Documents 2 and 3).
Japanese Patent No. 2821678 JP 2001-185607 A JP-A-8-37227

  Here, when the holder is made of a fragile material such as ceramic, it is relatively easy to process the complicated shape as described above by blasting or the like, but when the holder is made of a ductile material such as metal, milling or the like is used. Since machining is the main, complicated machining becomes difficult.

  In other words, in machining, if the shape of the recess on the mounting surface of the holder and the interval between the recesses (or the pitch of the support pins) change, the number of blade replacements increases and machining programming becomes complicated. It will be something. In recent years, as the substrate size is increased and the processing pattern is complicated, the holder processing operation tends to become more complicated.

  In addition, when the holder is made of a ductile material such as a metal, an outer frame portion (edge) that serves as a decompression seal member is formed after forming a concave portion on the mounting surface and then subjecting the mounting surface to flattening (grinding, lapping, etc.) Part) and the inner support (support pin) are likely to cause a difference in processing pressure based on the area difference, and as a result, the inner support tends to be scraped more. Furthermore, after forming a recess on the mounting surface, a so-called burr removal operation is performed to remove the burr that occurs at the corners of the convex body. In this case as well, there is a gap between the outer frame portion and the inner support. Therefore, a step based on the area difference between the two is easily formed. If the level difference of the mounting surface, particularly the height of the upper surface of the outer frame portion is higher than the upper surface of the inner support, the above-described warpage in the outer peripheral portion of the substrate is promoted.

The present invention has been made in view of the above circumstances, and can be used to machine a mounting surface flatly using machining, and can simplify the machining work during machining. An object is to provide an adsorption device.
Another object of the present invention is to provide an exposure apparatus capable of improving the exposure accuracy.

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 8 showing the embodiment.
The substrate suction apparatus of the present invention has a placement surface (11) on which a substrate (P) to be flattened is placed, and the concave portion (12) formed on the placement surface is reduced from the atmospheric pressure. Thus, in the adsorption device for adsorbing the back surface of the substrate, the outer peripheral portion of the mounting surface is formed on an upper surface of the outer frame portion (15) serving as a decompression seal member of the concave portion and inward from the outer frame portion. It is comprised from the upper surface of several extension part (17) extended in comb shape.

According to this substrate suction device, the outer peripheral portion of the mounting surface includes an upper surface of the outer frame portion serving as a decompression seal member for the concave portion, and a plurality of extending portions extending inward from the outer frame portion in a comb shape. Since the top surface is composed of a top surface, even when the mounting surface on which the concave portion is formed is flattened, a processing pressure difference based on the area difference between the two top surfaces hardly occurs, and the mounting surface is flat. To be processed. Furthermore, even when performing the burr removal operation, a step due to the area difference is not easily formed between the two upper surfaces. Then, the substrate held by suction is brought into contact with the flat mounting surface, so that the substrate is reliably flattened (flatness corrected).
Moreover, in this board | substrate adsorption | suction apparatus, the curvature of the outer peripheral part of a board | substrate is suppressed by providing the several extension part extended in a comb shape inward from an outer frame part in the outer peripheral part of a mounting surface. There is an advantage of being.

In the above-described substrate suction device, the other part of the placement surface (11) may be composed of the upper surfaces of a plurality of pin-like convex portions (16) arranged in a predetermined arrangement pattern.
Since the mounting surface is composed of the upper surfaces of multiple pin-shaped protrusions, particles are unlikely to be sandwiched between the substrate and the mounting surface. As a result, the substrate is attracted and held with high flatness (flatness). Is done. Moreover, the contact area between the substrate and the mounting surface is small, and sticking of the substrate and peeling charging are unlikely to occur.

In this case, it is preferable that the tips of the plurality of extending portions (17) are located outside one pitch of the plurality of pin-like convex portions (16) in the predetermined arrangement pattern.
As a result, the machining pitch can be unified, the number of blade replacements can be reduced, and machining programming can be simplified, thereby simplifying machining operations. Also, pattern design is facilitated.

In the above substrate suction apparatus, each of the ends of the plurality of extending portions (17) may have a planar shape in an R shape.
As a result, burr is hardly generated at the tips of the plurality of extending portions, and the clogging operation is less likely to be caught and the inside of the recess can be easily cleaned. As a result, the burr removal work can be simplified. In addition, it becomes easy to clean the substrate suction apparatus at regular maintenance.

In the substrate suction apparatus, each of the plurality of extending portions (17) and the plurality of pin-shaped convex portions (16) has an inclined surface whose narrow angle with respect to the mounting surface is 45 ° or less. It is good to be formed.
As a result, burr is hardly generated on the plurality of extending portions and the plurality of pin-shaped convex portions, and the chamfering operation is simplified such that the clogging in the burr removing operation is less likely to be easily cleaned. By reducing the burden of the burr removal work, the occurrence of a step on the mounting surface due to the burr removal work is suppressed. In addition, it becomes easy to clean the substrate suction apparatus at regular maintenance.

  A plurality of convex portions may be provided on the upper surface of the extending portion.

An exposure apparatus according to the present invention includes the above-described substrate suction apparatus.
According to this exposure apparatus, since the substrate is attracted and held flat, defocusing is suppressed and a pattern with good resolution can be exposed.

  According to the substrate suction device of the present invention, it is possible to process the mounting surface flatly by using machining, and it is possible to simplify the machining operation at the time of machining.

  Further, according to the exposure apparatus of the present invention, since the substrate is held with high flatness, it is possible to improve the exposure accuracy.

  1 to 3 are views showing an example of a substrate holder as a substrate suction device according to the present invention. FIG. 1 is a plan view, and FIG. 2 is an enlarged view of a portion A shown in FIG. 3 is a cross-sectional view taken along line BB shown in FIG.

  1 to 3, the substrate holder 10 adsorbs the back surface of the substrate P (in this example, a glass plate) by reducing the concave portion 12 formed on the mounting surface 11 to be lower than the atmospheric pressure. It is to hold. Further, the substrate holder 10 is made of a plate member made of metal (for example, aluminum) that is sufficiently thicker than the substrate P to be held, and the overall shape of the mounting surface 11 for supporting the substrate P is rectangular. The substrate P has a substantially rectangular shape slightly smaller than the substrate P (for example, a rectangle having a side of about 1000 to 1800 mm). The substrate holder 10 is provided with a suction hole 13 opened in the space of the recess 12, and a vacuum device (not shown) is connected to the suction hole 13.

  Further, the substrate holder 10 is provided with an outer frame portion 15 serving as a pressure reducing seal member along a rectangular outer edge portion in a rim shape, and in an inner substantially rectangular region surrounded by the outer frame portion 15. A plurality of pin-shaped convex portions 16 arranged in a matrix at a predetermined equal pitch Pa (for example, 5 mm pitch) are provided. Further, in this example, a plurality of extending portions 17 extending in a comb shape so as to be substantially parallel to each other at equal intervals from the outer frame portion 15 are provided. The arrangement pattern of the pin-shaped convex portions is not limited to the matrix shape, and may be, for example, a staggered shape.

  Each of the plurality of extending portions 17 is provided by extending a predetermined length perpendicular to the outer frame portion 15 serving as a base point. The plurality of extending portions 17 are spaced apart from each other in a direction orthogonal to the extending direction of the plurality of extending portions 17, and the arrangement pitch thereof is the same as the arrangement pitch Pa of the plurality of pin-like convex portions 16 described above. Further, the tips of the plurality of extending portions 17 are located one pitch outward from the outermost pin-shaped convex portions 16 among the plurality of pin-shaped convex portions 16 arranged in the matrix shape described above. That is, the distance between the outermost pin-shaped convex portion 16 and the tip of the extending portion 17 is the same as the arrangement pitch Pa of the plurality of pin-shaped convex portions 16.

  As shown in FIG. 2, the planar shape of the pin-like convex portion 16 is circular, and the distal ends of the plurality of extending portions 17 are formed in an R shape. That is, an edge made of a circular arc having the same length as the width of the extending portion 17 is formed at each end of the plurality of extending portions 17. Further, as shown in FIG. 3, the plurality of extending portions 17 and the plurality of pin-like convex portions 16 are each inclined surfaces 17 b having a narrow angle θ with respect to the mounting surface 11 of 45 ° or less (45 ° in this example), 16b.

  The placement surface 11 is configured by the upper surface 15 a of the outer frame portion 15, the upper surfaces 16 a of the plurality of pin-shaped convex portions 16, and the upper surfaces 17 a of the plurality of extending portions 17. Further, the concave portion 12 of the placement surface 11 is formed by the gap between the outer frame portion 15, the plurality of pin-like convex portions 16, and the plurality of extending portions 17.

FIGS. 4A and 4B are diagrams schematically showing a manufacturing process of the substrate holder 10 having the above-described configuration.
The substrate holder 10 having the above configuration can be preferably manufactured by machining such as milling. For example, as shown in FIG. 4A, the plate-like member 30 that is the base material of the substrate holder 10 is fixed to the base 31, and the tip of a rotating blade 32 (drill, end mill, etc.) is attached to the plate-like member 30. At the same time, the blade 32 is moved relative to the plate-like member 31, thereby forming the recess 12 having a desired pattern in the plate-like member 30.

  At this time, as shown in FIG. 2 above, the tips of the plurality of extending portions 17 are located outside one pitch of the plurality of pin-like convex portions 16 in the predetermined arrangement pattern, so that the processing is performed. The width and arrangement pattern of the recesses 12 to be made can be made substantially uniform over the entire surface, and the processing pitch can be unified and the processing pattern can be made uniform. As a result, all the recesses 12 can be formed with the same type of cutter, and the machining operation can be simplified by reducing the number of times the cutter is replaced or simplifying the programming. In the pattern design of the recesses 12, for example, when the arrangement pattern of the plurality of pin-like protrusions 16 is deviated from the pitch in the vicinity of the outer frame portion 15 according to a predetermined pitch (basic pitch), The pin-shaped convex portion 16 may be connected to the outer frame portion 15 and may be used as the extending portion 17. Thereby, simplification of pattern design is achieved.

  In addition, after the formation of the concave portion 12, the mounting surface 11 including the upper surface 15 a of the outer frame portion 15, the upper surfaces 16 a of the plurality of pin-shaped convex portions 16, and the upper surfaces 17 a of the plurality of extending portions 17 is flattened. Do. The flattening processing can be performed by, for example, grinding or lapping. At this time, since the grinding member is pressed against each of the surfaces 15a, 16a, and 17a, there is a risk that a difference in the pressing force of the grinding member occurs on the mounting surface 11 particularly in the outer peripheral portion of the substrate holder 10. There is. In the substrate holder 10 of the present example, since the plurality of extending portions 17 are formed in a comb shape from the outer frame portion 15 to the inner package at the outer peripheral portion, the upper surface 15a of the outer frame portion 15 and the plurality of extending portions are formed. A difference in processing pressure based on an area difference between the upper surface 17a of the existing portion 17 is unlikely to occur, and the mounting surface 11 is processed flat. Further, when performing the burr removal operation thereafter, a step based on the area difference is not easily formed between the surfaces 15a, 16a, and 17a.

  In addition, since the tips of the plurality of extending portions 17 are formed in an R shape, the tips of the plurality of extending portions 17 are unlikely to be burred, and the clogging work is less likely to be caught and the recess 12 Easy to clean. As a result, the burr removal work can be simplified. In addition, since the plurality of extending portions 17 and the plurality of pin-shaped convex portions 16 are formed with slopes 17b and 16b having a narrow angle of 45 ° or less with respect to the mounting surface 11, respectively, the burr is also returned. It is possible to simplify the burr removal work, such as less catching in the removal work and easier cleaning of the recess 12 (for example, cleaning of the bottom surface 18). By reducing the burden of the burr removal work, the occurrence of a step on the mounting surface due to the burr removal work is suppressed.

  Moreover, as shown in FIG.4 (b), it becomes easy to carry out a burr removal operation | work and a cleaning operation | work by the structure which gives R to an edge part like the cutter 321. FIG.

  Thus, in the substrate holder 10 of this example, the mounting surface 11 is processed flat using machining. Therefore, the substrate P held by suction is brought into contact with the flat placement surface, so that the substrate P is surely flattened (flatness corrected).

  Further, in the substrate holder 10 of this example, the placement surface 11 is configured from the upper surfaces 16a of the plurality of pin-shaped convex portions 16, so that particles are not easily sandwiched between the substrate P and the placement surface 11, As a result, the substrate P is attracted and held with high flatness (flatness). In addition, there is an advantage that the contact area between the substrate P and the mounting surface 11 is small, and the substrate P is hardly attached or peeled off.

  Further, in the substrate holder 10 of the present example, a plurality of extending portions 17 extending inward from the outer frame portion 15 are provided on the outer peripheral portion of the mounting surface 11, thereby being sucked and held. Further, there is an advantage that warpage of the outer peripheral portion of the substrate P is suppressed.

Here, FIG. 5 is a view taken in the direction of arrow C in FIG. 3 and schematically shows a cross-sectional state of the substrate P sucked and held by the substrate holder 10.
In FIG. 5, since the substrate P is sucked at each gap portion between the plurality of extending portions 17 at the outer peripheral portion, a force Fv partially acts on each suction location. If the substrate P is slightly bent by this suction, the substrate P is curved in a wave shape as shown in FIG. This deformation is caused by warping due to the force Fv acting at one suction location inside the outer peripheral portion of the substrate P. Therefore, when the force Fv is strong, the amount of deflection increases. The wavy deformation is preferably within a target flatness range.

6 and 7 are diagrams for explaining an example of the above-described plurality of extending portions 17.
In the example of FIG. 6, the entire upper surfaces 17a of the plurality of extending portions 17 are continuously formed in a planar shape. By making the upper surfaces 17a of the plurality of extending portions 17 into a continuous planar shape, there is an advantage that it is possible to reliably suppress the occurrence of a step due to a pressure difference during machining.

  On the other hand, in the example of FIG. 7, a plurality of convex portions 17 x are provided on the upper surfaces 17 a of the plurality of extending portions 17. The plurality of convex portions 17 x have an effect of suppressing the sandwiching of particles between the substrate P and the extending portion 17, similarly to the pin-shaped convex portion 16. In this case, it is preferable to determine the shape and arrangement pitch of the plurality of convex portions 17x so that a step due to a pressure difference during machining does not occur.

  The substrate holder 10 of this example is made of a ductile material such as metal that is preferably used for a large substrate, and is preferably processed by machining, but the present invention is not limited to this. The present invention can also be applied to the case where other materials such as a brittle material such as ceramic are used as the material for forming the substrate holder.

FIG. 8 is a schematic perspective view showing an embodiment of an exposure apparatus provided with the substrate suction apparatus of the present invention.
In FIG. 8, an exposure apparatus EX includes a mask stage MST that supports a mask M having a pattern, a substrate stage PST that supports a photosensitive substrate (photosensitive substrate) P via a substrate holder (substrate adsorption device) PH, Illumination optical system IL for illuminating mask M supported by mask stage MST with exposure light EL, and projection optics for projecting the pattern of mask M illuminated with exposure light EL onto photosensitive substrate P held by substrate holder PH A system PL and a control device CONT for controlling operations related to exposure processing are provided. In the present embodiment, the projection optical system PL has a plurality (five) of projection optical systems PLa to PLe, and these projection optical systems PLa to PLe are provided so as to be exposed side by side. The illumination optical system IL is also composed of a plurality (five) of illumination system modules corresponding to the number of projection optical systems PLa to PLe. Then, the exposure apparatus EX according to the present embodiment illuminates the mask M with the exposure light EL while synchronously moving the mask M and the photosensitive substrate P in the predetermined direction with respect to the projection optical system PL, and changes the pattern of the mask M. This is a so-called multi-lens scan type exposure apparatus that exposes the photosensitive substrate P. The mask M is obtained by forming a predetermined pattern on a glass plate (original plate) with a shielding material such as chromium. The photosensitive substrate P is obtained by applying a photosensitive agent (photoresist) to a glass plate (glass substrate).

  Here, in the following description, the direction (scanning direction) in which the mask M and the photosensitive substrate P move synchronously in the horizontal plane is the Y-axis direction, and the direction orthogonal to the scanning direction (non-scanning direction) in the horizontal plane is the X-axis. A direction perpendicular to the direction, the X-axis direction, and the Y-axis direction is taken as a Z-axis direction. The directions around the X-axis, Y-axis, and Z-axis are the θX, θY, and θZ directions, respectively.

The illumination optical system IL illuminates the mask M with the exposure light EL. As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) emitted from a mercury lamp and far ultraviolet light (wavelength 248 nm) such as KrF excimer laser light (wavelength 248 nm). DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm), or the like is used. The mask M is illuminated with a plurality of different illumination areas by a plurality of illumination system modules of the illumination optical system IL.

  The mask stage MST is provided on the optical path of the exposure light EL, and has a long stroke in the Y-axis direction and a stroke of a predetermined distance in the X-axis direction orthogonal to the scanning direction in order to perform one-dimensional scanning exposure. Yes. The mask stage MST is driven by the mask stage drive unit MSTD, and the mask stage drive unit MSTD is controlled by the control device CONT. Moving mirrors 40a and 40b are provided at respective end edges in the X-axis direction and Y-axis direction on the mask stage MST so as to be orthogonal to each other. A laser interferometer 41a is disposed facing the moving mirror 40a, and a laser interferometer 41b is disposed facing the moving mirror 40b. Each of the laser interferometers 41a and 41b irradiates each of the movable mirrors 40a and 40b with laser light and measures the distance between the movable mirrors 40a and 40b, whereby the X axis direction and the Y axis of the mask stage MST are measured. The position in the direction, and thus the position of the mask M is detected. The detection results of the laser interferometers 41a and 41b are output to the control device CONT, and the control device CONT controls the position of the mask stage MST via the mask stage drive unit MSTD based on the detection results of the laser interferometers 41a and 41b.

  In the plurality of projection optical systems PLa to PLe, the projection optical systems PLa, PLc and PLe and the projection optical systems PLb and PLd are arranged in a staggered pattern in two rows. In other words, the projection optical systems PLa to PLe arranged in a staggered manner are arranged by shifting adjacent projection optical systems (for example, projection optical systems PLa and PLb, PLb and PLc) by a predetermined amount in the Y-axis direction. Yes. Each of these projection optical systems PLa to PLe transmits a plurality of exposure lights EL emitted from the illumination system module and transmitted through the mask M, and projects a pattern image of the mask M onto the photosensitive substrate P held by the substrate holder PH. . Each of the projection optical systems PLa to PLe includes a field stop (not shown). The field stop sets a projection area on the photosensitive substrate P. In the present embodiment, the field stop has a trapezoidal opening, and the projection areas 50a to 50e on the photosensitive substrate P are defined in a trapezoidal shape by the field stop.

  The substrate stage PST is provided on the optical path of the exposure light EL, and has a long stroke in the Y-axis direction and a long stroke for stepping in the X-axis direction orthogonal to the scanning direction in order to perform one-dimensional scanning exposure. Have. Furthermore, the substrate stage PST can move in the Z-axis direction and can also move in the θX, θY, and θZ directions. The substrate stage PST is driven by the substrate stage drive unit PSTD, and the substrate stage drive unit PSTD is controlled by the control device CONT. Moving mirrors 42a and 42b are provided at respective end edges in the X-axis direction and Y-axis direction on the substrate stage PST so as to be orthogonal to each other. A laser interferometer 43a is arranged to face the moving mirror 42a, and a laser interferometer 43b is arranged to face the moving mirror 42b. Each of the laser interferometers 43a and 43b irradiates each of the movable mirrors 42a and 42b with a laser beam and measures the distance between the movable mirrors 42a and 42b, whereby the X axis direction and the Y axis of the substrate stage PST are measured. The position in the direction, and thus the position of the photosensitive substrate P is detected. The detection results of the laser interferometers 43a and 43b are output to the control device CONT, and the control device CONT controls the position of the substrate stage PST via the substrate stage drive unit PSTD based on the detection results of the laser interferometers 43a and 43b. Further, the exposure apparatus EX includes a focus detection system (not shown) that detects the positions of the pattern surface of the mask M and the exposure processing surface of the photosensitive substrate P in the Z-axis direction, and the control device CONT detects the detection result of the focus detection system. Based on the above, the position of the photosensitive substrate P in the Z-axis direction is controlled via the substrate stage drive unit PSTD.

  The exposure apparatus EX of the present example includes the substrate holder 10 described with reference to FIGS. 1 to 3 as the substrate holder PH. Therefore, since the photosensitive substrate P is attracted and held with high flatness, defocusing is suppressed and a pattern with good resolution can be exposed.

  The exposure apparatus EX in the above embodiment is a so-called multi-lens scan type exposure apparatus having a plurality of adjacent projection optical systems. However, the present invention also applies to a scanning type exposure apparatus having one projection optical system. Can be applied. Further, as the exposure apparatus EX, in addition to the scanning exposure apparatus that scans and exposes the pattern of the mask M by synchronously moving the mask M and the photosensitive substrate P, the mask M and the photosensitive substrate P are held stationary. It is also possible to apply to a step-and-repeat type exposure apparatus that exposes the above pattern and sequentially moves the photosensitive substrate P stepwise.

  The use of the exposure apparatus EX is not limited to a liquid crystal exposure apparatus that exposes a liquid crystal display element pattern on a square glass plate. For example, an exposure apparatus for manufacturing a semiconductor or a thin film magnetic head Widely applicable to exposure apparatus.

The magnification of the projection optical system PL is not limited to an equal magnification system, and may be either a reduction system or an enlargement system. Further, as the projection optical system PL, when using far ultraviolet rays such as an excimer laser, a material that transmits far ultraviolet rays such as quartz or fluorite is used as a glass material, and when using an F ₂ laser, a catadioptric system or a refractive system is used. Use an optical system.

  When a linear motor is used for the substrate stage PST and the mask stage MST, either an air levitation type using an air bearing or a magnetic levitation type using a Lorentz force or a reactance force may be used. The stage may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  When a planar motor is used as the stage drive device, either the magnet unit or the armature unit is connected to the stage, and the other of the magnet unit and the armature unit is provided on the moving surface side (base) of the stage. Good.

  The reaction force generated by the movement of the substrate stage PST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-166475. The present invention can also be applied to an exposure apparatus having such a structure.

  The reaction force generated by the movement of the mask stage MST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-330224. The present invention can also be applied to an exposure apparatus having such a structure.

  As described above, the exposure apparatus of the embodiment of the present application maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 9, the semiconductor device includes a step 201 for designing the function and performance of the device, a step 202 for producing a mask (reticle) based on the design step, and a substrate (wafer, glass plate) as a base material of the device. ), A substrate processing step 204 for exposing the reticle pattern onto the substrate by the exposure apparatus of the above-described embodiment, and developing the exposed substrate, a device assembly step (including a dicing process, a bonding process, and a packaging process) ) 205, manufactured through inspection step 206 and the like.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

It is a top view showing an example of a substrate holder as a substrate adsorption device concerning the present invention. It is the A section enlarged view shown in FIG. It is a BB arrow sectional view shown in FIG. It is a figure which shows typically the mode of the manufacture process of a substrate holder. FIG. 4 is a view taken in the direction of arrow C in FIG. 3, schematically showing a cross-sectional state of the substrate held by suction on the substrate holder. It is a figure for demonstrating the example of a some extension part. It is a figure for demonstrating the other example of a some extension part. It is a schematic perspective view which shows the embodiment of the exposure apparatus provided with the board | substrate adsorption | suction apparatus of this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Substrate holder (substrate adsorption | suction apparatus), 11 ... Mounting surface, 12 ... Recessed part, P ... Substrate, 15 ... Outer frame part, 16 ... Pin-shaped convex part, 17 ... Extension part, 15a, 16a, 17a ... Upper surface , EX ... exposure apparatus.

Claims (7)

In an adsorption apparatus that has a placement surface on which a substrate to be flattened is placed, and sucks the back surface of the substrate by reducing the recess formed in the placement surface from the atmospheric pressure,
The outer peripheral portion of the mounting surface is composed of an upper surface of an outer frame portion serving as a pressure-reducing seal member of the concave portion and upper surfaces of a plurality of extending portions extending inward from the outer frame portion in a comb shape. A substrate suction apparatus characterized by comprising:   2. The substrate suction apparatus according to claim 1, wherein the other part of the placement surface is composed of upper surfaces of a plurality of pin-like convex portions arranged in a predetermined arrangement pattern.   3. The substrate suction apparatus according to claim 2, wherein tips of the plurality of extending portions are located outside one pitch of the plurality of pin-like convex portions in the predetermined arrangement pattern.   4. The substrate suction apparatus according to claim 1, wherein the distal ends of the plurality of extending portions are formed in an R shape in a planar shape. 5.   The plurality of extending portions and the plurality of pin-shaped convex portions are each formed with a slope having a narrow angle of 45 ° or less with respect to the placement surface. 4. The substrate suction apparatus according to claim 4.   The substrate adsorption apparatus according to claim 1, wherein a plurality of convex portions are provided on an upper surface of the extension portion. An exposure apparatus comprising the substrate suction device according to claim 1.

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