JP2006049814A - Light emitting device and illumination system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device which has high emitted light intensity and high brightness and is excellent in a light emitting efficiency. <P>SOLUTION: The light emitting device includes a base body 1 where the mounting portion 1a of a light emitting element 3 is formed on a main upside surface; a first frame-like reflecting component 2 which is fitted on the main upside surface of the base body 1 so as to surround the mounting portion 1a, and whose inside circumference is a light reflecting surface; a second reflecting component 4 which is fitted on the main upside surface of the base body so as to surround the first reflecting component 2, and whose inside circumference 4a is a light reflecting surface; the light emitting element 3 mounted on the mounting portion 1a; a transparent component 6 which is located inside the second reflecting component 4 so as to cover the light emitting element 3 and first reflecting component 2; and a first wavelength conversion layer 5 which converts the wavelength of light emitted from the light emitting element 3, and is located inside or on the surface of the transparent component 6 positioned above the light emitting element 3 at space from the first reflecting component 2 and the second reflecting component 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light emitting device in which a light emitting element is accommodated and an illumination device using the same.

  A conventional light emitting device is shown in FIG. In FIG. 18, the light emitting device has a mounting portion 11a for mounting the light emitting element 13 at the center of the upper surface, and leads that electrically connect the inside and outside of the light emitting device from the mounting portion 11a and its periphery. A base 11 made of an insulator on which a wiring conductor (not shown) made of terminals, metallized wiring, etc. is formed, and adhesively fixed to the upper surface of the base 11 so that the inner peripheral surface 12a spreads outward as it goes upward. And a frame-shaped reflecting member 12 whose inner peripheral surface 12a is a reflecting surface that reflects light emitted from the light emitting element 13, and wavelength conversion of light emitted from the light emitting element 13 on a transparent member The wavelength conversion layer 15 containing a fluorescent material (not shown) and a translucent member 16 filled inside the reflecting member 12 to protect the light emitting element 13 are mainly configured.

  The substrate 11 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin. When the substrate 11 is made of ceramic, the wiring conductor is formed on its upper surface by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), etc. at a high temperature. When the base 11 is made of a resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 11.

  The reflecting member 12 is made of metal such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, ceramics such as alumina ceramics or resin such as epoxy resin, and is used for cutting, die molding, extrusion molding, etc. Formed by molding technique.

  Further, the reflecting member 12 has an inner peripheral surface 12a as a reflecting surface that reflects light from the light emitting element 13 and the wavelength conversion layer 15, and the inner peripheral surface 12a is made of a metal such as Al by vapor deposition or plating. It is formed by adhering. The reflecting member 12 is joined to the upper surface of the base 11 by a soldering material such as solder, silver (Ag) solder, or a joining material such as a resin adhesive so as to surround the mounting portion 11a with the inner peripheral surface 12a.

  The light-emitting element 13 is formed on a single crystal substrate such as sapphire by liquid phase growth method or MOCVD method, for example, gallium (Ga) -Al-nitrogen (N), zinc (Zn) -sulfur (S), Zn -Selenium (Se), Silicon (Si) -Carbon (C), Ga-Phosphorus (P), Ga-Al-Arsenic (As), Al-Indium (In) -Ga-P, In-Ga-N, Ga A light emitting layer such as -N or Al-In-Ga-N is formed. Examples of the structure of the light emitting element 13 include a homo structure having a MIS junction and a PN junction, a hetero structure, and a double hetero structure. Further, the emission wavelength of the light emitting element 13 is variously selected from ultraviolet light to infrared light depending on the material of the light emitting layer and the degree of mixed crystal thereof. Note that the light emitting element 13 has a method of using a bonding wire (not shown) for the wiring conductor arranged around the mounting portion 11a and the electrode of the light emitting element 13, or the electrode of the light emitting element 13 is installed on the lower side. Then, they are electrically connected by a method using a flip chip bonding method in which solder bumps are used for connection.

  Further, the wavelength conversion layer 15 is emitted from the light emitting element 13 by containing a phosphor in a transparent member such as an epoxy resin or a silicone resin and thermosetting it to form a plate and covering the opening of the reflecting member 12. It can absorb visible light and ultraviolet light, which are the emission wavelengths, and convert it into other long-wavelength light for emission. Accordingly, various wavelength conversion layers 15 are used depending on the emission wavelength of the light emitted from the light emitting element 13 or the desired light emitted from the light emitting device, and the light emitting device can extract light having a desired wavelength spectrum. You can get none. The light emitting device can emit white light when the light emitted from the light emitting element 13 and the light from the phosphor are in a complementary color relationship.

  The phosphor is, for example, yttrium / aluminum / garnet phosphor activated by cerium (Ce), perylene derivative, zinc cadmium sulfide or manganese (Mn) activated by copper (Cu) or Al. Examples include activated magnesium oxide and titanium oxide. These phosphors may be used alone or in combination of two or more.

Furthermore, the translucent member 16 protects the light emitting element 13 by using a transparent member such as an epoxy resin or a silicone resin, and reduces the refractive index difference between the light emitting element 13 and the transparent member. It is possible to suppress light from being trapped inside the light emitting element 13.
JP 2000-349346 A

  However, in the above-described conventional light emitting device, the light emitted from the light emitting element 13 is absorbed by the phosphor in the wavelength conversion layer 15, and then fluorescence having different wavelengths is emitted from the phosphor in all directions. Some of this fluorescence is emitted upward from the wavelength conversion layer 15 and becomes the emitted light of the light emitting device, but the other part is emitted downward from the wavelength conversion layer 15 or other phosphors. The light is reflected and emitted downward from the wavelength conversion layer 15 or is repeatedly reflected on the inner peripheral surface 12a of the reflecting member 12 or the wavelength conversion layer 15 and confined in the light emitting device. In addition, there is a problem that it is difficult to improve brightness.

  Accordingly, the present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to provide a light emitting device having high radiated light intensity and high luminance and high luminous efficiency.

  The light emitting device of the present invention has a base on which a light emitting element mounting portion is formed on the upper main surface, and an inner peripheral surface that is attached to the upper main surface of the base so as to surround the mounting portion. A frame-shaped first reflecting member formed into a surface, and a frame-shaped first reflecting member attached to the upper main surface of the base body so as to surround the first reflecting member and having an inner peripheral surface as a light reflecting surface And the light-emitting element placed on the placement portion, and a translucent member provided inside the second reflective member so as to cover the light-emitting element and the first reflective member And converting the wavelength of light emitted from the light emitting element, which is provided inside or on the surface of the translucent member located above the light emitting element and spaced from the first and second reflecting members. And a first wavelength conversion layer.

  The light emitting device of the present invention has a flat substrate and a side wall portion bonded to the upper main surface of the substrate and having a light emitting element mounting portion formed on the upper surface and an inner peripheral surface serving as a light reflecting surface. A first reflecting member formed so as to surround the mounting portion, and a frame attached to an upper main surface of the base so as to surround the first reflecting member and having an inner peripheral surface as a light reflecting surface Second reflective member, the light emitting element placed on the mounting portion, and the inner side of the second reflective member so as to cover the light emitting element and the first reflective member A light-transmitting member and light emitted from the light-emitting element, which is provided inside or on the surface of the light-transmitting member located above the light-emitting element and spaced from the first and second reflecting members. And a first wavelength conversion layer for converting a wavelength.

  In the light emitting device of the present invention, preferably, the second reflecting member is provided with a second wavelength conversion layer for converting a wavelength of light emitted from the light emitting element on a surface of an inner peripheral surface thereof. Features.

  In the light emitting device of the present invention, preferably, the second wavelength conversion layer is provided so that the thickness thereof gradually increases from the upper end portion to the lower end portion.

  In the light-emitting device of the present invention, preferably, the second wavelength conversion layer contains a phosphor that converts the wavelength of light emitted from the light-emitting element, and the density of the phosphor extends from the upper end to the lower end. It is characterized by gradually increasing.

  In the light emitting device of the present invention, preferably, the second wavelength conversion layer is provided with a plurality of concave portions or convex portions on an inner surface thereof.

  In the light-emitting device of the present invention, preferably, the mounting portion protrudes so that a height is higher than a lower end of the inner peripheral surface of the first reflecting member.

  In the light emitting device of the present invention, preferably, the first wavelength conversion layer has an outer peripheral portion at an upper end of the inner peripheral surface of the first reflecting member opposite to the end portion of the light emitting element. It is located in the said 2nd reflection member side rather than the straight line which passes through.

  The illuminating device of the present invention is characterized in that the light emitting device of the present invention is installed in a predetermined arrangement.

  A light-emitting device according to a first aspect of the present invention includes a base having a light-emitting element mounting portion formed on an upper main surface, and an inner circumference attached to the upper main surface of the base so as to surround the mounting portion. A frame-shaped first reflecting member whose surface is a light reflecting surface and a frame shape whose inner peripheral surface is a light reflecting surface attached to the upper main surface of the base so as to surround the first reflecting member A second reflective member, a light emitting element placed on the placement portion, a translucent member provided inside the second reflective member so as to cover the light emitting element and the first reflective member, and light emission A first wavelength for converting the wavelength of light emitted by the light emitting element, which is provided inside or on the surface of the translucent member located above the element and spaced from the first reflecting member and the second reflecting member. The first wavelength after the light emitted from the light emitting element is wavelength-converted by the first wavelength conversion layer. The light emitted downward from the conversion layer is reflected upward by the second reflection member, and the first wavelength conversion layer is exposed to the outside of the light emitting device from the gap between the first wavelength conversion layer and the second reflection member. Can be released without allowing it to permeate again. As a result, the light emitted from the first wavelength conversion layer in the downward direction can be extremely effectively prevented from being confined in the light emitting device, and the emitted light intensity and luminance are increased, and the light emitting device has high luminous efficiency. It can be.

  A light emitting device according to a second aspect of the present invention is bonded to a flat substrate and an upper main surface of the substrate, a light emitting element mounting portion is formed on the upper surface, and an inner peripheral surface is a light reflecting surface. The first reflecting member formed so that the side wall portion surrounds the mounting portion, and the inner peripheral surface attached to the upper main surface of the base so as to surround the first reflecting member is the light reflecting surface. The frame-shaped second reflecting member, the light emitting element placed on the placing portion, and the translucency provided inside the second reflecting member so as to cover the light emitting element and the first reflecting member The wavelength of the light emitted from the light emitting element, which is provided in the interior or surface of the member and the translucent member located above the light emitting element and spaced from the first reflective member and the second reflective member, is converted. A first wavelength conversion layer, so that the light emitted from the light emitting element has a wavelength at the first wavelength conversion layer. After the conversion, the light emitted downward from the first wavelength conversion layer is reflected upward by the second reflecting member and emitted from the gap between the first wavelength converting layer and the second reflecting member. The first wavelength conversion layer can be emitted without being transmitted again to the outside of the device. As a result, the light emitted from the first wavelength conversion layer in the downward direction can be extremely effectively prevented from being confined in the light emitting device, and the emitted light intensity and luminance are increased, and the light emitting device has high luminous efficiency. It can be.

  In addition, heat generated from the light emitting element can be easily transmitted to the side wall unit integrated with the mounting unit. In particular, when the first reflecting member is made of metal, heat is quickly transferred to the side wall portion and is well dissipated from the outer surface of the side wall portion. As a result, the temperature rise of the light emitting element can be suppressed, and cracks in the joint caused by the difference in thermal expansion between the light emitting element and the first reflecting member can be suppressed. Further, the heat of the light-emitting element can be favorably moved not only in the height direction of the first reflecting member but also in the outer peripheral direction, and the heat is efficiently conducted from the entire lower surface of the first reflecting member to the base, thereby the light-emitting element. In addition, the temperature increase of the first reflecting member can be more effectively suppressed, the operation of the light emitting element can be stably maintained, and thermal deformation of the inner peripheral surface of the first reflecting member can be suppressed. Therefore, stable light characteristics of the light emitting device can be maintained and operated over a long period of time.

  In the light emitting device of the present invention, preferably, the second reflecting member is provided with a second wavelength conversion layer for converting the wavelength of light emitted from the light emitting element on the inner peripheral surface thereof. From the light from the light emitting element that is reflected from the lower side without being wavelength-converted by the first wavelength conversion layer, the second wavelength conversion layer converts the wavelength of the light, and the emitted light intensity and luminance of the light-emitting device In addition, luminous efficiency can be improved.

  In the light emitting device of the present invention, preferably, the second wavelength conversion layer is provided so that its thickness gradually increases from the upper end portion to the lower end portion. The amount of light generated from the phosphor gradually increases toward the lower end of the second wavelength conversion layer where the distance from the second wavelength conversion layer increases, and the upper surface of the translucent member and the second wavelength conversion layer The amount of light generated from the phosphor gradually decreases from the lower end portion toward the upper end portion of the second wavelength conversion layer where the distance to the second wavelength conversion layer decreases. As a result, the light intensity distribution of the light emitting device can be made uniform between the central portion and the peripheral portion, and the occurrence of color unevenness can be suppressed.

  In the light emitting device of the present invention, preferably, the second wavelength conversion layer contains a phosphor that converts the wavelength of light emitted from the light emitting element, and the density of the phosphor is from the upper end to the lower end. The amount of light generated from the phosphor gradually increases toward the lower end of the second wavelength conversion layer where the distance between the upper surface of the translucent member and the second wavelength conversion layer increases. The amount of light generated from the phosphor gradually decreases from the lower end portion toward the upper end portion of the second wavelength conversion layer which increases and the distance between the upper surface of the translucent member and the second wavelength conversion layer decreases. . As a result, the light intensity distribution of the light emitting device can be made uniform between the central portion and the peripheral portion, and the occurrence of color unevenness can be suppressed.

  Further, by converting the wavelength of the light emitted from the light emitting element that has not been wavelength-converted by the first wavelength conversion layer and is reflected outward by the phosphor having a higher density, the emitted light intensity and brightness of the light-emitting device and Luminous efficiency is improved.

  In the light emitting device of the present invention, preferably, the second wavelength conversion layer is provided with a plurality of concave portions or convex portions on the inner surface thereof, so that it is directly from the light emitting element or the first reflecting member. The second wavelength conversion by propagating to the first wavelength conversion layer through the reflection by the inner peripheral surface of the light and reflecting to the lower outer side without wavelength conversion by the phosphor contained in the first wavelength conversion layer The light incident on the layer is easily incident on the second wavelength conversion layer due to the concave portion or the convex portion, the light whose wavelength is converted by the phosphor in the second wavelength conversion layer is increased, and the emitted light of the light emitting device Intensity, brightness, and luminous efficiency are improved.

  In addition, since the surface area of the second wavelength conversion layer is increased by the plurality of recesses or projections, and the phosphor exposed on the surface of the second wavelength conversion layer increases, the fluorescence contained in the first wavelength conversion layer The phosphor of the second wavelength conversion layer is likely to be excited by the light reflected outwardly without being wavelength-converted by the body, and the light that is wavelength-converted by the phosphor of the second wavelength conversion layer increases. Therefore, the radiated light intensity, luminance, and luminous efficiency of the light emitting device are improved.

  The light emitting device of the present invention is preferably obliquely below the light emitting element by projecting so that the height of the mounting portion is higher than the lower end of the inner peripheral surface of the first reflecting member. The light emitted in the direction can be efficiently reflected upward by the inner peripheral surface of the first reflecting member, and the light from the light emitting element is inside the light emitting device by the lower end of the inner peripheral surface of the first reflecting member. It can suppress that it is confined by. Therefore, the light emitting device can reduce the light absorption loss of the inner peripheral surface of the first reflecting member with respect to the light generated from the light emitting element. Thereby, the emitted light intensity of a light-emitting device can be improved.

  In the light emitting device of the present invention, preferably, in the above light emitting device, the outer peripheral portion of the first wavelength conversion layer is an end portion of the light emitting element and an upper end of the inner peripheral surface of the first reflecting member on the opposite side of the end portion. By being located on the second reflecting member side with respect to the straight line passing through the light, it is possible to suppress the light from the light emitting element from being directly emitted to the outside of the light emitting device. As a result, it is possible to irradiate light from the light emitting device with no unevenness in emission color or emission distribution.

  The illuminating device of the present invention is a conventional illuminating device using discharge using light emission by recombination of electrons of a light emitting element made of a semiconductor because the light emitting device of the present invention is installed in a predetermined arrangement. In addition, a light-emitting element with lower power consumption and longer life can be used as a light source, and a small lighting device that can efficiently radiate light emitted from the light source to the outside can be obtained. Further, since the temperature rise of the light emitting element is reduced because it can be operated efficiently with low power, fluctuations in the center wavelength of the light generated from the light emitting element can be suppressed, and stable radiated light over a long period of time. While being able to irradiate light with an intensity and a radiated light angle (light distribution), it is possible to provide an illuminating device in which color unevenness and uneven illuminance distribution on the irradiated surface are suppressed.

  In addition, the light-emitting device of the present invention is installed in a predetermined arrangement as a light source, and a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an appropriate shape are installed around these light-emitting devices. It can be set as the illuminating device which radiates | emits the light of a simple light distribution.

  The light-emitting device according to the first aspect of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In this figure, 1 is a base, 2 is a first reflecting member, 4 is a second reflecting member, 6 is a translucent member filled inside the second reflecting member, and 5 is above the light emitting element 3. And it arrange | positions in the inside or surface (in FIG. 1 inside) of the translucent member 6 at intervals with the 1st reflective member 2 and the 2nd reflective member 4, and wavelength-converts the light which the light emitting element 3 light-emits. This is a first wavelength conversion layer that generates fluorescence, and a light-emitting device for mainly housing the light-emitting element 3 is constituted by these.

  The substrate 1 is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, metal such as Fe—Ni—Co alloy or Cu—W, or resin such as epoxy resin, A placement portion 1 a on which the light emitting element 3 is placed is formed on the upper surface of the base 1.

  In addition, the base 1 has a brazing material such as solder or Ag brazing so that the first reflecting member 2 surrounds the mounting portion 1 a on the upper surface, and the second reflecting member 4 surrounds the first reflecting member 2. Or a bonding material such as an adhesive such as epoxy resin. The first reflecting member 2 has a desired surface accuracy around the light emitting element 3 (for example, in the longitudinal section of the light emitting device, the light reflecting surfaces provided on both sides of the light emitting element 3 with the light emitting element 3 in between are symmetrical. The second reflecting member 4 is attached around the first reflecting member 2 so that an inner peripheral surface (hereinafter referred to as a first inner peripheral surface) 2a is provided. It is attached so that the second inner peripheral surface 4a is provided with surface accuracy. Thereby, not only the fluorescence on the upper surface and the side surface of the first wavelength conversion layer 5 but also the fluorescence from the lower surface of the first wavelength conversion layer 5, the inner peripheral surface of the second reflecting member 4 (hereinafter referred to as the second surface). The light can be efficiently output to the outside of the light emitting device. As a result, the light-emitting device has high radiated light intensity and high luminance, can improve the light emission efficiency, and light from the light-emitting element 3 is transmitted to the first wavelength conversion layer 5 on the first inner peripheral surface 2a. Therefore, the uneven color of light output from the light emitting device is suppressed.

  In addition, as for the 2nd reflection member 4, it is preferable that the cross-sectional shape of the 2nd internal peripheral surface 4a is a concave curved surface. As a result, the fluorescence emitted downward from the first wavelength conversion layer 5 is reflected upward as light having high directivity by the second inner peripheral surface 4a, and is emitted outside the light emitting device. . Therefore, these light-emitting devices are optimal as illumination devices that can efficiently irradiate light onto the irradiation surface.

  Moreover, the 1st reflective member 2 and the 2nd reflective member 4 may produce the 1st reflective member 2 and the 2nd reflective member 4 integrally by die shaping | molding or cutting. Thereby, the heat of the light emitting element 3 is dissipated to the whole light emitting device through the first reflecting member 2 and the second reflecting member 4, and the heat radiation area of the light emitting device is increased, so that Temperature rise is suppressed.

  Moreover, it is preferable that the mounting portion 1a protrudes so that the height is higher than the lower end of the first inner peripheral surface 2a of the first reflecting member 2 as shown in FIG. As a result, the light emitted obliquely downward from the light emitting element 3 is efficiently reflected upward on the first inner peripheral surface 2a and propagated to the first wavelength conversion layer 5, so that the first wavelength conversion is performed. The light of the light emitting element 3 whose wavelength is converted by the layer 5 is increased, and the radiation intensity of the light emitting device is improved.

  Such a protruding mounting portion 1a can be integrally fired by removing the periphery thereof by polishing, cutting, etching, or the like, or by laminating the ceramic green sheets to be the base 1 and the mounting portion 1a. Thus, it is formed so as to protrude from the upper surface of the substrate 1. Alternatively, another member may be formed on the upper surface of the substrate 1 by being attached with an adhesive or the like. For example, members made of ceramics such as alumina ceramics, aluminum nitride sintered bodies, mullite sintered bodies, glass ceramics, metals such as Fe-Ni-Co alloys and Cu-W, or resins such as epoxy resins, It can also be provided by being attached to the upper surface of the substrate 1 with a bonding material such as a brazing material or an adhesive.

  Moreover, as shown in FIG. 6, it is preferable that the mounting part 1a is inclined so that its side surface expands outward as it goes downward. Thereby, when the liquid translucent member 6 before thermosetting is filled inside the second reflecting member 4, the protruding mounting portion 1a and the upper surface of the base 1 or the lower end of the first inner peripheral surface 2a It is possible to effectively prevent an air layer from being formed at the corner between the two. Further, the light emitted from the light emitting element 3 is favorably reflected upward and in the direction of the first inner peripheral surface 2a by the side surface of the protruding mounting portion 1a, and the radiation intensity of the light emitting device can be further improved. . Furthermore, the heat generated in the light emitting element 3 is efficiently diffused and transmitted to the base 1 side via the mounting portion 1a, so that the temperature rise of the light emitting element 3 is more effectively suppressed.

  Further, the mounting portion 1a is formed with a wiring conductor (not shown) for electrically connecting the light emitting element 3. The wiring conductor is led to the outer surface of the light emitting device through a wiring layer (not shown) formed inside the base 1 and connected to the external electric circuit board, whereby the light emitting element 3 and the external electric circuit are connected. Are electrically connected.

  The first reflecting member 2 and the second reflecting member 4 are cut with respect to a metal having high reflectivity such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), and Cu. It is formed by performing processing, mold forming, or the like. Or when the 1st reflective member 2 and the 2nd reflective member 4 consist of insulators, such as ceramics and resin (Including the case where the 1st reflective member 2 and the 2nd reflective member 4 are metal), The first inner peripheral surface 2a and the second inner peripheral surface 4a have high reflectivity such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), Cu, etc. by plating or vapor deposition. A metal thin film may be formed. Further, when the first inner peripheral surface 2a and the second inner peripheral surface 4a are made of a metal that is easily discolored by oxidation of Ag, Cu or the like, a Ni plating layer with a thickness of, for example, about 1 to 10 μm is formed on the surface. It is preferable that an Au plating layer having a thickness of about 0.1 to 3 μm is sequentially deposited by an electrolytic plating method or an electroless plating method. Thereby, the corrosion resistance of the first inner peripheral surface 2a and the second inner peripheral surface 4a is improved, and the deterioration of the reflectance is suppressed.

  Further, the arithmetic average roughness Ra of the first inner peripheral surface 2a and the second inner peripheral surface 4a is preferably 0.004 to 4 μm, whereby the light from the light emitting element 3 and the first wavelength conversion layer The fluorescence from 5 can be reflected well. When Ra exceeds 4 μm, the light from the light emitting element 3 and the first wavelength conversion layer 5 is not reflected uniformly, and diffusely reflects inside the light emitting device, increasing the optical loss. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

  Moreover, even if the 1st reflection member 2 changes the cross-sectional shape of an outer peripheral surface into a curved shape, or it uses a some reflection member between the 1st reflection member 2 and the 2nd reflection member, there will be no trouble. Absent.

  The distance between the upper surface of the first reflecting member 2 and the lower surface of the first wavelength conversion layer 5 is preferably 0.5 to 3 mm. If it is less than 0.5 mm, it becomes difficult to reflect the fluorescence emitted downward from the first wavelength conversion layer 5 to the second reflecting member 4 outside the first reflecting member 2, thereby improving the radiation efficiency. It becomes difficult. In addition, if it exceeds 3 mm, light from the light emitting element 3 is easily emitted directly to the outside without passing through the first wavelength conversion layer 5 from the gap between the first wavelength conversion layer 5 and the first reflecting member 2. Therefore, uneven color and uneven intensity of the emitted light are likely to occur.

  The light emitting element 3 is electrically connected to the wiring conductor formed on the substrate 1 by wire bonding or a flip chip bonding method in which the electrodes of the light emitting element 3 are connected to each other by solder bumps. Preferably, the connection is made by a flip chip bonding method. Thereby, since the wiring conductor can be provided immediately below the light emitting element 3, it is not necessary to provide a space for providing the wiring conductor on the upper surface of the base 1 around the light emitting element 3. Therefore, it is possible to effectively suppress the light emitted from the light emitting element 3 from being absorbed in the space of the wiring conductor of the base body 1 and the radiation light intensity from being lowered.

  This wiring conductor is formed by, for example, forming a metallized layer of a metal powder such as W, Mo, Cu, Ag, or by burying a lead terminal such as an Fe-Ni-Co alloy, or by forming a wiring conductor. An input / output terminal made of an insulating material is provided by being fitted and joined to a through hole provided in the base 1.

  It should be noted that the exposed surface of the wiring conductor should be coated with a metal having excellent corrosion resistance, such as Ni or Au, with a thickness of about 1 to 20 μm, which can effectively prevent oxidative corrosion of the wiring conductor. The connection between the light emitting element 3 and the wiring conductor can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor by an electrolytic plating method or an electroless plating method. Is more preferable.

  The translucent member 6 is made of a transparent resin such as epoxy resin or silicone resin, or translucent glass, and covers the light emitting element 3 and, if necessary, the first wavelength conversion layer 5 and the first reflective member. 2 and the inside of the second reflecting member 4 are filled. Thereby, the difference in refractive index between the inside and outside of the light emitting element 3 and the first wavelength conversion layer 5 is reduced, and more light can be extracted from the light emitting element 3 and the first wavelength conversion layer 5. Furthermore, when the translucent member 6 is made of the same material as the transparent member constituting the first wavelength conversion layer 5, light emission from the light emitting device is improved, and the emitted light intensity and luminance can be remarkably improved.

  The first wavelength conversion layer 5 includes a phosphor that can convert the wavelength of light from the light emitting element 3 and a transparent member such as an epoxy resin, a silicone resin, or glass. And is cured by an oven or the like. The first wavelength conversion layer 5 is disposed directly above the light emitting element 3 and covers a part of the first reflecting member 2 and the second reflecting member 4 so that the first wavelength converting layer 5 is directly irradiated from the light emitting element 3. And the light reflected by the first reflecting member 2 are wavelength-converted by the phosphor and light having a desired wavelength spectrum is extracted.

  Further, as shown in FIG. 2, the first wavelength conversion layer 5 is provided above the light emitting element 3 and on the surface of the translucent member 6 so as to be spaced from the first reflecting member 2 and the second reflecting member 4. May be arranged. In that case, the light emitted from the first wavelength conversion layer 5 is easily radiated to the outside of the light emitting device, so that the light emission efficiency of the light emitting device can be improved and the emitted light intensity and luminance can be improved.

  Further, as shown in FIG. 7, the first wavelength conversion layer 5 has an outer peripheral portion that is an end portion of the light emitting element 3 and an upper end of the inner peripheral surface 2a of the first reflecting member 2 opposite to the end portion. It is preferable that the second reflection member 4 is located on the side of the straight line passing through. Thereby, it can suppress that the light from the light emitting element 3 is radiated | emitted directly outside the light-emitting device. As a result, it is possible to irradiate light from the light emitting device with no unevenness in emission color or emission distribution.

  Further, as shown in FIG. 8, the first wavelength conversion layer 5 preferably has a cross-sectional shape that is a convex curved surface toward the light emitting element 3 side. As a result, the fluorescence emitted from the lower surface of the first wavelength conversion layer 5 is uniformly applied to the second inner peripheral surface 4a of the second reflecting member 4, thereby causing the second inner peripheral surface 4a to emit light. Color unevenness of reflected light is suppressed. Accordingly, the optical characteristics of the light emitting device can be improved.

  Further, as shown in FIG. 9, the first wavelength conversion layer 5 has a curved surface that is convex toward the light emitting element 3, and the first wavelength conversion layer 5 increases in intensity with respect to the light emission intensity distribution of the light emitting element 3. It is preferable that the thickness of the layer 5 has a proportional relationship in which the thickness increases. As a result, light emitted from the upper surface of the first wavelength conversion layer 5 is also uniformly irradiated to the outside. Therefore, the light emitting device can irradiate the outside with light in which the deviation of the light distribution and the color unevenness are suppressed.

  Further, the translucent member 6 may be filled with different translucent materials inside the first reflecting member 2 and the second reflecting member 4 as shown in FIG. That is, in the transparent member 7 filled to the upper end inside the first reflecting member 2 and the translucent member 6 filled inside the second reflecting member 4, the refractive index of the transparent member 7 is translucent. When lower than the member 6, the light reflected by the light emitting element 3 or the first inner peripheral surface 2 a propagates into the translucent member 6 without being totally reflected at the interface between the transparent member 7 and the translucent member 6. At the same time, a part of the fluorescence emitted downward from the first wavelength conversion layer 5 is totally reflected at the interface between the transparent member 7 and the translucent member 6 and emitted outside the light emitting device. When the refractive index of the transparent member 7 is higher than that of the translucent member 6, the light from the light emitting element 3 or the light reflected by the first inner peripheral surface 2 a is an interface between the transparent member 7 and the translucent member 6. The reflection loss that occurs when the light passes through is suppressed. The translucent member 6 and the transparent member 7 can be selected in consideration of the refractive index difference and the transmittance so that the emitted light intensity of the light emitting device is maximized.

  Next, the second invention of the present invention will be described. In addition, in 2nd invention of this invention, it is the same as said 1st invention except the mounting part 2b being formed in the 1st reflection member 2, and detailed description is abbreviate | omitted.

  As shown in FIG. 3A, the first reflecting member 2 has a mounting portion 2b on which the light emitting element 3 is mounted on the upper surface, and an inner peripheral surface that surrounds the mounting portion 2b is a light reflecting surface. The side wall portion 2c is attached to the central portion of the upper surface of the base body 1. Further, a frame-like second reflecting member 4 having a side wall portion 4c in which the second inner peripheral surface 4a is a light reflecting surface is formed on the outer peripheral portion of the upper surface of the base 1 at the outer peripheral portion of the first reflecting member 2. To be attached. The inside of the second reflecting member 4 is filled with a translucent member 6 so as to cover the light emitting element 3 and the first reflecting member 2, and above the light emitting element 3 and the translucent member. A first wavelength conversion layer 5 that converts the wavelength of light emitted from the light emitting element 3 is disposed inside or on the surface of the light emitting element 3 with a space between the first reflecting member 2 and the second reflecting member 4. .

  Thereby, after the light emitted from the light emitting element 3 is wavelength-converted by the first wavelength conversion layer 5, the light emitted downward from the first wavelength conversion layer 5 is reflected by the second reflecting member 4. While reflecting in the upward direction, the first wavelength conversion layer 5 can be emitted from the gap between the first wavelength conversion layer 5 and the second reflection member 4 to the outside of the light emitting device without being transmitted again. As a result, light emitted downward from the first wavelength conversion layer 5 can be extremely effectively prevented from being confined in the light emitting device, and the emitted light intensity and luminance are increased, and light emission with high luminous efficiency is achieved. It can be a device.

  Further, the heat generated from the light emitting element 3 can be easily transferred to the side wall portion 2c integrated with the placement portion 2b. In particular, when the first reflecting member 2 is made of metal, heat is quickly transferred to the side wall portion and is well dissipated from the outer surface of the side wall portion 2c. As a result, the temperature rise of the light emitting element 3 can be suppressed, and cracks in the joint caused by the difference in thermal expansion between the light emitting element 3 and the first reflecting member 2 can be suppressed. In addition, the heat of the light emitting element 3 can be favorably moved not only in the height direction of the first reflecting member 2 but also in the outer peripheral direction, so that heat can be efficiently conducted from the entire lower surface of the first reflecting member 2 to the base 1. Thus, the temperature rise of the light emitting element 3 and the first reflecting member 2 can be more effectively suppressed, the operation of the light emitting element 3 can be stably maintained, and the thermal deformation of the inner peripheral surface of the first reflecting member 2 can be suppressed. Can do. Therefore, stable light characteristics of the light emitting device can be maintained and operated over a long period of time.

  Note that the light emitting element 3 has a wiring conductor (not shown) formed in the base body 1 through the through hole 2d formed in the inner peripheral surface 2a surrounding the mounting portion 2b as shown in FIG. Are electrically connected by the bonding wire 8 to supply power.

Further, as shown in FIG. 4, the first reflecting member 2 and the second reflecting member 4 are produced by integrally molding the first reflecting member 2 and the second reflecting member 4 by molding or cutting. May be. Thereby, the heat of the light emitting element 3 is dissipated to the whole light emitting device through the first reflecting member 2 and the second reflecting member 4, and the heat radiation area of the light emitting device is increased, so that The temperature rise is suppressed. Similarly to the embodiment shown in FIG. 5 or 6 in the first invention of the present invention, the side wall on which the mounting portion 2b is the inner peripheral surface of the first reflecting member 2 around it. It may protrude so as to be higher than the lower end of the portion 2c, and the light emitted obliquely downward from the light emitting element 3 is efficiently reflected upward by the side wall portion 2c and propagated to the first wavelength conversion layer 5. Therefore, the light of the light emitting element 3 that is wavelength-converted by the first wavelength conversion layer 5 is increased and the radiation intensity of the light emitting device is improved.

  Further, as shown in FIG. 11, the second reflecting member 4 is provided with a second wavelength conversion layer 4b for converting the wavelength of light emitted from the light emitting element 3 on the surface of the second inner peripheral surface 4a. Preferably it is. That is, the light propagates to the first wavelength conversion layer 5 directly from the light emitting element 3 or through reflection by the first inner peripheral surface 2a, and is wavelength-converted by the phosphor contained in the first wavelength conversion layer 5. Instead, the light reflected outwardly from the lower side reaches the second wavelength conversion layer 4b formed on the second inner peripheral surface 4a and is wavelength-converted. The wavelength-converted light is radiated upward from the second wavelength conversion layer 4 b and the upper surface of the translucent member 6 from between the first wavelength conversion layer 5 and the second reflection member 4. Is emitted to the outside of the light emitting device. As a result, the light emitting device emits light from the light emitting device by converting the light of the light emitting element which is not wavelength-converted by the first wavelength conversion layer 5 and is reflected outwardly by the second wavelength conversion layer 4b. Light intensity, brightness, and luminous efficiency can be improved.

  The light emitted from the second wavelength conversion layer 4b to the second inner peripheral surface 4a is reflected by the second inner peripheral surface 4a, which is a light reflecting surface, and again the second wavelength conversion layer 4b. Back to the side.

  Further, as shown in FIG. 12, the second wavelength conversion layer 4b is preferably provided so that its thickness gradually increases from the upper end to the lower end. As a result, the second wavelength conversion layer 4b is gradually thicker toward the lower end of the second wavelength conversion layer 4b where the distance between the upper surface of the translucent member 6 and the second wavelength conversion layer 4b increases. As a result, the amount of light generated from the phosphor gradually increases. In addition, the second wavelength conversion layer is gradually thinned toward the upper end of the second wavelength conversion layer 4b where the distance between the upper surface of the translucent member 6 and the second wavelength conversion layer 4b is reduced. The amount of light generated from the phosphor gradually decreases from the lower end side. As a result, the intensity distribution of light emitted upward from the light emitting device can be made uniform between the central portion and the peripheral portion, and color unevenness can be suppressed.

  In the second wavelength conversion layer 4b, it is preferable that the density of the phosphor gradually increases from the upper end to the lower end. Thereby, the density of the phosphor of the second wavelength conversion layer 4b is increased toward the lower end of the second wavelength conversion layer 4b where the distance between the upper surface of the translucent member 6 and the second wavelength conversion layer 4b increases. By gradually increasing, the amount of light generated from the phosphor gradually increases. Moreover, the density of the phosphor of the second wavelength conversion layer 4b is lower at the upper end of the second wavelength conversion layer 4b where the distance between the upper surface of the translucent member 6 and the second wavelength conversion layer 4b becomes smaller. By being gradually smaller than the portion, the amount of light generated from the phosphor gradually decreases from the lower end portion. As a result, the intensity distribution of light emitted upward from the light emitting device can be made uniform between the central portion and the peripheral portion, and color unevenness can be suppressed.

  Further, the second wavelength conversion layer 4b is preferably provided with a plurality of concave portions or convex portions on the inner surface thereof. That is, as shown in FIG. 13, by providing a plurality of concave portions or convex portions on the surface of the second wavelength conversion layer 4b, the surface area of the second wavelength conversion layer 4b increases. As a result, the amount of phosphor exposed on the surface of the second wavelength conversion layer 4b increases, so that it propagates to the first wavelength conversion layer 5 directly from the light emitting element 3 or through reflection by the first inner peripheral surface 2a. In addition, the light reflected by the phosphor contained in the first wavelength conversion layer 5 without being wavelength-converted outward is irradiated onto the phosphor exposed on the surface of the second wavelength conversion layer 4b. Thus, the phosphor is excited and is easily wavelength-converted to fluorescence. As a result, the amount of fluorescence from the phosphor increases and the fluorescence is efficiently emitted from the second wavelength conversion member 4b, so that the emitted light intensity, luminance, and luminous efficiency of the light emitting device are improved.

  Further, the light propagates to the first wavelength conversion layer 5 directly from the light emitting element 3 or through reflection by the first inner peripheral surface 2a and is not wavelength-converted by the phosphor contained in the first wavelength conversion layer 5. The light that is reflected downward and incident at an obtuse angle that is nearly parallel to the surface of the second wavelength conversion layer 4b is incident at an acute angle that is close to a right angle with respect to the side surface of the concave or convex portion. The light is propagated into the second wavelength conversion layer 4b without being transmitted. As a result, the incident light incident on the second wavelength conversion layer 4b from the translucent member 5 increases, that is, the transmittance at the interface between the translucent member and the second wavelength conversion layer increases, and the second Since the light whose wavelength is converted by the phosphor in the wavelength conversion layer 4b increases, the emitted light intensity, luminance, and luminous efficiency of the light emitting device are improved.

  Next, the light emitting device of the present invention is configured by arranging one device in a predetermined arrangement, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. The lighting device of the present invention can be obtained by installing the light emitting device groups in a circular shape or a polygonal shape so as to have a predetermined arrangement such as a plurality of concentric groups. Thereby, it is possible to use the light-emitting element 3 having lower power consumption and longer life as a light source than a conventional lighting device using discharge, which utilizes light emission by recombination of electrons of the light-emitting element 3 made of a semiconductor. A small illuminating device with less heat generation that can efficiently radiate light emitted from the light source to the outside can be obtained. As a result of being able to operate efficiently with low power, the amount of heat generated by the light emitting element 3 is small, fluctuations in the center wavelength of the light generated from the light emitting element 3 can be suppressed, and stable radiated light over a long period of time. While being able to irradiate light with an intensity and a radiated light angle (light distribution), it is possible to provide an illuminating device in which color unevenness and uneven illuminance distribution on the irradiated surface are suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  For example, a plurality of light emitting devices 101 are arranged in a plurality of rows on the light emitting device driving circuit board 102 as shown in the plan view and the cross-sectional view shown in FIGS. In the case of an illuminating device in which the reflecting jig 9 is installed, in a plurality of light emitting devices 101 arranged on one adjacent row, an arrangement in which the interval between the adjacent light emitting devices 101 is not shortest, a so-called staggered pattern It is preferable that That is, when the light emitting devices 101 are arranged in a grid, the glare is strengthened by arranging the light emitting devices 101 as light sources on a straight line, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Furthermore, since the distance between adjacent light emitting devices 101 is increased, thermal interference between adjacent light emitting devices 101 is effectively suppressed, and heat in the light emitting device driving circuit board 102 on which the light emitting devices 101 are mounted is reduced. Clouding is suppressed, and heat is efficiently dissipated to the outside of the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with little obstacles to human eyes.

  Further, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device drive circuit board 102 as shown in the plan view and the sectional view shown in FIGS. In the case of the illuminating device formed in a plurality of groups, it is preferable that the number of the light emitting devices 101 in one circular or polygonal light emitting device 101 group is increased from the central side of the illuminating device to the outer peripheral side. Thereby, it is possible to arrange more light emitting devices 101 while maintaining an appropriate interval between the light emitting devices 101, and it is possible to further improve the illuminance of the lighting device. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide lights and signaling devices, stage and studio lighting, advertising lights, lighting poles, underwater lighting, strobe lights, spotlights, security lights embedded in power poles, emergency lighting, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

  For example, a plurality of light emitting elements 3 may be provided on the base 1 in order to improve the radiation intensity. It is also possible to arbitrarily adjust the angles of the first inner peripheral surface 2a and the second inner peripheral surface 4a and the distance from the upper end of the second inner peripheral surface 4a to the upper surface of the translucent member 6. With this, it is possible to obtain better color rendering by providing a complementary color gamut.

  Further, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 101 are installed in a predetermined arrangement, but may be one in which one light emitting device 101 is installed in a predetermined arrangement.

  Examples of the light emitting device of the present invention are shown below. First, a substrate 1 made of alumina ceramic to be the substrate 1 was prepared. The base 1 is integrally formed so that the mounting portion 1a protrudes, and the upper surface of the mounting portion 1a and the upper surface of the base 1 other than the mounting portion 1a are made parallel.

  The base body 1 has a rectangular parallelepiped mounting portion 1a having a width of 0.35 mm, a depth of 0.35 mm, and a thickness of 0.15 mm formed at the center of the upper surface of a rectangular parallelepiped having a width of 17 mm, a depth of 17 mm, and a thickness of 0.5 mm.

  In addition, a wiring conductor for electrically connecting the light emitting element 3 and the external electric circuit board through an internal wiring formed inside the base body 1 is formed at a portion where the light emitting element 3 of the mounting portion 1a is mounted. did. The wiring conductor was formed into a circular pad having a diameter of 0.1 mm by a metallized layer made of Mo—Mn powder, and a Ni plating layer having a thickness of 3 μm and an Au plating layer having a thickness of 2 μm were sequentially deposited on the surface thereof. . Further, the internal wiring inside the base body 1 was formed by an electrical connection portion made of a through conductor, that is, a so-called through hole. This through hole was also formed with a metallized conductor made of Mo-Mn powder in the same manner as the wiring conductor.

The first reflecting member 2 has a diameter of the uppermost end of the first inner peripheral surface 2a of 2.7 mm and a height of 1.5 mm, and the lower end of the first inner peripheral surface 2a (the upper surface of the base 1). The height from the lower surface joined to the lower side of the inclined surface of the first inner peripheral surface 2a) was 0.1 mm. Further, the shape of the first inner peripheral surface 2a in the cross section orthogonal to the upper main surface of the base body 1 is such that the height from the lower end of the first inner peripheral surface 2a is Z ₁ and the radius of the inner dimension is r ₁ . Sometimes Z ₁ = (cr ₁ ² ) / [1+ {1- (1 + k) c ² r ₁ ² } ^1/2 ]
The constant k is -1.053, and the curvature c is 1.818. The arithmetic average roughness Ra of the first inner peripheral surface 2a was 0.1 μm.

The second reflecting member 4 has a diameter of the uppermost end of the second inner peripheral surface 4a of 16.1 mm and a height of 3.5 mm. The height of the lower end of the second inner peripheral surface 4a (the upper surface of the base 1) The height from the lower surface joined to the lower side of the inclined surface of the second inner peripheral surface 4a) was 0.18 mm. Further, the shape of the second inner peripheral surface 4a in the cross section orthogonal to the upper main surface of the substrate 1 is such that the height from the lower end of the second inner peripheral surface 4a is Z ₂ and the radius of the inner dimension is r ₂ . Sometimes Z ₂ = (cr ₂ ² ) / [1+ {1- (1 + k) c ² r ₂ ² } ^1/2 ]
The constant k is -2.3 and the curvature c is 0.143. The arithmetic average roughness Ra of the second inner peripheral surface 4a was 0.1 μm.

  Next, an Au—Sn bump is provided on the wiring conductor formed on the upper surface of the substrate 1, and the light emitting element 3 is bonded to the wiring conductor via the Au—Sn bump, and the first reflecting member 2 is mounted. The second reflecting member 4 was joined to the outer periphery of the base 1 with a resin adhesive so as to surround the first reflecting member 2 so as to surround the portion 1a.

  And using the dispenser, the translucent member 6 which consists of a transparent silicone resin was inject | poured into the inside of the 1st reflective member 2 and the 2nd reflective member 4, and was thermosetted in oven.

  Further, the translucent member 6 is a plate having a diameter of 5 mm and a thickness of 0.9 mm, which contains three kinds of phosphors that are excited by the light of the light emitting element 3 and emit red light, green light, and blue light. The 1st wavelength conversion layer 5 was installed in the position of height 2.5mm from the light emitting element 3 so that the 1st reflective member 2 might be covered.

  Thereafter, the translucent member 6 was coated on the first wavelength conversion layer 5 using a dispenser, and thermally cured in an oven.

  Further, as comparative light-emitting devices, light-emitting devices similar to those described above with respect to the structure shown in FIG. 18 were produced.

  With respect to the light-emitting devices thus manufactured, a current of 20 mA was applied to each of the light-emitting devices so that the light-emitting devices were turned on to measure the total luminous flux. As a result, the luminous efficiency of the light emitting device as a comparative example of the structure of FIG. 18 was 8.5 (lm / W), whereas the outer dimensions were the same, and the luminous efficiency of the light emitting device of the structure of FIG. / W). It has been found that the light emitting device of the present invention can provide an effect as much as 3.2 times in luminous efficiency, confirming the superiority of the light emitting device of the present invention.

  It should be noted that the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

It is sectional drawing which shows an example of embodiment of the light-emitting device of 1st invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st invention of this invention. (A) (b) is sectional drawing in a different position which shows an example of embodiment of the light-emitting device of 2nd invention of this invention, respectively. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 2nd invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st or 2nd invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st or 2nd invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st or 2nd invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st or 2nd invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st or 2nd invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st or 2nd invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st or 2nd invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st or 2nd invention of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of 1st or 2nd invention of this invention. It is a top view which shows an example of embodiment of the illuminating device of this invention. FIG. 15 is a cross-sectional view of the lighting device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. FIG. 17 is a cross-sectional view of the illumination device of FIG. It is sectional drawing of the conventional light-emitting device.

Explanation of symbols

1: Base 1a: Placement part 2: First reflecting member 3: Light emitting element
4: 2nd reflective member 4b: 2nd wavelength conversion layer 5: 1st wavelength conversion layer 6: Translucent member

Claims (9)

A base having a light emitting element mounting portion formed on the upper main surface, and a frame-like shape in which the inner peripheral surface is a light reflecting surface attached to the upper main surface of the base so as to surround the mounting portion. A first reflecting member, a frame-like second reflecting member attached to an upper main surface of the base so as to surround the first reflecting member, and having an inner peripheral surface as a light reflecting surface; The light-emitting element placed on the placement unit, a translucent member provided inside the second reflective member so as to cover the light-emitting element and the first reflective member, and above the light-emitting element A first wavelength conversion layer for converting a wavelength of light emitted from the light emitting element, which is provided inside or on the surface of the translucent member located at a distance from the first and second reflecting members; A light-emitting device comprising: A flat substrate and a side wall portion which is bonded to the upper main surface of the substrate and has a light emitting element mounting portion formed on the upper surface and whose inner peripheral surface is a light reflecting surface surround the mounting portion. The formed first reflecting member, and a frame-like second reflecting member attached to the upper main surface of the base so as to surround the first reflecting member and having an inner peripheral surface as a light reflecting surface And the light-emitting element placed on the mounting portion, the translucent member provided inside the second reflective member so as to cover the light-emitting element and the first reflective member, and A first light for converting the wavelength of light emitted from the light emitting element, which is provided inside or on the surface of the translucent member located above the light emitting element and spaced from the first and second reflecting members. A light emitting device comprising a wavelength conversion layer. The second reflection member is provided with a second wavelength conversion layer for converting a wavelength of light emitted from the light emitting element on a surface of an inner peripheral surface of the second reflection member. The light emitting device according to 1. 4. The light emitting device according to claim 1, wherein the second wavelength conversion layer is provided so that a thickness thereof gradually increases from an upper end portion to a lower end portion. The second wavelength conversion layer contains a phosphor that converts the wavelength of light emitted from the light emitting element, and the density of the phosphor gradually increases from the upper end to the lower end. The light emitting device according to any one of claims 1 to 4. The light emitting device according to claim 1, wherein the second wavelength conversion layer has a plurality of concave portions or convex portions on an inner surface thereof. The light emitting device according to any one of claims 1 to 6, wherein the mounting portion protrudes so that a height is higher than a lower end of the inner peripheral surface of the first reflecting member. apparatus. The first wavelength conversion layer has an outer peripheral portion that is more than a straight line passing through an end portion of the light emitting element and an upper end of the inner peripheral surface of the first reflecting member on the opposite side of the end portion. The light-emitting device according to claim 1, wherein the light-emitting device is located on a reflecting member side. 9. A lighting device comprising the light emitting device according to claim 1 installed in a predetermined arrangement.

Images