JP2006049132A - Manufacturing method of image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing device of a low-cost and high-quality image display device having high productivity while suppressing surface discharge between metal back layers. <P>SOLUTION: Patterns of a shading layer and a phosphor layer are respectively formed on an oblong front substrate arranged oppositely to a back substrate with multiple electron emission elements arranged thereon; and a pattern of the metal back layers vertically and horizontally divided in a matrix-like form are formed on the phosphor layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an image display device, and more particularly to a method for manufacturing a flat image display device using an electron-emitting device.

  Recently, as a next-generation image display device, development of a flat-type image display device in which a large number of electron-emitting devices are arranged so as to be opposed to a phosphor screen has been advanced. There are various types of electron-emitting devices, all of which basically use field emission, and display devices using these electron-emitting devices are generally called field emission displays (hereinafter referred to as FED). )is called. A display device using a surface conduction electron-emitting device among FEDs is also called a surface conduction electron-emission display (hereinafter referred to as SED). In this specification, the display device is generally called FED. Use terminology.

  In order to obtain practical display characteristics in the FED, it is necessary to use a phosphor similar to a normal cathode ray tube and a phosphor screen in which an aluminum thin film called a “metal back” is formed on the phosphor. It becomes. The metal back reflects the light emitted from the phosphor by the electrons emitted from the electron source and proceeds toward the electron source to increase the brightness, and imparts conductivity to the phosphor layer. The purpose is to serve as an anode electrode and to prevent the phosphor layer from being damaged by ions generated by ionization of the gas remaining in the vacuum envelope. In this case, the anode voltage applied to the phosphor screen is desired to be at least several kV, preferably 10 kV or more.

  However, the gap between the front substrate and the rear substrate of the FED cannot be so large from the viewpoint of the resolution and the characteristics of the support member, and needs to be set to about 1 to 2 mm. For this reason, in the FED, a strong electric field is formed in a narrow gap between the front substrate and the rear substrate, and when an image is formed over a long period of time, discharge (surface discharge between metal back films; vacuum arc discharge) is likely to occur between the two substrates. Become. When a discharge occurs, a large discharge current ranging from several amperes to several hundred amperes flows instantaneously, so that the electron-emitting device in the cathode part and the phosphor screen in the anode part may be destroyed or damaged. Such a discharge that leads to the occurrence of a defect is not allowed as a product. Therefore, in order to put the FED into practical use, it is necessary to prevent damage caused by discharge over a long period of time.

Patent Document 1 discloses that a metal back film (Al film) used as an anode electrode is divided and a common electrode provided outside a phosphor screen via a resistance member in order to alleviate damage when a discharge occurs. A technique for connecting is disclosed.
Japanese Patent Laid-Open No. 10-326583

  However, in the above-described prior art, after the metal back film is formed so as to cover the entire surface of the phosphor layer, a dividing step for dividing the metal back film for the purpose of preventing surface discharge is required. However, there was a problem that the cost was low and the cost was likely to be high. Further, in the conventional metal back film dividing step, it is difficult to cleanly separate only the metal back film, and the phosphor layer that is the underlying layer may be damaged.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing an image display device that has high productivity, low cost, and high quality while suppressing occurrence of surface discharge. And

  In the method for manufacturing an image display device according to the present invention, a light shielding layer and a phosphor layer are respectively formed on a rectangular front substrate disposed opposite to a rear substrate on which a large number of electron-emitting devices are arranged. A metal back layer divided into a matrix shape in the vertical direction and the horizontal direction is formed on the substrate.

  In the present invention, a metal back layer is formed on the phosphor layer by chemical vapor deposition or physical vapor deposition, a photoresist is applied on the metal back layer, and this photoresist film is exposed and developed. Patterning into a predetermined matrix shape, the metal back layer may be selectively etched using the photoresist film patterned in the matrix shape as a mask, and the photoresist film may be removed from the front substrate (see FIG. 1). ).

  In the present invention, a photoresist is coated on the phosphor layer, the photoresist film is exposed and developed to be patterned into a predetermined matrix, and the recesses of the photoresist film patterned in the matrix are formed. Alternatively, the metal back layer may be patterned in a matrix form by passing a paste containing conductive particles through a screen mask having a predetermined pattern and performing printing (see FIG. 4).

  In the present invention, a metal back layer is transferred from the transfer material onto the phosphor layer, a photoresist is applied onto the transferred metal back layer, and the photoresist film is exposed and developed to obtain a predetermined Alternatively, the metal back layer may be selectively etched using the patterned photoresist film as a mask, and the photoresist film may be removed from the front substrate (see FIG. 5). In this case, the transfer material may be a flexible film having a thermal transfer layer containing conductive particles such as aluminum (Al), or a thermal transfer layer containing conductive particles such as aluminum (Al). A rigid substrate having the following may be used.

  Furthermore, in the present invention, after the first base protective layer is formed on the phosphor layer, a metal back layer may be formed on the first base protective layer, or the second base protective layer may be formed. After the layer is formed on the metal back layer, a photoresist film may be formed on the second base protective layer (see FIGS. 1 and 5).

  In general, the thickness of the metal back layer is preferably in the range of about 50 to 200 nm (0.05 to 0.2 μm). When the thickness of the metal back layer is less than 50 μm, the anode function, which is the original function of the metal back layer, is lowered, and the electron beam emitted from the electron-emitting device on the back substrate becomes insufficient, and the screen is This is because it tends to cause image quality deterioration such as blurring. On the other hand, if the thickness of the metal back layer exceeds 200 μm, the attenuation of the electron beam passing through the metal back layer increases, and the energy of the electron beam reaching the phosphor layer decreases.

  In the metal back layer of the matrix pattern, the dividing width is different between the vertical direction and the horizontal direction. The vertical dividing width is generally smaller than the horizontal dividing width, and is generally 20 to 30 μm (at most, it can be suppressed to less than 50 μm). This is because if the distance between adjacent RGB pixels becomes too large, the sharpness of the image quality is impaired and a sharp image cannot be obtained. On the other hand, the lateral dividing width is allowed to be relatively wide, and is generally 50 to 150 μm. This is because the horizontal direction does not affect the image quality deterioration so sensitively compared to the vertical direction. In addition, the division in the horizontal direction is because the emphasis is placed on suppressing the occurrence of surface discharge.

  In the present specification, “partition of the metal back layer in the vertical direction” means that an insulating line that prevents electrical conduction of the metal back layer is provided in a direction (Y direction) parallel to the short side of the rectangular substrate, This is defined as eliminating electrical continuity between adjacent metal back layers. In addition, “division of the metal back layer in the horizontal direction” means that an adjacent metal back is formed by providing an insulating line that prevents electrical conduction of the metal back layer in a direction (X direction) parallel to the long side of the rectangular substrate. It is defined to mean eliminating electrical continuity between layers. These insulation lines extending in the vertical and horizontal directions are not only physically divided by cutting away a part of the metal back layer, but also converting a part of the good conductor constituting the metal back layer into an insulator by chemical treatment. (For example, a so-called chemical cut in which a part of an aluminum metal film is selectively oxidized to form aluminum oxide).

  According to the present invention, since the metal back layer is formed in a matrix, generation of surface discharge between the metal back layers is effectively prevented.

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings.

(First embodiment)
First, a method for manufacturing an FED as an image display apparatus according to the first embodiment will be described with reference to FIG.

  A glass substrate 2 serving as a front substrate of the FED is cleaned using a predetermined chemical solution to obtain a desired clean surface substantially free of particles, fats and oils, metal ions, and the like. Next, a light shielding layer forming solution containing a light absorbing material such as a black pigment is applied to the inner surface of the cleaned front substrate 2, and the coating film is heated and dried, and then a patterning mask having openings at positions corresponding to the matrix pattern is formed. It is exposed to light and developed to form a matrix pattern light shielding layer 2b shown in FIG. At the same time, a rectangular frame light shielding layer 2a is formed around the periphery of the front substrate 2 as shown in FIG. 2 around the matrix pattern light shielding layer 2b.

Next, a mixed solution prepared by mixing Y ₂ O ₂ S: Eu ³⁺ as a red (R) phosphor at a predetermined ratio with respect to a photoresist solution (including a solvent) is applied onto the front substrate 2 by a spin coating method. Apply to a predetermined film thickness. After the coating film is heated and dried, it is exposed using a mask having openings at positions corresponding to the red (R) pattern, developed, and washed and dried. As a result, a red (R) strip pattern is formed. Similarly, ZnS: Cu, Al is used as a green (G) phosphor, and ZnS: Ag is used as a blue (B) phosphor, and green (G) and blue (B) are also changed to a red (R) pattern. A predetermined pattern is formed in each adjacent position. Finally, the substrate 2 is baked to burn off the photoresist, and the phosphor layers 3 of the striped RGB three-color pattern are regularly arranged in the vertical and horizontal directions (Y direction and X direction) as shown in FIGS. A phosphor screen is obtained. On this phosphor screen, square pixels with a pitch of 600 μm were arranged in a matrix, and the width of the vertical division line 31V of the phosphor layer 3 was set to a range of 20 to 30 μm.

  Next, as shown in FIG. 1C, a first base protective layer 4 having a predetermined thickness was applied on the phosphor layer 3. The first base protective layer 4 protects the phosphor layer 3 from etching damage described later, and is made of an adhesive containing water glass and / or an organic resin such as an acrylic resin or nitrocellulose. The film thickness of the first undercoat protective layer 4 is sufficient to protect the phosphor layer 3, but it is not excessively thick in consideration of shortening the etching time in a later process.

  Next, as shown in FIG. 1D, a metal back layer 5 having a predetermined thickness made of an Al film was formed on the first base protective layer 4 by a vacuum deposition method. The film thickness of the metal back layer 5 was set to 0.1 μm, for example. Further, a second base protective layer 6 was formed on the metal back layer 5. The second base protective layer 6 protects the metal back layer 5 from development damage described later, and is made of an adhesive containing water glass and / or an organic resin such as an acrylic resin or nitrocellulose.

  Next, a positive photoresist solution was applied onto the second base protective layer 6 by spin coating, and baked to form a photoresist film 7 having a predetermined thickness. As shown in FIG. 1 (f), the photoresist film 7 was exposed using a mask 8 having an opening at a position corresponding to the matrix pattern light-shielding layer 2b within the plane field of view. When this was developed, the exposed portion was dissolved in the developer to obtain a matrix-like resist pattern 7a shown in FIG.

  The developer is washed away with water and dried, and then the second base protective layer 6 and the metal back layer 5 are selectively etched using the plasma discharge etching method with the resist pattern 7a as a mask, as shown in FIG. did.

  The whole substrate 2 was baked under the conditions of a predetermined temperature and a predetermined time, and the organic components of the resist pattern 7a and the second undercoat protective layer pattern 6a were burned away, thereby obtaining a matrix-like metal back layer pattern 5a. The space between the metal back layer patterns 5a becomes the dividing portion 31 shown in FIG. These dividing portions 31 are filled with a resistance adjustment layer (not shown), and the upper surface of the resistance adjustment layer is flush with the upper surface of the metal back layer pattern 5a.

  Next, the phosphor screen formed as described above is placed in the vacuum envelope 14 together with the electron-emitting device. For this, a method of forming a vacuum container by vacuum-sealing the front substrate 2 having a phosphor screen and the rear substrate 1 having a plurality of electron-emitting devices 18 with frit glass or the like is employed. Further, a predetermined getter material is deposited from above the pattern in the vacuum envelope 14, and a getter material deposition film is formed in the region of the metal back layer 5. Thus, a desired FED as an image display device was obtained.

  FIG. 2 shows the structure of the front substrate 2, particularly the phosphor screen, common to the embodiments of the present invention. The phosphor screen of the front substrate 2 has a number of rectangular phosphor layers 3 that emit red (R), green (G), and blue (B). When the longitudinal direction of the front substrate 2 is the X axis and the width direction perpendicular to the X axis is the Y axis, the phosphor layers R, G, B are repeatedly arranged at a predetermined gap interval in the X axis direction, and the Y axis direction Are arranged repeatedly at predetermined gap intervals. Note that the gap gap between the phosphor layers in the XY plane is accurate because the predetermined gap gap is allowed to vary within the range of manufacturing errors or within the tolerance of design. Although it cannot be said that it is a constant value, it is assumed here that it is a substantially constant value for convenience.

  The phosphor screen includes patterned light shielding layers 2a and 2b. As shown in FIG. 2, this light-shielding layer is a matrix between the rectangular frame light-shielding layer 2a extending along the peripheral edge of the front substrate 2 and the phosphor layers R, G, B inside the rectangular frame light-shielding layer 2a. And a matrix pattern light shielding layer 2b extending in a shape.

Red (R), green (G), and blue (B) phosphor layers 3 (pixels) are arranged in a region where the matrix pattern light shielding layer 2b does not exist. On the matrix pattern light-shielding layer 2b, as shown in FIG. 3, a vertical division line 31V filled with a resistance adjusting layer and a horizontal division line (stripe) 31H chemically cut into Al ₂ O ₃ are provided. .

  Since the phosphor layer 3 is aligned with R, G, and B in the X direction as shown in FIG. 3, the vertical line portion 31V is much narrower than the horizontal line portion 31H. For example, in the case of a square pixel with a pitch of 600 μm, the width of the vertical line portion 31V is 30 μm and the width of the horizontal line portion 31H is 100 μm.

  As a result of examining the degree of electrical disconnection between the patterns in the FED obtained in the first embodiment (suppression of surface discharge between the metal back layers), the peak value of the discharge current when discharge occurs is suppressed, A momentary concentration of energy was avoided. As a result of the reduction of the maximum value of discharge energy, destruction, damage and deterioration of the electron-emitting device and the phosphor screen were prevented.

(Second Embodiment)
Next, a method for manufacturing an FED as an image display apparatus according to the second embodiment will be described with reference to FIG.

  A glass substrate 2 serving as a front substrate of the FED is cleaned using a predetermined chemical solution to obtain a desired clean surface substantially free of particles, fats and oils, metal ions, and the like. Next, a light shielding layer forming solution containing a light absorbing material such as a black pigment is applied to the inner surface of the cleaned front substrate 2, and the coating film is heated and dried, and then a patterning mask having openings at positions corresponding to the matrix pattern is formed. The matrix pattern light-shielding layer 2b shown in FIG.

Next, a mixed solution prepared by mixing Y ₂ O ₂ S: Eu ³⁺ as a red (R) phosphor at a predetermined ratio with respect to a photoresist solution (including a solvent) is applied onto the front substrate 2 by a spin coating method. Apply to a predetermined film thickness. After the coating film is heated and dried, it is exposed using a mask having openings at positions corresponding to the red (R) pattern, developed, and washed and dried. As a result, a red (R) strip pattern is formed. Similarly, ZnS: Cu, Al is used as a green (G) phosphor, and ZnS: Ag is used as a blue (B) phosphor, and green (G) and blue (B) are also changed to a red (R) pattern. Predetermined patterns were respectively formed at adjacent positions, and as shown in FIG. 4B, an RGB three-color phosphor layer 3 was formed in an area where the matrix pattern light shielding layer 2b did not exist. Finally, the substrate 2 is baked to burn off the photoresist, and the phosphor layers 3 of the striped RGB three-color pattern are regularly arranged in the vertical and horizontal directions (Y direction and X direction) as shown in FIGS. A phosphor screen is obtained. On this phosphor screen, square pixels with a pitch of 600 μm were arranged in a matrix, and the width of the vertical division line 31V of the phosphor layer 3 was set to a range of 20 to 30 μm.

  Next, a positive photoresist solution was applied onto the metal back layer 5 by spin coating and baked to form a photoresist film 7 having a predetermined thickness. As shown in FIG. 4C, the photoresist film 7 was exposed using a mask 8 having an opening at a position corresponding to the matrix pattern light-shielding layer 2b within the plane field of view. When this was developed, the exposed portion was dissolved in the developer, and a matrix-like resist pattern 7a shown in FIG. 4D was obtained.

  After the developer is washed away with water and dried, an Al paste 15 is formed in the recess of the resist pattern 7a using a screen mask 10 having openings corresponding to the pattern of the phosphor layer 3, as shown in FIG. Screen printed to drop. The Al paste 15 is sufficiently mixed and stirred in a mixing stirrer (not shown) and then supplied to the substrate 2 through the screen mask 10.

  The whole substrate 2 was baked under baking conditions of a predetermined temperature and time, and the resist pattern 7a was burned away, whereby a matrix-like metal back layer pattern 15 was obtained. The space between the metal back layer patterns 15 becomes a dividing portion 31 shown in FIG. These dividing portions 31 are filled with a resistance adjustment layer (not shown), and the upper surface of the resistance adjustment layer is flush with the upper surface of the metal back layer pattern 15. Subsequent steps were performed under substantially the same conditions as in the first embodiment to obtain a desired FED.

  As a result of examining the degree of electrical disconnection between the patterns (suppression of surface discharge between the metal back layers) in the FED obtained in the second embodiment in this manner, good results were obtained.

(Third embodiment)
Next, a method for manufacturing an FED as an image display apparatus according to the third embodiment will be described with reference to FIG. In addition, description of the part which this embodiment overlaps with said embodiment is abbreviate | omitted.

  In this embodiment, the metal back layer is formed using the Al transfer film 24. The transfer film 24 has a structure in which an Al film and an adhesive layer are sequentially laminated on a base film via a release agent layer (a protective film as necessary), as shown in FIG. In this way, the feeding reel 40 sequentially feeds toward the take-up reel 41. The transfer film 24 is disposed so as to be in contact with the substrate 2 to be processed, pressed, and subjected to thermal transfer processing. Examples of the pressing method include a stamp method and a roller method. After the thermal transfer process, the substrate is unloaded from the transfer processing chamber, the film 24 is wound on the reel 41 by a predetermined length, and the next substrate is loaded and arranged, and the thermal transfer process is performed. In this way, the Al film is transferred to a large number of substrates one after another.

  The substrate 2 to be processed carried into the transfer processing chamber is obtained by forming the light shielding layer pattern 2b, the phosphor layer 3, and the first base protective film 4 in the same manner as in the first embodiment. The substrate 2 to be processed was pressed against the Al transfer film 24, and an Al film 25 as a metal back layer was thermally transferred onto the first undercoat protective film 4 as shown in FIG. As shown in FIG. 5C, a second base protective layer 26 was further formed on the metal back layer 5.

  Next, a positive photoresist solution was applied onto the second base protective layer 26 by spin coating, and baked to form a photoresist film 27 having a predetermined thickness. As shown in FIG. 5D, the photoresist film 27 was exposed using a mask 28 having an opening at a position corresponding to the matrix pattern light-shielding layer 2b within the plane field of view. When this was developed, the exposed portion was dissolved in the developer, and a matrix-like resist pattern 27a shown in FIG. 5E was obtained.

  After the developer is washed away with water and dried, the second base protective layer 26 and the metal back layer 25 are selectively etched using the plasma discharge etching method with the resist pattern 27a as a mask, as shown in FIG. did.

  The whole substrate 2 was baked under conditions of a predetermined temperature and a predetermined time, and the organic components of the resist pattern 27a and the second undercoat protective layer pattern 26a were burned away, thereby obtaining a matrix-like metal back layer pattern 25a. The space between the metal back layer patterns 25a becomes a dividing portion 31 shown in FIG. These dividing portions 31 are filled with a resistance adjustment layer (not shown), and the upper surface of the resistance adjustment layer is flush with the upper surface of the metal back layer pattern 25a.

  Next, the phosphor screen formed as described above is placed in the vacuum envelope 14 together with the electron-emitting device. For this, a method of forming a vacuum container by vacuum-sealing the front substrate 2 having a phosphor screen and the rear substrate 1 having a plurality of electron-emitting devices 18 with frit glass or the like is employed. Further, a predetermined getter material is deposited from above the pattern in the vacuum envelope 14, and a getter material deposition film is formed in the region of the metal back layer 5. Thus, a desired FED as an image display device was obtained.

  As a result of examining the degree of electrical disconnection between the patterns (suppression of surface discharge between the metal back layers) in the FED obtained in the third embodiment in this manner, good results were obtained.

Next, the structure of the FED phosphor screen common to the above embodiment will be described with reference to FIGS. The FED has a front substrate 2 and a rear substrate 1 each made of a rectangular glass plate, and both substrates 1 and 2 are arranged to face each other with an interval of 1 to 2 mm. The front substrate 2 and the rear substrate 1 are joined to each other through a rectangular frame-shaped side wall 13 and the flat rectangular vacuum envelope whose inside is maintained at a high vacuum of about 10 ⁻⁴ Pa or less. 14 is constituted.

  A phosphor layer 3 constituting a phosphor screen is formed on the inner surface of the front substrate 2. This phosphor screen is composed of a phosphor layer 3 that emits light of three colors of red (R), green (G), and blue (B), and a matrix-shaped light shielding layer 22b. On the phosphor screen, a metal back layer 5 is formed which functions as an anode electrode and functions as a light reflecting film for reflecting the light of the phosphor layer 3. During the display operation, a predetermined anode voltage is applied to the metal back layer 5 by a circuit (not shown).

  On the inner surface of the back substrate 1, a large number of electron-emitting devices 18 that emit an electron beam for exciting the phosphor layer 3 are provided. These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. The electron-emitting devices 18 are driven by wires (not shown) arranged in a matrix. In addition, a large number of plate-like or columnar spacers 19 are provided between the back substrate 1 and the front substrate 2 as reinforcement in order to withstand the atmospheric pressure acting on the substrates 1 and 2. .

  An anode voltage is applied to the phosphor screen via the metal back layer 7, and the electron beam emitted from the electron emitter 18 is accelerated by the anode voltage and collides with the phosphor screen. Thereby, the corresponding phosphor layer 3 emits light and an image is displayed.

(A)-(i) is process drawing which shows the manufacturing method of the image display apparatus which concerns on the 1st Embodiment of this invention. The top view which shows a fluorescent screen and a metal back layer of a front substrate by cutting out a part of an image display device (FED). The top view which expands and shows the fluorescent screen of an image display apparatus (FED). (A)-(f) is process drawing which shows the manufacturing method of the image display apparatus which concerns on the 2nd Embodiment of this invention. (A)-(g) is process drawing which shows the manufacturing method of the image display apparatus which concerns on the 3rd Embodiment of this invention. The perspective view which shows the outline | summary of an image display apparatus (FED). Sectional drawing cut | disconnected along the AA line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Back substrate, 2 ... Front substrate, 2a, 2b light shielding layer pattern, 3 ... Phosphor layer,
4 ... 1st foundation protective layer (water glass layer, adhesive layer),
6, 26 ... second base protective layer (water glass layer, adhesive layer),
5 ... Metal back layer (Al film), 5a ... Metal back pattern,
7, 27 ... resist film, 7a ... resist pattern, 10 ... mask,
13 ... sidewall, 15 ... paste (metal back pattern after firing),
18 ... an electron-emitting device, 19 ... a spacer,
24 ... Al transfer film, 25 ... Al film transferred by heat,
25a ... Metal back pattern,
31. Dividing part,
31V ... Vertical section line (metal back dividing line, resistance adjustment layer)
31H: Horizontal dividing line (stripe, chemical cut, resistance adjustment layer)

Claims (7)

A light shielding layer and a phosphor layer are respectively formed on a rectangular front substrate arranged opposite to a rear substrate on which a large number of electron-emitting devices are arranged, and a matrix is formed in the vertical and horizontal directions on the phosphor layer. A method of manufacturing an image display device, comprising forming a metal back layer divided into two. The metal back layer is formed on the phosphor layer by chemical vapor deposition or physical vapor deposition, a photoresist is applied on the metal back layer, and the photoresist film is exposed and developed to form a predetermined layer. 2. The method according to claim 1, wherein the metal back layer is selectively etched using the photoresist film patterned in a matrix as a mask, and the photoresist film is removed from the front substrate. The manufacturing method of the image display apparatus of description. A photoresist is coated on the phosphor layer, the photoresist film is exposed and developed to be patterned into a predetermined matrix, and conductive particles are included in the recesses of the photoresist film patterned in the matrix. 2. The method for manufacturing an image display device according to claim 1, wherein the metal back layer is patterned in a matrix form by passing the paste through a screen mask having a predetermined pattern and performing printing. The metal back layer is transferred from the transfer material onto the phosphor layer, a photoresist is applied onto the transferred metal back layer, and the photoresist film is exposed and developed to be patterned into a predetermined matrix. 2. The image display device according to claim 1, wherein the metal back layer is selectively etched using the photoresist film patterned in a matrix form as a mask, and the photoresist film is removed from the front substrate. Manufacturing method. 5. The image display device according to claim 4, wherein the transfer material is either a flexible film having a thermal transfer layer containing conductive particles or a rigid substrate having a thermal transfer layer containing conductive particles. Manufacturing method. 5. The metal back layer is formed on the first base protective layer after forming the first base protective layer on the phosphor layer. 6. The manufacturing method of the image display apparatus of description. 5. The photoresist film is formed on the second undercoat protective layer after the second undercoat protective layer is formed on the metal back layer. The manufacturing method of the image display apparatus of description.

Images