JP2006046868A - Radiator and heat pipe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat pipe and a radiator as high performance, thin, light and low cost heat transfer and radiation means. <P>SOLUTION: A light and thin tube 2 of connected hollow structure made of a flat plastic resin molding with a plurality of refrigerant passages provides heat exchange over outer surfaces. The tube is sealed at both ends and provided with a working fluid sealed therein. The radiator 1 comprises a plurality of independent heat pipes for heat exchange with a fluid outside the pipes. The heat pipe comprises means for pressurizing and moving the working fluid as means for transferring heat from a heat generation source to thereby transfer heat from one heat pipe end to the opposite end. The heat pipe and radiator for efficient heat transfer are formed out of plastic resin in a high performance, thin, light, low cost and flexible design that can cool an electronic part, efficiently radiate a large amount of heat generated locally in a fuel cell, magnetic refrigeration, electric vehicle or the like, and provide thermal switch and heat radiation control. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is a heat pipe that can be preferably used for cooling a small heating element such as a semiconductor, and is a compact, thin, flexible, lightweight, and inexpensive product that can control heat dissipation and heat transfer. provide.

  As a heat pipe used as a cooling device for a small heating element such as a semiconductor, one end of the heat pipe is inserted into a heat receiving block, and a heat radiating fin such as aluminum is usually provided at the other end to transmit air on the air side with a low heat transfer coefficient. For the purpose of supplementing the thermal performance, cooling by a blower fan or the like by increasing the area of the heat transfer surface is known.

The heat pipe has a sealed cavity, and heat is transported by the phase transformation and movement of the working fluid contained in the cavity, and a part of the heat is directly transferred to the container constituting the heat pipe. Most of the heat is transported by phase transformation and movement by the working fluid.

On the heat absorption side of the heat pipe, the working fluid evaporates due to heat transferred through heat conduction in the material of the container constituting the heat pipe, and the vapor moves to the heat radiation side of the heat pipe. On the heat dissipation side, the working fluid vapor is cooled and returned to the liquid phase again. And the working fluid which returned to the liquid phase moves to the heat absorption side again. Heat is transported by such phase transformation and movement of the working fluid.

In recent years, electronic devices have built-in high-output and highly-integrated components such as CPUs, and various electronic components such as semiconductor elements have a very high degree of integration and perform processing such as calculation and control of information at high speed. Generates a large amount of heat. In order to move and cool the heat of a semiconductor element or the like, which is a high output and highly integrated component, to a predetermined position, a metal heat pipe such as copper or aluminum is generally used.

  As disclosed in Patent Document 1, a heat pipe type heat sink is disclosed.

  However, as shown in FIG. 12, in the conventional heat pipe 121, the heat radiation fin 122 shown in FIG. 12 is attached to one end of the heat pipe in order to increase the area of the heat transfer surface in order to supplement the heat transfer performance. The air taken into the housing from the outside air intake with a structure that requires a certain area and is cooled by the blower fan cools the radiating fin because the air heated by the heat of the heating element in the housing cools the radiating fin. The cooling efficiency is poor, and in order to ensure the operating principle of the heat pipe, it is necessary to arrange the heat source such as a heating element so that it is located at the horizontal position or below the heat pipe. It is difficult to reduce the weight.

  According to FIG. 13, a heat exchanger is used at the end of the heat pipe, and the refrigerant from the heat pipe is arranged so that a plurality of thin tubes 131a, 131b, 131c,. In order to exchange heat with the fluid outside the tube by forming a planar portion and making the gap between adjacent narrow tubes about twice the diameter, it is composed of a metal such as copper or aluminum and has header portions at both ends. When the header pipes 112a and 112b are used and both ends of the narrow pipe group are connected to the header pipes 132a and 132b, a compact tubular heat exchanger having a high heat transfer coefficient is configured to flow the fluid. The flow rate per one hour becomes small, and the effect that the pressure loss becomes small is obtained.

  As disclosed in Patent Document 2, a thin tube heat exchanger and a heat pipe using the same are disclosed.

  However, even if a plurality of thin tubes are arranged in a direction crossing the longitudinal direction to form a planar portion, it becomes difficult to cope with the limitation of the installation location due to the increase in cooling area and the cooling capacity due to natural cooling, As a result, it is inefficient if the arrangement is only one stage, and there is a concern about the influence of deterioration and corrosion when the thickness is 0.1 to 0.3 mm as a thin tube of a metal pipe made of aluminum or copper.

Further, according to Patent Document 3, according to the forced vibration type heat pipe shown in FIG. 14 and the design method thereof, a closed loop flow path meandering between the heat absorbing part (HOT) and the heat radiating part (COLD) is formed. When a fluid is enclosed in the flow path and a vibrator (141) is provided at the heat radiating end, when the pressure is applied from the direction 112a, the fluid meanders to 142b and the pressure direction of the vibrator (141) is set to 142b. When it is activated by the operation, the fluid is pushed back in the opposite direction at a frequency of about 1 / s, so that the fluid enclosed in the flow path becomes an antiphase in the adjacent flow path as an oscillating flow, and the heat absorption part (HOT) Heat transfer to the heat radiating part (COLD) side, heat transfer approximately 40 times that of copper is possible, and the heat pipe structure is made thin and highly efficient.

However, metal such as copper and aluminum is used as a member, and it is difficult to dissipate all the heat generated by the CPU in the main body case when applied to a notebook computer etc. to the outside of the main body. Considering the effects on parts, etc., it is necessary to install it in the case on the LCD housing side as a relatively small heat dissipation means. In this case, the opening and closing operation of the case that is frequently performed is made flexible with metal. It is difficult to handle heat pipes.
Japanese Patent Laid-Open No. 8-306836 JP 2003-279274 A JP 2002-364991 A

A conventional heat pipe is made of a metal with excellent thermal conductivity, such as copper and aluminum, and is composed of a pipe closed at both ends. A hydraulic fluid such as water is sealed inside, and one end is used for heat dissipation. However, there is a problem in that the heat exchange capacity per unit volume is small and the fin volume is large.

  The present invention is a low-cost, flexible and compact by developing a heat pipe of the prior art and mounting it on an electronic device etc. so that the heat received from a semiconductor can be efficiently transported by the heat pipe and the transferred heat is efficiently dissipated. An object of the present invention is to provide heat dissipation means while performing heat transfer using a lightweight flat plastic tube.

A plurality of thin tube channels are formed in the flat plastic tube, the thickness of the cross section through which the refrigerant flows is 0.5 mm or less, the outer surface of the flat plastic tube acts as a heat transfer surface for heat exchange, and a plurality of flat shapes The pitch interval for placing the plastic tube is set to 2 to 4 times the thickness of the flat plastic tube, both ends of the flat plastic tube are closed, and the wall surface in the tube part is coated with a hydrophilic substance, and the pressure is reduced and condensed. It has working fluid and acts as a plurality of independent heat pipes. A radiator having one end of the flat plastic tube terminal thermally connected to a metal flat plate having a heat receiving surface and a heat radiating surface at right angles

  The flat plastic tube is formed with a plurality of thin tube channels, the thickness of the cross section through which the refrigerant flows is 0.5 mm or less, the outer surface of the flat plastic tube acts as a heat transfer surface for heat exchange, and the flat plastic tube The tube terminal is formed as a heat absorbing part that receives heat generated from the outside, and the opposite terminal is formed as a heat radiating part.The narrow tube flow path is provided with a closed loop, the working fluid is enclosed, and pressure is applied to the working fluid by the pressurizing mechanism. By making it occur, heat fluid movement, heat movement time control, thermal fluid movement ON / OFF control can be performed by fluid circulation between the heat absorption part and heat radiation part of the flat plastic tube terminal. Heat pipe to be used.

  The flat plastic tube is formed with a plurality of thin tube channels, the thickness of the cross section through which the refrigerant flows is 0.5 mm or less, the outer surface of the flat plastic tube acts as a heat transfer surface for heat exchange, and the flat plastic tube The tube terminal has a closed loop flow path that meanders between a heat absorption part that receives heat from the outside and a heat radiation part of the opposite terminal, and a working fluid is enclosed and a pressure that is in reverse phase to the working fluid is pressurized. A heat pipe characterized by being applied by

  The heat radiator or the heat pipe, wherein the heat radiator or the heat pipe is configured by using a flat plastic tube.

  According to the radiator of the first aspect, the thickness of the cross section of the flat tube through which the refrigerant is circulated is 0.5 mm or less, and the heat transfer tube is made of a plastic member, so that the weight is reduced, the cost is low, and the productivity is excellent.

  According to the radiator of the first aspect, since the heat receiving means and the heat radiating means are provided on the outer surface of the plastic tube planar portion, and fins are not required, the size and thickness can be reduced.

  According to the radiator of the first aspect, the heat exchange can be performed with high efficiency by configuring the heat receiving and heat radiation cycle with the plastic tube through which a plurality of independent fluids are circulated.

  According to the heat pipe of claim 2, by using a plastic member, when the wall thickness is about 0.1 mm, there is no difference in thermal conductivity compared to copper or aluminum, and the weight is reduced. Is also possible.

  According to the heat pipe of the second aspect, it is possible to forcibly move the fluid in one direction to increase the speed of the heat transfer, thereby enabling a larger amount of heat transfer.

  According to the heat pipe of the second aspect, the amount of fluid movement can be controlled, or ON / OFF control can be performed.

  According to the heat pipe of the third aspect, the heat transfer can be moved to an arbitrary position by making the heat pipe flexible.

  According to the fourth aspect, the combination of the heat pipe and the heat radiator enables high-speed movement and heat radiation.

  Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings.

  Embodiment 1 FIG. 1 is a perspective view showing the multi-heat pipe of the first embodiment, FIG. 2 is a cross-sectional view of a flat plastic tube (hereinafter simply referred to as a tube) shown in FIG. 1, and FIG. FIG. 4 shows a cross-sectional view of the heatsink seen from the side, FIG. 5 is a characteristic diagram showing the heat radiation amount and power, and FIG. 6 is a cross-sectional view showing the structure inside the tube. Show.

  As shown in FIG. 1, the radiator 1 of the present embodiment has a plurality of tubes 2 and one end portion of each tube 2 having a heat receiving surface and a heat radiating surface at a predetermined pitch interval as a heat radiating surface of the heat receiving plate 3. One end crosses at right angles and is thermally connected and fixed, and joined by a heat conductive adhesive shown in FIG. 4, and the opposite end faces are open.

  The tube 2 used in the present invention is not only a general-purpose plastic such as polycarbonate resin, POM, ABS, nylon, PP, PE, ABS, PMMA, PET, but also a polyetherimide resin, a polybutylene terephthalate resin, a polyamide resin. At least selected from the group consisting of polyphenylene sulfide resins, polyphenylene ether resins, polyether ether ketone resins, polyphenylene ether resins-styrene resins-polyamide resins, fluororesins, and polycarbonate resins A resin composition obtained by melting with one kind of resin is extruded.

  Each tube 2 of the radiator 1 has the narrow channel 5 shown in FIG. 6 independently closed at both ends, the inner surface of the tube 2 is depressurized, and an appropriate amount of working fluid is sealed. , Water, transformer oil, heat transport medium such as perfluorocarbon, alcohol, silicone oil, and alternative chlorofluorocarbon refrigerant can be preferably used, but ethanol is used in the present invention, but is limited to these. Various gas and liquid refrigerants, such as a refrigerant containing water, may be used.

  In FIG. 6, the tube 2 has a long shape in which a plurality of thin tube cross sections are hollow, and the cross section of the tube 2 having a width of about 0.5 mm improves the heat transfer performance of the working fluid 8, 5 wall surface 10 is formed by sputtering using inorganic oxide silicon dioxide or the like as a hydrophilic treatment.

  In FIG. 4, one end of the tube 2 is inserted into a concave groove 4 provided on the heat radiation surface of the heat receiving flat plate 3 and fixed with an adhesive 7 having high heat conductivity, and the heat receiving flat plate 3 and the tube 2 are thermally connected. As the structure connected to the tube 2, the tubes 2 are arranged at a constant pitch interval, and heat is transferred from the heat receiving plate 3 to the tube 2, and the lower surface of the heat receiving plate 3 is made of a semiconductor (not shown) or the like. It is an endothermic part.

  Further, FIG. 2 shows a hollow circular hole 1C, a hollow elliptical hole 1d, or a hollow rectangular hole 1a having a diameter of 0.5 × 0.5 mm or smaller, Alternatively, it is formed of a hollow hole 1b having a concavo-convex portion on the outer peripheral surface or a star-shaped hole 1e, and the hollow holes are planar by 2a, 2b, 2c, ..., 2n (n is an integer of 2 or more). A planar portion formed in a shape is formed.

  In the radiator 1 of the present embodiment, the material of the heat transfer surface 9 for exchanging heat with the fluid 8 shown in FIG. 6 is configured on the outer surface of the tube 2 as plastic.

  As shown in FIG. 3 with only the outer surface of the tube 2 as the heat transfer surface 9, the pitch interval (hereinafter simply referred to as the pitch P) for arranging the plastic tubes 2 is set to be 2 to 4 times the thickness T of the tube 2. Yes.

  When the pitch P at which the tubes 2 are arranged is 2 to 4 times the thickness T of the tubes 2, the air-side heat transfer coefficient can be further improved, and extremely high heat exchange efficiency can be exhibited.

  FIG. 5 is a characteristic diagram showing a change in the ratio (heat dissipation amount / power) of the heat dissipation amount and power (fan power) to the value (PT) obtained by dividing the tube interval (pitch P) by the thickness T of the tube 2. The vertical axis is the ratio between the heat radiation amount and the power.

  As can be seen from this characteristic diagram, if the PT is set between 2 and 4, the heat exchange efficiency can be greatly increased.

  Although the thickness of the thin tube in the first embodiment is not particularly limited, it is preferably as thin as possible in the sense of reducing the pressure loss. For example, a material having a thickness of about 0.1 to 0.2 mm can be preferably used, and there is no difference in heat conduction performance from conventional metals such as copper and aluminum. It becomes possible.

    Further, in the radiator 1 of the present embodiment, if the thickness of the tube 2 is 0.5 mm or less, the number of the tubes 2 is increased as compared with the case where the thickness is more than 0.5 mm, and the tube 2 is formed. The total cross-sectional area of the flow path 5 can be sufficiently secured, and the flow resistance of the refrigerant can be greatly reduced.

  The tube 2 provided on the heat radiating surface of the heat receiving flat plate 3 shown in FIG. 1 is shown in FIG. 6, and the narrow channel 5 operates independently as a single heat pipe, and is more constant than the heat radiating surface of the heat receiving flat plate 3. When the temperature reaches the temperature, the fluid 8 in each heat pipe reaches the upper terminal 11b by phase transformation and movement, and the fluid 8 is transferred to the tube 2 by an electric fan (not shown) provided outside. Cooled from the hot surface.

  The fluid 8 in the heat pipe, which has been cooled to a certain temperature or less, is in a liquid phase state, and reaches the heat radiating surface 11 a of the heat receiving flat plate 3 through the hydrophilically treated wall surface 10.

  The heat pipe 1 is moved in heat by the phase transformation and movement of the fluid 8.

  Therefore, according to the radiator 1 of the present embodiment shown in FIG. 1, since it is made of a plastic resin material, further improvement in performance, size reduction, and weight reduction can be realized.

  When a plurality of independent tubes are arranged in parallel at a constant pitch on the surface of about 5 cm × 5 cm as described above, heat is effectively radiated by acting as a plurality of independent heat pipes.

  Embodiment 2. FIG. 7a is a cross-sectional view from above of the heat pipe 7 according to Embodiment 2 of the present invention, 7b is a cross-sectional view from the side, FIG. 8 is a perspective cross-sectional view, and the entire heat pipe 7 is made of plastic resin. The wall 14 of the heat transfer surface for exchanging heat with the fluid shown in FIG. 8 is constituted by the outer surface of the tube, and the tube 12 used from FIG. 7a is polycarbonate resin, POM, ABS, nylon, PP, PE, ABS, PMMA, General purpose plastics such as PET, as well as polyetherimide resins, polybutylene terephthalate resins, polyamide resins, polyphenylene sulfide resins, polyphenylene ether resins, polyether ether ketone resins, polyphenylene ether resins-styrene resins Resin-polyamide resin mixed resin, fluorine resin, and polycarbonate resin It is extruded resin composition obtained by melting at least one resin selected from the group consisting of fat.

  The tube 12 shown in FIG. 8 includes a plurality of straight flow paths 15, and the number of straight flow paths is equally distributed from the center point 13 to the heat absorption side flow paths 16a and the heat dissipation side flow paths 16b to form a closed loop. As a structure to be made, the cross-sectional shape of the channel is a hollow round hole 1C having an inner diameter of 0.5φ or less, a hollow elliptical hole 1d, or a hollow square hole 1a having a diameter of 0.5 × 0.5 mm or less, as shown in FIG. A hollow oblong hole, or a hollow hole 1b having a concavo-convex portion on the outer peripheral surface or a star-shaped hole 1e, and the hollow holes are 2a, 2b, 2c,..., 2n (n is 2 or more) It was set as the planar part formed in planar shape by the integer.

  In addition, the heat pipe 7 of the second embodiment has a thin wall thickness of 0.1 to 0.2 mm, and there is no difference in heat conduction performance from conventional metals such as copper and aluminum, which is made of plastic resin. It becomes possible to configure, and the heat transfer function is configured by the wall surface 14 partitioning the thin tube shown in FIG.

  A refrigerant 21 is sealed in the flow path 15 of the heat pipe 7, and as the refrigerant 21, a heat transport medium such as water, transformer oil, perfluorocarbon, alcohol, silicon oil, and an alternative chlorofluorocarbon refrigerant is used. Although ethanol can be preferably used in the present invention, the present invention uses ethanol. However, the present invention is not limited thereto, and various gases and liquid refrigerants such as a refrigerant containing water may be used.

  The pressurizing mechanism 22 shown in FIGS. 9 and 8 is connected to the liquid inlet portions 20b ′ and 16a and the liquid outlet portions 20a ′ and 16b, and generates a pump by a piston method or a diaphragm method (not shown). The refrigerant 21 shown in FIG. 8 is pressurized by pressure and circulated 19 (17a to 17b) in the closed loop with a pump, whereby the high-temperature refrigerant 21 shown in FIG. 7b is moved from the tube terminal 18a to the opposite terminal 18b. Thus, heat is transferred to the flat plate 25b made of metal having excellent thermal conductivity such as aluminum or copper.

  Further, the heat transferred to the flat plate 25b shown in FIG. 7b is thermally connected to a heat radiating means (not shown) provided outside, so that the transferred heat is subjected to a heat radiating process, and the refrigerant 21 absorbs heat. A closed loop moving to the side 18a is constructed.

  In addition, in the heat pipe 140 shown in FIG. 14, when the refrigerant (arrow direction) meanders to form a closed loop, the circulation (in the arrow direction) of the refrigerant (arrow direction) is performed at a constant interval by a pressurizing mechanism (not shown). A pressure is applied to repeatedly vibrate in the fluid directions 142a and 142b to dissipate heat by transferring heat from the hot HOT side to the COLD side. In this case, the heat transferred to the fluid (arrow direction) moves to the HOT side using the wall surface of the straight flow path of the tube and the fluid (arrow direction) as a heat transfer body.

  The fluid liquid outlet 20a ′ and the liquid inlet 20b ′ of the pressurizing mechanism 22 for generating pressure in the refrigerant 21 are connected to the tubes 20a and 20b of the tube 12 shown in FIG. It is possible to make the working fluid by applying pressure to the fluid by operating the pressure pump 22 such as the system when the power is turned on.

  For a pump that applies pressure, a piezoelectric system or a diaphragm is advantageous when space is required, such as a notebook personal computer, and a pressurizing means such as a piston system is selected when high speed movement is required.

  As described above, the heat transfer by the heat pipe 7 can be controlled by changing the discharge pressure of the pressure pump or the pump operation time.

  Also, the pressure pump can be controlled as a heat switch by turning it on and off with an external control signal.

  Embodiment 3 FIG. 10 is a perspective view schematically showing the present invention. When applied to the notebook computer 23 shown in the heat pipe 7, the heat generated by the CPU 24 (central processing unit) (details omitted) is applied to the heat pipe. The flat plate (not shown in the figure) provided on the heat-absorbing part 7 and having excellent heat conductivity is fixed with silicon grease or the like.

  As the heat transfer direction, an HDD (not shown) and a semiconductor are housed on the personal computer main body side, and the heat is moved to the case cover side where an LCD (not shown) is housed to avoid thermal influence.

  The fluid in the heat pipe 7 is moved by applying a frequency and a voltage of 0.5 / s to 1 / s at around DC 1.5V to 5V as a pressure pump power source (details omitted).

  Since the space on the case cover side as a heat radiating means is limited on the heat radiating side (not shown) of the heat pipe 7, the thickness of the conventionally applied aluminum fin 27 and the like is reduced to radiate heat.

  At this time, exhaust heat is released from the arrow 29 through the arrow 29 by natural heat dissipation or forced heat dissipation means such as a small electric fan (not shown).

  In the case of a notebook computer, the main body and the case cover can be folded by a tilt structure. However, according to the heat pipe 7 of the present invention, the heat pipe 7 of the flexible structure 28 can be formed by selecting a plastic member. It is.

Embodiment 4 FIG. FIG. 11 is a perspective view schematically showing an example in which the radiator 1 according to the first embodiment of the present invention and the heat pipe 7 according to the second embodiment are integrated and used for cooling the heating element.

  In FIG. 11, for example, a CPU 24 (central processing unit) (not shown in detail), which is a heating element, is accommodated in a housing 30 in an electronic device such as a personal computer.

  The CPU 24 (central processing unit) (detailed illustration is omitted) and the heat pipe 7 are mounted in pressure contact with a flat plate 25a provided by thermal coupling. The CPU 24 (central processing unit) (detailed illustration) is provided to increase heat conduction. (Not shown) and a contact portion between the flat plate 25a and silicon grease or the like is applied and brought into close contact with the flat plate 25a to improve heat conduction and to be fixed.

  The tube of the heat pipe 7 is made of plastic and has a flexible structure, and can be arranged in a bent shape inside the housing 30. The tube has a thin thickness of 0.5 mm and has a small installation area. It can be placed in the body 30.

  An appropriate amount of ethanol, ammonia, water, or the like is enclosed in the heat pipe 7 shown in FIG. 11 as the refrigerant 21 shown in FIG. 8 (not shown). The heat generated by the CPU 24 shown in FIG. 21 is pressurized by a pump 22 (details omitted), and the refrigerant 21 is a closed loop that moves to the heat radiation side terminal of the opposite heat pipe.

  At this time, the high-temperature refrigerant 21 that has moved to the heat radiation side terminal is thermally conducted to the radiator 1 from a flat plate (not shown) made of a material such as copper or aluminum having high heat conductivity provided in the heat radiation side terminal. The plurality of tubes 2 exchange heat with the outside air by an electric fan 32 or the like from a plurality of parallel tube directions, and the exhaust heat is discharged from a vent hole provided in the housing 30 indicated by an arrow 33 to perform heat exchange. .

  At this time, the heat pipe 7 has a flexible structure and can be installed at an arbitrary position in the housing 30.

    In the fourth embodiment configured as described above, heat transfer and heat exchange with a relatively large capacity are possible, and the selection of the plastic material and the design such as the moving amount and moving speed of the working fluid in the heat pipe 7 are possible. It is also possible to configure a large-capacity heat dissipation circuit.

  As described above, since the heat exchange amount per unit volume can be increased by the operation of the radiator 1 shown in the first embodiment, it is possible to increase the heat dissipating capacity of the heat pipe and to increase the capacity of the CPU 24. There is.

It is a perspective view which shows the heat radiator of 1st embodiment. It is the sectional view on the AA line of the tube shown in FIG. It is an expanded sectional view of the tube shown in FIG. It is sectional drawing from the side surface shown in FIG. Characteristic diagram showing the change in the ratio (heat dissipation / power) of the heat dissipation amount and power (fan power) to the value (PT) obtained by dividing the tube interval (pitch P) by the tube thickness T (PT) It is a perspective view which shows the heat exchanger of a form. It is a schematic diagram of the tube shown in FIG. It is sectional drawing from the front and side surface of the heat pipe of 2nd Embodiment. It is a schematic diagram of the heat pipe of 2nd implementation. It is an example of the pressure pump of 2nd implementation. It is a perspective view of a heat radiator and a heat pipe application in the housing | casing of 2nd Embodiment. It is a perspective view of a heat radiator and a heat pipe application in the housing | casing of 3rd Embodiment. 2 is a configuration diagram of a heat pipe of Reference Document 1. FIG. 6 is a perspective view of a thin tube group heat exchanger of Reference 2. FIG. 10 is a cross-sectional view of a heat pipe of Reference 3. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat radiator 1a, 1b, 1c, 1d, 1e Tube hole cross section 2 Tube 2a, 2b, 2c, ..., 2n The upper surface of a hollow hole 3 Heat-receiving plate 4 Groove part 5 Narrow tube flow path 6 7b Heat pipe cross section
8 Working fluid 9 Tube heat transfer surface 10 Thin tube wall surface 11a, 11b Terminal 12 Heat pipe tube 13 Center point of the number of channels 14 Channel wall surface 15 Linear channel 16a, 16b Heat absorption, heat dissipation channel,
17a, 17b Fluid direction
18a, 18b
19 Refrigerant circulation direction 20a, 20a Heat pipe entry / exit flow path 21 Refrigerant 22 Pressurization mechanism 23 Notebook PC 24 CPU
25a, 25b Flat plate 26 Ventilation hole 27 Aluminum fin 28 Flexible structure of heat pipe 29 Heat exhaust direction from case cover 30 PC case 31 Heat conduction flat plate 32 Electric fan 33 Exhaust heat outflow direction

Claims (4)

  A plurality of thin tube channels are formed in the flat plastic tube, the thickness of the cross section through which the refrigerant flows is 0.5 mm or less, the outer surface of the flat plastic tube acts as a heat transfer surface for heat exchange, and a plurality of flat shapes The pitch interval for placing the plastic tube is set to 2 to 4 times the thickness of the flat plastic tube, both ends of the flat plastic tube are closed, and the wall surface in the tube part is coated with a hydrophilic substance, and the pressure is reduced and condensed. It has a working fluid and acts as a plurality of independent heat pipes. A radiator having one end of the flat plastic tube terminal thermally connected to a metal flat plate having a heat receiving surface and a heat radiating surface at right angles   The flat plastic tube is formed with a plurality of thin tube channels, the thickness of the cross section through which the refrigerant flows is 0.5 mm or less, the outer surface of the flat plastic tube acts as a heat transfer surface for heat exchange, and the flat plastic tube The tube terminal is formed as a heat absorbing part that receives heat generated from the outside, and the opposite terminal is formed as a heat radiating part.The narrow tube flow path is provided with a closed loop, the working fluid is enclosed, and pressure is applied to the working fluid by the pressurizing mechanism. By making it occur, heat fluid movement, heat movement time control, thermal fluid movement ON / OFF control can be performed by fluid circulation between the heat absorption part and heat radiation part of the flat plastic tube terminal. Heat pipe to be used.   The flat plastic tube is formed with a plurality of thin tube channels, the thickness of the cross section through which the refrigerant flows is 0.5 mm or less, the outer surface of the flat plastic tube acts as a heat transfer surface for heat exchange, and the flat plastic tube The tube terminal has a closed loop flow path that meanders between a heat absorption part that receives heat from the outside and a heat radiation part of the opposite terminal, and a working fluid is enclosed and a pressure that is in reverse phase to the working fluid is pressurized. A heat pipe characterized by being applied by   The heat radiator or the heat pipe, wherein the heat radiator or the heat pipe is configured by using a flat plastic tube.

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