JP2006030966A - Image drawing method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To decrease uneven resolution and density caused by errors in relative positions of drawing heads and installation angles thereof and by influences of pattern distortion or the like in an image drawing apparatus and an image drawing method for forming a desired two-dimensional pattern on a drawing surface by using a plurality of drawing heads. <P>SOLUTION: A rectangular two-dimensional pixel array is installed in each of exposure heads 30 in an exposure apparatus (image drawing apparatus) so as to make a predetermined angle with the direction of scanning, facing an exposure surface of a photosensitive material 12. Combinations of slits and photo detectors detect positions of light spots in the exposure surface comprising inter-head relay areas. Pixels in the pixel arrays are selected by the measured positions of light spots so as to realize almost ideal N-overlay exposure by suppressing overexposure and underexposure to minimal in the inter-head relay areas. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a drawing apparatus and a drawing method, and more particularly to a drawing apparatus and a drawing method for forming a two-dimensional pattern represented by image data on a drawing surface using a plurality of drawing heads.

  2. Description of the Related Art Conventionally, various drawing apparatuses that include a drawing head and that form a desired two-dimensional pattern represented by image data on a drawing surface by the drawing head are known. A typical example is an exposure apparatus that forms a desired two-dimensional pattern on an exposure surface of a photosensitive material or the like by an exposure head for producing a semiconductor substrate or a printing plate. In general, an exposure head of such an exposure apparatus includes a pixel array such as a light source array or a spatial light modulator that generates a light spot group having a large number of pixels and forming a desired two-dimensional pattern. By operating the exposure head while moving it relative to the exposure surface, a desired two-dimensional pattern can be formed on the exposure surface.

  In the field of such an exposure apparatus, a sufficiently large size may be obtained depending on the configuration of the pixel array, such as when a digital micromirror device (DMD) of a generally available size is used as a spatial light modulation element. It is difficult to cover the exposure area with a single exposure head. For this reason, several exposure apparatuses that use a plurality of exposure heads in parallel have been proposed. In addition, in order to improve the resolution in the direction orthogonal to the scanning direction, an exposure head including a pixel array in which pixels are arranged two-dimensionally is inclined with respect to the scanning direction. Several types of exposure apparatuses have been proposed.

  For example, Patent Document 1 discloses that a plurality of exposure heads each having a DMD in which micromirrors are arranged in a rectangular lattice shape are inclined with respect to the scanning direction, and triangular portions on both sides of the inclined DMD are provided. An exposure apparatus is described in which each exposure head is mounted in such a manner that the DMDs adjacent to each other in a direction orthogonal to the scanning direction complement each other.

Also, in Patent Document 2, a plurality of exposure heads having a rectangular grid DMD are not tilted with respect to the scanning direction or tilted by a minute angle, and exposure is performed by a DMD adjacent in a direction orthogonal to the scanning direction. Each exposure head is mounted with a setting such that the regions overlap each other by a predetermined width, and the number of micromirrors to be driven is gradually decreased or increased at a certain rate at a portion corresponding to the overlapping portion between the exposure regions of each DMD, An exposure apparatus is described in which the exposure area of each DMD has a parallelogram shape.
Japanese Patent Laid-Open No. 2004-9595 JP 2003-195512 A

  However, when exposure is performed using a plurality of exposure heads each having a pixel array in which pixels are arranged two-dimensionally and the pixel column direction of each pixel array is inclined with respect to the scanning direction, the relative position between the exposure heads In general, fine adjustment of the relative mounting angle is generally difficult and often slightly deviates from the ideal relative position and relative mounting angle. In addition, pattern distortion may occur in a pattern actually formed on the exposure surface due to various aberrations of the optical system between the pixel array and the exposure surface, distortion of the pixel array itself, and the like. Therefore, if it is assumed that an ideal state free from such shifts and distortions can be realized, even if an exposure apparatus that is set so that the exposure areas of each pixel array are smoothly connected to each other is used, the shift or distortion actually occurs. Since it is very difficult to completely eliminate the distortion, unevenness in resolution and density occurs in the connection area between the heads of the two-dimensional pattern formed on the exposure surface.

  One possible solution to this problem is to improve the relative position between exposure heads, the relative mounting angle adjustment accuracy, the optical system adjustment accuracy, and the like. The cost will be very high.

  The same problem may occur not only in the exposure apparatus but also in other types of drawing apparatuses such as an ink jet printer having an ink jet recording head that performs drawing by discharging ink droplets toward a drawing surface.

  In view of the above circumstances, the present invention provides a drawing apparatus and a drawing method for forming a desired two-dimensional pattern on a drawing surface using a plurality of drawing heads. An object of the present invention is to reduce the unevenness of resolution and density in the joint area between heads on the actual drawing surface due to the influence of distortion and the like, and to improve the graphic accuracy.

  That is, the drawing apparatus according to the present invention is a drawing apparatus that draws a drawing surface by N-fold drawing (N is a natural number of 1 or more) and forms a two-dimensional pattern represented by image data on the drawing surface. A plurality of drawing heads having a plurality of usable pixels arranged in a shape and having a pixel array that generates a drawing point group that forms a two-dimensional pattern according to the image data, and can be used as described above The drawing head attached to the drawing surface so that the pixel column direction of the pixels and the scanning direction of the drawing head form a predetermined tilt angle, and each drawing head with respect to the drawing surface, the scanning direction described above A moving means for relative movement to each of the drawing heads, and for each of the drawing heads, out of the above-mentioned many usable pixels, the head is selected from the connection area usable pixels corresponding to the drawing points in the connection area between the heads on the drawing surface. Intermittent The use pixel designating means for designating the connection area use pixel that realizes the N-fold drawing in the connection area, and, for each drawing head, only the connection area use pixel among the connection area useable pixels is actually operated. Thus, there is provided a setting changing means for changing the setting.

  Here, in the present invention, the “pixel column” refers to an arrangement in a direction in which the angle formed with the scanning direction is smaller among the two arrangement directions of the pixels arranged two-dimensionally on the pixel array. “Pixel row” refers to an array in a direction having a larger angle with the scanning direction. Note that the arrangement of the pixels on each pixel array is not necessarily a rectangular grid, and may be, for example, a parallelogram arrangement.

  In the present invention, “N-fold drawing” means a pixel array of N used pixels in which straight lines parallel to the scanning direction are projected on the drawing surface at almost all points in the target area on the drawing surface. A drawing process with a setting that intersects with. Here, “substantially all points” in the predetermined area are described as the scan between the pixel columns of each used pixel in a very small part below the resolution, due to errors such as the mounting angle and pixel arrangement. The pixel pitch along the direction orthogonal to the direction may not exactly match the pixel pitch of other portions, and the number of pixel columns of the used pixels that intersect with a straight line parallel to the scanning direction may increase or decrease within a range of ± 1. Because. In the following description, N-fold drawing in which N is a natural number of 2 or more is collectively referred to as “multiple drawing”. Further, in the following description, “N double exposure” and “multiple drawing” are used as terms corresponding to “N double drawing” and “multiple drawing” for an embodiment in which the drawing apparatus or drawing method of the present invention is implemented as an exposure apparatus or exposure method. The term “multiple exposure” shall be used.

  Further, in the present invention, the “head-to-head connection region” is a position coordinate in a direction perpendicular to the scanning direction in a drawing area that the pixel array of each drawing head actually covers on the drawing surface. It shall refer to the part that overlaps the drawing area that is actually covered on the drawing surface.

  In addition, the “used pixel designation unit” in the present invention may accept manual designation of a used pixel, and includes a position detection unit, a selection unit, etc., which will be described later, and automatically selects the optimum used pixel. You may do.

  Furthermore, in the above description, “change the setting so that only the connection area use pixel is actually operated” means, for example, a mode in which pixels other than the connection area use pixel among the connection area useable pixels are set to OFF and do not operate. The portion of the image data that is sent to the connection area usable pixels other than the connection area use pixels may be in the off state (that is, data indicating that drawing is not performed), or other than the connection area use pixels. The pixels that can be used in the connection area are also operated, but a configuration may be employed in which light rays from these pixels and drawing media such as ink jets are shielded so as not to reach the drawing surface.

  Moreover, in the drawing apparatus according to the present invention, the use pixel specifying unit further includes, for each drawing head, a pixel other than the connection area useable pixel among the many useable pixels. The intermediate area use pixel that realizes the N-fold drawing in an area other than the head-to-head connection area on the drawing surface is designated, and the setting change means further includes the above-mentioned for each drawing head. The setting may be changed so that only the above-described intermediate area use pixel operates among the pixels other than the connection area useable pixels among the many useable pixels.

In the drawing apparatus according to the present invention, the set inclination angle θ in each drawing head is the number s of pixels forming each pixel column of usable pixels of the drawing head, and the pixel column direction of these usable pixels. Pixel pitch p and the pixel column pitch δ of usable pixels along the direction orthogonal to the scanning direction described above,

It is preferable that the angle satisfies the above relationship.

  Furthermore, in the drawing apparatus according to the present invention, the number N of N-fold drawing is preferably a natural number of 2 or more.

  In the drawing apparatus according to the present invention, the pixel array of each drawing head generates a light point group as the drawing point group, and the use pixel designation unit includes each drawing head. In the above light spot group, the position detection means for detecting the position on the drawing surface of the light spot constituting the head-to-head connection region on the drawing surface, and the detection by the position detecting means for each drawing head Based on the results, in the head-to-head connection region on the drawing surface, the total of the portion where the drawing is redundant for the ideal N-fold drawing and the portion where the drawing is insufficient for the ideal N-fold drawing is the minimum As described above, a selection unit that selects the above-described connection area use pixel may be provided.

  Alternatively, the pixel array of each drawing head generates a light point group as the drawing point group, and the use pixel specifying unit draws the drawing point out of the light point group for each drawing head. Position detecting means for detecting the position on the drawing surface of the light spot constituting the connecting area between the heads on the surface, and for each drawing head, the distance between the heads on the drawing surface based on the detection result by the position detecting means. In the connection region, the number of drawing points in a portion where drawing is redundant with respect to ideal N-fold drawing is equal to the number of drawing points in a portion where drawing is insufficient with respect to ideal N-fold drawing. There may be provided a selection means for selecting the connection region use pixel.

  Alternatively, the pixel array of each drawing head generates a light point group as the drawing point group, and the use pixel specifying unit draws the drawing point out of the light point group for each drawing head. Position detecting means for detecting the position on the drawing surface of the light spot constituting the connecting area between the heads on the surface, and for each drawing head, the distance between the heads on the drawing surface based on the detection result by the position detecting means. In the connection area, the above-mentioned connection area is set so that the portion where the drawing becomes redundant with respect to the ideal N-fold drawing is minimized and the portion where the drawing is insufficient with respect to the ideal N-fold drawing does not occur. You may provide the selection means which selects a use pixel.

  Alternatively, the pixel array of each drawing head generates a light point group as the drawing point group, and the use pixel specifying unit draws the drawing point out of the light point group for each drawing head. Position detecting means for detecting the position on the drawing surface of the light spot constituting the connecting area between the heads on the surface, and for each drawing head, the distance between the heads on the drawing surface based on the detection result by the position detecting means. In the connection area, the above-mentioned connection area is set so that a portion where drawing is insufficient with respect to ideal N-fold drawing is minimized and a portion where drawing is redundant with respect to ideal N-fold drawing does not occur. You may provide the selection means which selects a use pixel.

  In the drawing apparatus according to the present invention, since the use pixel specifying unit specifies the connection area use pixel, the N overlap of the connection area usable pixels for each drawing head. Reference drawing means for performing reference drawing using only pixels constituting every (N−1) pixel rows for the number N of drawing may be further provided.

  Alternatively, in the drawing device according to the present invention, the use pixel designating unit designates the connection region use pixel, and therefore, for each drawing head, the N overlap among the connection region usable pixels. Reference drawing means for performing reference drawing using only pixels constituting a group of adjacent pixel rows corresponding to 1 / N of the total number of usable pixel rows for the number N of drawing. May be further provided.

  Here, when the total number of usable pixel rows is not divisible by N, the above-mentioned “group of adjacent pixel rows corresponding to 1 / N of the total number of usable pixel rows” A group consisting of the number of pixels closest to 1 / N of the total number of pixel rows, the maximum number of 1 / N or less of the total number of pixel rows, or the minimum number of pixel rows of 1 / N or more of the total number of pixel rows Etc. may be selected.

  In the drawing apparatus according to the present invention, the dimension of the predetermined part in the joint area between the heads of the two-dimensional pattern represented by the image data matches the dimension of the corresponding part that can be realized by the designated use pixel in the joint area. As described above, it may further include data conversion means for converting the image data.

  Furthermore, in the drawing apparatus according to the present invention, the pixel array may be a spatial light modulation element that modulates light from a light source for each pixel according to the image data.

  Here, the above-mentioned “light source” may be incorporated in each drawing head (exposure head), or for each drawing head or a plurality of drawing provided outside each drawing head. It may be a light source shared between the heads.

  In the drawing apparatus according to the present invention, the drawing point groups formed on the drawing surface are connected to each other by the connecting area using pixels specified by the using pixel specifying means of the drawing heads adjacent to each other. The image forming apparatus may further include drawing control means for controlling drawing point formation timing by the drawing head.

  In the drawing apparatus according to the present invention, the drawing control means includes the position in the scanning direction with respect to the drawing surface of the connection area use pixel of one drawing head of the drawing heads adjacent to each other and the other drawing head. The drawing point formation timing can be controlled on the basis of the distance between the position in the scanning direction with respect to the drawing surface of the connecting region use pixel and the relative movement speed of the drawing head by the moving means.

  In the drawing apparatus according to the present invention, the drawing point groups formed on the drawing surface by the connection area use pixels specified by the use pixel specifying means of the drawing heads adjacent to each other are connected in the scanning direction. In addition, scanning direction image data correction means for correcting image data input to drawing heads adjacent to each other can be further provided.

  Further, in the above drawing apparatus according to the present invention, the scanning direction image data correction means can perform rotation processing as the correction.

  In the drawing apparatus according to the present invention, a reference pixel is preset for each drawing head, and an image of a drawing point formed by the reference pixel intersects the preset scanning direction. The image forming apparatus may further include a drawing point position correcting unit that corrects image data input to each drawing head so that the drawing should be performed at a predetermined position in the direction.

  In the drawing apparatus according to the present invention, the drawing points that are formed on the drawing surface by the drawing heads adjacent to each other are input to the drawing heads adjacent to each other so as to be connected in the direction intersecting the scanning direction. Further, it is possible to further include cross direction image data correction means for correcting the image data to be processed.

  A drawing method according to the present invention includes a pixel array having a number of usable pixels arranged two-dimensionally and generating a drawing point group constituting a two-dimensional pattern represented by the image data according to the image data. Drawing using a plurality of drawing heads, each of which is attached to the drawing surface such that the pixel row direction of the usable pixels and the scanning direction of the drawing head form a predetermined tilt angle. In each of the drawing heads, a connection area usable pixel corresponding to a drawing point in the connection area between the heads on the drawing surface among the plurality of usable pixels is selected in the connection area between the heads. A step of designating a connection area use pixel that realizes N-fold drawing (N is a natural number of 1 or more) and, for each drawing head, among the connection area usable pixels, the connection area described above. A step of changing the setting of the drawing head so that only the used pixels are actually moved, and the drawing head is operated while moving each drawing head relative to the drawing surface in the scanning direction, and the two-dimensional pattern described above The method includes the step of forming the pattern on the drawing surface.

  Here, “operating each drawing head while moving each drawing head relative to the drawing surface relative to the scanning direction” is a form in which drawing is performed continuously while always moving the drawing head. Alternatively, the drawing head may be configured to perform the drawing operation while moving the drawing head stepwise while stopping the drawing head at each movement destination position.

  In the above drawing method of the present invention, the drawing heads are connected so that the drawing point groups formed on the drawing surface by the designated connection area use pixels of the drawing heads adjacent to each other are connected in the scanning direction. It may further include a step of controlling the drawing point formation timing.

  In the drawing method of the present invention described above, the position in the scanning direction with respect to the drawing surface of the connection area use pixel of one drawing head of the drawing heads adjacent to each other and the connection area use pixel of the other drawing head. The drawing point formation timing can be controlled based on the distance between the drawing surface and the position in the scanning direction and the relative movement speed of the drawing head.

  In the drawing method of the present invention described above, the drawing point groups formed on the drawing surface by the connection area use pixels specified by the use pixel specifying means of the drawing heads adjacent to each other are connected in the scanning direction. The method may further include a step of correcting the image data input to the drawing heads adjacent to each other.

  In the drawing method of the present invention, a rotation process can be performed as the correction.

  In the drawing method according to the present invention, a reference pixel is set in advance for each drawing head, and an image of a drawing point formed by the reference pixel intersects with the preset scanning direction. The image data input to each drawing head can be corrected so as to be drawn at a predetermined position.

  In the above drawing method of the present invention, the drawing point groups formed on the drawing surface by the drawing heads adjacent to each other are input to the drawing heads adjacent to each other so as to be connected in the direction intersecting the scanning direction. It is possible to further include a step of correcting the image data.

  According to the drawing apparatus and the drawing method of the present invention, the number of pixels having the number and distribution that can minimize the influence of the relative position between the drawing heads and the relative mounting angle, etc. are used to connect the connecting regions. Since it can be designated as a pixel, it is possible to perform N-fold drawing with reduced resolution and density unevenness occurring in the head-to-head connection region on the actual drawing surface.

  Further, the use pixel designating unit further designates an intermediate region use pixel that realizes N-fold drawing in an area other than the head-to-head connection region, and the setting change unit further includes a pixel other than the head-to-head connection region usable pixel. According to the aspect in which the setting is changed so that only the pixels using the intermediate area actually operate among the usable pixels, the influence of the mounting angle error of each drawing head and the pattern distortion also in the area other than the inter-head connecting area. Since pixels with a number and distribution that can be minimized can be designated as intermediate region use pixels, uniform N-fold drawing with reduced resolution and uneven density over the entire drawing surface is performed. Can do.

  Further, according to the aspect in which the number N of N-fold drawing is a natural number of 2 or more and multiple drawing is performed, the influence and occurrence of residual relative position error, mounting angle error, pattern distortion, etc. of each drawing head are avoided. Unevenness below the unresolved resolution can be leveled by the effect of filling by multiple drawing, so that the resolution and density unevenness of the two-dimensional pattern remaining on the drawing surface can be further reduced.

  Further, among the usable pixels in the connection area, a group of adjacent (N−1) pixel columns or a group of adjacent pixel rows corresponding to 1 / N of the total number of usable pixel rows. According to the aspect in which the reference drawing can be performed by using only the constituent pixels, a simple single drawing pattern can be obtained by the reference drawing. It becomes easy to specify the area use pixel, and it becomes easier to specify the optimum connection area use pixel.

  Furthermore, according to the aspect in which the image data is converted in accordance with the size of the predetermined portion that can be realized by the designated connection region use pixel, the image data has the size of the predetermined portion that can be realized by the specified connection region use pixel. The dimensions of the two-dimensional pattern shown can be matched to form a high-definition pattern on the drawing surface according to the desired two-dimensional pattern.

  Hereinafter, an exposure apparatus, which is one embodiment of a drawing apparatus of the present invention, will be described in detail with reference to the drawings.

  As shown in FIG. 1, the exposure apparatus 10 according to the present embodiment includes a flat plate-like moving stage 14 that holds a sheet-like photosensitive material 12 by adsorbing to the surface. Two guides 20 extending along the stage moving direction are installed on the upper surface of the thick plate-shaped installation table 18 supported by the four legs 16. The stage 14 is arranged so that the longitudinal direction thereof faces the stage moving direction, and is supported by the guide 20 so as to be reciprocally movable. The exposure apparatus 10 is provided with a stage driving device (not shown) that drives a stage 14 as a moving means along a guide 20.

  A U-shaped gate 22 is provided at the center of the installation base 18 so as to straddle the movement path of the stage 14. Each end of the U-shaped gate 22 is fixed to both side surfaces of the installation base 18. A scanner 24 is provided on one side of the gate 22 and a plurality of (for example, two) sensors 26 for detecting the front and rear ends of the photosensitive material 12 are provided on the other side. The scanner 24 and the sensor 26 are respectively attached to the gate 22 and fixedly arranged above the moving path of the stage 14. The scanner 24 and the sensor 26 are connected to a controller (not shown) that controls them. Here, for explanation, an X axis and a Y axis that are orthogonal to each other are defined in a plane parallel to the surface of the stage 14 as shown in FIG.

  A slit formed in a “<” shape that opens in the direction of the X-axis at the upstream edge (hereinafter sometimes simply referred to as “upstream”) along the scanning direction of the stage 14. Nine 28 are formed at equal intervals. Each slit 28 includes a slit 28 a located on the upstream side and a slit 28 b located on the downstream side. The slit 28a and the slit 28b are orthogonal to each other, and the slit 28a has an angle of −45 degrees and the slit 28b has an angle of +45 degrees with respect to the X axis. Single cell type photodetectors (not shown) are incorporated at positions below the respective slits 28 in the stage 14. Each photodetector is connected to an arithmetic unit (not shown) that performs a use pixel selection process described later.

As shown in FIGS. 2 and 3B, the scanner 24 includes ten exposure heads 30 arranged in a matrix of 2 rows and 5 columns. In the following, when individual exposure heads arranged in the m-th row and the n-th column are shown, they are expressed as an exposure head 30 _mn .

Each exposure head 30 is attached to the scanner 24 so that the pixel column direction of an internal digital micromirror device (DMD) 36 to be described later forms a predetermined inclination angle θ with the scanning direction. Therefore, the exposure area 32 by each exposure head 30 is a rectangular area inclined with respect to the scanning direction. As the stage 14 moves, a strip-shaped exposed region 34 is formed on the exposure surface of the photosensitive material 12 for each exposure head 30. In the following, when an exposure area by individual exposure heads arranged in the m-th row and the n-th column is indicated, it is expressed as an exposure area 32 _mn .

Further, as shown in FIGS. 3A and 3B, each exposure head 30 is arranged such that each of the strip-shaped exposed regions 34 partially overlaps the adjacent exposed region 34. . Thus, exposed portion that can not be between, for example the first line of the exposure area 32 ₁₁ and the exposure area 32 _12, can be exposed by the second row of the exposure area 32 _21.

  Note that the positions of the nine slits 28 are substantially matched with the center positions of the overlapping portions between the adjacent exposed regions 34. In addition, the size of each slit 28 is set to sufficiently cover the width of the overlapping portion between the exposed regions 34.

  As shown in FIGS. 4 and 5, each of the exposure heads 30 includes a DMD 36 manufactured by Texas Instruments, Inc. as a spatial light modulation element that modulates incident light for each pixel unit according to image data. ing. The DMD 36 is connected to a controller that includes a data processing unit and a mirror drive control unit. The data processing unit of the controller generates a control signal for driving and controlling each micromirror in the use area on the DMD 36 for each exposure head 30 based on the input image data. The mirror drive control unit controls the angle of the reflection surface of each micromirror of the DMD 36 for each exposure head 30 based on the control signal generated by the image data processing unit.

  As shown in FIG. 4, on the light incident side of the DMD 36, there is provided a laser emission portion in which the emission end portion (light emission point) of the optical fiber is arranged in a line along the direction that coincides with the long side direction of the exposure area 32. The fiber array light source 38, the lens system 40 for correcting the laser light emitted from the fiber array light source 38 and condensing it on the DMD, and the mirror 42 for reflecting the laser light transmitted through the lens system 40 toward the DMD 36 Arranged in order. In FIG. 4, the lens system 40 is schematically shown.

  As shown in detail in FIG. 5, the lens system 40 has a pair of combination lenses 44 that collimate the laser light emitted from the fiber array light source 38, and the light quantity distribution of the collimated laser light becomes uniform. In this way, a pair of combination lenses 46 for correction and a condensing lens 48 for condensing the laser light whose light quantity distribution is corrected on the DMD 36 are configured.

  Further, on the light reflection side of the DMD 36, a lens system 50 that images the laser beam reflected by the DMD 36 on the exposure surface of the photosensitive material 12 is disposed. The lens system 50 includes two lenses 52 and 54 arranged so that the DMD 36 and the exposure surface of the photosensitive material 12 have a conjugate relationship.

  In the present embodiment, the laser light emitted from the fiber array light source 38 is substantially magnified five times, and then the light from each micromirror on the DMD 36 is reduced to about 5 μm by the lens system 50. Is set to

  As shown in FIG. 6, the DMD 36 is a mirror device in which a large number of micromirrors 58 that constitute pixels (pixels) are arranged in a lattice pattern on an SRAM cell (memory cell) 56. In this embodiment, a DMD 36 in which 1024 columns × 768 rows of micromirrors 58 are arranged is used. Among these, the micromirrors 58 that can be driven by a controller connected to the DMD 36, that is, usable micromirrors 58 are 1024 columns × 256 rows. Suppose only. The data processing speed of the DMD 36 is limited, and the modulation speed per line is determined in proportion to the number of micromirrors to be used. Thus, by using only some of the micromirrors in this way, Modulation speed increases. Each micromirror 58 is supported by a support column, and a material having high reflectivity such as aluminum is deposited on the surface thereof. In the present embodiment, the reflectance of each micromirror 58 is 90% or more, and the arrangement pitch thereof is 13.7 μm in both the vertical direction and the horizontal direction. The SRAM cell 56 is a silicon gate CMOS manufactured on a normal semiconductor memory manufacturing line via a support including a hinge and a yoke, and is configured monolithically (integrated) as a whole.

  When an image signal representing the density of each point constituting a desired two-dimensional pattern in binary is written in the SRAM cell 56 of the DMD 36, each micromirror 58 supported by the column is arranged with the DMD 36 centered on the diagonal line. It is inclined to any one of ± α degrees (for example, ± 10 degrees) with respect to the substrate side. 7A shows a state where the micromirror 58 is tilted to + α degrees when the micromirror 58 is in the on state, and FIG. 7B shows a state where the micromirror 58 is tilted to −α degrees when the micromirror 58 is in the off state. . Therefore, by controlling the inclination of the micromirror 58 in each pixel of the DMD 36 as shown in FIG. 6 according to the image signal, the laser light B incident on the DMD 36 is reflected in the inclination direction of each micromirror 58. The

  FIG. 6 shows an example in which a part of the DMD 36 is enlarged and each micromirror 58 is controlled to + α degrees or −α degrees. On / off control of each micromirror 58 is performed by a controller connected to the DMD 36. Further, a light absorber (not shown) is arranged in the direction in which the laser beam B reflected by the off-state micromirror 58 travels.

  As shown in FIG. 8, the fiber array light source 38 includes a plurality of (for example, 14) laser modules 60, and one end of a multimode optical fiber 62 is coupled to each laser module 60. A multimode optical fiber 64 having a smaller cladding diameter than the multimode optical fiber 62 is coupled to the other end of the multimode optical fiber 62. As shown in detail in FIG. 9, seven ends of the multimode optical fiber 64 opposite to the multimode optical fiber 62 are arranged along the direction orthogonal to the scanning direction, and these are arranged in two rows to emit laser light. A portion 66 is configured.

  As shown in FIG. 9, the laser emitting portion 66 constituted by the end portion of the multimode optical fiber 64 is sandwiched and fixed between two support plates 68 having a flat surface. Further, a transparent protective plate such as glass is preferably disposed on the light emitting end face of the multimode optical fiber 64 for protection. The light exit end face of the multi-mode optical fiber 64 has high light density and is likely to collect dust and easily deteriorate. However, the protective plate as described above prevents the dust from adhering to the end face and deteriorates. Can be delayed.

  Hereinafter, an example of the use pixel designation process in the exposure apparatus 10 of the present embodiment will be described with reference to FIGS.

In the present embodiment, double exposure processing is performed by the exposure apparatus 10, and the setting tilt angle of each exposure head 30, that is, each DMD 36, is an ideal state in which there is no attachment angle error of the exposure head 30. It is assumed that an angle θ _ideal is used that results in exactly double exposure using a usable 1024 column × 256 row micromirror 58. This angle θ _ideal is the number N of N exposures, the number s of micromirrors 58 forming each pixel column of the usable micromirrors 58, the pixel pitch p in the pixel column direction of the usable micromirrors 58, and the scanning direction. For the pixel column pitch δ of the usable micromirror 58 along the direction orthogonal to

Given by. As described above, the DMD 36 in the present embodiment includes a large number of micromirrors 58 having equal vertical and horizontal arrangement pitches arranged in a rectangular lattice shape.

And the above equation (1) is

It becomes. In this embodiment, since s = 256 and N = 2 as described above, the angle θ _ideal is about 0.45 degrees from the equation (3). It is assumed that the exposure apparatus 10 is initially adjusted so that the mounting angle of each exposure head 30, that is, each DMD 36 becomes this angle θ _ideal .

FIG. 10 shows the influence of deviation of the relative positions of the two exposure heads (for example, exposure heads 30 ₁₂ and 30 ₂₁ ) in the X-axis direction from the ideal state in the exposure apparatus 10 initially adjusted as described above. It is explanatory drawing which showed the example of the nonuniformity which arises in the pattern on an exposure surface by. The relative position shift in the X-axis direction can occur because it is difficult to finely adjust the relative position between the exposure heads.

In the following drawings and description, the mth light spot row in each exposure area 32 on the exposure surface is r (m), the nth light spot row on the exposure surface is c (n), and mth. The light spot in the row nth column is denoted as P (m, n). The upper part of FIG. 10 is a group of light spots from the micromirror 58 that can be used in the DMD 36 of the exposure heads 30 ₁₂ and 30 ₂₁ projected onto the exposure surface of the photosensitive material 12 with the stage 14 being stationary. It is the figure which showed the pattern. The lower part of FIG. 10 shows the state of the exposure pattern formed on the exposure surface when continuous exposure is performed by moving the stage 14 in a state where the pattern of light spots as shown in the upper part appears. Is shown for the connection area between the heads of the exposure areas 32 ₁₂ and 32 ₂₁ and its peripheral part. In FIG. 10, for convenience of explanation, an exposure pattern by the pixel column group A composed of every other pixel column of the usable micromirror 58 and an exposure pattern by the pixel column group B composed of the remaining pixel columns are shown. Although shown separately, the exposure pattern on the actual exposure surface is a superposition of these two exposure patterns.

In the example of FIG. 10, as a result of the deviation of the relative position between the exposure heads 30 ₁₂ and 30 ₂₁ in the X-axis direction from the ideal state, the exposure pattern by the pixel column group A and the pixel column group B in both the exposure pattern, the head connected region between the exposure area 32 ₁₂ and 32 _21, exposure is redundant parts are gone occur than in the state of an ideal double exposure.

In order to reduce the unevenness appearing in the connecting area between the heads on the exposure surface as described above, in the present embodiment, the light from the exposure heads 30 ₁₂ and 30 ₂₁ is used by using the above-described combination of the slit 28 and the photodetector. Among the point group, the positions on the drawing surface are detected for some of the light spots constituting the head-to-head connection region on the drawing surface. Based on the position detection result, the connected computing device to the photodetector, of the micro mirrors corresponding to light spots constituting the head connected region between the exposure heads 30 ₁₂ and 30 _21, actually the exposure process A connection area use pixel selection process for selecting a micromirror to be used is performed.

First, with reference to FIGS. 11 and 12, a method for detecting the position of a light spot using a set of a slit 28 and a photodetector will be described. FIG. 11 is a top view showing the positional relationship between exposure areas 32 ₁₂ and 32 ₂₁ similar to FIG. 10 and the corresponding slits 28. As described above, the size of the slit 28 is set to a size that sufficiently covers the width of the overlapping portion between the exposed regions 34 by the exposure heads 30 ₁₂ and 30 ₂₁ , that is, a size that sufficiently covers the head connecting region.

Figure 12 is a top view for explaining a detection method of detecting the position of a point P of the exposure area _{32 21} as an example (256, 1024). First, in a state where P (256, 1024) is lit, the stage 14 is slowly moved to relatively move the slit 28 along the Y-axis direction, so that the light spot P (256, 1024) is located on the upstream side slit 28a. The slit 28 is positioned at an arbitrary position so as to come between the slits 28b on the downstream side. At this time, the coordinates of the intersection of the slit 28a and the slit 28b are (X0, Y0). The value of this coordinate (X0, Y0) is determined and recorded from the movement distance of the stage 14 to the position indicated by the drive signal given to the stage 14 and the known X-axis direction position of the slit 28. The

  Next, the stage 14 is moved, and the slit 28 is relatively moved to the right in FIG. 12 along the Y axis. Then, as indicated by a two-dot chain line in FIG. 12, the stage 14 is stopped when the light at the light spot P (256, 1024) passes through the left slit 28b and is detected by the photodetector. The coordinates of the intersection of the slit 28a and the slit 28b at this time are recorded as (X0, Y1).

  This time, the stage 14 is moved in the opposite direction, and the slit 28 is moved relative to the left in FIG. 12 along the Y axis. Then, as indicated by a two-dot chain line in FIG. 12, the stage 14 is stopped when the light at the light spot P (256, 1024) passes through the right slit 28a and is detected by the photodetector. The coordinates of the intersection of the slit 28a and the slit 28b at this time are recorded as (X0, Y2).

  From the above measurement results, the coordinates (X, Y) of the light spot P (256, 1024) are determined by the calculation of X = X0 + (Y1-Y2) / 2, Y = (Y1 + Y2) / 2.

In the selection of the connecting region use pixel, in the example of FIG. 10, first, the position of the exposure area 32 ₁₂ of the light spot P (256,1), is detected by the group of the slit 28 and a photodetector. Subsequently, the position of the light spot on the spot row r of the exposure area _{32 21} (256), the light spot P (256, 1024), we detected the P (256,1023) ··· and order, exposure where point indicating a larger X coordinate than the area _{32 12} of the light spot P (256,1) P (256, n) is detected, and terminates the detecting operation. Then, the micro mirrors corresponding to light spots constituting the c (1024) from the light spot column c of the exposure area _{32 21} (n + 1), specifies as a micro-mirror is not used in this exposure. For example, it shows a larger X coordinate than the point P of the point P (256,1020) the exposure area _{32 12} of the exposure area _{32 21} in the example of FIG. 10 (256,1), the light spot of the exposure area _{32 21} P (256,1020) When the detection operation at the detected ends, corresponding to the portion 70 covered with hatched in FIG. 13, c (1024) from the light spot column c of the exposure area _{32 21} (1021) Are identified as micromirrors that are not used in the main exposure.

Next, the number N of the N multiple exposure, the position of the point P of the exposure area _{32 12} (256, N) is detected. In this embodiment, since N = 2, the position of the light spot P (256, 2) is detected. Then, among the light spot columns of the exposure area 32 _21, constitutes the rightmost point column c (1020) except for those identified as light spots string corresponding to the micromirror that is not used for the exposure in the light the position of the point, P (1,1020) in order from the light spot P (1,1020), P (2,1020 ) ··· and continue to detect the exposure area _{32 12} of the light spot P (256, two When the light spot P (m, 1020) indicating an X coordinate larger than) is detected, the detection operation is terminated. Thereafter, the X-coordinate of the point P in the exposure area _{32 12} (256, 2) in the connected operational devices on the light detector, the light spot P in the exposure area _{32 21} (m, 1020) and P (m-1, 1020) is the X coordinate of the comparison, if the direction of the X coordinate of the point P of the exposure area _{32 21} (m, 1020) is closer to the X coordinate of the point P (256, two) of the exposure area _{32 12,} micro mirrors corresponding to P (m-1,1020) from point P of the exposure area _{32 21} (1,1020) is found the X coordinate of the point P of the exposure area _{32 21} (m-1,1020) If close to the X-coordinate of the point P in the exposure area _{32 12} (256, 2), the micro mirrors corresponding the point P of the exposure area _{32 21} (1,1020) to P (m-2,1020) is, Specially used as a micromirror not used in this exposure It is. The position of the point P of the exposure area _{32 12 (256, N-1} ) i.e. P (256,1), also the position of each point constituting the next light spot columns c (1019) of the exposure area _{32 21} Similar detection processing and micromirror selection processing are performed. As a result, for example, the micromirror corresponding to the light spot constituting the portion 72 covered with the hatching in FIG. 13 is additionally specified as a micromirror not used for the main exposure. These micromirrors identified as not being used for the main exposure are always sent a signal to set the micromirror angle to the off-state angle, and these micromirrors are substantially used for the main exposure. Not.

If a micromirror that is not used for the main exposure is selected as described above, in the connection area between the heads of the exposure areas 32 ₁₂ and 32 ₂₁ , a portion where the exposure is redundant with respect to an ideal double exposure and an ideal The total of the portions where exposure is insufficient with respect to double exposure can be minimized, and uniform double exposure very close to the ideal state can be realized as shown in the lower part of FIG.

In the example above, the X-coordinate upon the specific light spot constituting the portion 72 covered with hatched, point P of the exposure area _{32 12} (256, 2) in FIG. 13, the exposure area _{32 21} of the light spot P (m, 1020) and P (m-1,1020) without comparison of the X-coordinate of the immediately, P from point P of the exposure area _{32 21 (1,1020) (m-} 2 , 1020) may be specified as a micromirror that is not used for the main exposure. In that case, in the joint area between the heads, the portion where the exposure is redundant with respect to the ideal double exposure is minimized, and the portion where the exposure is insufficient with respect to the ideal double exposure is not generated. Can be selected as the actual micromirror to be used. Alternatively, the micromirrors corresponding to P from point P of the exposure area _{32 21 (1,1020) (m-} 1,1020), may be specified as micro mirrors not used in this exposure. In that case, in the joint area between the heads, the portion where the exposure is insufficient with respect to the ideal double exposure is minimized, and the portion where the exposure is redundant with respect to the ideal double exposure does not occur. Can be selected as the actual micromirror to be used. Alternatively, in the connection area between the heads on the exposure surface, the number of light spots in the portion where the exposure is redundant with respect to the ideal double drawing and the number of light points in the portion where the exposure is insufficient for the ideal double drawing. The micromirrors actually used may be selected so that.

Next, an example of pixel designation processing in the modification example of the exposure apparatus 10 of the present embodiment described above will be described with reference to FIGS. This example was considered in the example of pixels designated processing described with reference to FIGS. 10 13, in addition to the parallel displacement of the relative position between the exposure heads 32 ₁₂ and 32 _21, the exposure heads 32 ₁₂ and 32 _{In consideration} of the mounting angle error ₂₁ and the relative mounting angle shift between the exposure heads 32 ₁₂ and 32 ₂₁ , the influence of these is minimized to further reduce the unevenness of resolution and density on the exposure surface. It is an example.

In this modification, the exposure apparatus 10 performs double exposure processing as in the above embodiment, but the set inclination angle of each exposure head 30, that is, each DMD 36 satisfies the above equation (1). Ideal angle θ An angle slightly larger than _ideal , for example, an angle θ of about 0.50 degrees is adopted. Although it is difficult to finely adjust the mounting angle of each exposure head 30, the actual mounting angle of each exposure head 30 does not fall below the _ideal angle θ _ideal even if a slight error occurs in the mounting angle. It is to make it. It is assumed that the exposure apparatus 10 is initially adjusted so that the mounting angle of each exposure head 30, that is, each DMD 36 is close to the set inclination angle θ within an adjustable range.

14, in the initial adjusted exposure apparatus 10 as described above, two exposure heads (exposure head _{30 12} as an example a _{30 21)} X-axis direction about the relative displacement, as well as the exposure heads _{30 12} 30 ₂₁ is an explanatory diagram showing an example of unevenness that occurs in a pattern on an exposure surface due to the influence of an attachment angle error ₂₁ and a relative angle shift. FIG.

In the example of FIG. 14, the exposure pattern by the pixel column group A and the exposure pattern by the pixel column group B are the same as the result of the relative positional shift between the exposure heads 30 ₁₂ and 30 _{21 in} the X-axis direction, as in the example of FIG. In both cases, in the connection area between the heads of the exposure areas 32 ₁₂ and 32 ₂₁ , a portion 74 in which exposure is more redundant than in the ideal double exposure state occurs, and this causes density unevenness. In addition, in the example of FIG. 14, the set inclination angle θ of each exposure head is slightly larger than the angle θ _ideal satisfying the above equation (1), and fine adjustment of the mounting angle of each exposure head is difficult. For this reason, as a result of the actual mounting angle slightly deviating from the set inclination angle θ, the exposure pattern and the pixels by the pixel array group A are also obtained in the region other than the head-to-head connection region on the exposure surface. In both of the exposure patterns of the column group B, a portion 76 in which exposure is more redundant than in an ideal double exposure state occurs in a portion corresponding to an end portion of each pixel column, that is, a connecting portion between pixel columns. Further concentration unevenness is caused.

In this modification, first, the use pixel selection process for reducing the uneven density due to the influence of the mounting angle error and relative mounting angle of deviation of each exposure heads 30 ₁₂ of the 30 _21. Specifically, the actual inclination angle θ ′ of the pixel row projected on the exposure surface is specified for each of the exposure heads 30 ₁₂ and 30 ₂₁ using the above-described combination of the slit 28 and the photodetector, and the light In the arithmetic device connected to the detector, the micromirror to be actually used for the main exposure process is selected based on the actual inclination angle θ ′. Specific actual inclination angle theta ', for example, the position of the point P of the exposure area _{32 12} of FIG. 14 is an exposure head _{30 12} (1,1) and P (256,1), the exposure head _{30 21} the position of the point P of the exposure area _{32 21} (1,1024) and P (256, 1024), respectively detected by a set of slits 28 and the light detector described above, the slope of the straight line connecting those light spots This is done by calculating the angle in the arithmetic unit.

Using the actual inclination angle θ ′ thus identified, the arithmetic device connected to the photodetector is

Is derived for each of the exposure heads 30 ₁₂ and 30 ₂₁ , and the micromirrors on the DMD 36 from the (T + 1) th row to the 256th row are not used for the main exposure. The process specified as For example, T = 254 for the exposure head _{30 12,} when T = 255 was derived for the exposure head _3O21, micro mirrors corresponding to light spots constituting the parts 78 and 80 covered with hatched in FIG. 15 These are specified as micromirrors that are not used for the main exposure. Thereby, in each area other than the joint area between the heads of the exposure areas 32 ₁₂ and 32 ₂₁ , the exposure is redundant with respect to the ideal double exposure and the exposure is insufficient with respect to the ideal double exposure. The sum of the parts can be minimized.

Here, instead of deriving the natural number closest to the above value t, the minimum natural number greater than or equal to the value t may be derived. In that case, in each area other than the connection area between the heads of the exposure areas 32 ₁₂ and 32 ₂₁ , the portion where the exposure is redundant with respect to the ideal double exposure is minimized, and the ideal double exposure is achieved. On the other hand, it is possible to prevent a portion where exposure is insufficient from occurring. Or it is good also as deriving the maximum natural number below value t. In that case, in each area other than the connection area between the heads of the exposure areas 32 ₁₂ and 32 ₂₁ , the portion where the exposure is insufficient with respect to the ideal double exposure is minimized, and the ideal double exposure is achieved. On the other hand, it is possible to prevent a portion where the exposure becomes redundant. In each region other than the head-to-head connection region, the number of light spots of the portion where the exposure is redundant with respect to the ideal double drawing and the number of light points of the portion where the exposure is insufficient with respect to the ideal double drawing are as follows. It is good also as specifying the micromirror which is not used for this exposure so that it may become equal.

  Thereafter, with respect to the micromirror corresponding to the light spots other than the light spots constituting the portions 78 and 80 covered by the oblique lines in FIG. 15, the same process as the above-described use pixel selection process described with reference to FIGS. In FIG. 15, the micromirrors corresponding to the light spots constituting the shaded portion 82 and the shaded portion 84 are additionally specified as micromirrors that are not used for the main exposure. These micromirrors identified as not being used for the main exposure are always sent a signal to set the micromirror angle to the off-state angle, and these micromirrors are substantially used for the main exposure. Not.

  According to the above modification, uniform double exposure can be performed with reduced resolution and uneven density over the entire drawing surface including the head-to-head connection area and the other areas.

  As mentioned above, although one embodiment of the drawing apparatus of this invention and its modification example were demonstrated in detail, the above is only an illustration and various changes are possible without deviating from the scope of the present invention.

  For example, in the above-described embodiment and modification, the slit 28 and the single cell type photodetector are used as the means for detecting the position of the light spot on the exposure surface. For example, a two-dimensional detector or the like may be used.

  In the embodiment and the modification described above, the micro mirror actually used for the main exposure is calculated by the arithmetic unit connected to the light detector based on the position detection result of the light spot by the combination of the slit 28 and the light detector. For example, by performing reference exposure using all available micromirrors, and manually checking the micromirrors used by the operator by visually confirming the resolution and density unevenness of the reference exposure results. The form specified by is also included in the scope of the present invention.

  Furthermore, as another modification of the above-described embodiment, among the usable micromirrors of the DMD 36 of each exposure head 30, (N-1) micromirrors constituting every third pixel column, or the total number of pixel rows The reference exposure is performed by using only the micromirrors that constitute a group of adjacent pixel rows corresponding to 1 / N of the first, and the reference exposure among the micromirrors corresponding to the light spots that form the head-to-head connection region. Among the used ones, micromirrors that are not used for the main exposure may be specified so that a state close to an ideal single exposure can be realized.

FIG. 16 is an explanatory diagram showing an example of a form in which reference exposure is performed using only micromirrors that constitute every (N−1) pixel rows. In this example, the main exposure is assumed to be double exposure, and therefore N = 2. First, using only micromirrors corresponding to the odd-numbered light spot rows of two exposure heads adjacent to each other in the X-axis direction (for example, exposure heads 30 ₁₂ and 30 ₂₁ ) shown by a solid line in FIG. Reference exposure is performed, and a reference exposure result is output as a sample. For the output reference exposure results, the operator can visually check the resolution and density unevenness, and estimate the actual tilt angle to minimize the resolution and density unevenness in the head-to-head connection area. The micromirror used in the main exposure can be designated so that the main exposure can be realized to a limited extent. For example, in the main exposure, micromirrors other than those corresponding to the light spot columns in the portion 86 shown by hatching in FIG. 16 and the portion 88 shown by shading are among the micromirrors constituting the odd-numbered pixel rows. It can be specified as actually used. For even-numbered pixel columns, reference exposure may be performed separately in the same manner, and the micromirror used for the main exposure may be designated, or the same pattern as the pattern for the odd-numbered pixel columns may be applied. Good. By specifying the micromirrors used for the main exposure in this way, the main exposure using both the odd-numbered and even-numbered micromirror rows is close to ideal double exposure in the head-to-head connection region. The state can be realized. The analysis of the reference exposure result is not limited to visual observation by the operator, and may be a mechanical analysis. Incidentally, description in FIG. 16, the relationship between the exposure head _{30 12} and the exposure head _{30 21,} odd column and an odd column of the exposure head _{30 21} of the exposure head _{30 12} have the relationship of continuous as shown in FIG. 16 Therefore, although the odd reference thinning reference exposure is used for both exposure heads, the present invention is not limited to this, and one exposure head uses even reference thinning reference exposure, and the other exposure head uses odd reference thinning reference exposure. You may do it.

FIG. 17 shows a group of adjacent pixel rows corresponding to 1 / N of the total number of pixel rows for two exposure heads adjacent to each other in the X-axis direction (for example, exposure heads 30 ₁₂ and 30 ₂₁ ). It is explanatory drawing which showed an example of the form which performs reference exposure using only a micromirror. In this example, the main exposure is assumed to be double exposure, and therefore N = 2. First, reference exposure is performed using only micromirrors corresponding to the light spots in the first to 128 (= 256/2) rows indicated by the solid line in FIG. 17, and the reference exposure results are output as samples. With respect to the output reference exposure result, the operator can visually check the resolution and density unevenness or estimate the actual tilt angle to minimize the resolution and density unevenness in the head-to-head connection area. The micromirror used in the main exposure can be designated so that the main exposure can be realized to the limit. For example, micromirrors other than those corresponding to the light spot columns in the portion 90 shown shaded in FIG. 17 and the shaded portion 92 are actually used in the main exposure among the micromirrors in the first to 128th rows. Can be specified as used. For the micromirrors in the 129th to 256th lines, reference exposure may be separately performed in the same manner, and the micromirror used for the main exposure may be designated. The same pattern may be applied. By specifying the micromirrors used for the main exposure in this way, in the main exposure using the entire micromirrors, a state close to ideal double exposure can be realized in the connection area between the heads. The analysis of the reference exposure result is not limited to visual inspection by the operator, and may be mechanical analysis.

  In the above embodiments and modified examples, the case where the main exposure is the double exposure has been described. However, the present invention is not limited to this, and any N double exposure or more than the single exposure may be used. However, in order to further reduce the non-uniformity in resolution and density of the two-dimensional pattern remaining on the drawing surface, it is preferable to perform multiple exposure of double exposure or more. In particular, by setting the exposure to about 3 to 7 exposures, it is possible to achieve an exposure with a good balance between ensuring high resolution and reducing resolution and density unevenness.

  Further, in the exposure apparatus according to the embodiment and the modification example, the selection of the use pixel in the head-to-head connection region is performed by selecting one of the two exposure heads involved in the head-to-head connection region as in the example of FIG. Only one exposure head may be configured such that some pixels are not used, or both exposure heads may share unused pixels.

  Here, an example of a method for designating a micromirror to be used based on the reference exposure result in the above-described exposure apparatus will be described.

Specifically, the amount of deviation from the ideal state of the relative position in the X-axis direction of two exposure heads (for example, exposure heads 30 ₁₂ and 30 ₂₁ ) is measured, and used based on the measured amount of deviation. Specifies the micromirror to be used. First, a method for measuring the deviation amount will be described.

When measuring the deviation amount, for example, as described in FIG. 16, the exposure head 30 ₁₂ and the exposure head 30 ₂₁ (N-1) using only micro mirrors constituting the pixel columns of the intervals A straight line extending in the X-axis direction is exposed. In other words, an exposure point exposed by the micro mirrors constituting the respective pixel columns of the exposure heads 30 ₁₂ and the exposure head 30 ₂₁ performs exposure so as to line up in the X-axis direction. Note that an exposure method using only the micromirrors constituting every (N-1) pixel rows as described above is hereinafter referred to as “thinning reference exposure”.

Then, when exposing a straight line extending in the X-axis direction as described above, the exposure head 30 ₂₁ a predetermined number of pixels (hereinafter referred to as "predetermined gap image".) To not to use the micro mirrors corresponding Perform exposure.

FIG. 18 shows a part of a straight line extending in the X-axis direction exposed as described above. In FIG. 18, a straight line in the vicinity of a region that is assumed to be exposed by overlapping or insufficient exposure head 30 ₂₁ and exposure head 30 ₁₂ is shown. A straight line L ₂₁ in FIG. 18 is a straight line exposed by the exposure head 30 ₂₁ , a straight line L ₁₂ is a straight line exposed by the exposure head 30 ₁₂ , and the straight line Le is formed by a micromirror corresponding to a predetermined skimmer image. A straight line to be exposed is shown (because it is not actually exposed, hereinafter referred to as “interval Le”).

Then, performs exposure without using a micromirror corresponding to a predetermined gap image as described above, the exposure head 30 ₁₂ or the exposure head 30 _21, as shown in FIG. 19, to expose the reference scale Ls. The reference scale Ls, as shown in FIG. 19, a straight line extending in the X axis direction to be exposed by the micro mirrors constituting the pixel columns of the exposure head 30 ₁₂ or the exposure head 30 _21, n pieces, n + 1 carbon atoms, Intervals L (n), L (n + 1), L (n + 2), L (n + 3) corresponding to n + 2, n + 3, n-1, n-2 and n-3 exposure points (number of pixels). , L (n-1), L (n-2) and L (n-3) are straight lines arranged in the X-axis direction for each predetermined number of exposure points. Incidentally, the reference scale Ls may be exposed with either the exposure head 30 ₁₂ or the exposure head 30 ₂₁ at both of the exposure head may be exposed. Further, the reference scale Ls may be exposed on a part of the straight line L ₂₁ or the straight line L ₁₂ shown in FIG. 18, or the straight line L ₂₁ and the straight line L ₁₂ may be exposed separately. The reference scale Ls is also exposed by thinning reference exposure.

  The number n of exposure points at the interval L (n) in the reference scale Ls is set to the same number as the number of micromirrors corresponding to a predetermined gap image, and the length of the interval Le is compared with the interval L. As a result, the number of micromirrors corresponding to the amount of deviation can be measured.

For example, if the length of the interval Le is the same as the length of the interval L (n), the deviation amount is zero. And if the length of the space | interval Le is the same length as the space | interval L (n-3), the number of micromirrors corresponding to the said deviation | shift amount is three. Accordingly, the exposure area of the exposure head 30 _12, the exposure area of the exposure head 32 ₂₁ will have been duplicated three minute micromirrors. Therefore, in the above case, the micromirrors corresponding to the light spot P (m, 1019), the light spot P (m + 1, 1019) and the light spot P (m + 2, 1019) in FIG. 16 should not be used. That's fine.

For example, if the length of the interval Le is the same as the length of the interval L (n + 2), the number of micromirrors corresponding to the shift amount is two. That is, the 2 pieces of micromirrors only the exposure head 30 ₁₂ and the exposure head 30 ₂₁ are separated in the pixel column. In such a case, the light spot P (m-1, 1019) and the light spot P (m-2, 1019) may be used.

  Note that the comparison between the length of the interval Le and the length of the interval L may be made visually, or may be measured by a predetermined measuring device.

  As described above, the micromirror to be used can be designated based on the thinning reference exposure result.

Here, in the above description, in the exposure head 30 ₂₁ and the exposure head 30 ₁₂ , by specifying the micromirror to be used, the unevenness of the exposure pattern due to the influence of the relative position shift in the X-axis direction of the two exposure heads. Although how to eliminate, as specified micro mirrors to be used in the exposure heads as described above, for example, the exposure head 30 ₂₁ According to the exposure head 30 _12, if the exposure timing to the exposure surface is not appropriate an exposure pattern to be exposed by the exposure head 30 ₂₁ and the exposure pattern to be exposed by the exposure head 30 ₁₂ deviates in the Y-axis direction.

For example, considering the case where the exposure head 30 ₂₁ and the exposure head 30 ₁₂ perform thinning reference exposure on the straight lines L ₂₁ and L ₁₂ extending in the X-axis direction as described above, the exposure timing of each exposure head must be appropriate. if, as shown in FIG. 20 (a), the straight line _{L 21} and the straight line _{L 12} is displaced in the Y-axis direction.

Therefore, as shown in FIG. 20B, the exposure timing by the exposure head 30 ₂₁ and the exposure head 30 ₁₂ is controlled so that the straight line L ₂₁ and the straight line L ₁₂ are connected without shifting in the Y-axis direction. Is desirable.

Specifically, for example, the position of the micromirrors of the leftmost exposure point of the micro mirror and the straight line L ₁₂ that corresponds to the right end of the exposure point of the straight line L ₂₁ corresponding FIG. 20 (B), the above-mentioned slit 28 and the light detector vessels of set and using a two-dimensional detector and the like is measured, determine the distance in the Y-axis direction of the micromirrors, based on the moving speed of the distance and the stage 14, and a straight line L ₂₁ and the straight line L ₁₂ Y as connected without displacement in the axial direction, the exposure timing of the exposure heads 30 ₂₁ and the exposure head 30 ₁₂ determined, it is sufficient to expose at the exposure timing.

Further, not limited to the method as described above, actually exposed linear L ₂₁ and the straight line L ₁₂ by the exposure head 30 ₂₁ and the exposure head 30 ₁₂ at a preset exposure timing, the exposed linear L ₂₁ and the straight line a shift amount in the Y-axis direction L _12, measured by a predetermined measuring unit, on the basis of the shift amount may be adjusted the preset exposure timing.

Further, in the exposure head 30 ₂₁ and the exposure head 30 ₁₂ , as shown in FIG. 21, reference micromirrors r ₂₁ and r ₁₂ (hereinafter referred to as “reference micromirrors”) are set in advance. The exposure head 30 ₂₁ and the exposure head 30 ₂₁ and the exposure points rp ₂₁ and rp ₁₂ exposed by the reference micromirrors r ₂₁ and r ₁₂ are positioned on the reference line RL in the Y-axis direction on the preset exposure surface. it may be adjusted exposure timing of the exposure head 30 _12.

  Further, when measuring the deviation amount in the Y-axis direction as described above, if the scanning direction of the micromirror beam does not coincide with the Y-axis direction, and there is a deviation, the predetermined micromirror It is also conceivable to draw a straight line in the scanning direction and measure the exposure position by the reference micromirror of each exposure head with reference to this straight line. For example, if the angle between the scanning direction and the X-axis direction is determined, a virtual line having this angle can be set for the scanning direction, and the exposure position can be measured as a deviation from the virtual line. . Note that coarse adjustment may be performed so that the position and angle of the pattern are aligned with the virtual line.

As the above-mentioned reference micromirror, it is assumed that the micro-mirror at the same position of the DMD of the exposure heads are designated, for example, as shown in FIG. 21, the micro mirrors corresponding to the left end of the exposure point of the straight line L ₂₁ it is sufficient to specify the micro mirrors corresponding to the left end of the exposure point of the straight line L _12. Further, the exposure timing is adjusted so that the exposure points rp ₂₁ and rp ₁₂ exposed by the reference micromirrors r ₂₁ and r ₁₂ are positioned on the reference line RL in the Y-axis direction on the preset exposure surface. As a method, for example, the straight line L ₂₁ and the straight line L ₁₂ are exposed by the exposure head 30 ₂₁ and the exposure head 30 ₁₂ at a preset exposure timing, and the positional relationship between the reference line RL, the exposure point rp ₂₁ and the exposure rp ₁₂ is used. Is measured by a predetermined measuring means, and the exposure timing may be adjusted as described above based on the measured positional relationship and the moving speed of the stage 14.

The reference line RL may be set in advance on the exposure surface. For example, the reference line RL is parallel to the X-axis direction (perpendicular to the scanning direction) passing through a light spot by a reference micromirror of a predetermined exposure head. ) A straight line may be set as the reference line RL, and the exposure timing may be adjusted so that the light spot by the reference micromirror of the other exposure head is positioned on the reference line RL. As the above-mentioned predetermined exposure head, for example, it may be to specify the exposure head 30 ₁₁ in FIG. 3 (B).

Here, as described above, the exposure head 30 ₂₁ and the exposure head 30 ₁₂ may be exposed at the exposure timing such that the light spot corresponding to the reference micromirror is positioned on the reference line RL. When the actual tilt angle of the DMD of 30 ₂₁ or the exposure head 30 ₁₂ deviates from the set tilt angle, the straight line L ₂₁ and the straight line L ₁₂ do not become parallel to the X-axis direction as shown in FIG. In other words, it becomes that exposure pattern to be exposed by the exposure pattern and the exposure head 30 ₁₂ is exposed by the exposure head 30 ₂₁ is rotated about a point corresponding to the reference micro-mirrors.

Therefore, the amount of rotational deviation about the light spot corresponding to the reference micromirror as described above is measured for each exposure head, and the above rotation is performed on the exposure image data representing the exposure pattern exposed by each exposure head. By performing a rotation process according to the shift amount, an exposure pattern exposed by the exposure head 30 ₂₁ (for example, a straight line L ₂₁ ) and an exposure pattern exposed by the exposure head 30 ₁₂ (for example, a straight line L ₁₂ ) You may make it connect about a Y-axis direction. Note that the rotational deviation amount is obtained by, for example, exposing a straight line L ₂₁ and a straight line L ₁₂ as shown in FIG. 22 by the exposure head 30 ₂₁ and the exposure head 30 ₁₂ , and X of the exposed straight line L ₂₁ and straight line L ₁₂ . What is necessary is just to measure and acquire the angle with respect to an axial direction by a predetermined | prescribed measurement means. Here, the rotation processing may rotate image data representing an exposure pattern, or may be rotated by controlling the timing of each column (for example, from 1 column to 1024 columns) in the exposure head. The exposed pattern may be exposed.

Further, the angle is not actually measured by the predetermined measuring means as described above, but, for example, the exposure points corresponding to the reference micromirrors r ₂₁ and r ₁₂ of the exposure head 30 ₂₁ and the exposure head 30 ₁₂ as described above. rp _{21, rp 12} is, as to expose the linear _{L 21} and the straight line _{L 12} in the exposure timing as to be positioned on the reference line RL, respectively a straight line parallel to the straight line _{L 21} and the straight line _{L 12,} the Y-axis direction A large number of exposures may be performed at different pitches, and the rotational deviation amount may be acquired based on the exposure pattern. Specifically, for example, as shown in FIG. 23, the exposure head 30 ₂₁ exposes a number of straight lines parallel to the straight line L ₂₁ at a pitch of 45 μm and the exposure head 30 ₁₂ sets a straight line parallel to the straight line L ₁₂ to a pitch of 46 μm. in a large number exposure, the position of the right end of the light spot in the Y-axis direction of the straight line that is exposed by the exposure head 30 ₂₁ has a left end matches, obtains a straight line that is exposed by the exposure head 30 _12, the straight line is the straight line L ₁₂ counting what number of the straight line from, for example, if a straight line from the straight line L ₁₂ 3-th as shown in FIG. 23, as well as the measurement principle of the caliper, the right end of the light spot of the straight line L ₂₁ is the reference What is necessary is just to measure when it has shifted | deviated 3 micrometers from line RL. Then, for example, the shift may be converted into a rotation angle of the straight line L ₂₁ centered on the light spot rp ₂₁ and the rotation process may be performed on the exposure image data based on the rotation angle as described above.

In the above description, the exposure timing is set so that the exposure points rp ₂₁ and rp ₁₂ exposed by the reference micromirrors r ₂₁ and r ₁₂ of the exposure head 30 ₂₁ and the exposure head 30 ₁₂ are positioned on the reference line RL. after obtains the rotation offset amount with respect to the X-axis direction of the straight line L ₁₂ that is exposed by the linear L21 and the exposure head 30 ₁₂ is exposed by the exposure head 30 ₂₁ performs rotation processing on the exposure image data on the basis of the rotation offset amount However, the setting of the exposure timing and the order of the rotation processing may be reversed. Specifically, as shown in FIG. 24, the straight line L ₂₁ and the straight line L ₁₂ are exposed at a preset exposure timing, and the rotational deviation amount of the straight line L ₂₁ and the straight line L ₁₂ with respect to the X-axis direction is measured. Then, after the exposure image data is subjected to a rotation process corresponding to the rotation deviation amount, the straight line L ₂₁ and the straight line L ₁₂ are exposed again by the exposure head 21 and the exposure head 12, as shown in FIG. by measuring the displacement amount in the Y-axis direction and the exposed linear L ₂₁ and the straight line _l2 and the reference line RL, adjusts the exposure timing set the advance in accordance with the shift amount, on the reference line RL may be linear _{L 21} and the straight line _{L 12} is positioned on the reference line RL.

Further, as described above, the rotation processing is not performed, and only the exposure timing is adjusted so that the right end of the straight line L ₂₁ and the left end of the straight line L ₁₂ coincide with each other in the Y-axis direction as shown in FIG. Good. Specifically, the straight line L ₂₁ and the straight line L ₁₂ are exposed at a preset exposure timing, and the position of the rightmost exposure point of the straight line L ₂₁ in the Y-axis direction and the leftmost light spot of the straight line L ₁₂ are detected. the amount of deviation between the position of the Y-axis direction is measured by a predetermined measuring unit, based on the shift amount, the left end of the exposure point position and the straight line L ₁₂ in the Y-axis direction of the right end of the exposure point of the straight line L ₂₁ exposure head 30 ₂₁ as the position of the Y-axis direction coincides with it is sufficient to adjust the exposure timing of the exposure head 30 _12. Further, for the exposure timing of the exposure head 30 _22, the right end of the exposure point position and the straight line L ₁₂ in the Y-axis direction of the left end of the exposure point of the straight line L ₂₂ that is exposed by the exposure head 30 ₂₂ Y-axis for the direction of Adjustment may be made so that the positions coincide with each other. When the exposure patterns by the exposure heads are connected as described above, at least one exposure head is exposed at an exposure timing such that the exposure point by the reference micromirror is located on the reference line RL. It is desirable. In Figure 25, the exposure point by reference micromirrors of the exposure head 30 ₂₁ is to be positioned on the reference line RL.

Further, as described above, without adjusting the exposure timing, only the rotation process is performed, and as shown in FIG. 26, the right end of the straight line L ₂₁ and the left end of the straight line L ₁₂ are made to coincide with each other in the Y-axis direction. Also good. Specifically, the straight line L ₂₁ and the straight line L ₁₂ are exposed at a preset exposure timing, and the position of the rightmost exposure point of the straight line L ₂₁ in the Y-axis direction and the leftmost exposure point of the straight line L ₁₂ are detected. the amount of deviation between the position of the Y-axis direction, and a predetermined measurement means, to measure by using a like plurality of straight lines pattern shown in FIG. 23, based on the shift amount, the right end of the exposure point of the straight line L ₂₁ subjected to rotation processing in the exposure image data representing a straight line L ₁₂ so that the position of the Y-axis direction of the left end of the exposure point position and the straight line L ₁₂ is matched in the Y-axis direction, decorated with exposure of its rotation process linear L ₁₂ may be such that the exposure by the exposure head 30 ₁₂ based on the image data. Furthermore, the exposure image data of the exposure head 30 _22, for Y-axis direction of the right end of the exposure point position and the straight line L ₁₂ in the Y-axis direction of the left end of the exposure point of the straight line L ₂₂ that is exposed by the exposure head 30 ₂₂ Rotation processing may be performed so that the positions of the two coincide with each other. Even when the exposure patterns by the exposure heads are connected as described above, at least one exposure head is exposed at an exposure timing such that the exposure point by the reference micromirror is positioned on the reference line RL. It is desirable. In Figure 26, the exposure point by reference micromirrors of the exposure head 30 ₂₁ is to be positioned on the reference line RL.

  Further, a scanning direction reference line along the scanning direction is exposed by a predetermined micromirror of the exposure head, and a line in a predetermined direction is exposed for each exposure head, and each exposure is performed with reference to the scanning direction reference line. You may make it perform a rotation process so that the said predetermined direction of the line which the head exposed may align correctly.

  Here, when the micromirror to be used in each exposure head is designated as described above and exposure is performed by the micromirror, the exposure point corresponding to the desired exposure image data is exposed in the desired X-axis direction. Exposure image data is assigned to each micromirror so that it is exposed to a position. Specifically, for example, as shown in FIG. 27A, exposure image data is assigned to the micromirror 1 so that an exposure point 1 corresponding to the exposure image data 1 is exposed at a position of X = 0.

  However, even if the exposure image data is assigned as described above, the exposure point 1 is actually set as shown in FIG. 27B due to, for example, the displacement of the installation position of the optical system in the exposure head and the characteristics. The exposure is performed at a position of X = 1 instead of X = 0, and other exposure points may be shifted in the X-axis direction as shown in FIG. 27B, and a desired exposure pattern is formed at a desired position of the photosensitive material 12. Cannot be exposed.

  Thus, for example, as shown in FIG. 27C, each exposure point may be exposed to a desired position by shifting the exposure image data in the X-axis direction and assigning it to each micromirror. Although the micromirror to which the exposure image data 1 is assigned is not shown in FIG. 27C, for example, when the micromirror 1 is a micromirror that exposes the light spot at the extreme end of a predetermined exposure head. The exposure image data 1 may be assigned to the micromirror of the adjacent exposure head. As a method of assigning the exposure image data shifted in the X-axis direction to each micromirror, the exposure image data itself is subjected to shift processing as image processing, and the exposure image data after the shift processing is assigned to each micromirror. It may be possible to assign the address, or the address when reading the exposure image data stored in the memory or the like is shifted and set, and the exposure image data is read from the memory according to the shifted address and assigned to each micromirror. You may do it.

Further, when assigning exposure image data shifted in the X-axis direction as described above to each micromirror, for its shift amount, for example, by exposing the linear L ₂₁ as described in FIG. 21, the reference micro mirror r21 The amount of deviation of the exposure point rp21 to be exposed in the X-axis direction is measured by a predetermined measuring means, and based on the amount of deviation, the exposure image data is subjected to shift processing, or the read address from the memory is added or subtracted. That's fine.

  Here, when assigning exposure image data to the micromirrors of each exposure head, for example, as shown in FIG. 28A, exposure points from micromirrors 1 to 10 in the range of 0 to 9 in the X-axis direction. The exposure image data is assigned to each micromirror on the assumption that the exposure is performed. For example, when the magnification of the optical system in the exposure head is smaller than the design value, it is shown in FIG. Thus, the range of 0-9 in the X-axis direction is exposed at the exposure points of the micromirrors 1-12. In such a case, if the exposure image data is assigned on the premise as described above, as shown in FIG. 28B, the exposure pattern is reduced more than the desired exposure pattern, the exposure pattern is distorted, and exposure is performed. The exposure pattern is not properly connected between the heads. Note that exposure image data assigned to the micromirrors of adjacent exposure heads are assigned to the micromirrors 11 and 12 in FIG.

  Therefore, depending on the magnification deviation amount of the optical system of the exposure head as described above, for example, as shown in FIG. 28 (c), the exposure image data is interpolated within a range of 0 to 9 in the X-axis direction. The exposure pattern may be exposed. Note that the exposure image data interpolated with the exposure image data indicated by the arrows in FIG.

  In the above description, the processing when the magnification of the optical system of the exposure head is smaller than the design value has been described. Conversely, when the magnification of the optical system of the exposure head is larger than the design value, the magnification deviation amount The exposure image data may be thinned out and assigned to each micromirror in accordance with the number.

  Here, a method for measuring the amount of magnification deviation of the optical system of the exposure head as described above will be described below.

Here is a description of how to measure the magnification deviation amount of the exposure head 30 _21, it is possible to measure the magnification deviation amount of each of the exposure heads by using the same method for the other exposure head.

First, the reference micromirror _{r 12} of the exposure head _{30 12,} while exposing the first reference line _X 12 (0) extending in the Y-axis direction as shown in the lower part of FIG. 29, the first by the exposure head _{30 12} A number of straight lines extending in the Y-axis direction are exposed at a pitch of 46 μm in the X-axis direction with respect to the reference line X ₁₂ (0) (hereinafter referred to as “first scale pattern”). On the other hand, the micro mirrors of the exposure head _{30 21} that exposes an exposure point at the same position for the exposure point _{rp 12} and X-axis direction corresponding to the reference micromirror _{r 12} of the exposure head _{30 12,} as shown in the upper part of FIG. 29 Y The second reference line X ₂₁ (0) extending in the axial direction is exposed, and the exposure head 30 ₂₁ applies the Y axis to the second reference line X ₂₁ (0) at a pitch of 45 μm in the X-axis direction, for example. Many straight lines extending in the direction are exposed (hereinafter referred to as “second scale pattern”).

Here, for example, when the magnification shift amount of the optical system of the exposure head 30 ₂₁ is 0, the position of the first reference line X ₁₂ (0) in the X-axis direction and the second reference line X _21. (0) is the position in the X-axis direction is to match, do not match when there is magnification deviation amount of the optical system of the exposure head 30 _21. Then, the closest to the second reference line X _{21 (0),} measures the straight line and the first scale pattern and the second scale pattern matches. In FIG. 29, the straight line X ₁₂ (2) of the first scale pattern coincides with the straight line of the second scale pattern closest to the second reference line X ₂₁ (0). Therefore, similarly to the measurement principle of the caliper, the position of the exposure point to be exposed by the exposure head 30 ₂₁ It can be seen that the deviation 2μm in the X-axis right direction. This deviation amount is a magnification deviation amount.

  Therefore, exposure may be performed by thinning out only exposure image data corresponding to the number of exposure points exposed in the range of 2 μ in the X-axis direction. If there is a shift amount in the direction opposite to the above in the X-axis direction, the exposure image data may be interpolated.

  In addition, the exposure apparatus according to the embodiment and the modification example further includes a correspondence that can realize the dimensions of a predetermined portion of the two-dimensional pattern represented by the image data by the micromirror that is actually used for the main exposure. A mechanism for converting the image data may be provided so as to coincide with the size of the portion. By converting the image data in such a manner, a high-definition pattern according to a desired two-dimensional pattern can be formed on the exposure surface.

  Furthermore, in the exposure apparatus according to the embodiment and the modification example, the DMD that modulates the light from the light source for each pixel is used as the pixel array. However, the present invention is not limited to this, and a light modulation element such as a liquid crystal array other than the DMD, A light source array (for example, an LD array, an organic EL array, etc.) may be used.

  Further, the operation mode of the exposure apparatus according to the above-described embodiment and the modified example may be a mode in which exposure is continuously performed while constantly moving the exposure head, or each step while moving the exposure head step by step. The exposure operation may be performed with the exposure head stationary at the position of the movement destination.

  In addition, the present invention is not limited to an exposure apparatus and an exposure method, and a drawing surface is drawn by N-fold drawing (N is a natural number of 1 or more) using a plurality of drawing heads, and a two-dimensional pattern represented by image data is drawn. The present invention can be applied to any apparatus and method as long as it is a drawing apparatus and a drawing method formed on the surface. As an example, for example, an ink jet printer or an ink jet printing method may be used. That is, in general, an ink jet recording head of an ink jet printer is formed with a nozzle that ejects ink droplets on a nozzle surface facing a recording medium (for example, recording paper or an OHP sheet). Are arranged in a lattice pattern, and the head itself is inclined with respect to the scanning direction, and an image can be recorded by N-fold drawing. In an inkjet printer employing such a two-dimensional array, even if the relative position or angle between the drawing heads deviates from an ideal state, the effect of such deviation is minimized by applying the present invention. Since a limited number of nozzles can be designated as actually used nozzles, it is possible to reduce the resolution and density unevenness that occur in the connection area between the heads of the recorded image.

  As mentioned above, although embodiment and modification of this invention were described in detail, these embodiment and modification are only an illustration, and the technical scope of this invention should be defined only by a claim. It goes without saying that it is a thing.

The perspective view which shows the external appearance of the exposure apparatus which is one Embodiment of the drawing apparatus of this invention 1 is a perspective view showing the configuration of a scanner of the exposure apparatus in FIG. (A) is a top view showing an exposed area formed on the exposed surface of the photosensitive material, and (B) is a top view showing an array of exposure areas by each exposure head. 1 is a perspective view showing a schematic configuration of an exposure head of the exposure apparatus of FIG. FIG. 1 is a top view and a side view showing a detailed configuration of an exposure head of the exposure apparatus in FIG. 1 is a partially enlarged view showing the configuration of the DMD of the exposure apparatus of FIG. A perspective view for explaining the operation of the DMD The perspective view which shows the structure of a fiber array light source Front view showing arrangement of light emitting points in laser emitting section of fiber array light source Explanatory drawing showing an example of unevenness in the pattern on the exposure surface when there is a relative position shift between adjacent exposure heads A top view showing a positional relationship between an exposure area by two adjacent exposure heads and a corresponding slit. Top view for explaining the method of measuring the position of the light spot on the exposure surface using a slit Explanatory drawing which shows the state where only the use pixel selected in the example of FIG. 10 is actually moved and the nonuniformity which arises in the pattern on an exposure surface was improved Explanatory drawing showing an example of unevenness in the pattern on the exposure surface when there is a relative position shift and mounting angle error between adjacent exposure heads FIG. 14 is an explanatory diagram showing a state in which only the used pixels selected in the example of FIG. 14 are actually moved and the unevenness in the pattern on the exposure surface is improved. Explanatory drawing showing a first example of reference exposure Explanatory drawing showing a second example of reference exposure The figure for demonstrating an example of the measuring method of the deviation | shift amount regarding the X-axis direction of two exposure heads. Diagram showing an example of reference scale (A) The figure for demonstrating the shift | offset | difference of the Y-axis direction of the exposure pattern exposed by two exposure heads, (B) The figure which shows the exposure pattern after adjusting the exposure timing of two exposure heads The figure for demonstrating the correction method of the deviation | shift in the Y-axis direction of the exposure pattern exposed by two exposure heads The figure for demonstrating the shift | offset | difference of the exposure pattern resulting from the installation angle etc. of two exposure heads The figure for demonstrating an example of the measuring method of the shift | offset | difference of the exposure pattern resulting from the installation angle of two exposure heads, etc. The figure for demonstrating the other example of the method of connecting the exposure pattern of two exposure heads about a Y-axis direction. The figure for demonstrating the other example of the method of connecting the exposure pattern of each exposure head about the Y-axis direction. The figure for demonstrating the other example of the method of connecting the exposure pattern of each exposure head about the Y-axis direction. (A) The figure which shows the ideal position of the exposure point exposed by each micromirror, (B) X-axis direction where the exposure point exposed by each micromirror originates in the error of the imaging position of an optical system, etc. The figure which shows a mode to shift, (C) The figure for demonstrating an example of the method of correct | amending the shift | offset | difference about the X-axis direction of the exposure point resulting from the error of the imaging position of an optical system, etc. (A) A view showing an ideal position of an exposure point exposed by each micromirror, (B)) An exposure point exposed by each micromirror is in the X-axis direction due to an error in magnification of the optical system, etc. The figure which shows a mode that it shifts, (C) The figure for demonstrating an example of the method of correct | amending the shift | offset | difference about the X-axis direction of the exposure point resulting from the error of the magnification of an optical system, etc. The figure for demonstrating an example of the method of measuring the deviation | shift amount about the X-axis direction of the exposure point resulting from the error of the magnification of an optical system, etc.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Exposure apparatus 12 Photosensitive material 14 Moving stage 18 Installation stand 20 Guide 22 Gate 24 Scanner 26 Sensor 28 Slit 30 Exposure head 32 Exposure area 36 DMD
38 Fiber array light source

Claims (25)

A drawing apparatus that draws a drawing surface by N-fold drawing (N is a natural number of 1 or more) and forms a two-dimensional pattern represented by image data on the drawing surface.
A plurality of drawing heads, each having a plurality of usable pixels arranged two-dimensionally and having a pixel array for generating a drawing point group constituting the two-dimensional pattern according to the image data, A drawing head attached to each of the drawing surfaces such that a pixel row direction of the possible pixels and a scanning direction of the drawing head form a predetermined inclination angle;
Moving means for moving each of the drawing heads relative to the drawing surface in the scanning direction;
For each of the drawing heads, out of the large number of usable pixels, among the usable pixels in the connection area corresponding to the drawing points in the connection area between the heads on the drawing surface, the N overlaps in the connection area between the heads. Use pixel designation means for designating a connection region use pixel for realizing drawing;
A drawing apparatus, comprising: a setting changing unit for changing the setting of each drawing head so that only the connection area use pixel among the connection area useable pixels actually operates. The use pixel designating unit further includes, for each of the drawing heads, out of the pixels other than the connection area usable pixels among the plurality of usable pixels, other than the inter-head connection area on the drawing surface. An intermediate area use pixel for realizing the N-fold drawing in the area is designated,
The setting changing unit further changes the setting for each of the drawing heads so that only the intermediate area use pixels are actually operated among the pixels other than the connection area useable pixels among the many useable pixels. The drawing apparatus according to claim 1, wherein: The set inclination angle θ in each drawing head is the number of pixels s forming each pixel column of the usable pixels of the drawing head, the pixel pitch p in the pixel column direction of the usable pixels, and the scanning direction. For the pixel column pitch δ of the usable pixels along the direction orthogonal to

The drawing apparatus according to claim 1 or 2, wherein the angle satisfies the relationship (1).   The drawing apparatus according to claim 1, wherein the N is a natural number of 2 or more. The pixel array of each of the drawing heads generates a light spot group as the drawing point group,
The use pixel designation means is
For each of the drawing heads, position detecting means for detecting a position on the drawing surface of a light spot constituting the head-to-head connecting region on the drawing surface of the light spot group;
For each of the drawing heads, based on the detection result by the position detection means, in the connecting region between the heads on the drawing surface, a portion where the drawing is redundant with respect to the ideal N-fold drawing and an ideal 5. The apparatus according to claim 1, further comprising a selection unit configured to select the connection area use pixel so that a total of portions where drawing is insufficient with respect to the N-fold drawing is minimized. The drawing apparatus described. The pixel array of each of the drawing heads generates a light spot group as the drawing point group,
The use pixel designation means is
For each of the drawing heads, position detecting means for detecting a position on the drawing surface of a light spot constituting the head-to-head connecting region on the drawing surface of the light spot group;
For each of the drawing heads, based on the detection result by the position detecting means, the number of drawing points of the portion where the drawing is redundant with respect to the ideal N-fold drawing in the connecting region between the heads on the drawing surface, 2. The apparatus according to claim 1, further comprising selection means for selecting the connection area use pixel so that a drawing point number of a portion where drawing is insufficient is equal to the ideal N-fold drawing. 4. The drawing apparatus according to any one of 4 above. The pixel array of each of the drawing heads generates a light spot group as the drawing point group,
The use pixel designation means is
For each of the drawing heads, position detecting means for detecting a position on the drawing surface of a light spot constituting the head-to-head connecting region on the drawing surface of the light spot group;
For each of the drawing heads, based on the detection result by the position detection means, in the connecting area between the heads on the drawing surface, the portion where drawing becomes redundant with respect to the ideal N-fold drawing is minimized, 5. The apparatus according to claim 1, further comprising a selection unit that selects the connection area use pixel so that a portion where drawing is insufficient for the ideal N-fold drawing does not occur. The drawing apparatus according to item 1. The pixel array of each of the drawing heads generates a light spot group as the drawing point group,
The use pixel designation means is
For each of the drawing heads, position detecting means for detecting a position on the drawing surface of a light spot constituting the head-to-head connecting region on the drawing surface of the light spot group;
For each of the drawing heads, based on the detection result by the position detecting means, in the connecting area between the heads on the drawing surface, the portion where drawing is insufficient for the ideal N-fold drawing is minimized, 5. The apparatus according to any one of claims 1 to 4, further comprising selection means for selecting the connection area use pixel so that a portion where the drawing becomes redundant with respect to the ideal N-fold drawing does not occur. The drawing apparatus according to item 1.   In order to designate the connection area use pixel in the use pixel designation means, for each of the drawing heads, (N-1) pixel rows are formed for the N among the connection area useable pixels. 5. The drawing apparatus according to claim 4, further comprising reference drawing means for performing reference drawing using only pixels.   In order to designate the connection area use pixel in the use pixel designating means, for each of the drawing heads, 1 / of the total number of pixel rows of the usable pixel with respect to the N among the connection area useable pixels. 5. The drawing apparatus according to claim 4, further comprising reference drawing means for performing reference drawing using only pixels constituting a group of adjacent pixel rows corresponding to N lines.   Data for converting the image data so that the size of the predetermined portion in the inter-head connecting region of the two-dimensional pattern represented by the image data matches the size of the corresponding portion that can be realized by the specified connecting region use pixel. 11. The drawing apparatus according to claim 1, further comprising conversion means.   The drawing apparatus according to claim 1, wherein the pixel array is a spatial light modulation element that modulates light from a light source for each pixel according to the image data.   Control of the drawing point formation timing by the drawing heads adjacent to each other so that the drawing point groups formed on the drawing surface are connected by the use pixels of the connection area specified by the use pixel specifying means of the drawing heads adjacent to each other The drawing apparatus according to claim 1, further comprising a drawing control means for performing the drawing.   The drawing control means includes a position of the drawing area use pixel of one drawing head of the drawing heads adjacent to each other in the scanning direction with respect to the drawing surface and the drawing of the connection area use pixel of the other drawing head. 14. The drawing point formation timing is controlled based on a distance between a position in the scanning direction with respect to a surface and a relative moving speed of the drawing head by the moving unit. Drawing device.   Input to the drawing heads adjacent to each other so that the drawing point groups formed on the drawing surface by the connection region use pixels specified by the use pixel specifying means of the drawing heads adjacent to each other are connected in the scanning direction. 15. The drawing apparatus according to any one of 1 to 14, further comprising scanning direction image data correction means for correcting the image data to be corrected.   The drawing apparatus according to claim 15, wherein the scanning direction image data correction unit performs a rotation process as the correction. Reference pixels are preset for each drawing head,
The image data input to each drawing head is corrected so that the image of the drawing point formed by the reference pixel is to be drawn at a predetermined position in the direction intersecting the preset scanning direction. The drawing apparatus according to claim 1, further comprising a drawing point position correcting unit.   Crossing direction for correcting image data input to the drawing heads adjacent to each other so that the drawing point groups formed on the drawing surface by the drawing heads adjacent to each other are connected in a direction crossing the scanning direction. 18. The drawing apparatus according to claim 1, further comprising image data correcting means. A plurality of drawing heads having a pixel array that has a number of usable pixels arranged two-dimensionally and generates a drawing point group that forms a two-dimensional pattern represented by the image data according to the image data. A drawing method using drawing heads attached to the drawing surface such that a pixel column direction of the usable pixels and a scanning direction of the drawing head form a predetermined tilt angle,
For each of the drawing heads, N-fold drawing is performed in the connection region between the heads among the connection region usable pixels corresponding to the drawing points in the connection region between the heads on the drawing surface among the plurality of usable pixels ( (N is a natural number equal to or greater than 1) designating a connection region use pixel that realizes:
For each of the drawing heads, the step of changing the setting of the drawing head so that only the connection area use pixel among the connection area useable pixels actually operates;
A step of operating each of the drawing heads while moving each of the drawing heads relative to the drawing surface in the scanning direction to form the two-dimensional pattern on the drawing surface. Drawing method.   A step of controlling drawing point formation timing by each of the drawing heads such that each drawing point group formed on the drawing surface by the designated connection region use pixels of the drawing heads adjacent to each other is connected in the scanning direction. The drawing method according to claim 19, further comprising:   About the position of the drawing area using pixels of one drawing head of the drawing heads adjacent to each other in the scanning direction with respect to the drawing surface and the scanning direction of the connecting area using pixels of the other drawing head with respect to the drawing surface 21. The drawing method according to claim 20, wherein the drawing point formation timing is controlled based on a distance between the drawing position and a relative movement speed of the drawing head.   Input to the drawing heads adjacent to each other so that the drawing point groups formed on the drawing surface by the connection region use pixels specified by the use pixel specifying means of the drawing heads adjacent to each other are connected in the scanning direction. The drawing method according to claim 19, further comprising a step of correcting the image data to be processed.   23. The drawing method according to claim 22, wherein a rotation process is performed as the correction. A reference pixel is preset for each drawing head,
The image data input to each drawing head is corrected so that the image of the drawing point formed by the reference pixel is to be drawn at a predetermined position in the direction intersecting the preset scanning direction. The drawing method according to claim 19, further comprising a step.   A step of correcting image data inputted to the drawing heads adjacent to each other such that drawing point groups formed on the drawing surface by the drawing heads adjacent to each other are connected in a direction intersecting the scanning direction; 25. The drawing method according to claim 19, further comprising:

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