JP2006022303A - Optical cation crosslinking pattern polymer - Google Patents
Optical cation crosslinking pattern polymer Download PDFInfo
- Publication number
- JP2006022303A JP2006022303A JP2005041424A JP2005041424A JP2006022303A JP 2006022303 A JP2006022303 A JP 2006022303A JP 2005041424 A JP2005041424 A JP 2005041424A JP 2005041424 A JP2005041424 A JP 2005041424A JP 2006022303 A JP2006022303 A JP 2006022303A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- epoxy group
- polymer
- curing
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 36
- 238000004132 cross linking Methods 0.000 title claims abstract description 11
- 230000003287 optical effect Effects 0.000 title claims abstract description 11
- 150000001768 cations Chemical class 0.000 title 1
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 39
- 239000000178 monomer Substances 0.000 claims abstract description 32
- 239000004593 Epoxy Substances 0.000 claims abstract description 15
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- 239000011342 resin composition Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 10
- -1 fumaric acid ester Chemical class 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- 150000003440 styrenes Chemical class 0.000 claims description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Natural products OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- 229920006037 cross link polymer Polymers 0.000 claims 4
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000001530 fumaric acid Substances 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 abstract description 7
- 238000010538 cationic polymerization reaction Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 abstract description 2
- 229920001169 thermoplastic Polymers 0.000 abstract description 2
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 150000003254 radicals Chemical group 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 5
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 5
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 5
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 2
- FIMUXQLLGBMSAI-UHFFFAOYSA-N cyclohexylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCCC1 FIMUXQLLGBMSAI-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- ZKJNETINGMOHJG-GGWOSOGESA-N (e)-1-[(e)-prop-1-enoxy]prop-1-ene Chemical class C\C=C\O\C=C\C ZKJNETINGMOHJG-GGWOSOGESA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- AAUXVPAKDMCMMN-UHFFFAOYSA-N 2-[(4-ethenylphenoxy)methyl]oxirane Chemical compound C1=CC(C=C)=CC=C1OCC1OC1 AAUXVPAKDMCMMN-UHFFFAOYSA-N 0.000 description 1
- CRQSAKXMWFFXJG-UHFFFAOYSA-N 2-[(4-ethenylphenyl)methyl]oxirane Chemical compound C1=CC(C=C)=CC=C1CC1OC1 CRQSAKXMWFFXJG-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MLVSWIXRZNPEKF-OWOJBTEDSA-N bis(oxiran-2-ylmethyl) (e)-but-2-enedioate Chemical compound C1OC1COC(=O)/C=C/C(=O)OCC1CO1 MLVSWIXRZNPEKF-OWOJBTEDSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000012663 cationic photopolymerization Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- UUZLJPRHSPEASP-UHFFFAOYSA-N cyclohexylmethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1CCCCC1 UUZLJPRHSPEASP-UHFFFAOYSA-N 0.000 description 1
- 125000005520 diaryliodonium group Chemical group 0.000 description 1
- JBSLOWBPDRZSMB-BQYQJAHWSA-N dibutyl (e)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C\C(=O)OCCCC JBSLOWBPDRZSMB-BQYQJAHWSA-N 0.000 description 1
- BLKQQTCUGZJWLN-VAWYXSNFSA-N dicyclohexyl (e)-but-2-enedioate Chemical compound C1CCCCC1OC(=O)/C=C/C(=O)OC1CCCCC1 BLKQQTCUGZJWLN-VAWYXSNFSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- LDCRTTXIJACKKU-ONEGZZNKSA-N dimethyl fumarate Chemical compound COC(=O)\C=C\C(=O)OC LDCRTTXIJACKKU-ONEGZZNKSA-N 0.000 description 1
- 229960004419 dimethyl fumarate Drugs 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical class C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
本発明は、紫外線その他の活性エネルギー線(活性種を生成可能な光線及び放射線)の照射によって架橋による3次元硬化が可能な重合体、及びこれを含有する樹脂組成物に関する。特には、エポキシ基同士のカチオン重合反応によって3次元化が行われるものに関する。なお、光以外の活性エネルギー線により架橋反応が誘起される場合も含めて、光カチオン架橋、光硬化性等の語を用いることとする。 The present invention relates to a polymer that can be three-dimensionally cured by crosslinking by irradiation with ultraviolet rays or other active energy rays (light rays and radiation capable of generating active species), and a resin composition containing the same. In particular, the present invention relates to one that is three-dimensionalized by a cationic polymerization reaction between epoxy groups. It should be noted that terms such as photocationic crosslinking and photocurability are used including the case where a crosslinking reaction is induced by active energy rays other than light.
近年、情報通信技術が急速に発展し、端末機のディスプレイの部材や、光通信技術の光ファイバー等の光学材料の検討が盛んになってきている。中でも、ポリマー系光学材料として、光の照射によって硬化可能な樹脂が検討されている。例えば、ウレタンアクリレートまたはエポキシアクリレートと、(メタ)アクリル酸エステルモノマーとの共重合樹脂といった光ラジカル重合により硬化可能な樹脂について検討されている(特開2000−81520,特開平7−233227)。なお、「(メタ)アクリル酸エステル」は、アクリル酸エステル、メタクリル酸エステル、またはこれらの組み合わせをいうものとする。
しかし、光ラジカル重合型では硬化時の収縮が大きく、硬化物にゆがみやわれが生じてしまう問題点がある。硬化時の収縮による成形後のゆがみやわれは、光ファイバー等の成形体では特に問題になる。また、ラジカル重合は酸素による阻害を受けるので、最表面の硬化性が悪くなりやすいという欠点もある。 However, in the photo radical polymerization type, there is a problem that the shrinkage at the time of curing is large and the cured product is distorted and distorted. Distortion and cracking after molding due to shrinkage during curing is particularly a problem in molded articles such as optical fibers. In addition, since radical polymerization is inhibited by oxygen, there is a drawback that the curability of the outermost surface tends to be deteriorated.
本件発明者らは、上記問題点に鑑み鋭意検討する中、一般に(メタ)アクリル酸エステルの硬化収縮より脂環式エポキシ化合物の硬化収縮の方が小さいという点に着目した。硬化収縮が小さいと、ゆがみや割れを極力減らす点で有利となる。また、本件発明者らは、酸素阻害の影響を受けないカチオン重合型の硬化反応(特開2003−149476、特開2003−212961)に着目するに至った。酸素阻害の影響を受けないならば、最表面の硬化性が悪く物性が出ないということもなくなる。 The inventors of the present invention have paid attention to the fact that the cure shrinkage of the alicyclic epoxy compound is generally smaller than the cure shrinkage of the (meth) acrylic acid ester in the intensive study in view of the above problems. Small cure shrinkage is advantageous in reducing distortion and cracking as much as possible. Further, the present inventors have come to focus on a cationic polymerization type curing reaction (Japanese Patent Application Laid-Open No. 2003-149476, Japanese Patent Application Laid-Open No. 2003-212961) that is not affected by oxygen inhibition. If it is not affected by oxygen inhibition, the curable property on the outermost surface is poor and physical properties are not lost.
以上のように、本発明は、ポリマー系光学材料等の製造に用いる光硬化性樹脂において、硬化成形後の歪みや割れを防止することができ、最表面についても充分な硬化が行われるものを提供すること目的とする。 As described above, the present invention is a photocurable resin used for the production of polymer-based optical materials and the like, which can prevent distortion and cracking after curing molding, and the outermost surface is sufficiently cured. The purpose is to provide.
本発明の光硬化性重合体は、1〜3個のエポキシ基及び1個のラジカル反応基を分子中に含むエポキシ基含有モノマーを、単独で、または1個のラジカル反応基を分子中に含む非エポキシ基含有モノマーとの組み合わせで、ラジカル反応基の反応により重合した可塑性、熱可塑性または液状の重合体であって、エポキシ当量が200〜2000(g/eq)であり、かつ、重量平均分子量が2000〜20万であることを特徴とする。 The photocurable polymer of the present invention contains an epoxy group-containing monomer containing 1 to 3 epoxy groups and one radical reactive group in the molecule alone or one radical reactive group in the molecule. A plastic, thermoplastic or liquid polymer polymerized by reaction of a radical reactive group in combination with a non-epoxy group-containing monomer, having an epoxy equivalent of 200 to 2000 (g / eq), and a weight average molecular weight Is 2000 to 200,000.
本発明の光カチオン架橋型樹脂組成物によれば、硬化収縮が小さいため、硬化物のゆがみやわれの問題がほとんどなくなる。硬化物の透明性が良好であることから、光導波路等の光学分野への応用も可能である。 According to the photocationically crosslinked resin composition of the present invention, since the curing shrinkage is small, the problem of distortion and cracking of the cured product is almost eliminated. Since the cured product has good transparency, it can be applied to optical fields such as optical waveguides.
また、構成モノマーの組み合わせや組成比によって、樹脂組成物の屈折率やガラス転移点を調整することができる。硬化前のガラス転移点を高くすることができるので、硬化前にもタックフリーにすることができる。そのため、硬化前の状態でもほこりがつかないようにするドライフィルム化ができるという利点がある。 Moreover, the refractive index and glass transition point of a resin composition can be adjusted with the combination and composition ratio of a structural monomer. Since the glass transition point before curing can be increased, tack-free can be achieved before curing. Therefore, there is an advantage that a dry film can be formed so as not to be dusty even in a state before curing.
ポリマーは、公知の方法で合成することが可能であり、例えば、所定量モノマーと溶剤を一括で仕込み、窒素を導入しながら、ラジカル重合開始剤の存在下、70〜80℃に加温しつつ撹拌することにより得られる。 The polymer can be synthesized by a known method. For example, while a predetermined amount of monomers and a solvent are charged all at once and nitrogen is introduced, the polymer is heated to 70 to 80 ° C. in the presence of a radical polymerization initiator. It is obtained by stirring.
ポリマーの重合成分として必須成分であるエポキシ基を含有するラジカル重合可能なモノマーは、1〜3個のエポキシ基と、1個のラジカル反応基とを有するものである。エポキシ基は、脂環式エポキシ基及びグリシジル基のいずれでも良いが、光カチオン重合の反応性から、一般に脂環式エポキシ基が好ましい。エポキシ基含有モノマーとして、脂環式エポキシ基を有するラジカル反応性モノマーを単独で、または、グリシジルエポキシ基を有するラジカル反応性モノマーと組み併せて用いるのが好ましい。また、1分子あたりのエポキシ基の数は、1〜2個が好ましい。通常は、エポキシ基の数が1個であるモノマーのみを用いるか、または、エポキシ基の数が1〜3個のモノマーを組み合わせて用い、全体の平均でエポキシ基の数が1〜1.5個の範囲内とするのが好ましい。エポキシ基含有モノマーのエポキシ基以外の部分は、ラジカル重合反応及びその制御が容易な不飽和二重結合からなる低分子単位である。 The radically polymerizable monomer containing an epoxy group, which is an essential component as a polymerization component of the polymer, has 1 to 3 epoxy groups and one radical reactive group. The epoxy group may be either an alicyclic epoxy group or a glycidyl group, but an alicyclic epoxy group is generally preferred from the reactivity of photocationic polymerization. As the epoxy group-containing monomer, a radical reactive monomer having an alicyclic epoxy group is preferably used alone or in combination with a radical reactive monomer having a glycidyl epoxy group. The number of epoxy groups per molecule is preferably 1 to 2. Usually, only a monomer having 1 epoxy group is used, or a monomer having 1 to 3 epoxy groups is used in combination, and the average number of epoxy groups is 1 to 1.5 on the whole. It is preferable to be within the range. The part other than the epoxy group of the epoxy group-containing monomer is a low molecular unit composed of an unsaturated double bond that is easy to control and control radical polymerization.
このようなエポキシ基含有モノマーとしては、エポキシ基を含有する(メタ)アクリル酸エステル類、エポキシ基を含有するスチレン誘導体、エポキシ基を含有するフマル酸エステル類、エポキシ基を含有するビニル化合物があげられる。具体的には、エポキシシクロヘキシルメチルアクリレート(I)、エポキシシクロヘキシルメチルメタクリレート(II)、グリシジルアクリレート(III)、グリシジルメタクリレート(IV)、〔(4−エテニルフェニル)メチル〕オキシラン(V)、4−(グリシジルオキシ)スチレン(VI)、4-ビニルエポキシシクロヘキサン(VII)、ジグリシジルフマレート(VIII)、及び、ジエポキシシクロヘキシルメチルフマレート(IX)が挙げられる。これらの化合物の構造式を下記に示す。
エポキシ基を含有しない、その他のポリマーの重合成分として用いられるモノマーとしては、公知慣用のものが使用可能である。たとえば、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸ブチル、ベンジル(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、イソボルニル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、(メタ)アクリロイルモルホリン、(メタ)アクリルアミド、ジシクロヘキシルフマレート、ジベンジルフマレート、ジブチルフマレート、スチレン等が挙げられる。 As a monomer that does not contain an epoxy group and is used as a polymerization component for other polymers, known monomers can be used. For example, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, benzyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxy Butyl (meth) acrylate, phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, isobornyl (meth) acrylate, cyclohexyl (meth) acrylate, (meth) acryloylmorpholine, (meth) acrylamide, dicyclohexyl fumarate, dibenzyl Examples include fumarate, dibutyl fumarate, and styrene.
このような非エポキシ基含有モノマーを用いる場合、エポキシ基含有モノマーのモル分率、すなわち、エポキシ基含有モノマーのモル数/ラジカル重合性モノマーの総モル数は、例えば0.2〜0.75である。このような共重合により、硬化物の物性を容易に、好ましいものに調整することができる。 When such a non-epoxy group-containing monomer is used, the mole fraction of the epoxy group-containing monomer, that is, the mole number of the epoxy group-containing monomer / the total mole number of the radical polymerizable monomer is, for example, 0.2 to 0.75. is there. By such copolymerization, the physical properties of the cured product can be easily adjusted to a preferable one.
本発明のポリマーは、エポキシ当量が200〜2000(g/eq)である。エポキシ当量が2000を越えると、光カチオン架橋の密度が不充分となり、エポキシ当量が200未満では、光カチオン架橋の密度が過剰となり、かえって靱性の低下を招く。なお、エポキシ当量の測定は、JIS K 7236−1986の方法により行うことができる。 The polymer of the present invention has an epoxy equivalent of 200 to 2000 (g / eq). When the epoxy equivalent exceeds 2000, the density of the photocation crosslinking becomes insufficient, and when the epoxy equivalent is less than 200, the density of the photocation crosslinking becomes excessive, which leads to a decrease in toughness. In addition, the measurement of an epoxy equivalent can be performed by the method of JISK7236-1986.
本発明のポリマーの重量平均分子量(THF溶媒によるGPC、ポリスチレン換算)は、2000〜20万であり、好ましくは3000〜5万である。重合体の重量平均分子量が、2000未満であると、ラジカル反応性末端基の濃度が過大になる。また、タック性が残り取り扱い性に劣る。一方、重合体の重量平均分子量が20万を越えると、粘度が過大となり、取り扱いが困難となり、特には、気泡等の混入を防ぐのが困難になってしまう。 The polymer of the present invention has a weight average molecular weight (GPC by THF solvent, in terms of polystyrene) of 2000 to 200,000, preferably 3000 to 50,000. When the weight average molecular weight of the polymer is less than 2,000, the concentration of radical reactive end groups becomes excessive. In addition, tackiness remains and handling properties are poor. On the other hand, when the weight average molecular weight of the polymer exceeds 200,000, the viscosity becomes excessive and handling becomes difficult, and in particular, it becomes difficult to prevent mixing of bubbles and the like.
本発明のポリマーは、光カチオン架橋による3次元硬化時の体積収縮が、好ましくは3%未満、より好ましくは2%未満であり、反応硬化により生じる歪みや残留応力を充分に小さくすることができる。また、透明性の高い硬化物を容易に得ることができることから、ポリマー系光学材料の製造に用いることができる。 The polymer of the present invention has a volume shrinkage at the time of three-dimensional curing by photocation crosslinking, preferably less than 3%, more preferably less than 2%, and can sufficiently reduce strain and residual stress caused by reaction curing. . Moreover, since a highly transparent cured product can be easily obtained, it can be used for production of a polymer-based optical material.
また、本発明の樹脂組成物を塗料化する場合には、酢酸エチル、トルエン等の有機溶剤およびモノマー類で希釈することができ、モノマーで希釈する場合は、ポリマーとモノマーの総和中のポリマーの含有率を30重量%以上にすることが望ましい。 When the resin composition of the present invention is made into a paint, it can be diluted with an organic solvent and monomers such as ethyl acetate and toluene, and when diluted with a monomer, the polymer in the sum of the polymer and the monomer can be diluted. The content is desirably 30% by weight or more.
希釈に用いるモノマー類としては、ビニルエーテル化合物、プロペニルエーテル化合物、スチレン誘導体、エポキシ化合物、ラクトン化合物、オキセタン化合物等、公知慣用のものが使用可能である。これらは単独で用いてもよく、複数種を併用してもよい。 As the monomers used for the dilution, known and commonly used monomers such as vinyl ether compounds, propenyl ether compounds, styrene derivatives, epoxy compounds, lactone compounds, oxetane compounds can be used. These may be used independently and may use multiple types together.
本発明の光カチオン架橋型樹脂組成物には、必要に応じて光カチオン重合開始剤(活性エネルギー線の照射により活性種を生成する反応開始剤)を添加する。 If necessary, a photocationic polymerization initiator (a reaction initiator that generates active species by irradiation with active energy rays) is added to the photocationically crosslinked resin composition of the present invention.
光カチオン重合開始剤の種類は特に限定されず、公知のものが使用可能であるが、代表的な例としては、ジフェニルヨードニウム塩、トリフェニルスルホニウム塩、アルキルヨードニウム塩、アルキルスルホニウム塩、ジアリールヨードニウム塩、ジアリールスルホニウム塩等が挙げられる。これらを単独で用いても、複数種併用してもよい。 The kind of the cationic photopolymerization initiator is not particularly limited, and known ones can be used, but typical examples include diphenyliodonium salt, triphenylsulfonium salt, alkyliodonium salt, alkylsulfonium salt, diaryliodonium salt. And diarylsulfonium salts. These may be used alone or in combination.
また、光カチオン重合開始剤を使用する場合のその添加量は、ポリマーと上記必要に応じて用いられるモノマーの総和に対し、0.1〜10重量%程度であり、約1〜3重量%が好ましい。 Moreover, the addition amount in the case of using a photocationic polymerization initiator is about 0.1 to 10 weight% with respect to the sum total of a polymer and the monomer used as needed, and about 1 to 3 weight%. preferable.
さらに、本発明の光カチオン架橋型樹脂組成物には、必要に応じて、光安定剤、紫外線吸収剤、触媒、レベリング剤、消泡剤、重合促進剤、酸化防止剤、難燃剤、赤外線吸収剤、等を添加することができる。 Furthermore, the photocation cross-linking resin composition of the present invention includes a light stabilizer, an ultraviolet absorber, a catalyst, a leveling agent, an antifoaming agent, a polymerization accelerator, an antioxidant, a flame retardant, and an infrared absorption as necessary. An agent, etc. can be added.
なお、本発明の光カチオン架橋型樹脂組成物を硬化させる活性エネルギー線は、紫外線、可視光線、電子線、γ線等であり、光源は特に限定されないが、例としては、高圧水銀灯、カーボンアーク灯、キセノン灯、メタルハライド灯等が挙げられる。 The active energy rays for curing the photocationically crosslinked resin composition of the present invention are ultraviolet rays, visible rays, electron rays, γ rays, etc., and the light source is not particularly limited, but examples include high pressure mercury lamps, carbon arcs. Lamp, xenon lamp, metal halide lamp and the like.
以下、本発明を実施例および比較例によりさらに具体的に説明する。なお、以下において、配合比率及び「%」は、特に断らないかぎり、全て重量基準であるものとする。 Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples. In the following, the blending ratio and “%” are all based on weight unless otherwise specified.
[合成例1]
フラスコに、スチレン52g(0.5モル)、エポキシシクロヘキシルメチルメタクリレート98g(0.5モル)、クロロベンゼン300g、α−メチルスチレンダイマー7.5g、及びラウロイルパーオキサイド1.5gを仕込み、窒素を導入しながら70±2℃の条件にて8時間反応させた。その後、メタノールで精製し、ポリマーAを得た。
[Synthesis Example 1]
A flask was charged with 52 g (0.5 mol) of styrene, 98 g (0.5 mol) of epoxycyclohexylmethyl methacrylate, 300 g of chlorobenzene, 7.5 g of α-methylstyrene dimer, and 1.5 g of lauroyl peroxide, and nitrogen was introduced. The reaction was allowed to proceed for 8 hours at 70 ± 2 ° C. Then, it refine | purified with methanol and the polymer A was obtained.
[合成例2]
フラスコにクロロベンゼン203.2gを仕込み、窒素を導入しながら加温し、還流温度とする。そこに、スチレン78g(0.75モル)、エポキシシクロヘキシルメチルメタクリレート49g(0.25モル)、クロロベンゼン50.8g、α−メチルスチレンダイマー25.4g、及びラウロイルパーオキサイド12.7gを溶解させたものを滴下しながら120〜130℃で反応させた。その後、メタノールで精製し、ポリマーBを得た。
[Synthesis Example 2]
A flask is charged with 203.2 g of chlorobenzene and heated while introducing nitrogen to a reflux temperature. In this solution, 78 g (0.75 mol) of styrene, 49 g (0.25 mol) of epoxycyclohexylmethyl methacrylate, 50.8 g of chlorobenzene, 25.4 g of α-methylstyrene dimer, and 12.7 g of lauroyl peroxide were dissolved. The reaction was carried out at 120 to 130 ° C. while dropping. Then, it refine | purified with methanol and the polymer B was obtained.
[合成例3]
フラスコにクロロベンゼン262gを仕込み、窒素を導入しながら加温し、還流温度とする。そこに、スチレン52g(0.5モル)、イソボルニルアクリレート52g(0.25モル)、エポキシシクロヘキシルメチルアクリレート45.5g(0.25モル)、クロロベンゼン38g、α−メチルスチレンダイマー7.5g、及びラウロイルパーオキサイド7.5gを溶解させたものを滴下しながら120〜130℃で反応させた。その後、メタノールで精製し、ポリマーCを得た。
[Synthesis Example 3]
A flask is charged with 262 g of chlorobenzene and heated while introducing nitrogen to a reflux temperature. There, 52 g (0.5 mol) of styrene, 52 g (0.25 mol) of isobornyl acrylate, 45.5 g (0.25 mol) of epoxycyclohexylmethyl acrylate, 38 g of chlorobenzene, 7.5 g of α-methylstyrene dimer, And it was made to react at 120-130 degreeC, dripping what melt | dissolved 7.5 g of lauroyl peroxide. Then, it refine | purified with methanol and the polymer C was obtained.
[合成例4]
フラスコにクロロベンゼン280gを仕込み、窒素を導入しながら加温し、還流温度とする。そこに、シクロヘキシルアクリレート123.2g(0.8モル)、エポキシシクロヘキシルメチルアクリレート36.4g(0.2モル)、クロロベンゼン40g、α−メチルスチレンダイマー1.2g、及びラウロイルパーオキサイド8.0gを溶解させたものを滴下しながら120〜130℃で反応させた。その後、メタノールで精製し、ポリマーDを得た。
[Synthesis Example 4]
A flask is charged with 280 g of chlorobenzene and heated while introducing nitrogen to a reflux temperature. There, 123.2 g (0.8 mol) of cyclohexyl acrylate, 36.4 g (0.2 mol) of epoxycyclohexylmethyl acrylate, 40 g of chlorobenzene, 1.2 g of α-methylstyrene dimer, and 8.0 g of lauroyl peroxide are dissolved. It was made to react at 120-130 degreeC, dripping what was made to drop. Then, it refine | purified with methanol and the polymer D was obtained.
[合成例5]
フラスコにクロロベンゼン295gを仕込み、窒素を導入しながら加温し、還流温度とする。そこに、シクロヘキシルアクリレート123.2g(0.8モル)、エポキシシクロヘキシルメチルアクリレート36.4g(0.2モル)、クロロベンゼン24g、及びラウロイルパーオキサイド4.8gを溶解させたものを滴下しながら120〜130℃で反応させた。その後、メタノールで精製し、ポリマーEを得た。
[Synthesis Example 5]
A flask is charged with 295 g of chlorobenzene and heated while introducing nitrogen to a reflux temperature. While the solution in which 123.2 g (0.8 mol) of cyclohexyl acrylate, 36.4 g (0.2 mol) of epoxy cyclohexyl methyl acrylate, 24 g of chlorobenzene, and 4.8 g of lauroyl peroxide were dropped, 120 to 120- The reaction was performed at 130 ° C. Then, it refine | purified with methanol and the polymer E was obtained.
以上の合成例の、反応モル比、及び得られたポリマーの分子量を表1に示す。ポリマーの分子量の測定は、テトラヒドロフラン(THF)を溶媒とするGPC装置により行い、ポリスチレン換算値としての重量平均分子量を求めた。具体的な測定条件は、下記のとおりである。
カラム:東ソー(株)のポリスチレンゲルカラム (TSK gel G4000HXL+TSK gel G3000HXL+TSK gel G2000HXL+TSK gel G1000HXL×2本)
カラム温度:40℃
検出器:示差屈折率検出器(島津製作所RID−6A)
流速:1ml/min.
Column: Tosoh Co., Ltd. polystyrene gel column (TSK gel G4000H XL + TSK gel G3000H XL + TSK gel G2000H XL + TSK gel G1000H XL x 2)
Column temperature: 40 ° C
Detector: Differential refractive index detector (Shimadzu RID-6A)
Flow rate: 1 ml / min.
[比較合成例1]
ヘキサメチレンジイソシアネートのイソシアヌレートタイプ3量体504g(1モル)、ハイドロキノンモノメチルエーテル0.47g、2−ヒドロキシプロピルアクリレート429g(3.3モル)を仕込み、70〜80℃の条件にて残存イソシアネート濃度が0.1%になるまで反応させ、ウレタンアクリレートを得た。
[Comparative Synthesis Example 1]
504 g (1 mol) of isocyanurate type trimer of hexamethylene diisocyanate, 0.47 g of hydroquinone monomethyl ether, 429 g (3.3 mol) of 2-hydroxypropyl acrylate, and the residual isocyanate concentration is 70 to 80 ° C. It was made to react until it became 0.1%, and urethane acrylate was obtained.
[比較合成例2]
ビスフェノールAジグリシジルエーテル(標準タイプ)380g(1モル)、アクリル酸144g(2モル)、ハイドロキノンモノメチルエーテル0.26g、テトラブチルアンモニウムブロマイド2.62gを仕込み、90〜100℃の条件にて酸価が5mgKOH/g以下になるまで反応させ、エポキシアクリレートを得た。
[Comparative Synthesis Example 2]
380 g (1 mol) of bisphenol A diglycidyl ether (standard type), 144 g (2 mol) of acrylic acid, 0.26 g of hydroquinone monomethyl ether and 2.62 g of tetrabutylammonium bromide are charged, and the acid value is 90 to 100 ° C. Was reacted until 5 mgKOH / g or less was obtained, to obtain an epoxy acrylate.
[実施例1〜5、比較例1,2]
上記合成例で得られたポリマーおよび比較合成例で得られたウレタンアクリレート、エポキシアクリレートについて、以下の要領で物性を測定した。結果を表2に示す。
[Examples 1 to 5, Comparative Examples 1 and 2]
The physical properties of the polymer obtained in the above synthesis example and the urethane acrylate and epoxy acrylate obtained in the comparative synthesis example were measured as follows. The results are shown in Table 2.
・タック性: 溶剤を揮発させた後に、指で表面を触りタックがあるかどうかを見た
○:べたつきがない ×:べたつきがある
・硬化性: 硬化フィルムを塩化メチレンに18時間浸漬して未硬化部分を抽出し、105℃X3時間乾燥する。塩化メチレン浸漬前の重量と乾燥後の重量から、ゲル化率として次式により求めた
ゲル化率(%)=乾燥後の重量÷浸漬前の重量×100
・屈折率
*硬化前のポリマー:得られたポリマー/トルエン=75/25、50/50、25/75、0/100(重量比)の比率で配合して均一に溶解させ、得られた各樹脂組成物をアッベ屈折計で測定温度25℃にて測定した。横軸に配合比率、縦軸に各比率の測定値をとったグラフからポリマー/トルエン=100/0の屈折率を外挿により求めた。
*硬化前のウレタンアクリレート・エポキシアクリレート:アッベ屈折計で測定温度25℃にて測定した。
・ Tackiness: After volatilizing the solvent, touch the surface with your finger to see if there is tack.
○: No stickiness ×: Stickiness / curing property: The cured film is immersed in methylene chloride for 18 hours to extract an uncured portion and dried at 105 ° C. for 3 hours. From the weight before methylene chloride immersion and the weight after drying, the gelation rate was calculated by the following formula
Gelation rate (%) = weight after drying ÷ weight before immersion × 100
Refractive index * Polymer before curing: obtained polymer / toluene = 75/25, 50/50, 25/75, 0/100 (weight ratio) are blended and uniformly dissolved, and each obtained The resin composition was measured with an Abbe refractometer at a measurement temperature of 25 ° C. The refractive index of polymer / toluene = 100/0 was obtained by extrapolation from a graph in which the horizontal axis represents the blending ratio and the vertical axis represents the measured value of each ratio.
* Urethane acrylate / epoxy acrylate before curing: measured with an Abbe refractometer at a measurement temperature of 25 ° C.
・硬化収縮: 下記条件で硬化させた樹脂の硬化前後の20℃での比重をピクノメーターで測定し、次式により体積収縮率として求めた
体積収縮率(%)=〔(硬化後の比重−硬化前の比重)/硬化後の比重〕×100
・ガラス転移点(硬化前):DSCのベースラインの変曲点から求めた
・ガラス転移点(硬化後):レオログラフのtanδの極大点から求めた
・透明性:硬化物の透明性を目視判定した
○:透明である。×:濁りがある。
Curing shrinkage: Specific gravity at 20 ° C. before and after curing of a resin cured under the following conditions was measured with a pycnometer, and volume shrinkage (%) = [(specific gravity after curing− Specific gravity before curing) / specific gravity after curing] × 100
・ Glass transition point (before curing): Determined from DSC inflection point ・ Glass transition point (after curing): Determined from rheographic tan δ maximum ・ Transparency: Visual determination of transparency of cured product did
○: Transparent. X: There is turbidity.
・硬化条件:表2の比率で配合して均一に溶解させた樹脂組成物をガラス板上に200μmのアプリケーターバーで塗布し、減圧乾燥機で70℃×1時間乾燥後、80W/cmの高圧水銀灯を用いて積算照度200mJ/cm2の紫外線を照射した。下表において、ロードシルフォトイニシエイター(ローディア社の商標)PI−2074は光カチオン重合開始剤であり、イルガキュア(Irgacure; Geigy社の商標)184は光ラジカル重合の開始剤である。
表2の結果から知られるように、実施例1〜5では、硬化時の体積収縮率を2%未満とすることができた。特に、実施例2〜5では、0.2%以下とすることができた。表1に示すように、実施例1のポリマー(A)のエポキシ当量が320g/eqであるのに対し、実施例2〜5のポリマー(B〜E)は、エポキシ当量が500g/eq以上である。すなわち、実施例2〜5では、エポキシ当量を500g/eq以上とすることにより、体積収縮率を特に小さくすることができた。 As is known from the results in Table 2, in Examples 1 to 5, the volume shrinkage during curing could be less than 2%. In particular, in Examples 2 to 5, it could be 0.2% or less. As shown in Table 1, the epoxy equivalent of the polymer (A) of Example 1 is 320 g / eq, whereas the polymers (B to E) of Examples 2 to 5 have an epoxy equivalent of 500 g / eq or more. is there. That is, in Examples 2 to 5, the volume shrinkage rate could be particularly reduced by setting the epoxy equivalent to 500 g / eq or more.
また、いずれの実施例においても、ゲル化率で表される硬化性、及び硬化物の透明性において、一般的なウレタンアクリレート(比較例1)やエポキシアクリレート(比較例2)と比べて、全く遜色がなかった。さらに、タック性がなく取り扱い性が良好であり、ほこりの付着によるトラブルもほとんど生じないものであった。 Moreover, in any Example, compared with general urethane acrylate (Comparative Example 1) and epoxy acrylate (Comparative Example 2), the curability represented by the gelation rate and the transparency of the cured product are completely different. There was no dark blue. Furthermore, there was no tackiness and good handleability, and there was almost no trouble due to dust adhesion.
Claims (5)
An optical material obtained by curing the photocurable resin composition according to claim 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005041424A JP2006022303A (en) | 2004-06-07 | 2005-02-17 | Optical cation crosslinking pattern polymer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004168716 | 2004-06-07 | ||
JP2005041424A JP2006022303A (en) | 2004-06-07 | 2005-02-17 | Optical cation crosslinking pattern polymer |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006022303A true JP2006022303A (en) | 2006-01-26 |
Family
ID=35795808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005041424A Pending JP2006022303A (en) | 2004-06-07 | 2005-02-17 | Optical cation crosslinking pattern polymer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2006022303A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007055134A1 (en) * | 2005-11-10 | 2007-05-18 | Nec Corporation | Photosensitive resin composition for optical waveguide formation, optical waveguide and method for producing optical waveguide |
JP2010285541A (en) * | 2009-06-11 | 2010-12-24 | Daicel Chem Ind Ltd | Copolymer, curable resin composition containing the same, and cured article thereof |
JP2014009334A (en) * | 2012-07-02 | 2014-01-20 | Dai Ichi Kogyo Seiyaku Co Ltd | Cross-linked polymer via photo-induced cationic polymerization |
-
2005
- 2005-02-17 JP JP2005041424A patent/JP2006022303A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007055134A1 (en) * | 2005-11-10 | 2007-05-18 | Nec Corporation | Photosensitive resin composition for optical waveguide formation, optical waveguide and method for producing optical waveguide |
US7847017B2 (en) | 2005-11-10 | 2010-12-07 | Nec Corporation | Photosensitive resin composition for optical waveguide formation, optical waveguide and method for producing optical waveguide |
US8414733B2 (en) | 2005-11-10 | 2013-04-09 | Nec Corporation | Photosensitive resin composition for optical waveguide formation, optical waveguide and method for producing optical waveguide |
JP2010285541A (en) * | 2009-06-11 | 2010-12-24 | Daicel Chem Ind Ltd | Copolymer, curable resin composition containing the same, and cured article thereof |
JP2014009334A (en) * | 2012-07-02 | 2014-01-20 | Dai Ichi Kogyo Seiyaku Co Ltd | Cross-linked polymer via photo-induced cationic polymerization |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104837938A (en) | Liquid optical adhesive compositions | |
JP5315829B2 (en) | Curable hard coat agent composition | |
EP0030968B1 (en) | Irradiation of polyacrylate compositions in air | |
JPH0759614B2 (en) | Crosslinkable polymer cast composition | |
JP2019214711A (en) | Ether linkage-containing sulfur compound and resin composition | |
JP5641554B2 (en) | Active energy ray-curable optical composition and high refractive index resin | |
JP5700203B2 (en) | Amineimide compound, composition using the same, and curing method thereof | |
WO2014157131A1 (en) | Curable resin composition, cured product, and optical article | |
JP4880249B2 (en) | Photoradical crosslinking polymer and photocurable resin composition | |
JPWO2017154589A1 (en) | Curable composition and optical member | |
JP5502791B2 (en) | Curable resin composition, cured product and optical material | |
JP2015021045A (en) | Optical three-dimensional contouring resin composition consisting of cyclic ether group-containing (meth)acrylate | |
JP2006022303A (en) | Optical cation crosslinking pattern polymer | |
JP2016044229A (en) | Epoxy (meth)acrylate compound and resin composition containing the same, and cured product thereof | |
JP2011037941A (en) | Curable resin composition, cured article thereof, and plastic lens | |
JP2014009334A (en) | Cross-linked polymer via photo-induced cationic polymerization | |
JP2009091462A (en) | Carbazoyl group-containing copolymer, resin composition for optical material, and member for optical material | |
TW201610028A (en) | Active-energy-ray-curable composition | |
JP2008062571A (en) | Photo-curable pressure-sensitive adhesive film | |
JPWO2013146651A1 (en) | Cyclic ether group-containing (meth) acrylate | |
JP6268663B2 (en) | Active energy ray curable resin composition, active energy ray curable coating agent, active energy ray curable product and molded article thereof | |
JP2021105170A (en) | Active energy ray-curable composition and method for producing the same | |
JP2012046673A (en) | Optical use adhesive resin composition | |
JP2001081111A (en) | Production of cationic polymerizable resin composition | |
JP5509719B2 (en) | Curable resin composition, cured product thereof, and plastic lens |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Effective date: 20060407 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081029 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081104 |
|
A521 | Written amendment |
Effective date: 20081226 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
A02 | Decision of refusal |
Effective date: 20090512 Free format text: JAPANESE INTERMEDIATE CODE: A02 |