JP2006013043A - Heat-piped heatsink - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-piped heatsink having a constant cooling performance regardless of mounting directions of two kinds of a vertical mounting and a horizontal mounting. <P>SOLUTION: The heat-piped heatsink has a plurality of heat pipes 41 which are bent in an L shape, one of which functions as a heat absorbing section and the other of which functions as a heat dissipating section. A pedestal 43 is fixed on the heat-absorber sides of a plurality of the heat pipes 41 and transfers the amount of heat received from a central processing unit 18 to the heat absorbers of a plurality of the heat pipes 41. The heat-piped heatsink further has a plurality of cooling fins 42, is fixed on the heat-dissipating section sides of a plurality of the heat pipes 41, and dissipates the amount of heat transferred from the heat dissipaters of a plurality of the heat pipes 41. The pedestal 43 is fixed to the central processing unit 18 mounted in the vertical direction or the horizontal direction in the direction that a constant liquid head is ensured among the heat absorbers of the heat pipes 41 to the heat dissipaters. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat pipe heat sink for cooling a semiconductor element such as a central processing unit of an information processing apparatus such as a computer, and in particular, is attached to an information processing apparatus that has two installation methods of vertical installation and horizontal installation. The present invention relates to a technique that is effective when applied to the maintenance of the cooling capacity during heating.

  A semiconductor element such as a central processing unit used in an information processing apparatus such as a computer generates heat during operation. In particular, the amount of heat generated by highly integrated semiconductors in recent years has increased. When a semiconductor exceeds a certain temperature, its function as a semiconductor is lost. Therefore, it is necessary to cool a semiconductor element having a large calorific value.

  Conventionally, as a method for cooling a semiconductor element of an information processing apparatus, a method using heat conduction, a method using air cooling, a method using a heat pipe, and a method using liquid cooling are known.

  Cooling by heat conduction is achieved by using a material having high heat conductivity in a heat radiation path from the semiconductor element to the outside of the information processing apparatus. This method generates a relatively small amount of heat from the semiconductor element and is suitable for a compact information processing apparatus such as a notebook personal computer. Further, when a semiconductor with high power consumption such as a central processing unit is cooled, it is often used as a heat sink in combination with air cooling described later.

  Cooling by air cooling is achieved by providing a blower inside the information processing apparatus and forcibly convection cooling the semiconductor element. This method is widely used for cooling semiconductor elements having a certain amount of heat generation, and is also applied to personal computers by reducing the size and thickness of the blower.

  Cooling using a heat pipe is achieved by carrying heat to the outside of the information processing apparatus by a refrigerant sealed in the pipe (see, for example, Patent Document 1). As the operation principle of this heat pipe, first, the refrigerant evaporates by the amount of heat absorbed from the outside by the heat absorbing portion, and the vapor moves to the heat radiating portion. Then, heat is absorbed from the steam at the heat radiating part and released to the outside, and the refrigerant that has returned from the vapor to the liquid by heat absorption at the heat radiating part moves to the heat absorbing part, thereby carrying heat from the heat absorbing part to the heat radiating part. Can do.

  Moreover, there is a heat pipe type heat sink as a method of improving the cooling efficiency by combining heat pipes with heat conduction and air cooling. This method has a large heat transport capacity and can cool a semiconductor element or the like with high power consumption as compared with a method using a simple heat sink.

  Cooling by liquid cooling is achieved by providing a radiator, a pump, and a heat receiving jacket, and carrying heat from the heat receiving jacket to the radiator by the cooling liquid. Since the heat receiving jacket is connected to the radiator and pump by a suitable piping line, the coolant can be transferred to the heat receiving jacket, removing heat from the heating element, and the superheated coolant is Cooled and continuously returned to the heat receiving jacket by a pump. This method is suitable for cooling a semiconductor element having a large calorific value.

In cooling by liquid cooling, in consideration of leakage of the cooling liquid, a heat generating semiconductor component cooled by the cooling liquid, a cooling liquid cooling means for cooling the cooling liquid, and supplying the cooled cooling liquid to the heat generating semiconductor part An information processing apparatus including a cooling liquid supply unit, wherein the information processing apparatus case stores heat-generating semiconductor components, and the cooling liquid cooling case stores a cooling liquid cooling unit and a refrigerant supply unit. There is a configuration in which the entire configuration is handled as a single unit by connecting the respective casings and pipes. This method is suitable for cooling a semiconductor element having a large calorific value and maintainability.
JP-A-2-244748

  The above-described four types of conventional cooling techniques are, in order of decreasing cooling capacity, heat conduction, air cooling, heat pipe heat sink, and liquid cooling. In recent years, the power consumption per semiconductor element, particularly the central processing unit, has reached a level exceeding 80 W, and the conventional techniques such as heat conduction and air cooling have a problem of insufficient cooling capacity. The liquid cooling with the highest cooling capacity is composed of a plurality of parts such as a heat receiving jacket, a coolant circulation pipe, a pump, and a radiator, which causes an increase in cost. Furthermore, the assemblability and maintainability are poor due to the nature of using the coolant.

  On the other hand, the heat pipe heat sink is suitable for cooling a semiconductor whose power consumption exceeds 80 W, but has two problems described later.

  The first problem is that the heat pipe of the heat pipe type heat sink circulates the refrigerant by using the vaporization by the heat absorption of the refrigerant and the liquefaction by the heat radiation. It depends on. Therefore, depending on the installation method of the information processing apparatus, the cooling performance is deteriorated because the refrigerant inside the heat pipe does not go to the heat absorption part or does not return.

  As described above, since the cooling capacity is affected by the installation direction of the heat pipe, the cooling capacity varies depending on the installation method in the information processing apparatus having the two types of installation methods of vertical installation and horizontal installation. That is, the installation form of a personal computer (hereinafter referred to as a PC server) as an information processing apparatus is roughly divided into two cases, that is, a case where the substrate is oriented vertically and a case where it is oriented horizontally. Therefore, when using a heat pipe heat sink, the direction of installation must be taken into account.

  The second problem is that in a computer equipped with a plurality of central processing units, since the central processing units are mounted adjacent to each other, the installation area of the cooling module is limited. Due to this limitation, in order to increase the cooling efficiency of the heat pipe heat sink, the fins must be enlarged in the direction perpendicular to the substrate, which becomes a factor of increasing the height.

  Therefore, an object of the present invention is to provide a heat pipe heat sink having a constant cooling performance regardless of the installation direction, and to improve the cooling capacity while suppressing the height of the heat pipe heat sink as much as possible.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A heat pipe heat sink according to the present invention is bent into an L shape, fixed to a plurality of heat pipes, one of which is a heat absorbing unit and the other of which is a heat radiating unit, and the heat absorbing unit side of the plurality of heat pipes, and receives heat from a semiconductor element. A pedestal that transfers heat to the heat absorption parts of a plurality of heat pipes and a plurality of heat radiation fins that are fixed to the heat radiation part side of the plurality of heat pipes and radiate the heat transferred from the heat radiation parts of the plurality of heat pipes The pedestal is fixed to the semiconductor element mounted in the vertical direction or the horizontal direction in a direction that ensures a certain liquid drop between the heat absorption part and the heat dissipation part of the heat pipe.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  According to the present invention, it is possible to eliminate a difference in cooling capacity caused by a difference in installation method that causes a problem in a computer having two types of installation methods of vertical installation and horizontal installation. There is no need to change the orientation of the installation.

  Further, according to the present invention, when the heat pipe type heat sink is installed adjacently, the cooling fin area can be increased, and the limited installation space can be used effectively.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

<Configuration of heat pipe heat sink>
The configuration of the heat pipe heat sink according to one embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a side view showing a configuration of a heat pipe heat sink according to an embodiment of the present invention, and FIG. 2 is a schematic diagram showing a configuration of a heat pipe heat sink according to an embodiment of the present invention. For this reason, the periphery of one heat pipe is cut out. FIG. 3 is an exploded view showing components of a heat pipe heat sink according to an embodiment of the present invention, where (a) shows cooling fins, (b) shows heat pipes, and (c) shows a pedestal.

  1 to 3, the heat pipe heat sink includes a heat pipe 41, a cooling fin 42, and a pedestal 43.

  The heat pipe heat sink is placed on the heat radiation surface of a semiconductor element such as the central processing unit 18 on the mother board 16 fixed to the PC server body 13. For fixing the heat pipe heat sink, a screw fixing stud 61 and a fixing screw 62 are used, or a leaf spring clip or the like is used.

  The heat pipe 41 is subjected to an L-shaped bending process so as to satisfy the same cooling capacity in the two installation forms of the PC server described above. The angle of the L-shaped bend is preferably set between 90 degrees and 110 degrees in consideration of the case where a plurality of heat pipe heat sinks are installed adjacent to each other for the reason described later, but the specific angle is arbitrary. It is.

  The outer diameter of the heat pipe 41 is arbitrary, but the above-described L-shaped bending process is possible, and the heat pipe heat sink has a sufficient capacity to cool the semiconductor elements such as the central processing unit 18 to be cooled. The outer diameter is satisfactory.

  The cooling fins 42 are thin plates made of a material such as copper or aluminum having a plate thickness of 1 mm or less, and holes for fixing to the heat pipes 41 are opened by the number of heat pipes 41 to be attached. Further, the thickness, area, and number of attached cooling fins 42 are arbitrary, but the semiconductor elements such as the central processing unit 18 to be cooled by the heat pipe heat sink are cooled in consideration of the positions of the attachment holes described above. A value sufficient for

  The pedestal 43 is made of a material such as copper or aluminum, and the shape, thickness, and area of the pedestal 43 can sufficiently absorb the heat generated from the semiconductor elements such as the central processing unit 18 to be cooled by the heat pipe heat sink, and the substrate. It is set to a value that can be fixed to the semiconductor element such as the above central processing unit 18 by a fixing screw 62 or a leaf spring clip.

  Moreover, the L-shaped one end of the heat pipe 41 is fixed to the pedestal 43 by welding or the like, and the pedestal side of the heat pipe 41 serves as a heat absorbing portion. One end of the heat pipe 41 that is not fixed to the pedestal 43 is passed through the mounting hole of the cooling fin 42 and fixed by welding, caulking, or the like, and the cooling fin 42 side of the heat pipe 41 is a heat radiating portion. The cooling fin 42 is fixed so that the plane of the cooling fin 42 is perpendicular to the heat pipe 41.

<Example of PC server installation mode>
Next, with reference to FIG. 4 to FIG. 6, an installation form of a PC server on which a heat pipe heat sink according to an embodiment of the present invention is mounted will be described. FIG. 4 is a configuration diagram showing an installation mode of a pedestal type PC server on which a heat pipe type heat sink according to an embodiment of the present invention is mounted, and FIG. 5 is a diagram illustrating the mounting of the heat pipe type heat sink according to an embodiment of the present invention. FIG. 6 is a perspective view showing a basic structure of a PC server as an information processing apparatus mounted with a heat pipe heat sink according to an embodiment of the present invention. It is the perspective view which looked at the inside of the state which opened the top plate of PC server from the back side.

  First, the first installation form of the PC server is a form called a pedestal type installed on a floor surface or the like as shown in FIG. As shown in FIG. 4, the PC server body 13 includes a top plate 111 made of a plastic mold material or a painted sheet metal material, left and right side plates 112, and a bottom plate 115 having parts such as legs for preventing the fall. The front bezel 114 having a design that also serves as a door and a cover is mounted on the front surface. In the example shown in FIG. 4, the mother board 16 is vertically mounted in the PC server main body 13, and the heat pipe heat sink 100 is mounted on the central processing unit 18 on the mother board 16.

  Further, the second installation form of the PC server is a form called a rack mount type mounted on a 19-inch rack 121 as shown in FIG. In this embodiment, as shown in FIG. 5, the slide rail 120 and the mounting flange 119 are fastened to the PC server body 13 and can be installed in the 19-inch rack 121 via the slide-rail fittings provided on the 19-inch rack 121. It is what. In the example shown in FIG. 5, the mother board 16 is mounted horizontally in the PC server main body 13, and the heat pipe heat sink 100 is mounted on the central processing unit 18 on the mother board 16.

  Further, a PC server as an information processing apparatus on which a heat pipe type heat sink as shown in FIG. 6 is mounted includes a motherboard 16 made of semiconductors, a central processing unit 18, an HDD 31, an FD / CD 32, a fan in a PC server main body 13. 33, a 5-inch device 34 which is a tape device such as DAT, a power source 35, a PCI card device 36, a back panel 37, a memory 39, and the like. In the illustrated example, the heat pipe heat sink 100 according to the embodiment of the present invention is attached to the central processing unit 18 on the mother board 16.

  Usually, the upper part of the central processing unit 18 has a structure to which a heat sink made of a metal such as aluminum or copper can be attached, and a screw hole or the like is provided. Further, as described above, ventilation by a fan is performed so that air is sucked from the front surface and exhausted from the back surface due to restrictions on the installation form of the rack mount type equipment.

  In the example shown in FIG. 6, the PC server can be installed either horizontally or vertically, and normally can be installed horizontally and vertically in one direction.

  As shown in FIGS. 4 to 6, the heat pipe type heat sink mounted on the central processing unit 18 on the mother board 16 is different depending on the installation form of the mother board 16 in the PC server depending on the installation form of the PC server. The mounting direction has a horizontal direction and a vertical direction.

<Installation form of heat pipe heat sink>
Next, a mounting form of the heat pipe heat sink according to an embodiment of the present invention will be described with reference to FIGS. FIG. 7 is a diagram showing a horizontal mounting configuration of a heat pipe heat sink according to an embodiment of the present invention, and FIG. 8 is a vertical mounting configuration of a heat pipe heat sink according to an embodiment of the present invention. FIG. 7 shows the case of the second installation mode described above, where the motherboard 16 is mounted horizontally, and FIG. 8 shows the case of the first installation mode described above, where the motherboard 16 is mounted vertically. This is an implementation form. 7 and 8 show a case where there are two semiconductor elements such as the central processing unit 18.

  In FIG. 7, the heat pipe heat sink has a drop as shown in FIG. 7 so that the heat in the heat pipe 41 can be easily returned to the pedestal 43 after releasing the heat absorbed by the pedestal 43 side. Is mounted with the pedestal 43 facing downward.

  Further, in FIG. 8, the heat pipe type heat sink has a drop as shown in FIG. 8 so that the heat in the heat pipe can be easily returned to the pedestal 43 after releasing the heat absorbed by the pedestal 43 side at the cooling fin 42 part. In order to provide, the cooling fin 42 is mounted with the fixed end facing upward.

  By mounting the heat pipe heat sink in the direction shown in FIGS. 7 and 8, a constant cooling performance can be obtained regardless of the two installation forms of the PC server described above.

  FIGS. 7 and 8 are one example following the installation form of the PC server, but the important point in this embodiment is the orientation of the semiconductor elements such as the mother board 16 on which the heat pipe type heat sink is mounted and the central processing unit 18. Is to select an installation direction in which the above-mentioned head can be provided in the heat pipe type heat sink depending on whether it is vertical or horizontal.

  In addition, when the PC server can be installed either horizontally or vertically, the heat pipe is arranged so that the horizontal installation is as shown in FIG. 7 and the vertical installation is as shown in FIG. Equipped with a heat sink.

  As described above, in this embodiment, the heat pipe type heat sink composed of the heat pipe 41 bent in the L-shape, the cooling fins 42, and the pedestal 43 has a constant liquid drop regardless of the installation form of the PC server. It is possible to eliminate the difference in cooling capacity due to the difference between the two types of installation methods of PC server vertical and horizontal installation by mounting so as to ensure the heat pipe type heat sink It becomes possible to eliminate the need to change the installation direction.

<Mounting of adjacent heat pipe heat sink>
Next, the case where the heat pipe type heat sink according to the embodiment of the present invention is installed adjacent to each other will be described with reference to FIGS. 9 and 10. FIG. 9 and FIG. 10 are configuration diagrams showing a case where a heat pipe heat sink according to an embodiment of the present invention is installed adjacent to each other, and a semiconductor element such as the central processing unit 18 to be cooled is placed on the substrate. FIG. 9 shows a configuration in which the cooling fins 42 are overlapped by changing the L-shaped bending angle of the heat pipe 41 so that the area of the cooling fins 42 can be made as large as possible even when they are installed adjacent to each other. Shows a configuration in which the cooling fins 42 are overlapped by subjecting the cooling fins 42 to step bending.

  When semiconductor elements such as the central processing unit 18 are installed adjacent to each other, it is usually necessary to reduce the cooling fin area so that the cooling fins 42 of adjacent heat pipe heat sinks do not interfere with each other.

  For this reason, in order to increase the cooling efficiency of the heat pipe heat sink, the cooling fins must be enlarged in the direction perpendicular to the substrate, which causes the height to rise, but as shown in FIGS. 9 and 10 Moreover, even if the area of the cooling fin 42 is increased by offsetting the portion where the adjacently installed cooling fins overlap, the cooling fin 42 can be mounted without causing interference.

  In the example shown in FIG. 9, even if the heat pipe type heat sink is installed adjacently by setting the L-shaped bending angle of the heat pipe 41 between about 91 degrees and 100 degrees, it is indicated by the wavy line in FIG. As described above, the cooling fins 42 can overlap and can be mounted with a large cooling fin area without causing the cooling fins 42 to interfere with each other. The specific angle of the L-shaped bending of the heat pipe needs to be determined in consideration of the relative distance between adjacent heat pipe heat sinks.

  In addition, by making it possible to change the position of the cooling fins 42, the cooling fins 42 can be overlapped with respect to the L-shaped bending angle of any heat pipe 41 and the relative distance between the heat pipe heat sinks. is there.

  Although FIG. 9 shows an example in which the L-shaped bending angle of the heat pipe 41 is changed, the fixing angle of the cooling fin 42 with respect to the heat pipe 41 is changed while the L-shaped bending angle of the heat pipe 41 remains unchanged. It may be.

  Further, in FIG. 10, by performing step bending on the cooling fins 42, even if heat pipe heat sinks are installed adjacent to each other, the cooling fins 42 overlap and cool as shown by the wavy lines in FIG. 10. The fins 42 can be mounted with a large cooling fin area without causing interference.

  Moreover, even if it combines FIG. 9, FIG. 10, even if it installs a heat pipe type heat sink adjacently by setting the heat pipe 41 to an appropriate L-shaped bending angle, it does not interfere with the cooling fin 42, It can be mounted with a large cooling fin area.

  As described above, even when the heat pipe type heat sink is installed adjacently, the area of the cooling fin 42 can be increased. Therefore, the semiconductor element such as the central processing unit 18 is installed adjacently. However, it is possible to cool the cooling fin 42 without increasing it.

<Other configuration of heat pipe type heat sink>
Next, another configuration of the heat pipe heat sink according to the embodiment of the present invention will be described with reference to FIGS. 11 and 12. FIG. 11 is a configuration diagram showing another configuration of a heat pipe heat sink according to an embodiment of the present invention, where (a) is a top view, (b) is a side view, and (c) is a front view. Yes. FIG. 12 is a configuration diagram showing another configuration of the heat pipe heat sink according to the embodiment of the present invention, in which (a) shows a top view and (b) shows a front view.

  In FIG. 11, the heat pipe heat sink has a configuration in which heat pipes 41 bent in an L shape are alternately arranged on a pedestal 43 so that the fixed ends of the cooling fins 42 are opposite to each other.

  In FIG. 12, the heat pipe type heat sink is an L-shaped bend of the heat pipe 41 so that the refrigerant aggregated at the heat radiating part (returned from the vapor to the liquid) in the heat pipe type heat sink shown in FIG. The angle is larger than 90 degrees and the L-shaped bending angle is set to the outside.

  As shown in FIG. 11, by arranging the heat pipes 41 so that the fixed ends of the cooling fins 42 are alternately reversed, the heat pipes 41 are alternately mounted in the vertical mounting state and in the vertical two-way mounting state. Since the fixed end of one of the cooling fins 42 of the heat pipe 41 arranged in the opposite direction faces upward, it is easy to return to the pedestal 43 after releasing the heat absorbed by the refrigerant in the heat pipe at the fin portion. As shown in FIG. 8, not only the mounting state mounted on the PC server vertically placed in one direction (when the motherboard 16 is located on the left side) as shown in FIG. 8, but also in the opposite direction Even in a mounted state mounted on a vertically placed PC server (when the mother board 16 is located on the right side), it is possible to obtain cooling performance.

  As shown in FIG. 12, by setting the L-shaped bending angle of the heat pipe 41 to the outside, the refrigerant aggregated in the heat radiating portion easily returns to the pedestal 43 side of the heat pipe 41, and the cooling efficiency can be increased. .

  Further, since the L-shaped bending angle of the heat pipe 41 is set to the outside, even if the motherboard 16 in the PC server is not installed vertically but is arranged at a slightly inclined position, the refrigerant is not heated. The refrigerant condensed in the heat radiating part on the cooling fin 42 side can return to the pedestal 43 side of the heat pipe 41, and the cooling efficiency can be maintained.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

It is a side view which shows the structure of the heat pipe type heat sink which concerns on one embodiment of this invention. It is a schematic diagram which shows the structure of the heat pipe type heat sink which concerns on one embodiment of this invention. It is an exploded view which shows the component of the heat pipe type heat sink which concerns on one embodiment of this invention. It is a block diagram which shows the installation form of the pedestal type PC server which mounts the heat pipe type heat sink which concerns on one embodiment of this invention. It is a block diagram which shows the installation form of the rack mount type PC server which mounts the heat pipe type heat sink which concerns on one embodiment of this invention. It is a perspective view which shows the fundamental structure of the PC server as an information processing apparatus which mounts the heat pipe type heat sink which concerns on one embodiment of this invention. It is a figure which shows the mounting form of the horizontal direction of the heat pipe type heat sink which concerns on one embodiment of this invention. It is a figure which shows the mounting form of the vertical direction of the heat pipe type heat sink which concerns on one embodiment of this invention. It is a block diagram which shows the case where the heat pipe type heat sink which concerns on one embodiment of this invention is installed adjacently. It is a block diagram which shows the case where the heat pipe type heat sink which concerns on one embodiment of this invention is installed adjacently. It is a block diagram which shows the other structure of the heat pipe type heat sink which concerns on one embodiment of this invention. It is a block diagram which shows the other structure of the heat pipe type heat sink which concerns on one embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 13 ... PC server main body, 16 ... Mother board, 18 ... Central processing unit, 31 ... HDD, 32 ... FD / CD, 33 ... Fan, 34 ... 5-inch device, 35 ... Power supply, 36 ... Card device, 37 ... Back panel , 39 ... Memory, 41 ... Heat pipe, 42 ... Cooling fin, 43 ... Base, 61 ... Screw fixing stud, 62 ... Fixing screw, 100 ... Heat pipe heat sink, 111 ... Top plate, 112 ... Side plate, 114 ... Front Bezel, 115 ... bottom plate, 119 ... mounting flange, 120 ... slide rail, 121 ... 19 inch rack.

Claims (3)

A plurality of heat pipes bent into an L shape, one of which is a heat absorbing portion and the other is a heat radiating portion;
A pedestal that is fixed to the heat-absorbing part side of the plurality of heat pipes and transfers heat received from a semiconductor element to the heat-absorbing part of the plurality of heat pipes;
A plurality of heat dissipating fins that are fixed to the heat dissipating part side of the plurality of heat pipes and dissipate heat transferred from the heat dissipating part of the plurality of heat pipes;
The pedestal is fixed to the semiconductor element mounted in the vertical direction or the horizontal direction between the heat absorbing portion and the heat radiating portion of the heat pipe in a direction that ensures a certain liquid drop. Heat pipe type heat sink. In the heat pipe type heat sink according to claim 1,
When mounting a plurality of the heat pipe heat sinks adjacent to each other,
A plurality of cooling fins of the first and second heat pipe heat sinks are fixed non-parallel to the pedestal at a certain angle, and the first heat pipe heat sink and the second heat pipe heat sink A heat pipe type heat sink characterized by overlapping cooling fins. In the heat pipe type heat sink according to claim 1,
When mounting a plurality of the heat pipe heat sinks adjacent to each other,
A plurality of cooling fins of the first and second heat pipe heat sinks are subjected to step bending to overlap the cooling fins of the first heat pipe heat sink and the second heat pipe heat sink. Heat pipe type heat sink.

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