JP2005340184A - Led lighting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lighting apparatus which is light-weighted and has high accuracy and high efficiency of illumination intensity, and can realize light distribution change easily by a stress from the outside, and has enough freedom in design of light distribution. <P>SOLUTION: The LED lighting apparatus 10 can be obtained in which the substrate main part 14 is formed by forming a heat resisting film having thermoplasticity in a prescribed three-dimensional shape reflecting a targeted irradiation range as a whole, and a reflecting face 16 for reflecting the light is installed on the surface where the LEDs 12 are mounted as a light source, and a conductive circuit 18 is formed on the rear face, thereby which is full of flexibility and is easy to change light distribution by displacing the LED mounting portion by the stress from the outside, and has a high light illumination efficiency with light weight and high accuracy. Since a plurality of LEDs 12 are arranged on the surface of the LED lighting apparatus 10, reduction of illumination intensity at the time of light distribution change can be prevented. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an LED lighting device in which an LED light source, a mounting substrate, and a reflecting surface are integrated, and particularly relates to an LED lighting device capable of performing variable light distribution.

  In recent years, LEDs (light-emitting diodes) with characteristics such as low power consumption and long life have been expected to be used as light sources for lighting fixtures due to their high brightness. There is a need for lighting fixture designs that increase

  On the other hand, in each lighting field such as automobile lighting, store lighting, and crime prevention lighting, in addition to the demand for low power and miniaturization, variable light distribution lighting that can change the irradiation position according to the external situation and environment is required. .

  Based on such a situation, as a technique for improving the illuminance efficiency of the LED, a method has been proposed in which a reflective concave portion obtained by plating is provided on a flexible circuit board using a polyimide film and an LED element is mounted in the concave portion. (For example, refer to Patent Document 1).

  According to this technology, it is possible to improve the illuminance efficiency of the LED to some extent, but since the reflective recess is formed within the thickness range of the flexible substrate, the height of the reflective recess is limited, and the element mounting Even in this case, there is a problem that the light from the element cannot be sufficiently reflected and utilized.

  On the other hand, as a technique for changing the irradiation position according to the external situation and environment, a method of controlling the light distribution by mounting an LED element (LED chip) on a flexible circuit board based on polyimide and bending the board Has been proposed (see, for example, Patent Document 2).

  According to such a technique, it is possible to change the light distribution of the light emitted from the LED, but since the flexible wiring board is formed in a planar shape, even if it is arranged in a curved line, irradiation with a single substrate is possible. There was a problem that the range was limited and the degree of freedom of light distribution was limited. Moreover, in order to hold | maintain the three-dimensional arrangement | positioning of a flexible wiring board, there also existed a problem that the holding structure had to be prepared separately.

In addition, as a technique for obtaining variable light distribution from a single light source such as a halogen bulb, a film reflector formed by forming a polyimide film into a bowl shape and vapor-depositing metal on its inner surface, utilizing the flexibility of the film, A technique is known in which the film reflector is deformed by an external stress to change the irradiation range (see, for example, Patent Document 3). Since this is a technique for deforming or operating the part, there is a problem that it is difficult to perform light distribution control accompanying movement of the focal point.
Japanese Patent Publication No. 8-264841 (page 2-3, FIG. 1) Japanese Patent Publication No. 11-163212 (page 9) Japanese Patent Laying-Open No. 2003-151328 (page 2-7)

  Therefore, the main problem of the present invention is to solve the above-mentioned problems, make it light and highly accurate, have high illuminance efficiency, and can easily control the light distribution by external stress, and can freely control the light distribution. It is providing a high LED lighting apparatus.

  The invention described in claim 1 is described as follows: “a substrate main body 14 in which a heat-resistant film having thermoplasticity is formed into a predetermined three-dimensional shape, a plurality of LEDs 12 mounted at predetermined positions on the surface of the substrate main body 14, a substrate main body 14, a reflective surface 16 that reflects light emitted from the LED 12, and a conductive circuit 18 that is provided on the LED 12 mounting portion on the back surface and the front surface of the substrate body 14, and connects the LED 12 and an external circuit to light the LED 12. It is the LED illumination device 10 characterized by the above.

  In the present invention, a heat-resistant film having thermoplasticity is formed into a predetermined three-dimensional shape reflecting the target irradiation range as a whole to form the substrate body 14 and on the surface on which the LED 12 as a light source is mounted. Since the reflecting surface 16 for reflecting the light is provided, the light distribution can be easily changed by changing the shape of the substrate body 14 using an external signal or stress, and a predetermined tertiary Even when a tall LED 12 such as a radial type is used, the light emitted from the LED 12 is sufficiently reflected without being leaked by the reflecting surface formed into the original shape, thereby condensing the light in the target irradiation range. be able to. That is, the light distribution of the light emitted from the LED 12 can be variably controlled and the illuminance efficiency can be improved.

  In addition, since the plurality of LEDs 12 are arranged on the surface of the substrate body 14, when the light distribution of the light emitted from the LEDs 12 is changed by changing the substrate body 14 from the original shape, each LED 12 is changed. Can irradiate the corresponding range, and the focal point of the light is not blurred as in the case of a single light source, and it is possible to prevent a decrease in illuminance when the light distribution changes.

  And since the back surface of the board | substrate body 14 is provided with the conductive circuit 18 connected to an external circuit and lighting LED12, the LED lighting apparatus 10 can be made thin and it shall be excellent in heat dissipation. it can.

  The invention described in claim 2 is characterized in that, in the LED lighting device 10 according to claim 1, "the heat-resistant film is an aromatic polyimide film". It is possible to obtain the substrate body 14 that is easy to mount and has high shape accuracy.

  According to a third aspect of the present invention, in the LED lighting device 10 according to the first or second aspect of the present invention, “the LED 12 mounting portion of the substrate body 14 is provided with a partial recess 20 surrounding the LED 12 in order to increase reflection efficiency. In this way, the light emitted from the LED 12 can be more effectively reflected and focused on the target irradiation range.

  The invention described in claim 4 is the LED lighting device 10 according to claims 1 to 3, wherein “a stress formed in a bent structure such as slits 26a and 26d and grooves 26b and 26c on at least a part of the substrate body 14”. The absorption part 26 is provided ".

  In this invention, since the stress absorption part 26 which consists of bending structures, such as slit 26a, 26d and groove | channel 26b, 26c, is provided in at least one part of the board | substrate body 14, external stress is given to the LED lighting apparatus 10, and primary shape is given. When controlling deformation from a predetermined shape to a secondary or subsequent shape, the LED lighting device 10 can be deformed into a predetermined shape without distortion. For this reason, the light distribution accuracy of the LED lighting apparatus 10 in the secondary and subsequent shapes can be further improved.

  The invention described in claim 5 is characterized in that, in the LED lighting device 10 described in claims 1 to 4, “the mounted LED 12 is composed of a radial type or surface mounted type LED component”. Thus, the LED lighting device 10 can be easily and efficiently manufactured simply by mounting the LED component 12, that is, the LED 12 in a form completed as a component, on the substrate body 14 provided with the reflective surface 16 and the conductive circuit 18.

  The invention described in claim 6 is characterized in that, in the LED lighting device 10 described in claims 1 to 4, "the mounted LED 12 is composed of an element, and the element is sealed with a transparent resin on the substrate body 14". Thus, by directly mounting the element itself as the LED 12 on the substrate body 14, it is possible to mount more LEDs 12 on the surface of the substrate body 14. Furthermore, by sealing the element of the LED 12 with a transparent resin, the LED element can be protected from stress such as impact applied from the outside without inhibiting the light emission of the LED 12.

  According to the present invention, a heat-resistant film having thermoplasticity is formed into a predetermined three-dimensional shape reflecting the target irradiation range as a whole to form a substrate body, and a reflective surface is formed on the surface on which the LED is mounted. In addition to providing the LED lighting device by providing a conductive circuit on the back side, the shape of the substrate body using external stress etc. in addition to the effect of increasing the reflection efficiency (i.e. illumination efficiency) in the primary shape By changing, the distribution of light emitted from the LED can be variably controlled, and the illuminance efficiency in the secondary and subsequent shapes can be improved by the reflecting surface formed in a three-dimensional shape.

  Further, since a plurality of LEDs are arranged on the surface of the substrate body, even if the light distribution of the light emitted from the LEDs is changed by changing the shape of the substrate body, each LED corresponds to each other. Since the range is irradiated, an effective light distribution can be realized without a decrease in illuminance when the light distribution changes.

  Furthermore, by providing a partial recess for increasing the reflection efficiency in the LED mounting portion of the substrate body, it is possible to more effectively reflect the light emitted from the LED and concentrate it on the target irradiation range. .

  And by providing a stress absorption part in at least a part of the substrate body, when controlling the deformation of the LED lighting device, the LED lighting device can be deformed into a predetermined shape without distortion. The light distribution accuracy of the LED lighting device in the shape can be further improved.

  Therefore, it is possible to provide an LED lighting device that is lightweight and highly accurate, has high illuminance efficiency, and can variably control the light distribution with an external stress, and has a high degree of freedom in light distribution design.

  The present invention will be described below with reference to the drawings. The LED lighting device 10 of the present invention shown in FIGS. 1 and 2 emits a plurality of LEDs 12 mounted as a light source and irradiates the light toward a predetermined irradiation range. In addition to the LEDs 12, The substrate body 14, the reflecting surface 16, and the conductive circuit 18 are included.

  The substrate body 14 is made of a heat-resistant film having thermoplasticity, maintains the form of the LED lighting device 10, and has a predetermined three-dimensional shape so that light emitted from the mounted LED 12 is irradiated toward a predetermined irradiation range. It is a molded product.

  Examples of the material of the heat-resistant film constituting the substrate body 14 include polyimide, polyamide, polyphenylene sulfide, and liquid crystal polymer, and it is particularly preferable to use a polyimide film. Thus, by using the polyimide film excellent in heat resistance as the substrate body 14, it is easy to mount the LED 12 with excellent solder heat resistance, and the substrate body 14 with high shape accuracy can be obtained. In addition, as an LED to be mounted, an LED (so-called power LED) that emits heat of about 150 to 200 ° C. at the maximum at the time of lighting is used although a current of 100 mmA or more can be input and high-luminance light can be irradiated. Even in this case, there is no concern that the substrate body 14 is deformed by the heat generated by the LEDs.

  Furthermore, a thermoplastic aromatic polyimide film is preferable in order to obtain a molded shape for improving the illuminance efficiency, that is, a predetermined three-dimensional shape with high accuracy.

  Aromatic polyimide is a condensate of aromatic tetracarboxylic acid and aliphatic or aromatic diamine, typically tetracarboxylic dianhydrides such as pyromellitic dianhydride and biphenyltetracarboxylic dianhydride. And a diamine such as paraphenylenediamine and diaminodiphenyl ether to produce an amic acid, which is obtained by ring-closing curing with heat or a catalyst. The thermoplastic polyimide can be obtained, for example, by copolymerizing the following compounds.

  Examples of dicarboxylic acid anhydrides include pyromellitic dianhydride, 4,4′-oxydiphthalic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,2 ′, 3,3′biphenyltetracarboxylic dianhydride, 2,2′-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride Bis (3,4-dicarboxyphenyl) sulfone dianhydride, bis (3,4-dicarboxyphenyl) sulfide dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3 , 4-dicarboxyphenyl) methane dianhydride, 1,1-bis (2,3-dicarboxyphenyl) methane dianhydride, 1,1-bis (2,3-dicarboxyphenyl) propan Anhydride, 2,2-bis (3,4-carboxyphenyl) propane dianhydride, m- phenylene bis (trimellitic acid) may be mentioned dianhydrides like.

  Examples of diamines include hexamethylenediamine, heptamethylenediamine, 3,3′-dimethylpentamethylenediamine, 3-methylhexamethylenediamine, 3-methylheptamethylenediamine, 2,5-dimethylhexamethylenediamine, octamethylenediamine, and nona. Methylenediamine, 1,1,6,6-tetramethylhexamethylenediamine, 2,2,5,5-tetramethylhexamethylenediamine, 4,4-dimethylheptamethylenediamine, decamethylenediamine, m-phenylenediamine, 4 , 4′-diaminobenzophenone, 4-aminophenyl-3-aminobenzoate, m-aminobenzoyl-p-aminoanilide, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, bis (4-aminophenyl) Nyl) methane, 1,1-bis (4-aminophenyl) ethane, 2,2-bis (4-aminophenyl) propane, 2,2′-bis [4- (4-aminophenoxy) phenyl)] propane, 4,4′-diaminodiphenyl sulfoxide, 3,3′-diaminobenzophenone, 1,3-bis (4-aminophenoxy) benzene, 2,2′-diaminozenzophenone, 1,2-bis (4-aminophenoxy) ) Benzene, 1,3-bis (4-aminobenzoyloxy) benzene, 4,4′-dibenzanilide, 4,4′-bis (4-aminophenoxy) phenyl ether, 2,2′-bis (4-aminophenyl) Hexafluoropropane, 2,2′-bis (4-aminophenyl) -1,3-dichloro-1, 1,3,3-hexafluoropropane, 4,4′- Diaminodiphenyl sulfone, 1,12-diamino-dodecane, 1,13-diamino dodecane, etc. polysiloxane diamine.

  Among the above compounds, the thermoplastic polyimide used in the present invention includes 1,3-bis (4-aminophenoxy) benzene (abbreviated as RODA), pyromellitic dianhydride (abbreviated as PMDA) and 4, Copolymer of 4′-oxydiphthalic dianhydride (ODPA), 4,4′-diaminodiphenyl ether (abbreviated as ODA) and 3,3′4,4′-biphenyltetracarboxylic dianhydride (abbreviated as BPDA) Copolymer with ODA, PMDA and BPDA, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and PMDA with 2,2′-bis [4- A copolymer with (4-aminophenoxy) phenyl)] propane (abbreviated as BAPP) is particularly preferable.

  The thermoplastic polyimide is softened by heating. In the present invention, the glass transition temperature is preferably 200 to 350 ° C., more preferably 210 to 320 ° C. from the viewpoint of solder heat resistance during LED mounting. Preferably it is 250 to 310 degreeC. The thermoplastic polyimide preferably has a breaking elongation at the glass transition temperature of 100 to 700%, and more preferably 150 to 400%.

  The thickness of the film formed of the material as described above and formed on the substrate body 14 is preferably 12.5 to 175 μm, more preferably 25 to 130 μm from the viewpoints of flexibility and heat dissipation. Moreover, it is preferable that the thermal expansion coefficient of a film is 5-60 ppm / degrees C in the location where the wiring after shaping | molding exists.

  Examples of a method for forming the substrate body 14 using such a heat-resistant film having thermoplasticity include a vacuum forming method and a press forming method, but the method is not particularly limited as long as it does not cause cracks or wrinkles. It is not a thing.

  Here, as the molding shape (three-dimensional shape) of the substrate main body 14, in addition to the bowl shape or the bowl shape shown in FIGS. In consideration of the secondary and subsequent light distribution at the time of light distribution change, any shape as long as the above thermoplastic / heat-resistant film follows without tearing during molding processing It may be.

  A plurality of LED 12 mounting portions are provided at predetermined positions on the surface of the substrate body 14. As for the local molding shape of the LED 12 mounting portion, in order to increase the reflection efficiency of the LED 12, as shown in FIG. 1 and FIG. 2, a concave portion 20 having a sufficiently deep wall surface is formed. However, for the purpose of increasing the positional accuracy, that is, the mounting accuracy by fitting the surface-mounted LED and the radial LED, as shown in FIG. It may be. Furthermore, when it is not necessary to improve the local reflection efficiency with the overall shape design, it is not necessary to provide the local recess 20 or 22 in the LED 12 mounting portion as shown in FIG.

  A hole for a through hole 24 through which the lead wire 12a of the LED 12 or the like is inserted is provided in a portion where the LED 12 is mounted on the substrate body 14 formed in the shape as described above.

  As shown in FIGS. 1 and 2, a pair of slits 26 a designed so as not to cut the wiring of the LED 12 in the vicinity of the LED 12 mounting portion of the substrate body 14 (to reach the outer edge portion 28), and the slits 26 a One or a plurality of (two in FIG. 1 and FIG. 2) stress absorbing portions 26 each having a bent structure having a groove 26b connecting the tips of the two are provided, and stress is applied to the substrate body 14 from the outside. In this case, the LED 12 mounting portion may be displaced without distortion independently of other LED 12 mounting portions. Here, when the slit 26a is provided, a concave groove is formed in the slit 26a forming portion, and then, if the bottom portion of the concave groove is slit, the separated concave groove becomes the flange 27, and the shape of the slit 26a forming portion is formed. It will be useful for retention.

  The stress absorbing portion 26 is not limited to the above-described slit 26a and groove 26b. For example, when the primary shape of the substrate body 14 is formed in a curved plate shape as shown in FIG. Only the two grooves 26 c provided so as to be parallel to each other in the width direction can be used as the stress absorbing portion 26. In addition to this, as shown in FIG. 6, a single slit 26d is provided in the direction substantially orthogonal to the groove 26c so as not to cut the wiring of the LED 12 mounting portion, and the stress absorbing portion 26 including this is provided. You can also. In other words, the stress absorbing portion 26 can displace some of the LED 12 mounting portions in the substrate body 14 without distortion independently of other LED 12 mounting portions when stress is applied from the outside, and the entire substrate body 14 is distorted. As long as it can be deformed into a predetermined shape without any limitation, its shape and arrangement position may be arbitrary.

  In addition to such a stress absorbing portion 26, the substrate body 14 is partially reinforced to facilitate the displacement control by partially mounting the LED 12 of the substrate body 14 and the edge portion, and the connection portion with the outside. Therefore, a separately prepared resin molded product or a metal plate may be attached.

  Further, in place of the grooves 26b and 26c described above, a pair of auxiliary plates (not shown) adjacent to the bent portion of the substrate main body 14 corresponding to the bent portion of the stress absorbing portion 26 along the bent portion. Alternatively, the substrate body 14 around the bent portion may be formed thick. By doing so, the rigidity around the bent portion in the substrate body 14 can be improved, and only the bent portion can be smoothly swung.

  In addition, it is preferable that the outer edge portion 28 of the substrate body 14 is formed in advance with a shape such as a flange or a folded portion so as to be convenient when the LED lighting device 10 is attached to a lighting fixture.

  The reflection surface 16 is a surface formed by coating a reflection material on the irradiation side surface of the substrate body 14 in order to increase the reflection efficiency of light emitted from the LED 12.

  As a composition of the reflecting material constituting the reflecting surface 16 and a method of forming the reflecting material, a metal such as aluminum or silver is coated by vapor deposition or plating, a dielectric is vapor-deposited in multiple layers, or a reflection or color rendering property is achieved. Examples include excellent resin and paint coatings. That is, the composition of the reflecting material constituting the reflecting surface 16 and the method for forming the reflecting surface 16 are not particularly limited as long as the reflectance is improved as compared with the raw polyimide film in accordance with the purpose of illumination.

  In addition, the range in which the reflective surface 16 is provided by coating the reflective material is a portion excluding the place where the insulation and circuit connection of the LED 12 mounting portion on the irradiation side surface of the substrate body 14 is hindered, and depending on the illumination purpose, It is also possible to divide the substrate body 14 and apply two or more kinds of different coatings. In addition, a coating that does not contribute to the reflection is applied to a molding part that does not contribute to the lighting effect, a molding part that is generated depending on a product design purpose, a mounting part, or a molding part that is generated due to a shape requirement on an external electrical connection. Or conversely, no coating may be applied. Furthermore, it goes without saying that a protective film can be coated for the purpose of preventing the coating material from being oxidized and damaged.

  The conductive circuit 18 is a circuit that is provided on the back surface and the front surface of the board body 14 where the LED 12 is mounted, and connects the LED 12 and an external circuit (not shown) to light the LED 12.

  As shown in FIG. 1, the conductive circuit 18 is connected to the one provided on the back surface of the substrate body 18 and the one provided on the LED 12 mounting portion on the surface of the substrate body 14 through a through hole 24. The method for creating the through hole 24 is the same as the method for creating a normal planar circuit, and is not particularly limited.

  The conductive circuit 18 is preferably formed after the substrate body 14 is formed into a predetermined three-dimensional shape in order to prevent oxidative deterioration of the conductor during the formation of the substrate body 14 and the generation of cracks due to stress. Alternatively, after a wiring process is performed in advance on a heat-resistant film having thermoplasticity, the substrate body 14 provided with the conductive circuit 18 may be obtained by forming the wiring.

  The conductive circuit 18 is produced by using a subtractive method, a semi-additive method, a full additive method, using a method in which metal deposition is performed after the substrate body 14 is formed, followed by electrolytic plating, or a method in which electroless plating is performed after forming. Either of these methods may be used, or a method of obtaining a circuit pattern by removing unnecessary conductor portions using laser processing may be used. Furthermore, a method of transferring a circuit created from a metal foil via an adhesive may be used, or a method of drawing a circuit using a conductive paste may be used.

  When the conductive circuit 18 is formed by these methods, the conductor metal is preferably made of copper. However, when the conductive paste is used, a silver paste may be used, depending on the requirements of the mounting process. For example, it is needless to say that different metals or alloys such as solder, tin, gold and nickel can be plated. In addition, when vapor deposition is used, it goes without saying that a metal such as chromium or nickel can be vapor-deposited in order to increase the adhesion between the substrate body 14 and the metal or prevent oxidation.

  In order to protect the conductive circuit 18, it is preferable to apply a resist ink on the surface of the circuit 18 or adhere a cover film formed in the same shape as the substrate body 14 in order to improve reliability. The material of the cover film is preferably a heat-resistant film having the same kind of thermoplasticity as that of the substrate body 14, for example, a polyimide film, when heat resistance is required depending on the order of the manufacturing process, but is not limited thereto. . Note that the position of the terminal of the conductive circuit 18 connected to an external circuit (not shown) is not limited.

  Then, the LED lighting device 10 is completed by mounting the LED 12 using the solder 30 or the like on the LED 12 mounting portion of the substrate body 14 provided with the reflecting surface 16 on the front surface and the conductive circuit 18 on the back surface.

  Here, when an element is mounted as the LED 12, either wire bonding or flip chip bonding can be applied, and an anisotropic conductive film, a conductive paste, or the like can also be used. In addition, when the LED element is used as described above, it is preferable to seal the surface of the mounted element with a transparent resin 32 made of an epoxy resin or the like, as shown in FIG. This is because the LED element can be protected from stress such as impact given from the outside without inhibiting the light emission of the LED 12, and the life of the LED lighting device 10 can be extended.

  According to the LED lighting device 10 of the present invention configured as described above, the substrate body 14 is formed by forming a heat-resistant film having thermoplasticity into a predetermined three-dimensional shape reflecting the target irradiation range as a whole. Since the reflective surface 16 that reflects light is provided on the surface on which the LED 12 that is a light source is mounted, the light distribution is achieved by changing the shape of the substrate body 14 using an external signal or stress. Even when a relatively tall LED 12 such as a radial type is used, the light emitted from the LED 12 is sufficiently generated by the reflecting surface formed into a predetermined three-dimensional shape. It is possible to collect light in the target irradiation range by reflecting without leakage. That is, the light distribution of the light emitted from the LED 12 can be variably controlled and the illuminance efficiency can be improved.

  In addition, since the plurality of LEDs 12 are arranged on the surface of the substrate body 14, when the light distribution of the light emitted from the LEDs 12 is changed by changing the substrate body 14 from the original shape, each LED 12 Each of the corresponding ranges can be irradiated, and the focal point of the light is not blurred as in the case of a single light source, and a desired light distribution can be obtained without a decrease in illuminance when the light distribution changes.

  And since the back surface of the board | substrate body 14 is provided with the conductive circuit 18 connected to an external circuit and lighting LED12, the LED lighting apparatus 10 can be made thin and it shall be excellent in heat dissipation. it can.

  Here, when mounting LED12 of the form completed as a radial type or surface mount type LED component, ie, component, as LED12, the LED lighting apparatus 10 can be manufactured simply and efficiently. On the other hand, when the element itself is mounted as the LED 12, more LEDs 12 can be mounted on the surface of the substrate body 14.

  Moreover, by providing the partial recessed part 20 for improving reflection efficiency in the LED12 mounting part of the board | substrate body 14, the light emitted from LED12 is reflected more effectively and it concentrates on the target irradiation range. Can do.

  And when the stress absorption part 26 is provided in the vicinity of some LED12 mounting parts in the board | substrate body 14, an external stress is given to the LED illuminating device 10, and a deformation | transformation control is carried out from a primary shape to the shape after a predetermined secondary. In this case, the LED lighting device 10 can be deformed into a predetermined shape without distortion. For this reason, the light distribution accuracy of the LED lighting apparatus 10 in the secondary and subsequent shapes can be further improved.

  In the above-described example (embodiment), the reflective surface 16 is coated with a protective film to protect the reflective surface 16, and resist ink is applied to or covered with the conductive circuit 18 to protect the conductive circuit 18. Although the bonding of the film has been described, the entire surface of the LED lighting device 10 may be protected by the following method instead of these methods. That is, a transparent resin solution made of a fluorine resin or an epoxy resin is applied to the entire surface of the completed LED lighting device 10 by a known method such as dipping, and this is dried to be transparent on the entire surface of the LED lighting device 10. A thin resin thin film may be formed. According to such a method, the protective film can be simultaneously formed on both surfaces of the substrate body 14 in one step. That is, a protective film can be formed on the entire LED lighting device 10 efficiently and economically. Further, by using a transparent resin solution made of a fluororesin in particular, it is possible to prevent the reflective material from being oxidized and scratched on the reflective surface 16, and the resin thin film is covered in the conductive circuit 18 formation portion. By functioning as a film, the insulation and reliability of the conductive circuit 18 can be improved, and at the same time, antifouling can be imparted to the entire surface of the LED lighting device 10.

  The LED lighting device 10 of the present invention has a thin substrate body 14 and excellent heat dissipation. However, a heat sink (not shown) is provided on the back surface of the substrate body 14 corresponding to the LED 12 mounting portion. Also good. By providing such a heat radiating plate, the heat generated by the LED 12 can be radiated more efficiently, and the change in color tone and the life of the LED 12 can be prevented more reliably.

  EXAMPLES Hereinafter, although this invention is demonstrated concretely based on an Example, the technical scope of this invention is not limited to these Examples.

[Example 1] (See FIGS. 1 and 2)
As a heat-resistant film having thermoplasticity, “Kapton (registered trademark)” 500SKJ (thickness 125 μm) manufactured by Toray DuPont Co., Ltd. is used, and as shown in FIG. 1 and FIG. Then, a molded body having a plurality of molding recesses 20 formed with a curvature so as to increase the reflection efficiency and having a three-dimensional shape (in the case of this embodiment) that is designed to collect light as a whole, The substrate body 14 was obtained by forming by a vacuum forming method so as not to be wrinkled or distorted, and drilling for the through hole 24 for inserting the lead wire 12a of the LED 12. A pair of concave grooves to be slit later and a groove 26b for connecting the tips of the concave grooves are formed in advance on the substrate body 14 at positions facing each other.

  Subsequently, the substrate main body 14 is subjected to plasma processing to activate the surface, and after masking portions other than the mounting portion on the irradiation surface side (front side), nickel, chrome, copper deposition is performed on both surfaces, and 300Å After that, an 18 μm conductor film and a through hole 24 were obtained by electrolytic copper plating. Thereafter, an LED conductive circuit 18 is formed on the substrate body 14 by photolithography, and a solder resist is applied to the surface while masking the external connection terminal portion, the through hole 24 and the reflective material coating planned portion. . Note that an external connection circuit (not shown) was formed on the back surface of the substrate body 14 at the center.

  Subsequently, the entire back surface of the substrate main body 14 and the surface of the front surface where the LED 12 is to be mounted are masked, and the reflective surface 16 is obtained by coating the surface with aluminum to a thickness of 1200 mm. The wire 12a was inserted into the through hole 24 and soldered.

  Finally, the bottom of the concave groove of the substrate body 14 is slit to form the stress absorbing portion 26 composed of the slit 26a and the groove 26b, and the outer periphery of the external connection circuit terminal portion at the center of the back surface is cut into three sides. The LED lighting device 10 of the present invention was obtained by bending an external connection terminal (not shown).

  When the obtained LED lighting device 10 is temporarily fixed to a separately prepared metal frame using the molded shape of the outer edge portion 28 and the mounting board is connected to an external LED lighting circuit, the LED 12 is lit. The primary designed range was irradiated with high illuminance. Moreover, when the part divided | segmented by the slit 26a was operated by the mechanical stress by an external motor drive, the irradiation pattern designed secondary was able to be obtained.

[Example 2] (see FIG. 7)
As a heat-resistant film having thermoplasticity, “Kapton (registered trademark)” 500SKJ (thickness 125 μm) manufactured by Toray DuPont Co., Ltd. is used. As shown in FIG. A three-dimensional shape (in this embodiment) having a locally molded portion (that is, a recess 20) having a shape that expands in a tapered shape toward the inner surface (contains the LED element), and is designed as a whole. The bowl-shaped molded body is molded by a vacuum molding method so as not to be wrinkled or distorted, and through holes 24 are drilled to obtain electrical connection between the front and back surfaces of the LED 12 element itself. Thus, the substrate body 14 was obtained. A pair of concave grooves to be slit later and a groove 26b for connecting the tips of the concave grooves are formed in advance on the substrate body 14 at positions facing each other.

  Subsequently, the substrate main body 14 is subjected to plasma processing to activate the surface, and after masking portions other than the mounting portion on the irradiation surface side (front side), nickel, chrome, copper deposition is performed on both surfaces, and 300Å After that, an 18 μm conductor film and a through hole 24 were obtained by electrolytic copper plating. Thereafter, the LED conductive circuits 18 and 30 are formed on both surfaces of the substrate body 14 by a photolithography method, and a solder resist is formed by masking the external connection terminal portion, the through hole 24 and the reflective material coating portion. After coating on the surface, the terminal part was plated with nickel. Note that an external connection circuit (not shown) was formed on the back surface of the substrate body 14 at the center.

  Subsequently, the entire back surface of the substrate body 14 and the surface of the front surface where the LED 12 is to be mounted are masked, and the reflective surface 16 is obtained by coating the surface with aluminum to a thickness of 1200 mm. The cathode electrode side of the LED 12 element is directly connected to the conductive circuit 18 with a conductive resin in the recess 22 formed with 18, and the anode side electrode on the upper side of the element is connected to the conductive circuit 18 on the surface side of the substrate body 14 by wire bonding and mounted. did. Furthermore, the recess 22 in which the LED 12 element was mounted was sealed with a transparent resin 34 such as an epoxy resin.

  Finally, the bottom of the concave groove of the substrate body 14 is slit to form the stress absorbing portion 26 composed of the slit 26a and the groove 26b, and the outer periphery of the external connection circuit terminal portion at the center of the back surface is cut into three sides. The LED lighting device 10 of the present invention was obtained by bending an external connection terminal (not shown).

  When the obtained LED lighting device 10 is temporarily fixed to a separately prepared metal frame using the molded shape of the outer edge portion 28 and the mounting board is connected to an external LED lighting circuit, the LED 12 is lit. The primary designed range was irradiated with high illuminance. Further, when the portion divided by the slit 26a was operated by a mechanical stress generated by driving an external motor, a secondary designed irradiation pattern could be obtained. Furthermore, the light irradiated by the LED 12 element could be effectively reflected even on the slope formed on the side of the recess 20.

[Example 3] (not shown)
As a heat-resistant film with thermoplastic properties, “Kapton (registered trademark)” 500SKJ (thickness 125 μm) manufactured by Toray DuPont Co., Ltd. is used. A three-dimensional reflecting plate shape that has a molding site and is designed as a whole is molded by vacuum forming so that there is no wrinkle or distortion, and electrical connection between the front and back sides is performed on the part where the LED is mounted later The substrate body was obtained by drilling a through hole for this purpose. Note that a pair of concave grooves to be slit later and a groove for connecting the tips of the concave grooves are formed in advance at positions facing each other of the substrate body.

  Subsequently, after plasma processing is performed on the substrate main body to activate the surface, masking is performed on portions other than the mounting portion on the irradiation surface side (front side), and then nickel, chromium, and copper are deposited on both surfaces to form 300 mm. A metal vapor-deposited film was obtained, and then an 18 μm conductor film and a through hole were obtained by electrolytic copper plating. After that, the LED conductive circuit is formed on the substrate body by a photolithography method, and the back surface is used as a circuit cover film except for the externally connected terminal portion of the polyimide film formed in the same shape with an adhesive. Affixed to the circuit surface.

  Subsequently, the external connection terminal portion, the LED mounting terminal portion and the reflective material coating planned portion were masked and a solder resist was applied to the surface, and then the terminal portion was tin-plated and subjected to cream soldering. The connection circuit with the outside was formed on the back surface flat portion at the center of the molded body. Next, the entire back surface of the substrate body and the LED mounting portion on the front surface were masked, and the surface was coated with aluminum to a thickness of 1200 mm by vapor deposition to obtain a reflective surface. Thereafter, the prepared surface-mounted LED chip component was mounted by a reflow soldering process.

  Finally, slit the bottom of the concave groove of the board body to form a stress absorbing part consisting of slits and grooves, cut into three sides around the external connection circuit terminal part in the center of the back surface, and bend outward to be external A connection terminal was created to obtain an LED mounting substrate of the present invention.

  The obtained LED mounting board is temporarily fixed to a separately prepared metal frame using the molding shape of the peripheral edge, and when the LED mounting board is connected to an external LED lighting circuit, the LED lights up. The primary designed range was irradiated with high illuminance. Further, when the portion divided by the slit was operated by mechanical stress generated by driving an external motor, a secondary designed irradiation pattern could be obtained.

  The LED mounting substrate of the present invention can be used for a variable light distribution illumination device.

It is a perspective view which shows the LED mounting board (radial type LED mounting) of one Example of this invention. It is the II sectional view taken on the line in FIG. It is sectional drawing which shows the LED mounting board (surface mounting type LED mounting) of one Example of this invention. It is sectional drawing which shows the LED mounting board (without a recessed part) of one Example of this invention. It is a perspective view which shows the LED mounting board (curved flat plate shape) of one Example of this invention. It is a perspective view which shows the LED mounting board (it adds a slit to FIG. 4) of one Example of this invention. It is sectional drawing which shows the LED mounting board (LED element mounting) of one Example of this invention.

Explanation of symbols

10 ... LED mounting board 12 ... LED
DESCRIPTION OF SYMBOLS 14 ... Board | substrate body 16 ... Reflective surface 18 ... Conductive circuit 20,22 ... Concave 24 ... Through hole 26 ... Stress absorption part 26a, 26d ... Slit 26b, 26c ... Groove 30 ... Solder 32 ... Transparent resin

Claims (6)

A substrate body in which a heat-resistant film having thermoplasticity is molded into a predetermined three-dimensional shape;
A plurality of LEDs mounted at predetermined positions on the surface of the substrate body;
A reflection surface provided on the surface of the substrate main body for reflecting light emitted from the LED, and provided on the LED mounting portion on the back surface and the front surface of the substrate main body, connecting the LED and an external circuit to connect the LED. An LED lighting device comprising a conductive circuit to be lit.   The LED lighting device according to claim 1, wherein the heat-resistant film is an aromatic polyimide film.   3. The LED lighting device according to claim 1, wherein the LED mounting portion of the substrate body is provided with a partial recess surrounding the LED in order to increase reflection efficiency.   The LED lighting device according to claim 1, wherein a stress absorbing portion configured by a bent structure such as a slit or a groove is provided on at least a part of the substrate body.   The LED lighting device according to claim 1, wherein the LED to be mounted is composed of a radial type or a surface mounting type LED component.   The LED lighting device according to claim 1, wherein the LED to be mounted includes an element, and the element is sealed with a transparent resin on a substrate body.

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