JP2005339112A - Image module, image input device and mounting method for solid-state image pickup element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the mounting method of an image pickup module and a solid-state image pickup element for making compact an image input device. <P>SOLUTION: A wheel 51d is perforated from a surface 51c of a reinforcing substrate 51 to a back face 51a, and a flexible substrate 52 is attached to the surface 51c of the reinforcing substrate, and anisotropic conductive adhesive 54 is poured into the hole 51d, and a light receiving part 53b formed in an opposite face 53a of the solid-state image pickup element 53 is faced to the back face 51a of the reinforcing substrate 51, and a bump 53c formed so as to be protruded from the opposite face 53a of the solid-state image pickup element 53 is inserted into the hole 51d, and the bump 53c is bonded through the anisotropic conductive adhesive 54 to the flexible substrate 52 and the reinforcing substrate 51. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an imaging module in which a solid-state imaging device is mounted on a substrate, an image input device that inputs an image with the solid-state imaging device, and a mounting method for mounting the solid-state imaging device on a substrate.

  In recent years, networking of electronic devices has progressed, communication between electronic devices has become free, and various information can be accessed from anywhere. Accordingly, the importance of security is increasing in order to prevent unauthorized access from a malicious person. One of the security technologies is a method of performing personal authentication by fingerprint, and a technology for applying the personal authentication by fingerprint to an electronic device has been proposed. For fingerprint authentication, an electronic device must be provided with an image input device for inputting a fingerprint image.

Patent Document 1 describes an image input device that inputs a fingerprint image. The image input apparatus includes a transparent cylinder that can rotate around a center line, and a selfoc lens array having a radial direction of the cylinder as an optical axis is disposed in the cylinder. Further, a line sensor, which is a solid-state image sensor, is arranged in the cylinder so as to be parallel to the center line of the cylinder, and the line sensor intersects with the optical axis of the SELFOC lens array. When inputting a fingerprint image with this image input device, if the finger is pressed against the outer peripheral surface of the cylinder at a portion intersecting with the optical axis of the SELFOC lens array, the finger is rotated by the line sensor. A fingerprint image is input by scanning line-sequentially.
JP 2004-21934 A

  By the way, there is a demand to make the image input device compact. In order to make the image input device compact, the diameter of the cylinder must be shortened. However, since the line sensor, the substrate, and the Selfoc lens array are arranged in the cylinder, the diameter of the cylinder can be easily reduced. Can not.

  Further, when the diameter of the cylinder is shortened, the space in the cylinder becomes small. Therefore, if the line sensor, substrate, and Selfoc lens array are placed in a cylinder, the distance between the line sensor and the Selfoc lens array will be shortened, and the focus will be lost unless the focal length of the Selfoc lens array is shortened. End up.

  Also, although the line sensor is mounted on the substrate, if a conductive adhesive is used at the time of mounting, the conductive adhesive may cover the light receiving part of the line sensor, resulting in a decrease in mounting yield. I will.

  Therefore, the present invention has been made to solve the above-described problems, and an object of the present invention is to make the image input device compact.

In order to solve the above problems, the invention according to claim 1
A reinforcing substrate in which a hole penetrating from one surface to the other surface is formed;
A flexible substrate attached to one surface of the reinforcing substrate;
A solid-state imaging device provided with a bump projecting from an opposing surface opposite to the other surface of the reinforcing substrate and inserted into the hole on the opposing surface, and a light receiving unit for transmitting and receiving an electrical signal through the bump on the opposing surface; ,
An imaging module including a conductive bonding material that fills the hole and bonds the bump, the flexible substrate, and the reinforcing substrate.

Preferably, a notch is formed in a portion of the reinforcing substrate and the flexible substrate that overlaps the light receiving portion in plan view.
Preferably, a hole is formed in a portion of the reinforcing substrate and the flexible substrate that overlaps the light receiving portion in plan view.
Preferably, a portion of the reinforcing substrate and the flexible substrate that overlaps the light receiving portion in plan view is provided transparently.
Preferably, a wiring circuit is patterned on the flexible substrate, and the bumps are electrically connected to the wiring circuit by the conductive bonding material.
Preferably, the conductive bonding material is an anisotropic conductive adhesive having conductivity in a penetration direction of the hole.

  In the above invention, the flexible substrate is attached to one surface of the reinforcing substrate, the solid-state imaging device is mounted on the other surface of the reinforcing substrate, and the solid-state imaging device has the light receiving portion on the opposite surface facing the reinforcing substrate. The light receiving portion of the solid-state imaging device can be arranged as far from the optical system as the thickness of the reinforcing substrate and the flexible substrate. Therefore, the focus is not lost even if the focal length of the optical system is not shortened.

  Further, when this imaging module is arranged in the cylindrical member, the distance between the light receiving portion of the solid-state imaging device and the optical system can be kept at least by the thickness of the reinforcing substrate and the flexible substrate, so the diameter of the cylindrical member is shortened. be able to. Therefore, when this imaging module is disposed in the cylindrical member, the image input device can be reduced in size.

  In addition, since a hole is formed in the reinforcing substrate, a conductive bonding material is injected into the hole, a bump of the solid-state imaging element is inserted into the hole, and the bump is bonded to the reinforcing substrate and the flexible substrate. The conductive bonding material remains in the hole by the volume of the gap between the holes. Therefore, it can prevent that a conductive joining material covers the light-receiving part of a solid-state image sensor. That is, when a conductive bonding material is applied to a flat surface of a circuit board and the solid-state image sensor is mounted on the board so as to sandwich the conductive bonding material, the conductive bonding material is interposed between the circuit board and the solid-state image sensor. Leaks and the leaked conductive bonding material covers the light receiving part of the solid-state imaging device, but holes are formed in the reinforcing substrate as in the present invention. Therefore, it is possible to reduce the amount of the conductive bonding material to be covered, and to prevent the conductive bonding material from covering the light receiving portion of the solid-state imaging device.

The invention according to claim 7 is:
A transparent cylindrical member rotatably supported around the center line;
The imaging module according to any one of claims 1 to 6, wherein the solid-state imaging device is disposed in the cylindrical member so that a facing surface of the solid-state imaging element is parallel to a center line of the cylindrical member, and the solid-state imaging is performed on an optical axis. And an optical system disposed in the cylindrical member so as to intersect an outer peripheral surface of the cylindrical member.

Preferably, the image input device is disposed in the cylindrical member, and a storage recess is formed. The base member has an optical path hole penetrating from the bottom of the storage recess to the opposite side, and covers the storage recess. A cap member attached to the base member, and the optical system is fitted into the optical path hole, and the flexible substrate is located on the bottom side of the housing recess and viewed in the penetration direction of the optical path hole. The reinforcing substrate and the flexible substrate are accommodated in the accommodating recess so that the light receiving portion of the solid-state imaging element overlaps the optical path hole, and the flexible substrate and the reinforcing substrate are disposed between the bottom of the accommodating recess and the cap member. It is pinched.
Preferably, a recess is formed in a portion of the cap member facing the solid-state image sensor, and the solid-state image sensor is housed in the recess.

  In the above invention, since the flexible substrate and the reinforcing substrate are sandwiched between the bottom of the housing recess of the base member and the cap member, a screw for fixing the flexible substrate and the reinforcing substrate to the base member is separately provided for the base member. There is no need to install. Therefore, the diameter of the cylindrical member can be shortened, and the image input device can be reduced in size.

The invention according to claim 10 is:
A base member in which a storage recess is formed and an optical path hole penetrating from the bottom of the storage recess to the opposite side;
An optical system fitted in the optical path hole;
A substrate stored in the storage recess to be laid on the bottom of the storage recess;
A solid-state imaging device mounted on a surface opposite to the bottom side of the housing recess among both surfaces of the substrate, and a light-receiving portion overlapping the optical path hole when viewed in the penetration direction of the optical path hole,
A cap member attached to the base member so as to cover the storage recess,
In the image input device, the substrate is sandwiched between a bottom of the storage recess and the cap member.

Preferably, a recess is formed in a portion of the cap member that faces the solid-state image sensor, and the solid-state image sensor is housed in the recess.
Preferably, the image input device further includes a transparent cylindrical member supported so as to be rotatable around a center line, and the base member, the optical system, the substrate, the solid-state imaging device, and the cap member are the cylindrical member. Is placed inside.

  In the above invention, since the substrate is sandwiched between the bottom of the storage recess of the base member and the cap member, it is not necessary to separately attach a screw for fixing the substrate to the base member to the base member. Therefore, since the diameter of the cylindrical member can be shortened, the image input device can be reduced in size.

The invention according to claim 13 is:
A base member in which a bent outer surface is formed and an optical path hole penetrating from the outer surface to the opposite surface is formed;
An optical system fitted in the optical path hole;
A flexible substrate closely attached to the outer surface so as to bend along the outer surface;
A solid-state imaging device that is mounted on a surface opposite to the surface that is in close contact with the outer surface of both surfaces of the flexible substrate, and a light-receiving portion overlaps the optical path hole when viewed in the penetration direction of the optical path hole,
A cap member that covers the outer surface and has a recess formed in a portion facing the solid-state imaging device;
In the image input device, the flexible substrate is sandwiched between the cap member and the outer surface, and the solid-state imaging device is housed in a recess of the cap member.

  Preferably, the image input apparatus further includes a transparent cylindrical member that is rotatably supported around a center line, and the base member, the optical system, the flexible substrate, the solid-state imaging device, and the cap member are the cylinder. It is arranged in the member.

In the above invention, since the flexible substrate is sandwiched between the outer surface of the base member and the cap member, it is not necessary to separately attach a screw for fixing the flexible substrate to the base member to the base member. Therefore, since the diameter of the cylindrical member can be shortened, the image input device can be reduced in size.
In addition, since the flexible substrate is in close contact with the outer surface of the base member in a bent state, the flexible substrate is disposed in the cylindrical member even when the length of the flexible substrate in an unfolded state is longer than the diameter of the cylindrical member. be able to. Therefore, the diameter of the cylindrical member can be reduced without being influenced by the length of the flexible substrate.

The invention according to claim 15 is:
Drill holes from one side of the reinforcing substrate to the other,
A flexible substrate is attached to one surface of the reinforcing substrate,
Injecting a conductive bonding material into the hole,
With the light receiving portion formed on one surface of the solid-state image sensor facing the other surface side of the reinforcing substrate,
A bump provided to protrude from one surface of the solid-state image sensor is inserted into the hole,
It is the mounting method of the solid-state image sensor which joins the said bump to the said flexible substrate and the said reinforcement board | substrate with the said electroconductive joining material.

  In the above invention, since the solid-state imaging device is mounted with the light-receiving portion formed on one surface of the solid-state imaging device facing the reinforcing substrate, the light-receiving portion of the solid-state imaging device is equal to the thickness of the reinforcing substrate and the flexible substrate. It can be arranged far from the optical system. Therefore, the focus is not lost even if the focal length of the optical system is not shortened.

  Further, when the solid-state image sensor mounted is disposed in the cylindrical member, the distance between the light receiving portion of the solid-state image sensor and the optical system can be maintained at least by the thickness of the reinforcing substrate and the flexible substrate. The diameter can be shortened. For this reason, when an element mounted with a solid-state imaging device is arranged in a cylindrical member, the image input device can be reduced in size.

  In addition, since a hole is formed in the reinforcing substrate, a conductive bonding material is injected into the hole, a bump of the solid-state imaging element is inserted into the hole, and the bump is bonded to the reinforcing substrate and the flexible substrate. The conductive bonding material remains in the hole by the volume of the gap between the holes. Therefore, it can prevent that a conductive joining material covers the light-receiving part of a solid-state image sensor.

  According to the first to ninth and fifteenth aspects of the present invention, it is possible to prevent the conductive bonding material from covering the light receiving portion of the solid-state imaging device, and to reduce the size of the image input device. Further, the focus is not lost even if the focal length of the optical system is not shortened.

  According to the tenth to fourteenth aspects of the present invention, the diameter of the cylindrical member can be shortened, so that the image input device can be reduced in size.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

[First Embodiment]
FIG. 1 is an exploded perspective view of the imaging module 50, and FIG. 2 is a cross-sectional view along a plane that is orthogonal to the longitudinal direction of the imaging module 50 and that passes through a bump 53c described later.

  This imaging module 50 is obtained by mounting a solid-state imaging element 53 on a back surface 51a of a reinforcing substrate 51 formed of PET (polyethylene terephthalate). This reinforcing substrate 51 has a rectangular shape and is formed with a rectangular notch 51b on one side in the longitudinal direction, and is provided in a bowl shape in plan view. The reinforcing substrate 51 is formed with a plurality of holes 51d penetrating from the back surface 51a to the front surface 51c, and these holes 51d are arranged along the longitudinal direction of the notch 51b.

  A flexible substrate 52 is attached to the surface 51 c of the reinforcing substrate 51, and one of the holes 51 d is closed by the flexible substrate 52. The flexible substrate 52 is obtained by patterning circuit wiring by gold plating on a film material formed of polyimide. The flexible substrate 52 has flexibility, the rigidity of the flexible substrate 52 is lower than that of the reinforcing substrate 51, and the reinforcing substrate 51 is substantially rigid.

  When viewed from above, the flexible substrate 52 is also provided with a notch 52b in the same manner as the reinforcing substrate 51. The flexible substrate 52 is provided in a bowl shape when viewed from above and has the same shape as the reinforcing substrate 51. And the flexible substrate 52 and the reinforcement board | substrate 51 are stuck in the state with which the external shape overlapped.

  The solid-state imaging device 53 includes a light receiving portion 53b and a plurality of bumps (pins) 53c on the facing surface 53a facing the back surface 51a of the reinforcing substrate 51. The light receiving portion 53 b is configured by arranging a plurality of photoelectric conversion elements along the longitudinal direction of the solid-state imaging element 53. That is, the solid-state image sensor 53 is a line sensor.

  The plurality of bumps 53c are provided so as to protrude from the facing surface 53a, and are provided on the pad by repeatedly performing resist and gold plating on the facing surface 53a. These bumps 53 c are arranged along the longitudinal direction of the light receiving portion 53 b, that is, along the longitudinal direction of the solid-state imaging element 53. The plurality of bumps 53c are provided in a one-to-one relationship with the plurality of holes 51d of the reinforcing substrate 51, and the interval between the plurality of bumps 53c is equal to the interval between the plurality of holes 51d. These bumps 53c have conductivity and are used to electrically connect the light receiving portion 53b to the outside, and electrical signals are transmitted and received between the light receiving portion 53b and the outside through the bumps 53c.

  The solid-state imaging device 53 is mounted on the back surface 51a of the reinforcing substrate 51. A plurality of bumps 53c are inserted into the corresponding holes 51d, and the light receiving portion 53b is formed between the reinforcing substrate 51 and the flexible substrate 52 in a plan view. It extends from the outer edge and is located in the notches 51b and 52b.

  Here, as shown in FIG. 3 in which the region A of FIG. 2 is enlarged, the hole 51 d is filled with a thermosetting anisotropic conductive adhesive 54, and the bump 53 c is reinforced by the anisotropic conductive adhesive 54. Bonded to the substrate 51 and the flexible substrate 52. The anisotropic conductive adhesive 54 contains conductive fine particles 54a, and the anisotropic conductive adhesive 54 has conductivity in the thickness direction (through direction of the hole 51d) by such conductive fine particles 54a. The bumps 53 c are electrically connected to the circuit wiring of the flexible substrate 52 through the anisotropic conductive adhesive 54. Instead of the anisotropic conductive adhesive 54, the hole 51d may be filled with a simple conductive adhesive, that is, an isotropic conductive adhesive (for example, carbon paste or silver paste) that conducts in any direction. good. Further, instead of the anisotropic conductive adhesive 54, solder may be filled into the holes 51 d and the bumps 53 c may be soldered to the circuit wiring of the flexible substrate 52.

  In a state where the solid-state imaging device 53 is mounted on the back surface 51a of the reinforcing substrate 51, the light receiving portion 53b is positioned at the notches 51b and 52b in plan view, and the notches 51b and 52b are the reinforcing substrate 51 and the flexible substrate 52 and are planar. It is formed in a portion overlapping the light receiving portion 53b as viewed.

  A method for mounting the solid-state image sensor 53 will be described. A rectangular flexible substrate 52 patterned with circuit wiring is prepared, and a rectangular reinforcing substrate 51 is prepared. Then, a plurality of holes 51d are drilled in the reinforcing substrate 51, the flexible substrate 52 is bonded to the reinforcing substrate 51 with an adhesive, and the notches 51b and 52b are formed on the reinforcing substrate 51 and the flexible substrate 52 bonded together.

  Next, anisotropic conductive adhesive 54 is injected into each hole 51d, the facing surface 53a of the solid-state imaging element 53 is directed toward the back surface 51a of the reinforcing substrate 51, and a plurality of bumps 53c are formed in the corresponding holes 51d. The plurality of bumps 53 c are aligned with the circuit wiring of the flexible substrate 52 by being inserted. Thereafter, the anisotropic conductive adhesive 54 is thermally cured, the plurality of bumps 53 c are pressure-bonded toward the flexible substrate 52, and the plurality of bumps 53 c are bonded to the reinforcing substrate 51 and the flexible substrate 52.

  In addition, a conductive adhesive is injected instead of the anisotropic conductive adhesive 54, the plurality of bumps 53c are bonded to the reinforcing substrate 51 and the flexible substrate 52 with the conductive adhesive, and each bump 53c is connected to the conductive adhesive. May be electrically connected to the circuit wiring. Also, solder is injected instead of the anisotropic conductive adhesive 54, and the plurality of bumps 53c are joined to the reinforcing substrate 51 and the flexible substrate 52 by solder by flowing the solder, and each of the bumps 53c is connected to the circuit wiring by the solder. You may electrically connect to.

  As described above, since the holes 51d are formed in the reinforcing substrate 51, even if the bumps 53c are joined to the reinforcing substrate 51 and the flexible substrate 52, the anisotropic conductive adhesive 54 is applied by the volume of the gap between the holes 51d. It remains in the hole 51d. Therefore, it is possible to prevent the anisotropic conductive adhesive 54 from covering the light receiving portion 53 b of the solid-state imaging element 53.

  An imaging module 50A shown in an exploded manner in FIG. 4 shows a modification of the imaging module 50. The imaging module 50A is provided with a reinforcing substrate 151 and a flexible substrate 152 corresponding to the bowl-shaped reinforcing substrate 51 and the flexible substrate 52 of the imaging module 50 in a rectangular frame shape. Rectangular holes 151b and 152b formed in the central part of the reinforcing substrate 151 and the flexible substrate 152 correspond to the notches 51b and 52b in the imaging module 50, and the light receiving part 53b of the solid-state imaging device 53 is rectangular when viewed in plan. 151b and 152b are located inside. Regarding the imaging module 50A, the same components as those of the imaging module 50 are denoted by the same reference numerals, and the description thereof is omitted.

  In the imaging module 50A, the holes corresponding to the rectangular holes 151b and 152b may be filled with a transparent material instead of the holes such as the rectangular holes 151b and 152b. The transparent material is preferably provided in a flat plate shape so as not to cause a lens effect. Similarly, in the imaging module 50, a flat transparent material may be fitted into portions corresponding to the notches 51b and 52b. Furthermore, instead of using a ridge-like or rectangular frame-like reinforcing substrate and a flexible substrate, a rectangular transparent reinforcing substrate and a transparent flexible substrate may be used, but it corresponds to the notch 52b or the rectangular hole 152b of the transparent flexible substrate. In the portion to be processed, the wiring circuit is not patterned, and the adhesive for bonding the transparent flexible substrate to the transparent substrate is also transparent.

  The image input apparatus 1 including the imaging module 50 will be described with reference to FIGS. FIG. 5 is a cross-sectional view of the image input apparatus 1, and FIG. 6 is an exploded perspective view of the image input apparatus 1.

  The image input apparatus 1 includes an outer cylinder 2 provided in a cylindrical shape, an inner cylinder 3 inserted into the outer cylinder 2 and provided in a cylindrical shape, and a base member disposed in the inner cylinder 3 4, a selfoc lens array 5 attached to the base member 4, an imaging module 50, a light source 7, and a cap member 8. Here, FIG. 5 is a cross-sectional view along a plane orthogonal to the center lines of the outer cylinder 2 and the inner cylinder 3.

  A rectangular opening 2a as viewed in the radial direction (radial direction) is formed at the central portion in the thrust direction (axial direction) of the outer cylinder 2, and the inner cylinder 3 inserted into the outer cylinder 2 is formed in the opening 2a. Exposed. A bearing member 9 is attached to one end of the outer cylinder 2 in the thrust direction.

  Here, the bearing member 9 is directed to a cylindrical thrust bearing portion 9a having a diameter substantially equal to the inner peripheral diameter of the outer cylinder 2, and from the bottom surface of the thrust bearing section 9a to an end portion on the opposite side of the outer cylinder 2 in the thrust direction. And a cylindrical radial bearing portion 9b having a diameter smaller than the inner peripheral diameter of the outer cylinder 2 and substantially equal to the inner peripheral diameter of the inner cylinder 3, and two formed on the outer peripheral wall of the thrust bearing section 9a And a protruding portion 9c. The radial bearing portion 9b and the thrust bearing portion 9a are concentric. Notches 2b are formed at both ends in the thrust direction of the outer cylinder 2, and the thrust bearing portion 9a and the radial bearing portion 9b are inserted into the outer cylinder 2 in a state where the protruding portion 9c is engaged with the notch 2b at one end portion. The bearing member 9 is fixed to the outer cylinder 2. In a state where the bearing member 9 is inserted into the outer cylinder 2, the radial bearing portion 9 b is concentric with the outer cylinder 2.

  A radial bearing portion 9b of the bearing member 9 is inserted into one end portion in the thrust direction of the inner tube 3 inserted into the outer tube 2, and the inner tube 3 can rotate around the center line with respect to the radial bearing portion 9b. The radial load of the inner cylinder 3 is received by the radial bearing portion 9b. Further, the end surface of one end portion in the thrust direction of the inner cylinder 3 is in contact with the bottom surface of the thrust bearing portion 9a around the radial bearing portion 9b, and the load in the thrust direction of the inner tube 3 is received by the bottom surface of the thrust bearing portion 9a. Yes. The bearing member 9 is a dry type slide bearing in which no lubricant is present in the contact portion with the inner cylinder 3, but there may be a lubricant in the contact portion with the inner cylinder 3.

  Note that the bearing member 9 is attached to one end of the both ends in the thrust direction of the outer cylinder 2, but the bearing member provided similarly to the bearing member 9 is also symmetrical to the other end of the outer cylinder 2. Is attached. Here, in FIG. 6, the bearing member 9 attached to one end is illustrated, and the bearing member attached to the other end is not shown for easy understanding of the drawing.

  The inner cylinder 3 is formed of transparent acrylic, but may be formed of a transparent material such as polycarbonate, other resin, borosilicate glass, quartz glass, or other glass. On the outer peripheral surface of the inner cylinder 3, there are provided scales 3a arranged along the circumferential direction at regular intervals. The scale 3a may be provided with a convex shape or a concave shape with respect to the outer periphery of the inner cylinder 3, or may be colored with white, black, or other colors, or coated with a magnetic or conductive material. But it ’s okay. An encoder that generates and outputs a synchronization signal by detecting the graduation 3a optically, magnetically, or electrically is provided on the inner peripheral surface of the outer cylinder 2. Instead of providing the scale 3a and the encoder, a rotary encoder may be connected to the inner cylinder 3 via a gear or the like, and a synchronization signal may be generated and output by the rotary encoder every time the inner cylinder 3 rotates by a predetermined angle. .

  The base member 4 inserted into the inner cylinder 3 has the longitudinal direction of the thrust direction of the outer cylinder 2 and the inner cylinder 3. At both ends in the longitudinal direction of the base member 4, quadrangular columnar convex portions 4 a are formed. On the other hand, on the end face of the radial bearing portion 9b facing the thrust direction, a rectangular columnar concave portion (not shown because it is hidden in FIG. 6) is formed, and the convex portion 4a of the base member 4 is radial. The bearing member 9b is fitted into a recess, and the movement of the base member 4 in the radial direction and the thrust direction is suppressed by the recess of the radial bearing portion 9b. In the bearing member on the opposite side (not shown in FIG. 6), a concave portion is formed as in the bearing member 9 shown in FIG. 6, and the other convex portion 4a of the base member 4 is fitted into the concave portion. .

  As shown in FIGS. 5 to 7, a rectangular storage recess 4 c is formed in a plan view on the lower surface 4 d of the base member 4 opposite to the upper surface 4 j facing the opening 2 a of the outer cylinder 2. . A rectangular optical path hole 4b narrower than the width of the storage recess 4c in plan view is opened at the bottom of the storage recess 4c. The optical path hole 4b extends from the bottom of the storage recess 4c to the upper surface 4j on the opposite side. It penetrates along the direction (radial direction) substantially orthogonal to the center line of the. The opening 2a of the outer cylinder 2 is located on the extension in the penetration direction of the optical path hole 4b.

  The Selfoc lens array 5 is fixed to the base member 4 by fitting the Selfoc lens array 5 into the optical path hole 4 b of the base member 4. The SELFOC lens array 5 includes a plurality of SELFOC lenses 5a whose optical axis is a line in the radial direction of the inner cylinder 3 (through direction of the optical path hole 4b). This is an optical system that is arranged and forms one continuous image with the entire plurality of Selfoc lenses 5a. A portion where the optical axis of the selfoc lens array 5 and the inner cylinder 3 intersect is exposed to the opening 2 a of the outer cylinder 2.

  In the storage recess 4c, the reinforcing substrate 51 and the flexible substrate 52 of the imaging module 50 are stored in a state of being laid so as to be parallel to the thrust direction of the inner cylinder 3. Here, the flexible substrate 52 is on the bottom side of the storage recess 4c, and the solid-state imaging device 50 is projected from the storage recess 4c. In addition, the notches 51b and 52b of the reinforcing substrate 51 and the flexible substrate 52 overlap with the optical path hole 4b, and the reinforcing substrate 51 and the flexible substrate 52 are provided so as to avoid the optical axis of the Selfoc lens array 5. The optical axis does not intersect with the reinforcing substrate 51 and the flexible substrate 52.

  Further, the solid-state image sensor 53 of the imaging module 50 is disposed so that the facing surface 53 a is parallel to the center line of the inner cylinder 3. Since the light receiving portion 53b of the solid-state imaging element 53 overlaps the optical path hole 4b when viewed in the penetrating direction of the optical path hole 4b, the light receiving portion 53b of the solid-state imaging element 53 intersects with the optical axis of the SELFOC lens array 5. The SELFOC lens array 5 is configured to form an image on the light receiving portion 53 b of the solid-state imaging device 53 at a portion on the optical axis that intersects the outer peripheral surface of the inner cylinder 3.

  The width of the storage recess 4c is equal to the width of the reinforcement substrate 51 and the flexible substrate 52, and the movement of the reinforcement substrate 51 and the flexible substrate 52 stored in the storage recess 4c is suppressed by the storage recess 4c. Also, a claw 4e protruding in the width direction of the storage recess 4c is formed at a part of the edge of the storage recess 4c, and the claw 4e is located in the notches 51b and 52b of the reinforcement substrate 51 and the flexible substrate 52. 51 and the flexible substrate 52. Therefore, movement of the reinforcing substrate 51 and the flexible substrate 52 in the longitudinal direction is suppressed by the claw 4e.

  In addition, the lower surface 4d in which the storage recess 4c is formed is covered with the cap member 8, and the reinforcing substrate 51 and the flexible substrate 52 are sandwiched between the bottom of the storage recess 4c and the cap member 8. A portion of the cap member 8 facing the solid-state image sensor 53 on the surface of the reinforcing substrate 51 is formed with a rectangular recess 8a that is elongated in the thrust direction in plan view. The protruding solid-state image sensor 53 is housed in the recess 8a.

  At both ends in the longitudinal direction of the cap member 8, columnar engaging projections 8b projecting in the longitudinal direction are provided, and at both ends in the longitudinal direction of the base member 4, it projects downward from the lower surface 4d. The grip portion 4f thus formed is formed. The grip portion 4f is divided into two forks, and the engagement protrusion 8b is fitted into the notch 4g therebetween, and the engagement protrusion 8b is gripped by the grip portion 4f by the elastic force of the grip portion 4f and the engagement protrusion 8b. ing. The cap member 8 is fixed to the base member 4 by the engaging protrusion 8b being gripped by the grip portion 4f, and the reinforcing substrate 51 and the flexible substrate 52 sandwiched between the base member 4 and the cap member 8 are further fixed. Is fixed.

  When viewed in the longitudinal direction of the base member 4, one side portion of the base member 4 is provided with a hook-like portion 4 h that extends laterally and bends toward the opening 2 a of the outer cylinder 2. A light source 7 is accommodated inside the bowl-shaped portion 4h. The light source 7 is a linear light source along the thrust direction of the inner cylinder 3. The light source 7 is provided so as to irradiate from the inside of the inner cylinder 3 toward the intersection between the optical axis of the Selfoc lens array 5 and the outer peripheral surface of the inner cylinder 3.

  Instead of the imaging module 50, the imaging module 50A shown in FIG. Also in this image input apparatus 1, a rectangular transparent reinforcing substrate and a transparent flexible substrate may be used instead of the reinforcing substrates 51 and 151 and the flexible substrates 52 and 152 having a bowl shape or a rectangular frame shape. The notches 51b and 52b or the rectangular holes 151b and 152b may be filled with a transparent material.

A method of using the image input apparatus 1 configured as described above and an operation of the image input apparatus 1 will be described.
The subject presses his / her finger against the outer peripheral surface of the inner cylinder 3 in the opening 2 a of the outer cylinder 2. In particular, it is desirable to bring the finger into contact with the outer peripheral surface of the inner cylinder 3 with the fingertip oriented in the tangential direction of the outer peripheral surface of the inner cylinder 3.

  When the subject presses the finger against the outer peripheral surface of the inner cylinder 3, the light of the light source 7 that has been lit enters the finger through the inner cylinder 3, and the finger is irradiated at the portion where the finger contacts the outer peripheral surface of the inner cylinder 3.

  And if a test subject moves a finger to the tangent direction of the inner cylinder 3 in the state which pressed the finger on the outer peripheral surface of the inner cylinder 3, the inner cylinder 3 will rotate. As the finger moves, the finger passes above the solid-state image sensor 53, the contact portion between the finger and the inner cylinder 3 changes, and the finger is scanned by the solid-state image sensor 3. That is, when the synchronization signal is sequentially generated from the encoder along with the rotation of the inner cylinder 3 and the imaging operation is performed every time the solid-state imaging device 3 inputs the synchronization signal, a one-dimensional image of the part in contact with the finger is obtained. Are obtained sequentially. By sequentially synthesizing the one-dimensional images acquired by the solid-state imaging device 53, an image defined by the unevenness of the finger surface, that is, the fingerprint of the finger is generated as a two-dimensional image.

  In the above description, a finger is used as a subject, but a pattern (including characters, numbers, pictures, figures, shades, etc.) appearing on the surface of a smooth subject such as paper is also two-dimensional. It can be acquired as an image. For any subject, as in the case of a finger, the subject can be pressed against the outer peripheral surface of the inner cylinder 3 in the opening 2a, and the inner cylinder 3 can be rotated by moving in the tangential direction with the subject pressed. It ’s fine.

  As described above, according to the present embodiment, the flexible substrate 52 is attached to the front surface 51 c of the reinforcing substrate 51, and the solid-state imaging device 53 is attached to the back surface 51 a of the reinforcing substrate 51 so that the facing surface 53 a faces the reinforcing substrate 51. Since it is mounted, the light receiving portion 53 b of the solid-state imaging device 53 can be arranged as far away from the Selfoc lens array 5 as the thickness of the reinforcing substrate 51 and the flexible substrate 52. Therefore, even when the diameter of the inner cylinder 3 is shortened, the focus is not lost even if the focal length of the SELFOC lens array 5 is not shortened.

  Further, since the distance between the light receiving portion 53b of the solid-state imaging device 53 and the Selfoc lens array can be maintained at least by the thickness of the reinforcing substrate 51 and the flexible substrate 52, the diameter of the inner cylinder 3 can be shortened. Therefore, the image input device 1 can be reduced in size.

  In addition, since the flexible substrate 52 and the reinforcing substrate 51 are sandwiched between the bottom of the housing recess 4 c and the cap member 8, screws for fixing the flexible substrate 52 and the reinforcing substrate 51 to the base member 4 are used as the base member 4. There is no need to install separately. Therefore, the diameter of the inner cylinder 3 can be shortened, and the image input apparatus 1 can be reduced in size.

[Second Embodiment]
FIG. 8 is an exploded perspective view of the imaging module 250 according to the second embodiment, and FIG. 9 is a cross-sectional view taken along a plane orthogonal to the longitudinal direction of the imaging module 250 and passing through a pad 253c described later. It is. In the imaging module 250, a portion corresponding to any portion of the imaging module 50 in the first embodiment is assigned a common low-order symbol, and the imaging module 250 and the imaging module 50 correspond to each other. In the case where the portions are provided in the same manner, the description of the portions provided in the same manner is omitted.

  The imaging module 250 is obtained by mounting a solid-state imaging device 253 on the back surface 252a of a flexible substrate 252. Similar to the flexible substrate 52 in the first embodiment, the flexible substrate 252 has a rectangular shape and a rectangular notch 252b formed on one side in the longitudinal direction. It is provided in the shape. A reinforcing substrate is not attached to the flexible substrate 252.

  The solid-state imaging device 253 is also a line sensor, and includes a light receiving unit 253b and a plurality of pads 253c on an opposing surface 253a facing the flexible substrate 252. That is, unlike the solid-state image sensor 53 in the first embodiment, the solid-state image sensor 253 is not provided with convex bumps. These pads 253c are arranged along the longitudinal direction of the light receiving portion 253b.

  The solid-state imaging element 253 is mounted on the back surface 252a of the flexible substrate 252. An anisotropic conductive adhesive 254 is interposed between the facing surface 253a and the back surface 252a, and the facing surface 253a is an anisotropic conductive adhesive 254. Is adhered to the back surface 252a of the flexible substrate 252. The anisotropic conductive adhesive 254 is provided so as to integrally cover the plurality of pads 253c. Since the anisotropic conductive adhesive 254 is conductive in the thickness direction, the plurality of pads 253c are each independently a flexible substrate. 252 is electrically connected to the circuit wiring. The light receiving portion 253b is not covered with the anisotropic conductive adhesive 254.

  The image input apparatus 201 including the imaging module 250 will be described with reference to FIG. FIG. 10 is a cross-sectional view of the image input device 201. In the image input device 201, a portion corresponding to any portion of the image input device 201 in the first embodiment is denoted by a common low-order code, and the image input device 201 and the image input device 1 are connected. In the case where the parts corresponding to each other are provided in the same manner, the description of the same parts is omitted.

  Similarly to the image input apparatus 1 in the first embodiment, the image input apparatus 201 also has an outer cylinder 202, an inner cylinder 203, a base member 204, a cap member 208, a Selfoc lens array 205, and an imaging module. 250 and a light source 207.

  In the image input device 1 of the first embodiment, the storage recess 4 c is formed on the lower surface of the base member 4, but in the image input device 201 of the second embodiment, the lower surface 204 d of the base member 204 is stored in the lower surface 204 d. No recess is formed. Instead, the lower surface 204d of the base member 204 is a surface 210 in which one opening of the optical path hole 204b is formed, and a flat surface 210 orthogonal to the optical axis of the SELFOC lens array 205, and the flat surface. 210 is in contact with (adjacent to) 210, is inclined with respect to the flat surface 210, is curved so as to bulge, and is in contact with the inclined surface 211 on the opposite side of the flat surface 210, and is parallel to the flat surface 210. The second flat surface 212 formed in this manner, the vertical surface 213 formed so as to be in contact with and perpendicular to the flat surface 210 on the opposite side of the inclined surface 211, and on the opposite side of the flat surface 210 The third flat surface 214 is formed to be in contact with the vertical surface 213 and to be parallel to the flat surface 210.

  The flexible substrate 252 of the imaging module 250 is bent and bent along the flat surface 210 and the inclined surface 211, and is in close contact with the flat surface 210 and the inclined surface 211. In addition, the notch 252b of the flexible substrate 252 and the light receiving portion 253b of the solid-state imaging device 253 overlap with the optical path hole 204b when viewed in the penetrating direction of the optical path hole 204b, and the flexible substrate 252 is provided so as to avoid the optical axis of the SELFOC lens array 205. The optical axis of the SELFOC lens array 205 and the flexible substrate 252 do not intersect. The total width of the flat surface 210 and the inclined surface 211 is equal to the width of the flexible substrate 252, a part of the outer edge of the flexible substrate 252 is in contact with the vertical surface 213, and another part of the outer edge is the second flat surface 212. It is in contact. Therefore, the flexible substrate 252 is prevented from moving in the width direction along the flat surface 210 and the inclined surface 211.

  A cap member 208 that covers the lower surface 204d of the base member 204 is also provided so as to fit the lower surface 204d. That is, the surface of the cap member 208 on the side of the base member 204 includes a flat surface 220 facing the flat surface 210 substantially in parallel with a gap, an inclined surface 221 facing the inclined surface 211 with a gap, and a second surface. The flat surface 222 is affixed to the flat surface 212, the vertical surface 223 is affixed to the vertical surface 213, and the flat surface 224 is affixed to the third flat surface 214. A flexible substrate 252 is sandwiched between 211 and the inclined surface 221. A rectangular recess 208a is formed on the flat surface 220 facing the solid-state image sensor 253, and the solid-state image sensor 253 is accommodated in the recess 208a.

  According to the second embodiment, since the flexible substrate 252 is sandwiched between the lower surface 204 d of the base member 204 and the cap member 8, a screw for fixing the flexible substrate 252 to the base member 204 is provided. There is no need to install separately. Therefore, since the diameter of the inner cylinder 203 can be shortened, the image input device 201 can be reduced in size.

  Further, since the flexible substrate 252 is in close contact with the lower surface 204d in a bent state, the flexible substrate 252 is placed in the inner cylinder 3 even when the width of the unfolded flexible substrate 252 is longer than the diameter of the inner cylinder 3. Can be arranged. Therefore, the diameter of the inner cylinder 3 is not affected by the width of the flexible substrate 252, and the diameter of the inner cylinder 3 can be reduced.

2 is an exploded perspective view of an imaging module 50. FIG. 2 is a cross-sectional view of an imaging module 50. FIG. It is the figure which expanded and showed the area | region A of FIG. It is an exploded perspective view of imaging module 50A. 2 is a cross-sectional view of the image input device 1. FIG. 2 is an exploded perspective view of the image input device 1. FIG. It is the disassembled perspective view shown from the opposite side to the illustration direction of FIG. 2 is an exploded perspective view of an imaging module 250. FIG. 2 is a cross-sectional view of an imaging module 250. FIG. 2 is a cross-sectional view of an image input device 201. FIG.

Explanation of symbols

1,201 Image input device 3,203 Inner cylinder (cylindrical member)
4, 204 Base member 4b, 204b Optical path hole 4c Storage recess 204d Lower surface (outer surface)
5, 205 Selfoc lens array (optical system)
8, 208 Cap member 8a, 208a Recess 50 Imaging module 51, 151 Reinforcement substrate 51d Hole 52, 152, 252 Flexible substrate 53, 253 Solid imaging device 53a Opposing surface 53b Light receiving portion 53c Bump 54 Anisotropic conductive adhesive (conductive) Bonding material)

Claims (15)

A reinforcing substrate in which a hole penetrating from one surface to the other surface is formed;
A flexible substrate attached to one surface of the reinforcing substrate;
A solid-state imaging device provided with a bump projecting from an opposing surface opposite to the other surface of the reinforcing substrate and inserted into the hole on the opposing surface, and a light receiving unit for transmitting and receiving an electrical signal through the bump on the opposing surface; ,
An imaging module comprising: a conductive bonding material that fills the hole and bonds the bump, the flexible substrate, and the reinforcing substrate.   2. The imaging module according to claim 1, wherein a notch is formed in a portion of the reinforcing substrate and the flexible substrate that overlaps the light receiving portion in plan view.   2. The imaging module according to claim 1, wherein a hole is formed in a portion of the reinforcing substrate and the flexible substrate that overlaps the light receiving portion in plan view.   The imaging module according to claim 1, wherein a portion of the reinforcing substrate and the flexible substrate that overlaps the light receiving portion in plan view is provided transparently.   5. The imaging module according to claim 1, wherein a wiring circuit is patterned on the flexible substrate, and the bumps are electrically connected to the wiring circuit by the conductive bonding material. 6. .   The imaging module according to claim 1, wherein the conductive bonding material is an anisotropic conductive adhesive having conductivity in a penetration direction of the hole. A transparent cylindrical member rotatably supported around the center line;
The imaging module according to any one of claims 1 to 6, wherein the imaging module is disposed in the cylindrical member such that a facing surface of the solid-state imaging element is parallel to a center line of the cylindrical member.
An image input apparatus comprising: an optical system disposed in the cylindrical member so that an optical axis intersects a light receiving portion of the solid-state imaging device and an outer peripheral surface of the cylindrical member. A base member which is disposed in the cylindrical member, has a storage recess, and has an optical path hole penetrating from the bottom of the storage recess to the opposite side;
A cap member attached to the base member so as to cover the storage recess,
The optical system is fitted into the optical path hole, and the reinforcement is made so that the flexible substrate is located on the bottom side of the housing recess and the light receiving part of the solid-state imaging device overlaps the optical path hole when viewed in the penetration direction of the optical path hole. The image according to claim 7, wherein the substrate and the flexible substrate are stored in the storage recess, and the flexible substrate and the reinforcing substrate are sandwiched between a bottom of the storage recess and the cap member. Input device.   The image input apparatus according to claim 8, wherein a concave portion is formed in a portion of the cap member that faces the solid-state imaging device, and the solid-state imaging device is accommodated in the concave portion. A base member in which a storage recess is formed and an optical path hole penetrating from the bottom of the storage recess to the opposite side;
An optical system fitted in the optical path hole;
A substrate stored in the storage recess to be laid on the bottom of the storage recess;
A solid-state imaging device mounted on a surface opposite to the bottom side of the housing recess among both surfaces of the substrate, and a light-receiving portion overlapping the optical path hole when viewed in the penetrating direction of the optical path hole,
A cap member attached to the base member so as to cover the storage recess,
The image input apparatus, wherein the substrate is sandwiched between a bottom of the storage recess and the cap member.   The image input device according to claim 10, wherein a concave portion is formed in a portion of the cap member that faces the solid-state imaging device, and the solid-state imaging device is housed in the concave portion. A transparent cylindrical member rotatably supported around the center line;
The image input device according to claim 10, wherein the base member, the optical system, the substrate, the solid-state imaging device, and the cap member are disposed in the cylindrical member. A base member in which a bent outer surface is formed and an optical path hole penetrating from the outer surface to the opposite surface is formed;
An optical system fitted in the optical path hole;
A flexible substrate closely attached to the outer surface so as to bend along the outer surface;
A solid-state imaging device that is mounted on a surface opposite to the surface that is in close contact with the outer surface of both surfaces of the flexible substrate, and a light-receiving portion overlaps the optical path hole when viewed in the penetration direction of the optical path hole,
A cap member that covers the outer surface and has a recess formed in a portion facing the solid-state imaging device;
The image input apparatus, wherein the flexible substrate is sandwiched between the cap member and the outer surface, and the solid-state imaging device is housed in a recess of the cap member. A transparent cylindrical member rotatably supported around the center line;
The image input device according to claim 13, wherein the base member, the optical system, the flexible substrate, the solid-state imaging device, and the cap member are disposed in the cylindrical member. Drill holes from one side of the reinforcing substrate to the other,
A flexible substrate is attached to one surface of the reinforcing substrate,
Injecting a conductive bonding material into the hole,
With the light receiving portion formed on one surface of the solid-state image sensor facing the other surface side of the reinforcing substrate,
A bump provided to protrude from one surface of the solid-state image sensor is inserted into the hole,
A method for mounting a solid-state imaging device, wherein the bump is bonded to the flexible substrate and the reinforcing substrate with the conductive bonding material.

Images