JP2005329443A - Laser beam machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machine capable of uniformizing the results of machining. <P>SOLUTION: A mirror 23 reflecting a beam 8 and a beam 9, which are deflected by a beam branching filter 7 (an optical path deflection device), is set on a straight line p, which passes through a middle point K of a central line m passing through an axial center O1 of a laser beam irradiation part 10a and passing through an axial center O2 of a laser beam irradiation part 10b, and which is vertical to the straight line m. A total reflection mirror 12a and a total reflection mirror 12b are symmetrically arranged with respect to the straight line p; a mirror 11a and a mirror 11e are arranged likewise; a mirror 11b and a mirror 11f are arranged likewise; and a mirror 11c and a mirror 11g are arranged likewise. Thereby, the optical path length of the beam 8 from the beam branching filter 7 to the axial center O1 and the optical path length of the beam 9 from the beam branching filter 7 to the axial center O2 become equal, so that the beam 8 and the beam 9, with which a work is irradiated, are made equal in energy. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is a laser processing machine comprising two laser irradiation units, and shaping the outer diameter of laser light output from a laser oscillator to a desired size and then supplying the laser beam to one of the laser irradiation units About.

FIG. 2 is a plan view showing a main part of a conventional laser beam machine.
The outer diameter of the laser beam 3 output from the laser oscillator 2 is shaped by the beam shaper 5 via the total reflection mirror 4. The laser beam 3 that has passed through the aperture 6 is assigned one of two optical paths by a beam splitter (for example, an acoustooptic device) 7. The beam 8 designated on one optical path is reflected by the mirrors 11a to 11c, is deflected in the direction perpendicular to the paper surface by the mirror 11d indicated by a two-dot chain line, and is incident on the axis O1 of the laser irradiation unit 10a. Further, the beam 9 designated as the other optical path is reflected by the mirrors 11e to 11h, is deflected in the direction perpendicular to the paper surface by the mirror 11j indicated by a two-dot chain line, and is incident on the axis O2 of the laser irradiation unit 10b. To do.

  The laser oscillator 2, the total reflection mirror 4, the beam shaper 5, the aperture 6, the beam demultiplexer 7, and the mirrors 11 a to 11 j are on the surface side of the optical path plate 1, and the laser irradiation unit 10 a and the laser irradiation unit 10 b are the optical path plate 1. It is arrange | positioned at the back surface side, respectively.

  The laser irradiation units 10a and 10b are composed of a pair of galvano scanners (not shown), an fθ lens, and the like, and the laser irradiation unit 10a and the laser irradiation unit 10b have the same configuration.

  In Japanese Patent Application Laid-Open No. 2003-112278, by making the optical path length from the aperture 6 to the laser irradiation unit 10a the same as the optical path length from the laser irradiation unit 10b, the holes processed in the laser irradiation unit 10a and the laser irradiation unit 10b are processed. The diameter is the same.

JP 2003-112278 A

  However, in order to adjust the optical path length within a limited space including the technique of Patent Document 1, the number of mirrors arranged between the aperture 6 and the laser irradiation unit 10a, and the aperture 6 and the laser irradiation unit 10b The number of mirrors arranged between them is different. Due to the difference in the reflectivity of the mirrors, the power applied to the processing point is smaller on the side where the number of mirrors is larger than the side where the number of mirrors is small, and it is difficult to obtain a uniform processing result.

  An object of the present invention is to provide a laser processing machine capable of solving the above-described problems and making the processing result uniform.

  In order to solve the above problems, the present invention comprises two laser irradiation units, and after shaping the outer diameter of the laser light output from the laser oscillator to a desired size by means of the outer diameter shaping means of the laser light, In a laser processing machine that is supplied to one of the laser irradiation units by an optical path deflecting device, the optical path deflecting device is arranged at a substantially equidistant position from the two laser irradiation units, and the optical path deflecting device The optical path to the laser irradiation part is formed symmetrically.

  The power irradiated to the processing point becomes the same, and the processing quality becomes uniform.

Hereinafter, the present invention will be described in more detail with reference to embodiments.
FIG. 1 is a plan view showing a main part of a laser beam machine according to the present invention. Components having the same or the same functions as those in FIG.

  The total reflection mirror is provided with another total reflection mirror 4b in addition to the illustrated total reflection mirror 4a. The total reflection mirror 4 a, the beam shaper 5, the aperture 6, the beam demultiplexer 7, and the mirror 23 are placed on the first plate 20, and the laser oscillator 2 and the total reflection mirror 4 b are arranged below the plate 20. Has been. Further, the total reflection mirror 12a, the total reflection mirror 12b, and the mirrors 11a to 11h are placed on the second plate 21.

  Here, the total reflection mirror 12a and the total reflection mirror 12b, the mirror 11a and the mirror 11e, the mirror 11b and the mirror 11f, and the mirror 11c and the mirror 11g have an axis O1 of the laser irradiation unit 10a and an axis O2 of the laser irradiation unit 10b. They are arranged symmetrically with respect to a straight line p that passes through the midpoint K of the passing center line m and is perpendicular to the center line m.

  Further, the plate 20 is disposed at a position where the beams 8 and 9 reflected by the mirror 23 are substantially symmetric with respect to the straight line p.

Next, the operation of the present invention will be described.
The laser beam 3 output from the laser oscillator 2 enters the total reflection mirror 4a via the total reflection mirror 4b, and the outer diameter of the laser beam 3 is shaped by the beam shaper 5. The laser beam 3 transmitted through the aperture 6 is designated by the beam splitter 7 in one of two optical paths.

  The beam 8 designated on one optical path is reflected by the mirror 23, the total reflection mirror 12a, and the mirrors 11a to 11c, and the optical path is deflected in a direction perpendicular to the paper surface by the mirror 11d to be applied to the axis O1 of the laser irradiation unit 10a. Incident.

  The beam 9 designated as the other optical path is reflected by the mirror 23, the total reflection mirror 12b, and the mirrors 11e to 11g, and the optical path is deflected in the direction perpendicular to the paper surface by the mirror 11j, so that the axis of the laser irradiation unit 10b is obtained. Incident on O2.

Since the optical path length from the beam demultiplexer 7 to the axis O1 and the optical path length from the beam demultiplexer 7 to the axis O2 are substantially the same, the energy of the beam 8 and the beam 9 applied to the workpiece is the same. Therefore, the processing result processed by the laser irradiation unit 10a and the processing unit processed by the laser irradiation unit 10b are almost the same.

  In this embodiment, the beams 8 and 9 output from the beam demultiplexer 7 are made incident on the total reflection mirror 12a and the total reflection mirror 12b via the mirror 23. The beam splitter 7 may be arranged so that the output beams 8 and 9 are directly incident on the total reflection mirror 12a and the total reflection mirror 12b.

  By the way, when the type of laser is changed (for example, a carbon dioxide laser is changed to a UV laser), it is often necessary to change the beam shaper 5, the aperture 6 and the beam demultiplexer 7 which are beam shaping means together with the laser oscillator. .

  In the laser processing machine, since the optical path plate 1 or the plates 20 and 21 are arranged at about 1.5 m from the floor surface, the setup time becomes longer when the type of laser is changed.

  In this embodiment, since the beam shaper 5, the aperture 6 and the beam demultiplexer 7 which are beam shaping means are mounted on the plate 20, the plate 20 may be replaced, and the setup time can be shortened. it can. Further, since the optical axes of the beam shaper 5, the aperture 6 and the beam demultiplexer 7, which are beam shaping means, can be made coaxial in advance, almost no adjustment time is required.

It is a top view which shows the principal part of the laser beam machine which concerns on this invention. It is a top view which shows the principal part of the conventional laser beam machine.

Explanation of symbols

7 Beam splitter (optical path deflector)
8, 9 Beams 10a, 10b Laser irradiation parts 11a-11g Mirrors 12a, 12b Total reflection mirrors 23 Mirrors O1, O2 Axis m Center line K passing through O1, O2 K Middle point
p Straight line perpendicular to center line m

Claims (3)

  Two laser irradiation units are provided, and the outer diameter of the laser beam output from the laser oscillator is shaped to a desired size by the laser beam outer diameter shaping unit, and then either one of the laser irradiation units by the optical path deflecting device. In the laser processing machine, the optical path deflecting device is arranged at a substantially equidistant position from the two laser irradiating units, and the optical path from the optical path deflecting device to the laser irradiating unit is formed symmetrically. A laser processing machine characterized by that.   2. The laser beam machine according to claim 1, wherein an optical component that defines an optical path from the optical path deflecting device to the laser irradiation unit is disposed on the first plate.   3. The laser beam machine according to claim 2, wherein means for shaping the outer diameter of the laser beam to a desired size and the optical path deflecting device are disposed on the second plate.

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