JP2005228695A - Illuminating device and projector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illuminating device for uniformly illuminating even when illuminating by using an LED array. <P>SOLUTION: Illuminating light of each color from BGR light illuminating devices 21, 23 and 25 installed in the illuminating device 20 is made incident to each corresponding liquid crystal light valves 31, 33 and 35, respectively. Each valve 31, 33 and 35 is modulated by an element-driven device 38 operating in response to an external image signal, has two-dimensional refraction index distributions, respectively, and modulates each illuminating light of each color two-dimensionally spatially on a pixel-by pixel basis. At this time, in light source units 21a, 23a and 25a for each light, since LED packages 21f, 23f and 25f are mounted in a manner that they are precisely aligned on circuit boards 21g, 23g and 25g, illuminations free of the luminance irregularity can be obtained. As a result, an image with a high quality free from the luminance irregularity can be projected. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an illumination device suitable for illumination of a liquid crystal light valve or other light modulation device, and a projector incorporating the same.

As a conventional projector, the illumination light of each color from the LED array provided for each color is brought into a highly parallel state by the lens array, and the entire LCD is made uniform with white light synthesized by the illumination light of each color by the dichroic prism. There is something to illuminate (see Patent Document 1).
Figures 2 and 5 of Japanese Patent Laid-Open No. 2000-56410

  However, since the projector as described above uses an LED array composed of lead-type LEDs, it is not easy to improve the mounting position accuracy on the wiring board. In other words, due to the presence of the clearance provided in the hole through which the lead passes, a relative positional deviation is likely to occur between the plurality of LEDs, resulting in a deviation from the position set by the condenser lens, resulting in non-uniform light quantity. Brightness unevenness occurs in the projected image.

  Accordingly, an object of the present invention is to provide an illumination device that can perform uniform illumination even when illumination is performed using an LED array.

  It is another object of the present invention to provide a projector capable of projecting an image having no luminance unevenness with uniform illumination light.

  In order to solve the above-described problems, an illumination device according to the present invention includes: (a) a solid light source chip that generates light source light; A light emitting device having at least two alignment terminals; and (b) a mounting substrate provided with a plurality of pads on the surface, which are respectively arranged corresponding to the alignment terminals and solderable.

  In the above lighting device, the light emitting device has a plurality of solderable plurality of alignment terminals, and the mounting substrate has a plurality of solderable pads corresponding to the arrangement of the alignment terminals. By fixing to a plurality of pads by soldering, it is possible to simultaneously achieve fixing and alignment of the light emitting device with respect to the mounting substrate. As a result, the solid light source chip can be installed at a desired position with desired accuracy, and illumination without luminance unevenness can be achieved.

  In a specific aspect of the present invention, in the lighting device, at least two of the plurality of alignment terminals are electrode terminals for energization. In this case, the electrode terminals among the alignment terminals can supply power to the solid-state light source chip, and not only can the number of alignment terminals be minimized, but also the electrical connection and alignment of the light emitting device to the mounting substrate can be performed simultaneously. Can be achieved.

  In another specific aspect of the present invention, the remaining alignment terminals other than the electrode terminals among the plurality of alignment terminals are pseudo terminals that are not intended to be energized. In this case, precise alignment is achieved by utilizing the added pseudo terminal to a desired degree.

  In still another specific aspect of the present invention, the plurality of alignment terminals and the plurality of pads are fixed while performing self-alignment by a reflow process. In this case, the light emitting device can be simply and accurately aligned using solder.

  In still another specific aspect of the present invention, the plurality of alignment terminals have a predetermined-shaped adhesive surface provided on the lower surface of the light emitting device, and each alignment terminal and the plurality of pads are respectively They are connected via solder balls. In this case, highly accurate alignment using the surface tension of the solder ball becomes possible.

  In still another specific aspect of the present invention, the plurality of alignment terminals have a predetermined-shaped adhesive surface provided on a side surface or a lower surface of the light-emitting device, and each alignment terminal and the plurality of pads include Are connected via a solder layer. In this case, highly accurate alignment using a solder layer is possible.

  In yet another specific aspect of the present invention, the light emitting device is a surface mount package in which a solid light source chip and a plurality of alignment terminals are embedded and integrated. In this case, high-precision alignment is possible when the surface mount package is soldered.

  According to still another specific aspect of the present invention, a plurality of light emitting devices are attached in a predetermined arrangement on the mounting substrate. In this case, each light-emitting device can be mounted on the mounting substrate with simple and precise alignment including mutual arrangement relation, and illumination light from a plurality of light-emitting devices can be efficiently guided to the irradiation target. .

  The first projector according to the present invention includes: (a) an illumination device for each color that emits light sources of each color from a light emitting device provided for each color as illumination light for each color; and (b) an illumination device for each color. (C) a light combining optical system for combining and emitting image light of each color modulated by the light modulating device for each color; and (d) a light combining optical system. And a projection optical system for projecting the image light synthesized through the above.

  In the projector, in order to illuminate the light modulation devices of the respective colors, the illumination devices of the respective colors emit light sources of the respective colors from the above-described light emitting devices provided for the respective colors. At this time, since the light-emitting device is precisely aligned on the mounting substrate, it is possible to perform precise illumination and not only project a high-quality image without uneven brightness, but also the light-emitting device of each color. It is possible to prevent color unevenness from occurring due to an arrangement error.

  In addition, a second projector according to the present invention includes (a) the illuminating device that emits light source light from the light emitting device as illumination light, and (b) a light modulation device that is illuminated by illumination light from the illuminating device, (C) a projection optical system that projects image light modulated by the light modulation device.

  In the projector, in order to illuminate the light modulation device, the illumination device emits light source light from the above-described light emitting device. At this time, since the light emitting device is precisely aligned on the mounting substrate, it is possible to perform precise illumination and project a high-quality image without luminance unevenness.

[First Embodiment]
FIG. 1 is a block diagram conceptually illustrating the structure of the projector according to the first embodiment of the invention. The projector 10 includes an illumination device 20, an image forming unit 30, a projection lens 40, and a control device 50. Here, the illumination device 20 includes a B light illumination device 21, a G light illumination device 23, an R light illumination device 25, and a light source driving device 27. The image forming unit 30 is driven by three liquid crystal light valves 31, 33, and 35 that are transmission type light modulators, a cross dichroic prism 37 that is a light combining optical system, and the liquid crystal light valves 31, 33, and 35. And an element driving device 38 for outputting a signal.

  The B light illumination device 21 includes a light source unit 21a for B light and a rod integrator 21c. Among them, the light source unit 21a for B light is obtained by attaching a plurality of LED packages 21f in an appropriate two-dimensional arrangement on the circuit board 21g, and individually forming lens elements for beam shaping on the front surface of each LED package 21f. The condenser lens array 21b. Each LED package 21f generates B light included in the blue (B) category among the three primary colors as a light emitting device. The B light extracted from the LED package 21f, that is, the first light source light LB passes through the condenser lens array 21b, and then enters the incident end, that is, the incident port IP of the rod integrator 21c that is a light uniformizing unit. At this time, the B light from each LED package 21f is appropriately diverged by each lens element constituting the condenser lens array 21b and is made into an elliptical or rectangular cross-section beam gathered at a predetermined position. That is, the B light from each LED package 21f is collected as a whole at a rectangular incident port IP provided in the rod integrator 21c, and is incident on the incident port IP without leaking. The first illumination light emitted from the exit port OP which is the exit end through the rod integrator 21c is a liquid crystal for B light in the image forming unit 30 via the first polarizing filter 26a arranged to face the exit port OP. The light enters the light valve 31. Thereby, the irradiated area on the liquid crystal light valve 31 is illuminated uniformly with the B light.

  FIG. 2 is a plan view of the B light source unit 21a. In the B light source unit 21a, seven LED packages 21f are arranged on a circuit board 21g at equal intervals. That is, each LED package 21f is arranged and fixed at each apex and center of gravity of a regular hexagon on the circuit board 21g which is a mounting board. Each LED package 21f incorporates an LED element 21h called a solid light source chip in a resin sealing body. A wiring pattern 21k for supplying electric power to each LED package 21f is formed on the circuit board 21g, and a pair of terminal pads 21m are formed at two peripheral places. Here, the wiring pattern 21k connects each LED package 21f in series, and each LED package 21f can be driven with the same current by connecting a DC power source to both terminal pads 21m.

  3 and 4 are views for explaining the structure of a specific LED package 21f and the attachment of the LED package 21f to the circuit board 21g.

  As shown in FIG. 3 and the like, in the LED package 21f, the mirror member 63 is fixed on the lower pedestal 61, and the LED element 21h is fixed at the center of the mirror member 63. The reflecting surface of the mirror member 63 and the LED element 21 h are enclosed in a transparent resin sealing body 65. The light source light emitted from the LED element 21h is directly or after being reflected by the mirror 63, and then emitted to the front via the resin sealing body 65 whose tip is a lens.

  A large number of lands LA1 and LA2, which are solderable alignment terminals, are formed on the lower surface of the LED package 21f at equal intervals on lattice points along the X and Y directions. Among these, the pair of lands LA1 are electrode terminals that are electrically connected individually to the LED elements 21h via the pedestals 61, respectively. Further, the remaining land LA2 is not connected to the LED element 21h, but is an electrically floating pseudo terminal or pseudo electrode. In the LED package 21f in a state before being fixed to the circuit board 21g, the solder balls BA are adhered and fixed to the lower surfaces of the lands LA1 and LA2, that is, the adhesive surface BS1.

  On the other hand, in a predetermined region on the surface of the circuit board 21g, a large number of lands LA3 and LA4 which are pads for soldering are formed as a group on the lattice points at equal intervals. These lands LA3 and LA4 are formed with a predetermined dimensional accuracy corresponding to the accuracy required for the mounting corresponding to the fixed position of the LED package 21f. Among these, the pair of lands LA3 are connected to the wiring pattern 21k and serve as electrode pads that enable power supply to the LED package 21f. The remaining land LA4 is not connected to the wiring pattern 21k, and is a pseudo float pad that is not intended to supply power to the LED package 21f.

  Here, attachment of the LED package 21f to the circuit board 21g will be described. Seven LED packages 21f are prepared in advance, and solder is printed on the bonding surfaces BS1 on the lands LA1 and LA2 provided on the lower surfaces of the LED packages 21f. For each LED package 21f, solder balls BA are placed on the lands LA1 and LA2 using an appropriate device, and the solder balls BA are melted and adhered to the lands LA1 and LA2 using a reflow technique or the like. . On the other hand, a circuit board 21g is prepared separately from the LED package 21f, and solder is printed on the adhesion surface BS2 on each land LA3, LA4 provided on the upper surface of the circuit board 21g. Thereafter, the seven LED packages 21f with the solder balls BA already attached are placed at corresponding positions on the circuit board 21g, and are put into the reflow apparatus. As a result, the solder ball BA is melted, and the lands LA1 and LA2 on the LED package 21f side and the lands LA3 and LA4 on the circuit board 21g side are joined to each other. At this time, the surface tension of each solder ball BA acts in a balanced manner, and the seven LED packages 21f and the circuit board 21g are precisely aligned.

  In addition, arrangement | positioning and space | interval of land LA1, LA2 etc. which are provided in the circuit board 21g surface can be suitably changed according to the positional accuracy at the time of attaching the LED package 21f on the circuit board 21g. Specifically, for example, the distance between the lands LA1 and LA2, that is, the pitch is set to about 2 to 4 times the mounting accuracy of the LED package 21f.

  Returning to FIG. 1, the G light illumination device 23 includes a G light source unit 23 a and a rod integrator 23 c. Among these, the G light source unit 23a has the same structure as the B light source unit 21a, but each LED package 23f on the circuit board 23g is included in the green (G) category of the three primary colors. Each LED element that generates light is incorporated, and the second light source light LG made of the G light is incident on the incident port IP of the rod integrator 23c without being leaked through the condenser lens array 23b. The second illumination light LG that has passed through the rod integrator 23c is uniformized without loss by wavefront division and superimposition, and G of the image forming unit 30 passes through the first polarizing filter 26b that is disposed to face the exit port OP. The light enters the liquid crystal light valve 33 for light. Thereby, the irradiated area on the liquid crystal light valve 33 is uniformly illuminated by the G light. The G light source unit 23a described above has the LED package 23f precisely aligned in the same manner as the B light source unit 21a, and supplies the G light to the next-stage rod integrator 23c in a desired state. As a result, the uniformity of the second illumination light LG can be increased.

  The R light illumination device 25 includes a light source unit for R light 25a and a rod integrator 25c. Among these, the R light source unit 25a has the same structure as the R light source unit 21a, but each LED package 25f on the circuit board 25g is included in the red (R) category of the three primary colors. Each LED element that generates light is built in, and the third light source light LR composed of the R light is incident on the incident port IP of the rod integrator 25c without being leaked through the condenser lens array 25b. The third illumination light LR that has passed through the rod integrator 25c is uniformized without loss by wavefront division and superimposition, and R of the image forming unit 30 passes through the first polarizing filter 26c disposed opposite to the exit port OP. The light enters the liquid crystal light valve 35 for light. Thereby, the irradiated area on the liquid crystal light valve 35 is illuminated uniformly with the R light. The R light source unit 25a described above has the LED package 25f precisely aligned in the same manner as the B light source unit 21a, and supplies the R light to the next stage rod integrator 25c in a desired state. be able to.

  Each of the liquid crystal light valves 31, 33, and 35 is a light transmission type light modulation device, and is driven by an element driving device 38 to switch the polarization direction of the illumination light in units of pixels. Illuminating light from each color light illuminating device 21, 23, 25 incident on the light 35 is two-dimensionally modulated. On the incident side of each liquid crystal light valve 31, 33, 35, first polarizing filters 26a, 26b, 26c are arranged facing the incident surface, and each liquid crystal light valve 31, 33, 35 is placed in a specific direction. It can be illuminated by a polarized component. In addition, second polarizing filters 36a, 36b, and 36c are arranged on the exit side of the liquid crystal light valves 31, 33, and 35 so as to face the exit surfaces, and pass through the liquid crystal light valves 31, 33, and 35. Only the polarization component in the direction orthogonal to the specified direction can be read out. Illumination light from the color light illuminators 21, 23, and 25 incident on the liquid crystal light valves 31, 33, and 35 is modulated two-dimensionally by the liquid crystal light valves 31, 33, and 35, respectively. The image lights of the respective colors that have passed through the liquid crystal light valves 31, 33, and 35 are combined by the cross dichroic prism 37 and emitted from one side surface thereof.

  As a projection optical system, the projection lens 40 projects the combined light image emitted from the cross dichroic prism 37 onto a screen (not shown) at an appropriate magnification. That is, the projector 10 projects a color image obtained by combining the images of the colors B, G, and R formed on the liquid crystal light valves 31, 33, and 35 onto the screen as a moving image or a still image.

  Hereinafter, the operation of the projector 10 shown in FIG. 1 will be described. The illumination lights of the respective colors from the BGR light illumination devices 21, 23, and 25 provided in the illumination device 20 are incident on the corresponding liquid crystal light valves 31, 33, and 35, respectively. Each of the liquid crystal light valves 31, 33, and 35 has a two-dimensional refractive index distribution modulated by an element driving device 38 that operates according to an image signal from the outside, and two-dimensional spatial distribution of illumination light of each color. Is modulated in units of pixels. As described above, the illumination light, that is, the image light modulated by the liquid crystal light valves 31, 33, and 35 is combined by the cross dichroic prism 37 and then enters the projection lens 40 which is a projection optical system and is projected onto the screen. . In this case, in each light source unit 21a, 23a, 25a, the LED packages 21f, 23f, 25f are mounted on the circuit boards 21g, 23g, 25g in a state of being precisely aligned. Uneven lighting is possible. As a result, it is possible to project a high-quality image without luminance unevenness, and color unevenness due to mounting errors of the LED packages 21f, 23f, and 25f provided for the respective light source units 21a, 23a, and 25a. It can be prevented from occurring. The lands LA1 to LA4 for precisely aligning the LED packages 21f, 23f, and 25f also have a role of reducing the thermal resistance, and the LED element 21h can be efficiently cooled and stably operated. As a result, the light emission of the LED packages 21f, 23f, and 25f can be stabilized.

[Second Embodiment]
Hereinafter, a projector according to a second embodiment of the invention will be described. Since the projector according to the second embodiment is a modification of the projector according to the first embodiment, description of common parts is omitted, and only different parts are described.

  FIG. 5 is a view for explaining the structure of the LED package 121f for B light incorporated in the projector of the second embodiment and its attachment to the circuit board 121g, and corresponds to FIG. In this case, the LED package 121f is a so-called leadless chip carrier (LCC).

  As illustrated, the LED package 121f has a structure in which an LED element 21h is fixed to the center of a rectangular pedestal 161, and the LED element 21h is enclosed in a transparent resin sealing body 165. The light source light from the LED element 21h is emitted to the front through the resin sealing body 165 whose tip is a lens. A reflection mirror can be provided on the base 161.

  A large number of notched terminals LA11 and LA12, which are solderable alignment terminals, are formed at appropriate intervals around the base 161 (side surfaces). Among these, the pair of lands LA11 are electrode terminals that are electrically connected to the LED element 21h. The remaining land LA12 is not connected to the LED element 21h, but is an electrically floating pseudo terminal or pseudo electrode.

  On the other hand, on the surface of the circuit board 121g, lands LA13 and LA14, each of which is a pad for soldering and extending in two rows in parallel in the X direction and the Y direction, are formed at appropriate intervals. Among these, the pair of lands LA13 are connected to the wiring pattern 121k and serve as electrode pads that enable power supply to the LED package 121f. The remaining land LA14 is not connected to the wiring pattern 121k, and is a pseudo float pad that is not intended to supply power to the LED package 121f.

  Here, attachment of the LED package 121f to the circuit board 121g will be described. First, the circuit board 21g is prepared, and solder is printed on the lands LA13 and LA14 provided on the upper surface of the circuit board 121g. Thereafter, the LED package 121f is placed at a corresponding position on the circuit board 121g and put into a reflow apparatus. As a result, the solder on the lands LA13 and LA14 is melted, and the curved adhesive surfaces of the notched terminals LA11 and LA12 provided on the LED package 21f side and the lands LA13 and LA14 on the circuit board 21g side are joined to each other. Fixed. At this time, the surface tension of each solder acts in a well-balanced manner between the notched terminals LA11 and LA12 and the lands LA13 and LA14 on the circuit board 21g side, and the LED package 121f and the circuit board 121g are precisely arranged. Aligned.

[Third Embodiment]
Hereinafter, a projector according to a third embodiment of the invention will be described. The projector according to the third embodiment is a modification of the projector according to the first embodiment.

  FIG. 6 is a view for explaining the structure of the LED package 221f for B light incorporated in the projector of the third embodiment and its attachment to the circuit board 221g.

  The LED package 221f is a surface mount package, and an LED element is enclosed in a rectangular parallelepiped main body 261. A pair of terminals LA21, which are solderable alignment terminals, are formed on both ends of the main body 261, particularly on the lower surface, and serve as electrode terminals that are electrically connected to the LED elements embedded therein. The bonding surface of the terminal LA21 is rectangular. In addition, a pair of notched terminals LA22 that are solderable alignment terminals are formed on both sides of the main body 261, and are not connected to the LED element 121h but become electrically floating pseudo terminals. . The adhesive surface of the notched terminal LA22 is a curved surface.

  On the other hand, a pair of lands LA23 facing the X direction and a pair of lands LA24 facing the Y direction, which are pads for soldering, are formed on the surface of the circuit board 221g. Among these, the pair of lands LA23 are connected to the wiring pattern 221k and serve as electrode pads that enable power supply to the LED package 121f. Further, the remaining pair of lands LA24 are not connected to the wiring pattern 221k, and are pseudo float pads.

  In the case of this embodiment, alignment in the X direction is achieved by soldering the terminal LA21 and the land LA23, and alignment in the Y direction is achieved by soldering the terminal LA22 and the land LA24. Thereby, the LED package 221f can be positioned two-dimensionally on the circuit board 221g.

  As described above, the present invention has been described according to the embodiment, but the present invention is not limited to the above embodiment. For example, in the first embodiment and the like, the number, arrangement, interval, and the like of the LED packages 21f, 23f, and 25f in the color light illumination devices 21, 23, and 25 can be appropriately changed according to the specifications of the projector. Further, the number, arrangement, interval, and the like of the lands LA1 to LA4 provided in the LED packages 21f, 23f, and 25f can be appropriately changed according to the specifications of the projector.

  In addition, the shape and structure of the condenser lens arrays 21b, 23b, and 25b in the color light illuminating devices 21, 23, and 25 can be appropriately changed according to the specifications of the projector. As a result, the incident angle range of the illumination light incident on the rod integrators 21c, 23c, and 25c of each color can be adjusted. As a result, the viewing angle of the illumination light incident on the liquid crystal light valves 31, 33, and 35 of each color is adjusted. The range can be freely controlled to some extent.

  For example, in the first embodiment, it is not necessary to use only the lands LA1 and LA3 for energization, and the lands LA2 and LA4 can also be used for energization in parallel.

  Further, as the projector 10, the light source light from the white light source is collected by a mirror or the like and incident on the incident end of the rod integrator to obtain uniform illumination light at the exit end of the rod integrator. It is also possible to directly illuminate a single color display type liquid crystal light valve disposed facing the integrator's exit end. In this case, instead of the color light source units 21a, 23a, and 25a as in the above embodiment, a white light source unit having the same structure as these is used, thereby projecting a high-quality image without uneven brightness. be able to. In addition, the LED package soldered on the circuit board in the white light source unit may include an LED element for each color of RGB or an LED element for B light and an RG light fluorescent material. it can.

It is a block diagram which illustrates notionally the structure of the projector of 1st Embodiment. It is a top view of the light source unit for B light. It is a perspective view for demonstrating the structure of an LED package, and its attachment. It is a perspective view for demonstrating the structure of an LED package, and its attachment. It is a perspective view explaining the principal part of the projector of 2nd Embodiment. It is a perspective view explaining the principal part of the projector of 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Projector, 20 ... Illumination device, 21, 23, 25 ... Each color light illumination device, 21, 23, 25 ... Light illumination device, 21a, 23a, 25a ... Light source unit for color light, 21b, 23b, 25b ... Condensing lens Array, 21c, 23c, 25c ... Rod integrator, 21f, 23f, 25f ... LED package, 21g, 23g, 25g ... Circuit board, 21h ... LED element, 21k ... Wiring pattern, 23 ... Light illumination device, 27 ... Light source drive device 30 ... Light modulation device 31, 33, 35 ... Liquid crystal light valve, 37 ... Cross dichroic prism, 38 ... Element drive device, 40 ... Projection lens, 50 ... Control device, LA1 to LA4 ... Land

Claims (10)

A light-emitting device having a solid-state light source chip that generates light source light and a plurality of alignment terminals that are two-dimensionally arranged below or on the side of the solid-state light source chip and can be soldered;
A lighting device comprising: a mounting substrate provided on the surface with a plurality of pads which are respectively arranged corresponding to the alignment terminals and which can be soldered.   The lighting device according to claim 1, wherein at least two of the plurality of alignment terminals are electrode terminals for energization.   The illumination device according to claim 2, wherein the remaining alignment terminals excluding the electrode terminals among the plurality of alignment terminals are pseudo terminals that are not intended to be energized.   4. The lighting device according to claim 1, wherein the plurality of alignment terminals and the plurality of pads are fixed while being self-aligned by a reflow process. 5.   The plurality of alignment terminals have an adhesive surface of a predetermined shape provided on the lower surface of the light emitting device, and each alignment terminal and the plurality of pads are connected via solder balls, respectively. The lighting device according to any one of claims 1 to 4, wherein the lighting device is characterized.   The plurality of alignment terminals have an adhesive surface of a predetermined shape provided on a side surface or a lower surface of the light emitting device, and each alignment terminal and the plurality of pads are connected via a solder layer. The lighting device according to any one of claims 1 to 4, wherein   The lighting device according to claim 6, wherein the light emitting device is a surface mount package in which a solid light source chip and the plurality of alignment terminals are embedded and integrated.   The lighting device according to claim 1, wherein a plurality of the light emitting devices are attached in a predetermined arrangement on the mounting substrate. The illumination device for each color according to any one of claims 1 to 8, wherein the light source light of each color from the light emitting device provided for each color is emitted as illumination light of each color;
A light modulation device of each color illuminated by illumination light of each color from the illumination device of each color;
A light combining optical system for combining and emitting image light of each color modulated by the light modulation device of each color;
A projector comprising: a projection optical system that projects image light combined through the light combining optical system. The illumination device according to any one of claims 1 to 8, wherein the light source light from the light emitting device is emitted as illumination light.
A light modulation device illuminated by illumination light from the illumination device;
A projector comprising: a projection optical system that projects image light modulated by the light modulation device.

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