JP2005114882A - Method for placing substrate on process stage, substrate exposure stage, and substrate exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for placing a substrate on a process stage suitable for handling a large substrate by which a substrate can be fast placed on a substrate chuck table with high accuracy, and to provide a substrate exposure stage. <P>SOLUTION: The substrate exposure stage is equipped with: a table having a substrate placing face where a substrate is to be placed; and three or more sucking pins which protrude from the substrate placing face to specified height with respect to the substrate placing face so as to form a plane receiving the substrate and which relatively retreat to at least the substrate placing face. A substrate carried by a handling robot is received and sucked at specified height by the sucking pins, and then placed on the substrate placing face by making the sucking pins relatively retreat to the substrate placing face. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate mounting method for a processing stage, a substrate exposure stage, and a substrate exposure apparatus. More specifically, in a substrate exposure apparatus for a liquid crystal panel, an exposure substrate can be mounted on a substrate chuck table at high speed and with high accuracy. Thus, the present invention relates to an improvement in a substrate mounting method for a processing stage suitable for handling a large substrate.

In a liquid crystal panel, a mask on which a pattern is drawn on a transparent plate is used as an original plate, and this is optically projected onto an exposed substrate such as a glass substrate to copy the pattern.
In recent years, the yield for large-sized liquid crystal substrates has been improved, so that the substrate to be allocated is assigned to a large-sized exposure substrate (multiple exposure substrate) for exposure, and the substrate to be allocated is cut out from the large substrate after exposure. A so-called plural number of sheets are taken.
In this type of projection exposure, exposure is usually performed with a proximity gap of several tens of micrometers to several hundreds of micrometers. At this time, it is necessary for the mask original plate and the substrate to be exposed to be parallel to each other at a projection position approached by a minute distance Δg. For this purpose, the height position of the substrate with respect to the mask is measured at a plurality of positions with a gap sensor or the like by a plurality of optical measuring instruments, and the three points of the tilt mechanism are driven up and down by the measurement data to vertically move the substrate chuck table. It moves, and parallel projection (gap setting) is performed to make them parallel at the projection position. Patent Document 1 by the applicant is known as this type of exposure apparatus.
In addition, since the exposure of the multi-chip liquid crystal substrate is performed by projection exposure corresponding to each substrate to be cut out, it is necessary to perform parallel exposure for each assigned substrate.
Japanese Unexamined Patent Publication No. Hei 6-291010

Not only large substrates, but especially when exposing multi-piece exposure substrates, it is necessary to position and deliver to the substrate chuck table with high accuracy because the allocated substrate is cut out later. . As a substrate chuck table for this type of large substrate, a table in which suction grooves are formed symmetrically from the center is known (Patent Document 2).
On the other hand, in the exposure apparatus, there is a step between the exposure substrate transported by the substrate handling robot from the loader side or the like and the height of the substrate chuck table of the exposure stage. Further, the exposure substrate cannot be placed on the substrate chuck table unless a level difference is provided. In the case of a large substrate, this step must be as large as several centimeters from the viewpoint of substrate looseness and handling safety. Therefore, the substrate handling robot normally descends and sets the exposure substrate on the substrate chuck table.
However, the arm of the handling robot for large substrates cannot be chucked on both sides of the substrate, and takes the form of holding the back side of the substrate. Therefore, a space is required for the handling robot arm to escape from the back side of the substrate. Therefore, a guide groove or the like for escaping the arm is provided on the substrate chuck table, or in order to escape the arm, a push-up pin is provided instead of such a guide groove to receive the substrate. As for the latter, the invention by the applicant is known as Patent Document 3.
JP-A-7-183366 JP 2000-237983 A

Since the substrate becomes large and the glass substrate is thin and heavy, high-speed descent handling can cause chipping of the substrate and misalignment when placed on the substrate chuck table. . Therefore, the descent speed of the handling robot arm must be slowed down. Thereby, the throughput of the handling process which carries an exposure board | substrate in an exposure stage falls.
Moreover, in the case where the guide groove or the like is provided, the substrate placed in the guide groove portion is in a non-contact state, so that the substrate is likely to be distorted, and in the exposure apparatus, this causes uneven exposure. Become one. In order to avoid such a situation, when the above-described push-up pin is used, a lateral shift of the substrate is likely to occur when the push-up pin is lowered. In order to solve this problem, in Patent Document 3 described above, the height of the push-up pin is changed to slightly curve the exposed substrate so that the central portion comes into contact with the substrate chuck table first. Since it is necessary to lower it gradually, there is a problem that it takes time to place the exposure substrate on the substrate chuck table.
SUMMARY OF THE INVENTION An object of the present invention is to solve such problems of the prior art, and it is possible to place a substrate on a substrate chuck table with high speed and high accuracy, and a processing stage suitable for handling a large substrate. Another object of the present invention is to provide a substrate mounting method.
Another object of the present invention is to provide a substrate exposure stage and a substrate exposure apparatus that can place a substrate on a substrate chuck table at high speed and with high accuracy and are suitable for handling a large substrate.

In order to achieve such an object, the substrate mounting method and the substrate exposure stage of the present invention are characterized by a table having a substrate mounting surface on which a substrate is mounted and a predetermined height with respect to the substrate mounting surface. And a substrate receiving surface that protrudes from the substrate mounting surface and has at least three suction pins that retreat relatively to the substrate mounting surface. The substrate transported via the handling robot has a predetermined height. The suction pins are received and sucked, and the suction pins are relatively moved backward to the substrate placement surface and placed on the substrate placement surface.
Further, the substrate exposure apparatus according to the present invention is characterized by a table having a substrate placement surface on which a substrate is placed, and a surface that receives the substrate by protruding from the substrate placement surface at a predetermined height with respect to the substrate placement surface. And a substrate exposure stage having at least three suction pins that recede relatively to at least the substrate mounting surface,
The suction pin sucks the substrate transported through the handling robot at a predetermined height, moves back to the substrate placement surface to place the substrate on the substrate placement surface, and the placed substrate is exposed. It is what is done.

As described above, according to the present invention, the table is provided with three or more suction pins protruding at a predetermined height that form a surface for receiving the substrate with respect to the substrate placement surface of the table, and at least three suction pins After receiving the substrate, the suction pins are relatively retracted to the substrate placement surface of the table, and the substrate is placed on the table.
In this case, since the substrate is in an attracting state even when the descending speed is increased when placing the substrate on the table, the substrate can be placed on the table safely and with high accuracy with almost no lateral displacement of the substrate. .
Further, since the substrate is sucked, the table can be moved with respect to the suction pin. If the table side is moved in this way, the substrate does not move up and down, so that the substrate can be secured in the attracted position, and no lateral deviation occurs. Therefore, the accuracy with which the handling arm sets the substrate on the suction pin is maintained as it is.
Furthermore, since the suction pins protrude from the substrate mounting surface at a predetermined height, even if the arm of the handling robot is on the back surface of the substrate, it can be retracted from the table side at high speed.
In particular, in the case of a multi-piece exposure substrate in which a plurality of substrates to be allocated are allocated, the exposure substrate can be securely held if the suction pin is cylindrical and the head is the suction surface. Positioning movement of the substrate with respect to the mask becomes possible. Therefore, the moving operation of moving the allocated substrate to the mask position and the operation of retracting the suction pins to the substrate mounting surface of the table can be performed simultaneously, and the time until the exposure substrate is chucked on the table is shortened.
As a result, it is possible to place the substrate on the substrate chuck table at high speed and with high accuracy, and it is possible to easily realize a substrate placement method, a substrate exposure stage, and a substrate exposure apparatus suitable for handling a large substrate. it can.

FIG. 1 is an explanatory view of an exposure apparatus for a multi-piece exposure substrate to which the substrate mounting method of the present invention is applied, FIG. 2 is an explanatory view of the multi-piece exposure substrate, and FIG. 3 is an explanation of the substrate chuck table. 4 and 4 are cross-sectional explanatory views regarding the relationship between the table elevating mechanism and the suction pins, and FIG. 5 is an explanatory view of the exposure substrate handling process.
In FIG. 1, 10 is a mechanism unit of the exposure apparatus, and 20 is a control unit.
In addition, the exposure apparatus 10 includes exposure means including an exposure light source and various mechanisms for loading and unloading the exposure substrate, but these are omitted in the drawing.
An exposure stage 2 in the mechanism unit 10 includes an XYθ stage 3, a tilt device 4 (consisting of tilt mechanisms 4 F, 4 R, and 4 C) provided on the XYθ stage 3 and a substrate chuck table 5. The substrate chuck table 5 is supported by the tilt device 4. The substrate chuck table 5 can be linearly moved and rotated in the X direction and the Y direction, and the tilt device 4 can control the tilt. The XYθ stage 3 includes a Y stage 3a, an X stage 3b, and a θ stage 3c, and is placed on the stone surface plate 2a. Here, the tilt device 4 is a Z stage.
As shown in FIG. 1, the tilt device 4 includes tilt mechanisms 4F, 4R, and 4C. The tilt mechanism 4F is provided at the front position F, the tilt mechanism 4R is provided at the rear position R, and the tilt mechanism 4C is at the center position. And each is arranged at a position to be a vertex of the triangle.

An exposure substrate 6 shown in FIG. 2 is placed on the substrate chuck table 5. Six substrates to be allocated (hereinafter referred to as cell substrates) 6a, 6b, 6c, 6d, 6e, and 6f are allocated to the exposure substrate 6.
Returning to FIG. 1, 7 a, 7 b, 7 c, and 7 d are gap sensors that measure the gap between the exposure substrate 6 placed on the substrate chuck table 5 and the mask 1. The gap sensors 7a, 7b, 7c, and 7d are sequentially positioned on one of the assigned substrates 6a to 6f together with the mask 1 by the XY movement of the substrate chuck table 5, and are arranged at the upper four corners of each.
In FIG. 1, the front left and right gap sensors 7a and 7b and the rear left and right gap sensors 7c and 7d overlap each other, and only one of them is shown.

The gap sensors 7a, 7b, 7c, and 7d receive one of the six cell substrates 6a to 6f assigned to the exposure substrate 6 and the reflected light of the mask 1 simultaneously with a one-dimensional CCD, and the received elements. A signal corresponding to the gap is generated according to the position of. The gap detection signal obtained from the gap sensors 7a, 7b, 7c, and 7d is a signal having a high level at the position of the element that has received the reflected light. Therefore, when this signal is received by the binarization circuit 24 and binarized, a signal that causes the light receiving position to be “1” is generated. This digital value is input to the microprocessor (MPU) 21 through the interface 22 in the control unit 20. Since the interval between the “1” bits among the binarized “1” and “0” bits represents the gap value, the gap is calculated by the MPU 21 and detected by the gap sensors 7a, 7b, 7c, and 7d. The respective gap values are stored in the memory 23 corresponding to the measurement points at the four corners.
Then, the MPU 21 drives the drive circuit 25 via the interface 22 and sets the gaps between the mask 1 and the cell substrates 6a, 6b, 6c, 6d, 6e, 6f by the tilt device 4, respectively. Further, an actuator 59 of a table elevating mechanism 55 described later is driven. In addition, an air pump or the like is driven in order to suck the exposure substrate 6 through the suction holes and suction grooves under negative pressure.

Here, the memory 23 includes a gap direct control exposure processing program 23a, a gap setting master data storage program 23b, a regression plane function calculation program 23c, a tilt control value calculation program 23d, a tilt mechanism drive program 23e, and an exposure substrate placement control. A program 23f is provided. Further, the memory 23 has a parameter area 23g for storing gap setting master data DF (corresponding to the front position tilt mechanism 4F), DR (corresponding to the rear position tilt mechanism 4R), DC (corresponding to the center position tilt mechanism 4C), and the like. Is provided.
The gap direct control exposure processing program 23a is executed by the MPU 21. When the MPU 21 exposes the cell substrates 6a to 6f of the first multi-piece exposure substrate 6, the cell substrates 6a to 6f (first cell substrates) are exposed. -Sixth cell substrate) are exposed in parallel and exposed. Further, the gap setting values at the time of parallel projection are stored in the parameter area 23g as master data DF, DR, DC corresponding to each of the cell substrates 6a to 6f.
In addition, when exposing the cell substrates 6a to 6f of the second and subsequent multi-chip exposure substrates 6, only the cell substrate 6a (first cell substrate) is parallelized and the gap setting value when the parallel substrate is paralleled and 1 Differences ΔF, ΔR, ΔC from master data DF, DR, DC when exposing the cell substrate 6a of the first exposure substrate 6 are stored as correction values in the parameter area 23g, and the remaining cells in the second and subsequent sheets are stored. When the substrates 6b to 6f are paralleled, only the differences ΔF, ΔR, and ΔC are corrected for the respective master data DF, DR, and DC to directly tilt the mechanisms 4F, 4R, and 4C without parallelism. Is controlled to set the gap, and the exposure process is started.

The regression plane function calculation program 23c, the tilt control value calculation program 23d, and the tilt mechanism driving program 23e are programs that are called and executed during the execution of the gap direct control exposure processing program 23a for parallel alignment processing and the like. is there.
The exposure substrate placement control program 23f is called by the gap direct control exposure processing program 23a and executed by the MPU 21 when the exposure substrate 6 is received. At this time, the MPU 21 sucks the exposure substrate 6 by the suction pins 51 according to the procedure shown in FIG. 5, raises the chuck table body 50 toward the suction pins 51, and simultaneously places the exposure substrate 6 on the chuck table body 50. Parallel operation control for positioning the first cell substrate at the position of the mask 1 is performed.

As shown in FIG. 3A, the substrate chuck table 5 has a chuck table main body 50 for sucking and chucking the exposure substrate 6, a suction pin 51, and a table lifting mechanism 55 (see FIG. 4). The suction pins 51 are cylindrical bodies, and are arranged in a large number in the vertical and horizontal directions on the substrate placement surface 50 a of the chuck table 50. Each suction pin 51 has a circular suction surface in which a suction hole 52 is provided in the head, as shown in the partial enlarged view of FIG. The substrate mounting surface 50 a is provided with insertion holes 53 vertically and horizontally at predetermined intervals, and suction pins 51 are inserted into the respective insertion holes 53. The suction pin 51 protrudes from the substrate placement surface 50a so as to protrude from the insertion hole 53 by several cm, for example, about 40 mm to 45 mm.
In addition, the point shown on the substrate mounting surface 50a is a point obtained by an antireflection brass processing. Reference numeral 54 denotes a substrate suction groove provided on the substrate mounting surface 50a, and 54a is a suction hole that makes the substrate suction groove 54 a negative pressure. A negative pressure is applied to adsorb the exposure substrate 6.
When the chuck table main body 50 is lifted by the table lifting mechanism 55, the suction pins 51 retreat to the substrate placement surface 50a as shown in FIG. As a result, the exposure substrate 6 is placed on the substrate placement surface 50 a and is sucked and held by the substrate suction groove 54.
The chuck table main body 50 is lifted to the suction pin 51 side after the exposure substrate 6 is transported from the loader side by the robot hand and placed on the suction pin 51, and then the exposure substrate 6 is sucked. At this time, since the exposure substrate 6 is in the suction state, even if the chuck table body 50 is moved to the suction pin 51 side and the back surface of the exposure substrate 6 is brought into contact with the substrate placement surface 50a, the lateral displacement of the exposure substrate 6 does not occur. . In addition, if the chuck table main body 50 is raised in this way, the exposure substrate 6 does not move up and down. Thereby, the exposure substrate 6 can secure the position of the suction state, and can secure the positioning accuracy during conveyance.

FIG. 4 is an explanatory cross-sectional view of the relationship between the table elevating mechanism 55 for raising the chuck table body 50 and the suction pins 51 in this case.
Each suction pin 51 is fixed to a frame 56 provided on the back surface of the chuck table main body 50 via a bracket 56a. The suction pin 51 is slidably held by a sleeve 57 that is attached and fixed to the back surface of the chuck table main body 50 corresponding to the insertion hole 53, and is inserted into the insertion hole 53. A coil spring 58 is mounted between the sleeve 57 and the suction pin 51 via a flange 51 a fixed on the rear side of the suction pin 51.
Note that the frame 56 is fixed to the XYθ stage 3 via a flexible coupling (not shown) or the like, and allows a minute raising / lowering operation of the chuck table main body 50 by the tilt device 4 of about several hundred μm.
The table elevating mechanism 55 includes an actuator 59 fixed to the frame 56 and a planting pin 60 planted on the back surface of the chuck table body 50, and the rod 59 a of the actuator 59 is connected to the planting pin 60 via the frame 61. Are combined. The frame 61 is provided along the suction pins 51 in the vertical direction or the horizontal direction, and is provided on one of the other suction pins so as to be shared with other table lifting mechanisms 55 (not shown). A plurality of other table elevating mechanisms 55 are arranged along the frame 61 in a distributed manner.
Reference numeral 62 denotes an air pipe connected to the rear portion of the suction pin 51 for making the suction hole 52 have a negative pressure, connected to a suction air pump (not shown), and provided at the center of the suction pin 51. The suction hole 52 communicates with the through hole 51b.

When the actuator 59 is driven to extend by the drive circuit 25 and the rod 59a extends, the frame 61 moves forward. As a result, the chuck table main body 50 moves forward toward the suction pin 51 and enters the state shown in FIG. At this time, the coil spring 58 mounted between the sleeve 57 and the suction pin 51 extends.
On the other hand, when the actuator 59 is reduced and driven by the drive circuit 25 and the rod 59a is reduced, the coil spring 58 returns to the original state, and the chuck table main body 50 is retracted from the head of the suction pin 51 and is in the state shown in FIG. become.

FIG. 5 is an explanatory diagram of an exposure substrate handling process performed by the MPU 21 executing the exposure substrate placement control program 23f.
First, the exposure substrate 6 is transferred from the loader side to the upper portion of the substrate chuck table 5 of the exposure stage 2 by the handling robot 8. As a result, the exposure substrate 6 stops at a position of 5 mm to 10 mm above the suction pin 51 (FIG. 5A).
Next, as indicated by the dotted line, the handling robot 8 is lowered by 5 mm to 10 mm, and the back surface of the exposure substrate 6 contacts the head of the suction pin 51. At this time, the suction arm of the handling robot 8 on the back surface of the exposure substrate 6 enters between the suction pin 51 and another suction pin 51 (FIG. 5B). The suction arm has a fork shape that avoids the position of the suction pin 51.
Here, the suction hole 52 of the suction pin 51 is driven by negative pressure via the air pump and the air pipe 62, air suction is started, and the exposure substrate 6 is sucked by the suction pin 51 (FIG. 5C). . At this time, the handling robot 8 is retracted from the substrate chuck table 5 at the same time.
Next, the table elevating mechanism 55 is driven and the chuck table main body 50 starts to rise (FIG. 5D). The XYθ stage 3 is simultaneously driven to position the first cell substrate 6 a of the exposure substrate 6 at the position of the mask 1, and the substrate mounting surface 50 a of the chuck table body 50 that has advanced toward the suction pins 51 is the back surface of the exposure substrate 6. , The chuck table body 50 starts to suck the exposure substrate 6 and the suction pins 51 are released from the suction (FIG. 5E). As a result, the state shown in FIG. 1 is obtained.
Thereafter, parallel processing for setting a gap between the first cell substrate 6a and the mask 1 is started.
After this parallel processing is completed, the marks and the like are aligned, and the pattern of the mask 1 is changed to the first pattern by the exposure light irradiated from the irradiation optical system of the exposure means (not shown) to the first cell substrate 6a. The cell substrate 6a is exposed. The second cell substrate 6b to the sixth cell substrate 6f, which are sequentially positioned, are also exposed by the same process after the parallel alignment process is completed.

After exposure, contrary to the above, suction of the suction pins 51 is started in the state of FIG. 5E, and suction of the exposure substrate 6 by the chuck table body 50 is released. Then, the table elevating mechanism 55 is driven to return from the state shown in FIG. 5E to the state shown in FIG. 5D, and the chuck table main body 50 is lowered and retracted from the suction pin 51 side, as shown in FIG. It becomes a state. In this state, contrary to the above, the handling robot 8 enters between the suction pins 51, the suction pins 51 are released from the suction of the exposure substrate 6, and the state shown in FIG. It rises by 5 mm to 10 mm to the state shown in FIG. Then, the handling robot 8 transports the exposed exposure substrate 6 to the unloader.
A handling robot 9 may be provided on the opposite side of the handling robot 8 across the substrate chuck table 5 as indicated by a dotted line for exclusive use of the unloader. This handling robot 9 can take out the exposed exposure substrate 6 from the side opposite to the carry-in side.
In this way, the handling robot 8 can alternately carry in and place the exposure substrate 6 on the substrate chuck table 5, and the handling robot 9 can carry out the exposure substrate 6 from the substrate chuck table 5 alternately. The handling processing speed can be further improved.

As described above, in the embodiment, the chuck table main body 50 is lifted and lowered, but it is needless to say that the suction pin 51 may be lowered to the state shown in FIGS. 3 (a) to 3 (c). .
In the embodiment, a large number of suction pins are provided in the vertical direction and the horizontal direction, but the number of suction pins may be at least three because it is sufficient to form a surface for receiving the substrate.

FIG. 1 is an explanatory view of an exposure apparatus for a multi-piece exposure substrate to which the substrate exposure method of the present invention is applied. FIG. 2 is an explanatory view of the multi-piece exposure substrate. FIG. 3 is an explanatory diagram of the substrate chuck table. FIG. 4 is a cross-sectional explanatory diagram regarding the relationship between the table lifting mechanism and the suction pin. FIG. 5 is an explanatory diagram of the exposure substrate handling process.

Explanation of symbols

1 ... mask, 2 ... exposure stage,
3 ... XYθ stage, 4 ... tilt device (tilt mechanisms 4F, 4R, 4C)
5 ... Substrate chuck table, 6 ... Exposed substrate,
6a, 6b, 6c, 6d, 6e, 6f ... allocated substrate (cell substrate),
7a, 7b, 7c, 7d ... Gap sensor,
8 ... Handling robot,
10 ... Mechanism part of exposure apparatus, 20 ... Control part,
21 ... MPU, 22 ... interface,
23 ... Memory,
23a ... Gap direct control exposure processing program,
23b ... Gap setting master data storage program,
23c ... Regression plane function calculation program,
23d: tilt control value calculation program,
23e: Tilt mechanism drive program 23f: Exposure substrate placement control program,
50 ... Chuck table body, 50a ... Substrate mounting surface,
51 ... Suction pin, 52 ... Suction hole, 53 ... Insertion hole 53,
54 ... Substrate adsorption groove, 55 ... Table lifting mechanism,
56, 61 ... frame, 57 ... sleeve, 58 ... coil spring,
59 ... actuator, 60 ... planting pin.

Claims (8)

  A table having a substrate placement surface on which a substrate is placed; and at least the substrate placement surface that forms a surface that protrudes from the substrate placement surface at a predetermined height relative to the substrate placement surface to receive the substrate Three or more suction pins that retreat relative to each other, the suction pins receive and suck the substrate transported via a handling robot at the predetermined height, and the suction pins relatively A substrate placement method for a processing stage that is retracted to a substrate placement surface and placed on the substrate placement surface.   And a lifting mechanism that lifts and lowers the table relative to the suction pin at the predetermined height, the substrate is an exposure substrate, and the table is a substrate chuck table that chucks the exposure substrate. 2. A substrate mounting method for a processing stage according to claim 1, wherein the substrate is mounted on a processing stage that exposes the exposure substrate in parallel.   And a lifting mechanism that lifts and lowers the suction pins with respect to the table. The substrate is an exposure substrate. The table is a substrate chuck table that chucks the exposure substrate. The substrate mounting method for a processing stage according to claim 1, wherein the substrate mounting method is provided on a processing stage that performs exposure.   The substrate chuck table chucks the exposed substrate by suction, and the suction pin is a cylindrical body having a suction hole in a head, and is provided in the substrate chuck table in a vertical direction and a horizontal direction at predetermined intervals. The lift mechanism is provided on the back surface of the substrate chuck table, and the exposure substrate is mounted on the substrate mounting surface and is sucked by the suction pins. 4. The method of placing a substrate on a processing stage according to claim 2 or 3, wherein suction is performed by the substrate chuck table.   The exposure substrate is a multi-piece exposure substrate in which a plurality of substrates to be allocated are assigned to one exposure substrate, and the substrate chuck table is an XY moving table in a state of being sucked by the suction pins. 5. The substrate mounting method for a processing stage according to claim 4, wherein the suction pin relatively moves back to the substrate mounting surface and the substrate chuck table moves to position the allocated substrate on a mask.   A substrate exposure stage using the substrate mounting method for a processing stage according to claim 1. A table having a substrate placement surface on which a substrate is placed; and at least the substrate placement surface that forms a surface that protrudes from the substrate placement surface at a predetermined height relative to the substrate placement surface to receive the substrate A substrate exposure stage having three or more suction pins that are relatively retracted to
The suction pin sucks the substrate transported via a handling robot at the predetermined height, and moves back to the substrate placement surface to place the substrate on the substrate placement surface. A substrate exposure apparatus in which the processed substrate is exposed.   A display panel manufactured by the substrate exposure apparatus according to claim 7.

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