JP2005079065A - Light source device, manufacturing method of light source device, and projection type display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source device which allows a solid light source to be cooled with high efficiency, even when a large quantity of heat is generated from the solid light source including a fine heat generation area. <P>SOLUTION: This light source device 100 is equipped with the solid light source 11, and a base material 21 for mounting the light source 11. In the base material 11, a surface opposite to the mounting surface of the light source 11 is formed into an uneven surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light source device and a projection display device, and more particularly to a light source device having a configuration suitable for cooling a light source.

Projection-type display such as a projector that displays light by causing light emitted from the light source device to enter a light modulation unit such as a liquid crystal light valve and to enlarge and project the image light modulated by the light modulation unit onto a screen by a projection lens or the like. The device is widely known. A solid light source such as an LED light source is employed as a light source used in the light source device of the projection display device. Since such a solid light source generates heat with light emission, cooling is required to improve the light emission efficiency. As a method of cooling such a solid light source, for example, there is one disclosed in Patent Document 1.
JP 7-68840 A

  In the said patent document 1, it comprised from the LED support bar which mounted LED, and the heat conductor which is arrange | positioned and contacted with this LED support bar thermally, and comprised the U-shaped duct inside. A cooling system is disclosed. In this case, since the duct is only U-shaped, only the cooling fluid near the mounted LED can exchange heat, and high cooling efficiency cannot be obtained for the part to be cooled. .

  The present invention has been made in view of the above problems, and provides a light source device capable of cooling a solid light source with high efficiency even when a large amount of heat is generated from the solid light source including a minute heat generation region. It is aimed. In addition, the present invention provides a light source device that has a simple structure for cooling the solid-state light source and can contribute to reduction in manufacturing cost. Furthermore, an object of the present invention is to provide a highly reliable projection type display device including such a light source device.

  In order to solve the above-described problems, a light source device of the present invention includes a solid light source and a base material on which the solid light source is placed, and the base material is opposite to the placement surface of the solid light source. The surface is made an uneven surface.

  According to such a light source device, since the uneven surface is formed on the back surface side of the base material on which the solid light source is placed, it is possible to perform highly efficient cooling on the back surface side. That is, even when the solid light source generates heat with light emission, the solid light source can be indirectly cooled through the base material by cooling the back side of the base material with a cooling fluid such as air or water. In addition, since the uneven surface is formed on the back surface side in the present invention, the contact area between the cooling fluid and the substrate is increased, and the heat exchange efficiency is very high. In this case, the thermal resistance from the solid light source that is the heat source to the cooling fluid is small as compared with, for example, the case where the fins are separately fixed to the back side of the base material, and cooling can be performed efficiently. Furthermore, the manufacturing process is simple, and it is possible to effectively cool through the convex portion even in a region away from the substrate. Therefore, the utilization efficiency of the cooling fluid is high, and as a result, the solid light source can be cooled with high efficiency. In addition, since cooling is performed on the surface opposite to the mounting surface of the solid light source, that is, on the side opposite to the light emitting surface, when liquid is used as the cooling fluid, bubbles or the like are generated in the liquid. Even in this case, there is no optical influence of the bubbles. In the present invention, the base material on which the solid light source is placed is preferably composed of a metal substrate with excellent thermal conductivity and excellent workability, and in this case, it can be easily formed by a processing technique such as etching. An uneven surface can be provided.

  In the present invention, a flow path through which a cooling fluid for cooling the solid-state light source flows may be disposed on the side of the base material on which the uneven surface is formed. By allowing the cooling fluid to flow through the flow path, heat exchange can be performed with high efficiency between the base material and the solid light source via the uneven surface of the base material.

  The cooling fluid may be configured to directly flow into a portion corresponding to the back surface of the solid-state light source in the uneven surface of the base material. In this case, since the cooling fluid directly hits the back surface of the solid light source, the cooling efficiency can be further improved, and turbulent flow can be generated around the uneven surface, thereby further improving the cooling efficiency. It becomes. As a specific configuration, it is possible to employ a configuration in which the inlet of the cooling fluid is oriented with respect to the uneven surface of the base material (particularly, the portion corresponding to the back surface of the solid light source). The turbulent flow occurs in the cooling fluid because the cooling fluid sprayed on the back surface of the base material circulates in all directions after colliding with the back surface of the base material. This is because it circulates in a direction crossing the direction.

  In the distribution channel, the surface facing the uneven surface of the base material may be provided with uneven surfaces formed alternately with the uneven surface of the base material. In this case, a flow path that follows the shape is surely formed between the irregularities, and it is difficult for problems such as stagnation to occur in the flow of the cooling fluid during the flow. It becomes possible to distribute | circulate on a distribution path with low resistance, and it becomes possible to aim at the improvement of the further cooling efficiency. In this case, in detail, it can be configured such that the convex portions of the opposing surfaces are located between the convex portions of the base material.

  Next, in order to solve the above-described problem, the light source device of the present invention includes, as a different aspect thereof, a solid light source in which a semiconductor layer is formed between a pair of electrodes, and is disposed on the light emission back side of the solid light source. The back surface of the formed electrode is an uneven surface.

  According to such a light source device, by forming an uneven surface on the back surface of the electrode constituting the solid light source, it becomes possible to directly and efficiently cool the solid light source on the back surface side. That is, even when the solid light source generates heat with light emission, the solid light source is cooled by cooling the electrode arranged on the light emitting back side among the members constituting the solid light source with a cooling fluid such as air or water. In the present invention, the uneven surface is formed on the back side of the electrode, so that the contact area between the cooling fluid and the electrode increases, and the heat exchange efficiency becomes very high. In this case, for example, as compared with the case where a base material is fixed to the back surface side of the electrode and unevenness is formed on the base material, the heat resistance from the solid light source as a heat source to the cooling fluid is further reduced and cooling is performed efficiently. Can do. The manufacturing process is simple, and it is possible to effectively cool the region away from the electrode through the convex portion. Therefore, the utilization efficiency of the cooling fluid is high, and as a result, the solid light source can be cooled with high efficiency. In addition, since cooling is performed on the surface opposite to the light emitting surface of the solid light source, that is, the light emitting back surface, when a liquid is used as a cooling fluid, even when bubbles or the like are generated in the liquid, the optical In particular, it is not affected by the bubbles. In the present invention, for example, a metal electrode or the like can be adopted as an electrode for providing an uneven surface, and such a metal electrode can be easily provided with an uneven surface by a processing technique such as etching.

  As a method of making the back surface of the electrode formed on the light emitting back surface side of the solid-state light source as an uneven surface as described above, in addition to a method of performing processing such as etching on the electrode, the light emitting back surface side of the semiconductor layer It is also possible to make the back surface of the n- or p-type semiconductor layer disposed on the concave-convex surface, and to form the concave-convex surface on the back surface of the electrode disposed on the light emitting back surface side following the concave-convex surface. In this case, since the semiconductor layer is relatively thicker than the electrode, it is relatively simple to give the semiconductor layer an uneven surface. In addition, by applying a coating for preventing corrosion on the back side of the electrode, it is possible to prevent or suppress corrosion of the electrode even when water or the like is used as a cooling fluid.

  Next, a projection type display device of the present invention is characterized by comprising the above-described light source device. Specifically, the light source device includes a light modulation device that modulates light emitted from the light source device, and a projection device that projects light modulated by the light modulation device. Can do. Since such a projection type display device includes a light source device with excellent cooling efficiency, it is difficult to cause wear of the light source device due to heat generation or decrease in light emission efficiency of the light source device, and is extremely reliable. It becomes.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In addition, in each figure, in order to make each layer and each member the size which can be recognized on drawing, the scale is varied for every layer and each member.

(Light source device)
FIG. 1 is a schematic cross-sectional view showing a schematic configuration of a light source device according to an embodiment of the present invention. FIG. It is a top view. First, the light source device 100 shown in FIG. 1 has a solid light source 11 that mainly emits light, a metal substrate (base material) 21 on which the solid light source 11 is placed and fixed, and a metal substrate 21 that is placed and fixed. A cooling case 31 having a flow part 50 through which a cooling fluid can flow is mainly configured.

  In the case of the present embodiment, a solid light source that generates heat due to light emission from an LED light source using a light emitting diode element is employed as the solid light source 11. Specifically, an LED element having an n-type and p-type GaP layer sandwiched between a pair of electrodes is used.

  The cooling case 31 is made of a material that can be easily molded, such as a resin, and a through hole 51 is formed in the bottom thereof (that is, the side on which the metal substrate 21 is placed is the upper side and the opposite side). An inflow pipe 41 for introducing a cooling fluid into the flow part 50 is fixed to the through hole 51. In addition, an outlet 35 for discharging the cooling fluid from the circulation part 50 is formed on the side of the cooling case 31. The tip of the inflow pipe 41 is disposed to face the back surface of the metal substrate 21 (the surface on which the solid light source 11 is placed), that is, the inlet of the inflow pipe 41 is on the back surface of the metal substrate 21. In particular, it is directed to the back surface of the place where the solid light source 11 is placed. Thus, in this embodiment, the cooling case 31 functions as a pedestal that fixes the position of the solid-state light source 11 and forms a cooling fluid circulation portion.

  The back surface of the metal substrate 21, that is, the surface opposite to the mounting surface of the solid light source 11 is an uneven surface, and a large number of protrusions 25 are formed. The protrusions 25 function as fins for improving the cooling efficiency of the metal substrate 21 by the cooling fluid, and a plurality of protrusions 25 are formed on substantially the entire surface of the rectangular metal substrate 21 as shown in FIG. Such protrusions 24 can be formed, for example, by a known etching process on the metal substrate 21, and it is particularly preferable to coat the surface of the metal substrate 21 that contacts the cooling fluid to prevent corrosion.

  Here, when the cooling fluid is introduced from the inflow pipe 41 into the flow part 50 in the cooling case 31 using a pump or the like, the cooling fluid spreads radially around the back surface of the opposing metal substrate 21. In the figure, the arrow indicates the direction in which the cooling fluid flows. That is, since the cooling fluid flows from the central portion of the solid light source 11 toward the peripheral portion (peripheral portion of the metal substrate 21), the cooling fluid is directly cooled with respect to the central portion where the solid light source 11 having the largest heat generation amount is placed. The fluid hits, and the flow rate is fastest in the central portion and the cooling efficiency is high. At this time, since the direction of the flow line of the cooling fluid and the projection 25 intersect, a turbulent flow occurs in the flow of the cooling fluid, and as a result, the cooling efficiency is further increased. Of course, since the back surface of the metal substrate 21 is made uneven by the protrusions 25, the contact area between the cooling fluid and the metal substrate 21 is increased, and the metal substrate 21, and thus the solid light source 11 can be cooled with high efficiency. It becomes possible.

  In addition, as the protrusion 25 provided on the metal substrate 21, for example, a stripe-shaped protrusion or a spiral-shaped protrusion from the center can be adopted in addition to the granular protrusion as shown in FIG. Here, the height of the protrusion 25 depends on the size of the solid light source 11 and the thickness of the metal substrate 21, but when the thickness of the metal substrate 21 is t, the height of the protrusion is 0.2t-0. It is preferably about 8 t. If it is less than 0.2 t, sufficient cooling efficiency improvement effect may not be obtained. On the other hand, if it exceeds 0.8 t, there may be a problem that sufficient strength cannot be maintained in the metal substrate 21. .

  1 shows the light source device 100 having the cooling pipe 41 having the inlet in the normal direction with respect to the back surface of the metal substrate 21, but as shown in FIG. It is also possible to employ the light source device 500 that forms the second inflow port 41a and allows the cooling fluid to flow in from a substantially oblique direction. In this case, turbulent flow is more likely to occur in the circulation of the cooling fluid, and higher cooling efficiency can be achieved.

  Hereinafter, different embodiments of the light source device of the present invention will be described. FIG. 3 is a schematic cross-sectional view showing the light source device 200 of the second embodiment, which corresponds to FIG. 1 of the light source device 100, and FIG. 4 is for explaining the main part of the light source device of FIG. FIG. In the light source device 200 of FIG. 3, members / elements having the same reference numerals as those of the light source device 100 of FIG. 1 are not described because they have the same configuration unless otherwise specified.

  The light source device 200 shown in FIG. 3 includes a solid-state light source 11 that mainly emits light, a metal substrate (base material) 22 on which the solid-state light source 11 is placed and fixed, and a metal substrate 22 that is placed and fixed on the inside. A cooling case 32 having a flow part through which a cooling fluid can flow is mainly used. In this light source device 200, the metal substrate 22 on which the solid light source 11 is placed is fixed to a cooling case 32, and the cooling case is placed on the back surface of the metal substrate 22 (the placement surface of the solid light source 11 is the front surface). A protrusion 26 protruding inside 32 is formed. The protrusions 26 are formed by forming the back surface of the metal substrate 22 into an uneven surface by etching, and have a concentric configuration as shown in FIG.

  The cooling case 32 is made of a material that can be easily molded, such as a resin, and the inner surface is coated with a metal coating to prevent gas permeation. The bottom (that is, the side on which the metal substrate 21 is placed) An inflow port 37 is opened on the other side of the cooling case 32 so that a cooling fluid such as air or water can flow into the cooling case 32. Further, an outlet 36 for discharging the cooling fluid from the cooling case 32 is opened at the side of the cooling case 31. In addition, the inflow port 37 is arrange | positioned facing the back surface of the metal substrate 22, and the inflow direction is especially directed to the back surface of the location in which the solid light source 11 is mounted.

  On the other hand, an uneven surface is formed on the surface of the cooling case 32 facing the metal substrate 22 so as to form a flow path following the uneven shape between the protrusion 26 of the metal substrate 22. That is, the cooling case 32 is formed with a recess facing the protrusion (convex portion) 26 of the metal substrate 22 and formed with a protrusion (convex portion) 38 facing the recess of the metal substrate 22. With such a configuration, a zigzag flow path 53 is formed in the gap between the back surface of the metal substrate 22 and the surface of the cooling case 38 (the surface facing the metal substrate 22). In this case as well, it is preferable to provide a coating for preventing corrosion on the surface of the metal substrate 22 that contacts the cooling fluid.

  Here, when the cooling fluid is introduced into the cooling case 32 from the inlet 37 using a pump or the like, the cooling fluid spreads radially around the back surface of the opposing metal substrate 22. In the figure, the arrow indicates the direction in which the cooling fluid flows. That is, the cooling fluid flows from the central portion of the solid light source 11 to the peripheral portion (peripheral portion of the metal substrate 22) through the circulation path 53 and follows the path discharged from the outflow port 36. The cooling fluid directly hits the central portion on which the large solid light source 11 is placed, and the flow rate is fastest and the cooling efficiency is high in the central portion. Further, since the back surface of the metal substrate 22 is made uneven by the protrusions 26, the contact area between the cooling fluid and the metal substrate 22 increases, and the metal substrate 22, and thus the solid light source 11 can be cooled with high efficiency. It becomes possible. Further, since the concentric protrusions 38 of the cooling case 32 are located between the protrusions 26 of the metal substrate 22, it is difficult for problems such as fluid stagnating in the recesses between the protrusions to further improve the cooling efficiency. Is possible.

  3 shows the light source device 200 in which the inflow direction of the cooling fluid is a normal direction with respect to the back surface of the metal substrate 22, the second in the inflow direction side of the cooling fluid as shown in FIG. It is also possible to employ the light source device 600 in a mode in which the cooling fluid is introduced from a substantially oblique direction. In this case, the flow rate of the cooling fluid is further increased, and higher cooling efficiency can be achieved.

  FIG. 5 is a schematic cross-sectional view showing a light source device 300 according to the third embodiment, which corresponds to FIG. In the light source device 300 of FIG. 5, members and elements having the same reference numerals as those of the light source device 100 of FIG. 1 are not described because they have the same configuration unless otherwise specified.

  A light source device 300 shown in FIG. 5 mainly includes a solid-state light source 11 that mainly emits light, and a cooling case 23 that has a circulation portion 54 on which the solid-state light source 11 is placed and fixed and in which a cooling fluid can flow. It is configured as. In the light source device 300, the solid light source 11 is directly fixed to the cooling case 23, and does not include the metal substrate 21 like the light source device 100 of FIG.

  The solid light source 11 includes an upper electrode 12 made of a transparent electrode such as ITO, a p-type p-GaP layer 13, an n-type n-GaP layer 14, and a lower electrode made of a metal electrode such as aluminum from the light emitting surface side. 15. Here, a plurality of protrusions 16 projecting into the cooling case 23 are formed on the back surface of the lower electrode 15 (the light emitting surface side of the solid light source 11 is the front surface). The protrusions 16 function as fins for improving the cooling efficiency of the lower electrode 15 by the cooling fluid, and are formed in a plurality of grains, for example, on the substantially entire surface of the rectangular lower electrode 15. Such protrusions 16 can be formed by, for example, a known etching process for the lower electrode 15, and it is preferable to apply a coating for preventing corrosion particularly on the surface of the lower electrode 15 that contacts the cooling fluid.

  The cooling case 23 is made of a material that can be easily molded, such as resin, and the inner surface is provided with a metal coating that prevents gas permeation. The bottom (that is, the side on which the solid light source 11 is placed) An inflow port 27 is opened on the opposite side, and allows a cooling fluid such as air or water to flow into the flow part 54 inside the cooling case 23. An outlet 28 for discharging the cooling fluid from the cooling case 23 is opened at a different position on the bottom of the cooling case 23. The inlet 27 is disposed at a position corresponding to the center of the back surface of the solid light source 11 (lower electrode 15), and the inflow direction is particularly directed to the center of the back surface where the solid light source 11 is placed. Yes.

  Here, when the cooling fluid is introduced into the cooling case 23 from the inlet 27 using a pump or the like, the cooling fluid directly hits the back surface of the solid light source 11 (the back surface of the lower electrode 15) and then spreads radially. It becomes. In the figure, the arrow indicates the direction in which the cooling fluid flows. That is, the cooling fluid flows from the central part of the solid light source 11 to the peripheral part (peripheral part of the lower electrode 15) through the circulation part 54 and follows the path discharged from the outlet 28, so that the heat generation amount is the highest. The cooling fluid directly hits the center of the large solid light source 11, and the center has the fastest flow rate and high cooling efficiency. Further, since the back surface of the solid light source 11, that is, the back surface of the lower electrode 15 is an uneven surface by the protrusion 16, the contact area between the cooling fluid and the solid light source 11 (lower electrode 15) increases, and the solid light source 11 ( It becomes possible to cool the lower electrode 15) with high efficiency. Further, like the light source device 100 shown in FIG. 1, the projections 16 can generate a turbulent flow in the flow of the cooling fluid, thereby further improving the cooling efficiency.

  As a method for forming the protrusion 16 on the back surface of the lower electrode 15 formed on the light emitting back surface side of the solid light source 11 as shown in FIG. In addition to the formation method, the back surface of the semiconductor layer (in this case, the n-GaP layer 14) disposed between the electrodes 15 and 12 on the light emitting back surface side is an uneven surface, and light is emitted following the uneven surface. It is also possible to form an uneven surface on the back surface of the lower electrode 15 disposed on the back surface side.

  That is, as in the light source device 400 shown in FIG. 6, the protrusion 14a is formed on the light emitting back surface side of the semiconductor layer (n-GaP layer) 14 by etching or the like, and the lower electrode 15 is formed so as to cover it. Thus, a protrusion 15 a that follows the protrusion 14 a of the semiconductor layer (n-GaP layer) 14 can be applied to the lower electrode 15. In this case, since the semiconductor layer (n-GaP layer) 14 is relatively thicker than the lower electrode 15, it is relatively easy to provide an uneven surface to the semiconductor layer (n-GaP layer) 14. As a result, the manufacturing process can be simplified, and the back surface of the solid light source 11 can be more reliably provided with unevenness. In the light source device 400 of FIG. 6, members / elements denoted by the same reference numerals as those of the light source device 300 of FIG. 5 are not described because they have the same configuration unless otherwise specified.

(Projection type display device)
FIG. 9 is an enlarged view showing a schematic configuration of a projection display device as one embodiment of the present invention, and the projection display device 70 shown in FIG. 9 is an example of a three-plate system. In the projection type liquid crystal display device 70, an LED light source 100r including an LED element capable of emitting red (R) color light, an LED light source 100g including an LED element capable of emitting green (G) color light, and blue (B The three LED light sources 100b having LED elements capable of emitting colored light) are used as separate light sources. In addition, as each LED light source 100r, 100g, 100b, each of the light source devices 100 to 600 of the various embodiments described above can be adopted, and a light guide unit 72 made of a rod lens or the like is disposed on the emission side. Has been.

  A liquid crystal light valve 75 that modulates each color light of R, G, and B is provided on the emission side of each light guide 72. Then, the three color lights modulated by the respective liquid crystal light valves 75 are configured to enter a cross dichroic prism (color combining means) 77. This prism 77 is formed by bonding four right-angle prisms, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are formed in a cross shape on the inner surface. These dielectric multilayer films combine the three color lights Lr, Lg, and Lb to form light representing a color image. The color synthesized light is projected onto the screen 79 by the projection lens 76, and an enlarged image is displayed.

  In such a projection type display device 70, the LED light sources 100r, 100g, and 100b employ any one of the light source devices 100 to 600 of the above-described embodiment, so that the light emission efficiency is high and the durability is excellent. It becomes a highly reliable display device. The LED light sources 100r, 100g, and 100b are provided with cooling cases 31, 32, and 23 (see FIGS. 1, 3, 5, 6, 7, and 8) through which a coolant flows. However, a common pipe 35 is connected to each LED light source 100r, 100g, 100b in order to share the cooling fluid flowing through the cooling cases 31, 32, 23 of each LED light source 100r, 100g, 100b. As a result, the cooling fluid that circulates through the LED light sources 100r, 100g, and 100b is shared, and the configuration of the cooling system is very simple. That is, the common pipe 35 is connected to the inlet and outlet of the cooling fluid of each of the light source devices 100 to 600, and the inflow of the common cooling fluid is controlled by one pump (not shown).

  Although one embodiment of the present invention has been described above, the present invention is not limited to this, and the present invention is not limited to the wording of each claim without departing from the scope described in each claim. Improvements based on the knowledge that a person skilled in the art normally has can be added as appropriate to the extent that the person can easily replace them. For example, in the present embodiment, the configuration of the present invention is adopted for cooling the LED light source, but the configuration of the present invention can also be adopted for cooling other solid light sources, and the light source device of the present invention is a three-plate type. Although the embodiment adopted in the projection display device has been described, it is naturally possible to adopt the configuration of the light source device of the present invention in a single-plate projection display device.

The cross-sectional schematic diagram which shows one Embodiment of the light source device of this invention. The plane schematic diagram which shows the principal part of the light source device of FIG. The cross-sectional schematic diagram which shows different embodiment of the light source device of this invention. FIG. 4 is a schematic plan view showing a main part of the light source device of FIG. 3. The cross-sectional schematic diagram which shows different embodiment of the light source device of this invention. The cross-sectional schematic diagram which shows different embodiment of the light source device of this invention. The cross-sectional schematic diagram which shows different embodiment of the light source device of this invention. The cross-sectional schematic diagram which shows different embodiment of the light source device of this invention. Explanatory drawing which shows schematic structure about one Embodiment of the projection type display apparatus of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Solid light source, 21 ... Metal substrate (base material), 25 ... Protrusion, 31 ... Cooling case, 50 ... Distribution part, 100, 200, 300, 400, 500, 600 ... Light source device

Claims (13)

A solid light source, and a base material on which the solid light source is placed,
The light source device according to claim 1, wherein a surface of the substrate opposite to the mounting surface of the solid light source is an uneven surface.   The light source device according to claim 1, wherein the base material is formed of a metal substrate.   The flow path through which the cooling fluid for cooling the said solid light source distribute | circulates by the surface side in which the uneven | corrugated surface of the said base material was formed is arrange | positioned. Light source device.   4. The light source device according to claim 3, wherein the cooling fluid is configured to directly flow into a portion corresponding to a back surface of the solid-state light source in the uneven surface of the base material.   5. The light source device according to claim 3, wherein an inlet of the cooling fluid to the flow path is oriented with respect to the uneven surface of the base material.   6. The inflow port of the cooling fluid to the flow path is directed to a portion corresponding to the back surface of the solid light source in the uneven surface of the base material. The light source device according to claim 1.   The surface of the distribution path facing the uneven surface of the base material is provided with an uneven surface formed alternately with the uneven surface of the base material. The light source device according to item. A solid light source in which a semiconductor layer is formed between a pair of electrodes,
The light source device, wherein the back surface of the electrode disposed on the light emitting back surface side of the solid-state light source is an uneven surface. A solid light source in which a semiconductor layer is formed between a pair of electrodes,
Among the semiconductor layers, the back surface of the n-type or p-type semiconductor layer disposed on the light emitting back surface side is an uneven surface, and the back surface of the electrode disposed on the back surface side of the semiconductor layer following the uneven surface Is a rough surface.   10. The light source device according to claim 8, wherein a coating for preventing corrosion is applied to the back side of the electrode. A method of manufacturing a light source device including a solid light source in which a semiconductor layer is formed between a pair of electrodes,
A light source device comprising: a step of removing a part of the back surface of an n-type or p-type semiconductor layer located on a light emitting back surface side of the solid-state light source among the semiconductor layers to form an uneven surface. Production method.   A projection display device comprising the light source device according to claim 1.   A light source device according to any one of claims 1 to 10, a light modulation device that modulates light emitted from the light source device, and a projection device that projects light modulated by the light modulation device. A projection type display device characterized by that.

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