JP2005071705A - Image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image display device improved in withstand voltage characteristic and display quality by suppressing the bleeding of a spacer forming material. <P>SOLUTION: A spacer structure 22 is provided between a first substrate 10 on which a fluorescent screen is formed and a second substrate 12 on which a plurality of electron emission sources 18 are provided. The spacer structure is provided with a sheet-like grid 24 facing the first and second substrates and having a plurality of electron beam passage holes facing the electron emission sources respectively, and a plurality of spacers raised on at least one surface of the grid. The grid has a plurality of recessed parts 27 formed on at least one surface, and the spacers are raised in the recessed parts, respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an image display device including a substrate disposed oppositely and a spacer structure disposed between the substrates.

  2. Description of the Related Art In recent years, various flat-type image display devices have attracted attention as next-generation lightweight and thin display devices that replace cathode ray tubes (hereinafter referred to as CRTs). For example, a surface conduction electron-emitting device (hereinafter referred to as SED) is being developed as a kind of field emission device (hereinafter referred to as FED) that functions as a flat display device.

  The SED includes a first substrate and a second substrate that are arranged to face each other at a predetermined interval, and these substrates form a vacuum envelope by joining peripheral portions to each other through rectangular side walls. ing. Three color phosphor layers are formed on the inner surface of the first substrate, and on the inner surface of the second substrate, a large number of electron-emitting devices corresponding to each pixel are arranged as an electron source for exciting the phosphor. Each electron-emitting device includes an electron-emitting portion and a pair of electrodes that apply a voltage to the electron-emitting portion.

  In the SED as described above, it is important to maintain a high degree of vacuum in the space between the first substrate and the second substrate, that is, in the vacuum envelope. When the degree of vacuum is low, the lifetime of the electron-emitting device, and hence the lifetime of the device, is reduced. Further, in order to support an atmospheric pressure load acting between the first substrate and the second substrate and maintain a gap between the substrates, a large number of plate-like or columnar spacers are arranged between the two substrates.

  In order to dispose the spacers over the entire surfaces of the first substrate and the second substrate, an extremely thin plate or an extremely thin columnar shape is used so as not to contact the phosphor of the first substrate and the electron-emitting device of the second substrate. A spacer is required. Since these spacers must be placed very close to the electron-emitting device, it is necessary to use an insulating material as the spacer. At the same time, when considering the reduction of the thickness of the first substrate and the second substrate, more spacers are required, and the manufacturing becomes more difficult.

  As for the alignment of the spacers with respect to the phosphors on the first substrate and between the electron-emitting devices on the second substrate, a method of attaching the spacers directly between the phosphors or between the electron-emitting devices, or a hole through which electrons pass A method is conceivable in which a large number of spacers are formed on a previously formed metal plate with high positional accuracy, and the spacers formed on the metal plate are aligned with the first substrate or the second substrate.

In the latter case, two molding dies each having a large number of holes corresponding to the spacer shape are brought into close contact with the front and back surfaces of the metal plate, and the through holes for spacer formation are defined by the metal plate and the two molding dies. . In this state, each through hole is filled with a paste-like spacer forming material. Further, the protruding portion of the spacer forming material is removed by scraping the surface of the mold with a squeegee or the like. Subsequently, after the filled spacer forming material is cured inside the mold, a method of obtaining a columnar spacer formed on the metal plate by removing two molds from the metal plate can be considered ( For example, Patent Document 1).
JP 2002-082850 A

  In the above method, if the metal plate and the mold are not strictly adhered, the spacer forming material enters between the metal plate and the mold. In this case, not only a spacer having a normal shape cannot be formed, but also there is a possibility that an electron passage hole previously formed in the metal plate is blocked by the spacer forming material. Further, the spacer forming material and the adhesive component that have oozed out on the metal plate have irregular bleed shapes and are likely to be a source of electric discharge. When the bleeding portion of the spacer forming material is charged, the electron beam emitted from the electron-emitting device is attracted to the bleeding portion and deviates from the original trajectory. As a result, there is a problem that electron beam mislanding occurs in the phosphor layer and the color purity of the display image is deteriorated.

  The present invention has been made in view of the above points, and an object of the present invention is to provide an image display device that suppresses bleeding of a spacer forming material and has improved withstand voltage characteristics and display quality.

  In order to achieve the above object, an image display device according to an aspect of the present invention includes a first substrate on which a phosphor screen is formed, and a first substrate with a predetermined gap between the first substrate and the phosphor screen. A second substrate provided with a plurality of electron emission sources to be excited, and a spacer structure provided between the first and second substrates and supporting an atmospheric pressure load acting on the first and second substrates, The spacer structure is opposed to the first and second substrates and has a plate-like grid having a plurality of electron beam passage holes opposed to the electron emission sources, and on at least one surface of the grid. A plurality of spacers erected on the surface, the grid has a plurality of recesses formed on the at least one surface, and each spacer is erected in the recesses. Have

An image display device according to another aspect of the present invention includes a first substrate on which a phosphor screen is formed, and a plurality of the first substrate that is opposed to the first substrate with a predetermined gap and that excites the phosphor screen. And a spacer structure that is provided between the first and second substrates and supports an atmospheric pressure load acting on the first and second substrates, and the spacer structure. Is opposed to the first and second substrates and has a plate-like grid having a plurality of electron beam passage holes respectively facing the electron emission source, and standing on at least one surface of the grid A plurality of spacers, wherein the grid has a plurality of grooves formed on the at least one surface and positioned around the grid-side end of each spacer.

  According to the present invention, the bleeding of the spacer forming material on the grid can be suppressed, the occurrence of discharge due to the bleeding of the spacer forming material and the adverse effect on the electron beam are suppressed, and the withstand voltage characteristics and the display quality are improved. An image display device can be provided.

An embodiment in which the present invention is applied to a surface conduction electron-emitting device (hereinafter referred to as SED) which is a kind of FED as a flat-type image display device will be described in detail below with reference to the drawings.
As shown in FIGS. 1 to 3, the SED includes a first substrate 10 and a second substrate 12 each made of a rectangular glass plate, and these substrates have a gap of about 1.0 to 2.0 mm. Corresponding arrangement. The 1st board | substrate 10 and the 2nd board | substrate 12 comprise the flat vacuum envelope 15 by which the peripheral parts were joined through the rectangular-frame-shaped side wall 14 which consists of glass, and the inside was maintained at the vacuum.

  A phosphor screen 16 that functions as a phosphor screen is formed on the inner surface of the first substrate 10. The phosphor screen 16 is configured by arranging phosphor layers R, G, and B that emit red, blue, and green, and a light shielding layer 11, and these phosphor layers are formed in a stripe shape, a dot shape, or a rectangular shape. ing. On the phosphor screen 16, a metal back 17 and a getter film 19 made of aluminum or the like are sequentially formed.

  On the inner surface of the second substrate 12, a number of surface conduction electron-emitting elements 18 that emit electron beams are provided as electron sources for exciting the phosphor layers R, G, and B of the phosphor screen 16. . These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. Each electron-emitting device 18 includes an electron emitting portion (not shown) and a pair of device electrodes for applying a voltage to the electron emitting portion. On the inner surface of the second substrate 12, a large number of wirings 21 for supplying a potential to the electron-emitting devices 18 are provided in a matrix shape, and end portions thereof are drawn out of the vacuum envelope 15.

  The side wall 14 functioning as a bonding member is sealed to the peripheral edge of the first substrate 10 and the peripheral edge of the second substrate 12 by, for example, a sealing material 20 such as low-melting glass or low-melting metal. Are joined.

  As shown in FIGS. 2 to 5, the SED includes a spacer structure 22 disposed between the first substrate 10 and the second substrate 12. In the present embodiment, the spacer structure 22 is composed of a grid 24 made of a rectangular metal plate, and a large number of columnar spacers standing upright on both sides of the grid.

  More specifically, the grid 24 has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 24b facing the inner surface of the second substrate 12, and is arranged in parallel to these substrates. A large number of electron beam passage holes 26 are formed in the grid 24 by etching or the like. The electron beam passage apertures 26 are respectively arranged to face the electron emission elements 18 and transmit the electron beams emitted from the electron emission elements. A plurality of recesses 27 are formed in the first and second surfaces 24a and 24b of the grid 24 by half etching or the like. These recesses 27 are formed in a region where the spacer is erected, that is, between the two adjacent electron beam passage holes 26, and are arranged at a predetermined pitch.

The grid 24 is formed with a thickness of 0.1 to 0.3 mm using, for example, an iron-nickel metal plate. On the surface of the grid 24, an oxide film made of an element constituting a metal plate, for example, an oxide film made of Fe ₃ O ₄ or NiFe ₂ O ₄ is formed. The surfaces 24a and 24b of the grid 24 and the wall surfaces of the electron beam passage holes 26 are covered with a high resistance film having a discharge current limiting effect. This high resistance film is formed of a high resistance material mainly composed of glass and has a resistance value of 1 × 10 ⁸ to 1 × 10 ¹⁵ Ω / □.

  On the first surface 24 a of the grid 24, a first spacer 30 a is integrally provided so as to overlap each recess 27 and is positioned between adjacent electron beam passage holes 26. The tip of the first spacer 30 a is in contact with the inner surface of the first substrate 10 through the getter film 19, the metal back 17, and the light shielding layer 11 of the phosphor screen 16. On the second surface 24 b of the grid 24, a second spacer 30 b is integrally provided so as to overlap each recess 27, and is positioned between adjacent electron beam passage holes 26. The tip of the second spacer 30 b is in contact with the inner surface of the second substrate 12. Here, the tip of each second spacer 30 b is located on the wiring 21 provided on the inner surface of the second substrate 12. The first and second spacers 30a and 30b are aligned with each other, and are formed integrally with the grid 24 with the grid 24 sandwiched from both sides.

  As shown in FIG. 5, each of the first and second spacers 30a and 30b is formed in a tapered shape with a diameter decreasing from the grid 24 side toward the extending end. For example, each first spacer 30a has a substantially elliptical cross-sectional shape, the diameter of the proximal end located on the grid 24 side is about 0.3 mm × 2 mm, the diameter of the extended end is about 0.2 mm × 2 mm, The height is about 0.6 mm. Each of the second spacers 30b has a substantially elliptical cross-sectional shape, the diameter of the proximal end located on the grid 24 side is about 0.3 mm × 2 mm, the diameter of the extended end is about 0.2 mm × 2 mm, and the height. Is formed in about 0.8 mm.

  As shown in FIGS. 4 and 5, each recess 27 is formed in an oval shape corresponding to the base end of the first or second spacer 30a, 30b, and has a larger diameter and a larger area than the spacer base end. Is formed. A gap G extending over the entire periphery of the spacer base end is formed between the base end edge of each of the first and second spacers 30a and 30b and the end edge of the recess 27. When the interval between adjacent electron beam passage holes 26 of the grid 24 is D, the gap G is formed to be 5 to 30% of the interval D. In the present embodiment, the gap G is formed to be 0.1 mm, for example. Further, the depth d of each recess 27 is formed to be 5 to 30% of the interval D. The gap G may not necessarily be provided over the entire circumference of the base ends of the first and second spacers, or the gap may not be uniform over the entire circumference.

  The spacer structure 22 configured as described above is disposed between the first substrate 10 and the second substrate 12. The first and second spacers 30a and 30b are in contact with the inner surfaces of the first substrate 10 and the second substrate 12, thereby supporting the atmospheric pressure load acting on these substrates, and the interval between the substrates being a predetermined value. To maintain.

  The SED includes a voltage supply unit (not shown) that applies a voltage to the grid 24 and the metal back 17 of the first substrate 10. The voltage supply unit is connected to the grid 24 and the metal back 17, and applies a voltage of 12 kV to the grid 24 and 10 kV to the metal back 17, for example. When an image is displayed in the SED, an anode voltage is applied to the phosphor screen 16 and the metal back 17, and the electron beam emitted from the electron emitter 18 is accelerated by the anode voltage to collide with the phosphor screen 16. . As a result, the phosphor layer of the phosphor screen 16 is excited to emit light and display an image.

Next, the manufacturing method of SED comprised as mentioned above is demonstrated. First, a method for manufacturing the spacer structure 22 will be described.
As shown in FIG. 6, when manufacturing the spacer structure 22, first, a grid 24 having a predetermined size and a rectangular plate-like upper die 36 a and lower die 36 b having substantially the same dimensions as this grid are prepared. In this case, a metal plate having a thickness of 0.15 mm made of Fe-50% Ni is degreased, washed and dried, and then the electron beam passage hole 26 is formed by etching to form the grid 24. In addition, a plurality of recesses 27 are formed by half-etching both surfaces of the grid 24. Thereafter, after the entire grid 24 is oxidized, an insulating film is formed on the grid surface including the inner surface of the electron beam passage hole 26. Further, a coating solution containing glass as a main component is applied on the insulating film, dried, and baked to form a high resistance film.

  The upper mold 36a and the lower mold 36b as the molds are formed in a flat plate shape using a transparent material that transmits ultraviolet rays, for example, transparent silicon, transparent polyethylene terephthalate, or the like. The upper die 36a has a flat contact surface 41a that is in contact with the grid 24, and a large number of bottomed spacer forming holes 40a for forming the first spacers 30a. Each of the spacer formation holes 40a opens on the contact surface 41a of the upper die 36a and is arranged at a predetermined interval. Similarly, the lower mold 36b has a flat contact surface 41b and a large number of bottomed spacer forming holes 40b for forming the second spacer 30b. Each of the spacer formation holes 40b opens on the contact surface 41b of the lower mold 36b and is arranged at a predetermined interval.

  After that, the spacer forming material 46 is filled into the spacer forming hole 40a of the upper die 36a and the spacer forming hole 40b of the lower die 26b. As the spacer forming material 46, a glass paste containing at least an ultraviolet curable binder (organic component) and a glass filler is used. The specific gravity and viscosity of the glass paste are appropriately selected.

  Subsequently, as shown in FIG. 7, the upper die 36 a is positioned so that the spacer forming holes 40 a filled with the spacer forming material 46 are positioned between the electron beam passage holes 26, and the contact surfaces 41 a are arranged on the grid 24. One surface 24a is closely attached. Similarly, the lower die 36b is positioned so that each spacer forming hole 40b is positioned between the electron beam passage holes 26, and the contact surface 41b is brought into close contact with the second surface 24b of the grid 24. Note that an adhesive is applied in advance to the spacer standing position of the grid 24, that is, each recess 27 by dispenser or printing. Thus, an assembly 42 including the grid 24, the upper mold 36a, and the lower mold 36b is configured. In the assembly 42, the spacer forming holes 40a of the upper mold 36a and the spacer forming holes 40b of the lower mold 36b are arranged to face each other with the grid 24 in between.

Next, as shown in FIG. 8, the assembly 42 is placed in a flat vacuum vessel 50, and the upper die 36 a and the lower die 36 b are brought into close contact with the grid 24 using atmospheric pressure. Here, the vacuum vessel 50 will be described in detail.
The vacuum vessel 50 has a first main wall 52 and a second main wall 54 each formed in a rectangular plate shape, and the first and second main walls are arranged to face each other with a gap. A rectangular frame-shaped side wall 55 is provided between the peripheral portions of the first and second main walls 52 and 54. The side wall 55 is airtightly fixed to the inner peripheral edge portion of the first main wall 52 and is erected substantially perpendicular to the first main wall. The free end of the side wall 55, here the upper end, is in airtight contact with the inner peripheral edge of the second main wall 54 via the O-ring 56. The interior of the vacuum container 50 configured in this way is connected to a vacuum pump 58 via an exhaust valve 57 provided at the peripheral edge of the second main wall 54.

  The first and second main walls 52 and 54 are formed to have a larger planar dimension than the grid 24. The first and second main walls 52 and 54 are made of a material that can be elastically deformed and can transmit ultraviolet rays, such as transparent silicon, transparent polyethylene terephthalate, and glass. As will be described later, uneven portions are formed on the inner surfaces of the first and second main walls 52 and 54 so that the entire assembly 42 is uniformly pressurized.

  When sandwiching the assembly 42 using the vacuum container 50 configured as described above, first, the pressure diffusion plate 60a is laid on the inner surface of the first main wall 52 with the second main wall 54 removed. . The assembly 42 is placed on the pressure diffusion plate 60a, and for example, the lower mold 36b is opposed to the first main wall 52.

  Next, the pressure diffusion plate 60 b is disposed on the assembly 42, and the second main wall 54 is disposed so as to be opposed to the upper mold 36 a of the assembly 42 and the peripheral portion is superimposed on the O-ring 56. . The pressure diffusion plates 60a and 60b are made of an ultraviolet transmissive material.

  In this state, the vacuum pump 58 as an evacuation unit is operated to evacuate the vacuum vessel 50 to a predetermined degree of vacuum, and then the exhaust valve 57 is closed to maintain the vacuum vessel in a vacuum. When the inside of the vacuum vessel 50 is evacuated, atmospheric pressure acts on the first and second main walls 52 and 54 of the vacuum vessel. For this reason, the first and second main walls 52 and 54 press the assembly 42 disposed inside from both sides, thereby bringing the upper mold 36 a and the lower mold 36 b into close contact with the grid 24.

  At this time, as described above, since the first and second main walls 52 and 54 of the vacuum vessel 50 are formed of an elastically deformable material, the upper die 36a and the lower die 36b are elastically deformed along the assembly 42. Close contact with. Further, the inner surfaces of the first and second main walls 52 and 54 are formed to be uneven. Therefore, the atmospheric pressure acts uniformly on the entire surfaces of the upper die 36a and the lower die 36b through the pressure diffusion plates 60a and 60b, respectively. Therefore, the grid 24, the upper mold 36a, and the lower mold 36b are maintained in an extremely good contact state.

  As described above, the first and second main walls 52 from the ultraviolet lamps 62a and 62b disposed outside the vacuum vessel 50 in a state where the grid 24, the upper mold 36a and the lower mold 36b are brought into close contact with each other using atmospheric pressure. , 54 is irradiated with ultraviolet rays (UV). Here, the first and second main walls 52 and 54, the pressure diffusion plates 60a and 60b, the upper mold 36a and the lower mold 36b of the vacuum vessel 50 are each formed of an ultraviolet transmitting material. Therefore, the ultraviolet rays irradiated from the ultraviolet lamps 62a and 62b are transmitted through the first and second main walls 52 and 54, the pressure diffusion plates 60a and 60b, the upper mold 36a and the lower mold 36b of the vacuum vessel 50 and filled. The spacer forming material 46 is irradiated. As a result, the spacer forming material 46 can be UV-cured while maintaining extremely good adhesion of the assembly 42.

  Subsequently, the vacuum in the vacuum container 50 is released, and the assembly 42 is taken out from the vacuum container. At this time, since the second main wall 54 is only in contact with the O-ring, the vacuum container can be easily opened by releasing the vacuum. Thereafter, as shown in FIG. 9, the upper mold 36 a and the lower mold 36 b are peeled from the grid 24 so that the cured spacer forming material 46 remains on the grid 24. Next, after the grid 24 provided with the spacer forming material 46 is heat-treated in a heating furnace and the binder is blown out from the spacer forming material, the spacer forming material is finally fired at about 500 to 550 ° C. for 30 minutes to 1 hour. To do. Thereby, the spacer structure 22 in which the first and second spacers 30a and 30b are formed on the grid 24 is obtained.

  On the other hand, in the manufacture of the SED, the first substrate 10 provided with the phosphor screen 16 and the metal back 17 in advance, the second substrate on which the electron-emitting device 18 and the wiring 21 are provided and the side wall 14 is joined. 12 are prepared.

  Subsequently, the spacer structure 22 obtained as described above is positioned on the second substrate 12. In this state, the first substrate 10, the second substrate 12, and the spacer structure 22 are arranged in the vacuum chamber, the inside of the vacuum chamber is evacuated, and then the first substrate is bonded to the second substrate via the side wall 14. . Thereby, SED provided with the spacer structure 22 is manufactured.

  According to the SED configured as described above, when the spacer structure is manufactured by providing the recess 27 at the spacer standing position on the surface of the grid 24, the bleeding of the spacer forming material on the grid surface is within the range of the recess. Can be suppressed within. As a result, the width of the spacer forming material bleeding from the base end of each spacer onto the grid surface is set to the range of the gap G between the end of the spacer base end and the end of the recess 27, compared to the conventional case. Can be greatly reduced. Therefore, it is possible to prevent the occurrence of discharge due to the bleeding of the spacer forming material and improve the withstand voltage characteristics of the SED. At the same time, it is possible to prevent an electron beam trajectory shift due to charging of the bleeding portion, and to improve the landing characteristics and brightness of the electron beam. Furthermore, there is no possibility that the electron beam passage hole 26 is blocked by the spacer forming material. As a result, an SED with improved display quality can be obtained.

Next, an SED according to another embodiment of the present invention will be described. According to the present embodiment, as shown in FIGS. 10 and 11, in the first and second surfaces 24a and 24b of the grid 24, annular spacers are provided at the spacer standing positions instead of the recesses described above. 28 is provided. That is, each groove 28 extends along the entire circumference of the grid-side end edge of the first or second spacer 30a, 30b, and is formed so as to surround the periphery of the grid-side end. Each groove 28 is formed by etching or the like, and its width W and depth d are both 5 to 30% of the distance D between adjacent electron beam passage holes 26.
Other configurations are the same as those of the above-described embodiment, and the same portions are denoted by the same reference numerals and detailed description thereof is omitted.

  Also in the second embodiment configured as described above, by providing the groove 28 surrounding the spacer standing position on the surface of the grid 24, when the spacer structure is manufactured, the spacer forming material bleeds on the grid surface. It can be suppressed by the groove. Therefore, also in 2nd Embodiment, the effect similar to 1st Embodiment mentioned above can be acquired.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

  In the above-described embodiment, the spacer structure is configured to integrally include the first and second spacers and the grid, but the second spacer may be formed on the second substrate 12. Further, the spacer structure may include only the grid and the second spacer, and the grid may be in contact with the first substrate.

  In addition, the diameter and height of the spacer, the dimensions, materials, and the like of the other components are not limited to the above-described embodiments, and can be appropriately selected as necessary. Various filling conditions for the spacer forming material can be selected as necessary. In addition, the present invention is not limited to the one using a surface conduction electron-emitting device as an electron source, but can be applied to an image display device using another electron source such as a field emission type or a carbon nanotube.

The perspective view which shows SED which concerns on 1st Embodiment of this invention. The perspective view of said SED fractured | ruptured along line AA of FIG. Sectional drawing which expands and shows said SED. The perspective view which expands and shows a part of said spacer structure. Sectional drawing along line BB of FIG. Sectional drawing which shows the manufacturing process of the said spacer structure. Sectional drawing which shows the assembly which closely_contact | adhered the shaping | molding die and the grid. Sectional drawing which shows the manufacturing process of the said spacer structure. Sectional drawing which shows the state which open | released the said shaping | molding die. The perspective view which expands and shows a part of spacer structure of SED which concerns on 2nd Embodiment of this invention. Sectional drawing along line CC of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... 1st board | substrate, 12 ... 2nd board | substrate, 14 ... Side wall, 15 ... Vacuum envelope,
16 ... phosphor screen, 18 ... electron-emitting device, 22 ... spacer structure,
24 ... Grid, 26 ... Electron beam passage hole, 27 ... Recess,
28: groove, 30a: first spacer, 30b: second spacer.

Claims (10)

A first substrate on which a phosphor screen is formed;
A second substrate provided opposite to the first substrate with a predetermined gap and provided with a plurality of electron emission sources for exciting the phosphor screen;
A spacer structure provided between the first and second substrates and supporting an atmospheric pressure load acting on the first and second substrates;
The spacer structure is opposed to the first and second substrates and has a plate-like grid having a plurality of electron beam passage holes opposed to the electron emission sources, and on at least one surface of the grid. A plurality of spacers standing on the surface, the grid has a plurality of recesses formed on the at least one surface, and each spacer is set up in the recess. An image display device.   Each recess has a larger area than the end of each spacer on the grid side, and a gap is formed between the edge of each spacer on the grid side and the end of the recess. The image display device according to claim 1, wherein   The clearance gap between the edge of the grid side end of each said spacer and the edge of the said recessed part is extended over the perimeter of the grid side end of each spacer, The Claim 2 characterized by the above-mentioned. Image display device.   The spacers and the recesses are provided between adjacent electron beam passage holes of the grid, and a gap is provided between the edge of the grid side end of each spacer and the edge of the recess. 4. The image display device according to claim 2, wherein the image display device is formed at 5 to 30% of an interval between electron beams.   The spacers and the recesses are provided between adjacent electron beam passage holes of the grid, and the depth of the recesses is 5 to 30% of the interval between the adjacent electron beam passage holes. The image display device according to claim 1, wherein the image display device is provided.   The grid has a first surface facing the first substrate, a second surface facing the second substrate, and a plurality of recesses respectively formed on the first and second surfaces, The spacer includes a plurality of first spacers standing in the recess on the first surface and a plurality of second spacers standing in the recess on the second surface. The image display device according to claim 1, wherein the image display device is an image display device. A first substrate on which a phosphor screen is formed;
A second substrate provided opposite to the first substrate with a predetermined gap and provided with a plurality of electron emission sources for exciting the phosphor screen;
A spacer structure provided between the first and second substrates and supporting an atmospheric pressure load acting on the first and second substrates;
The spacer structure is opposed to the first and second substrates and has a plate-like grid having a plurality of electron beam passage holes opposed to the electron emission sources, and on at least one surface of the grid. And the grid has a plurality of grooves formed on the at least one surface and positioned around the grid-side end of each spacer. Image display device.   The spacers are provided between adjacent electron beam passage holes of the grid, and the width of each groove is 5 to 30% of the interval between the adjacent electron beams. Item 8. The image display device according to Item 7.   Each of the spacers is provided between adjacent electron beam passage holes of the grid, and each groove has a depth of 5 to 30% of the interval between the adjacent electron beams. The image display device according to claim 7 or 8.   The grid has a first surface facing the first substrate, a second surface facing the second substrate, and a plurality of grooves formed on the first and second surfaces, respectively. The spacer includes a plurality of first spacers erected on the first surface and a plurality of second spacers erected on the second surface. 10. The image display device according to any one of items 9 to 9.

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