JP2005045008A - Multilayer body and its producing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer body such as a printed wiring board, especially a flexible wiring board, having an IVH structure in which a conductor is secured rigidly into an IVH even if it is subjected to stress or bending due to working environment and good connection reliability is ensured over a long term. <P>SOLUTION: The multilayer body comprises a film 1, first and second resin layers 2 and 3 having at least one layer formed on the opposite sides of the film 1, first and second wiring patterns 4 and 5 formed on the surface of the first and second resin layers 2 and 3, contact holes provided in the first and second resin layers and the film such that the contact hole in the film has a diameter larger than that in the resin layer in order to connect the first and second wiring patterns 4 and 5 electrically, and a conductor formed to clamp the film in the contact hole. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a printed wiring board having a connection hole for electrically connecting double-sided or multilayer wiring, and more particularly to a multilayer laminate as a flexible wiring board and a manufacturing method thereof.

  In recent years, electronic devices have become lighter, thinner, and smaller, and accordingly, printed wiring boards have been required to be thinner. Conventionally, a flexible wiring board with copper wiring on the surface of a polyimide film is well known as a thin substrate, but even if the wiring pitch is made fine or multi-layered, a through-hole with a general interlayer connection structure is used. Therefore, it was difficult to realize high-density mounting. Therefore, a flexible wiring board using inner via holes (hereinafter referred to as IVH) for interlayer connection has been proposed as a wiring board that is thin and compatible with high-density mounting.

  FIG. 7 shows a cross-sectional view of a flexible wiring board using an interlayer connection structure.

  The circuit patterns 87a and 87b are IVH connected by the conductive paste 85 filled in the through holes 83, and the circuit patterns 96a and 96b are IVH connected by the conductive paste 85 in the same manner as the two-layer wiring board 88. A four-layer circuit board is formed by attaching 95 to the insulating substrate 92 and bonding the same.

For example, Patent Document 1 is known as prior art document information related to the invention of this application.
JP-A-6-268345

  However, a flexible wiring board for IVH connection is a base film (generally a polyimide film is generally used) and a conductor formed in IVH (usually when Cu conductor is applied to form a conductor) In many cases, the conductor breaks in the IVH or breaks between the wiring pattern and the conductor due to the influence of stress, bending, etc. depending on the usage environment, and the connection is made for a long time. It was difficult to stabilize.

  The present invention has been made in view of the above problems, and in a printed wiring board, particularly a flexible wiring board, the conductor is firmly fixed in the IVH even under the influence of stress, bending, etc. due to the use environment, and is connected over a long period of time. An object is to provide a multilayer laminate having an IVH structure with good reliability.

  In order to solve the above-mentioned problem, the invention described in claim 1 of the present invention is characterized in that a film, first and second resin layers comprising at least one layer provided on both surfaces of the film, and the first and second resin layers are provided. The first and second wiring patterns formed on the surface of the two resin layers, and the first and second resin layers and the film are electrically connected to the first and second wiring patterns in order to electrically connect the first and second wiring patterns. A multi-layer laminate comprising a connection hole provided so that the resin layer side has a large diameter and a conductor formed so as to sandwich the film in the connection hole, and the conductor is formed so as to sandwich the film. Therefore, the film and the conductor are firmly fixed, and the connection is stabilized over a long period.

  Invention of Claim 2 of this invention is a multilayer laminated body of Claim 1 which provided the taper of 3 to 5 degree | times in the connection hole, and has the effect | action which can implement a conductor easily.

  According to a third aspect of the present invention, there is provided a first resin layer, a first wiring pattern provided on the lower surface of the first resin layer, and a film laminated on the upper surface of the first resin layer, In order to electrically connect the second resin layer laminated on the film and the second wiring pattern provided on the upper surface of the second resin layer, the first and second resin layers and the film are A first multilayer laminate composed of a conductor formed in a connection hole provided so that the resin layer side has a large diameter, and a third resin layer is laminated on the upper surface of the first multilayer laminate, A second film is laminated on the upper surface of the second resin layer, a fourth resin layer is laminated on the upper surface of the second film, and a third wiring pattern is laminated on the upper surface of the fourth resin layer. In order to electrically connect the wiring patterns of the third and fourth resin layers and the second film, A multilayer wiring board in which at least one second multilayer laminated body in which a conductor is formed is laminated in a connection hole provided so that the resin layer side has a larger diameter than the film, and the wiring pattern is a multilayer wiring board having three or more layers Can be formed, and has an effect of improving wiring accommodation and contributing to higher mounting density.

  The invention according to claim 4 of the present invention includes a step of applying an uncured resin on both sides of the film to form an uncured resin layer, and a step of forming a cover film on both sides of the uncured resin layer, Next, in the uncured resin layer and the film on which the cover film is formed, a step of forming a connection hole provided so that the uncured resin side has a larger diameter than the film, a step of forming a conductor in the connection hole, and Next, a method for producing a multilayer laminate comprising a step of peeling the cover film and a step of forming a wiring pattern by placing metal foil on both sides of the uncured resin layer and then applying heat and pressure. Can provide a wiring board having a good connection hole.

  The invention according to claim 5 of the present invention includes a step of applying an uncured resin on both sides of the film to form an uncured resin layer, and a step of forming a cover film on both sides of the uncured resin layer, Next, a step of forming a connection hole provided in the uncured resin layer and the film on which the cover film is formed so that the uncured resin layer side has a larger diameter than the film, and a step of forming a conductor in the connection hole, Next, uncured resin on both surfaces of the film on the upper surface of the multilayer laminate comprising the steps of peeling the cover film and then forming a wiring pattern by placing metal foil on both surfaces of the uncured resin layer and heating and pressing The process of forming an uncured resin layer by applying, then the process of forming a cover film on both sides of the uncured resin layer, and then the uncured resin layer and the film on which the cover film is formed are uncured from the film. The resin side has a large diameter A step of forming a connection hole, a step of forming a conductor in the connection hole, a step of peeling the cover film, and a metal foil on one side of the uncured resin layer This is a method for manufacturing a multilayer laminate formed by repeating the process of forming a wiring pattern by applying pressure, and can provide a multilayer wiring board having connection holes with good connection reliability over a long period of time.

The invention according to claim 6 of the present invention includes a film, first and second uncured resin layers comprising at least one layer on both surfaces of the film, and surfaces of the first and second uncured resin layers. A laser processing method for forming a connection hole having a taper in the thickness direction of a multilayer laminate comprising a first cover film and a second cover film formed in the above, and an energy storage time required for one pulse of laser irradiation t _c is the laser pulse oscillation period T,
t _c <0.1 × T
The method for producing a multilayer laminate according to claim 4 or 5, wherein the first and second uncured resin layers are caused to flow by the action of heat generated during laser processing. The connection hole provided in the second uncured resin layer can be formed so that the diameter of the connection hole is larger than the diameter of the connection hole provided in the film, and a sufficiently long interval between laser pulses to be continuously output is ensured. By doing so, it has the effect of suppressing the flow range of the first and second uncured resin layers to be about 20 μm larger than the diameter of the connection hole provided in the film.

  Invention of Claim 7 of this invention is a manufacturing method of the multilayer laminated body of Claim 6 which processes by irradiating a continuous pulse laser of at least 2 pulses or more, and is 3 to 5 degree | times to a connection hole The taper can be provided.

  Invention of Claim 8 of this invention is a manufacturing method of the multilayer laminated body of Claim 6 which processes by irradiating the continuous pulse laser whose pulse width is 50 ns or less, and laser is so short that a pulse width is short Since the effect of heat generated during processing can be reduced, and the interval between pulses can be reduced accordingly, laser processing can be speeded up.

  Invention of Claim 9 of this invention is a manufacturing method of the multilayer laminated body of Claim 6 which processes by the laser beam whose wavelength is 355 nm or less, The organic substance obtained by shortening the wavelength of a laser beam The ablation effect that cuts the chemical bond is incorporated into laser processing, and the effect of heat generated during laser processing is minimized.

  As described above, according to the present invention, the film, the first and second resin layers including at least one layer on both surfaces of the film, and the first and second layers formed on the surfaces of the first and second resin layers are provided. In order to electrically connect the second wiring pattern and the first and second wiring patterns, the first and second resin layers and the film are provided such that the resin layer has a larger diameter than the film. Since the conductor is formed so as to sandwich the film, the film and the conductor are formed by sandwiching the connection hole and the conductor formed so as to sandwich the film in the connection hole. It is firmly fixed and the connection can be stabilized over a long period of time.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view of a multilayer laminate for explaining Embodiment 1 of the present invention.

  In FIG. 1, a first resin layer 2 and a second resin layer 3 are formed on both surfaces of a film 1. A first wiring pattern 4 and a second wiring pattern 5 are formed on the surfaces of the first and second resin layers 2 and 3. The first and second wiring patterns 4 and 5 are connected to a conductor 7 formed in the connection hole 6 for electrical connection. The diameters of the first resin layer 2 and the second resin layer 3 are formed to be larger than the diameter of the film 1, and are formed in an eyelet shape that sandwiches the film 1.

  Thus, since the conductor 7 is formed so as to sandwich the film 1 in the connection hole 6, the stress generated by bending stress, bending, thermal stress, thermal expansion difference and moisture absorption on the wiring board formed as a multilayer laminate. Since the conductor 7 is firmly fixed without sliding inside the connection hole 6 even if the contact is provided, the connection interface between the conductor 7 and the first and second wiring patterns 4 and 5 and the conductor 7 itself is less likely to break, so that a wiring board having an IVH structure with good connection reliability over a long period of time can be obtained.

  The film 1 is made of an insulating organic material, and for example, a polyimide film, an aramid film, a liquid crystal polymer sheet, or the like can be used. In the first embodiment, a polyimide film having a thickness of 12.5 μm is used.

  The first resin layer 2 and the second resin layer 3 are made of an insulating organic material. For example, a polyimide resin, an epoxy resin, a modified resin having characteristics of two kinds of organic resins, or the like can be used. These resins are desirably thermosetting resins because it is necessary to ensure that the adhesion strength with the film 1 and the first and second wiring patterns 4 and 5 is sufficiently high for a long period of time under various usage environments.

  Moreover, even if it is a thermoplastic resin, if it does not soften at the reflow peak temperature of about 260 degreeC, it is applicable. In the first embodiment, an epoxy-modified polyimide resin is used, and a first resin layer 2 having a thickness of 10 μm and a second resin layer 3 having a thickness of 5 μm is applied and cured. The curing method and the like will be described in detail in the manufacturing method described later.

  The first wiring pattern 4 and the second wiring pattern 5 are made of a material having electrical conductivity. For example, a copper foil or a copper plating wiring can be used. In the first embodiment, an electrolytic copper foil having a thickness of 9 μm is used. The electrolytic copper foil is subjected to a roughening process using a plating method on the surface to be bonded to the first and second resin layers 2 and 3 to ensure adhesion. The pattern was formed using a photolithography method and an etching method.

  The connection hole 6 is formed by a manufacturing method described later, and a conductor 7 is formed inside.

  For the conductor 7, for example, a conductive paste or metal plating can be used. In the first embodiment, a conductive paste kneaded with copper powder and an epoxy resin is filled in the connection hole 6 and used as the conductor 7.

  The conductor 7 may be formed so as to be completely filled in the connection hole 6 as shown in FIG. 1, or the conductor 7 is formed on the inner wall portion of the connection hole 6 as shown in FIG. A shape that is not completely filled may be used. However, in consideration of increasing the wiring capacity and the mounting density of mounting parts as a wiring board, the shape in which the inside of the connection hole 6 is completely filled as shown in FIG. preferable.

  The shape of the conductor 7 shown in FIG. 2 can be formed when a method of forming by metal plating is used.

  Although details of the connection hole 6 will be described later, the connection hole 6 is widened at one end because the conductor 7 is filled with a conductive paste by squeezing or formed by plating. Is desirable.

  On the other hand, as for the wiring board, it is desirable that both opening diameters of the connection holes 6 are as large as possible from the viewpoint of ensuring connection stability and miniaturization of the connection holes 6. Therefore, in the first embodiment, the connection hole 6 is tapered, but the laser processing is controlled to be in the range of 3 to 5 degrees. As a result, the connection stability is secured as the wiring board while facilitating the formation of the conductor 7.

  Next, the manufacturing method of the multilayer laminated body of this Embodiment 1 is demonstrated using FIG.

  FIG. 3A shows a film 1 serving as a base material of the multilayer laminate of the first embodiment.

  A state in which the first uncured resin layer 8 and the second uncured resin layer 9 are formed on both surfaces of the film 1 is shown in FIG.

  Further, the cover film 10 is formed on the outermost surfaces of the first uncured resin layer 8 and the second uncured resin layer 9 to obtain the state shown in FIG.

  The first uncured resin layer 8 and the second uncured resin layer 9 were supplied in a liquid state and applied to the surface of the film 1. In the present first embodiment, a reverse dryer method is used as a coating method, a resin layer to be the first uncured resin layer 8 is applied on one side, and then a tunnel dryer set at 110 to 150 ° C. The solvent was volatilized to form the first uncured resin layer 8, and then the cover film 10 was laminated using a roll laminator at 70 to 90 ° C. and a pressure of 1.0 to 4.0 kg / cm. The process up to here was continuously performed. Subsequently, coating, drying, and laminating were similarly performed on the other surface of the film 1 to produce a multilayer laminate of FIG.

  In the first embodiment, the production is performed separately for each side, but in order to make the B-stage state of the uncured resin layer the same as the front and back, it is more desirable to perform double-sided simultaneous coating and double-sided simultaneous lamination. . The coating method is not limited to the reverse coating method, and other coating methods such as a doctor blade method or a method using a comma coater may be used. In addition, when coating one side at a time as in the first embodiment, the drying temperature of the resin previously applied is lower, the drying temperature of the resin to be applied later is increased, and the B stage on the front and back sides The state was made as similar as possible.

  Further, PEN (polyethylene naphthalate) having a thickness of 9 μm was used for the cover film 10, and the surface laminated on the uncured resin layer was previously subjected to silicon release treatment.

  Next, as shown in FIG.3 (d), the connection hole 6 was formed using the laser processing machine. The laser processing machine used in this step used a device that performs processing by irradiating continuous pulses using a third harmonic YAG laser having a wavelength of 355 nm.

In this laser processing machine, the irradiation time per pulse was 50 ns, the output at the processing point was 60 μJ, and 60 pulses were irradiated to process one hole. At this time, the pulse frequency was 3 kHz, and the laser oscillation cycle (T) was set to irradiate one pulse at about 333 ms. In order to obtain the machining point output, the accumulation time t _c was set to about 19 ms. By such laser processing, the flow range of the first and second uncured resin layers 8 and 9 was suppressed to be about 20 μm larger than the diameter of the connection hole provided in the film 1. PEN melted at the time of laser processing flows into the portion where the first and second uncured resin layers 8 and 9 have flowed, as shown in FIG. A taper of 3 to 5 degrees can be provided in the connection hole 6 by adjusting the number of pulses to be irradiated and the focal point of the laser beam in this processing.

  FIG. 3E shows a state in which the conductor 7 is filled in the connection hole 6.

  In this step, a conductive paste is used as the conductor 7, and the conductive paste is imprinted and filled by squeezing from the large side of the opening of the connection hole 6 while performing vacuum suction from the small side of the opening of the connection hole 6. . At this time, it is more preferable to increase the number of squeezing because the filling property of the conductive paste is improved.

  Next, the cover film 10 is peeled off as shown in FIG. The cover film 10 is peeled off at room temperature, and care must be taken so that the conductive paste is not taken on the cover film 10 side at the time of peeling.

  Finally, copper foils are arranged on both sides of the multilayer laminate of FIG. 3 (f), heated and pressed to cure the first and second uncured resin layers 8 and 9, and bonded to the copper foils at the same time. The conductor 7 is compressed into a shape that sandwiches the film 1 while forming an electrical connection with the copper foil. Subsequently, the copper foil is patterned to form the first wiring pattern 4 and the second wiring pattern 5 to obtain the multilayer laminate shown in FIG.

In this heating and pressurizing step, the temperature was maintained at 200 ° C. for 1 hour, and was performed at 150 to 200 kg / cm ² .

(Embodiment 2)
FIG. 4 is a cross-sectional view of a multilayer laminate for explaining Embodiment 2 of the present invention.

  In FIG. 4, a first resin layer 2 and a second resin layer 3 are formed on both surfaces of the film 1. A first wiring pattern 4 and a second wiring pattern 5 are formed on the surfaces of the first and second resin layers 2 and 3. The first and second wiring patterns 4 and 5 are connected to a conductor 7 formed in the connection hole 6 for electrical connection. Since the conductor 7 is formed so that the diameters of the first resin layer 2 and the second resin layer 3 are larger than the diameter of the film 1, the conductor 7 is formed in an eyelet shape that sandwiches the film 1. This is referred to as a first stacked body 101. The first stacked body 101 is the same as the stacked body shown in FIG. 1, and the constituent materials and the manufacturing method are as described in the first embodiment.

  A third resin layer 11, a second film 12, and a fourth resin layer 13 are laminated on the upper surface of the first laminate 101, and a third wiring is formed on the outermost surface of the fourth resin layer 13. A pattern 14 is formed. The third wiring pattern 14 and the first wiring pattern 4 are connected to a second conductor 17 formed in the second connection hole 16 for electrical connection. Since the second conductor 17 is formed so that the diameters of the third resin layer 11 and the fourth resin layer 13 are larger than the diameter of the second film 12, the second film 12 is sandwiched therebetween. It is formed in an eyelet shape. This is called a second stacked body 102. As the second stacked body 102, the constituent material and the manufacturing method described in Embodiment Mode 1 are used.

  Further, the fifth resin layer 18, the third film 19, and the sixth resin layer 20 are laminated on the lower surface of the first laminated body 101, and the fourth resin layer 20 is disposed on the outermost surface of the sixth resin layer 20. A wiring pattern 21 is formed. The fourth wiring pattern 21 and the second wiring pattern 5 are connected to a third conductor 23 formed in the third connection hole 22 for electrical connection. Since the third conductor 23 is formed so that the diameters of the fifth resin layer 18 and the sixth resin layer 20 are larger than the diameter of the third film 19, the third film 19 is sandwiched between the third conductors 23. It is formed in an eyelet shape. This is referred to as a third stacked body 103. The third laminate 103 also uses the constituent material and the manufacturing method described in Embodiment Mode 1.

  In the second embodiment, the second stacked body 102 and the third stacked body 103 are respectively stacked one above the other on the first stacked body 101. However, the second stacked body 102 and the third stacked body 103 are stacked. The stacked bodies 103 may be stacked in multiple layers.

  Also in the second embodiment, as in the first embodiment, the conductor is formed so as to sandwich the film and fit into the connection hole, so that bending stress or bending is applied to the wiring board formed as a multilayer laminate. Even if stress caused by thermal stress, thermal expansion difference or moisture absorption is applied, the conductor is firmly fixed without sliding inside the connection hole. The body itself is less likely to break, and a wiring board having an IVH structure with good connection reliability over a long period of time can be obtained.

  Next, the manufacturing method of the multilayer laminated body of this Embodiment 2 is demonstrated using FIG.

  FIG. 5A shows a state in which the multilayer laminate obtained in FIG. 3F is arranged on both sides of the first laminate 101 described in FIG. 4, and copper foils 24 and 25 are arranged on both sides thereof. is there. By heating and pressurizing them and patterning the copper foils 24 and 25 in the patterning step to form a wiring pattern, a multilayer laminate of the second embodiment as shown in FIG. 5B can be obtained. it can. As a specific manufacturing method, the same method as in the first embodiment was used.

  If further multilayer wiring is required, the multilayer laminate obtained in FIG. 3 (f) is arranged on both sides of the multilayer laminate obtained in FIG. 5 (b), and copper foils 24, 25 are arranged on both sides thereof. The patterning process may be repeated by heating and pressing them.

(Embodiment 3)
FIG. 6 is a schematic cross-sectional view of the connection hole of the multilayer laminate for explaining the third embodiment of the present invention.

  6A is a vertical sectional view of the connection hole 6, and FIG. 6B is a horizontal sectional view of the connection hole 6.

  By roughening the inner wall surface of the connection hole 6 as shown in FIGS. 6A and 6B, the adhesion strength with the conductor 7 is increased, and bending stress or Even if stress caused by bending, thermal stress, thermal expansion difference or moisture absorption is applied, the conductor 7 is firmly fixed without sliding inside the connection hole 6, so the conductor 7 and the first, The connection interface of the second wiring patterns 4 and 5 and the conductor 7 are less likely to break, and a wiring board having an IVH structure with good connection reliability over a long period of time can be obtained.

Sectional drawing of the multilayer laminated body in one embodiment of this invention Sectional view when the conductor of the present invention is not completely filled in the connection hole (A)-(g) Sectional drawing of the process of the manufacturing method of the multilayer laminated body of this invention. Sectional view of another multilayer laminate of the present invention (A), (b) Sectional drawing of the process of the manufacturing method of the other multilayer laminated body of this invention. (A), (b) Cross-sectional view of another multilayer laminate of the present invention Sectional drawing explaining conventional technology

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Film 2 1st resin layer 3 2nd resin layer 4 1st wiring pattern 5 2nd wiring pattern 6 Connection hole 7 Conductor

Claims (9)

A film, first and second resin layers comprising at least one layer provided on both surfaces of the film, first and second wiring patterns formed on the surfaces of the first and second resin layers, and In order to electrically connect the first and second wiring patterns, a connection hole provided in the first and second resin layers and the film so that the resin layer side has a larger diameter than the film, and in the connection hole A multilayer laminate comprising a conductor formed so as to sandwich the film. The multilayer laminate according to claim 1, wherein the connection hole is provided with a taper of 3 to 5 degrees. A first resin layer; a first wiring pattern provided on the lower surface of the first resin layer; a film laminated on the upper surface of the first resin layer; and a second resin layer laminated on the film; In order to electrically connect the second wiring pattern provided on the upper surface of the second resin layer, the connection provided on the first and second resin layers and the film so that the resin layer side has a larger diameter than the film. A first multilayer laminate made of a conductor formed in the hole, a third resin layer is laminated on the upper surface of the first multilayer laminate, and a second film is laminated on the upper surface of the third resin layer Then, a fourth resin layer is laminated on the upper surface of the second film, a third wiring pattern is laminated on the upper surface of the fourth resin layer, and the first wiring layer is electrically connected to connect the wiring patterns between the layers. 3. The resin layer side of the fourth resin layer and the second film is larger in diameter than the film. At least one laminated multilayer laminate second multilayer laminate formed by forming a conductor in the connection hole provided in the. A step of applying an uncured resin on both sides of the film to form an uncured resin layer; a step of forming a cover film on both sides of the uncured resin layer; and an uncured resin layer on which the cover film is formed Forming a connection hole in the film so that the uncured resin side of the film has a larger diameter; forming a conductor in the connection hole; then peeling the cover film; The manufacturing method of the multilayer laminated body which consists of a process which arrange | positions metal foil on both surfaces of an uncured resin layer, and heat-presses and forms a wiring pattern. A step of applying an uncured resin on both sides of the film to form an uncured resin layer; a step of forming a cover film on both sides of the uncured resin layer; and an uncured resin layer on which the cover film is formed Forming a connection hole in the film so that the uncured resin layer side of the film has a larger diameter, a step of forming a conductor in the connection hole, a step of peeling the cover film, and a step of A step of forming an uncured resin layer by applying uncured resin on both surfaces of a film on the upper surface of a multilayer laminate comprising a step of forming metal patterns on both surfaces of an uncured resin layer and heating and pressing to form a wiring pattern Next, a step of forming a cover film on both surfaces of the uncured resin layer, and a connection hole provided in the uncured resin layer and the film on which the cover film is formed next so that the uncured resin side has a larger diameter than the film Craft to form Next, the process of forming a conductor in the connection hole, the process of peeling the cover film, and the process of forming a wiring pattern by placing metal foil on one side of the uncured resin layer and heating and pressing are repeated. The manufacturing method of the multilayer laminated body formed in this way. A film, first and second uncured resin layers comprising at least one layer on both surfaces of the film, and first and second cover films formed on the surfaces of the first and second uncured resin layers, A laser processing method for forming a connection hole having a taper in the thickness direction of a multilayer laminate comprising: an energy storage time t _c required for laser irradiation of one pulse is relative to a laser pulse oscillation period T ,
t _c <0.1 × T
The manufacturing method of the multilayer laminated body of Claim 4 or 5 which satisfies the following relationship. The manufacturing method of the multilayer laminated body of Claim 6 which processes by irradiating a continuous pulse laser of at least 2 pulses or more. The manufacturing method of the multilayer laminated body of Claim 6 which processes by irradiating the continuous pulse laser whose pulse width is 50 ns or less. The manufacturing method of the multilayer laminated body of Claim 6 which processes by the laser beam whose wavelength is 355 nm or less.

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