JP2004362341A - Ic tag - Google Patents

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Publication number
JP2004362341A
JP2004362341A JP2003161021A JP2003161021A JP2004362341A JP 2004362341 A JP2004362341 A JP 2004362341A JP 2003161021 A JP2003161021 A JP 2003161021A JP 2003161021 A JP2003161021 A JP 2003161021A JP 2004362341 A JP2004362341 A JP 2004362341A
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JP
Japan
Prior art keywords
tag
outer layer
resin
built
main body
Prior art date
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Granted
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JP2003161021A
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Japanese (ja)
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JP4828088B2 (en
Inventor
Takamitsu Nakabayashi
貴光 中林
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Toppan Inc
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Toppan Printing Co Ltd
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Priority to JP2003161021A priority Critical patent/JP4828088B2/en
Publication of JP2004362341A publication Critical patent/JP2004362341A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag which does not have such possibility as the breakage of a built-in component inside an outer layer member even when any external force such as expansion and contraction is applied to the flexible outer layer member. <P>SOLUTION: An IC tag 10 has a built-in component which is configured by electrically connecting an IC module 3 to an antenna coil 2 obtained by coiling a lead wire and is covered with an outer layer member 14 consisting of resin. The built-in component is laid and fixed on a thin film substrate 11 so that a main part member 13 is formed. Then the main part member 13 is covered with the outer layer member 14 consisting of soft resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、導線を巻き回したアンテナコイルにＩＣモジュールを電気的に接続してなる内蔵部品を外層部材で被覆したＩＣタグに関する。
【０００２】
【従来の技術】
非接触での自動認識技術としてＲＦＩＤ（高周波同一性認識）があり、その用途が拡大しつつある。ＲＦＩＤの一種にＩＣタグがあり、ＩＣタグは人が持ったり、物（商品等）に固定したりして使用される。
【０００３】
ＩＣタグに内蔵されるアンテナとして、導線を巻き回したアンテナコイルがある。アンテナコイルは周波数１２５ｋＨｚタイプのＩＣタグの大半に採用されており、一部が周波数１３．５６ＭＨｚタイプのＩＣタグに採用されている。
【０００４】
図５に、従来のＩＣタグの一例を示すように、ＩＣタグ１は、アンテナコイル２にＩＣモジュール３を電気的に接続し、アンテナコイル２及びＩＣモジュール３を直接外層部材４で成型封止することにより被覆したものである。この種のＩＣタグ１の成型封止方法には、ラミネート、射出成型、樹脂注型等が挙げられる。成型に用いられる外層部材４としては、ＰＶＣ（ポリ塩化ビニル）、ＡＢＳ（アクリロニトリル−ブタジエン−スチレン共重合体樹脂）、エポキシ樹脂等、一般的に比較的硬度の高い硬質のものが挙げられる。
【０００５】
外層部材４が硬質な素材で構成されたＩＣタグ１を、例えば、配管等の曲面に固定して使用する場合、硬質のＩＣタグ１では曲面への固定が困難である。そこで、配管等の曲面への固定を容易とすべく、外層部材を柔軟材（軟質材）で構成したフレキシブルＩＣタグがある（例えば、特許文献１参照）。
【０００６】
【特許文献１】
実開平５−３０８７４号公報
【０００７】
【発明が解決しようとする課題】
しかしながら、外層部材４として軟質材、例えば軟質樹脂を用いた場合、内蔵されたアンテナコイル２及びＩＣモジュール３は軟質樹脂によって直接封止固定されているため、ＩＣタグに伸縮等の外力が加わった時に、その伸縮が直接アンテナコイル２及びＩＣモジュール３に伝わってしまう。このため、アンテナコイル２が断線したり、ＩＣモジュール３が破損したりするおそれがあるという問題があった。
【０００８】
以上の事情を考慮して創案された本発明の目的は、軟質な外層部材に伸縮等の外力が加わっても、外層部材内部の内蔵部品に破損などのおそれの無いＩＣタグを提供することにある。
【０００９】
【課題を解決するための手段】
上記目的を達成すべく本発明に係るＩＣタグは、導線を巻き回したアンテナコイルにＩＣモジュールを電気的に接続してなる内蔵部品を、樹脂からなる外層部材で被覆したＩＣタグにおいて、上記内蔵部品を薄膜基板上に載置・固定して本体部材を形成し、その本体部材を軟質樹脂からなる外層部材で被覆したものである。
【００１０】
また、導線を巻き回したアンテナコイルにＩＣモジュールを電気的に接続してなる内蔵部品を、樹脂からなる外層部材で被覆したＩＣタグにおいて、上記内蔵部品を薄膜基板で挟み込んで本体部材を形成し、その本体部材を軟質樹脂からなる外層部材で被覆したものである。
【００１１】
ここで、軟質樹脂は、熱可塑性ウレタンエラストマー、熱硬化性ウレタン、又はホットメルト樹脂であることが好ましい。また、薄膜基板は、熱硬化性樹脂のプリプレグシート、自己融着性を有する熱可塑性樹脂のシート、又はＰＥＴ基材にホットメルト樹脂或いは粘着剤をコーティングしてなるシートであることが好ましい。
【００１２】
以上の構成によれば、剛性の高い本体部材を、軟質な外層部材で被覆したＩＣタグが得られることから、外層部材に伸縮等の外力が加わったとしても、外層部材の内部に封入された内蔵部品に破損などが生じるおそれがない。
【００１３】
【発明の実施の形態】
以下、本発明の好適一実施の形態を添付図面に基づいて説明する。
【００１４】
（第１の実施形態）
本発明の好適な一実施形態に係るＩＣタグの断面図を図１に示す。尚、図５と同様の部材については同じ符号を付しており、これらの部材については新たな説明を省略する。
【００１５】
図１に示すように、本実施の形態に係るＩＣタグ１０は、導線を巻き回したアンテナコイル（例えばスパイラル状アンテナコイル）２にＩＣモジュール３を電気的に接続してなる内蔵部品を、薄膜基板１１上に載置・固定して本体部材１３を形成し、その本体部材１３を、軟質樹脂からなる外層部材１４で被覆したものである。このＩＣタグ１０に、適宜、打ち抜き加工等を施し、所定の形状（例えばカード状）を得るようにしてもよい。
【００１６】
薄膜基板１１は、ＰＥＴ（ポリエチレンテレフタレート）基材（例えば、約１００μｍ厚）１１ａと、ＰＥＴ基材１１ａの一方の面（図１中では上面）に設けた接着層（例えば、約２５μｍ厚）１１ｂとで構成される。この薄膜基板１１上に内蔵部品（アンテナコイル２及びＩＣモジュール３）を載置（配置）した後、加熱することで熱接着剤層１１ｂが溶融、固化し、基板１１と内蔵部品とが強固に接着、固定され、本体部材１３が得られる。接着層１１ｂの構成材としては、アクリル系の熱接着剤、ホットメルト樹脂（例えば、ポリアミド、ウレタン、ＥＶＡ等）、又は粘着剤等が挙げられる。
【００１７】
外層部材１４は、２枚のシート１２ａ，１２ｂで構成される。これらのシート１２ａ，１２ｂで本体部材１３を挟んで積層した後、加熱、加圧することで、その内部に本体部材１３が封入された外層部材１４が形成される。
【００１８】
外層部材１４を構成する軟質樹脂としては、熱可塑性ウレタンエラストマー（Ｔｈｅｒｍｏｐｌａｓｔｉｃ Ｅｌａｓｔｏｍｅｒｓ；以下、ＴＰＥと表す）が用いられる。軟質樹脂としてＴＰＥを用いることにより、十分な柔軟性を有する外層部材１４となる。軟質樹脂としては、ＴＰＥの他に、熱可塑性ウレタンエラストマー、熱硬化性ウレタン、ホットメルト樹脂（例えば、ポリアミド、ウレタン、ＥＶＡ（エチレン−酢酸ビニル共重合体）等）が挙げられる。
【００１９】
次に、本実施の形態の作用を説明する。
【００２０】
薄膜基板１１のＰＥＴ基材１１ａは薄く、それ自体の剛性は低いものの、内蔵部品は接着層１１ｂを介して薄膜基板１１と一体的に強固に固定されるため、得られた本体部材１３は高い剛性を有する。よって、本体部材１３の周囲に設けた軟質な外層部材１４が伸縮したとしても、本体部材１３は高い剛性を有していることから、外層部材１４の伸縮に追従することはない。その結果、ＩＣタグ１０に外力などが加わって屈曲したとしても、アンテナコイル２の断線、ＩＣモジュール３の破損等といった内蔵部品の破損、損傷を防止することができる。
【００２１】
また、本実施の形態に係るＩＣタグ１０を、名札や、カード等に取付けることで、名札により個人情報の識別を行うことができる。例えば、この名札を幼稚園や老人ホーム等において用い、名札を人が着ている衣服等に取り付けた場合、この状態で園児や老人が転倒したとしても、ＩＣタグ１０の外層部材１４は軟質樹脂で構成される軟らかなものであることから、ＩＣタグ１０により園児や老人が怪我をすることはない。
【００２２】
また、本実施の形態に係るＩＣタグ１０を、配管等の曲面に固定するような場合でも、ＩＣタグ１０が配管等の曲面に追従して（沿って）屈曲するので、容易に配管等に固定することができる。
【００２３】
次に、本発明の他の実施の形態を添付図面に基づいて説明する。
【００２４】
（第２の実施形態）
図１における本体部材の一変形例の断面図を図２に示す。尚、図１と同様の部材については同じ符号を付しており、これらの部材については新たな説明を省略する。
【００２５】
図２に示す本実施の形態に係るＩＣタグの本体部材２３の基本的な構成は、図１に示したＩＣタグ１０の本体部材１３と同様であるが、薄膜基板が熱硬化性樹脂のプリプレグシート２１で構成される点で異なる。
【００２６】
プリプレグシート２１は、ガラスエポキシ等の熱硬化性樹脂で構成される。このプリプレグシート２１の一方の面（図２中では上面）に、内蔵部品を配置した状態で熱プレスすることにより、プリプレグシート２１が熱硬化し、プリプレグシート２１と内蔵部品とが強固に接着、固定され、本体部材２３が得られる。この本体部材２３を、シート１２ａ，１２ｂ（図１参照）で挟んで積層した後、加熱、加圧することで外層部材１４が形成され、ＩＣタグが得られる。
【００２７】
本実施の形態に係る本体部材２３を用いたＩＣタグにおいても、前実施の形態に係るＩＣタグ１０と同様の作用効果が得られる。
【００２８】
（第３の実施形態）
図１における本体部材の一変形例の断面図を図３に示す。尚、図１と同様の部材については同じ符号を付しており、これらの部材については新たな説明を省略する。
【００２９】
図３に示す本実施の形態に係るＩＣタグの本体部材３３の基本的な構成は、図１に示したＩＣタグ１０の本体部材１３と同様であるが、薄膜基板が自己融着性を有する熱可塑性樹脂シート３１で構成される点で異なる。
【００３０】
熱可塑性樹脂シート３１は、ＰＶＣ、ＰＥＴＧ、ＰＢＴ等の自己融着性を有する熱可塑性樹脂で構成される。この熱可塑性樹脂シート３１の一方の面（図３中では上面）に内蔵部品を配置した状態で熱プレスすることにより、熱可塑性樹脂シート３１が溶融し、熱可塑性樹脂シート３１に内蔵部品が埋まった状態で強固に接着、固定され、本体部材３３が得られる。この本体部材３３を、シート１２ａ，１２ｂ（図１参照）で挟んで積層した後、加熱、加圧することで外層部材１４が形成され、ＩＣタグが得られる。
【００３１】
本実施の形態に係る本体部材３３を用いたＩＣタグにおいても、前実施の形態に係るＩＣタグ１０と同様の作用効果が得られる。
【００３２】
（第４の実施形態）
本発明の他の好適な一実施形態に係るＩＣタグの断面図を図４に示す。尚、図１と同様の部材については同じ符号を付しており、これらの部材については新たな説明を省略する。
【００３３】
図３に示す本実施の形態に係るＩＣタグ３０の基本的な構成は、図１に示したＩＣタグ１０と同様であるが、本体部材４３が、内蔵部品を２枚の薄膜基板１１，１１で挟み込んでなる点で異なる。
【００３４】
薄膜基板１１，１１で内蔵部品を挟み込んだ後、加熱することで熱接着剤層１１ｂ，１１ｂが溶融、固化し、基板１１，１１と内蔵部品とが強固に接着、固定され、本体部材４３が得られる。この本体部材４３をシート１２ａ，１２ｂで挟んで積層した後、加熱、加圧することで外層部材１４が形成され、ＩＣタグ３０が得られる。
【００３５】
本実施の形態に係るＩＣタグ４０においても、前実施の形態に係るＩＣタグ１０と同様の作用効果が得られる。
【００３６】
【発明の効果】
以上要するに本発明によれば、軟質な外層部材に伸縮等の外力が加わっても、外層部材内部の内蔵部品に破損などのおそれの無いＩＣタグを得ることができるという優れた効果を発揮する。
【図面の簡単な説明】
【図１】本発明の好適な一実施形態に係るＩＣタグの断面図である。
【図２】図１における本体部材の一変形例を示す断面図である。
【図３】図１における本体部材の一変形例を示す断面図である。
【図４】本発明の他の好適な一実施形態に係るＩＣタグの断面図である。
【図５】従来のＩＣタグの一例を示す断面図である。
【符号の説明】
２ アンテナコイル
３ ＩＣモジュール
１０ ＩＣタグ
１１ 薄膜基板
１３ 本体部材
１４ 外層部材[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an IC tag in which a built-in component formed by electrically connecting an IC module to an antenna coil around which a conductive wire is wound is covered with an outer layer member.
[0002]
[Prior art]
RFID (high-frequency identity recognition) is a non-contact automatic recognition technology, and its use is expanding. One type of RFID is an IC tag, and the IC tag is used by a person or fixed to an object (such as a product).
[0003]
As an antenna built in an IC tag, there is an antenna coil in which a conductive wire is wound. The antenna coil is employed in most of the 125 kHz frequency IC tags, and a part thereof is employed in the 13.56 MHz frequency IC tag.
[0004]
FIG. 5 shows an example of a conventional IC tag. In the IC tag 1, an IC module 3 is electrically connected to an antenna coil 2, and the antenna coil 2 and the IC module 3 are directly molded and sealed by an outer layer member 4. It is what was covered by doing. Examples of the method of molding and sealing this type of IC tag 1 include lamination, injection molding, and resin casting. Examples of the outer layer member 4 used for molding include hard members generally having relatively high hardness, such as PVC (polyvinyl chloride), ABS (acrylonitrile-butadiene-styrene copolymer resin), and epoxy resin.
[0005]
When the IC tag 1 in which the outer layer member 4 is made of a hard material is used by being fixed to a curved surface such as a pipe, it is difficult to fix the hard IC tag 1 to a curved surface. Therefore, there is a flexible IC tag in which an outer layer member is made of a flexible material (soft material) in order to facilitate fixing to a curved surface such as a pipe (for example, see Patent Document 1).
[0006]
[Patent Document 1]
JP-A-5-30874
[Problems to be solved by the invention]
However, when a soft material such as a soft resin is used as the outer layer member 4, the built-in antenna coil 2 and the IC module 3 are directly sealed and fixed by the soft resin, so that an external force such as expansion and contraction is applied to the IC tag. At times, the expansion or contraction is directly transmitted to the antenna coil 2 and the IC module 3. Therefore, there is a problem that the antenna coil 2 may be disconnected or the IC module 3 may be damaged.
[0008]
SUMMARY OF THE INVENTION An object of the present invention created in consideration of the above circumstances is to provide an IC tag in which a built-in component inside an outer layer member is not likely to be damaged even when an external force such as expansion and contraction is applied to a soft outer layer member. is there.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, an IC tag according to the present invention is an IC tag in which a built-in component formed by electrically connecting an IC module to an antenna coil wound with a conductive wire is covered with an outer layer member made of resin. Parts are mounted and fixed on a thin film substrate to form a main body member, and the main body member is covered with an outer layer member made of a soft resin.
[0010]
Also, in an IC tag in which a built-in component formed by electrically connecting an IC module to an antenna coil wound with a conductive wire is covered with an outer layer member made of resin, a body member is formed by sandwiching the built-in component between thin film substrates. The main body member is covered with an outer layer member made of a soft resin.
[0011]
Here, the soft resin is preferably a thermoplastic urethane elastomer, a thermosetting urethane, or a hot melt resin. Further, the thin film substrate is preferably a prepreg sheet of a thermosetting resin, a sheet of a thermoplastic resin having self-fusing properties, or a sheet obtained by coating a PET base material with a hot melt resin or an adhesive.
[0012]
According to the above configuration, since an IC tag in which a highly rigid main body member is covered with a soft outer layer member is obtained, even when an external force such as expansion and contraction is applied to the outer layer member, the IC tag is sealed inside the outer layer member. There is no risk of damage to built-in components.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings.
[0014]
(1st Embodiment)
FIG. 1 is a sectional view of an IC tag according to a preferred embodiment of the present invention. The same members as those in FIG. 5 are denoted by the same reference numerals, and a new description of these members will be omitted.
[0015]
As shown in FIG. 1, an IC tag 10 according to the present embodiment includes a built-in component formed by electrically connecting an IC module 3 to an antenna coil (for example, a spiral antenna coil) 2 around which a conductive wire is wound. A main body member 13 is formed by being placed and fixed on a substrate 11, and the main body member 13 is covered with an outer layer member 14 made of a soft resin. The IC tag 10 may be appropriately punched or the like to obtain a predetermined shape (for example, a card shape).
[0016]
The thin film substrate 11 is composed of a PET (polyethylene terephthalate) base (for example, about 100 μm thick) 11a and an adhesive layer (for example, about 25 μm thick) 11b provided on one surface (the upper surface in FIG. 1) of the PET base 11a. It is composed of After mounting (arranging) the built-in components (the antenna coil 2 and the IC module 3) on the thin film substrate 11, the heating adhesive layer 11b is melted and solidified by heating, and the substrate 11 and the built-in components are firmly connected. The main body member 13 is obtained by bonding and fixing. As a constituent material of the adhesive layer 11b, an acrylic heat adhesive, a hot melt resin (for example, polyamide, urethane, EVA, or the like), an adhesive, or the like can be given.
[0017]
The outer layer member 14 is composed of two sheets 12a and 12b. After laminating the main body member 13 between the sheets 12a and 12b, the outer layer member 14 in which the main body member 13 is sealed is formed by applying heat and pressure.
[0018]
As the soft resin constituting the outer layer member 14, a thermoplastic urethane elastomer (Thermoplastic Elastomers; hereinafter, referred to as TPE) is used. By using TPE as the soft resin, the outer layer member 14 has sufficient flexibility. Examples of the soft resin include a thermoplastic urethane elastomer, a thermosetting urethane, and a hot melt resin (for example, polyamide, urethane, EVA (ethylene-vinyl acetate copolymer), etc.) in addition to TPE.
[0019]
Next, the operation of the present embodiment will be described.
[0020]
Although the PET base 11a of the thin film substrate 11 is thin and has low rigidity, the built-in component is firmly fixed integrally with the thin film substrate 11 via the adhesive layer 11b, so that the obtained main body member 13 is high. Has rigidity. Therefore, even if the soft outer layer member 14 provided around the main body member 13 expands and contracts, since the main body member 13 has high rigidity, it does not follow the expansion and contraction of the outer layer member 14. As a result, even if the IC tag 10 is bent by an external force or the like, breakage or damage of the built-in components such as disconnection of the antenna coil 2 and breakage of the IC module 3 can be prevented.
[0021]
Also, by attaching the IC tag 10 according to the present embodiment to a name tag, a card, or the like, personal information can be identified by the name tag. For example, when this name tag is used in a kindergarten or a nursing home or the like and the name tag is attached to clothes or the like worn by a person, the outer layer member 14 of the IC tag 10 is made of a soft resin even if the child or the elderly falls down in this state. Since the IC tag 10 is soft, the child and the elderly are not injured by the IC tag 10.
[0022]
Further, even when the IC tag 10 according to the present embodiment is fixed to a curved surface such as a pipe, the IC tag 10 bends (follows) a curved surface such as a pipe so that the IC tag 10 can be easily applied to the pipe or the like. Can be fixed.
[0023]
Next, another embodiment of the present invention will be described with reference to the accompanying drawings.
[0024]
(Second embodiment)
FIG. 2 is a sectional view of a modification of the main body member in FIG. The same members as those in FIG. 1 are denoted by the same reference numerals, and a new description of these members will be omitted.
[0025]
The basic configuration of the main body member 23 of the IC tag according to the present embodiment shown in FIG. 2 is the same as that of the main body member 13 of the IC tag 10 shown in FIG. The difference is that the sheet 21 is formed.
[0026]
The prepreg sheet 21 is made of a thermosetting resin such as glass epoxy. By hot-pressing the prepreg sheet 21 on one surface (the top surface in FIG. 2) with the built-in components disposed, the prepreg sheet 21 is thermoset, and the prepreg sheet 21 and the built-in components are firmly adhered to each other. The main body member 23 is obtained by being fixed. After the main body member 23 is sandwiched between the sheets 12a and 12b (see FIG. 1) and laminated, the outer layer member 14 is formed by applying heat and pressure to obtain an IC tag.
[0027]
In the IC tag using the main body member 23 according to the present embodiment, the same operation and effect as those of the IC tag 10 according to the previous embodiment can be obtained.
[0028]
(Third embodiment)
FIG. 3 is a sectional view of a modification of the main body member in FIG. The same members as those in FIG. 1 are denoted by the same reference numerals, and a new description of these members will be omitted.
[0029]
The basic configuration of the main body member 33 of the IC tag according to the present embodiment shown in FIG. 3 is the same as that of the main body member 13 of the IC tag 10 shown in FIG. 1, but the thin film substrate has a self-fusing property. It differs in that it is constituted by a thermoplastic resin sheet 31.
[0030]
The thermoplastic resin sheet 31 is made of a self-fusing thermoplastic resin such as PVC, PETG, or PBT. The thermoplastic resin sheet 31 is melted by hot pressing in a state where the built-in components are arranged on one surface (the upper surface in FIG. 3) of the thermoplastic resin sheet 31, and the built-in components are embedded in the thermoplastic resin sheet 31. The main body member 33 is obtained by firmly adhering and fixing the main body member 33 in the folded state. After the main body member 33 is laminated by sandwiching it between the sheets 12a and 12b (see FIG. 1), the outer layer member 14 is formed by applying heat and pressure to obtain an IC tag.
[0031]
In the IC tag using the main body member 33 according to the present embodiment, the same operation and effect as those of the IC tag 10 according to the previous embodiment can be obtained.
[0032]
(Fourth embodiment)
FIG. 4 is a sectional view of an IC tag according to another preferred embodiment of the present invention. The same members as those in FIG. 1 are denoted by the same reference numerals, and a new description of these members will be omitted.
[0033]
The basic configuration of the IC tag 30 according to the present embodiment shown in FIG. 3 is the same as that of the IC tag 10 shown in FIG. 1, except that the main body member 43 has two built-in components and two thin film substrates 11 and 11. It differs in that it is sandwiched between.
[0034]
After the built-in components are sandwiched between the thin film substrates 11, 11, the heat adhesive layers 11b, 11b are melted and solidified by heating, and the substrates 11, 11 and the built-in components are firmly adhered and fixed, and the main body member 43 is fixed. can get. After laminating the main body member 43 between the sheets 12a and 12b, the outer layer member 14 is formed by heating and pressing, and the IC tag 30 is obtained.
[0035]
In the IC tag 40 according to the present embodiment, the same operation and effect as those of the IC tag 10 according to the previous embodiment can be obtained.
[0036]
【The invention's effect】
In short, according to the present invention, even when an external force such as expansion and contraction is applied to a soft outer layer member, an excellent effect that an IC tag in which a built-in component inside the outer layer member is not likely to be damaged can be obtained.
[Brief description of the drawings]
FIG. 1 is a sectional view of an IC tag according to a preferred embodiment of the present invention.
FIG. 2 is a sectional view showing a modification of the main body member in FIG.
FIG. 3 is a sectional view showing a modification of the main body member in FIG.
FIG. 4 is a cross-sectional view of an IC tag according to another preferred embodiment of the present invention.
FIG. 5 is a cross-sectional view illustrating an example of a conventional IC tag.
[Explanation of symbols]
2 antenna coil 3 IC module 10 IC tag 11 thin film substrate 13 main body member 14 outer layer member

Claims (4)

導線を巻き回したアンテナコイルにＩＣモジュールを電気的に接続してなる内蔵部品を、樹脂からなる外層部材で被覆したＩＣタグにおいて、上記内蔵部品を薄膜基板上に載置・固定して本体部材を形成し、その本体部材を軟質樹脂からなる外層部材で被覆したことを特徴とするＩＣタグ。In an IC tag in which a built-in component formed by electrically connecting an IC module to an antenna coil wound with a conductive wire is covered with an outer layer member made of a resin, the built-in component is placed and fixed on a thin film substrate to form a main body member. Wherein the main body member is covered with an outer layer member made of a soft resin. 導線を巻き回したアンテナコイルにＩＣモジュールを電気的に接続してなる内蔵部品を、樹脂からなる外層部材で被覆したＩＣタグにおいて、上記内蔵部品を薄膜基板で挟み込んで本体部材を形成し、その本体部材を軟質樹脂からなる外層部材で被覆したことを特徴とするＩＣタグ。In an IC tag in which a built-in component formed by electrically connecting an IC module to an antenna coil wound with a conductive wire is covered with an outer layer member made of a resin, the built-in component is sandwiched between thin film substrates to form a main body member. An IC tag comprising a body member covered with an outer layer member made of a soft resin. 上記軟質樹脂が、熱可塑性ウレタンエラストマー、熱硬化性ウレタン、又はホットメルト樹脂である請求項１又は２に記載のＩＣタグ。The IC tag according to claim 1, wherein the soft resin is a thermoplastic urethane elastomer, a thermosetting urethane, or a hot melt resin. 上記薄膜基板が、熱硬化性樹脂のプリプレグシート、自己融着性を有する熱可塑性樹脂のシート、又はＰＥＴ基材にホットメルト樹脂或いは粘着剤をコーティングしてなるシートである請求項１から３いずれかに記載のＩＣタグ。The thin film substrate is a prepreg sheet of a thermosetting resin, a sheet of a thermoplastic resin having self-fusing properties, or a sheet obtained by coating a PET base material with a hot melt resin or an adhesive. An IC tag described in Crab.
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