JP2004349101A - Film forming method, film forming device, manufacturing method of organic electroluminescent device, and organic electroluminescent device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film forming device capable of simply applying vapor deposition to a larger substrate, contributing to cost reduction. <P>SOLUTION: The film forming device 100 comprises an evaporation source 2 from which a material is evaporated or sublimated, and a means for relative movement 7 relatively moving the evaporation source 2 together with a mask 5 to the substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a film forming method, a film forming apparatus, a method of manufacturing an organic electroluminescence device, and an organic electroluminescence device.
[0002]
[Prior art]
In recent years, with the development of electronic devices such as computers and portable information devices, the use of organic electroluminescent devices as color display devices has been increasing. In the manufacturing process of this type of organic electroluminescence device, for example, when patterning an organic electroluminescence material or an electrode for light emission, deterioration of the organic material due to moisture or oxygen becomes a problem. Used.
[0003]
In a method of manufacturing an organic electroluminescence device including such a vapor deposition step, it is possible to reduce the cost by increasing the size of the substrate and increasing the number of panels to be obtained from one substrate. As the size of the mask increases, the yield of mask manufacturing may decrease. In addition, as the size of the substrate increases, in a substrate rotation type evaporation apparatus, the size of the apparatus itself may significantly increase the cost, and furthermore, the variation in the thickness of the evaporation film in the substrate may increase. Therefore, techniques as disclosed in Patent Documents 1 to 3 are disclosed.
[0004]
[Patent Document 1]
JP 2001-237073 A [Patent Document 2]
JP 2001-247959 A [Patent Document 3]
JP-A-2002-175878 [0005]
[Problems to be solved by the invention]
In Patent Literature 1, a plurality of members (unit masks) to be used as a vapor deposition mask and a base material to which the members are attached are positioned and fixed with alignment marks to increase the size of the mask. However, when there is a linear expansion difference between the base material and the unit mask, the temperature of the mask increases due to radiant heat from the evaporation source, and as a result, the mask may be distorted and the accuracy of evaporation may not be obtained. If the coefficient of linear expansion is the same, the whole will expand, but the material that can be used as a unit mask is limited, and cannot be adjusted to the expansion of the substrate, resulting in a displacement of the deposition pattern. May be larger.
[0006]
Also, in Patent Document 2 described above, with respect to the increase in the size of the vapor deposition apparatus and the variation in the film thickness of the vapor deposition inside the substrate, it has been realized that the vapor deposition sources are arranged in a line and scanned on the substrate, thereby uniformly vapor deposition within the substrate. Therefore, it is considered possible to prevent the deposition apparatus itself from being enlarged. However, it is necessary to use an evaporation mask having an opening corresponding to the shape of the evaporation pattern and an evaporation mask corresponding to the size of the substrate, and there is a fear that the yield of manufacturing the evaporation mask may be reduced.
[0007]
Further, in Patent Document 3 described above, a method is employed in which a deposition mask having a size smaller than the substrate size is used, and the deposition is performed in a plurality of times. It may take time.
[0008]
The present invention has been made in view of the above circumstances, and an object of the present invention is to form a film capable of easily and efficiently performing deposition on a large-sized substrate and contributing to cost reduction. It is an object of the present invention to provide a method and a film forming apparatus, and further provide a method of manufacturing an organic electroluminescent device including a step using the method and the apparatus, and an organic electroluminescent device obtained by the manufacturing method.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, a film forming method of the present invention is a film forming method of forming a film by vaporizing or sublimating a material and depositing the vaporized or sublimated material on a base material. Alternatively, the film is formed on the substrate while the deposition source to be sublimated is moved relative to the substrate together with the first mask having an opening.
[0010]
According to such a film forming method, since the evaporation source and the mask are integrally moved relative to the substrate, the substrate is large (the film forming surface is large). However, it is possible to form a film on a predetermined surface or the entire surface of the large-sized base material without increasing the size of the evaporation source and the mask. Therefore, since it is not necessary to increase the size of the mask, and hence the film forming apparatus itself, it is possible to suppress a reduction in the manufacturing yield of the mask and, consequently, the manufacturing yield of the film forming apparatus.
In addition, since the mask can be composed of a single member, for example, the mask shape is not deformed due to a difference in linear expansion coefficient as when composed of a plurality of members. Become.
Further, the film forming method of the present invention uses a mask having a size smaller than the size of the base material and forms the film in a plurality of times (see Patent Document 3). The positioning is easy, and there is no need to perform the positioning for each division performed.
Note that the relative movement performed in the film forming method of the present invention can be realized by any method of moving the evaporation source, or the method of moving the base material, and the method of moving both the evaporation source and the base material. is there.
In addition, in the present invention, “integrally” means that the evaporation source and the mask are moved relative to each other while being linked with each other, and does not necessarily mean that they are connected to one member.
[0011]
The film forming method can be performed using, for example, the following apparatus. That is, the film forming apparatus of the present invention is characterized by comprising an evaporation source for evaporating or sublimating a material, and a relative moving means for moving the evaporation source together with the first mask relative to the substrate. According to such a film forming apparatus, the film forming method of the present invention can be suitably realized, and the above-described effects can be easily achieved.
[0012]
In the present invention, the evaporation source is formed in a longitudinal shape, a longitudinal direction of the longitudinal evaporation source is substantially parallel to an arrangement direction of the plurality of openings, and a longitudinal direction of the longitudinal evaporation source. It can be relatively moved with respect to the base material along a direction substantially orthogonal to the base material. When the vapor deposition source is formed in a longitudinal shape, the vapor deposition source and the substrate can be relatively moved along a width direction of the longitudinal vapor source (a direction substantially perpendicular to the longitudinal direction). . In this case, vapor deposition can be performed extending in the relative movement direction with the longitudinal direction of the vapor deposition source as the width, and it is possible to efficiently form a film on a particularly large base material (formation surface having a large area).
[0013]
Further, in the present invention, the mask has openings arranged in a plurality of rows, and is moved relative to the substrate along a direction substantially orthogonal to the arrangement direction of the plurality of openings. Things. According to such a method, it is possible to efficiently form a striped film pattern arranged in a line on the wound forming member.
[0014]
Furthermore, in the present invention, in addition to the first mask formed integrally with the evaporation source, a second mask formed integrally with the substrate can be used. In this case, the second mask is The opening in which the first mask is arranged may be provided with an opening in an array extending in a direction intersecting the opening. According to such an embodiment, it is possible to efficiently form a matrix-like film pattern on the base material, which is suitable for forming a pixel pattern represented by, for example, a display device.
[0015]
In the present invention, the mask may be configured as a plurality of unit masks connected to each other. In this case, it is possible to suppress the positional deviation due to the thermal expansion of the mask, as compared with the case where the mask is configured as a single unit.
[0016]
Further, the mask can be mainly composed of any of silicon, invar, 42 alloy, stainless steel, nickel alloy, and quartz glass. In this case, it is easy to form an opening pattern of the mask, and it is difficult to deform because of small thermal expansion, so that a highly reliable evaporation pattern can be formed.
[0017]
Next, a method of manufacturing an organic electroluminescence device according to the present invention includes the above-described film forming method as one manufacturing step. In this case, for example, an organic electroluminescent material, which is a material for forming a light emitting layer constituting an organic electroluminescent device, can be formed on a substrate by using the above film forming method. Further, for example, an electrode material constituting an organic electroluminescence device can be formed on a substrate by using the above film forming method. As described above, by using the film forming method of the present invention, a predetermined pattern can be efficiently formed on a substrate, and in particular, a pattern corresponding to a pixel of a display device can be formed with high reliability by vapor deposition. Become. In the method of manufacturing an organic electroluminescence device according to the present invention, when a mask having a stripe-shaped opening is used, it is possible to form an electrode or the like corresponding to the stripe, and as described above. By using the two first and second masks, it is possible to form a matrix pixel or the like. And the organic electroluminescent device obtained by such a manufacturing method of the present invention becomes very reliable.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described.
First, FIG. 1 is a plan view schematically showing a vapor deposition device (film forming device) 100 as a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the vapor deposition device 100 of FIG. FIG. 3 is a cross-sectional view schematically showing a cross section BB ′ of the vapor deposition apparatus 100 in FIG.
[0019]
As shown in FIGS. 1 to 3, the vapor deposition apparatus 100 has a vacuum chamber 1 configured as a vapor deposition chamber, and includes a substrate holding unit for holding a substrate 50 as a member to be vapor-deposited. The substrate holding unit 51 has a configuration in which the substrate holding unit 51 holds the substrate 50 in such a manner that the evaporation surface faces the evaporation source 2. The inside of the vacuum chamber 1 is configured to be able to be depressurized by a pump (not shown).
Further, inside the vacuum chamber 1, an evaporation source housing section 3 for housing the evaporation source 2 is provided, and the evaporation source housing section 3 is covered with an evaporation cover 4. The evaporation cover 4 has a function of preventing or suppressing the diffusion of the evaporation material generated from the evaporation source 2.
[0020]
On the other hand, a vapor deposition mask 5 is provided above the vapor deposition source accommodating section 3, and more specifically, is integrally fixed to the mask holding section 6 of the vapor deposition source accommodating section 3.
Further, the evaporation source housing section 3 is assembled to the ball screw 7 on the side opposite to the side on which the mask holding section 6 is formed, and the rotation of the ball screw 7 around the axis causes the long axis of the ball screw 7 to rotate. It is configured to be movable in the direction. Note that the movement of the evaporation source housing section 3 is performed along the linear guide 8. Based on the movement of the evaporation source housing section 3, the evaporation source 2 and the evaporation mask 5 are integrally formed. Will move. The rotation of the ball screw 7 is performed using the motor 9 as a drive source.
[0021]
As described above, in the vapor deposition apparatus (film forming apparatus) 100 of the present embodiment, the vapor deposition source 2 and the vapor deposition mask 5 are provided between the vapor deposition source 2 and the substrate 50 as a deposition target member. The mask 2 and the vapor deposition mask 5 are integrally moved by a mask holding unit 6 (moving means) and move in the major axis direction of the ball screw 7. As a result, the vapor deposition source 2 moves relative to the substrate 50 together with the vapor deposition mask 5, and the vapor deposition material is vapor-deposited on the substrate 50 so as to extend in the moving direction.
[0022]
The vapor deposition source 2 is formed in a longitudinal shape, and is disposed such that the longitudinal direction of the vapor deposition source 2 is substantially perpendicular to the long axis direction of the ball screw 7. As a result, the vapor deposition source 2 has its own width direction. It is configured to move to. On the other hand, the evaporation mask 5 has a stripe-shaped opening 15, and its longitudinal direction is configured to be substantially parallel to the moving direction of the evaporation mask 5, that is, along the longitudinal direction of the stripe-shaped opening 15. , The evaporation source 2 and the evaporation mask 5 move. As shown in FIG. 6, the evaporation source 2 and the evaporation mask 5 are integrated so that the longitudinal direction of the stripe-shaped opening 15 of the evaporation mask 5 and the longitudinal direction of the evaporation source 2 intersect. .
[0023]
An evaporation method (film formation method) using the evaporation apparatus (film formation apparatus) 100 having the above configuration will be described.
First, as shown in FIGS. 1 to 3, the substrate 50 and the evaporation source housing 3 are set. Thereafter, the motor 9 is operated to drive the ball screw 7. The rotation of the ball screw 7 is controlled by a control unit connected to the motor 9, and more specifically, the amount and direction of the rotation are controlled.
[0024]
With the rotation of the ball screw 7, the evaporation source housing 3 moves in the long axis direction of the ball screw 7. In this case, when the ball screw 7 is clockwise, the ball screw 7 moves in the positive direction, and when the ball screw 7 is counterclockwise, the ball screw 7 moves in the negative direction. The deposition mask 5 moves relatively.
[0025]
By vapor-depositing the material from the vapor deposition source 2 while performing such relative movement, for example, as shown in FIG. 4, a stripe-shaped vapor deposition pattern P1 corresponding to the opening 15 of the vapor deposition pattern 5 is formed on the substrate 50. Will be formed. FIG. 4 is a plan view schematically showing the relative movement between the vapor deposition pattern 5 and the substrate 50. FIG. 5 shows the substrate 50 with the vapor deposition pattern P1 obtained by using the vapor deposition apparatus 100 of the present embodiment. It is a top view which shows a structure typically.
[0026]
According to the evaporation method (film formation method) using the evaporation apparatus (film formation apparatus) 100 of the present embodiment as described above, the evaporation source 2 and the evaporation mask 5 are integrally moved relative to the substrate 50. Therefore, even when the deposition area of the substrate 50 is large, deposition is easily performed on a predetermined surface or the entire surface of the large substrate 50 without designing the deposition source 2 and the deposition mask 5 to be large. It becomes possible.
Therefore, it is not necessary to increase the size of the deposition mask 5 with the increase in the deposition area, and it is possible to suppress a decrease in the manufacturing yield of the deposition mask 5.
[0027]
In addition, since the temperature rise during the vapor deposition is larger in the vapor deposition mask 5 than in the substrate 50, it is necessary to reduce the thermal expansion of the vapor deposition mask 5 against positional deviation (accuracy) of the vapor deposition pattern due to thermal expansion. Becomes effective. In order to realize this, it is preferable to use a material having a small linear expansion coefficient as the material of the vapor deposition mask 5, and it is preferable to use, for example, silicon, invar, 42 alloy, stainless steel, nickel alloy, quartz glass, or the like. Among them, silicon is preferable because an opening can be formed with high precision by anisotropic etching. On the other hand, a metal material such as invar can form an opening by ordinary etching. If the thermal expansion of the evaporation mask 5 does not cause a problem, a material such as stainless steel (opening by etching) or nickel alloy (opening by electroforming) can be used.
[0028]
Hereinafter, a second embodiment will be described.
First, FIG. 7 is a plan view schematically showing a vapor deposition apparatus (film forming apparatus) 200 according to a second embodiment of the present invention, and FIG. 8 is a cross-sectional view of the vapor deposition apparatus 200 of FIG. FIG. 9 is a cross-sectional view schematically illustrating a cross section BB ′ of the vapor deposition apparatus 200 in FIG. 7. In the second embodiment, in addition to the evaporation mask (hereinafter, also referred to as a first evaporation mask) 5 integrally formed with the evaporation source 2, a second evaporation mask 105 fixed integrally with the substrate 50. Is greatly different from the first embodiment. Therefore, the other members are denoted by the same reference numerals as in the first embodiment, and unless otherwise specified, members having the same reference numerals as in the first embodiment have the same configuration.
[0029]
As shown in FIGS. 7 to 9, the vapor deposition apparatus 200 has a vacuum chamber 1 configured as a vapor deposition chamber, and a substrate holding unit for holding a substrate 50 as a member to be vapor-deposited in the vacuum chamber 1. The substrate holding unit 51 further holds a second vapor deposition mask 105. The second vapor deposition mask 105 has a stripe-shaped opening 115 extending in a direction crossing the stripe-shaped opening 15 of the vapor deposition mask 5 on the side of the vapor deposition source 2, that is, the moving direction of the vapor deposition source 2. And an opening 115 extending in a direction intersecting with the opening 115.
[0030]
When vapor deposition is performed in the same manner as in the first embodiment using the vapor deposition apparatus 200 having the second vapor deposition mask 105, a matrix vapor deposition pattern P2 as shown in FIG. 50 can be formed. That is, FIG. 10 is a plan view schematically showing the configuration of the substrate 50 with the vapor deposition pattern P2 obtained by using the vapor deposition apparatus 200 of the present embodiment, and the second pattern is different from the stripe pattern shown in FIG. With the vapor deposition mask 105, a vapor deposition pattern P2 in which shadows are formed at predetermined intervals in the longitudinal direction can be obtained. Such a matrix-shaped deposition pattern is suitable for forming, for example, a pixel of a display device. Specifically, an organic material or an electrode material constituting a pixel is formed by a deposition method using the deposition device 200 of the present embodiment. (Film forming method) is preferable.
[0031]
Also, for example, when forming each of the R, G, and B light emitting portions in a predetermined matrix pattern on the organic electroluminescence device substrate shown in FIG. 11, it is preferable to use the vapor deposition device 200. . FIG. 11 is a plan view schematically showing the manner in which the light emitting layer forming material is deposited on the organic electroluminescence device substrate 55. In this manner, the deposition mask 5 of the organic electroluminescence device substrate 55 is formed on the organic electroluminescence device substrate 55. An opening pattern is formed corresponding to an arrangement pattern of any color, and a light-emitting layer forming material (organic electroluminescence material) of one color (for example, R) is vapor-deposited on the substrate 55 by the above-described method, and a pixel of a predetermined color ( While forming the R pixels, the other pixels (G pixels and B pixels) can be formed after the evaporation mask 5 is moved by a predetermined distance in the direction perpendicular to the relative movement direction of the evaporation source 2. In this case, pixels of each color can be suitably formed, and a large-sized organic electroluminescence panel can be manufactured efficiently.
[0032]
The following modifications can be added to the vapor deposition apparatuses 100 and 200 of the present embodiment. FIG. 12 is a cross-sectional view schematically showing the relationship between an evaporation mask and an evaporation source. In this case, the deposition mask 150 has a configuration in which a plurality of unit masks are connected. In this case, as described in the first embodiment, the deposition mask is formed of a single member. As compared with the case, it is possible to suppress the positional deviation due to the thermal expansion or the like of the evaporation mask. That is, since the thermal expansion is reduced in the connecting portion, the positional deviation of the mask can be suppressed. Note that, for example, it is preferable that a base material 151 is provided at the connection portion, and the deposition mask 150 is held on the base material 151. The structure shown in FIG. 12 is particularly suitable when a material such as silicon having a limited outer dimension is used as a material for forming the evaporation mask.
[0033]
FIG. 13 is a sectional view schematically showing a vapor deposition apparatus 300 according to the third embodiment. In this case, the position of the evaporation source 2 is fixed, and only the evaporation mask 5 moves relative to the substrate 5. Here, a protective sheet 11 is placed over a region other than the vapor deposition mask 5 so that the material vapor deposited from the vapor deposition source 2 reaches the substrate 50 through an opening (not shown) of the vapor deposition mask 5. I have. The protective sheet 11 is made of a stretchable rubber sheet, and the protective sheet 11 is deformed with the movement of the vapor deposition mask 5 to reliably prevent the vapor deposition material from reaching the substrate 50 from a region other than the vapor deposition mask 5. I have.
[0034]
Next, a method of manufacturing an organic electroluminescence device employing the above-described vapor deposition device (film forming device) and vapor deposition method (film forming method), and a configuration of the organic electroluminescence device will be described. FIG. 14 is a plan view schematically showing a schematic configuration of the organic electroluminescence device, and reference numeral 270 in FIG. 14 denotes an organic electroluminescence panel. Such an organic electroluminescence panel can be obtained by forming each light emitting layer (R pixel, G pixel, B pixel) on an organic electroluminescence device substrate 55 as shown in FIG.
[0035]
The organic electroluminescence panel 270 includes a substrate 55 made of glass or the like, a large number of organic electroluminescence elements forming pixels 271 (R pixels, G pixels, and B pixels shown in FIG. 11) arranged in a matrix. And a stop substrate (not shown). The substrate 55 is made of, for example, a transparent substrate such as glass, and includes a display region 202a located at the center of the substrate 55, and a non-display region 202b located at the periphery of the substrate 55 and arranged outside the display region 202a. Is divided into The display region 202a is a region formed by the organic electroluminescent elements arranged in a matrix, and is also called an effective display region. As described above, by the evaporation method (film formation method) using the above-described evaporation apparatus (film formation apparatus) 200 of the present embodiment, it is possible to easily configure each pixel in a matrix, and furthermore, a large-sized organic electroluminescence. It can be suitably used for an apparatus. When a striped electrode is formed on each substrate of the panel, the vapor deposition device 100 of the first embodiment is preferably used, and also in this case, it is suitably used for a large organic electroluminescence device. be able to.
[Brief description of the drawings]
FIG. 1 is a plan view schematically showing a vapor deposition apparatus according to a first embodiment of the present invention.
FIG. 2 is a sectional view taken along line AA ′ of FIG. 1;
FIG. 3 is a sectional view taken along the line BB ′ of FIG. 1;
FIG. 4 is a plan view schematically showing an operation when the vapor deposition device of the first embodiment is used.
FIG. 5 is a plan view schematically showing a deposition pattern obtained by using the deposition apparatus of the first embodiment.
FIG. 6 is an explanatory diagram showing a configuration of a main part of the vapor deposition apparatus of the first embodiment.
FIG. 7 is a plan view schematically showing a vapor deposition apparatus according to a second embodiment of the present invention.
FIG. 8 is a sectional view taken along line AA ′ of FIG. 7;
FIG. 9 is a sectional view taken along the line BB ′ of FIG. 7;
FIG. 10 is a plan view schematically showing a deposition pattern obtained by using the deposition apparatus of the first embodiment.
FIG. 11 is a plan view schematically showing a mode of depositing a light emitting layer forming material on a substrate for an organic electroluminescence device.
FIG. 12 is a cross-sectional view schematically showing a modification of the relationship between the deposition mask and the deposition source in the first and second embodiments.
FIG. 13 is a cross-sectional view schematically illustrating a vapor deposition apparatus according to a third embodiment.
FIG. 14 is a plan view showing one embodiment of an organic electroluminescence device obtained by a manufacturing method using the vapor deposition device of the present embodiment.
[Explanation of symbols]
2 evaporation source, 5 evaporation mask (mask), 6 evaporation mask holding member (moving means), 7 ball screw (relative moving means), 50 substrate (base material), 100, 200, 300 evaporation apparatus ( Film forming equipment)

Claims (16)

A film forming method for forming a film by vaporizing or sublimating a material and depositing the vaporized or sublimated material on a substrate,
A film forming method for forming the film on the base material while moving an evaporation source for vaporizing or sublimating the material, together with a first mask having an opening, relative to the base material. A film forming method for forming a film by vaporizing or sublimating a material and depositing the vaporized or sublimated material on a substrate,
A film forming method for forming the film on the substrate while moving a first mask having an opening relative to the substrate. The first mask has openings arranged in a plurality of rows, and is moved relative to the base material along a direction substantially orthogonal to an arrangement direction of the plurality of openings. 3. The film forming method according to 2. The evaporation source is configured in a longitudinal shape,
The longitudinal direction of the longitudinal evaporation source is substantially parallel to the arrangement direction of the plurality of openings,
4. The film forming method according to claim 3, wherein the film is moved relative to the substrate along a direction substantially orthogonal to a longitudinal direction of the longitudinal evaporation source. 3. The method according to claim 1, wherein a second mask is disposed between the substrate and the deposition source, and a film is formed on the substrate via the first mask and the second mask. 4. Film formation method. The first mask has a plurality of openings and a plurality of openings are arranged in a row, the second mask has a plurality of openings and a plurality of openings are arranged in a row,
6. The film forming method according to claim 5, wherein an arrangement direction of the plurality of openings formed in the first mask is substantially orthogonal to an arrangement direction of the plurality of openings formed in the second mask. 7. The film forming method according to claim 3, wherein the arrangement of the plurality of openings provided to the first mask and / or the second mask is a stripe. 8. An evaporation source for vaporizing or sublimating the material,
Relative movement means for moving the evaporation source relative to the substrate together with the first mask,
A film forming apparatus comprising: The first mask has a plurality of openings arranged in a row, and a relative movement direction regulation that moves relatively to the substrate along a direction substantially orthogonal to the arrangement direction of the plurality of openings. The film forming apparatus according to claim 8, further comprising a unit. The deposition source is configured in a longitudinal shape, the longitudinal direction of the longitudinal deposition source is substantially parallel to the arrangement direction of the plurality of openings,
Along a direction substantially perpendicular to the longitudinal direction of the longitudinal evaporation source,
The film forming apparatus according to claim 8, further comprising a relative movement direction regulating unit that relatively moves the substrate. The film forming apparatus according to claim 8, further comprising a second mask disposed between the base material and the evaporation source. The film forming apparatus according to any one of claims 8 to 10, wherein the first mask is formed by connecting a plurality of unit masks. A method for manufacturing an organic electroluminescence device, comprising the film formation method according to claim 1 as a manufacturing step. The method according to claim 13, further comprising a step of vaporizing or sublimating the organic material using the film forming method, and depositing the vaporized or sublimated organic material on a base material to form a film. A method for manufacturing a luminescence device. 14. The organic electroluminescence device according to claim 13, further comprising a step of vaporizing or sublimating an electrode material using the film forming method, and depositing the vaporized or sublimated material on a substrate to form a film. Manufacturing method. An organic electroluminescence device obtained by the manufacturing method according to claim 13.

Images