JP2004319724A - Structure of washing tub in semiconductor washing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology which prevents a washing liquid from staying in internal joints of a washing tub at the time of washing a semiconductor wafer and exhausting the washing liquid, and which shortens the drain-off time. <P>SOLUTION: The washing tub 8 comprises four side faces 8a, 8b, 8c, and 8d which are integrally formed into one unit. The side faces 8a-8d are each constituted of a rectangular, for example, nearly square-shaped flat surface. The washing tub 8 has a bottom, and is constructed by joining the four side faces 8a-8d to one another and then jointing the four side faces 8a-8d to a bottom face 8e constituted of a flat surface having nearly the same shape as those of the side faces 8a-8d. The internal joints 8f, 8g, 8h, and 8i of the four side faces 8a-8d of the washing tub 8 are formed into, for example, an arcuate cross-sectional shape. Internal joints 8j, 8k, 8m, and 8n for joining the four side faces 8a-8d and the bottom face 8e are also formed into the arcuate cross-sectional shape of nearly the same shape, just like the internal joints 8f-8i. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a cleaning method in a semiconductor cleaning apparatus in which a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, and an electronic component is immersed in a cleaning liquid contained in a cleaning tank to perform processing such as cleaning of the substrate. The structure of the tank.
[0002]
[Prior art]
Generally, in a semiconductor manufacturing process, a step of treating a semiconductor wafer with a chemical in order to remove contaminants from the surface of the semiconductor wafer contaminated during a previous process or processing is provided. Thereafter, impurities or suspended matters such as chemicals or particles attached to the semiconductor wafer are washed by a washing tank.
FIG. 4 shows an example of a cleaning tank in a conventional semiconductor cleaning apparatus.
Describing this, 1 is a bottomed and substantially box-shaped having a rectangular side surface and an open upper surface, and is a cleaning tank of a semiconductor cleaning apparatus. Reference numeral 2 denotes a cleaning liquid such as ultrapure water supplied into the cleaning tank 1. Reference numeral 3 denotes a semiconductor wafer immersed in a predetermined position in the cleaning liquid 2 in the cleaning tank 1. Reference numeral 4 denotes a drain port disposed on the bottom of the cleaning tank 1. The drain valve 5 is opened when the cleaning liquid 2 is replaced during the cleaning of the semiconductor wafer 3, and the cleaning liquid 2 is discharged from the discharge pipe 6. Discharge to the outside. Reference numeral 7b denotes a supply pipe for supplying the cleaning liquid 2 such as ultrapure water, which supplies the cleaning liquid 2 from the supply pipe 7b and overflows from the upper portions of the side portions 1a and 1c of the cleaning tank 1, and the outer tank 7 and the outer tank drain pipe. The cleaning liquid 2 is discharged through 7a. During the cleaning of the semiconductor wafer 3, a new cleaning liquid 2 is always supplied, and the clean cleaning liquid 2 flows from the lower part of the tank toward the upper part of the tank.
Further, as shown in FIG. 4, the cleaning tank 1 has four inner side joints of four side parts 1a, 1c, etc. (the other two side parts are not shown), and the four side parts and the bottom part. The inner joints 1j and 1m of 1e (the other two side surfaces are not shown) each form a joint angle θ of approximately 90 °.
Such a configuration is disclosed, for example, in the drawings of Japanese Patent Laid-Open Publication No. H11-307505.
[Problems to be solved by the invention]
[0003]
Since the structure of the cleaning tank in the semiconductor cleaning apparatus according to the prior art has the above-described shape and structure, the following problems exist.
That is, when the cleaning liquid 2 in the cleaning process of the semiconductor wafer 3 is replaced, the drain valve 5 is opened and the used cleaning liquid 2 flows out from the discharge pipe 6 as shown by arrows A and B in FIG. However, each of the eight inner joints 1j, 1m, etc. of the cleaning tank 1 has a joint angle θ of approximately 90 °, and despite the discharge of the cleaning liquid 2, the cleaning liquid 2 The portion 2a remains stagnated, it takes much time to completely drain, and there is a risk that the semiconductor wafer 3 is dried and a natural oxide film or a watermark is generated on the semiconductor wafer 3. Then, during the cleaning of the semiconductor wafer 3, the particles p, floating substances or impurities floating in the cleaning liquid 2 in the cleaning tank 1 stay in the portions where the cleaning liquid is stagnant in the inner joints 1j, 1m, etc. There is a problem that the cleaning time of a wafer or the like becomes long.
[0004]
[Means for Solving the Problems]
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems in the prior art, the present invention is to form a shape of an inner joint between each side portion and a bottom portion of a cleaning tank into a substantially circular arc shape and / or to form a multi-sided shape. Thereby, it is intended to eliminate the stagnation of the cleaning liquid in the cleaning tank, improve the flow efficiency of the cleaning liquid, and to prevent the cleaning liquid from being drained smoothly at the time of replacement of the cleaning liquid. It is established from the means.
[0005]
According to the first aspect of the present invention, there is provided a cleaning tank having a substantially box shape with a bottom having a rectangular side surface and an open upper surface, the cleaning tank being provided in a semiconductor cleaning apparatus, wherein each of the side surfaces of the cleaning tank. A structure of a cleaning tank in a semiconductor cleaning apparatus, wherein an inner joint portion of each other and an inner joint portion of each of the side portions and the bottom portion are formed in a substantially arc shape.
[0006]
According to the second aspect of the present invention, there is provided a cleaning tank having a substantially box-like shape having a bottom and a rectangular side surface and an open upper surface, which is installed in a semiconductor cleaning apparatus, wherein each side surface of the cleaning bath is provided. Cleaning in a semiconductor cleaning apparatus, wherein one face body connected to the inner surface of each of the side surfaces and the bottom surface portion is formed at the inner joint portion of the comrades and at the inner junction portion of each side surface portion and the bottom surface portion. The structure of the tank.
[0007]
According to the third aspect of the present invention, there is provided a cleaning tank having a substantially box shape with a bottom and having a rectangular side surface and an open upper surface provided in a semiconductor cleaning apparatus, wherein each side surface of the cleaning bath is provided. A cleaning tank in a semiconductor cleaning apparatus, wherein a polyhedron connected to each of the side surfaces and the inner surface of the bottom portion is formed at an inner joint portion of each other and at an inner joint portion of each of the side surface portions and the bottom portion. The structure is as follows.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the structure of a cleaning tank in a semiconductor cleaning apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0009]
Embodiment 1 of the present invention
Reference numeral 8 denotes a bottomed, substantially box-shaped cleaning tank having four rectangular side surfaces and an open top surface as shown in FIG. 1, and is formed of, for example, a quartz material or various resin materials. . Reference numeral 9 denotes a semiconductor wafer, for example, which is subjected to a chemical treatment in a chemical treatment tank, and is placed at a predetermined position of a cleaning liquid 10 made of ultrapure water or the like stored in the cleaning tank 8 by a carrier (not shown) or the like. Moving. Although the semiconductor wafer 9 has a circular shape in FIG. 1, the present invention is not limited to this. The semiconductor wafer 9 is cleaned by the cleaning liquid 10 described above.
[0010]
Then, before the semiconductor wafer 9 is put into the cleaning tank 8, the cleaning liquid 10 such as ultrapure water is supplied from the pure water supply pipe 14 to the cleaning tank 8 with the drain valve 13 a provided on the drain pipe 13 closed. Then, the cleaning liquid 10 overflows from the upper end of the cleaning tank 8. That is, overflow occurs. Then, the overflowing cleaning liquid 10 is received by the outer tank 11 and drained by the outer tank drain pipe 12. With the cleaning liquid 10 overflowing, the semiconductor wafer 9 waits for the semiconductor wafer 9 to be put into the cleaning tank 8. Then, the semiconductor wafer 9 is put into the cleaning tank 8 to perform the first cleaning.
After a predetermined time, the drain valve 13a located on the drain pipe 13 is opened to drain the cleaning liquid 10. During the drainage of the cleaning liquid 10, the supply from the pure water supply pipe 14 is stopped. Further, the drain valve 13a is closed again, and the cleaning liquid 10 is supplied to the cleaning tank 8 from the pure water supply pipe 14 and overflows from the upper end of the cleaning tank 8. 2 is washed. After a lapse of a predetermined time, the semiconductor wafer 9 is taken out of the cleaning tank 8 and transported to the next step (a drying area or the like). The remaining cleaning liquid 10 is in a state of overflow so as to be used for cleaning the next semiconductor wafer 9.
[0011]
By the way, as shown in FIG. 2, the cleaning tank 8 has four side surfaces 8a, 8b, 8c and 8d formed in series around the cleaning bath 8, and each of the side surfaces 8a to 8d is rectangular, for example, substantially rectangular. It is composed of a square plane. The washing tank 8 is bottomed, the upper surface is open, the four side surfaces 8a to 8d are joined to each other, and the four side surfaces 8a to 8d are connected to the side surfaces 8a to 8d. A bottom surface portion 8e formed of a plane having substantially the same shape as that of FIG.
[0012]
Here, the inner joints 8f, 8g, 8h, 8i of each of the four side surfaces 8a to 8d of the cleaning tank 8 have a cross-sectional shape of, for example, about 1 as shown in FIGS. It is formed in an arc shape including a / 4 circle. In addition, the inner joints 8j, 8k, 8m, and 8n of the four side surfaces 8a to 8d and the bottom surface 8e are formed into arcs having substantially the same cross-sectional shape as the four inner joints 8f to 8i. It is formed.
[0013]
Embodiment 2 of the present invention
Next, a cleaning tank structure according to a second embodiment of the present invention will be described.
FIG. 3B is a cross-sectional view of a cleaning tank according to a second embodiment of the present invention, in which a main part showing a joining portion of the other side is cut, and particularly a side of the cleaning tank 8. The structure of a portion 8a and a side portion 8b joined to the portion 8a are shown. In the second embodiment of the present invention, the inner joint portion C between the side surface portion 8a and the side surface portion 8b is formed by a single face body 8p. This one face body 8p has a planar shape and is formed integrally with the inner side face 8a1 of the side face part 8a and the inner side face 8b1 of the side face part 8b, and the joining angle θ1 formed by joining the respective faces is 135. °, which forms a so-called obtuse angle.
[0014]
Although the above description does not show other inner joint portions of the inner joint portion C between the side surface portions 8a and 8b, in the second embodiment of the present invention, the side surface portions 8b and 8c, 8c and the side 8d, the side 8d and the side 8a, the side 8a to 8d and the bottom 8e also have an inner joint C formed therein. Needless to say, the face body 8p is formed.
Then, one face body 8p formed at all the inner joint portions C of the combined cleaning tank 8 is formed at a total of eight places.
[0015]
Third Embodiment of the Invention
Next, a third embodiment of the structure of the cleaning tank according to the present invention will be described.
FIG. 3C is a cross-sectional view of a main part showing a joining portion of the other side part in the third embodiment of the cleaning tank structure according to the present invention, and in particular, the side surface of the cleaning tank 8. The structure of the part 8b and the side part 8b joined to this is shown.
In Embodiment 3 of the present invention, the inner joint portion D of the side surface portion 8a and the side surface portion 8b is formed of three planar bodies each having a planar shape, that is, a first planar body 8p1, a second planar body 8p2, and a third planar body 8p3. I have. The first to third face members 8p1 to 8p3 are integrally formed in a series, and the first face member 8p1 is provided on the inner surface 8a1 of the side surface portion 8a, and the third face member 8p3 is provided on the inner surface 8b1 of the side surface portion 8b. Are formed integrally. The joining angle θ2 formed by joining the inner side surface 8a1 of the side surface portion 8a and the first surface body 8p1 and the inner side surface 8b1 of the side surface portion 8b and the third surface body 8p3 is an obtuse angle. In addition, the joining angle θ3 formed by joining the first face body 8p1 and the second face body and the second face body 8p2 and the third face body 8p3 is an obtuse angle.
In addition, the present invention is not limited to the above three face bodies, and may be a face body in which a desired number are formed in series.
[0016]
The operation and the like of the first to third embodiments of the structure of the cleaning tank according to the present invention will be described.
After the semiconductor wafer 9 is subjected to the chemical treatment in the chemical treatment tank, the semiconductor wafer 9 is moved to a predetermined position of the cleaning liquid 10 stored by a carrier or the like. When cleaning the semiconductor wafer 9 in the cleaning tank 8 or when draining the cleaning liquid 10 from the drain pipe 13 at the time of replacing the cleaning liquid 10, the inside of each side part of the cleaning tank is connected to the inner joint part or each side part. As shown in FIGS. 3 (a), 3 (b) and 3 (c), the inner joints 8f, 8p, 8p1, 8p2 and 8p3 of the bottom face are respectively formed as arc-shaped, obtuse angle θ1 and obtuse angle θ2, θ3. Since the cleaning liquid 10 is formed, the cleaning liquid 10 smoothly flows in the direction of the arrow E without stagnating at the inner joint thereof, the particles p and the like do not stagnate, and when the cleaning liquid 10 is drained, the cleaning liquid 10 The water is quickly drained from the drain pipe 13 without staying in the inner joint.
[0017]
【The invention's effect】
Since the structure of the cleaning tank in the semiconductor cleaning apparatus according to the present invention has the above-described configuration and operation, the following effects can be obtained.
That is, a single or a plurality of face bodies in which all of the inner joints of a cleaning tank having a bottomed box shape having a rectangular side face and an open top face are formed in an arc shape or an obtuse angle with respect to the inner side face or the inner bottom face. Since the cleaning liquid does not stagnate, the particles can be prevented from staying in the inner bonding portion of the cleaning tank, the cleaning time of the semiconductor wafer can be reduced, and the inner bonding portion can be removed at the time of drainage for replacing the cleaning liquid. In addition, there is an effect that the stagnation of the cleaning liquid is prevented and the drainage process is completed in a short time.
In addition, exposure of the semiconductor wafer in the cleaning tank to air for a long time has an effect of preventing a natural oxide film and a water mark from being generated due to drying on the surface of the semiconductor wafer.
[Brief description of the drawings]
FIG. 1 is a vertical sectional view showing Embodiment 1 of a cleaning tank in a semiconductor cleaning apparatus according to the present invention.
FIG. 2 is a perspective view showing each inner joint portion of the cleaning tank according to the present invention shown in FIG.
3A and 3B are enlarged cross-sectional views of Embodiments 1 to 3 of an inner joint portion of a cleaning tank according to the present invention, wherein FIG. 3A is Embodiment 1, FIG. 3B is Embodiment 2, and FIG. Embodiment 3 is a third embodiment.
FIG. 4 is a vertical sectional view showing a shape of a cleaning tank of a semiconductor cleaning apparatus according to a conventional technique.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Cleaning tank 1a Side part 1c Side part 1e Bottom part 1j Inner joint part 1m Inner joint part 2 Cleaning liquid 2a Part of cleaning liquid 3 Semiconductor wafer 4 Drain port 5 Drain valve 6 Drain pipe 7 Outer tank 7a Outer tank drain pipe 7b Supply Pipe 8 Cleaning tanks 8a to 8d Side face 8e Bottom face 8f to 8i Inner joints 8j, 8k, 8m, 8n of side faces 8a1 Inner joint 8a1 of side face and bottom face Inner side face 8b1 of side face 8a Side face 8b Inner surface 8p One face 8p1 First face 8p2 Second face 8p3 Third face 9 Semiconductor wafer 10 Cleaning liquid 11 Outer tub 12 Outer tub drain 13 Drain 13a Drain valve 14 Pure water supply pipe C Inner joining according to the second embodiment Part D Inner joint part E according to Embodiment 3 Flow direction of cleaning liquid

Claims (3)

A bottomed substantially box-shaped cleaning tank having a rectangular side surface and an open top surface provided in a semiconductor cleaning apparatus, wherein an inner joint portion between the side surfaces of the cleaning tank and the respective side surfaces are provided. A structure of a cleaning tank in a semiconductor cleaning apparatus, wherein an inner joint portion between a bottom and a bottom portion is formed in a substantially arc shape. A bottomed substantially box-shaped cleaning tank having a rectangular side surface and an open top surface provided in a semiconductor cleaning apparatus, wherein an inner joint portion between the side surfaces of the cleaning tank and the respective side surfaces are provided. A cleaning tank structure in a semiconductor cleaning apparatus, wherein one face body connected to each of the side faces and the inner side face of the bottom face part is formed at an inner joint part of the bottom face part. A bottomed substantially box-shaped cleaning tank having a rectangular side surface and an open top surface provided in a semiconductor cleaning apparatus, wherein an inner joint portion between the side surfaces of the cleaning tank and the respective side surfaces are provided. A cleaning tank in a semiconductor cleaning apparatus, wherein a polyhedron connected to each of the side surfaces and the inner side surface of the bottom portion is formed at an inner joint portion between the first and second bottom portions.

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