JP2004288719A - Substrate carrying system and substrate processing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate carrying system capable of carrying substrates with high carrying efficiency without using a complex mechanism, and to provide a substrate processing system capable of processing the substrates with high throughput using it. <P>SOLUTION: When a substrate W is delivered to/from first and second load lock chambers 14 and 15 using first and second articulated arms 2A and 2B each comprising three arms, i.e. a rotating arm 51, 61, a middle stage arm and a substrate holding arm, and rotating about a common center of rotation, an extension/contraction driving section is driven to extend/contract the first and second substrate holding arms 2A and 2B while drawing curves symmetric laterally and separating forward. When a substrate W is delivered to/from first and second substrate carrying containers 11 and 12, a rotation driving section is driven furthermore in a part of extending/contracting operation so that the substrate holding arms perform a linear motion through a combination of the extending/contracting operation and the rotating operation. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate transfer device for transferring a substrate such as a semiconductor wafer (hereinafter, referred to as a wafer) and a substrate processing apparatus provided with the substrate transfer device.
[0002]
[Prior art]
Among semiconductor manufacturing apparatuses, there is a system called a cluster tool or a multi-chamber system in which a plurality of processing chambers (process chambers) are connected to a transfer chamber (transfer chamber) provided with a substrate transfer apparatus. This system can perform continuous processing without breaking vacuum, for example, when performing a plurality of vacuum processes on a substrate, and can keep the processing chamber away from the atmosphere to achieve higher throughput. There are advantages.
[0003]
FIG. 10 is a diagram showing a cluster tool described in Patent Document 1. Reference numerals 91 and 92 denote a cassette (carrier) chamber into which a cassette C, which is a wafer transfer container, is loaded from the atmosphere through a gate door GT; Is a first transfer chamber, 94 and 95 are preliminary vacuum chambers (load lock chambers), and 96 is a second transfer chamber. These are airtight and are separated from the atmosphere. Although the second transfer chamber 96 and the preliminary vacuum chambers 94 and 95 are set to a vacuum atmosphere, the cassette chambers 91 and 92 and the first transfer chamber 93 may be set to an inert gas atmosphere. G is a gate valve (gate valve). The first transfer chamber 93 is provided with a first transfer means 97, and the wafers W arranged in the cassettes in the cassette chambers 91 and 92 are taken out by the first transfer means 97 and are taken out by the first or the first transfer means. The second pre-vacuum chambers 94 and 95 are carried.
[0004]
On the other hand, a second transfer means 98 is provided in the second transfer chamber 96, and a plurality of wafers W in the preliminary vacuum chamber 94 (95) are stored in the second transfer chamber 96 by the second transfer means 98. In the illustrated example, three (3) vacuum processing chambers 90 are conveyed to a predetermined vacuum processing chamber 90 where vacuum processing such as etching or film formation is performed. The wafer W after the vacuum processing is carried out by the second carrying means 90 and carried to the first carrying means 97 via the first or second preliminary vacuum chamber 94 (95), for example, the cassette chambers 91 and 92. Is returned to the original cassette C. The first and second transfer means 97 and 98 are constituted by a multi-joint arm that combines three arms and is rotatable and extends and contracts on a straight line.
[0005]
In order to operate the cluster tool effectively, it is important to increase the transfer efficiency of the wafer. In this regard, for example, a transfer unit capable of transferring two wafers simultaneously in the first transfer chamber 93 is installed. It is desirable that the second transfer chamber 93 be formed in a polygonal shape, and a transfer means capable of transferring two wafers simultaneously in the second transfer chamber 96 be provided. Here, as a transfer device capable of simultaneously transferring two wafers radially, Patent Document 2 discloses a configuration in which two multi-joint arms, each of which has a distal end arm that can expand and contract linearly, can turn around a common turning center. A transport device is described.
[0006]
[Patent Document 1]
FIG. 1 of JP-A-6-314729.
[Patent Document 2]
FIG. 1 of JP-A-5-109866
[0007]
[Problems to be solved by the invention]
According to the transfer device having two articulated arms described in Patent Literature 2, the wafer can be transferred if the frontage of the cassette chamber faces the turning center of the transfer device as shown in FIG. However, if the frontage of the cassette chamber is not directed toward the center of rotation, the delivery cannot be performed. Considering that it is advantageous that the cassette is transported by an automatic transport robot in a factory and that the main body of the apparatus is arranged in a maintenance area in a clean room and a port for loading and unloading the cassette is provided in front of the apparatus, the cluster shown in FIG. It is advisable to design the tool so that two cassettes are arranged in front of the first transfer chamber 93 (the lower line in the figure).
[0008]
However, with such a layout, the two articulated arms described in Patent Literature 2 cannot cope with the layout, and therefore, it is necessary to add a mechanism such as sliding the articulated arm itself in the lateral direction, and the device becomes complicated.
[0009]
The present invention has been made under such a background, and an object of the present invention is to provide a substrate transfer apparatus that can transfer a substrate with high transfer efficiency while avoiding a complicated mechanism. A further object of the present invention is to enable the transfer of a substrate even if the substrate transport container is not oriented to the center of rotation of the substrate transport device. Another object of the present invention is to use the substrate transfer apparatus to transfer a substrate even when the first and second substrate transfer containers are arranged in a straight line on the left and right, and to perform a process with high throughput. It is an object of the present invention to provide a substrate processing apparatus capable of performing the above.
[0010]
[Means for Solving the Problems]
The substrate transport apparatus of the present invention includes at least three arms including a first swivelable arm and a first substrate holding arm for holding a substrate, and a first arm for driving the first swivel arm. A first articulated arm having a turning drive unit and a first telescopic drive unit for driving the arm to expand and contract;
At least three arms including a second swivel arm having a common swivel center with the first swivel arm and a second substrate holding arm for holding a substrate, and driving the second swivel arm And a second articulated arm having a second swiveling drive unit for driving the arm and a second telescopic drive unit for driving the arm to expand and contract.
The operation modes of the first and second articulated arms are:
By operating the first and second telescopic drive units, the movement trajectories of the first and second substrate holding arms are symmetrical to the left and right with respect to a horizontal straight line passing through the center of rotation and move away from the straight line as they advance. A mode in which a curve is drawn in the direction, and the first and second turning drive units are also driven to form a predetermined trajectory in a part of the expansion and contraction operation;
A mode in which the first and second turning drive units are driven to turn the first and second articulated arms.
[0011]
According to the substrate transfer apparatus of the present invention, since the driving of the turning drive unit and the drive of the expansion / contraction drive unit are performed simultaneously in a part of the operation mode, the degree of freedom in designing the transfer path is large. The actuation of the first and second telescopic drive units includes both simultaneous actuation and sequential actuation.
[0012]
The operation mode of the first and second articulated arms is such that the first and second telescopic drive units are operated so that the movement trajectories of the first and second substrate holding arms are horizontal straight lines passing through the center of rotation. In this case, a curve may be drawn in a direction symmetrical to the left and right and away from the straight line as the vehicle moves forward, and a mode in which the first and second turning drive units are not driven during the expansion / contraction operation may be further included. With this configuration, the first and second substrate holding arms move in a curved manner while opening left and right with respect to a horizontal straight line passing through the center of rotation, so that the frontage (transport opening) of each of the two chambers is reduced. Even if the substrate is not linear and faces the center of rotation, the substrate can be transferred to these chambers, and the substrate can be efficiently transported. Further, the movement trajectories of the first and second substrate holding arms obtained by driving the turning drive unit during the operation of the expansion / contraction drive unit are, for example, linear, so that the first and second substrate transfer containers are at the center of rotation. For example, even when the substrates are arranged in a horizontal line without being directed to the side, the substrates can be transferred.
[0013]
The first substrate holding arm and the second substrate holding arm are provided on the same plane, for example. Each of the first multi-joint arm and the second multi-joint arm includes three arms including a swivel arm, a substrate holding arm, and a middle arm shorter than the swivel arm and interposed between the two arms. It can be.
[0014]
Specifically, the first and second articulated arms are:
A base pulley that is rotatable about the center of rotation of the swing arm and that is rotatable independently of the swing arm;
A support pulley that is rotatably provided at the distal end of the swing arm, is connected to the base pulley by a timing belt, and rotates integrally with the middle arm;
An intermediate pulley provided coaxially with the support pulley on the middle arm and fixed to a swing arm;
A tip pulley that is rotatably provided at the tip end of the middle arm, is connected to the intermediate pulley by a timing belt, and rotates integrally with the substrate holding arm,
The configuration may be such that the tooth ratio of each pulley is adjusted so that the movement locus of the substrate holding arm draws a curve when the base pulley is rotated without driving the turning arm. In this case, for example, the ratio of the number of teeth between the proximal pulley and the supporting pulley is A (A is a value larger than 2): 1, and the ratio of the number of teeth between the intermediate pulley and the distal pulley is 1: 2.
[0015]
The substrate processing apparatus of the present invention includes the above-described substrate transfer apparatus, and a transfer chamber having an airtight structure communicating with the substrate processing chamber.
A first mounting area and a second mounting area in which a first substrate transport container and a second substrate transport container holding a plurality of substrates in a shelf shape are respectively arranged so as to be aligned in a straight line on the left and right; With
The first and second substrate holding arms respectively transfer the substrates to the first and second substrate transfer containers placed in the first and second mounting areas, respectively. When the substrate moves in the first substrate transport container or the second substrate transport container, the first and second substrate holding arms are driven by driving the first and second pivot arms. It is characterized by moving along a straight line.
[0016]
In the present invention, for example, a first substrate transfer container chamber including a first mounting area and a second substrate transfer container chamber including a second mounting area are connected around the transfer chamber. Alternatively, sealed first and second substrate transfer containers are placed in the first and second mounting regions, respectively, and the lids of these sealed substrate transfer containers are opened to transfer the inside of the substrate transfer container. It communicates with the room. The transfer chamber is, for example, a vacuum atmosphere or an inert gas atmosphere.
[0017]
When the transfer chamber is a first transfer chamber, the first transfer chamber is airtightly connected to the periphery of the first transfer chamber, and the first and second substrate holding arms carry out and out of the first and second substrate holding arms, respectively. And a second load lock chamber;
A second transfer chamber connected to the first and second load lock chambers and provided with transfer means for transferring the substrate;
A plurality of substrate processing chambers airtightly connected around the second transfer chamber,
When the first and second substrate holding arms load and unload a substrate with respect to the first and second load lock chambers, respectively, the first and second articulated arms operate in a telescopic mode. Can be. In this case, each transfer port of the first and second load lock chambers faces, for example, the turning center side.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
1 and 2 are views showing an embodiment of the substrate processing apparatus of the present invention. The substrate processing apparatus includes two airtight cassette chambers 11 and 12 into which a cassette (substrate transfer container) C that stores a plurality of wafers as substrates is loaded. These cassette chambers 11 and 12 are arranged side by side in a row, so that the cassettes C placed in them are aligned in a straight line to the left and right. The cassette chambers 11 and 12 correspond to a first substrate transfer container chamber forming a first mounting area and a second substrate transfer container chamber forming a second mounting area, respectively.
[0019]
Each of the cassette chambers 11 and 12 is provided with a gate door GD on the atmosphere side, and the gate door GD provides an airtight partition from the atmosphere. In the cassette chambers 11 and 12, as shown in FIG. 2, a cassette mounting table 11a is raised and lowered, and an elevating unit 11b for sequentially positioning wafer holding grooves in the cassette C at an access level of a first transfer device described later is provided. Is provided.
[0020]
A first transfer chamber 13 having an airtight structure is airtightly connected to the inside of the cassette chambers 11 and 12, and the first transfer chamber 13 is two load lock chambers (standby chambers) arranged side by side. A second transfer chamber 16, which is made into a vacuum atmosphere, is airtightly connected via first and second preliminary vacuum chambers 14, 15. In this example, the case of a so-called open type cassette is described. However, when a closed type cassette is used, the closed type cassette is attached to and detached from the side wall of the transfer chamber 13, and this point will be described later.
[0021]
In the first transfer chamber 13, there are positioning stages 17, 18 for rotating the wafer W to adjust the orientation thereof, cassettes 11, 12, preliminary vacuum chambers 14, 15, and positioning stages 17, 18. And a first substrate transfer device 2 for transferring the wafer W therebetween. The frontage (transport opening) of the first and second preliminary vacuum chambers 14 and 15 on the side of the first transfer chamber 13 faces the turning center 100 of the first substrate transfer device 2. Here, the meaning of facing the turning center 100 side means that the frontage of the first and second preliminary vacuum chambers 14 and 15 is not aligned in a straight line, but the layout viewed from the top is a mountain shape. In other words, the polygons are arranged along adjacent sides of the polygon. The cassette chambers 11 and 12 and the first transfer chamber 13 are, for example, in an inert gas atmosphere or a vacuum atmosphere.
[0022]
The second transfer chamber 16 is formed in a polygonal shape, for example, an octagonal shape, in which the second substrate transfer device 3 is provided. Vacuum chambers 4 (4A to 4F), which are substrate processing chambers, are air-tightly connected to six sides of the octagonal sides of the second transfer chamber 16, and auxiliary vacuum chambers are connected to the remaining two sides. 14 and 15 are connected. The second substrate transfer device 3 is configured to be able to simultaneously transfer, for example, two wafers W between the vacuum chamber 4 (4A to 4F) and the preliminary vacuum chambers 14 and 15. In FIG. 1, the vacuum chamber 4 is shown as a simple circle for convenience of illustration, but when an actually circular chamber is used, a member forming a transfer port connecting the chamber and the second transfer chamber 16 is interposed. I do.
[0023]
The vacuum chamber 4 may be, for example, a rectangular chamber. Examples of the vacuum processing performed in the vacuum chamber 4 include etching using an etching gas, film forming processing using a film forming gas, and ashing using an ashing gas. As shown in FIG. 2, a mounting table 41 for mounting a wafer W and a gas supply unit 42 for supplying a processing gas are provided in the vacuum chamber 4. Is located on a circle centered on the center of the second transfer chamber 16.
[0024]
Next, the first substrate transfer device 2 which is an embodiment of the substrate transfer device of the present invention will be described in detail. FIGS. 3 and 4 are views showing an overview and a transmission system of the first substrate transfer device 2, respectively. In this example, the substrate transfer device 2 includes a first multi-joint arm 2A forming a first transfer section and a second multi-joint arm 2B forming a second transfer section. 2A, a first turning arm 51 having a center portion of the first transfer chamber 13 as a turning center 100 (see FIG. 1), and a first turning arm 51 provided at a tip end thereof so as to be rotatable in a horizontal direction. A middle arm 52 configured to be shorter than the pivot arm 51, and a first substrate holding arm (for example, a fork-shaped arm) provided at the distal end of the middle arm 52 so as to be rotatable in the horizontal direction. ) 53.
[0025]
The second multi-joint arm 2B has a turning center common to the turning center 100 of the turning arm 51, a turning arm 61 constituting a second turning portion provided below the turning arm 51, and this turning arm 61B. An intermediate arm 62 provided on the arm 61 and shorter than the revolving arm 61, and a second substrate holding arm (tip arm) 63 provided on the intermediate arm 62 are provided. The structure of the second articulated arm 2B is substantially the same as the structure of the first articulated arm 2A, but the height of the substrate holding arm 63 is the same as the substrate holding arm 53 of the first articulated arm 2A. Therefore, the length of the rotation axis of the distal arm 63 is different, for example, in order that the distal arms 53 and 63 are configured to be conveyed on the same plane.
[0026]
At the reference position, the first articulated arm 2A and the second articulated arm 2B are placed at positions rotated backward from positions where the turning arms 51 and 61 are aligned with each other, and have a mountain shape. Waiting. At this time, the middle arms 52 and 62 are located at positions rotated backward from positions parallel to the swing arms 51 and 61, and the substrate holding arms 53 and 63 are slightly smaller than the positions parallel to the middle arms 52 and 62. The substrate holding arms 53 and 63 are positioned so as to rotate inward (toward the center of rotation) and do not interfere with each other.
[0027]
The transmission system of the first and second articulated arms 2A and 2B will be described with reference to FIG. 4. The turning arm 51 of the first articulated arm 2A has a cylindrical turning axis with the turning center 100 as the center of rotation. It is configured to turn by 70. On the base end side of the turning arm 51, a base pulley 72 that is rotatable independently of the turning arm 51 by a turning shaft 71 provided in a cylindrical turning shaft 70 around a turning center 100 as a rotation center. Is provided. A support pulley 73 that supports the middle arm 52 and rotates integrally with the middle arm 52 is rotatably provided at the distal end of the turning arm 51, and the support pulley 73 is in timing with the base pulley 72. They are connected by a belt 74.
[0028]
The middle arm 52 is fixed to the upper end of a hollow rotary shaft 75 provided above the support pulley 73. At the base end of the middle arm 52, an intermediate pulley 76 of the same diameter, for example, having the same number of teeth is provided coaxially with the support pulley 73, while a tip pulley 77 is rotatable at the tip of the middle arm 52. The tip pulley 77 is connected to the intermediate pulley 76 by a timing belt 78. The intermediate pulley 76 passes through the hollow rotary shaft 75 described above and is fixed to a shaft portion 76a fixed to the turning arm 51. The substrate holding arm 53 is fixed to the upper end of a rotating shaft 79 provided above the tip pulley 77.
[0029]
The ratio of the number of teeth between the base pulley 72 and the support pulley 73 is set to a value larger than 2, for example, 2.67: 1, and the ratio of the number of teeth between the intermediate pulley 76 and the distal pulley 77 is set to 1: 2. ing. Therefore, the substrate holding arm 53 takes a locus that draws a curve as described later.
[0030]
In the second articulated arm 2B, 80 is a cylindrical turning shaft, 81 is a cylindrical rotating shaft, 82 is a base pulley, 83 is a supporting pulley, 84 is a timing belt, 85 is a rotating shaft, 86 is an intermediate pulley. 86a, a shaft portion, 87, a tip pulley, 88, a timing belt, and 89, a rotating shaft. The point that the rotation shaft 81 of the proximal pulley 82 is provided so as to surround the turning shaft 70 of the first articulated arm 2A, and the rotation axis 89 of the substrate holding arm 63 is the substrate holding arm of the first articulated arm 2A The second articulated arm 2B is different from the first articulated arm 2A in that it is longer than the rotation shaft 79 of 53, but the configuration for determining the transfer function is exactly the same as that of the first articulated arm 2A. It is. Accordingly, the center of rotation of the turning shaft 80 and the rotating shaft 81 is the turning center 100, the ratio of the length of the middle arm 62 to the turning arm 61, the ratio of the number of teeth of the base pulley 82 and the number of teeth of the support pulley 83, and The ratio of the number of teeth between the intermediate pulley 86 and the tip pulley 87 is set similarly.
[0031]
In FIG. 4, reference numerals 54 and 55 denote a first turning drive unit for driving the turning shaft 70 and a first telescopic driving unit for driving the rotating shaft 71 in the first articulated arm 2A, respectively. The second articulated arm 2 </ b> B includes a second turning drive unit that drives the turning shaft 80 and a second telescopic driving unit that drives the rotating shaft 81. The driving units 54, 55, 64, and 65 correspond to a mechanism including a motor, a pulley, a belt, and the like, and are controlled by the control unit 200.
[0032]
A program corresponding to the operation mode of the first and second articulated arms 2A and 2B is stored in the control unit 200. In this operation mode, the first and second telescopic drive units 55 and 65 are driven. The first and second turning drive units 54 and 64 are driven in a telescopic mode in which the first and second articulated arms 2A and 2B are placed at reference positions shown by solid lines in FIG. In the revolving mode in which the revolving operation is performed, and when the first and second telescopic drive units 55 and 65 are driven to perform the telescopic operation, in this example, when the wafer W moves in the cassette C, the first and the second And the expansion / contraction / rotation mode for simultaneously driving the expansion / contraction driving units 55 and 65 and the first and second rotation driving units 54 and 64.
[0033]
FIG. 5 shows an example of a specific structure of the turning shafts 70 and 80, the rotating shafts 71 and 81 in the first and second articulated arms 2A and 3B, and parts related thereto. In FIG. 5, reference numerals 54a and 55a denote pulleys for rotating the turning shaft 70 and the rotating shaft 71, respectively, which are driven by a motor M1 and a motor M2 hidden behind the motor M1 and invisible. A pulley 64a rotates the turning shaft 80, and is driven by a motor M3 via a driving pulley 64c and a belt 64b. Reference numeral 65a denotes a pulley for rotating the rotating shaft 81, which is driven by a motor M4 via a driving pulley 65c and a belt 65b. The motors M1 to M4 are fixed to a base BE that forms a bottom surface of the transfer chamber 3.
[0034]
Here, returning to FIG. 1, the second substrate transfer device 3 arranged in the second transfer chamber 16 will be briefly described. The first arm 31A and the second articulated arm 3B are composed of the first arm 3A and the second arm 3B, and the tip arms 31A and 31B located at the uppermost stage can hold the wafer W on both sides. Further, the first articulated arm 3A and the second articulated arm 3B move in a curved direction in a direction away from each other when the tip arms 31A and 31B advance (retreat) from the reference position shown by the solid line, and move adjacent to each other. The wafers W can be transferred to the vacuum chambers 4 and 4 or the preliminary vacuum chambers 14 and 15 at the same time.
[0035]
Next, the operation of the above embodiment will be described. First, the above-described expansion / contraction mode among the operation modes in the substrate transfer device 2 will be described. In the first multi-joint arm 2A, the first turning drive unit 54 (see FIG. 4), which is the drive unit of the turning shaft 70, is stopped, and the first telescopic drive unit 55, which is the drive unit of the rotary shaft 71, is stopped. Is operated (driven) to rotate the base pulley 72, the rotation shaft 75 supporting the middle arm 52 tends to rotate. At this time, the rotating shaft 70 is not given a rotational force from the driving unit 54, but is in a free state (a rotatable state). Therefore, when the proximal pulley 72 rotates clockwise at the solid line position shown in FIG. Since the middle arm 52 is about to open with respect to the swing arm 51, the swing arm 51 rotates clockwise and also rotates counterclockwise as indicated by a chain line.
[0036]
Since the ratio of the number of teeth between the base pulley 72 and the support pulley 73 is 2.67: 1, when the turning arm 51 rotates by α degrees from the reference position, the middle arm 52 rotates by -2.67 α degrees. When the middle arm 52 rotates clockwise, the intermediate pulley 76 rotates counterclockwise relative to the middle arm 52, so that the substrate holding arm 53 rotates counterclockwise, and the intermediate pulley 76 and the tip pulley rotate. Since the ratio of the number of teeth to the number 77 is 1: 2, the substrate holding arm 53 rotates 1.335α degrees. Accordingly, as shown in FIG. 6, when the first articulated arm 2A is extended from the reference position and the substrate holding arm 53 is advanced, the substrate holding arm 53, more specifically, the center position of the wafer W held by the substrate holding arm 53 Traces a curve in a direction away from the horizontal straight line L0. The straight line L0 is a horizontal straight line passing through the center of rotation 100 connecting points equidistant from the first and second substrate holding arms 53 and 63 at the reference position. Also in the second articulated arm 2B, the second turning drive unit 64 (see FIG. 4) is stopped, and the second telescopic drive unit 65, which is the drive unit of the rotating shaft 81, is operated. The movement locus of the substrate holding arm 63 is symmetrical to the movement locus of the substrate holding arm 53 with respect to the straight line L0.
[0037]
Subsequently, the turning mode among the operation modes of the substrate transfer device 2 will be described. In this turning mode, the first turning drive unit 54 and the first telescopic drive unit 55 are simultaneously operated with the first articulated arm 2A at the reference position to move the base pulley 72 and the turning shaft 70 together. By rotating counterclockwise and simultaneously operating the second turning drive 64 and the second telescopic drive 65 with respect to the second articulated arm 2B in the reference position, the base pulley 82 and the turning shaft Rotate 80 counterclockwise. As a result, the first and second articulated arms 2A and 3B rotate about the turning center 100 in the counterclockwise direction while being at the reference position indicated by the solid line in FIG. Further, the expansion / contraction / rotation mode among the operation modes of the substrate transfer device 2 will be described. In this mode, the first and second turning driving units 54 and 64 are not driven with respect to the first and second articulated arms 3A and 3B at the reference position, as in the above-described telescopic mode. The first and second telescopic drive units 55 and 65 are driven, whereby the first and second substrate holding arms 53 and 63 advance in a curved line that opens rightward and leftward with respect to the straight line L0.
[0038]
When the first substrate holding arm 53 reaches a predetermined position, in this example, a position facing the cassette C, more specifically, as shown by a solid line in FIG. When the center W0 of the wafer W held by the substrate holding arm 53 is reached, the first turning drive unit 54 is driven so that the turning shaft 70 turns counterclockwise. As a result, as shown in FIG. 7, the first substrate holding arm 53 combines the operation of turning right while moving forward and the operation of rotating inward (toward the straight line L0) with the solid line in FIG. It moves linearly from the position to the chain line position. That is, the movement trajectory of the center W0 of the wafer W becomes a straight line.
[0039]
The second substrate holding arm 63 performs a symmetric operation in exactly the same manner. When the second substrate holding arm 63 reaches the position facing the cassette C, that is, when the center W0 of the wafer W held by the substrate holding arm 63 is located on an extension of the horizontal center line L1 of the cassette C. Then, the second turning drive unit 64 is driven so that the turning shaft 80 turns clockwise. As a result, the second substrate holding arm 63 moves linearly in combination with the operation of turning left while moving forward and the operation of rotating inward (toward the straight line L0).
[0040]
Since the first substrate transfer device 2 operates as described above, for example, the following transfer is performed in operating the substrate processing apparatus. Referring to FIG. 1, a wafer W before processing is held in a cassette C and carried into the cassette chamber 11 or 12 from the outside. After the gate door GD is closed to form an airtight space, for example, an inert gas atmosphere is set. You. Then, the gate valves G inside the cassette chambers 11 and 12 are opened, and the first and second articulated arms 2A and 2B in the first transfer chamber 13 which is in an inert gas atmosphere are moved in the same manner as described above. Perform the operation in the turning mode. In this mode, when the first and second substrate holding arms 53 and 63 open and move forward in a curved manner and reach a position facing the cassette C in the cassette chambers 11 and 12, the first and second substrate holding arms 53 and 63 linearly move and move inside the cassette C. , The cassette C is lowered by the elevating mechanism 11b shown in FIG. 2, and the wafer W is transferred to the first and second substrate holding arms 53 and 63.
[0041]
Next, the first and second substrate holding arms 53, 63 are retracted along the trajectory at the time of entry to the reference position shown by the solid line in FIG. Thereafter, the wafers W on the first and second substrate holding arms 53 and 63 are sequentially transferred to the positioning stages 17 and 18 in order to perform the positioning of the wafer W. That is, by driving the first and second turning drive units 54 and 64, the first and second turning arms 51 and 61 are simultaneously turned by a predetermined angle, and by driving the first telescopic drive unit 55, the first The wafer W is transferred to the positioning stage 17 by extending the substrate holding arm 53 of the first embodiment. After the alignment is performed, the first substrate holding arm 53 is retracted, and then the first and second pivot arms are moved. The wafers 51 and 61 are simultaneously turned by a predetermined angle, and the wafer W on the second substrate holding arm 63 is similarly positioned by the positioning stage 18. Subsequently, the first and second turning arms 51 and 61 are simultaneously turned in the turning mode, and the first and second articulated arms 2A and 2B assume the postures shown by solid lines in FIG. Thereafter, the first and second articulated arms 2A and 2B perform the operation in the telescopic mode, and the first substrate holding arms 53 and 63 move forward while drawing a curve while opening each other. And the wafer W is delivered.
[0042]
Then, after setting the preliminary vacuum chambers 14 and 15 to a predetermined vacuum atmosphere, the wafers W in the preliminary vacuum chambers 14 and 15 are separated by the second substrate transfer device 3 into predetermined vacuum chambers 4 adjacent to each other, for example, a vacuum chamber 4C. , And are simultaneously carried into 4D and subjected to a predetermined vacuum processing. On the other hand, the wafer W, for which the vacuum processing has already been completed, is carried out of the vacuum chamber 4 by the second substrate transfer device 3, and is carried into the preliminary vacuum chambers 14, 15, respectively. These wafers W are transferred to the first and second articulated arms 2A and 2B and returned to the original cassette C.
[0043]
According to the above-described embodiment, in the telescopic mode, the first and second substrate holding arms 53 and 63 advance in a curved manner so as to open each other, so that each frontage (transport opening) faces the turning center side. The wafer W can be transferred to the first and second preliminary vacuum chambers 14 and 15. Also, in the expansion / contraction mode, the first and second substrate holding arms 53 and 63 move forward while drawing a curve while opening each other, and can extend and retract on a straight line by combining extension / contraction operation and rotation operation from the middle. Even if the two cassettes C are arranged side by side on a straight line and the frontage is not directed to the center of rotation, the wafer W can be transferred.
[0044]
In addition, the length of the middle arms 52, 62 is made shorter than that of the revolving arms 51, 61, and the middle arms 52, 62 are rotated rearward so that the substrate holding arms 51, 61 are brought close to each other in the shape of a chevron. In this case, the turning radius is small, and therefore, the space of the transfer chamber 13 can be narrowed, and the wafer W can be transferred with high efficiency. C can be arranged side by side along a straight line.
[0045]
In the above-described embodiment, the cassette chambers 11 and 12 are connected to the first transfer chamber 13. However, when the transfer container is a sealed cassette, the first transfer chamber 13 is connected as shown in FIG. A partition wall 301 is provided on one side, and two retractable mounting tables that form a mounting area that cannot be seen in the drawing are provided outside the partition wall 301. On the mounting tables, a sealed cassette 302, A configuration is adopted in which the cassette 303 is placed and advanced, and the flange portions of the cassettes 302 and 303 are brought into close contact with the outer surface of the partition wall 301. Also in this case, the cassettes 302 and 303 are arranged side by side and on a straight line. Conveyance ports 306 and 307 opened and closed by doors 304 and 305, respectively, are formed in the partition wall 301 side by side. Is communicated with the transfer chamber 13, and then the wafer W in the cassettes 302 and 303 is transferred by the second transfer means 2. In this case, the second transporting means 2 is configured to be able to move up and down by a lifting unit (not shown).
[0046]
In the above-described embodiment, the turning axes 70 and 80 of the first articulated arm 2A and the second articulated arm 2B are configured to be driven independently of each other. May be driven by the turning drive unit. In this case, for example, the first multi-joint arm 2A is expanded and contracted to transfer the substrate, and then the second multi-joint arm 2B is expanded and contracted to transfer the substrate. Further, in the substrate transfer device of the present invention, the first telescopic drive unit 54 and the second telescopic drive unit 64 are shared, and the first multi-joint arm 2A and the second multi-joint arm 2B are driven by one axis. You may do so. The first and second articulated arms used in the present invention may use four or more arms instead of using three arms.
[0047]
In the present invention, for example, a substrate processing chamber for performing a vacuum process is connected to the first transfer chamber 13 in which the first and second articulated arms 2A and 2B are arranged without connecting a preliminary vacuum chamber (load lock chamber). It can also be applied to The substrate processing chamber is not limited to a single-wafer-type vacuum processing chamber. For example, a vertical batch furnace for performing a heat treatment in a batch system, and an inert gas atmosphere loading for loading a substrate into the batch furnace, for example. And a division space including an area.
[0048]
【The invention's effect】
According to the substrate transfer apparatus of the present invention, since the driving of the turning drive unit and the drive of the expansion / contraction drive unit are performed simultaneously in a part of the operation mode, the degree of freedom in designing the transfer path is large. Then, only the telescopic drive unit is driven to add a mode in which the first and second substrate holding arms move in a curved manner while opening left and right with respect to a horizontal straight line passing through the center of rotation. Even when the frontage (transport opening) of each of the two chambers faces the center of rotation, the substrate can be transferred to these chambers, and the substrate can be efficiently transported. Further, since the substrate holding arm is made to linearly move by driving the turning drive unit in addition to the telescopic drive unit, the first and second substrate transfer containers are arranged, for example, in a straight line to the left and right (in a horizontal line). Even in the case where the substrates are arranged, the transfer of the substrates can be performed. Further, according to the substrate processing apparatus of the present invention, by using the above-described substrate transfer device, the first and second substrate transfer containers can be arranged in a straight line on the left and right, and processing with high throughput can be performed. Can be.
[Brief description of the drawings]
FIG. 1 is an overall plan view showing an embodiment of a substrate processing apparatus according to the present invention.
FIG. 2 is a schematic vertical sectional view schematically showing the substrate processing apparatus.
FIG. 3 is a schematic view showing an embodiment of a substrate transfer device according to the present invention.
FIG. 4 is an explanatory diagram illustrating a transmission system of the substrate transfer device.
FIG. 5 is a cross-sectional view showing a specific configuration example of a part of the substrate transfer device.
FIG. 6 is an explanatory diagram illustrating an operation of the substrate transfer device.
FIG. 7 is an explanatory diagram illustrating an operation of the substrate transfer device.
FIG. 8 is an explanatory view showing a state of wafer transfer in the substrate processing apparatus.
FIG. 9 is a plan view showing a part of another embodiment of the substrate processing apparatus according to the present invention.
FIG. 10 is a plan view showing a conventional substrate processing apparatus.
[Explanation of symbols]
W semiconductor wafer
C Wafer cassette
11, 12 Cassette room
13 First transfer chamber
14, 15 Preparatory vacuum chamber
16 Second transfer chamber
2 First substrate transfer device
3 Second substrate transfer device
4 (4A-4F) vacuum chamber
2A first articulated arm
2B Second articulated arm
51, 61 swing arm
52, 62 Middle arm
53, 63 Substrate holding arm
54, 64 swing drive
55, 65 telescopic drive
70, 80 pivot axis
72, 82 Base pulley
73, 83 Support pulley
76, 86 Intermediate pulley
77, 87 Tip pulley
100 center of rotation
302, 303 Sealed cassette

Claims (12)

At least three arms including a pivotable first pivot arm and a first substrate holding arm for holding a substrate, a first pivot drive unit for driving the first pivot arm, and an arm. A first articulated arm having a first telescopic drive for telescopic drive;
At least three arms including a second swivel arm having a common swivel center with the first swivel arm and a second substrate holding arm for holding a substrate, and driving the second swivel arm Operating mode of the first and second articulated arms, comprising: a second articulated arm having a second turning drive unit for driving the arm and a second telescopic drive unit for extending and retracting the arm. Is
By operating the first and second telescopic drive units, the movement trajectories of the first and second substrate holding arms are symmetrical to the left and right with respect to a horizontal straight line passing through the center of rotation and move away from the straight line as they advance. A mode in which a curve is drawn in the direction, and the first and second turning drive units are also driven to form a predetermined trajectory in a part of the expansion and contraction operation;
A mode in which the first and second pivoting drive units are driven to pivot the first and second articulated arms. The operation mode of the first and second articulated arms is such that the first and second telescopic drive units are operated to move the movement trajectories of the first and second substrate holding arms into a horizontal straight line passing through the turning center. A mode in which a curve is drawn in a direction symmetrical to the left and right and away from the straight line as the vehicle advances, and the first and second turning drive units are not driven during the expansion / contraction operation is further included. 2. The substrate transfer device according to 1. The substrate transfer device according to claim 1, wherein a movement trajectory of the first and second substrate holding arms obtained by driving the turning drive unit when the extension drive unit operates is a straight line. 4. The substrate transfer device according to claim 1, wherein the first substrate holding arm and the second substrate holding arm are provided on the same plane. Each of the first multi-joint arm and the second multi-joint arm includes three arms including a turning arm, a substrate holding arm, and a middle arm that is interposed between the two arms and shorter than the turning arm. The substrate transfer device according to any one of claims 1 to 4, wherein: The first and second articulated arms are:
A base pulley that is rotatable about the center of rotation of the swing arm and that is rotatable independently of the swing arm;
A support pulley that is rotatably provided at the distal end of the swing arm, is connected to the base pulley by a timing belt, and rotates integrally with the middle arm;
An intermediate pulley provided coaxially with the support pulley on the middle arm and fixed to a swing arm;
A tip pulley that is rotatably provided at the tip end of the middle arm, is connected to the intermediate pulley by a timing belt, and rotates integrally with the substrate holding arm,
6. The substrate according to claim 5, wherein the ratio of the number of teeth of each pulley is adjusted such that the movement trajectory of the substrate holding arm draws a curve when the base pulley is rotated without driving the turning arm. Transport device. The ratio of the number of teeth between the base pulley and the support pulley is A (A is a value larger than 2): 1, and the ratio of the number of teeth between the intermediate pulley and the distal pulley is 1: 2. 7. The substrate transfer device according to 6. An airtight transfer chamber, comprising the substrate transfer apparatus according to claim 1 and communicating with the substrate processing chamber,
A first mounting area and a second mounting area in which a first substrate transport container and a second substrate transport container holding a plurality of substrates in a shelf shape are respectively arranged so as to be aligned in a straight line on the left and right; With
The first and second substrate holding arms respectively transfer the substrates to the first and second substrate transfer containers placed in the first and second mounting areas, respectively. When the substrate moves in the first substrate transport container, the first telescopic drive unit and the first turning drive unit are simultaneously driven, and when the substrate moves in the second substrate transport container, the second telescopic drive unit moves in the second substrate transport container. Wherein the first and second substrate holding arms move in a straight line, respectively. 9. A first substrate transfer container chamber including a first mounting area and a second substrate transfer container chamber including a second mounting area are connected around the transfer chamber. The substrate processing apparatus according to any one of the preceding claims. Sealed first and second substrate transfer containers are mounted on the first and second mounting areas, respectively. The lids of these sealed substrate transfer containers are opened to open the inside of the substrate transfer container and the transfer chamber. 9. The substrate processing apparatus according to claim 8, wherein the communication with the substrate is performed. Assuming that the transfer chamber is a first transfer chamber, the first transfer chamber is airtightly connected to the periphery of the first transfer chamber, and the first and second substrate holding arms carry out and carry out the substrates, respectively. A second load lock chamber;
A second transfer chamber connected to the first and second load lock chambers and provided with transfer means for transferring the substrate;
A plurality of substrate processing chambers airtightly connected around the second transfer chamber,
When the first and second substrate holding arms carry the substrate in and out of the first and second load lock chambers, respectively, the first and second rotation driving units are not driven and the first and second rotation driving units are not driven. The substrate processing apparatus according to claim 8, wherein the expansion / contraction drive section is driven. 12. The substrate processing apparatus according to claim 11, wherein each transfer port of the first and second load lock chambers faces the turning center side.

Images