JP2004260146A - Method and device of manufacturing circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To strip a flexible film without distorting it in stripping the flexible film from a reinforcing plate, and inhibit stress generated at the time of stripping. <P>SOLUTION: In a method for manufacturing a circuit board, a circuit pattern is formed on the surface opposite to the laminated surface of a flexible film that is laminated on a reinforcing plate via an organic layer that can be stripped, and then, the flexible film is stripped. The reinforcing plate and the flexible film are stripped while keeping the stripping angle in a range of 1° to 80°, or the reinforcing plate and flexible film are stripped by bringing at least a part of the flexible film along a curved support. A manufacturing device by this method is also obtained. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a method and an apparatus for manufacturing a circuit board using a flexible film having a highly accurate circuit pattern and excellent productivity.

  In the conventional peeling of a flexible film, the rigid substrate is generally a product, and the flexible film is generally a protective film. Therefore, the quality of the flexible film after peeling is not particularly noted, and the main focus is on the reliable peeling of the flexible film. In addition, there is also a use for peeling a flexible product from a rigid substrate in some cases, but a method that emphasizes the efficiency of the peeling operation and a method of bending the product to reduce the peeling force have been adopted. I have. Therefore, there has been no idea that the flexible film is peeled while maintaining the flatness and dimensional accuracy (for example, peeling without generating a strain of about several hundred μm).

  On the other hand, in recent years, it has been proposed to form a very fine circuit pattern by attaching a flexible film to a reinforcing plate and maintaining dimensional accuracy. Since the circuit pattern of the flexible film substrate is used after being peeled off from the reinforcing plate, it is desired that the dimensional change of the circuit pattern when peeled off from the reinforcing plate be suppressed to the order of microns. Therefore, there is a demand for peeling the flexible film without applying stress as much as possible.

As a method of peeling a flexible film from a rigid substrate, a method of fixing a rigid substrate and peeling the flexible film has been proposed. Specifically, an end of the flexible film is gripped (for example, see Patent Document 1), an adhesive tape is pressed against the surface of the flexible film (for example, see Patent Document 2), A method of peeling the flexible film by turning up the flexible film from the end while keeping the peel angle formed by the flexible film at an obtuse angle (for example, see Patent Literature 3) or a peeling roller A method of transferring a flexible film and then scraping the flexible film from a peeling roller with a scraper (for example, see Patent Document 4) has been proposed. However, in both cases, a flexible film as a protective film is peeled from a product, and the problem of peeling a flexible film on which a fine circuit pattern is formed without impairing dimensional accuracy and flatness has been solved. Did not.
JP-A-5-319675 (page 2) JP-A-7-315682 (page 3) JP-A-2002-104726 (page 5) JP-A-7-215577 (page 2)

  An object of the present invention is to solve the above-described problems of the conventional technology, to peel a flexible film without breaking or distorting it with low stress, and to further suppress a dimensional change of the flexible film at the time of peeling. It is an object of the present invention to provide a circuit board manufacturing method and a manufacturing apparatus capable of performing the above.

That is, the present invention (1) peels off the flexible film after forming a circuit pattern on the surface opposite to the bonding surface of the flexible film bonded to the reinforcing plate via the peelable organic material layer. A method for manufacturing a circuit board, comprising: separating a reinforcing plate and a flexible film while maintaining a peel angle in a range of 1 ° to 80 °.
(2) A method for manufacturing a circuit board in which a circuit pattern is formed on a surface opposite to a bonding surface of a flexible film bonded to a reinforcing plate via a peelable organic material layer, and then the flexible film is separated. A method for manufacturing a circuit board, wherein a reinforcing plate and a flexible film are peeled off at least a part of the flexible film along a curved support.
(3) The method for manufacturing a circuit board according to (2), wherein the radius of curvature of the curved support is in the range of 20 mm to 1000 mm.
(4) The method according to (1) or (2), wherein the electronic component is bonded to the circuit pattern.
(5) While rotating the curved support and moving it relative to the reinforcing plate, the flexible film is peeled off from the reinforcing plate along a part of the flexible film along the curved support. At this time, the rotational peripheral speed V1 of the support on the flexible film supporting surface is set to be higher than the relative movement speed V2 of the support relative to the reinforcing plate, and the tension applied to the flexible film when the flexible film is peeled off. The method for manufacturing a circuit board according to the above (2), wherein the control is performed.
(6) A circuit board manufacturing apparatus for peeling a flexible film from a flexible film substrate on which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via a peelable organic material layer. An apparatus for manufacturing a circuit board, comprising: holding means for holding a reinforcing plate; and curved separating means for separating at least a part of the flexible film from the reinforcing plate in contact with the curved support.
(7) The bending and separating means includes a rotation driving device for rotating the support, a relative movement driving device for relatively moving the support with respect to the reinforcing plate holding means, a rotation speed of the support, and a rotation speed of the support. The circuit board manufacturing apparatus according to the above (6), further comprising a speed control device for independently controlling a relative movement speed with respect to the reinforcing plate holding means.
(8) The above (7) including a speed ratio control device for controlling the rotation peripheral speed V1 to be higher than the relative movement speed V2, and a tension control device for controlling the tension applied to the flexible film at the time of peeling. 3. The apparatus for manufacturing a circuit board according to 1.).
(9) The circuit board manufacturing apparatus according to (6), wherein a concave portion corresponding to the position of the electronic component is provided on the support and / or a cushion layer is provided.
(10) The apparatus for manufacturing a circuit board according to (6), wherein a layer having tackiness is provided on the support.

  According to the present invention, while holding the reinforcing plate, a part of the flexible film is separated from the reinforcing film along the curved support, so that the flexible film has a low stress. , And the dimensional change of the flexible film at the time of peeling could be reduced.

  Further, the speed of each part of the peeling unit and the tension acting on the flexible film are controlled so that the peeling angle is optimized, so that the peeling of the flexible film from the reinforcing plate can be performed by changing the dimensional change of the flexible film or the like. It can be performed stably without damaging the circuit pattern.

  Further, according to the method of manufacturing a circuit board according to the present invention, since the circuit board is manufactured using the above-described excellent peeling method, a high-quality circuit board can be manufactured.

  The present invention is a method of peeling a part of a flexible film along a curved support when peeling a reinforcing plate and a flexible film serving as a circuit board.

  Preferred examples of the method and apparatus for peeling a flexible film of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic front view of a peeling device 1 of the present invention, FIG. 2 is a schematic front view showing another embodiment using the peeling device 1, and FIG. It is a schematic front view showing an embodiment. FIG. 9 is a schematic front view of a peeling unit 90 which is another embodiment of the peeling unit 10 used in the peeling apparatus 1.

  Further, FIG. 12 shows that in the peeling device of the present invention, the rotational peripheral speed of the flexible film supporting surface of the support 12, the relative moving speed of the support 12 with respect to the reinforcing plate 2, and the tension applied to the flexible film are monitored to set the upper limit. FIG. 12 is a schematic front view of the peeling device 200 for explaining a specific example of the setting unit, and FIG.

  First, the peeling device 1 shown in FIG. 1 will be described. The peeling device 1 shown in FIG. 1 mainly has the following configuration. The flexible film substrate 6 adhered to the reinforcing plate 2 as a glass substrate via the organic layer 3 from which the flexible film 4 can be peeled off, the mounting table A30 holding the reinforcing plate 2, and the flexible film 4 are reinforced. It comprises a peeling unit 10 for actually peeling off the plate 2 and a mounting table B32 on which the peeled flexible film 4 is mounted.

  The mounting table A30 and the mounting table B32 are respectively attached to the base 34 so as to be able to move up and down freely, and can be moved up and down independently and freely by a driving source (not shown). Further, suction holes are arranged on the upper surfaces of the mounting tables A30 and B32, respectively, and the objects mounted on the surfaces can be independently suction-held by a vacuum source (not shown).

  Next, the peeling unit 10 includes a support 12 having a holding portion 14 at the distal end in contact with the flexible film 4, a frame 18 for holding the support 12 cantilevered via a shaft 16, and a frame 18. It is composed of a rail 20 that guides freely on the base 34 in the horizontal direction. The holding portion 14 may be omitted, and the flexible film may be peeled directly along the support 12. However, the holding portion 14 having a cushioning property or the holding portion 14 having a recess for accommodating the height of the electronic component may be used. By adopting it, damage due to peeling can be more easily suppressed. The shaft 16 is driven by a rotary drive (not shown). The rotation speed of the rotary driving device can be freely set, and a slip ring is inserted between the shaft 16 and the rotary driving device when the torque greater than the set value is applied. The upper limit of the applied tension can be controlled. A suction hole is arranged on the surface of the holding unit 14. Then, a contact portion of the flexible film 4 can be sucked by a vacuum source (not shown). The suction hole provided in the holding section 14 is configured such that the contact portion between the holding section 14 and the flexible film 4 is sequentially sucked. The holding portion 14 has a curved surface in contact with the flexible film 4 so that the flexible film 4 can be held in a curved state. In addition, by sending a gas into a suction hole arranged on the surface of the holding unit 14 by a blowing source (not shown), the flexible film 4 held by the holding unit 14 can be peeled from the holding unit 14.

  The material of the holding portion 14 is not particularly limited, but is preferably an elastic body such as plastic or rubber or foamed plastic and has cushioning properties. This has the effects of preventing the flexible film from being damaged, forming a concave portion corresponding to the electronic component as will be described later, and preventing the flexible film from being easily broken by the edge of the concave portion. As for the material of the holding portion 14 having a tackiness such as silicone resin, the elongation of the flexible film accumulates as the peeling progresses, and the amount of displacement between the holding portion 14 and the flexible film 4 is increased. Can be prevented from increasing, so that an increase in the peel angle with the progress of peeling can be suppressed, which is preferable. As a measure of tackiness, when peeling the flexible film 4 from the holding portion 14, the peel strength in the 180 ° direction is preferably 9.8 N / m or less.

It is preferable that the support 12 or the holding portion 14 in contact with the flexible film is antistatic or conductive in order to suppress the charging potential of the flexible film due to peeling charging. When the charging potential is increased, there is a possibility that a discharge occurs to damage a circuit pattern or an electronic component. Since the antistatic or conductive member is in contact with the surface opposite to the peeling surface of the flexible film, the potential can be lowered even if the charge generated on the peeling surface is the same, so that the discharge Can be prevented. As the antistatic material, a plastic, rubber, foamed plastic, or the like containing a conductive material and having a surface resistance of 10 ¹² Ω or less can be used.

  The holding portion 14 is given a radius of curvature in consideration of the amount of deformation and releasability allowed for the flexible film 4 on which the circuit pattern is formed, but may have a partially different radius of curvature. If the radius of curvature is too small, the circuit pattern made of metal undergoes plastic deformation, causing curl or an insufficient effect of reducing the stress at the end of the electronic component. On the other hand, if the radius of curvature is too large, the force in the direction in which the flexible film is stretched becomes too large compared to the force used for peeling the flexible film, and the circuit pattern of the metal film and the plastic deformation of the flexible film are reduced. Cause. Therefore, the lower limit of the magnitude of the radius of curvature of at least a part of the holding portion 14 that comes into contact with the flexible film 4 is preferably 20 mm or more, more preferably 30 mm or more, and even more preferably 50 mm or more. Further, the upper limit value of the magnitude of the radius of curvature of at least a part of the holding portion 14 in contact with the flexible film 4 is preferably 1000 mm or less, more preferably 800 mm or less, and still more preferably 700 mm or less. In the present invention, the radius of curvature is defined as the radius of a circle having the same curvature as the portion having the curvature.

  Further, the rotation of the support 12 and the horizontal movement of the frame 18 are independently performed by a drive motor (not shown), and the contact portion between the holding portion 14 and the flexible film 4 is moved in the horizontal direction (horizontal in the drawing). (In the direction of the arrow). The rotational peripheral speed V1 of the support 12 on the flexible film holding surface, that is, the surface of the holding portion 14 is set higher than the relative movement speed V2 of the support relative to the reinforcing plate, and V1 is applied to the support by the torque limiting mechanism. Control is performed within a range that does not fall below V2 so that the torque does not exceed a predetermined value. The control of V1, V2 and torque can be performed by mechanical, electronic or a combination of both. As the mechanical torque control method, a method called a slip ring or the like can be adopted, which is preferable in terms of simplicity. The electronic torque control method can be realized by a combination of a torque sensor and a servomotor as described later, and is preferable in that control accuracy and control flexibility are high. As for the initial setting values of V1 and V2, it is preferable that V1 / V2 is 1.01 or more. The set value of the torque limit is set to a range that is sufficient to prevent the peel angle from increasing with the progress of peeling, and that the circuit pattern or flexible film made of metal does not undergo plastic deformation. Should be selected as appropriate according to the material, width and thickness of the flexible film.

  In one embodiment of the present invention, it is important that the range of the peeling angle 40 between the flexible film 4 and the reinforcing plate 2 during peeling shown in FIG. If the peeling angle is too large, the flexible film may be broken at the peeling point. If a metal circuit pattern is formed on the flexible film, the circuit pattern may be broken or deformed. There is. On the other hand, if the peel angle is too small, the force in the direction in which the flexible film is stretched becomes too large compared to the force used for peeling the flexible film, causing a circuit pattern made of a metal film or plastic deformation of the flexible film. become. Therefore, the range of the peel angle 40 for peeling the flexible film from the flexible film substrate 6 with low stress without distortion is more preferably 2 ° or more and 70 ° or less, and most preferably 5 ° or more and 60 ° or less. It is.

  In the present invention, the peeling force is measured by a 180 ° peel strength when a 1-cm-wide flexible film bonded to a reinforcing plate via a peelable organic material layer is peeled off. The peeling speed when measuring the peeling force is 300 mm / min. In the present invention, in order to control the above-mentioned peel angle within an optimum range, the peel force is preferably in the range of 0.098 N / m to 98 N / m.

  Since the mounting table A30 can be moved up and down, when the flexible film 4 and the reinforcing plate 2 are peeled off, the mounting table A30 is moved up and down to a position where the flexible film 4 and the holding unit 14 come into contact with a certain pressure, and stopped. . On the other hand, the mounting table B32 is provided for mounting the flexible film 4 adsorbed on the holding unit 14 of the peeling unit 10 on the mounting table B32. That is, after the peeling is completed, the peeling unit 10 moves to the mounting table B32 as shown by the broken line in FIG. The mounting table B32 is moved up and down to set the distance between the holding section 14 and the mounting table B32 to preferably 0.1 to 3 mm, more preferably 0.1 to 1 mm, to release the suction, and to release the flexible film 4. It is released from the holding unit 14 and is mounted on the mounting table B32.

  Next, a method of peeling the flexible film 4 using the peeling device 1 shown in FIG. 1 will be described. After the mounting table A30 is lowered to the lowest point, the flexible film substrate 6 is placed on the mounting table A30 with the reinforcing plate 2 on the lower side (that is, the flexible film 4 on the upper side) by transfer means (not shown). Place. Subsequently, the flexible film substrate 6 is suction-held on the mounting table A30 by operating a vacuum source (not shown). Next, the movement of the frame 18 and the rotation of the support 12 are performed such that the starting point S of the holding portion 14 of the peeling unit 10 is positioned right above the right end of the flexible film 4 in the drawing. When the positioning of the holding unit 14 is completed, the mounting table A30 is raised, and the right end of the flexible film 4 and the starting point S of the holding unit 14 are brought into contact with each other with a predetermined pressure. The pressure is preferably from 0.001 to 1 MPa, more preferably from 0.01 to 0.2 MPa.

  Next, in this state, a vacuum source (not shown) is operated, and the holding unit 14 is adsorbed to the flexible film 4. Thereafter, the movement of the frame 18 to the left and the rotation of the support 12 to the left are advanced. The curved surface of the holding portion 14 is sequentially brought into contact with the upper surface of the flexible film 4 from the right side (shown). As a result, the flexible film 4 is sequentially curved from the right side, and thus moves away from the reinforcing plate 2, and as a result, both are peeled off sequentially from the right side. When the final point E of the holding portion 14 comes to contact with the left end of the flexible film 4 and passes through it, the peeling is completed. When the peeling is completed, the movement of the frame 18 and the rotation of the support 12 are stopped, the mounting table A30 is lowered, and the flexible film 4 and the reinforcing plate 2 are completely separated. These mechanisms correspond to the separating means in the present invention. In addition, other mechanisms may be used as long as the peel angle can be controlled to 80 ° or less.

  Then, the support 12 is rotated clockwise until the center of the flexible film 4 adsorbed by the holding unit 14 is directly below. Then, the frame 18 is moved rightward to position the flexible film 4 held by the holding portion 14 so as to be directly above the mounting table B32. Subsequently, the mounting table B32 is raised so that the clearance between the upper surface of the mounting table B32 and the center of the flexible film 4 is 0.1 to 1 mm. When the clearance is set, the suction of the holding unit 14 is released, and the flexible film 4 is transferred to the mounting table B32. Next, the separated flexible film 4 and the reinforcing plate 2 on the mounting table A30 are transferred to the next step by a transfer device (not shown). The reinforcing plate 2 is transferred after releasing the suction. Subsequently, the peeling unit 10 is returned to the original position, and the same operation is repeated thereafter to peel the next flexible film substrate 6.

  The peeling device shown in FIG. 2A has a structure in which a holding member 22 for holding the end of the flexible film 4 in a hook shape is fixed to one end of the support 12 of the peeling device 1 of FIG. The material of the holding member 22 is not particularly limited, and for example, metal, resin, ceramics, or the like can be used. However, the main body is made of metal, and the contact portion with the flexible film 4 is made of a soft material such as rubber or resin. Preferably, a composite structure or the like which does not slip easily is used.

  The peeling method using the peeling device shown in FIG. 2A is as follows.

  The mounting table A30 is lowered to the lowest point, and then the frame 18 is moved to the right so that the holding unit 14 does not come directly above the mounting table A30. In this state, the flexible film substrate 6 is mounted on the mounting table A30 with the reinforcing plate 2 on the lower side (the flexible film 4 on the upper side) by a transfer unit (not shown). Subsequently, the flexible film substrate 6 is suction-held on the mounting table A30 by operating a vacuum source (not shown).

  Next, the mounting table A30 is raised so that the hook-shaped portion of the holding member 22 is positioned to fit into the right end of the flexible film 4. Then, the frame 18 is moved to the left, and the right end of the flexible film 4 is fitted into the hook-shaped portion of the holding member 22 as shown in FIG. The right end of the film 4 can be held. At this time, the clearance in the thickness direction between the hook-shaped portion of the holding member 22 and the right end of the flexible film 4 is preferably 0.1 to 5 mm, more preferably 0.5 to 1.5 mm.

  In order to hold the end of the flexible film 4 with the holding member 22, the end of the flexible film 4 may protrude from the reinforcing plate 2. Further, as shown in FIG. 2B, the flexible film substrate 6 in which the lead film 23 is bonded to the end of the flexible film 4 by another method is placed on the mounting table A30. May be held by the holding member 22.

  Then, in this state, the leftward movement of the frame 18 and the leftward rotation of the support 12 are performed in synchronization with each other, so that the curved surface of the holding portion 14 is sequentially brought into contact with the upper surface of the flexible film 4 from the right side (shown). As a result, the right end of the flexible film 4 is sequentially lifted upward while being curved, and is separated from the reinforcing plate 2 held by suction, so that the two are sequentially peeled from the right side. When the final point E of the holding portion 14 comes to contact with the left end of the flexible film 4 and passes through it, the peeling is completed. When the peeling is completed, the movement of the frame 18 and the rotation of the support 12 are stopped, the mounting table A30 is lowered, and the flexible film 4 and the reinforcing plate 2 are completely separated.

  After that, the frame 18 is moved rightward to position the end of the flexible film on the side not held by the holding member 22 with the end of the mounting table B32. In this state, the rightward movement of the frame 18 and the rightward rotation of the support 12 are performed in synchronization with each other to transfer the flexible film 4 to the mounting table B32.

  Subsequently, the holding of the holding member 22 is released, and the frame 18 is further moved to the right so that the right end of the flexible film 4 is released from the hook-shaped portion of the holding member 22, and the flexible film 4 is placed. It is completely transferred to the table B32. When the transfer is completed, the mounting table B32 is lowered to the lowest point. Then, the separated flexible film 4 and reinforcing plate 2 are transferred to the next step by a transfer device (not shown). Subsequently, the peeling unit 10 is returned to the original position, and the same operation is repeated thereafter to peel the next flexible film substrate 6.

  When the electronic component 5 such as an IC chip is mounted on the flexible film 4, a concave portion 36 corresponding to the electronic component 5 is formed in the holding portion 14 of the support 12 as shown in FIG. Preferably, it is provided. The size change of the concave portion 36 may be performed by providing an adapter. An example of the size of the concave portion corresponding to the IC chip is a depth of 0.5 to 2 mm and a length and width of 1 to 20 mm as shown in FIG. Further, the shape of the concave portion may be a groove shape for accommodating a plurality of IC chips, and the direction of the groove may be parallel to the curvature direction of the holding portion 14 as shown in FIG. May be perpendicular to the direction of curvature of the holder 14 as shown in FIG. Further, a suction hole may be provided on the bottom surface 74 of the concave portion 36, and the bottom surface 74 may be in contact with the electronic component so that the electronic component 5 can also be fixed to the holding portion 14 by suction. Further, it is also possible to manufacture the holding portion 14 from a flexible material having micropores capable of vacuum suction, and embed and fix the electronic component 5 in the material.

  According to the present invention, when a circuit pattern made of metal is provided on the flexible film 4, the circuit pattern is deformed by the force at the time of peeling, and the flexible film 4 may be warped, When the precision is prevented from deteriorating, and when electronic components such as IC chips are mounted on a circuit board made of a flexible film, the force for peeling off the electronic component mounting portion increases and the electronic component ends When the present invention is practiced, reliability with respect to deformation, warpage, dimensional accuracy, and the like can be achieved. Further, even when an electronic component such as an IC chip is sealed with a resin, the stress applied to the end of the electronic component at the time of peeling is reduced, which is preferable because the reliability of the circuit board is improved.

  The method of holding the flexible film substrate 6 by the mounting table A30 is not particularly limited, and may be electrostatic suction in addition to the vacuum suction described in the above embodiment. In order to be able to perform electrostatic adsorption, it is desirable that the mounting table A30 has a structure that is conductive and can apply a ground potential or an arbitrary voltage according to a method of applying static electricity. Further, it is preferable that a heating device is provided inside or on the mounting table A30 in order to reduce the peeling force of the peelable organic material layer 3. For the same purpose, a heating device is preferably provided on the support 12 or the holding portion 14. In order to sufficiently reduce the peeling force, the heating temperature is preferably high. However, if the heating temperature is too high, the organic material layer is deteriorated, and it is difficult to remove the organic material layer remaining on the flexible film 4 after peeling. Therefore, the heating temperature of the peelable organic material layer 3 is preferably 30 ° C. or more and 280 ° C. or less.

  Next, a peeling apparatus 200 according to an embodiment of the present invention will be described with reference to FIGS. In the peeling device 200, the peeling unit 10 of the peeling device 1 is replaced with a slip ring instead of the rotation peripheral speed of the flexible film supporting surface of the support 12, the relative moving speed of the support 12 with respect to the reinforcing plate 2, and the flexibility. An electrical control means for monitoring the tension applied to the film and setting the upper limit is added to the peeling unit 220. More specifically, the peeling device 200 gives the linear scale 202 that measures the relative moving speed V2 of the frame 18 to the mounting table A30 (fixed), the encoder 204 that measures the rotational angular velocity of the support 12, and the support 12. An electromagnetic clutch 206 for controlling torque is added to the peeling device 1. Assuming that the length from the center of the shaft 16 until the holding portion 14 contacts the flexible film 4 of the flexible film substrate 6 on the holding surface is R, this R is multiplied by the rotational angular velocity observed by the encoder 204. By the adjustment, the rotational peripheral speed V1 on the holding surface of the holding unit 14 is calculated. The holding surface of the holding portion 14 is synonymous with the flexible film supporting surface of the support 12. Further, the peeling device 200 is provided with the rotation peripheral speed V1 at the holding surface of the holding unit 14 derived from the measurement by the encoder 204 and the speed information of the relative moving speed V2 of the frame 18 measured by the linear scale 202, A control device 212 capable of controlling the speed of a rotation motor 210 for driving the support 12 via the electromagnetic clutch 206 and the shaft 16 and a linear motor 208 for driving the frame 18 is also added to the peeling device 1. ing. Here, the control device 212 also has a function of controlling the drive torque of the support 12 by changing the supply voltage to the electromagnetic clutch 206. The rotation motor 210 and the electromagnetic clutch 206 are attached to the frame 18 via a support bracket 214.

  Further, when the frame 18 moves at the relative moving speed V2, the support 12 attached thereto also moves at the relative moving speed V2.

Now, in the peeling apparatus 200, when the flexible film 4 of the flexible film substrate 6 is peeled from the reinforcing plate 2, the peel angle 40 shown in FIG. 7 can be controlled.
That is, when the rotational peripheral speed V1 on the holding surface of the holding portion 14 is smaller than the relative moving speed V2 of the frame 18, the flexible film 4 sags and the position of the peeling point P in FIG. Very unstable. At this time, as the magnitude of V1 / V2 decreases, the peeling point P moves to the right, so that the magnitude of the peeling angle 40 increases while exhibiting unstable behavior. On the other hand, when the rotation peripheral speed V1 on the holding surface of the holding portion 14 is higher than the relative moving speed V2 of the frame 18, tension is applied to the flexible film 4 from the support 12. In the state of V1 / V2> 1, as the magnitude of V1 / V2 increases, the tension acting on the flexible film 4 increases, and the peeling point P moves to the left in FIG. It gets smaller gradually. Further, since there is no slack in the flexible film 4, the position of the peeling point P is also stabilized, and as a result, peeling is stabilized. Therefore, by adjusting the magnitude of V1 / V2 under the condition of V1 / V2> 1 at which the separation is stabilized, the separation angle 40 can be set to a desired value.

  However, if V1 / V2 is too large, the tension applied to the flexible film 4 is too large, and the flexible film 4 is greatly deformed, and the precise circuit pattern formed on the flexible film 4 The dimensions and shape may change, or the circuit pattern may be damaged, resulting in a defect.

  In order to eliminate such inconveniences, it is preferable to limit the tension acting on the flexible film 4 at the time of peeling to a value at which no problem occurs. In the peeling device 200, the supply voltage to the electromagnetic clutch 206 is adjusted, and the torque can be controlled so that the torque applied to the support 12 becomes a predetermined value or less. Since the flexible film 4 is held by the holding portion 14 of the support 12, the torque applied to the support 12 is converted into tension acting on the flexible film. Therefore, if the torque applied to the support 12 is limited, the tension acting on the flexible film 4 can be limited. However, in this case, when the torque has reached the limit value, the rotation of the shaft 16 of the support 12 slides with respect to the rotation of the rotary motor 210, and the rotary motor 210 Even if the operation is performed so that V1 becomes a predetermined value, the actual rotational peripheral speed V1 on the holding surface of the holding portion 14 becomes smaller than when the electromagnetic clutch 206 does not slip. The actual magnitude of the rotational peripheral speed V1 on the holding surface of the holding portion 14 is determined depending on the torque limit value. Also at this time, it is desirable to select a torque limit value so that V1 / V2> 1 and further, a peel angle 40 in a desired range can be obtained.

  As described above, the peeling device 200 adjusts the rotational peripheral speed V1 and the relative moving speed V2 on the holding surface of the holding portion 14 to stabilize the peeling as V1 / V2> 1, while adjusting the torque applied to the support 12. Since the tension acting on the flexible film 4 can be limited, the peeling can be performed stably without deforming the flexible film 4 and without damaging the circuit pattern on the flexible film 4. it can.

  In the peeling device 200, V1 / V2> 1 and the control to limit the acting tension on the flexible film is performed by the control device 212 by the torque control using the electromagnetic clutch 206, and the holding unit It can also be performed by speed control of the rotational peripheral speed V1 on the holding surface 14 and the relative moving speed V2 of the frame 18. The speed control referred to here means that the supply voltage to the electromagnetic clutch 206 is first increased to increase the limiting torque so that the rotation of the support 12 does not slip with respect to the rotation of the rotary motor 210, and V1 / V2 Is controlled so that the rotation speed of the rotation motor 210 and the relative movement speed V2 of the frame 18 by the linear motor 208 are set so that the rotation speed of the frame 18 becomes an appropriate value larger than 1. Since the acting tension on the flexible film 4 increases as V1 / V2 increases, V1 / V2 is determined so that the tension is limited.

  Any of the above speed control and torque control may be used, but in the case of torque control, the elongation of the flexible film 4 accumulates and the slack occurs due to the progress of the peeling for a long time, and the peeling angle 40 increases. And the flexible film on which the circuit pattern is formed can always be peeled off with low stress.

  The torque control using the electromagnetic clutch 206 may be performed by another mechanical torque control method such as a slip ring, or may be performed by an electronic torque control method realized by a combination of a torque sensor and a servomotor. In addition, a combination of both a mechanical type and an electronic torque control type is also possible. It is preferable that the ratio V1 / V2 of the rotation peripheral speed V1 on the holding surface of the holding unit 14 to the relative movement speed V2 of the frame 18 be 1.01 or more. The limiting value of the torque applied to the support 12 and the tension acting on the flexible film 4 is sufficient to prevent the peel angle from increasing with the progress of the peeling, and furthermore, the circuit pattern made of metal or the like. It is necessary to set the flexible film within a range that does not cause plastic deformation, and it is appropriately selected depending on the material, width, and thickness of the flexible film. The tension applied to the flexible film 4 is preferably 300 N / m or less, more preferably 200 N / m or less.

  The method of peeling the flexible film 4 using the peeling device 200 is as follows: 1) Select an appropriate value that satisfies V1 / V2> 1 so that the peel angle 40 becomes a desired value by the control device 212. 2) Rotate. Speed control of the motor 210 so as to be the rotational peripheral speed V1 on the predetermined holding portion 14 holding surface; 3) driving of the linear motor 208 to speed control such that the relative moving speed V2 of the frame 18 becomes a predetermined value; 4) The supply voltage to the electromagnetic clutch 206 is adjusted to limit the torque applied to the support 12 to limit the tension on the flexible film 4 at the time of peeling. It is exactly the same as the method of peeling the film 4.

  In the peeling apparatus 1, the peeling unit 10 can be replaced with a peeling unit 80 shown in FIG. 8 or a peeling unit 90 shown in FIG. The peeling unit 80 includes a mounting table A30 that holds the reinforcing plate 2 of the flexible film substrate 6 bonded to the reinforcing plate 2 that is a glass substrate via the organic layer 3 capable of peeling the flexible film 4; A peeling member 81 that holds the flexible film 4 and pulls the flexible film 4 from the peelable organic material layer 3 by pulling in the direction of the extension of the peel angle 40 indicated by the arrow.

  The peeling member 81 holds the end of the flexible film 4 by a driving source (not shown), and can pull the flexible film 4 while keeping the peel angle 40 in the range of 1 ° to 80 °. In order to control the corner 40 more stably, it is preferable to use a peeling unit 90 described below.

  A peeling unit 90 shown in FIG. 9 includes a mounting table 92 for holding the reinforcing plate 2 of the flexible film substrate 6 bonded to the reinforcing plate 2 which is a glass substrate via the organic layer 3 capable of peeling the flexible film 4. A peeling member 91 that peels the flexible film 4 from the peelable organic material layer 3 by holding the end of the flexible film 4 and pulling the flexible film 4 in the direction of the extension of the peel angle 40 indicated by the arrow; In order to support the flexible film 4 at the time of the above, a support roll 95 attached to a frame 94 is provided.

  The mounting table 92 and the frame 94 are attached to the base 34 of the peeling apparatus 1, and can be independently moved in the horizontal direction by a driving source and a guide (not shown). The support roll 95 can be rotated by a drive source (not shown), can be formed as a free roll by separating from the drive source, or can be fixed so as not to rotate.

  The peeling member 91 holds the end of the flexible film 4 by a drive source (not shown), and moves the mounting table 92 to move the flexible film 4 along the peeling angle 40 indicated by an arrow. By pulling in the direction, it is possible to peel while keeping the peel angle 40 in the range of 1 ° or more and 80 ° or less. When peeling is performed, the frame 94 to which the support roll 95 is attached may be stopped, or may move in the direction of the arrow, that is, in the direction opposite to the direction in which the mounting table 92 moves.

  In another embodiment, the peeling member 91 holds the end of the flexible film 4 by a driving source (not shown) and moves the frame 94 in the direction of the arrow, that is, in the left direction of FIG. By pulling the flexible film 4, the peeling can be performed while keeping the peeling angle 40 in the range of 1 ° to 80 °. When peeling is performed, the mounting table 92 may be stopped, or may be moving in the opposite direction to the frame 94.

  When peeling is performed using the peeling unit 90, it is preferable that the flexible film 4 is always supported on the surface of the support roll 95. As a result, the flexible film is guided by the support roll, so that the peeling is performed stably. Further, it is preferable that the support roll 95 be driven such that the peripheral speed at the contact surface with the flexible film 4 is substantially the same as the moving speed of the flexible film, or that the support roll 95 is free to rotate at the time of peeling. Thereby, slippage between the support roll 95 and the flexible film 4 is eliminated, and problems such as damaging the flexible film 4 can be prevented. The support roll 95 may be rotationally fixed when peeling is performed, but is preferably used when damage to the surface of the flexible film 4 can be ignored.

  The peeling units 80 and 90 may be used in place of the peeling unit 220 of the peeling device 200.

  Examples of the reinforcing plate 2 used in the present invention include plates made of inorganic glass such as soda lime glass, borosilicate glass, and quartz glass, ceramics such as alumina, silicon nitride, and zirconia, stainless steel, invar alloy, and titanium. Those having a small coefficient of linear expansion or a coefficient of hygroscopic expansion such as a plate made of metal or glass fiber reinforced resin are preferable. Among them, a plate made of an inorganic glass and a metal is preferable because appropriate flexibility is easily obtained. In addition, it has excellent heat resistance and chemical resistance, large surface area, high surface smoothness, easy availability of the substrate at low cost, low plastic deformation, and low particle generation due to contact with transfer equipment. A plate made of an inorganic glass is particularly preferable because it is an insulator and there is no precipitation by electrolytic plating.

  When a glass substrate having a small thickness is used for the reinforcing plate, warping and torsion increase due to expansion and contraction forces of the flexible film, and the glass substrate may be broken when vacuum-adsorbed on a flat mounting table. In addition, the flexible film is deformed by vacuum suction / detachment, which tends to make it difficult to secure positional accuracy. On the other hand, in the case of a glass substrate having a large thickness, the glass substrate is not easily curved due to peeling, and the thickness unevenness lowers flatness and lowers the exposure accuracy. In addition, the handling load of a robot or the like increases, and quick operation cannot be performed, which causes a decrease in productivity and increases transportation costs. From these points, the thickness of the glass substrate is preferably in the range of 0.3 mm to 1.1 mm.

  When a metal substrate with a small thickness is used for the reinforcing plate, the warpage and torsion increase due to the expansion and contraction force of the flexible film, and the vacuum suction cannot be performed on a flat mounting table, or the warpage and torsion of the metal substrate occur. When the flexible film is deformed by a certain amount, the predetermined positional accuracy cannot be secured. Also, if there is a break, it becomes defective at that time. On the other hand, in the case of a metal substrate having a large thickness, flatness is reduced due to thickness unevenness, and bending for peeling becomes difficult, and exposure accuracy is also reduced. In addition, the handling load of the robot or the like increases, and quick operation cannot be performed. As a result, productivity decreases, and transport costs increase. Therefore, the thickness of the metal substrate is preferably in the range of 0.1 mm to 0.7 mm.

  In the present invention, a plastic film is used as the flexible film. For example, films such as polycarbonate, polyether sulfide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamide, and liquid crystal polymer can be employed. Among them, a polyimide film is preferably used because it has excellent heat resistance and chemical resistance. In addition, a liquid crystal polymer is preferably used in terms of excellent electrical characteristics such as low dielectric loss and low hygroscopicity. It is also possible to employ a flexible glass fiber reinforced resin plate. Further, these films may be laminated.

  Examples of the resin of the glass fiber reinforced resin plate include epoxy, polyphenylene sulfide, polyphenylene ether, a maleimide (co) polymer resin, polyamide, and polyimide.

  The thickness of the flexible film is preferably thin for weight reduction, miniaturization, or formation of fine via holes, while thicker for securing mechanical strength and maintaining flatness. From a preferable point, the range of 4 μm to 125 μm is preferable.

  As the peelable organic material layer used in the present invention, an adhesive or a pressure-sensitive adhesive is used. Examples of the peelable adhesive or pressure-sensitive adhesive include pressure-sensitive adhesives called acrylic or urethane-based re-release agents. In order to have sufficient adhesive strength during the processing of the flexible film, to be easily peelable at the time of peeling, and not to cause distortion in the flexible film substrate, those having an adhesive strength in an area called weak adhesive to medium adhesive are preferable. . A tacky silicone resin can also be used. It is also possible to use an epoxy resin having tackiness.

  As the releasable organic substance, those whose adhesive strength and adhesive strength are reduced in a low temperature region, those whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation, and those whose adhesive strength and adhesive strength are reduced by heat treatment are also preferably used. . Among them, those obtained by irradiation with ultraviolet rays are preferable because the change in adhesive strength and adhesive strength is large. As an example of the adhesive force and the adhesive force that are reduced by the irradiation of ultraviolet rays, a two-component cross-linkable acrylic pressure-sensitive adhesive can be used. Further, as an example of an adhesive whose adhesive strength and adhesive strength decrease in a low temperature region, an acrylic adhesive which reversibly changes between a crystalline state and an amorphous state can be mentioned, and is preferably used.

  The thickness of the releasable organic layer used in the present invention is not more than 0.1 μm because, when the thickness is too small, the flatness is deteriorated, and the strength of the peeling force due to the unevenness of the film thickness occurs because the peeling force is significantly reduced. Is more preferable, and more preferably 0.3 μm or more. On the other hand, if the thickness of the peelable organic material layer is too thick, the anchoring property of the organic material layer to the flexible film is improved, so that the adhesive strength becomes too strong, so that the thickness is preferably 10 μm or less, and preferably 20 μm or less. More preferred. When joining an electronic component to a circuit pattern on a flexible film fixed via a peelable organic material layer on a reinforcing plate, the thickness of the peelable organic material layer is controlled to suppress a change in the thickness direction of the circuit pattern. Is preferably 5 μm or less. When the peelable organic material layer is thick, when the electronic component is heated and pressed, the amount of deformation of the peelable organic material layer is large, and the circuit pattern of the bonding portion sinks, which may cause a problem in the reliability of the wiring circuit. When the sink is large, the circuit pattern may come into contact with the edge of the electronic component to cause a short circuit. The sink is preferably 6 μm or less, more preferably 3 μm or less, to ensure the reliability of the wiring circuit.

  Considering the peeling of the flexible film and the reinforcing plate, the adhesive strength between the peelable organic layer and the reinforcing plate is larger than the adhesive strength between the peelable organic layer and the flexible film. Is preferred. As a method of controlling the adhesive strength on both sides in this way, for example, there is a method of utilizing aging of the adhesive. That is, by applying a pressure-sensitive adhesive on the side where the pressure-sensitive adhesive strength is increased, and then proceeding with crosslinking for a predetermined period in a state where air is shut off, a surface having a reduced pressure-sensitive adhesive force can be obtained.

  An example of manufacturing the flexible film substrate 6 in the circuit board manufacturing method of the present invention will be described below, but the present invention is not limited to this.

  A releasable organic material is applied to a 1.1 mm-thick aluminoborosilicate glass using a spin coater, a blade coater, a roll coater, a bar coater, a die coater, screen printing, or the like. The use of a die coater is preferred in order to uniformly apply the liquid to the intermittently fed single-wafer substrate. After the peelable organic material is applied, the film is dried by heating drying or vacuum drying to obtain a peelable organic material layer having a thickness of 2 μm. An air-blocking film made of a release film (a silicone resin layer is provided on a polyester film) is attached to the applied peelable organic material layer, and left at room temperature for one week. This period is called aging, and the crosslinking of the peelable organic substance progresses, and the adhesive strength gradually decreases. The leaving period and the storage temperature are selected so as to obtain a desired adhesive strength. Instead of laminating the air blocking film, it can be stored in a nitrogen atmosphere or in a vacuum. It is also possible to apply a peelable organic substance to a long film substrate, dry it, and then transfer it to a reinforcing plate.

  Next, a polyimide film having a thickness of 25 μm is prepared. The film for air blocking on the glass substrate is peeled off, and the polyimide film is bonded to the glass substrate. As described above, a metal layer (which may be a circuit pattern) may be previously formed on one or both sides of the polyimide film. The polyimide film may be pasted in a cut sheet of a predetermined size, or may be pasted and cut while being wound from a long roll. For such a sticking operation, a polyimide film is held on the surface of a flexible flat body proposed in the pamphlet of WO 03/009657, and then pressed against a glass substrate to obtain low stress, high precision. And a method of laminating a polyimide film on the glass substrate side. Such a laminating apparatus will be described with reference to FIG. 10 is a schematic front view of the laminating apparatus. The flexible planar body 102 is charged by the electrostatic withstand device 104, and the polyimide film 4 is adsorbed. A flexible fabric or a thin film can be used for the flexible planar body 102 and is fixed to the frame 113. Further, the electrostatic charging device 104 is supported by a column 115 on a base 105, and the column 115 is moved by a vertical movement mechanism (not shown) so that the column 115 and the mounting table 101 move left and right in FIG. The device 104 moves so as not to interfere. Next, the glass substrate 2 on which the peelable organic material layer 2 has been applied is held on the mounting table 101 by vacuum suction or the like. The squeegee 103 presses the polyimide film 4 together with the flexible planar body 102 against the peelable organic material layer 3 and transfers the polyimide film 4 to the glass substrate 2 side. The squeegee 103 is held by a squeegee holder 114, and can move and move up and down. The mounting table 101 can be moved left and right in the figure by a rail 106, a guide 107, a nut 108, a ball screw 111, and a motor 112.

  When a metal layer (may be a circuit pattern) is not provided on the surface opposite to the bonding surface of the polyimide film, the metal layer is formed by a full additive method or a semi-additive method. Further, if necessary, plating of gold, nickel, tin or the like is performed to obtain a circuit pattern.

  In forming a circuit pattern, a connection hole can be provided in the polyimide film. That is, it is possible to provide a via hole for making an electrical connection with a metal layer provided on the surface to be bonded to the single-wafer substrate, or to provide a hole for placing a ball of a ball grid array. Laser holes or chemical etching can be used as the method of providing the connection holes. In the case of making an electrical connection, it is preferable that after forming the connection hole, the inner surface of the hole is made conductive by plating simultaneously with the formation of the circuit pattern. The diameter of the connection hole for making electrical connection is preferably 15 μm to 200 μm. The diameter of the hole for ball installation is preferably 50 μm to 800 μm, more preferably 80 μm to 800 μm.

  If necessary, a solder resist layer is formed on the circuit pattern. As the solder resist, a photosensitive solder resist or a thermosetting solder resist is preferable. Among them, it is more preferable to use a photosensitive solder resist for a fine circuit pattern. Apply a photosensitive solder resist on the circuit pattern with a spin coater, blade coater, roll coater, bar coater, die coater, screen printer, etc., dry it, expose it to ultraviolet light through a predetermined photomask, and develop Thus, a solder resist pattern is obtained. Next, curing is performed at 100 ° C. to 200 ° C.

  Next, electronic components such as an IC chip, a resistor and a capacitor are mounted on the formed circuit pattern. The means for mounting the electronic component is preferably performed by using a device that has an optical position detection function and a positioning function such as a movable stage and can ensure mounting accuracy.

  In addition, as a method for connecting the electronic component to the circuit board, a metal layer such as tin, gold, or solder formed at the connection portion of the circuit board and a metal layer such as gold or solder formed at the connection portion of the electronic component may be used. A metal layer such as tin, gold, or solder at the connection part of the circuit board and a metal layer such as gold or solder formed at the connection part of the electronic component by pressing and bonding the circuit board to the metal. A method of curing an anisotropic conductive adhesive or a non-conductive adhesive disposed between components and mechanically joining them is exemplified.

  In order to protect the circuit pattern and peel off the flexible film without distortion, it is preferable to form a protective layer on the entire surface or a part of the flexible film substrate 6. That is, by forming the protective layer, it is possible to obtain an effect of suppressing the peel angle at the time of peeling the flexible film from becoming too large. A similar effect can be obtained by providing a protective layer on the flexible film, peeling off the flexible film, and then removing the protective layer. The protective layer may be formed by laminating a film-like member or coating a liquid material. When the protective layer is in a liquid state, the solution is applied on a flexible film substrate using a spin coater, a blade coater, a roll coater, a bar coater, a die coater, a screen printer, a curtain coater, or the like, and dried. Further, the protective layer may be removed by dissolving it with water or a solvent after peeling the circuit board from the reinforcing plate, and is preferably a solder resist because of its function.

  Further, in a normal circuit pattern, there is a bias in the wiring direction, and in many cases, the distribution is such that the longitudinal direction of the wiring is aligned with a specific direction. In such a case, it is preferable to peel the wiring in a direction perpendicular to a direction in which many longitudinal directions of the wirings are arranged, because deformation of the film can be reduced.

  After connecting the circuit board and the electronic component, the circuit board and the glass substrate are separated using the separation method of the present invention. The circuit board on which the electronic components are mounted can be peeled from the glass substrate after the polyimide film with the circuit pattern is cut into individual pieces or an aggregate of the individual pieces using a laser, a high-pressure water jet, a cutter, or the like.

  In the present invention, it is possible to appropriately insert a resistance element or a capacitance element into a circuit pattern. Further, an insulating layer and a wiring layer can be laminated on at least one surface of the flexible film substrate to form a multilayer structure.

  The present invention is particularly effective in securing the mounting accuracy of a large-scale LSI having a small connection pitch and a large number of pins. Therefore, the package form (mounting form) of the LSI is not particularly limited. It can be applied to any of them.

  Although the use of the circuit board obtained by the manufacturing method of the present invention is not particularly limited, it is preferably used for a wiring board of an electronic device, an interposer for an IC package, a wiring board for a wafer level burn-in socket, and the like.

  Hereinafter, the present invention will be described more specifically with reference to Examples, but the present invention is not limited thereto.

Example 1
As a flexible film, a polyimide film ("Kapton" 100EN, manufactured by Toray Dupont Co., Ltd.) having a thickness of 25 m and a square size of 290 mm was prepared.

  A UV-curable adhesive "SK Dyne" SW-22 (manufactured by Soken Chemical Co., Ltd.) and a hardening agent L45 (Soken Chemical Co., Ltd.) were applied to a 1.1 mm thick, 300 mm square single-side polished soda glass prepared as a reinforcing plate using a die coater. Was mixed at a ratio of 100: 3 (weight ratio) and dried at 80 ° C. for 2 minutes. The thickness of the peelable organic layer after drying was 2 μm. Next, an air-blocking film (a film in which a silicone resin layer having an easy release was provided on a polyester film) was adhered to the organic material layer and left for one week.

While peeling the air blocking film, a polyimide film was bonded to the peelable organic material layer by a roll laminator. The polyimide film laminated on the glass was cut in accordance with the end of the glass. Thereafter, ultraviolet rays were irradiated from the glass substrate side at 1000 mJ / cm ² to cure the organic material layer.

  Then, a 6 nm thick chromium: nickel = 20: 80 (weight ratio) alloy film and a 200 nm thick copper film were laminated on the polyimide film in this order by sputtering. A positive photoresist was applied on the copper film by a spin coater and dried at 80 ° C. for 10 minutes. The photoresist was exposed and developed through a photomask to form a photoresist layer having a thickness of 10 μm in a portion where a plating film was not required.

  The test photomask pattern had the following shape. 240 connection pads (width: 25 μm, length: 80 μm) are arranged on each side of a square having a length of 3.5 mm, and each connection pad has a width of 20 μm and a length of 5 mm from the center of the width of 25 μm. Is placed. In the same manner as the center of the square, 240 pads (width: 50 μm, length: 100 μm) per side were arranged on the side of the square having a side length of 30 mm. One unit was formed by connecting a wire drawing part from a connection pad on a square with a side length of 3.5 mm and a pad on a square with a side length of 30 mm one-to-one with a wiring having a width of 20 μm. The units were uniformly arranged in 7 rows and 7 columns at a pitch of 40 mm on a substrate of 300 mm square. In addition, four points of markers (located at a distance of 200 mm from each other in a direction parallel to the sides) arranged diagonally from the center of the substrate for measurement were provided on the photomask pattern.

  Next, a copper layer having a thickness of 5 μm was formed by electrolytic plating in a copper sulfate plating solution using the copper film as an electrode. The photoresist was stripped with a photoresist stripper, and then the copper film and the chromium-nickel alloy film under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid-based aqueous solution. Subsequently, a tin layer having a thickness of 0.4 μm was formed on the copper plating film by electroless plating to obtain a circuit pattern.

  Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points (about 200 mm in the x direction and 200 mm in the y direction) that were originally separated by about 283 mm in the diagonal direction and provided for the above-described length measurement. When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was very well maintained.

  Next, a model IC chip of 4 mm × 4 mm in which four rows are arranged in a square with 60 gold-plated bumps arranged in a row at a pitch of 50 μm is mounted on a flip chip bonder FC-70 (manufactured by Toray Engineering Co., Ltd.) on the IC chip side. To 300 ° C., and metal-joined to the connection pads of the circuit pattern. The alignment between the bumps of the model IC chip and the connection pads of the circuit pattern was good.

  The polyimide film with the circuit pattern to which the IC chip was connected was peeled from the glass substrate using the peeling apparatus 1 shown in FIG. The curvature radius of the curved surface of the holding portion 14 was 600 mm, the degree of vacuum for adsorbing the flexible film in the holding portion 14 was 100 hPa, and the holding portion 14 was made of polyurethane rubber having a hardness of 70 °. The pressing pressure of the holding portion 14 against the flexible film was 0.01 MPa, and the rightward moving speed at the time of peeling the frame 18 was 0.3 m / min. The holding portion 14 shown in FIG. 3 was provided with a concave portion 36 (5 × 5 mm, depth 1 mm) corresponding to the IC chip. The side of the polyimide film with the circuit pattern to which the IC chip was connected was placed on the mounting table A30 shown in FIG. 1, and vacuum suction was performed at 100 hPa. The peeling angle between the reinforcing plate and the flexible film during peeling was a maximum of 20 °. The rotation peripheral speed of the holding section was set to 0.31 m / min. In addition, it was adjusted so that the slip ring worked when the tension applied to the polyimide film became 160 N / m or more. Although the wiring lead-out portion of the circuit pattern on the polyimide film slightly curled due to the peeling, no breakage or crack was observed, which was favorable. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points which were originally provided at a distance of about 283 mm in a diagonal direction provided on the peeled polyimide film (200 mm in the x direction and 200 mm in the y direction) Was measured, it was ± 5 μm or less with respect to the photomask pattern.

Example 2
A circuit pattern was obtained in the same manner as in Example 1. Next, using a screen printing machine on the flexible film from which the circuit pattern was obtained, the solder resist “FLEX PHOTO IMAGE MASK” NPR-90 (Nippon Polytechnics) Co., Ltd.) and dried at 70 ° C. for 30 minutes. Thereafter, the solder resist layer was irradiated with ultraviolet rays at 500 mJ / cm ² , and further thermally cured at 150 ° C. for 30 minutes. Finally, ultraviolet irradiation was performed at 1,500 mJ / cm ² for post-exposure to form a solder resist layer. The thickness of the solder resist layer after thermosetting was 24 μm.

  Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points (about 200 mm in the x direction and 200 mm in the y direction) that were originally separated by about 283 mm in the diagonal direction and provided for the above-described length measurement. When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was very well maintained.

  Next, in the same manner as in Example 1, the IC chip was metal-bonded to the connection pads of the circuit pattern. The alignment between the bumps of the model IC chip and the connection pads of the circuit pattern was good.

  A polyimide film with a circuit pattern to which an IC chip was connected was peeled from a glass substrate in the same manner as in Example 1 using the peeling apparatus 1 shown in FIG. The circuit pattern on the polyimide film did not show any deformation such as curl or breakage due to peeling, and was good. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points which were originally provided at a distance of about 283 mm in a diagonal direction provided on the peeled polyimide film (200 mm in the x direction and 200 mm in the y direction) Was measured, it was ± 5 μm or less with respect to the photomask pattern.

Example 3
A circuit pattern was obtained in the same manner as in Example 1. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points (about 200 mm in the x direction and 200 mm in the y direction) that were originally separated by about 283 mm in the diagonal direction and provided for the above-described length measurement. When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was very well maintained.

  Next, as in Example 1, the IC chip was metal-bonded to the connection pads of the circuit pattern. The alignment between the bumps of the model IC chip and the connection pads of the circuit pattern was good.

  Next, a 20 wt% aqueous solution of polyvinyl alcohol was applied on the circuit board and dried at 90 ° C. for 20 minutes to form a protective layer. The thickness of the protective layer after drying was 18 μm.

  A polyimide film with a circuit pattern to which an IC chip was connected was peeled from a glass substrate in the same manner as in Example 1 using the peeling device 1 shown in FIG. Next, the protective layer formed on the circuit board was washed with water, dried and removed.

  The circuit pattern on the polyimide film did not show any deformation such as curl or breakage due to peeling, and was good. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points which were originally provided at a distance of about 283 mm in a diagonal direction provided on the peeled polyimide film (200 mm in the x direction and 200 mm in the y direction) Was measured, it was ± 5 μm or less with respect to the photomask pattern.

Example 4
A polyimide film with a circuit pattern to which an IC chip was connected was obtained in the same manner as in Example 2 except that the curvature radius of the curved surface of the holding portion 14 was 70 mm. The peeling angle between the reinforcing plate and the flexible film during peeling was 70 ° at the maximum.

  Although the wiring lead-out portion of the circuit pattern on the polyimide film slightly curled due to the peeling, no breakage or crack was observed, which was favorable. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points which were originally provided at a distance of about 283 mm in a diagonal direction provided on the peeled polyimide film (200 mm in the x direction and 200 mm in the y direction) Was measured, it was ± 5 μm or less with respect to the photomask pattern.

Example 5
A circuit pattern was obtained in the same manner as in Example 1. Using the peeling device of FIG. 1, the glass substrate side was sucked to the mounting table A30 with a vacuum suction mechanism, one end of the polyimide film was attached to the holding portion 14 with an adhesive tape, and the polyimide film was gradually wound from the glass substrate.

  Although the polyimide film was slightly curled by the peeling, no breakage or crack was observed and the polyimide film was good. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points which were originally provided at a distance of about 283 mm in a diagonal direction provided on the peeled polyimide film (200 mm in the x direction and 200 mm in the y direction) Was measured, it was ± 5 μm or less with respect to the photomask pattern.

Example 6
A circuit pattern was obtained in the same manner as in Example 1, and then a solder resist layer was formed in the same manner as in Example 2. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points (about 200 mm in the x direction and 200 mm in the y direction) that were originally separated by about 283 mm in the diagonal direction and provided for the above-described length measurement. When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was very well maintained.

  Exfoliation was performed in the same manner as in Example 1 except that the radius of curvature of the holding portion was 1200 mm. At this time, the peeling angle between the reinforcing plate and the flexible film during peeling was 10 ° at the maximum. The circuit pattern on the polyimide film did not show any deformation such as curl or breakage due to peeling, and was good. However, two points (about 200 mm in the x direction and 200 mm in the y direction) that were originally provided at a distance of 283 mm in a diagonal direction and provided on the peeled polyimide film using a length measuring machine SMIC-800 (manufactured by Sokia Corporation). When the distance (point 200 mm apart) was measured, there was a photomask pattern which was distorted by 26 μm.

Example 7
As a flexible film, a polyimide film ("Kapton" 100EN, manufactured by Toray Dupont Co., Ltd.) having a thickness of 25 m and a square size of 290 mm was prepared.

  A UV-curable adhesive "SK Dyne" SW-22 (manufactured by Soken Chemical Co., Ltd.) and a hardening agent L45 (Soken Chemical Co., Ltd.) were applied to a 1.1 mm thick, 300 mm square single-side polished soda glass prepared as a reinforcing plate using a die coater. Was mixed at a ratio of 100: 3 (weight ratio) and dried at 80 ° C. for 2 minutes. The thickness of the peelable organic layer after drying was 2 μm. Next, an air-blocking film (a film in which a silicone resin layer having an easy release was provided on a polyester film) was adhered to the organic material layer and left for one week.

The polyimide film was bonded to the glass on which the peelable organic material layer was formed by using the laminating apparatus shown in FIG. 10 while peeling the air blocking film. The polyimide film laminated on the glass was cut in accordance with the end of the glass. Thereafter, ultraviolet rays were irradiated from the glass substrate side at 1000 mJ / cm ² to cure the organic material layer.

  Then, a 6 nm thick chromium: nickel = 20: 80 (weight ratio) alloy film and a 200 nm thick copper film were laminated on the polyimide film in this order by sputtering. A positive photoresist was applied on the copper film by a spin coater and dried at 80 ° C. for 10 minutes. The photoresist was exposed and developed through a photomask to form a photoresist layer having a thickness of 10 μm in a portion where a plating film was not required.

  The test photomask pattern had the following shape. 240 connection pads (width 25 μm, length 80 μm) are arranged on each side of a square having a length of 3.5 mm, and each connection pad has a width of 20 μm and a length of 5 mm from the center of the width 25 μm of each connection pad. Is placed. In the same manner as the center of the square, 240 pads (width: 50 μm, length: 100 μm) per side were arranged on the side of the square having a side length of 30 mm. One unit was formed by connecting a wire lead-out portion from a connection pad on a square having a side length of 3.5 mm and a pad on a square having a side length of 30 mm one-to-one with a wiring having a width of 20 μm. The units were uniformly arranged in 7 rows and 7 columns at a pitch of 40 mm on a substrate of 300 mm square. In addition, four points of markers (located at a distance of 200 mm from each other in a direction parallel to the sides) arranged diagonally from the center of the substrate for measurement were provided on the photomask pattern.

  Next, a copper layer having a thickness of 5 μm was formed by electrolytic plating in a copper sulfate plating solution using the copper film as an electrode. The photoresist was stripped with a photoresist stripper, and then the copper film and the chromium-nickel alloy film under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid-based aqueous solution. Subsequently, a tin layer having a thickness of 0.4 μm was formed on the copper plating film by electroless plating to obtain a circuit pattern.

  Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points (about 200 mm in the x direction and 200 mm in the y direction) that were originally separated by about 283 mm in the diagonal direction and provided for the above-described length measurement. When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was very well maintained.

  Next, a model IC chip of 4 mm × 4 mm in which four rows are arranged in a square with 60 gold-plated bumps arranged in a row at a pitch of 50 μm is mounted on a flip chip bonder FC-70 (manufactured by Toray Engineering Co., Ltd.) on the IC chip side. To 300 ° C., and metal-joined to the connection pads of the circuit pattern. The alignment between the bumps of the model IC chip and the connection pads of the circuit pattern was good.

  The polyimide film with the circuit pattern to which the IC chip was connected was peeled from the glass substrate using the peeling apparatus 200 shown in FIG. The curvature radius of the curved surface of the holding portion 14 was 600 mm, the degree of vacuum for adsorbing the flexible film in the holding portion 14 was 100 hPa, and the holding portion 14 was made of polyurethane rubber having a hardness of 70 °. The pressing pressure of the holding portion 14 against the flexible film was 0.01 MPa, and the right relative movement speed V2 at the time of peeling the frame 18 was 0.3 m / min. The holding portion 14 shown in FIG. 11 was provided with a concave portion 36 (5 × 5 mm, depth 1 mm) corresponding to the IC chip. The polyimide film with the circuit pattern connected to the IC chip was placed on the mounting table A30 shown in FIG. 11, and vacuum suction was performed at 100 hPa. The speed of the rotation motor 210 was controlled so that the rotation peripheral speed V1 on the holding surface of the holding portion 14 was 0.31 m / min. Furthermore, peeling was performed by adjusting the supply voltage to the electromagnetic clutch 206 so that the tension applied to the polyimide film 4 was 160 N / m.

  As a result, the peeling angle between the reinforcing plate and the flexible film during peeling was a maximum of 20 °. Although the wiring lead-out portion of the circuit pattern on the polyimide film slightly curled due to the peeling, no breakage or crack was observed, which was favorable. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points which were originally provided at a distance of about 283 mm in a diagonal direction provided on the peeled polyimide film (200 mm in the x direction and 200 mm in the y direction) Was measured, the difference was ± 3 μm or less with respect to the photomask pattern, which was very good.

Example 8
A polyimide film with a circuit pattern to which an IC chip was connected was obtained in the same manner as in Example 7 except that a silicone resin was used for the holding portion 14. The peeling angle between the reinforcing plate and the flexible film during peeling was at most 15 °. Further, when the polyimide film was peeled from the holding portion 14 made of a silicone resin, the peel strength in the 180 ° direction was 0.98 N / m.

  Curling, breakage, and cracks were not observed in the wiring lead-out portion of the circuit pattern on the polyimide film due to the peeling, which was favorable. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points which were originally provided at a distance of about 283 mm in a diagonal direction provided on the peeled polyimide film (200 mm in the x direction and 200 mm in the y direction) Was measured, the difference was ± 3 μm or less with respect to the photomask pattern, which was very good.

Example 9
A circuit pattern was obtained in the same manner as in Example 7. Except that the rotation motor 210 was controlled so that the rotation peripheral speed V1 on the holding surface of the holding portion 14 was 0.3 m / min, and the right relative movement speed V2 when the frame 18 was peeled was the same as the embodiment. 7 and peeled off. At this time, the peel angle 40 between the reinforcing plate and the flexible film may exceed 80 ° near the peeling end point of the flexible film, and the flexible film on which the circuit pattern is formed strongly curls near the peeling end point. did. Using a length measuring machine SMIC-800 (manufactured by Sokia Corporation), two points originally provided at a distance of 283 mm in a diagonal direction (200 mm in the x direction and 200 mm in the y direction) were provided on the peeled polyimide film for the length measurement. Was measured, it was found that some of the photomask patterns were distorted by 15 μm.

Comparative Example 1
A circuit pattern was obtained in the same manner as in Example 1, and the model IC chip was metal-bonded. The glass substrate side was sucked to the mounting table A30 with a vacuum suction mechanism, one end of the polyimide film was gripped, the end of the polyimide film was lifted, and the polyimide film was gradually peeled off from the glass substrate so that the peel angle became approximately 90 °. .

  In the portion where the model IC chip is mounted, the peeling force of the polyimide film from the substrate was increased, and a part of the circuit pattern on the polyimide film after peeling was broken, so that it could not be used as a product. In a portion where the model IC chip was not mounted, a part of the circuit pattern on the polyimide film after peeling was curled.

FIG. 1 is a schematic front view of a peeling device of the present invention. The schematic front view which shows another embodiment of the peeling apparatus of this invention. The schematic front view which shows another embodiment of the support body 12. FIG. FIG. 3 is a plan view showing the shape of a groove formed in a support 12. FIG. 9 is a plan view showing another shape of the groove formed in the support 12. FIG. 9 is a plan view showing another shape of the groove formed in the support 12. The schematic front view which shows another embodiment of the support body 12. FIG. FIG. 3 is a schematic front view showing details of a peeling unit 80. FIG. 9 is a schematic front view showing a peeling unit 90 which is another embodiment of the peeling unit. FIG. 1 is a schematic front view of a laminating apparatus suitable for the present invention. The schematic front view which shows another embodiment of the peeling apparatus of this invention. Side view of the peeling device of FIG.

Explanation of reference numerals

REFERENCE SIGNS LIST 1 peeling device 2 reinforcing plate 3 peelable organic material layer 4 flexible film 5 electronic component 6 flexible film substrate 10 peeling unit 12 support 14 holding unit 16 shaft 18 frame 20 rail 22 holding member 23 lead film 30 mounting table A
32 Mounting table B
34 Base 36 Concave portion 40 Peeling angle 80 Peeling unit 81 Peeling member 82 Mounting table 90 Peeling unit 91 Peeling member 92 Mounting table 93 Base 94 Frame 95 Support roll 100 Laminating device 101 Mounting table 102 Flexible sheet 103 Squeegee 104 Electrostatic charging device 106 Rail 111 Ball screw 200 Peeling device 202 Linear scale 204 Encoder 206 Electromagnetic clutch 208 Linear motor 210 Rotary motor 212 Control device 220 Peeling unit

Claims (10)

A method for manufacturing a circuit board, comprising: forming a circuit pattern on a surface opposite to a bonding surface of a flexible film bonded to a reinforcing plate via a peelable organic material layer; and then peeling the flexible film. And a method of manufacturing a circuit board for separating a reinforcing plate and a flexible film while maintaining a separation angle in a range of 1 ° or more and 80 ° or less. A method for manufacturing a circuit board, comprising: forming a circuit pattern on a surface opposite to a bonding surface of a flexible film bonded to a reinforcing plate via a peelable organic material layer; and then peeling the flexible film. And a method of manufacturing a circuit board in which a reinforcing plate and a flexible film are peeled off at least a part of the flexible film along a curved support. 3. The method for manufacturing a circuit board according to claim 2, wherein a radius of curvature of the curved support is in a range of 20 mm to 1000 mm. 3. The method according to claim 1, wherein the electronic component is bonded to the circuit pattern. Rotating the curved support and moving the flexible film relative to the reinforcing plate while peeling the flexible film from the reinforcing plate along a part of the flexible film along the curved support, The rotational peripheral speed V1 on the flexible film supporting surface is made higher than the relative moving speed V2 of the support relative to the reinforcing plate, and the tension applied to the flexible film when the flexible film is peeled off is controlled. A method for manufacturing the circuit board according to the above. A circuit board manufacturing apparatus for peeling a flexible film from a flexible film substrate on which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via a peelable organic material layer, the reinforcing plate And a holding means for holding the flexible film, and a curved separating means for separating at least a part of the flexible film from the reinforcing plate in contact with the curved support. The curved separating unit includes a rotation driving device for rotating the support, a relative movement driving device for relatively moving the support with respect to the reinforcing plate holding unit, a rotation speed of the support, and the holding of the reinforcement for the support. 7. The circuit board manufacturing apparatus according to claim 6, further comprising a speed control device for independently controlling a relative movement speed with respect to the means. 8. The apparatus according to claim 7, further comprising: a speed ratio control device that controls the rotation peripheral speed V1 to be higher than the relative movement speed V2; and a tension control device that controls a tension applied to the flexible film at the time of peeling. Equipment for manufacturing circuit boards. The circuit board manufacturing apparatus according to claim 6, wherein a concave portion corresponding to a position of the electronic component is provided on the support, and / or a cushion layer is provided. 7. The apparatus for manufacturing a circuit board according to claim 6, wherein a layer having tackiness is provided on the support.

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