JP2004207515A - Device and method for removing resist - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for removing a resist capable of uniformly removing the resist on a substrate surface with high efficiency. <P>SOLUTION: A resist removing device removes the resist on the substrate surface by making ozone water flow along the treating surface of a substrate. The resist removing device has a reaction tank composed of a fixing section fixing the substrate, so that the treating surface of the substrate runs approximately parallel in the direction of the flow of at least ozone water and a conversion member installed at a position opposed to the treating surface of the fixed substrate and converting the direction of the flow of ozone water. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【００４７】
表１より、実施例１、２の方が比較例１に比べて高いレジスト除去速度が得られることがわかった。
また、図８〜１０より、実施例１、２ではオゾン水流の方向に関わらず略均一にレジストが除去されていたのに対して、比較例１ではオゾン水流の流入側と流出側とでレジストの除去に著しい差があった。
【００４８】
【発明の効果】
本発明によれば、基板表面のレジストを高効率かつ均一に除去することができるレジスト除去装置及びレジスト除去方法を提供できる。
【図面の簡単な説明】
【図１】本発明のレジスト除去装置の反応部の一実施態様を示す断面図である。
【図２】本発明のレジスト除去装置の１実施形態を示す概略図である。
【図３】（ａ）は、本発明のレジスト除去装置の反応部の一例を模式的に示す平面図であり、（ｂ）は、（ａ）に示す反応部の断面図であり、（ｃ）は、（ａ）に示す反応部のＡ−Ａ線断面図である。
【図４】（ａ）は、図３に示す反応部のホルダー保持部に嵌合させるホルダーの一例を模式的に示す平面図であり、（ｂ）は、（ａ）に示すホルダーの正面図である。
【図５】本発明のレジスト除去装置における反応部の別の一例を模式的に示す斜視図である。
【図６】（ａ）は、実施例１及び２で用いた変換部材の一部を模式的に示す断面図であり、（ｂ）は、その平面図である。
【図７】比較例１で用いた反応部を模式的に示す断面図である。
【図８】実施例１における測定開始２０秒後のレジストの厚さを示す３次元図である。
【図９】実施例２における測定開始２０秒後のレジストの厚さを示す３次元図である。
【図１０】比較例１における測定開始２０秒後のレジストの厚さを示す３次元図である。
【図１１】従来のレジスト除去装置におけるレジスト除去の様子を示す模式図である。
【符号の説明】
１、５１ 基板
２ レジスト
３、５３ 変換部材
３ａ、５３ａ 波形部
４ オゾン発生器
５ オゾンガス検出器
６ オゾン溶解モジュール
６１ オゾン水流出口
６２ オゾン水流入口
７ オゾン水検出器
８、３０、５０ 反応部
９ 循環ポンプ
１０ 往路管
１１ 復路管
３１ ホルダー保持部
３２ 流入溝
３３ 流入側貯留部
３４ 流入路
３５ 流入管
３６ 流出溝
３７ 流出側貯留部
３８ 流出路
３９ 流出管
４０ ホルダー
４１ 保持部
４２ 本体部
５４ 固定部材
５５ オゾン水供給管
８１ オゾン水流出口
８２ オゾン水流入口
３００ 本体部[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resist removing apparatus and a resist removing method capable of removing a resist on a substrate surface with high efficiency.
[0002]
[Prior art]
When a circuit is formed on a semiconductor substrate or when a plurality of colored pixels having different hues are formed in a pattern on a liquid crystal substrate, a photolithography step is an essential step. For example, in the case of forming a circuit on a semiconductor substrate, a resist is applied on the substrate, an image formed of a resist pattern is formed by a normal photo process, and after etching using the image as a mask, the unnecessary resist is removed. In order to form a circuit by removing the resist, a resist is applied again to form the next circuit, and a cycle of image formation, etching and removal of the resist is repeated.
[0003]
Conventionally, in a resist removing step of removing unnecessary resist, an asher (ashing means) or an RCA cleaning method using sulfuric acid, hydrogen peroxide, or the like has been used for removing a resist from a semiconductor substrate. For removing the resist from the substrate, a mixed solution of an organic solvent and an amine has been used. However, if an asher is used to remove the resist, the semiconductor may be damaged due to the high temperature, and inorganic impurities cannot be removed. In addition, when using a solvent or chemicals to remove resist, a new chemical must be replaced every ten or more batches, which requires a large amount of chemicals, increases the cost of chemicals, and generates a large amount of waste liquid. Also, there is a great disadvantage in terms of cost and environment in treating waste liquid.
[0004]
Ozone water obtained by dissolving ozone gas in water exerts excellent effects on sterilization, deodorization, bleaching, etc. due to the strong oxidizing power of ozone, and the ozone gas self-decomposes into harmless oxygen (gas) over time. Since it has no residual properties, it is attracting attention as an environmentally friendly sterilizing, washing, and bleaching agent. In recent years, with increasing interest in the environment, a resist removal process using ozone water has attracted attention as an alternative to the above-described resist removal method.
[0005]
As a resist removal device using ozone water, for example, a device that installs a substrate in a flow path of an ozone water flow, a device that injects ozone water in a shower shape or a mist shape on a processing surface of the substrate, and the like were considered. In any case, there was a problem that a practical resist removal rate could not be obtained, or that the resist could not be uniformly removed over the entire surface of the substrate. In addition, since it is difficult to produce a large amount of high-concentration ozone water, there has been a demand for removing the resist efficiently with a smaller amount of ozone water.
[0006]
Patent Literature 1 discloses a method in which an object to be cleaned is diagonally immersed in a liquid in which ozone is dissolved, and the object to be cleaned is irradiated with ultraviolet light. Patent Document 2 discloses a method in which ozone gas is pressurized. A method is disclosed in which ozone water produced by dissolving in water with pure water is guided to a closed cleaning chamber containing the object to be cleaned while maintaining the pressure, and the object to be cleaned is cleaned.
In the method of cleaning an object to be cleaned using ozone water disclosed in Patent Literatures 1 and 2, the cleaning ability of the object to be cleaned is improved by irradiating the object to be cleaned with ultraviolet light or applying pressure. However, when attempting to remove the resist on the substrate surface by these methods, it is difficult to say that a sufficient resist removal rate can be obtained, and it is very difficult to uniformly remove the resist on the substrate surface. there were.
[0007]
[Patent Document 1]
Japanese Patent No. 3016301 [Patent Document 2]
JP 2001-79502 A
[Problems to be solved by the invention]
The present invention has been made in view of the above circumstances, and has as its object to provide a resist removing apparatus and a resist removing method capable of removing a resist on a substrate surface with high efficiency and uniformity.
[0009]
[Means for Solving the Problems]
The present invention is a resist removal apparatus that removes a resist on the substrate surface by flowing ozone water along a processing surface of the substrate, wherein at least the processing surface of the substrate is substantially in the direction of the flow of the ozone water. A resist stripper having a reaction part comprising a fixing part for fixing the substrate so as to be parallel and a conversion member provided at a position facing the processing surface of the fixed substrate and changing the direction of the flow of ozone water. Device.
Hereinafter, the present invention will be described in detail.
[0010]
The resist removing apparatus of the present invention removes the resist on the surface of the substrate by flowing ozone water along the processing surface (main surface) of the substrate.
In the present specification, the ozone water includes not only a solution obtained by dissolving ozone gas in an aqueous solution but also a solution obtained by dissolving ozone gas in water in which an organic acid such as acetic acid or a derivative thereof is dissolved.
The substrate is not particularly limited, and examples thereof include various silicon wafers used for semiconductor devices, glass substrates used for display panels, and other resin substrates.
[0011]
The resist removing apparatus according to the present invention includes: a fixing unit that fixes a substrate so that a processing surface (main surface) of the substrate is substantially parallel to a direction of an ozone water flow (hereinafter, also referred to as an ozone water flow); A reaction member, which is provided at a position facing the processing surface of the substrate and is configured to change the direction of the ozone water flow. By using such a resist removing apparatus of the present invention, the resist can be removed uniformly and with high efficiency.
[0012]
When the present inventors examined a conventional resist removing apparatus that installs a substrate in the flow path of the ozone water flow, as shown in FIG. 11, the resist 120 on the surface of the substrate 100 has a portion on the inflow side of the ozone water flow. Was relatively removed, while the outflow side of the ozone water flow was hardly removed even though the ozone water concentration was still high enough. FIG. 11 is a schematic view showing a state of resist removal in a conventional resist removal apparatus. In FIG. 11, the substrate 100 is arranged upside down.
The saturated concentration of ozone water at room temperature is as low as about 60 ppm, and the concentration of ozone water immediately decreases upon reaction with the resist. When the ozone water flows in the tube as a parallel water flow with respect to the surface direction of the substrate, the ozone water near the substrate processing surface that hit the resist on the inflow side consumes ozone to remove the resist there, and the ozone concentration decreases. Since the ozone water having a reduced ozone concentration flows directly near the processing surface of the substrate, it is considered that the ozone water no longer has an ozone concentration enough to remove the resist at the outflow side. On the other hand, it is considered that ozone water flowing at a position relatively far from the processing surface of the substrate flows away almost without being used for resist removal.
[0013]
In the reaction unit of the resist removing apparatus of the present invention, a conversion member for changing the direction of the ozone water flow is provided at a position facing the processing surface of the substrate fixed to the fixing unit so as to be substantially parallel to the direction of the ozone water flow. By providing, even if ozone is consumed on the inflow side of the ozone water flow, turbulence occurs in the ozone water flow due to the stirring effect of the conversion member, and high concentration ozone water always hits the entire processing surface of the substrate. The resist can be removed with high efficiency. In particular, when a conversion member having a shape that generates a turbulent flow such that the direction of the ozone water flow converted by the conversion member is directed toward substantially the entire processing surface of the substrate is selected, the resist can be formed with extremely high efficiency. Can be removed.
[0014]
The shape of the conversion member is not particularly limited, and examples thereof include a rod shape having a round or polygonal cross section, a mesh member, and a corrugated plate. Above all, it is preferable that the conversion member 3 shown in FIG. 1 has a structure in which a corrugated portion 3a having an oblique portion with respect to the direction of the ozone water flow is continuous in the direction of the ozone water flow. If the conversion member 3 having such a shape is used, an ozone water flow directed toward the entire processing surface of the substrate 1 is efficiently generated, so that a high-concentration ozone water reaches the resist 2 on the entire processing surface of the substrate 1. And the resist 2 can be removed with higher efficiency. FIG. 1 is a schematic view showing one embodiment of the reaction section of the resist removing apparatus of the present invention.
The angle of the oblique portion of the corrugated portion 3a is not particularly limited. However, if the angle is too small, the ozone water flow toward the processing surface of the substrate 1 is not generated, and the above-described effects may not be sufficiently obtained.
Further, the conversion member may be integrated with a member constituting the flow path of the ozone water (for example, a container or a partition in which the substrate is stored) or may be separate.
[0015]
In the resist removing apparatus of the present invention, the distance between the conversion member and the processing surface of the substrate is preferably 1.5 mm or less. If the thickness exceeds 1.5 mm, the effect of the turbulent flow of the ozone water flow by the conversion member may be difficult to reach the processing surface of the substrate, and the resist removal rate may be insufficient. It is more preferably 0.5 mm or less, and still more preferably 0.3 mm. The distance between the conversion member and the processing surface of the substrate means the distance between the closest points between the conversion member and the processing surface of the substrate.
[0016]
The material constituting the conversion member is not particularly limited as long as it has ozone resistance, and for example, a material made of a fluororesin is suitable. Examples of the fluorine resin include tetrafluoroethylene copolymers such as polytetrafluoroethylene resin (PTFE), perfluoroalkoxy resin (PFA), and fluoroethylene propylene resin (FEP); and fluorine rubber. Can be
[0017]
Further, it is preferable that the conversion member is disposed so as to oppose substantially the entire processing surface of the substrate, or has a size that opposes substantially the entire processing surface of the substrate. Since the ozone water flow toward the entire processing surface of the substrate can be more reliably generated, the chance of the ozone water reaching the resist on the entire surface of the substrate increases with a high probability, and the resist can be more reliably removed. It is.
[0018]
In the resist removing apparatus of the present invention, the substrate is fixed to the fixing part such that the processing surface is substantially parallel to the flow direction of the ozone water.
Means for fixing the substrate to the fixing portion so that the processing surface is substantially parallel to the flow direction of the ozone water is not particularly limited, and for example, a method of fixing the substrate to the fixing portion by an adhesive means such as a double-sided tape; A method of fitting a holder (fixed portion) on which a substrate is mounted to a holder holding portion; a vacuum chucking method of adsorbing a substrate to the fixed portion with a vacuum pump;
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described based on embodiments.
FIG. 2 is a schematic view showing one embodiment of the resist removing apparatus of the present invention.
The resist removing apparatus of the embodiment shown in FIG. 2 includes an ozone generator 4, an ozone gas detector 5, an ozone dissolving module 6, an ozone water concentration detector 7, a reaction unit 8, and a pump 9.
[0020]
In the ozone generator 4, ozone gas is generated. The ozone generator 4 is not particularly limited, and a known ozone generator can be used. The concentration of the ozone gas generated by the ozone generator 4 is measured and monitored by the ozone gas detector 5. The value of the ozone gas concentration measured by the ozone gas detector 5 is fed back to the ozone generator 4, and the concentration of the ozone gas generated by the ozone generator 4 is adjusted as needed.
[0021]
The ozone gas generated by the ozone generator 4 is dissolved in water in the ozone dissolving module 6.
The ozone dissolving module 6 preferably contains a gas permeable membrane made of a non-porous membrane. If such an ozone dissolving module is used, clogging does not occur even if the ozone water once used for removing the resist is circulated and used again.
The ozone water generated in the ozone dissolving module 6 is discharged from the ozone water outlet 61 to the outward pipe 10 and sent to the ozone water concentration detector 7, where the dissolved ozone gas concentration of the ozone water is monitored and managed.
[0022]
The obtained ozone water is sent from the ozone water inflow port 82 to the inside of the reaction section 8 through the outward pipe 10, and is used in the reaction section 8 to remove the resist on the substrate surface. The reaction section 8 will be described later in detail.
Further, the reaction unit 8 may be provided with a unit for irradiating ultraviolet rays. When the resist on the substrate surface is removed, irradiation with ultraviolet rays accelerates the decomposition rate of ozone, and accordingly, the effect of removing the resist can be enhanced. Therefore, by using ozone water and ultraviolet irradiation together, a higher resist removal effect can be obtained.
The means for irradiating the ultraviolet rays is not particularly limited, and examples thereof include a UV lamp. The wavelength of the irradiated ultraviolet light is preferably around 254 nm, which is absorbed by ozone.
[0023]
In the resist removing apparatus of the present invention, it is preferable to circulate and use the generated ozone water. By circulating and using the ozone water, a necessary amount of the ozone water can be saved, and a higher concentration ozone water can be easily obtained.
In order to circulate the ozone water, for example, the ozone water discharged from the ozone water outlet 81 of the reaction section 8 to the return pipe 11 may be sent to the ozone water inlet 62 of the ozone dissolving module 6 using the pump 9. .
[0024]
Further, the resist removing apparatus of the present invention preferably has a means for heating ozone water. Since the resist removal is performed by a chemical reaction between the resist and ozone, it is possible to increase the resist removal rate by applying a temperature.
Further, it is preferable that the resist removing apparatus of the present invention has means for pressurizing the inside of the apparatus. By pressurizing the inside of the apparatus, supersaturated ozone water can be generated, and by using such high concentration ozone water, the resist can be removed with higher efficiency.
[0025]
FIG. 3A is a plan view schematically showing one embodiment of the reaction unit in the resist removing apparatus of the present invention described with reference to FIG. 2, and FIG. 3B is a plan view of the reaction unit shown in FIG. It is a front view, (c) is an AA sectional view of the reaction part shown in (a).
In FIG. 3, the conversion member is omitted.
[0026]
As shown in FIGS. 3A to 3C, the reaction section 8 of the present embodiment includes a substantially disk-shaped main body 300.
On the upper surface of the main body 300, a holder holder 31 having a substantially rectangular concave shape in a plan view is provided near the center thereof, and a groove-shaped inflow-side storage part 33 and an outflow-side storage part 37 are provided near the outer periphery thereof. A plurality of parallel inflow grooves 32 and an outflow-side storage portion 37 are provided in parallel with the side surface of the holder holding portion 31 via the portion 31 and between the inflow-side storage portion 33 and the holder holding portion 31. A plurality of parallel outflow grooves 36 are provided between the holder holding portion 31 and the holder.
In addition, inside the main body 300, one end is exposed to a side surface near the inflow-side storage 33 of the main body 300, and the other end is extended to a portion directly below the inflow-side storage 33. 35, and an outflow pipe 39 whose one end is exposed to the side surface near the outflow-side reservoir 37 of the main body 300, and the other end of which is extended to a portion immediately below the outflow-side reservoir 37. The vicinity of the other end of the inflow pipe 35 and the inflow-side storage section 33 are circulated through an inflow path 34 having a V-shaped cross section, and the vicinity of the other end of the outflow pipe 39 and the outflow-side storage section. 37 is circulated through an outflow passage 38 having a V-shaped cross section.
[0027]
In the reaction section 8 having the above structure, a holder (fixing section) capable of holding and fixing a substrate having a resist on its surface is fitted into the holder holding section 31.
FIG. 4A is a plan view schematically showing an example of the holder, and FIG. 4B is a front view of the holder shown in FIG.
[0028]
As shown in FIGS. 4A and 4B, the holder 40 in the resist removing apparatus of the present invention is provided with a groove-shaped holding portion 41 on the upper surface of a substantially plate-shaped main body portion 42, and is substantially omitted in cross-section. It is U-shaped.
[0029]
The holder 40 is provided with a groove of the holder 41 of the holder 40 for smoothly flowing the ozone water from the inflow groove 32 of the reaction section 8 onto the resist on the substrate surface and flowing out the ozone water to the outflow groove 36. The groove is fitted to the holder holding part 31 of the reaction part 8 so that the direction of the groove is the same as that of the inflow groove 32 and the outflow groove 36 of the reaction part 8.
[0030]
In the reaction unit 8 of the resist removing apparatus of the present invention, the conversion member is a lid that covers the main body 300 at a position facing the processing surface of the substrate of the holder 40 fitted to the holder holding unit 31. On the lower surface of the lid (the surface facing the substrate), a plurality of ridges having a triangular cross section are formed, and the ridges of the conversion member are arranged so as to be orthogonal to the flow of the ozone water flow.
[0031]
In the reaction unit 8 having the above-described configuration, the ozone water is stored in the inflow-side storage unit 33 from the inflow pipe 35 through the inflow path 34, and after filling the inflow-side storage unit 33, passes through the inflow groove 32, and then is held in the holder holding unit. The fluid flows uniformly and in parallel between the conversion surface and the processing surface of the substrate fixed on the holding portion 41 of the holder 40 fitted to 31. After removing the resist on the surface of the substrate, the ozone water is collected from the outflow groove 36 to the outflow-side reservoir 37 and discharged from the outflow pipe 39 through the outflow path 38. The inflow pipe 35 is in communication with the ozone water inflow port 82 in FIG. 2, and the outflow pipe 39 is in communication with the ozone water outflow port 81.
[0032]
Although not shown in FIG. 3, the holder holding portion 31, the inflow groove 32, the inflow side storage portion 33, and the outflow groove are provided on the surface of the main body 300 of the reaction portion 8 on which the holder holding portion 31 is provided. A lid capable of accommodating the outlet 36 and the outflow-side reservoir 37 can be attached, and the above-described removal of the resist on the substrate surface can be performed inside the lid. In this case, the reaction section 8 is a closed reaction section, and can pressurize the inside of the resist removing apparatus of the present invention and remove the resist on the substrate surface using supersaturated ozone water.
[0033]
In the resist stripping apparatus of the present invention, the flow rate of ozone water when removing the resist on the substrate surface is not particularly limited, and depends on conditions such as the size and temperature of the substrate, the distance between the conversion member and the substrate, and the pattern of the conversion member. Although determined appropriately, a preferred lower limit is 0.7 L / min, and a preferred upper limit is 1.0 L / min. If the flow rate of the ozone water is less than 0.7 L / min, the resist cannot be efficiently removed, and it may take a long time to completely remove the resist on the substrate surface. On the other hand, when the flow rate exceeds 1.0 L / min, even if the flow rate of the ozone water is increased, the resist removal speed is not improved, and the efficiency of the resist removal with respect to the usage amount of the ozone water may be reduced. A more preferred lower limit is 0.9 L / min.
[0034]
The material constituting the reaction section 8 is not particularly limited as long as it has ozone resistance. For example, a material made of the same fluorine resin as the above-mentioned conversion member is preferable.
[0035]
The reaction section in the resist removing apparatus of the present invention is not limited to a substantially disk shape as in the reaction section 8 shown in FIG. 3, but may be any shape such as a plate shape. Further, by adjusting the depth of the holding portion 41 of the holder 40, the depth of the ozone water flowing on the processing surface of the substrate can be adjusted.
The structure of the reaction section in the resist removing apparatus of the present invention is such that a substrate having a resist on its surface is held and fixed on a fixing section, and the above-described conversion member is disposed at a position facing the processing surface of the substrate. The structure is not particularly limited to the structure shown in FIG. 3 as long as ozone water can flow between the processing surface of the substrate and the conversion member.
[0036]
FIG. 5 is a partial cross-sectional perspective view schematically showing another example of the reaction section in the resist removing apparatus of the present invention.
The reaction unit 50 shown in FIG. 5 is a doughnut-shaped conversion unit in which a cylindrical ozone water supply pipe 55 is inserted at the center of a fixing unit 54 composed of a disk-shaped support base and a vacuum chuck for fixing the substrate 52. The member 53 is configured to face the same, and a corrugated portion 53a having substantially the same shape as the corrugated portion shown in FIG. 1 is formed concentrically on the surface of the conversion member 53 on the fixed portion 54 side.
The substrate 52 is held and fixed on the surface of the fixing portion 54 on the conversion member 53 side, and the conversion member 53 has a predetermined interval between the processing surface of the substrate 52 and the waveform portion 53a. Fixed in position.
[0037]
In such a reaction section 50, the ozone water is supplied from the ozone water supply pipe 55 to the vicinity of the center of the substrate 52 between the conversion member 53 and the processing surface of the substrate 52, and then spreads toward the outer edge of the substrate 52. Flows to At that time, since the turbulent flow is generated in the ozone water flow by the corrugated portion 53a of the conversion member 53, even in the vicinity of the outer edge portion of the substrate 52, the ozone water is always hit with the high-concentration ozone water, so that the ozone water flow is uniform and with high efficiency. The resist on the substrate surface can be removed.
[0038]
As a material for forming the conversion member 53 and the fixing portion 54 and the like constituting the reaction portion 50, the same materials as the conversion member and the fixing portion of the reaction portion 8 shown in FIGS.
[0039]
Since the size of the reaction section 50 can be made substantially the same as the size of the substrate, even when removing the resist on the surface of the large-diameter substrate, it is possible to suppress an increase in the size of the resist removing apparatus. In addition, the resist on the surface of the large-diameter substrate can be removed efficiently and uniformly.
The reaction section having the above structure is usually used as an open reaction section. However, the reaction section having the above structure may be provided in a closed vessel to form a closed reaction section.
[0040]
By using the resist removing apparatus of the present invention, the resist can be removed with high efficiency. A method for removing a resist using the resist removing apparatus of the present invention is also one of the present invention.
[0041]
【Example】
Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
[0042]
(Example 1)
As shown in FIGS. 6 (a) and 6 (b), a conversion member having a structure in which a waveform portion having a slope of 45 ° and a height of 1.7 mm and ten continuous portions was formed in a range of 30 mm × 30 mm as shown in FIGS. . FIG. 6A is a cross-sectional view schematically illustrating a part of the conversion member in the reaction unit according to the first embodiment, and FIG. 6B is a plan view thereof.
Using this conversion member, a reaction section having the configuration shown in FIGS. Here, the distance between the conversion member and the wafer was 0.3 mm.
The wafer was previously coated with a resist solution (HPR-204LT, manufactured by Fuji Film Arch Co., Ltd.), treated with a spin coater (manufactured by Mikasa, 1H-DX2 type) at 2,000 rpm for 30 seconds, and then further heated to 90 ° C. 20 After drying for about a minute, a resist coated with a thickness of about 1.0 μm and cut into a size of 30 mm × 30 mm was used.
[0043]
Ozone water at a concentration of 50 ppm is flowed at a flow rate of 1.0 L / min at 21 ° C. into the reaction section, and the thickness of the resist is gradually changed with time using a film thickness meter (manufactured by Otsuka Electronics Co., Ltd., FE-3000 type). The measurement was performed to calculate the resist removal rate.
The results are shown in Table 1.
FIG. 8 shows a three-dimensional diagram showing the thickness of the resist 20 seconds after the start of measurement based on data obtained using a film thickness meter (manufactured by Otsuka Electronics Co., Ltd., FE-3000 type). The arrow shown in FIG. 8 indicates the direction of the flow of the ozone water flow.
[0044]
(Example 2)
The resist was removed in the same manner as in Example 1 except that the flow rate of the ozone water was set to 1.9 L / min.
The results are shown in Table 1 and FIG. The arrow shown in FIG. 9 indicates the direction of the ozone water flow.
[0045]
(Comparative Example 1)
As shown in FIG. 7, a reaction section having a configuration in which the conversion member was not installed was manufactured. Except for using this, the resist was removed in the same manner as in Example 1. FIG. 7 is a cross-sectional view schematically showing a reaction section according to Comparative Example 1, where 70 indicates a reaction section, 71 indicates a wafer, and 72 indicates a resist.
The results are shown in Table 1 and FIG. The arrow shown in FIG. 10 indicates the direction of the flow of the ozone water flow.
[0046]
[Table 1]

[0047]
From Table 1, it was found that Examples 1 and 2 can obtain a higher resist removal rate than Comparative Example 1.
8 to 10, the resist was removed substantially uniformly regardless of the direction of the ozone water flow in Examples 1 and 2, whereas the resist was removed on the inflow side and the outflow side of the ozone water flow in Comparative Example 1. There was a significant difference in the removal of
[0048]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the resist removal apparatus and the resist removal method which can remove the resist of a substrate surface efficiently and uniformly can be provided.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing one embodiment of a reaction section of a resist removing apparatus of the present invention.
FIG. 2 is a schematic view showing one embodiment of a resist removing apparatus of the present invention.
3A is a plan view schematically showing an example of a reaction section of the resist removing apparatus of the present invention, FIG. 3B is a cross-sectional view of the reaction section shown in FIG. () Is a sectional view taken along line AA of the reaction section shown in (a).
4A is a plan view schematically showing an example of a holder fitted into a holder holding portion of the reaction section shown in FIG. 3, and FIG. 4B is a front view of the holder shown in FIG. It is.
FIG. 5 is a perspective view schematically showing another example of the reaction section in the resist removing apparatus of the present invention.
FIG. 6A is a cross-sectional view schematically showing a part of the conversion member used in Examples 1 and 2, and FIG. 6B is a plan view thereof.
FIG. 7 is a cross-sectional view schematically showing a reaction section used in Comparative Example 1.
FIG. 8 is a three-dimensional diagram showing the thickness of a resist 20 seconds after the start of measurement in Example 1.
FIG. 9 is a three-dimensional view showing the thickness of a resist 20 seconds after the start of measurement in Example 2.
FIG. 10 is a three-dimensional diagram showing the thickness of a resist 20 seconds after the start of measurement in Comparative Example 1.
FIG. 11 is a schematic diagram showing a state of resist removal in a conventional resist removal apparatus.
[Explanation of symbols]
1, 51 Substrate 2 Resist 3, 53 Conversion member 3a, 53a Waveform section 4 Ozone generator 5 Ozone gas detector 6 Ozone dissolution module 61 Ozone water outlet 62 Ozone water inlet 7 Ozone water detector 8, 30, 50 Reactor 9 circulation Pump 10 Outgoing pipe 11 Return pipe 31 Holder holding section 32 Inflow groove 33 Inflow side storage section 34 Inflow path 35 Inflow pipe 36 Outflow groove 37 Outflow side storage section 38 Outflow path 39 Outflow pipe 40 Holder 41 Holder 42 Main body 54 Fixing member 55 Ozone water supply pipe 81 Ozone water outlet 82 Ozone water inlet 300 Main body

Claims (4)

A resist removing apparatus that removes resist on the surface of the substrate by flowing ozone water along a processing surface of the substrate,
At least a fixing portion for fixing the substrate so that the processing surface of the substrate is substantially parallel to the flow direction of the ozone water; and a fixing portion provided at a position opposed to the processing surface of the fixed substrate. And a conversion member for changing the direction of flow of the resist. 2. The resist removing apparatus according to claim 1, wherein the flow direction of the ozone water converted by the conversion member is a direction toward substantially the entire surface of the substrate. 3. The resist removing apparatus according to claim 1, further comprising means for pressurizing the ozone water. A method for removing a resist, comprising using the resist removing apparatus according to claim 1.

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