JP2004146631A - Electronic device - Google Patents

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Publication number
JP2004146631A
JP2004146631A JP2002310615A JP2002310615A JP2004146631A JP 2004146631 A JP2004146631 A JP 2004146631A JP 2002310615 A JP2002310615 A JP 2002310615A JP 2002310615 A JP2002310615 A JP 2002310615A JP 2004146631 A JP2004146631 A JP 2004146631A
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Japan
Prior art keywords
electronic device
panels
air volume
air
adjustment plate
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JP2002310615A
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Japanese (ja)
Inventor
Jiyoujiyu Hachitani
蜂谷 城充
Kenichi Jo
城 謙一
Yasuhiro Ando
安藤 靖弘
Shigefumi Hamano
浜野 成史
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NEC Engineering Ltd
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NEC Engineering Ltd
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Priority to JP2002310615A priority Critical patent/JP2004146631A/en
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device with a forced air-cooling system in which an air volume can be adjusted corresponding to a positional relationship between a plurality of parallel-arranged plates and a cooling fan or a heat release value of each panel. <P>SOLUTION: A plurality of panels 20 are arranged vertically between side panels 12 and 13 of a housing 11 of the electronic device 10 and cooling is performed by one or more cooling fans 40 mounted on an upper portion of the panels. The air volume adjusting plate 30 is arranged in the upper or lower portions of the plurality of panels 20. The air volume adjusting plate 30 includes a number of ventilating holes 31 with partially different opening rate. A cooling air volume effected by the cooling fans 40 is programmed accordingly depending on a mounted position of the cooling fans 40 or the heat release value of the panels or the like. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は電子機器筺体に関し、特に筺体の内部に配列された複数のカード(プリント基板)に実装された電子デバイス等の発熱を1以上の冷却ファンにより強制空冷する無線通信機器等の電子機器筺体に関する。
【0002】
【従来の技術】
無線通信機器等の電子機器は、内部に多数の半導体集積回路等の電子デバイスが実装された複数のカードを筺体内部に並列に実装して構成されるのが一般的である。斯かる電子デバイスの信頼性は、温度に依存する(即ち、温度が高いと信頼性が低下する)ので、低温に維持するのが好ましい。そのために、斯かる電子機器の筺体は、冷却ファンを設けて強制空冷することにより内部動作温度の上昇を抑えるのが一般的である。
【0003】
複数の回路基板が垂直又は水平方向に多段に実装される電子機器において、回路基板間に風速が均一な風を吹かせるようにして、回路基板の冷却効率を向上させる幾つかの強制空冷式の電子機器筺体の従来技術が提案されている。そのための手段として、電子機器筺体内の回路基板の位置側に複数のファンを配置し、各ファンには、吸気口から離れる方向に所定の角度だけ傾けられた吸気側導翼を設け、回路基板の他側には排気口に向けて傾斜された排気側導翼を設ける技術を開示している。また、ファンと回路基板間に多数の開口を有するメッシュ部材を配置する他の実施形態も開示している(例えば、特許文献1参照。)。
【0004】
また、多段に配置されたプリント配線基板(PKG)の上下にそれぞれ複数のファンユニットを配置すると共に各PKG段の上下に風向調整ユニットを配置している。各風向調整ユニットは、温度センサの検出温度により回転軸を中心に回転する複数の矩形板を備え、ファンからの風向きを調整する技術を開示している(例えば、特許文献2参照。)。
【0005】
【特許文献1】
特開2000−49482号(第3−4頁、第1−4図)
【特許文献2】
特開平11−204974号(第3−4頁、第1図)
【0006】
図8は、強制空冷型の電子機器の従来例を示す。図8(A)は、この従来の電子機器100の一部を分解した全体斜視図であり、(B)は図8(A)の上部Bの部分拡大図である。この電子機器100は、筺体101の上下のグリル(又は枠)108に設けられた複数のパネルガイド(又はプリント基板案内レール)102に沿って挿入される複数のパネル(電子デバイスが実装されたプリント基板)104が筺体101を構成する左右の側板101A−101B間に相互に並列に配置する。また、この筺体101内のパネル104の上方に、例えば2個の冷却ファン(図示せず)が配置される。
【0007】
図8(B)に示す如く、電子機器100の筺体101の内部には、例えば略一定間隔でパネルガイド102が設けられ、その間に通風孔105が形成される。従って、上述した冷却ファンを回転駆動すると、この冷却ファンにより吸い込み又は吸い出(排出)される冷却用空気は、この通風孔105に沿って流れる。これらパネルガイド102に挿入されたパネル104に実装された電子デバイス等の発熱部材からの発熱は、この空気流により強制冷却される。
【0008】
【発明が解決しようとする課題】
電子機器を構成する複数のパネルは、全て同一、同様に動作し且つ同様の発熱を生じるとは限らない。各パネルは、電子機器の動作状態および電子機器内での位置等により異なる発熱を生じ、その温度上昇も異なるのが一般的である。しかし、上述した従来技術では、斯かる考慮がなされていないか又は内部温度上昇の均一化のために複雑な構成を必要とし且つ電子機器を高価および大型化する等の課題を有する。また、相互に並列に配置された多数のパネル(プリント基板)を複数の冷却ファンにより強制空冷する場合には、冷却が不均一となる。即ち、冷却ファンの近傍のパネルには十分な空気流が生じるが、冷却ファンの両端又は冷却ファン間の間隙では空気流が不十分になるという課題があった。
【0009】
【発明の目的】
本発明は、従来技術の上述した課題に鑑みなされたものであり、簡単な構成により且つ電子機器を大型化することなく、また複数の冷却ファンを使用する場合でもパネルを略一様に冷却して電子機器の内部温度を所定温度以下に維持可能な電子機器を提供することを目的とする。
【0010】
【課題を解決するための手段】
前述の課題を解決するため本発明による電子機器は次のような特徴的な構成を採用している。
【0011】
(1)それぞれ発熱を伴う電子デバイス等が実装された複数のパネルが筺体内部に並列配置され、冷却ファンの空気流を前記パネル間に生じさせて強制空冷する電子機器において、
前記複数のパネルと実質的に直交して配置され、複数の通風孔を有する風量調整プレートを設け、該風量調整プレートの前記通風孔の寸法又は形状を部分的に変化させる電子機器。
【0012】
(2)前記風量調整プレートは、適宜交換可能に構成される上記(1)の電子機器。
【0013】
(3)前記風量調整プレートは、アルミニウム等の良熱伝導性の板状部材により形成され、筺体に取り付けられる上記(1)又は(2)の電子機器。
【0014】
(4)前記風量調整プレートは、前記冷却ファンに隣接して配置される上記(1)、(2)又は(3)の電子機器。
【0015】
(5)前記風量調整プレートは、前記複数のパネルの前記冷却ファンと反対側に配置される上記(1)、(2)又は(3)の電子機器。
【0016】
(6)前記風量調整プレートの前記通風孔は、異なる寸法の略矩形状の開口および実質的に円形の開口群により構成される上記(1)乃至(5)の何れかの電子機器。
【0017】
(7)前記風量調整プレートの前記矩形状又は円形開口群は、前記複数のパネルの間隙に沿って列状に形成される上記(6)の電子機器。
【0018】
(8)1対の側板を含む筺体の上部に配置された冷却ファンおよび相互に垂直方向に配列され、それぞれ発熱を伴う電子デバイス等が実装された複数のパネルを含む強制空冷式の電子機器において、
前記複数のパネルに対して実質的に直交して配置され、複数の通風孔が形成された風量調整プレートを備え、該風量調整プレートの通風孔は、前記配列された複数のパネル間の空気流量を補正する電子機器。
【0019】
(9)前記冷却ファンは、前記複数のパネルに沿って複数個設けられる上記(8)の電子機器。
【0020】
(10)前記風量調整プレートの前記通風孔は、前記冷却ファンの両端部および前記複数の冷却ファンの間隙部の開口率を大きく選定する上記(8)又は(9)の電子機器。
【0021】
【発明の実施の形態】
以下、本発明による電子機器の好適実施形態の構成および動作を、添付図面を参照して詳細に説明する。
【0022】
図1は、本発明による電子機器の第1実施形態である無線通信装置の構成を示す斜視図である。この電子機器10は、略直方体の筺体11、この筺体11内に挿抜可能に垂直方向に並列に実装される多数のパネル20、風量調節プレート30および1以上の冷却ファン(図1中には図示せず、図3の40参照)により構成される。
【0023】
筺体11は、左右側板12−13、バックプレーン(背面板)14、グリル状の上板15および底板16を有する。バックプレーン14には、複数のバックプレーンコネクタ(図示せず)が設けられ、筺体11の前面は開口して、パネル20の挿抜を可能に構成している。上板15および底板16には、それぞれ上下に対応して前面からバックプレーン14に向けて複数のパネルガイド(図示せず)が所定間隔で設けられ、複数のパネル20が、これらパネルガイドに沿って挿抜可能である。
【0024】
パネル20を、パネルガイドの1つに沿って十分に押し込むと、パネル20のエッジ(後端)に形成されたコンタクト(接触片)が、上述したバックプレーンコネクタに挿入され、電気的接続を確立する。パネル20の交換又は保守サービス時には、パネル20を手前に引き抜くことにより、パネル20のエッジに形成されたコンタクトが、バックプレーンコネクタから抜けて、上述した電気的接続は解除される。
【0025】
筺体11の上面には、ファン実装エリア21が設けられ、複数(例えば2個)の冷却ファンが取り付けられる。これら冷却ファンを駆動すると、筺体11の底面16の吸気口22から、実装された複数のパネル20の間隙を通して冷却用空気流が、矢印Aで示す如く筺体11の上面から筺体11の外部に排出される。また、風量調整プレート30は、図1に示す好適実施形態ではファン実装エリア21に配置される。即ち、実装された複数のパネル20の上端と冷却ファンとの間に配置される。この風量調整プレート30は、冷却ファンによりパネル20間を通して排出される空気流を最適値に調整する作用を有する。この風量調整プレート30は、電子機器の小型軽量化のためにできる限り薄い板状部材、好ましくはアルミニウム等の良熱伝導性の金属板により形成される。
【0026】
次に、図2は、上述した風量調整プレート30の具体例の平面図である。この風量調整プレート30は、略矩形状であり、その全面にわたり多数の通風孔31が形成されている。これら通風孔31は、実質的にパネル20の挿抜方向に沿って且つ隣接するパネル20間の間隙と一致して列状に形成されている。この風量調整プレート30の通風孔31は、部分的に異なる開口率の矩形状の開口又は複数の略円形の開口群により構成される。図2に示す特定例にあっては、中央部の比較的大きな複数列の矩形状の開口31A、両端部の細長い矩形状の開口31B−31C、両端部と中央部間の比較的小さい複数列の開口群31D−31Eを含んでいる。図2から明らかな如く、通風孔31A、31Bおよび31Cは、開口率が比較的大きく、通風量が大きい。一方、通風孔31Dおよび31Eは、開口率が比較的小さいので、通風量が小さい。
【0027】
次に、図3は、本発明による電子機器10の冷却ファン40による冷却効果乃至冷却空気の風量を示す概略説明図である。図3(A)は正面図であり、(B)は右側面図である。図3(B)に示す如く、冷却ファン40による空気は、複数の矢印で示す如く、電子機器10の底面からパネル20の間隙を通って電子機器10の上面へ排出される。一方、図3(A)は、冷却ファン40としてパネルの配列方向に並べて配置された複数の冷却ファン40A−40Bを使用する場合の、パネル20間を通過する風量を示す。風量調整プレート30を使用しない場合には、実線で示す如く、冷却ファン40A−40Bの近傍の風量は大きい。しかし、冷却ファン40Aおよび40Bの両端部又は両冷却ファン40A−40Bの間の風量は少ないので、冷却ファン40とパネル20との位置関係に応じて風量に不均一(ばらつき)を生じる。
【0028】
しかし、上述の如くプログラムされた開口率の通風孔31を有する風量調整プレート30を使用することにより、上述した風量の不均一を実質的に低減可能である。即ち、図2に示す如き風量調整プレート30を使用することにより、図3(A)中に破線で示す如く、複数のパネル20と冷却ファン40A−40Bとの位置に無関係に略均一な風量が得られる。
【0029】
次に、図4は、本発明による電子機器の第2実施形態の説明図である。この実施形態の電子機器50では、図4(B)に示す如く、筺体11の左側約2/3に発熱量が比較的大きいパネル20Aが配列され、右側の約1/3に発熱量の比較的小さいパネル20Bが配置されていると仮定する。
【0030】
上述の場合には、電子機器50の内部に使用する風量調整プレート60は、図4(A)に示す如く、左側の約2/3には開口率が比較的大きい矩形状の通風孔61Aを形成する。一方、右側の約1/3には開口率が比較的小さい円形開口群による通風孔61Bを形成する。これにより、図4(B)に示す如き風量分布曲線が得られる。即ち、発熱量が比較的大きいパネル20Aを実装する部分では風量を大きく選定し、発熱量が比較的小さいパネル20Bを実装する部分では風量を抑えることにより、有限の冷却風量を複数のパネル20に対して効率的に使用することが可能になる。
【0031】
次に、図5は、本発明による電子機器の第3実施形態の構成を示す斜視図である。この電子機器70では、風量調節プレート30を上述した第1および第2実施形態の電子機器10および50の如く冷却ファン40の近傍ではなく、複数のパネル(図示せず)の下側に配置していることを特徴とする。即ち、風量調整プレート30は、冷却ファン40による吸気通路内であれば、任意位置に配置可能である。
【0032】
次に、図6は、本発明による電子機器の第4実施形態の構成を示す斜視図である。この電子機器80は、風量調整プレート30を取り外し可能にすることを特徴とする。即ち、この電子機器80にあっては、例えば風量調整プレート30として異なるパターンでプログラムされた通風孔31を有する複数のプレートを用意し、電子機器80内に使用する複数のパネル20の位置および発熱状態等に応じて適宜交換して、最適な風量調整プレートを使用する。そのために、図7に部分斜視図で示す如く、電子機器の筺体11の側板(サイドプレート)12−13にガイドレール81を設け、取り付けネジ82により電子機器80の筺体11の適当な位置に取り外し可能に取り付けられる。風量調整プレート30は、異なる通風孔31が形成された複数個用意し、温度上昇試験を実施した結果に基づいて、最適な風量調整プレートを採用することが可能である。
【0033】
以上、本発明による電子機器の好適実施形態の構成および作用を詳述した。しかし、斯かる実施形態は、本発明の単なる例示に過ぎず、何ら本発明を限定するものではないことに留意されたい。本発明の要旨を逸脱することなく、特定用途に応じて種々の変形変更が可能であること、当業者には容易に理解できよう。例えば、複数のパネルは、上下に複数段状に配置してもよい。その場合には、複数のパネルの段間に風量調整プレートを配置してもよい。
【0034】
【発明の効果】
以上の説明から明らかな如く、本発明の電子機器によると次の如き実用上の顕著な効果が得られる。即ち、パネルの冷却ファンに対する実装位置関係による風量のばらつきを均等に変更することが可能である。また、複数のパネルの発熱量の違いに合わせ、パネル間の風量を簡単に調整可能となり、ファンの性能を効率的に利用可能にする。更に、電子機器の筺体を大型化することなく、実装された複数のパネルに対して必要最小限の風量を得ることが可能である。
【0035】
また、風量調整プレートの通風孔は、適宜プログラム可能であり、しかも温度上昇試験等により内部温度上昇を確認して、必要に応じて適当な通風孔が形成された風量調整プレートに交換可能である。更に、風量調整プレートは、アルミニウム等の良熱伝導性の金属板により形成し、熱を筺体の側板等に伝導して放熱することも可能である。
【図面の簡単な説明】
【図1】本発明による電子機器の第1実施形態の構成を示す斜視図である。
【図2】図1に示す電子機器に使用される風量調整プレートの一例の平面図である。
【図3】図1に示す電子機器の冷却動作説明図であり、(A)は冷却ファンと複数のパネル位置における風量分布、(B)は筺体内での冷却空気の流れを示す。
【図4】本発明による電子機器の第2実施形態を示し、(A)は使用する風量調整プレートの平面図、(B)は複数のパネルと風量分布図を示す。
【図5】本発明による電子機器の第3実施形態の構成を示す斜視図である。
【図6】本発明による電子機器の第4実施形態の構成を示す斜視図である。
【図7】図6に示す電子機器の風量調整プレートの取付状態を説明する部分斜視図である。
【図8】従来の電子機器の構成を示す斜視図である。
【符号の説明】
10、50、70、80 電子機器
11  筺体
12、13 側板
20  パネル(電子デバイスを実装したプリント基板)
30、60 風量調整プレート
31、61 通風孔
40  冷却ファン
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a housing for an electronic device, and particularly to a housing for an electronic device such as a wireless communication device in which heat generated by an electronic device mounted on a plurality of cards (printed circuit boards) arranged inside the housing is forcibly cooled by one or more cooling fans. About.
[0002]
[Prior art]
An electronic device such as a wireless communication device is generally configured by mounting a plurality of cards in which a large number of electronic devices such as semiconductor integrated circuits are mounted in parallel inside a housing. Since the reliability of such an electronic device depends on the temperature (that is, the higher the temperature, the lower the reliability), it is preferable to maintain the temperature at a low temperature. For this reason, the housing of such an electronic device is generally provided with a cooling fan and forcibly air-cooled to suppress an increase in the internal operating temperature.
[0003]
In electronic equipment in which a plurality of circuit boards are mounted in multiple stages in the vertical or horizontal direction, some forced air-cooling systems are used to improve the cooling efficiency of the circuit boards by blowing a uniform wind speed between the circuit boards. 2. Description of the Related Art Conventional technology for an electronic device housing has been proposed. As means for this, a plurality of fans are arranged on the position side of the circuit board in the electronic device housing, and each fan is provided with an intake-side guide blade inclined at a predetermined angle in a direction away from the intake port, On the other side, there is disclosed a technique of providing exhaust-side guide blades inclined toward the exhaust port. Further, another embodiment in which a mesh member having a large number of openings is arranged between a fan and a circuit board is disclosed (for example, see Patent Document 1).
[0004]
Also, a plurality of fan units are arranged above and below a multi-stage printed wiring board (PKG), and a wind direction adjustment unit is arranged above and below each PKG stage. Each wind direction adjustment unit includes a plurality of rectangular plates that rotate around a rotation axis according to a temperature detected by a temperature sensor, and discloses a technique of adjusting a wind direction from a fan (for example, see Patent Document 2).
[0005]
[Patent Document 1]
JP-A-2000-49482 (pages 3-4, FIG. 1-4)
[Patent Document 2]
JP-A-11-204974 (page 3-4, FIG. 1)
[0006]
FIG. 8 shows a conventional example of a forced air cooling type electronic device. FIG. 8A is an overall perspective view in which a part of the conventional electronic device 100 is exploded, and FIG. 8B is a partially enlarged view of an upper part B of FIG. 8A. The electronic device 100 includes a plurality of panels (printed on which electronic devices are mounted) inserted along a plurality of panel guides (or printed board guide rails) 102 provided on upper and lower grills (or frames) 108 of a housing 101. A board (substrate) 104 is arranged in parallel between the left and right side plates 101A and 101B constituting the housing 101. Further, above the panel 104 in the housing 101, for example, two cooling fans (not shown) are arranged.
[0007]
As shown in FIG. 8B, inside the housing 101 of the electronic device 100, panel guides 102 are provided at substantially constant intervals, for example, and ventilation holes 105 are formed therebetween. Therefore, when the above-described cooling fan is rotationally driven, the cooling air sucked or sucked (discharged) by the cooling fan flows along the ventilation holes 105. Heat generated from a heat generating member such as an electronic device mounted on the panel 104 inserted into the panel guide 102 is forcibly cooled by the air flow.
[0008]
[Problems to be solved by the invention]
The plurality of panels that make up the electronic device are all the same, operate in the same manner, and do not necessarily generate the same heat. Generally, each panel generates heat differently depending on the operation state of the electronic device, the position in the electronic device, and the like, and the temperature rise is also generally different. However, in the above-described conventional technology, there is a problem that such consideration is not taken or a complicated configuration is required for making the internal temperature rise uniform, and the electronic device is expensive and large. Further, when a large number of panels (printed circuit boards) arranged in parallel with each other are forcibly air-cooled by a plurality of cooling fans, the cooling becomes uneven. That is, a sufficient air flow is generated in the panel near the cooling fan, but the air flow is insufficient at both ends of the cooling fan or at the gap between the cooling fans.
[0009]
[Object of the invention]
The present invention has been made in view of the above-mentioned problems of the related art, and has a simple configuration and does not increase the size of an electronic device. Even when a plurality of cooling fans are used, the panel can be cooled substantially uniformly. To provide an electronic device capable of maintaining the internal temperature of the electronic device at a predetermined temperature or lower.
[0010]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, an electronic device according to the present invention employs the following characteristic configuration.
[0011]
(1) In an electronic device in which a plurality of panels on each of which an electronic device or the like that generates heat is mounted in parallel inside a housing and an air flow of a cooling fan is generated between the panels to perform forced air cooling,
An electronic device which is provided substantially perpendicular to the plurality of panels, has an air flow adjusting plate having a plurality of air holes, and partially changes the size or shape of the air holes of the air volume adjusting plate.
[0012]
(2) The electronic device according to (1), wherein the air volume adjustment plate is configured to be appropriately replaceable.
[0013]
(3) The electronic device according to (1) or (2), wherein the air volume adjustment plate is formed of a plate member having good heat conductivity such as aluminum and is attached to a housing.
[0014]
(4) The electronic device according to (1), (2) or (3), wherein the air volume adjustment plate is arranged adjacent to the cooling fan.
[0015]
(5) The electronic device according to (1), (2) or (3), wherein the air volume adjustment plate is disposed on a side of the plurality of panels opposite to the cooling fan.
[0016]
(6) The electronic device according to any one of (1) to (5), wherein the ventilation holes of the air volume adjustment plate include substantially rectangular openings having different dimensions and a group of substantially circular openings.
[0017]
(7) The electronic device according to (6), wherein the rectangular or circular opening group of the air volume adjustment plate is formed in a row along a gap between the plurality of panels.
[0018]
(8) In a forced air-cooling type electronic apparatus including a cooling fan arranged on an upper part of a housing including a pair of side plates and a plurality of panels arranged in a direction perpendicular to each other and mounted with electronic devices and the like each generating heat. ,
An air flow adjustment plate disposed substantially orthogonal to the plurality of panels and having a plurality of air holes formed therein, wherein the air holes of the air volume adjustment plate are provided with an air flow rate between the plurality of arranged panels. Electronic equipment to correct.
[0019]
(9) The electronic device according to (8), wherein a plurality of the cooling fans are provided along the plurality of panels.
[0020]
(10) The electronic device according to the above (8) or (9), wherein the ventilation holes of the air volume adjustment plate select large opening ratios at both ends of the cooling fan and gaps between the plurality of cooling fans.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the configuration and operation of a preferred embodiment of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.
[0022]
FIG. 1 is a perspective view illustrating a configuration of a wireless communication device that is a first embodiment of an electronic device according to the present invention. The electronic device 10 includes a substantially rectangular parallelepiped housing 11, a number of panels 20 that are vertically inserted in and removed from the housing 11, an air volume adjustment plate 30, and one or more cooling fans (FIG. (Not shown, see 40 in FIG. 3).
[0023]
The housing 11 includes left and right side plates 12-13, a back plane (back plate) 14, a grill-like upper plate 15 and a bottom plate 16. The backplane 14 is provided with a plurality of backplane connectors (not shown). The front surface of the housing 11 is open so that the panel 20 can be inserted and removed. A plurality of panel guides (not shown) are provided on the top plate 15 and the bottom plate 16 at predetermined intervals from the front surface to the back plane 14 corresponding to the up and down directions, respectively, and the plurality of panels 20 are arranged along these panel guides. It can be inserted and removed.
[0024]
When the panel 20 is sufficiently pushed along one of the panel guides, the contacts (contact pieces) formed on the edge (rear end) of the panel 20 are inserted into the above-described backplane connector to establish an electrical connection. I do. At the time of replacement or maintenance service of the panel 20, by pulling the panel 20 forward, the contact formed at the edge of the panel 20 comes off the backplane connector, and the above-described electrical connection is released.
[0025]
On the upper surface of the housing 11, a fan mounting area 21 is provided, and a plurality (for example, two) of cooling fans are mounted. When these cooling fans are driven, a cooling airflow is discharged from the upper surface of the housing 11 to the outside of the housing 11 from the intake port 22 on the bottom surface 16 of the housing 11 through the gap between the plurality of mounted panels 20 as indicated by an arrow A. Is done. The air volume adjustment plate 30 is disposed in the fan mounting area 21 in the preferred embodiment shown in FIG. That is, it is arranged between the upper ends of the plurality of mounted panels 20 and the cooling fan. The air volume adjusting plate 30 has an operation of adjusting an air flow discharged between the panels 20 by the cooling fan to an optimum value. The air volume adjustment plate 30 is formed of a plate member as thin as possible to reduce the size and weight of the electronic device, preferably a metal plate having good thermal conductivity such as aluminum.
[0026]
Next, FIG. 2 is a plan view of a specific example of the air volume adjustment plate 30 described above. The air volume adjustment plate 30 has a substantially rectangular shape, and has a large number of ventilation holes 31 formed over the entire surface thereof. These ventilation holes 31 are formed in a row substantially along the panel 20 insertion / extraction direction and in line with the gap between the adjacent panels 20. The ventilation holes 31 of the air volume adjustment plate 30 are configured by rectangular openings or a plurality of substantially circular openings having partially different opening ratios. In the specific example shown in FIG. 2, a relatively large plurality of rows of rectangular openings 31A at the center, elongated rectangular openings 31B-31C at both ends, a plurality of relatively small rows between both ends and the center. Of the opening groups 31D-31E. As is clear from FIG. 2, the ventilation holes 31A, 31B and 31C have a relatively large aperture ratio and a large ventilation volume. On the other hand, the ventilation holes 31D and 31E have a relatively small opening ratio, so that the ventilation volume is small.
[0027]
Next, FIG. 3 is a schematic explanatory diagram showing the cooling effect of the cooling fan 40 of the electronic device 10 according to the present invention or the flow rate of cooling air. FIG. 3A is a front view, and FIG. 3B is a right side view. As shown in FIG. 3B, the air from the cooling fan 40 is discharged from the bottom surface of the electronic device 10 to the upper surface of the electronic device 10 through the gap between the panels 20 as indicated by a plurality of arrows. On the other hand, FIG. 3A shows the airflow passing between the panels 20 when a plurality of cooling fans 40A-40B arranged side by side in the panel arrangement direction are used as the cooling fans 40. When the air volume adjusting plate 30 is not used, the air volume near the cooling fans 40A-40B is large as shown by the solid line. However, since the air volume between both ends of the cooling fans 40A and 40B or between the two cooling fans 40A-40B is small, the air volume becomes uneven (variation) depending on the positional relationship between the cooling fan 40 and the panel 20.
[0028]
However, by using the air volume adjustment plate 30 having the ventilation holes 31 with the programmed aperture ratio as described above, the above-mentioned non-uniform air volume can be substantially reduced. In other words, by using the air volume adjusting plate 30 as shown in FIG. 2, a substantially uniform air volume can be obtained regardless of the positions of the plurality of panels 20 and the cooling fans 40A-40B as shown by the broken lines in FIG. can get.
[0029]
Next, FIG. 4 is an explanatory diagram of a second embodiment of the electronic device according to the present invention. In the electronic device 50 of this embodiment, as shown in FIG. 4B, a panel 20A that generates a relatively large amount of heat is arranged at about 左側 of the left side of the housing 11, and a comparison of the amount of heat is provided at about 1 / of the right side. Assume that a very small panel 20B is arranged.
[0030]
In the above case, as shown in FIG. 4A, the air volume adjustment plate 60 used inside the electronic device 50 has a rectangular ventilation hole 61A having a relatively large aperture ratio at about 2/3 on the left side. Form. On the other hand, about 1/3 on the right side, a ventilation hole 61B is formed by a group of circular openings having a relatively small opening ratio. Thereby, an air volume distribution curve as shown in FIG. 4B is obtained. In other words, a large amount of air is selected in a portion where the panel 20A with a relatively large amount of heat is mounted, and a small amount of air is suppressed in a portion where the panel 20B with a relatively small amount of heat is mounted. It can be used efficiently.
[0031]
Next, FIG. 5 is a perspective view illustrating a configuration of an electronic device according to a third embodiment of the present invention. In this electronic device 70, the air volume adjusting plate 30 is arranged not under the vicinity of the cooling fan 40 but under a plurality of panels (not shown) as in the electronic devices 10 and 50 of the first and second embodiments. It is characterized by having. That is, the air volume adjustment plate 30 can be arranged at an arbitrary position as long as the air volume adjustment plate 30 is in the intake passage of the cooling fan 40.
[0032]
Next, FIG. 6 is a perspective view illustrating a configuration of an electronic device according to a fourth embodiment of the present invention. The electronic device 80 is characterized in that the air volume adjustment plate 30 is removable. That is, in the electronic device 80, for example, a plurality of plates having ventilation holes 31 programmed in different patterns are prepared as the air volume adjustment plate 30, and the positions and heat generation of the plurality of panels 20 used in the electronic device 80 are prepared. Use the optimal air volume adjustment plate by appropriately replacing it according to the state and the like. For this purpose, as shown in a partial perspective view in FIG. 7, a guide rail 81 is provided on a side plate (side plate) 12-13 of the housing 11 of the electronic device, and is removed at an appropriate position of the housing 11 of the electronic device 80 by a mounting screw 82. Mounted as possible. A plurality of air volume adjusting plates 30 having different ventilation holes 31 are prepared, and an optimal air volume adjusting plate can be adopted based on the result of performing a temperature rise test.
[0033]
The configuration and operation of the preferred embodiment of the electronic device according to the present invention have been described above in detail. However, it should be noted that such embodiments are merely examples of the present invention and do not limit the present invention in any way. It will be readily apparent to those skilled in the art that various modifications and changes can be made in accordance with the particular application without departing from the spirit of the invention. For example, a plurality of panels may be arranged vertically in a plurality of steps. In that case, an air volume adjusting plate may be arranged between the steps of the plurality of panels.
[0034]
【The invention's effect】
As is apparent from the above description, the electronic apparatus of the present invention has the following remarkable practical effects. That is, it is possible to uniformly change the variation in the air flow due to the mounting positional relationship of the panel with respect to the cooling fan. In addition, the air volume between the panels can be easily adjusted in accordance with the difference in the heat value of the plurality of panels, and the performance of the fan can be used efficiently. Furthermore, it is possible to obtain the minimum necessary airflow for a plurality of mounted panels without increasing the size of the housing of the electronic device.
[0035]
Further, the ventilation holes of the air volume adjustment plate can be appropriately programmed, and can be replaced with an air volume adjustment plate having an appropriate ventilation hole formed as necessary by checking the internal temperature rise by a temperature rise test or the like. . Further, the air volume adjusting plate may be formed of a metal plate having good heat conductivity such as aluminum, and may conduct heat to a side plate of the housing and radiate the heat.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a first embodiment of an electronic device according to the present invention.
FIG. 2 is a plan view of an example of an air volume adjusting plate used in the electronic device shown in FIG.
FIGS. 3A and 3B are explanatory diagrams of a cooling operation of the electronic apparatus shown in FIG. 1, wherein FIG. 3A shows a distribution of air flow at a cooling fan and a plurality of panel positions, and FIG.
4A and 4B show an electronic device according to a second embodiment of the present invention, wherein FIG. 4A is a plan view of an air flow adjusting plate to be used, and FIG.
FIG. 5 is a perspective view illustrating a configuration of a third exemplary embodiment of an electronic device according to the present invention.
FIG. 6 is a perspective view showing a configuration of a fourth embodiment of an electronic device according to the present invention.
FIG. 7 is a partial perspective view illustrating an attached state of an air volume adjusting plate of the electronic device illustrated in FIG. 6;
FIG. 8 is a perspective view illustrating a configuration of a conventional electronic device.
[Explanation of symbols]
10, 50, 70, 80 Electronic equipment 11 Housing 12, 13 Side plate 20 Panel (printed circuit board on which electronic device is mounted)
30, 60 Air volume adjustment plate 31, 61 Ventilation hole 40 Cooling fan

Claims (10)

それぞれ発熱を伴う電子デバイス等が実装された複数のパネルが筺体内部に並列配置され、冷却ファンの空気流を前記パネル間に生じさせて強制空冷する電子機器において、
前記複数のパネルと実質的に直交して配置され、複数の通風孔を有する風量調整プレートを設け、該風量調整プレートの前記通風孔の寸法又は形状を部分的に変化させることを特徴とする電子機器。
A plurality of panels each mounted with an electronic device or the like that generates heat are arranged in parallel inside the housing, and in an electronic device that performs forced air cooling by generating an air flow of a cooling fan between the panels,
An electronic device, comprising: an air flow adjusting plate that is arranged substantially orthogonal to the plurality of panels and has a plurality of air holes, and partially changes a size or a shape of the air holes of the air volume adjusting plate. machine.
前記風量調整プレートは、適宜交換可能に構成されることを特徴とする請求項1に記載の電子機器。The electronic device according to claim 1, wherein the air volume adjustment plate is configured to be appropriately replaceable. 前記風量調整プレートは、アルミニウム等の良熱伝導性の板状部材により形成され、筺体に取り付けられることを特徴とする請求項1又は2に記載の電子機器。The electronic device according to claim 1, wherein the air volume adjustment plate is formed of a plate member having good heat conductivity, such as aluminum, and is attached to a housing. 前記風量調整プレートは、前記冷却ファンに隣接して配置されることを特徴とする請求項1、2又は3に記載の電子機器。4. The electronic device according to claim 1, wherein the air volume adjustment plate is disposed adjacent to the cooling fan. 5. 前記風量調整プレートは、前記複数のパネルの前記冷却ファンと反対側に配置されることを特徴とする請求項1、2又は3に記載の電子機器。4. The electronic device according to claim 1, wherein the air volume adjustment plate is disposed on a side of the plurality of panels opposite to the cooling fan. 5. 前記風量調整プレートの前記通風孔は、異なる寸法の略矩形状の開口および実質的に円形の開口群により構成されることを特徴とする請求項1乃至5の何れかに記載の電子機器。6. The electronic device according to claim 1, wherein the ventilation holes of the air volume adjustment plate are configured by substantially rectangular openings having different dimensions and a group of substantially circular openings. 前記風量調整プレートの前記矩形状又は円形開口群は、前記複数のパネルの間隙に沿って列状に形成されることを特徴とする請求項6に記載の電子機器。The electronic device according to claim 6, wherein the rectangular or circular opening group of the air volume adjustment plate is formed in a row along a gap between the plurality of panels. 1対の側板を含む筺体の上部に配置された冷却ファンおよび相互に垂直方向に配列され、それぞれ発熱を伴う電子デバイス等が実装された複数のパネルを含む強制空冷式の電子機器において、
前記複数のパネルに対して実質的に直交して配置され、複数の通風孔が形成された風量調整プレートを備え、該風量調整プレートの通風孔は、前記配列された複数のパネル間の空気流量を補正することを特徴とする電子機器。
In a forced air cooling type electronic apparatus including a cooling fan arranged on an upper part of a housing including a pair of side plates and a plurality of panels arranged in a vertical direction with respect to each other and electronic devices etc. each generating heat,
An air flow adjustment plate disposed substantially orthogonal to the plurality of panels and having a plurality of air holes formed therein, wherein the air holes of the air volume adjustment plate are provided with an air flow rate between the plurality of arranged panels. Electronic equipment characterized by correcting.
前記冷却ファンは、前記複数のパネルに沿って複数個設けられることを特徴とする請求項8に記載の電子機器。The electronic device according to claim 8, wherein a plurality of the cooling fans are provided along the plurality of panels. 前記風量調整プレートの前記通風孔は、前記冷却ファンの両端部および前記複数の冷却ファンの間隙部の開口率を大きく選定することを特徴とする請求項8又は9に記載の電子機器。The electronic device according to claim 8, wherein the ventilation holes of the air volume adjustment plate select a large opening ratio between both ends of the cooling fan and a gap between the plurality of cooling fans.
JP2002310615A 2002-10-25 2002-10-25 Electronic device Pending JP2004146631A (en)

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JP2006209025A (en) * 2005-01-31 2006-08-10 Kyocera Mita Corp Cooling structure and image forming apparatus provided with the cooling structure
EP1940211A2 (en) 2006-12-27 2008-07-02 NEC Corporation Plug-in unit and electronic apparatus
WO2010073480A1 (en) * 2008-12-24 2010-07-01 日本電気株式会社 Electronic apparatus, sub-rack structure, and method of forming cooling route
JP2013176235A (en) * 2012-02-27 2013-09-05 Mitsubishi Electric Corp Rotary electric machine
JP2016164911A (en) * 2015-03-06 2016-09-08 日本電気株式会社 Cooling control device, circuit board, cooling method, and program
CN107087383A (en) * 2017-06-23 2017-08-22 成都特锐泰雷兹电子应用科技有限公司 A kind of subrack air-flow plate and its application process
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JP2006209025A (en) * 2005-01-31 2006-08-10 Kyocera Mita Corp Cooling structure and image forming apparatus provided with the cooling structure
JP4647323B2 (en) * 2005-01-31 2011-03-09 京セラミタ株式会社 Cooling structure and image forming apparatus having the cooling structure
EP1940211A2 (en) 2006-12-27 2008-07-02 NEC Corporation Plug-in unit and electronic apparatus
EP1940211A3 (en) * 2006-12-27 2009-10-28 NEC Corporation Plug-in unit and electronic apparatus
WO2010073480A1 (en) * 2008-12-24 2010-07-01 日本電気株式会社 Electronic apparatus, sub-rack structure, and method of forming cooling route
JP2013176235A (en) * 2012-02-27 2013-09-05 Mitsubishi Electric Corp Rotary electric machine
JP2016164911A (en) * 2015-03-06 2016-09-08 日本電気株式会社 Cooling control device, circuit board, cooling method, and program
CN107087383A (en) * 2017-06-23 2017-08-22 成都特锐泰雷兹电子应用科技有限公司 A kind of subrack air-flow plate and its application process
CN107087383B (en) * 2017-06-23 2023-06-02 成都特锐泰雷兹电子应用科技有限公司 Air quantity adjusting plate for plug box and application method thereof
JP2021052155A (en) * 2019-09-26 2021-04-01 ファナック株式会社 Electrical device including fan unit, and control panel including electrical device
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