JP2004135455A - Ic card, electronic apparatus, and power feeder thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card communicable even if apparatuses transmitting power by using radio signals are separated from each other at a longer distance. <P>SOLUTION: The IC card 11 is formed by laminating a plurality of base plates 16 in which coil patterns 13 for receiving the radio signals transmitted from a card reader are flatly arranged, and electrically connecting the coil patterns 13 that are arranged on each layer of the lamination. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
According to the present invention, power is supplied to a device that transmits power using a wireless signal to perform communication with the device and supply power to a portable electronic device and a portable electronic device. The present invention relates to a power supply device for performing power supply, and an electronic apparatus including the power supply device.
[0002]
[Problems to be solved by the invention]
In recent years, IC cards, RFID tags, and the like have become widespread. Inside these, a microcomputer (microcomputer) chip is embedded, and ID information and data of an individual or an article are stored in a memory on the chip, and are used while being carried by a person or attached to an object. . Then, when approaching a card reader that reads stored data, a microcomputer such as an IC card is powered and started by an electromagnetic signal or a radio signal transmitted from the card reader, and communicates with the card reader. It has become.
[0003]
16A and 16B show the configuration of an IC card. FIG. 16A is a plan view showing the inside of the IC card as seen through, FIG. 16B is a side view (thickness is slightly enlarged), and FIG. FIG. 2 is an enlarged view of an AA ′ section shown in FIG. The IC card 1 is configured by arranging a control LSI 3 and a coil pattern 4 constituting an antenna on the surface of a base substrate 2 and pasting protective films 5 and 6 on its upper and lower layers.
[0004]
In such a communication system using the IC card 1, there is a problem that the communication distance is short due to the limitation of the structure of the device and the manufacturing method. For example, when the IC card 1 is used as an ID card for entrance / exit management, as shown in FIG. 17, a gate provided with a card reader 7 is provided, and a person carrying the IC card 1 passes through the gate. However, at this time, communication cannot be performed unless the IC card 1 is brought close to the communication antenna 8 of the card reader 7 arranged at the gate to about several centimeters. Therefore, it is necessary for the user to take the IC card 1 and hold it over the part where the communication antenna 8 is arranged.
[0005]
Therefore, for example, when both hands of the user are closed to carry the luggage, the user stops at the gate, unloads the luggage, removes the IC card 1 from the pocket of the clothes, and holds the card 1 over the antenna. It is necessary to perform the procedure of performing entry registration, passing the gate with the baggage after holding the card 1 after the card 1 is lost, and it may not be said that convenience is good.
[0006]
The present invention has been made in view of the above circumstances, and an object thereof is to provide an IC card that enables communication even when a device that transmits power using a wireless signal is separated by a longer distance. An object of the present invention is to provide a power supply device for an electronic device and an electronic device including the power supply device.
[0007]
[Means for Solving the Problems]
According to the IC card of the first aspect, a plurality of coil arrangement layers in which an antenna coil for receiving a radio signal transmitted from an external device is arranged two-dimensionally are arranged and arranged on each of those layers. Electrically connected antenna coil. Therefore, receiving electric wave signals increases electric power fed through these antenna coils, so that the communicable distance between the external device and the IC card can be made longer, and the convenience can be improved. It becomes possible.
[0008]
According to the IC card of the second aspect, the control unit switches the connection between the plurality of antenna coils in series and in parallel by controlling the switching in the switching unit. That is, if a plurality of antenna coils are connected in series, the induced voltage increases, and if they are connected in parallel, the obtained current increases. Therefore, by appropriately switching the connection between the plurality of antenna coils, it is possible to adjust so as to obtain the optimum voltage and current.
[0009]
According to the IC card of the third aspect, the coil arrangement layer is formed of a thermoplastic resin as a base material, and is integrally formed by performing heating and pressing in a state where a plurality of layers are laminated. . With such a configuration, the thickness of the entire coil arrangement layer can be reduced, and the production can be performed in an extremely short time.
[0010]
According to the power supply device for an electronic device according to the fourth aspect, the antenna device for receiving a radio signal transmitted from an external device is configured by stacking a plurality of coil arrangement layers in which an antenna coil is arranged in a plane. Are electrically connected to each other, so that electric power supplied through the antenna coils increases by receiving a radio signal. Then, power is supplied to the electronic device configured to be portable by the power supply device, and if the user carries the electronic device to which the power supply device is connected and approaches the place where the external device is installed, the electronic device transmits. When the power receiving unit of the power supply apparatus receives the wireless signal to be supplied, power is supplied and operation becomes possible. Therefore, the electronic device does not need to use a battery or connect a power supply line for connecting to a power supply.
According to the power supply device for an electronic device according to the fifth or sixth aspect, the same effect as that of the second or third aspect can be obtained for the power receiving unit of the power supply device.
[0011]
According to the electronic device described in claim 7, power is supplied by the power supply device according to any one of claims 4 to 6. That is, since the power supply device can be configured to be thin, it is easy to configure the power supply device integrally with the electronic device. Then, since the electronic device can operate when approaching the place where the external device is installed, it is not necessary to use a battery or connect a power supply line for connecting to a power source in that region. Therefore, for example, it is suitable for a type of electronic device that only needs to be used in a specific area.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
(First embodiment)
Hereinafter, a first embodiment in which the present invention is applied to an IC card will be described with reference to FIGS. FIG. 1A is a plan view showing the inside of the IC card in the present embodiment in a see-through manner, FIG. 1B is a side view (thickness is slightly enlarged), and FIG. It is a figure which expands and shows the AA 'cross section.
[0013]
The IC card 11 has a base pattern in which a coil pattern (antenna coil) 13 constituting an antenna is disposed on a thermoplastic resin film 12 and a conductive paste 15 is filled in a via hole 14 for electrically connecting each layer. A plurality of (coil arrangement layers) 16 are laminated and integrally formed. The control LSI 17 which is a microcomputer may be arranged on the base substrate 16 of any layer. Protective films 18 and 19 on which predetermined indications are printed are attached to the upper and lower layers of the base substrate 16 in which a plurality of layers are superimposed as in the conventional configuration. When the control LSI 17 is arranged in the inner layer, the protective films 18 and 19 are not always necessary.
[0014]
FIG. 3 shows a manufacturing process of the IC card 11. First, a conductor such as a copper foil 20 (having a thickness of, for example, 18 μm) is attached to one surface of a resin film 12 as an insulating base material (see FIG. 3A), and the coil pattern 13 is patterned by etching (FIG. 3). (B)). The resin film 12 has a composition of, for example, 35 to 65% by weight of a polyether ketone resin and 65 to 35% by weight of a polyether imide, and is formed to have a thickness of about 25 to 75 μm.
[0015]
After the completion of the patterning, the protective film 21 is attached to the opposite surface of the resin film 12, and a carbon dioxide laser is irradiated from the protective film 21 side to form a bottomed via hole 14 having the contact point 13a of the coil pattern 13 as the bottom surface. (See FIG. 3 (c)). At this time, the output of the laser and the irradiation time are adjusted so as not to penetrate the contact point 13a.
[0016]
Next, the inside of the via hole 14 is filled with the conductive paste 15 (see FIG. 3D). The conductive paste 15 is a paste formed by adding a binder resin or an organic solvent to metal particles such as copper, silver, and tin and kneading the paste to form a paste. The paste is printed and filled in the via holes 14 by a screen printing machine using a metal mask. . Thereafter, the protective film 21 is peeled off (see FIG. 3E). Thus, one base substrate 16 is formed.
[0017]
Subsequently, a predetermined number of layers are stacked with the surface of the base substrate 16 on which the coil pattern 13 is formed facing downward (see FIG. 3F). Note that a cover layer 22 is disposed on the lowermost layer to protect the coil pattern 13 in the upper layer. The elastic modulus of the cover layer 22 is preferably set to 1 to 1000 Mpa in consideration of the heat-sealing property between the films 12. If the value exceeds the above range, heat fusion becomes difficult.
[0018]
Then, in a state of lamination as shown in FIG. 3 (f), they are collectively heated at 200 to 350 ° C. by a vacuum press machine and pressurized at a pressure of 0.1 to 10 Mpa. Then, since the respective films 12 are heat-sealed, they are integrally formed (see FIG. 3G). FIG. 6 shows an example of the material properties of the film 12, and FIG. 7 shows the pressing conditions. When the control LSI 17 is arranged in the inner layer, the connection is made to the coil pattern 13 of the layer arranged when the base substrate 16 is laminated at the stage of FIG. good.
[0019]
FIG. 4 shows two base substrates 16 arranged one above the other and directly connected via a contact point 13a on the same surface side. The coil pattern 13 is arranged such that the number of turns is “3” for each base substrate 16, and the outer contact point 13 aOUT of the upper layer base substrate 16 is connected to the contact point 13 aOUT of the upper layer base substrate 16.
[0020]
The inner contact point 13aIN of the upper base substrate 16 is connected to the inner contact point 13aIN of the lower base substrate 16, and the outer contact point 13aOUT of the lower base substrate 16 is connected to the lower base substrate 16 Is connected to the contact point 13aOUT. Further, FIG. 5 shows a three-dimensional perspective view of the connection state of the coil patterns 13 of the respective layers after lamination (connection is made such that the windings are continuously in the same direction).
[0021]
That is, since the electromotive force of the coil is proportional to the number of turns, the electromotive force induced by electromagnetic induction on the IC card 11 side by the electromagnetic signal transmitted from the card reader increases according to the number of base substrates 16 stacked.
[0022]
Therefore, for example, assuming that the IC card 11 configured as described above is used as an ID card in which an employee number and the like are stored, the transmission output on the card reader side is kept at the current specification, and FIG. As shown, the antenna 24 of the card reader (external device) 23 is arranged above the user's passage.
[0023]
Then, if the user enters the communicable area 25 of the antenna 24 with the IC card 11 put in, for example, a pocket or a bag of an outer garment, the IC card 11 transmits a radio signal (for example, (13 MHz band), and power is supplied, so that both can automatically communicate with each other. That is, even if the user does not perform the operation of taking out the IC card 11 from the pocket or bag and approaching the antenna 24, the employee number stored in the IC card 11 is automatically read by the card reader 23. Matching will be performed.
[0024]
As described above, according to the present embodiment, the IC card 11 is formed by laminating a plurality of base substrates 16 on which the coil patterns 13 for receiving wireless signals transmitted from the card reader 23 are arranged in a plane. Are electrically connected to the coil patterns 13 arranged on each layer. Therefore, the power supplied through the coil patterns 13 increases by receiving the radio signal, so that the communicable distance between the card reader 23 and the IC card can be made longer, and the convenience is improved. It becomes possible.
[0025]
In addition, the base substrate 16 is formed using the thermoplastic resin film 12 as a base material, and the IC card 11 is integrally formed by performing heating and pressurizing in a state in which a plurality of base substrates 16 are stacked. In addition, the entire thickness of the base substrate 16 can be reduced, and the manufacturing can be performed in an extremely short time as compared with the conventional method of stacking a plurality of layers.
[0026]
(Second embodiment)
FIGS. 8 to 12 show a second embodiment of the present invention. The same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described below. FIG. 8 shows the configuration of the entire power supply system. A plurality of transmitting antennas 33 of a power transmitting device 32 as an external device are arranged side by side above the user's passage 31, and their communicable areas 34 overlap each other.
[0027]
When the user carries the electronic device 35 and is located in the passage 31, the electronic device 35 is supplied with power by receiving a radio signal transmitted from the transmitting antenna 33 and is operable. That is, the electronic device 35 is configured to be portable, such as a PDA (Personal Digital Assistants), a personal computer, a mobile phone, a television, a radio, a digital camera, and the like, and includes a power supply device 36.
[0028]
9 to 12 show the configuration of the power supply device 36. FIG. The power supply device 36 is formed by the same manufacturing method as the IC card 11 in the first embodiment. FIG. 9 shows a plan view of one layer of the base substrate (coil arrangement layer) 37. A coil pattern (antenna coil) 38 as a receiving antenna that is wound a plurality of times is arranged on an outer edge portion of the rectangular base substrate 37. The coil pattern 38 supplies power to a control LSI (control means) 39. Similar to the IC card 11, a similar coil pattern 38 is arranged on a plurality of base boards, and they are connected in series. I have.
[0029]
On the inner peripheral side of the coil pattern 38, twenty coil patterns 40 are arranged in an array of 4 rows and 5 columns. These coil patterns 40 are connected in series for each row, and as shown in FIG. 11, coil patterns 40 of the same arrangement are arranged on a plurality of base substrates (for convenience, three layers and three rows). And they are connected in series in the stacking direction.
[0030]
The power output line 41 is connected to the first row and the first column of the coil pattern 40, and is also connected to switching terminals c of the switching units 42A to 42C arranged at the end of the row of the coil pattern 40. The power output line 43 is connected to the fourth row and the fifth column of the coil pattern 40, and is also connected to the switching terminals d of the switching units 42A to 42C.
[0031]
The switching unit 42 includes a plurality of switching elements, and is controlled by the control LSI 39 to switch the electrical connection of the coil pattern 40. The power output lines 41 and 43 are power lines for supplying power to the main body of the electronic device 35. The control LSI 39 is connected to a signal line 44 for communicating control commands and the like with the main body of the electronic device 35.
[0032]
The switching terminal a of the switching unit 42A is connected to the coil pattern 40 at the end of the first row, and the switching terminal b is connected to the coil pattern 40 at the second row and first column. Similarly, the switching terminal a of the switching unit 42B is connected to the coil pattern 40 at the end of the second row, and the switching terminal b is connected to the coil pattern 40 of the third row and the first column. The terminal a is connected to the coil pattern 40 at the end of the third row, and the switching terminal b is connected to the coil pattern 40 at the fourth row and first column. The switching terminals c and d of the switching unit 42 are connected to power output lines 41 and 43, respectively.
[0033]
FIG. 10 is a simplified diagram illustrating the connection switching mode of the coil pattern 40 for easy understanding. When the three coil patterns 40 (1) to 40 (3) are connected in series, the control LSI 39 performs control so as to connect the switching terminals a and b of the switching units 42 (1) and 42 (2). (Terminals a and d and terminals bc are separated). On the other hand, when the three coil patterns 40 (1) to 40 (3) are connected in parallel, the control LSI 39 includes the switching terminals a and d of the switching units 42 (1) and 42 (2), and the terminal b- Control is performed to connect the terminals c.
[0034]
As shown in FIG. 9, the power supply device 36 configured as described above is arranged so as to be attached to the surface of the electronic device 35, and supplies power to the electronic device 35 via the power output lines 41 and 43. . Then, as shown in FIG. 12, when a plurality of coil patterns 40 are connected in series, the voltage level of the received power can be increased. When a plurality of coil patterns 40 are connected in parallel, the current level of the received power can be increased. Can be raised. In FIG. 12, the direction in which the number of coil connections increases for each of the voltage and the current is reversed.
[0035]
A control circuit (not shown) arranged on the side of the electronic device 35 monitors the received power state at that time, and when it is desired to increase the voltage level, the power supply device 36 connects the coil patterns 40 of each row in series. Is transmitted to the control IC 39. When it is desired to increase the current level, a control command is transmitted to the control IC 39 so that the coil patterns 40 of each row are connected in parallel. Then, the control IC 39 switches the switching unit 42 in response to the control command.
[0036]
As described above, according to the second embodiment, the power supply device 36 receives the radio signal transmitted from the transmission antenna 33 of the power transmission device 32 and supplies power to the portable electronic device 35. Placed. That is, since the power supply device 36 can be configured to be extremely thin, the power supply device 36 can be integrally formed with the electronic device 35, and the electronic device 35 can operate when approaching the place where the power transmission device 32 is installed. In the area, there is no need to use a battery or connect a power supply line for connecting to a power supply, and the user can reliably obtain an opportunity to operate the electronic device 35.
[0037]
Then, the control LSI 39 of the power supply device 36 switches the connection between the plurality of coil patterns 40 in series and in parallel by controlling the switching of the switching unit 42. Therefore, it is possible to adjust the electronic device 35 so as to obtain the optimum voltage and current.
[0038]
(Third embodiment)
FIG. 13 shows a third embodiment of the present invention. The third embodiment shows another example in which the electronic device 51 and the power supply device 52 are integrally formed. The electrical configurations of the electronic device 51 and the power supply device 52 are the same as those of the electronic device 51 and the power supply device 52 in the second embodiment. As shown in FIG. 13, a display operation unit 53 such as a display or an operation panel is disposed on the front side of the electronic device 51, and a power supply device 52 is disposed on the back side thereof. An indicator (eg, an LED) 54 that indicates that the electronic device 51 is operable when the power is supplied from the power supply device 52 is disposed on the display operation unit 53.
[0039]
(Fourth embodiment)
14 and 15 show a fourth embodiment of the present invention. The fourth embodiment shows another example in which the power supply device 56 is integrally formed when the electronic device 55 is, for example, a personal computer. The electronic device 55 is, for example, a laptop type, and when the upper lid 57 is opened via a hinge mechanism (not shown), the display 58 and the operation panel 59 appear and become usable. The power supply device 56 is incorporated in the upper lid 57. An indicator 60 similar to that of the third embodiment is arranged on the power supply device 56 side. As shown in FIG. 15, the power supply device 56 and the main body of the electronic device 55 are connected via a power supply line, a communication line 61, and a connector 52.
As in the third and fourth embodiments described above, the electronic device and the power supply device can be integrally configured.
[0040]
The present invention is not limited to the embodiment described above and shown in the drawings, and the following modifications or extensions are possible.
Series to a plurality of coil patterns 40 in the second embodiment, the parallel connection switching embodiment is an example, be tied in advance how each coil pattern 40, how switch in series, the parallel connection by the switching unit May be appropriately changed according to the individual design.
The configuration of the power supply device 36 in the second embodiment may be applied to an operation power supply of the IC card 11 in the first embodiment.
In the second embodiment, the control circuit of the electronic device 35 simply informs the power supply device 36 of only the excess and deficiency of the voltage level and the current level, and the control IC 39 adjusts the coil pattern 40 in response to the notification. You may determine whether to connect in parallel.
[0041]
The power supply device is not limited to the configuration of the second embodiment, and may be configured to supply the electric power received in the configuration of the first embodiment to an electronic device.
In the second and third embodiments, the power supply device may charge a secondary battery included in the electronic device.
When the electronic device includes a solar cell, the electronic device may be configured to be used together with a power source obtained from the solar cell.
In the fourth embodiment, a display 58 may be arranged on the upper lid 57 side.
[Brief description of the drawings]
FIGS. 1A and 1B show a first embodiment in which the present invention is applied to an IC card, wherein FIG. 1A is a plan view showing the inside of the IC card as seen through, and FIG. 1B is a side view (thickness is slightly enlarged). FIG. 2C is an enlarged view of AA ′ section shown in FIG. 2A. FIG. 2 is a diagram showing a state in which a card reader reads data from an IC card. FIG. FIG. 4 is a view showing a process. FIG. 4 is a view showing two base substrates which are arranged on top of each other and are directly connected via contact points, on the same surface side. FIG. 5 shows a connection state of each layer coil pattern after lamination. FIG. 6 is a diagram showing an example of material properties of a thermoplastic resin film. FIG. 7 is a diagram showing a pressing condition of the thermoplastic resin film. FIG. 8 is a second embodiment of the present invention, and is an entire power supply system. FIG. 9 is a plan view of one layer of a base substrate. FIG. FIG. 11 is a simplified view for explaining the connection switching mode of the coil pattern. FIG. 11 is a three-dimensional perspective view showing the connection state of the coil pattern of each layer. FIG. FIG. 13 is a diagram showing a state where an output voltage and an output current change in accordance with the number of connections when the connection is made; FIG. 13 is a perspective view showing an electronic device and a power supply device according to a third embodiment of the present invention; FIG. 13 corresponding to FIG. 13 showing a fourth embodiment of the present invention. FIG. 15 is a diagram showing an upper lid portion of an electronic device including a power supply device. FIG. 16 is a diagram corresponding to FIG. 1 showing the configuration of a conventional IC card. Figure equivalent to Figure 2 [Explanation of reference numerals]
11 is an IC card, 12 is a thermoplastic resin film, 13 is a coil pattern (antenna coil), 16 is a base substrate (coil arrangement layer), 23 is a card reader (external device), 32 is a power transmission device (external device), 35 is an electronic device, 36 is a power supply device, 37 is a base substrate (coil arrangement layer), 38 is a coil pattern (antenna coil), 39 is a control LSI (control means), 40 is a coil pattern (antenna coil), 42 is A switching unit, 51 is an electronic device, 52 is a power supply device, 55 is an electronic device, and 56 is a power supply device.

Claims (7)

In a non-contact type IC card that is powered by an external device that transmits power using a wireless signal and communicates with the external device,
The antenna coil for receiving the radio signal is configured by stacking a plurality of coil arrangement layers arranged in a plane, and the antenna coils arranged in each of the layers are electrically connected. Characteristic IC card. Arrange a plurality of antenna coils in one coil arrangement layer,
A switching unit for switching a connection between the plurality of antenna coils in series and in parallel;
2. The IC card according to claim 1, further comprising control means for controlling switching in said switching section. The said coil arrangement | positioning layer is comprised by the thermoplastic resin as a base material, The heating and pressurization are performed collectively in the state which laminated | stacked several layers, The molding is characterized by the above-mentioned. Item 3. The IC card according to item 1 or 2. The antenna coil for receiving the radio signal transmitted by the external device is configured by stacking a plurality of coil arrangement layers in which the antenna coil is arranged in a plane, and the antenna coils arranged in each of these layers are electrically connected. A power supply device for an electronic device, which supplies the received power to an electronic device configured to be portable. Arrange a plurality of antenna coils in one coil arrangement layer,
A switching unit for switching a connection between the plurality of antenna coils in series and in parallel;
The power supply apparatus for an electronic device according to claim 4, further comprising control means for controlling switching in the switching unit. The said coil arrangement | positioning layer is comprised by the thermoplastic resin as a base material, The heating and pressurization are performed collectively in the state which laminated | stacked several layers, The molding is characterized by the above-mentioned. Item 6. A power supply device for an electronic device according to item 4 or 5. A power supply device according to any one of claims 4 to 6,
An electronic device, which is operated by being supplied with power by the power supply device and is configured to be portable.

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