JP2004126533A - Method for adjusting optical axis direction of lens - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately adjust the position of a lens arranged on the light emitting side of a semiconductor laser in an optical axis direction (Z-axis direction). <P>SOLUTION: A collimator lens 5 is aligned in the Z-axis direction as follows. A holder 6 is moved in the Z-axis direction by a tool at the edge of which a thin blade part is formed, and stopped at a place where the position of the lens 5 in the optical axis direction is optimum for the semiconductor laser 1. An adhesive 8 is applied to space between the holder 6 and a fixed base 3, and the semiconductor laser 1 is made to emit light so as to irradiate the adhesive 8 with emitted light. The adhesive is half-hardened by the action of a photosensitive agent mixed in the adhesive 8 and having sensitivity in the wavelength of emitted light, so that the holder 6 is temporarily fixed on the base 3. Then, the tool is pulled out and the adhesive is irradiated with the emitted light from the semiconductor laser 1 in a temporary adhesive state or after applying the adhesive again, whereby the holder 6 is firmly fixed on the fixed base. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides a configuration in which the position of a lens such as a collimator lens disposed on the light emitting side of a semiconductor light emitting element in the optical axis direction (Z-axis direction) is accurately adjusted. The present invention relates to a method of adjusting the direction of the optical axis of a lens to be performed.
[0002]
[Prior art]
A collimator lens is provided on the light emission side of the semiconductor laser for the purpose of converting light emitted from the semiconductor laser to parallel light and transmitting the light. This collimator lens is arranged while being held by a holder. In order to improve the parallelism when converting the light emitted from the semiconductor laser into parallel light, the position of the collimator lens in the optical axis direction (Z-axis direction) with respect to the semiconductor laser is adjusted by moving the holder.
[0003]
FIG. 6 is a schematic plan view showing an example of a conventional method of adjusting the optical axis direction of a collimator lens. In FIG. 4, a semiconductor laser (LD) 10 is attached to a fixed base 12, and has lead terminals 11 protruding from the fixed base 12. A space 13 is formed inside the fixed base 12, and a screw portion 14 is provided on an inner periphery thereof.
[0004]
The collimator lens 15 is fixed to one end of the holder 16. The holder 16 has a screw portion 17 formed on the side opposite to the fixed side of the collimator lens 15, and a hollow portion 18 is formed inside the screw portion 17.
[0005]
The screw portion 17 of the holder 16 enters the space 13 of the fixing base 12, and the screw portion 17 of the holder 16 and the screw portion 14 of the fixing base 12 are engaged. The holder 16 is approached to the semiconductor laser 10 while being screwed. The collimator lens 15 stops the advance of the holder 14 at an optimum position in the optical axis direction of the semiconductor laser (LD) 10. Light emitted from the semiconductor laser (LD) 10 passes through the hollow portion 18 of the screw portion 17 and is guided to the collimator lens 15.
[0006]
[Problems to be solved by the invention]
In the NA0.3 type collimator lens, the adjustment accuracy in the Z-axis direction needs to be 1 μm or less. However, as described above, when the screw portion 14 of the fixing base 12 of the semiconductor laser (LD) 10 is engaged with the screw portion 17 of the holder 16, factors such as the processing accuracy of the screw portions existing in the both are required. However, there is a problem that the adjustment accuracy is deteriorated due to rattling of, for example, about 4 μm.
[0007]
The present invention has been made in view of the above problems, and has as its object to provide a method of adjusting the direction of the optical axis of a lens such as a collimator lens in which the adjustment accuracy in the optical axis direction (Z-axis direction) is improved.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a method of adjusting the optical axis direction of a lens according to the present invention includes:
(1) arranging a holder provided with a groove and holding a lens at a predetermined position separated from the semiconductor light emitting element;
(2) moving the holder in the optical axis direction by bringing a thin blade portion formed at the tip of the tool into contact with the groove;
(3) stopping the movement of the holder when the position of the collimator lens in the optical axis direction with respect to the semiconductor light emitting element is an optimum position, and slightly moving the tool backward;
(4) applying an adhesive mixed with a photosensitive agent sensitive to an emission wavelength between the holder and the fixing means of the semiconductor light emitting element;
(5) causing the semiconductor light emitting element to emit light, irradiating the adhesive with outgoing light, temporarily bonding the adhesive, and temporarily fixing the holder to the fixing means;
(6) extracting the tool from the groove;
(7) permanently bonding the adhesive and firmly fixing the holder to the fixing means;
It is characterized by comprising. For this reason, it is possible to accurately adjust the position of the lens in the optical axis direction with respect to the semiconductor light emitting element without generating an error due to the processing accuracy of the component as in the related art. Also, when the holder holding the lens is temporarily bonded to the fixing means, the light emitted from the semiconductor light emitting element built in the device which is fixed to the fixing means and used as various optical devices without using an external light source is used. As a result, the cost can be saved, the use efficiency of the semiconductor light emitting element can be improved, and the position of the lens can be quickly adjusted with a simple configuration. The step (3) may be performed after the step (4) or after the step (5).
[0009]
The method for adjusting the optical axis direction of a lens according to claim 2 of the present invention is characterized in that:
(8) reapplying the adhesive or an adhesive different from the adhesive between the holder and the fixing means;
(9) performing the step of photo-curing the adhesive. For this reason, since the temporary bonding is performed and the actual bonding is performed by photo-curing utilizing the characteristics of the adhesive mixed with a photosensitive agent having sensitivity to the emission wavelength, the position of the lens can be adjusted efficiently.
[0010]
The method for adjusting the optical axis direction of a lens according to a third aspect of the present invention is characterized in that the temporary bonding of the adhesive is performed by photo-curing the adhesive. As described above, even in the temporary bonding, the bonding by photo-curing is performed utilizing the characteristics of the adhesive mixed with the photosensitive agent having sensitivity to the emission wavelength. For this reason, the position of the lens can be adjusted efficiently at the stage of temporary bonding.
[0011]
The method for adjusting the optical axis direction of a lens according to a fourth aspect of the present invention is characterized in that the time for photo-curing the adhesive is set to be longer for the permanent bonding than for the temporary bonding. As described above, since the time for photo-curing by permanent bonding is set to be long, the holder can be fixed to the fixing means with sufficient strength.
[0012]
The method for adjusting the optical axis direction of a lens according to claim 5 of the present invention is characterized in that the curing of the adhesive is performed by irradiating the adhesive with light emitted from the semiconductor light emitting element. For this reason, the emitted light of the semiconductor light emitting element is used not only for temporary bonding of the adhesive but also for actual bonding, so that the use efficiency of the semiconductor light emitting element built in the device can be further improved.
[0013]
The method for adjusting the optical axis direction of a lens according to claim 6 of the present invention is characterized in that the outgoing light of the semiconductor light emitting element is outgoing light by pulse oscillation. As described above, since the light emitted by the pulse oscillation is irradiated onto the adhesive and the holder is temporarily or permanently bonded to the fixing means, the position of the lens can be accurately adjusted.
[0014]
The method for adjusting the optical axis direction of a lens according to claim 7 of the present invention is such that the light curing of the adhesive is performed by irradiating the adhesive with light emitted from another light source different from the semiconductor light emitting element. Features. For this reason, it is possible to irradiate the adhesive with a sufficient amount of light to cause the photosensitive agent to act, and to firmly perform the actual bonding.
[0015]
The method of adjusting the optical axis direction of a lens according to claim 8 of the present invention is characterized in that the actual bonding of the adhesive is performed by thermally curing the temporarily bonded adhesive. For this reason, the adhesive can be thermoset using a high-temperature bath or the like, and the holder can be permanently bonded to the fixing means.
[0016]
The method of adjusting the optical axis direction of a lens according to claim 9 of the present invention is characterized in that the degree of curing when the adhesive is fully bonded is larger than the degree of curing when the adhesive is temporarily bonded. . At the stage of temporary bonding, fine adjustment is required at the stage of final bonding. Therefore, the degree of curing of the adhesive is reduced, and rational position adjustment of the lens in the optical axis direction can be performed.
[0017]
The method for adjusting the optical axis direction of a lens according to claim 10 of the present invention, wherein the semiconductor light emitting element is disposed next to a light emitting layer,
Wherein the _{In x Al y Ga 1-x} -y N (0 ≦ x, 0 ≦ y, x + y <1), a nitride-based semiconductor light-emitting device using. Therefore, by applying an adhesive mixed with a photosensitive agent having sensitivity to a predetermined wavelength, for example, an emission wavelength near 400 nm, the holder can be securely fixed to the fixing base, and the lens can be prevented from being displaced.
[0018]
A method for adjusting the optical axis direction of a lens according to an eleventh aspect of the present invention is characterized in that a groove having a V-shaped cross section is provided on a mounting plate of the lens, and the lens is moved along the groove. For this reason, the holder does not move in the X-axis and Y-axis directions, and the position of the lens in the Z-axis direction can be stably adjusted.
[0019]
According to a twelfth aspect of the present invention, in the method for adjusting the optical axis direction of a lens, the lens is a collimator lens. As described above, since the optical axis direction of the collimator lens is adjusted, light emitted from the semiconductor light emitting element can be converted into parallel light with high accuracy and propagated.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described below with reference to the drawings. In the basic configuration of the present invention, the holder is moved in the Z-axis direction with a tool having a thin blade portion formed at the tip, and the holder is positioned where the position of the collimator lens in the optical axis direction with respect to the semiconductor light emitting element is optimal. Stop. Next, an adhesive is applied between the holder and the fixing means of the semiconductor light emitting element, and the semiconductor light emitting element is caused to emit light and the adhesive is irradiated with outgoing light. Subsequently, the adhesive is temporarily bonded by the action of a photosensitive agent having sensitivity to the emission wavelength mixed into the adhesive, and the holder is temporarily fixed to the fixing means. Finally, the tool is pulled out, an adhesive is applied again, and heat curing is performed to firmly fix the holder to the fixing table.
[0021]
FIG. 1 is a schematic plan view showing a configuration example of the present invention, and FIG. 2 is an explanatory diagram showing a relationship between a tool and a holder. In FIG. 1, a semiconductor laser (LD) 1 is attached to a fixed base 3 with a lead terminal 2 protruding. The fixing base 3 is formed in a substantially inverted U shape in cross section. A collimator lens 5 is supported at one end of a holder 6 having a groove 7 formed near the center. The semiconductor laser 1 attached to the fixed base 3 emits light, and can be used as various optical devices.
[0022]
The holder 6 has an opening 6 a through which light emitted from the semiconductor laser 1 passes. The holder 6 is arranged on a mounting table (not shown) in the space 4 formed inside the fixing table 3. The mounting table is formed in a planar shape. Next, the holder 6 is moved in the optical axis direction (Z-axis direction) as described later. The holder 6 is stopped at an optimum position with respect to the semiconductor laser 1.
[0023]
The optimum position of the holder 6 with respect to the semiconductor laser 1 is when the semiconductor laser 1 is located at the focal point of the collimator lens 5. At this time, the collimator lens 5 converts the light of the semiconductor laser 1 into a parallel ray R with high accuracy. The optimum position of the collimator lens 5 with respect to the semiconductor laser 1 can be determined by causing the semiconductor laser 1 to emit light and observing it on a monitor.
[0024]
At the position where the holder 6 is stopped, the adhesive 8 is applied between the outer periphery 6x of the holder 6 and one inner wall 3a of the fixing base 3. A photosensitive agent having sensitivity to the emission wavelength of the semiconductor laser 1 is mixed in the adhesive 8. This photosensitive agent contains, for example, a material having sensitivity to a wavelength of about 400 nm.
[0025]
As the semiconductor laser 1, for example, a nitride-based semiconductor laser that emits blue-violet light using InGaN for a light emitting layer is used. The emission wavelength of the semiconductor laser 1 is, for example, 405 nm. When the semiconductor laser 1 emits light, a part of the emitted light irradiates the adhesive 8, and the light acts on the photosensitive agent to temporarily adhere the adhesive 8. For this reason, the collimator lens 5 is temporarily fixed to the fixed base 3 with the adhesive 8 in a state where the position in the optical axis direction is adjusted.
[0026]
Thus, in the present invention, it is not necessary to use an external light source for the temporary bonding of the adhesive 8 mixed with a photosensitive agent having sensitivity to the emission wavelength. The semiconductor laser 1 built in the device used as various optical devices is also used as a temporary bonding means for the adhesive 8. For this reason, the use efficiency of the semiconductor laser 1 is improved and the configuration is inexpensive and simple. The holder 6 is moved to the installation location of the external light source, and the position of the adhesive 8 and the position of the external light source are aligned. Is unnecessary, so that the processing time can be shortened.
[0027]
The adhesive 8 is made of a material that hardly shrinks during curing. This is because the use of an adhesive having a large shrinkage at the time of hardening causes the holder to move at the time of hardening of the adhesive, so that the position of the collimator lens cannot be adjusted accurately. If the adhesive 8 is irradiated with a large optical power for a short time, for example, about 1 second, and hardened, the adhesive shrinks, the holder moves, and the position of the collimator lens cannot be adjusted accurately. For this reason, the adhesive 8 is irradiated with the weak light that is the leakage light of the semiconductor laser, which is the light source in the optical device, for a long time of about 5 to 10 seconds to cure the adhesive 8.
[0028]
FIG. 2 is an explanatory diagram of a tool used to move the holder 6 in the Z-axis direction. In FIG. 2, a tool 20 is provided with a handle 21 and a rod 22. A thin blade portion 23 is formed at the tip of the rod 22, and the tool 20 has a minus driver shape as a whole.
[0029]
The width direction dimension Ta of the groove 7 formed in the holder 6 is about 2 mm. The thickness Tb of the thin blade portion 23 formed at the tip of the tool 20 in the thickness direction is, for example, about 0.5 mm. The operator presses the thin blade portion 23 against the groove 7 to move the holder 6 in the Z-axis direction. At this time, the moving pitch has a resolution of about ± 0.5 μm.
[0030]
As described above, the dimension Ta of the groove 7 formed in the holder 6 is increased to about four times the dimension Tb in the thickness direction of the thin blade portion 23 formed at the tip of the tool 20. This is for the following reasons. That is, since the moving pitch of the holder 6 by the tool 20 is extremely small, about ± 0.5 μm, if the dimensions of both are selected so that Ta is slightly larger than Tb, the holder 6 is adjusted to the optimum position in the Z-axis direction. Thus, when the thin blade portion 23 of the tool 20 is pulled out from the groove 7, the force is transmitted to the holder 6 by the upward movement of the thin blade portion 23, and the holder 6 also moves.
[0031]
Next, an example of the method of adjusting the axial direction of the collimator lens according to the present invention will be described.
[0032]
The holder 6 is arranged on the mounting plate at a position separated from the semiconductor laser 1 by a predetermined distance. For this position, a position close to the optimum position may be indicated in advance on the mounting plate by marking or the like. Next, the thin blade portion 23 of the tool 20 is brought into contact with the groove 7 of the holder 6, and the holder 6 is moved in the Z-axis direction while holding the handle 21 of the tool 20.
[0033]
The position of the holder 6 is adjusted so that the semiconductor laser 1 emits light and the semiconductor laser 1 is positioned at the focal point of the collimator lens 5 while observing the monitor. After confirming that the collimator lens 5 is at the optimum position with respect to the semiconductor laser 1, the tool 20 is moved backward slightly, for example, by about 0.5 μm for one pitch.
[0034]
The reason why the tool 20 is slightly moved backward at the optimum position of the holder 6 as described above is as follows. The thin blade portion 23 of the tool 20 is brought into contact with a side wall on the front side in the traveling direction of the groove 7 of the holder 6 to advance the holder 6. When the collimator lens 5 reaches the optimum position with respect to the semiconductor laser 1, the holder 6 is stopped. At this time, when the tool 20 is extracted in a state where the thin blade portion 23 of the tool 20 is in contact with the front wall of the holder 6 in the traveling direction of the groove 7, friction between the side wall of the groove 7 and the thin blade portion 23 is reduced. This causes the holder 6 to move. By moving the tool 20 backward, the friction does not occur, and the movement of the holder 6 can be prevented.
[0035]
When the holder 6 is stopped at the optimum position and the tool 20 is moved backward, an appropriate amount of the adhesive 8 is applied between the outer periphery of the holder 6 and one inner wall 3a of the fixed base 3. Next, the semiconductor laser 1 emits light. The adhesive 8 is irradiated with leakage light, which is a part of the light emitted from the semiconductor laser 1, for about 5 to 10 seconds to cause light to act on the photosensitive agent mixed in the adhesive 8. The adhesive 8 is temporarily adhered by being left as it is for a while, and the holder 6 is temporarily fixed to the fixing base 3.
[0036]
After that, the tool 20 is pulled out of the groove 7 of the holder 6. The width of the groove 7 is sufficiently larger than the thickness of the thin blade portion formed at the tip of the tool 20, and the holder 6 is temporarily fixed to the fixed base 3, so that the tool 20 is pulled out from the groove 7. Also, the holder 6 does not move from the optimum position.
[0037]
Next, in a state where the holder 6 is temporarily bonded with the adhesive 8 and temporarily fixed to the fixing table 3, the entire apparatus is placed in a high-temperature bath, and is thermally cured with the adhesive 8 to perform the actual bonding. Since the holder 6 is temporarily fixed to the fixed base 3, the holder 3 does not move even if the fixed base 3 is moved during the actual bonding process, and therefore, the adjustment position of the collimator lens 5 in the Z direction does not shift. .
[0038]
In addition, the following method can be adopted for the permanent bonding of the holder 6. That is, an appropriate amount of the adhesive 8 is applied again between the outer periphery of the holder 6 and one inner wall 3a of the fixing base 3. As this adhesive, an adhesive of the same type as used for the temporary bonding or an adhesive of a different type from the adhesive can be used. Subsequently, the semiconductor laser 1 is caused to emit light, and the emitted light is applied to the adhesive 8 for about 10 seconds. In this manner, by applying the adhesive again and irradiating the emitted light of the semiconductor laser 1, the adhesive 8 is light-cured, and the holder 6 can be firmly permanently bonded to the fixing base 3 and fixed. In this case, since the emitted light of the semiconductor light emitting element is used for the temporary bonding together with the temporary bonding of the adhesive, the use efficiency of the semiconductor light emitting element built in the device can be further improved.
[0039]
The main bonding process by photo-curing of the adhesive 8 can use not only the emitted light of the semiconductor laser 1 but also the emitted light of an external light source such as an ultraviolet irradiation device. In this case, it is possible to irradiate the adhesive with a sufficient amount of light to cause the photosensitive agent to act, and to perform the actual bonding firmly.
[0040]
In the present invention, by performing the above-described position adjustment in the Z-axis direction, the collimator lens 5 can be installed in the optical axis direction with an accuracy of about 1 μm with respect to the semiconductor laser 1. .
[0041]
FIG. 3 is a schematic explanatory diagram showing a configuration according to another embodiment of the present invention. This figure shows a side view of the holder 6 arranged as shown in FIG. 1 when viewed from the semiconductor laser 1 side.
[0042]
In the example of FIG. 3, a groove 24 having a V-shaped cross section is formed in the mounting table 25. The holder 6 is placed in the V-shaped groove 24. Since the holder 6 is moved in the Z-axis direction along such a V-shaped groove 24, the holder 6 is moved in the X-axis direction (the direction on the inner wall 3a side of the fixing base 3 shown in FIG. 1) and the Y-axis direction (the paper surface). (In the direction perpendicular to the axis), the position of the collimator lens 5 in the Z-axis direction can be stably adjusted.
[0043]
Although not shown, the position of the collimator lens 6 in the X-axis direction can be adjusted, for example, by applying a spring force of a spring member to the holder 6.
[0044]
In FIG. 1, a fixing base 3 for fixing a semiconductor laser 2 is formed in an inverted U-shape in cross section, and an adhesive 8 is applied between an inner wall 3a thereof and an outer periphery 6x of the holder 6. In the present invention, the shape of the fixing means of the semiconductor laser 2 is not limited to the shape shown in FIG. 1, and various shapes can be used.
[0045]
In the above description, the emitted light of the semiconductor laser is used for the temporary bonding of the collimator lens. The present invention is not limited to the semiconductor laser, and the temporary bonding of the collimator lens can be performed by using the light emitted from a semiconductor light emitting element such as a light emitting diode (LED).
[0046]
Further, the semiconductor light emitting device of the present invention, the following in the light emitting layer,
_{In x Al y Ga 1-x} -y N (0 ≦ x, 0 ≦ y, x + y <1), can be applied to nitride-based semiconductor light-emitting device using.
[0047]
Next, another embodiment of the present invention will be described. FIG. 4 is a characteristic diagram illustrating an example of a waveform of light emitted from the semiconductor laser 1. In this example, the semiconductor laser 1 is pulse-oscillated to form emitted light having an on-off pulse waveform. As described above, since the light emitted by the pulse oscillation is irradiated onto the adhesive and the holder is temporarily or permanently bonded to the fixing means, the position of the lens can be accurately adjusted.
[0048]
In the present invention, as the combination of the material of the adhesive and the wavelength of the light to be irradiated for photocuring the adhesive, in the actual bonding, an adhesive of a material different from that of the temporary bonding is used, and the light having a wavelength different from that of the temporary bonding is used. Can be used to make the adhesive light-cured. For example, the temporary bonding is performed with visible light of the semiconductor light emitting element, and the final bonding is performed with ultraviolet light. At this time, the curing wavelength band of the adhesive that cures with ultraviolet light is set to 350 to 380 nm, and the curing wavelength band of the adhesive that cures with visible light is set to 380 to 800 nm.
[0049]
FIG. 5 is a characteristic diagram showing an example of the wavelength of light applied to light cure the adhesive. (A) is a light intensity characteristic, (b) is the figure which expanded the characteristic of (a) partially. A waveform I in (a) is a waveform when power is applied to the semiconductor laser so as to output laser light having a value equal to or less than the oscillation threshold, and LED light is emitted. The wavelength of the laser light is 400 nm.
[0050]
At this time, the LED light has a broad light intensity distribution as shown in the enlarged view (b), and thus has a weak light intensity of 380 nm or less. In the embodiment of the present invention, the first adhesive a is applied between the holder and the fixing means. Next, power equal to or lower than the oscillation threshold is applied to the semiconductor laser to emit LED light. Using this light, the holder and the fixing means are temporarily bonded. After the position adjustment, the film is irradiated with 365 nm by an ultraviolet light irradiation device, and is permanently bonded. In this case, the adhesive a to be temporarily bonded is permanently bonded as it is. The adhesive a is cured by ultraviolet light.
[0051]
Another embodiment using the light intensity characteristic as shown in FIG. 5 will be described. First, an adhesive b that cures with visible light is applied between the holder and the fixing means. Next, power equal to or lower than the oscillation threshold is applied to the semiconductor laser to emit LED light. Using this light, the holder and the fixing means are temporarily bonded. After the position adjustment, the adhesive a that is cured by the ultraviolet light is applied to a position different from the position of the adhesive b. Then, power equal to or higher than the oscillation threshold value is supplied to the semiconductor laser to emit a laser beam, and the semiconductor laser is permanently bonded with the adhesive a. In this embodiment, a semiconductor laser that emits ultraviolet light of about 370 nm is used for the final bonding. As described above, in a configuration in which external light is not used for photocuring, there is an advantage that bonding can be performed in a place where light does not reach from the outside. For example, an adhesive may be applied to the V-groove described with reference to FIG. 3 to fix the holder and the fixing means.
[0052]
In another embodiment of the present invention, the time for photo-curing the adhesive is set to be longer for the main bonding than for the temporary bonding. For example, the light curing time of the temporary bonding is 5 seconds, and the light curing time of the final bonding is 10 seconds. As described above, since the time for photo-curing by the permanent bonding is set to be longer than the time for the temporary bonding, the holder can be fixed to the fixing means with sufficient strength.
[0053]
In the embodiment of the present invention, it is most preferable to irradiate light having a wavelength for main bonding to a portion of the adhesive provided for temporary bonding. In this case, an adhesive having a higher degree of curing with respect to the wavelength for final bonding than the wavelength for temporary bonding is used. However, in the embodiment of the present invention, the same adhesive may be provided at a location different from the location of the adhesive provided for the temporary bonding, and the light of the wavelength for the final bonding may be irradiated.
[0054]
As described above, in the embodiment of the present invention, (1) the material of the adhesive is any one of a material that cures with ultraviolet light, a material that cures with visible light, and a material that cures with heat (2) the adhesive is cured The means may be a semiconductor light emitting element (laser light), external light having a different wavelength from the laser light, or thermosetting. (3) Whether the position where the adhesive is applied is the same or different between the temporary bonding and the actual bonding (4) Optimal position adjustment can be performed by appropriately selecting each of the options of the irradiation time of light for curing the adhesive between the temporary bonding and the main bonding between the temporary bonding and the main bonding. At this time, as a concept that can include all of the options, "when the temporary bonding and the real bonding are compared, the degree of hardening by the real bonding is higher".
[0055]
In the above description, the lens is a collimator lens. However, the lens applied in the present invention is not limited to a collimator lens. For example, a condenser lens and a cylindrical lens can be included. That is, the present invention is directed to a "lens for forming a laser beam including parallel and condensed light" as a collective term when these lenses are grouped together.
[0056]
【The invention's effect】
As described above in detail, according to the present invention, it is possible to accurately adjust the position of a lens with respect to a semiconductor light emitting element in the optical axis direction without causing an error caused by processing accuracy of a component as in the related art. it can. Also, when the holder holding the lens is temporarily bonded to the fixing base, the light emitted from the semiconductor light emitting element built into the apparatus, which is fixed to the fixing base and used as various optical devices, without using an external light source, is used. As a result, the cost can be saved, the use efficiency of the semiconductor light emitting element can be improved, and the position of the lens can be adjusted with a simple configuration. Further, the processing time can be reduced. As the semiconductor light-emitting element, the light-emitting _{layer, In x Al y Ga 1-} x-y N (0 ≦ x, 0 ≦ y, x + y <1), since it uses a nitride semiconductor light emitting device using, The holder can be temporarily bonded to the fixing base by applying an adhesive mixed with a photosensitive agent having sensitivity to the emission wavelength.
[Brief description of the drawings]
FIG. 1 is a schematic plan view of a configuration according to an embodiment of the present invention.
FIG. 2 is an explanatory diagram showing a relationship between a holder and a tool.
FIG. 3 is a schematic explanatory diagram showing a configuration according to another embodiment of the present invention.
FIG. 4 is a characteristic diagram showing a pulse waveform.
FIG. 5 is a characteristic diagram showing light intensity characteristics.
FIG. 6 is a schematic plan view showing an example of an optical axis direction adjusting method of a conventional collimator lens.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Semiconductor laser 2 ... Lead terminal 3 ... Fixed base 3a ... Inner wall 4 ... Space part 5 ... Collimator lens 6 ... Holder 6a ... Hollow part 7 ... Groove 8 Adhesive 10 Semiconductor laser 11 Lead terminal 12 Fixed frame 13 Opening 14 Screw part 15 Collimator lens 16 Holder 17 ..Screw part 18 hollow part 20 tool 21 handle 22 rod 23 thin blade part 24 V-shaped groove 25 mounting plate

Claims (12)

(1) arranging a holder provided with a groove and holding a lens at a predetermined position separated from the semiconductor light emitting element;
(2) moving the holder in the optical axis direction by bringing a thin blade portion formed at the tip of the tool into contact with the groove;
(3) stopping the movement of the holder when the position of the lens in the optical axis direction with respect to the semiconductor light emitting element is at an optimum position, and slightly moving the tool backward;
(4) applying an adhesive mixed with a photosensitive agent sensitive to an emission wavelength between the holder and the fixing means of the semiconductor light emitting element;
(5) causing the semiconductor light-emitting element to emit light, irradiating the adhesive with outgoing light, temporarily bonding the adhesive, and temporarily fixing the holder to the fixing means;
(6) extracting the tool from the groove;
(7) firmly fixing the holder to the fixing means by permanently bonding the adhesive;
A method for adjusting the direction of the optical axis of a lens, comprising: The actual bonding of the adhesive is
(8) reapplying the adhesive or an adhesive different from the adhesive between the holder and the fixing means;
(9) The method for adjusting the optical axis direction of a lens according to claim 1, further comprising the step of: curing the adhesive with light. The method according to claim 1, wherein the temporary bonding of the adhesive is performed by light-curing the adhesive. 4. The method for adjusting the optical axis direction of a lens according to claim 3, wherein the time for photo-curing the adhesive is set to be longer for permanent bonding than for temporary bonding. The method for adjusting the optical axis direction of a lens according to any one of claims 2 to 4, wherein the photo-curing of the adhesive is performed by irradiating the adhesive with light emitted from the semiconductor light emitting element. . The method according to claim 5, wherein the light emitted from the semiconductor light emitting element is light emitted by pulse oscillation. The method for adjusting the optical axis direction of a lens according to claim 3, wherein the light curing of the adhesive is performed by irradiating light emitted from another light source different from the semiconductor light emitting element to the adhesive. The method according to claim 1, wherein the actual bonding of the adhesive is performed by thermally curing the temporarily bonded adhesive. 9. The optical axis of the lens according to claim 1, wherein the degree of curing when the adhesive is fully bonded is larger than the degree of curing when the adhesive is temporarily bonded. Direction adjustment method. The semiconductor light emitting element of the next to the light-emitting layer _{In x Al y Ga 1-x} -y N (0 ≦ x, 0 ≦ y, x + y <1)
The method for adjusting the optical axis direction of a lens according to claim 1, wherein the method is a nitride-based semiconductor light emitting device using The optical axis of the lens according to claim 1, wherein a groove having a V-shaped cross section is provided on the mounting plate of the lens, and the lens is moved along the groove. Direction adjustment method. The method for adjusting the optical axis direction of a lens according to claim 1, wherein the lens is a collimator lens.

Images