JP2004087582A - Method for managing circuit board, method for fixing tag chip, and electronic circuit production system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for managing a circuit board inexpensively and efficiently in an electronic circuit production system. <P>SOLUTION: In a component mounter located upstream an electronic circuit production system, a tag chip 300 is mounted on a circuit board 52 similarly to an electronic component, and an ID code is written to that tag chip 300 by means of a reader/writer. In correspondence to that ID code, inherent information of the circuit board 52, e.g. relative position of the reference mark 266 of each child substrate part 260 to the reference mark 262 of the entire circuit board 52, is stored in the computer, or the like, in a system controller. In a component mounter downstream, the ID code is read in by means of the reader/writer and inherent information previously associated therewith is called and utilized. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to management of a circuit board on which electronic circuit components are mounted to form an electronic circuit, and more particularly to a method of assigning an identification code to a circuit board and managing the circuit board based on the identification code. is there.
[0002]
[Prior art]
In the manufacture of electronic circuits, cream solder applicators, adhesive applicators, electronic circuit component mounting machines, automatic inspection machines, reflow furnaces, etc. are sequentially arranged from the upstream side to the downstream side, and an electronic circuit configured as an integrated line It is often performed using a component mounting system. A predetermined operation is sequentially performed in each device on the circuit board carried into such a system, and the circuit board is formed as an electronic circuit. Each work machine constituting this electronic circuit production system may be configured to perform work based on information unique to the circuit board to be worked, and in this case, each work machine is provided with some kind of information attached to the circuit board. There is a case where the unique information is obtained by reading a display or the like. For example, when the circuit board is a so-called “multi-board” in which a plurality of sub-boards are assembled to form one board, information on the relative position of each of the sub-boards on the circuit board corresponds to the unique information, Such relative position information is acquired by, for example, capturing an image of a reference mark provided on the circuit board and each of the daughter boards by an imaging device that captures an image of the board surface, and performing image processing on the obtained image data.
[0003]
In the case of the multi-substrate, when the circuit pattern of some of the sub-boards is defective, the unique information further includes information indicating that the sub-board is a work unnecessary area. If operations such as applying creamy solder and mounting electronic circuit components are performed on the daughter board, the operations themselves are not only wasted, but also defective products are manufactured. Therefore, in this case, it is desirable that information for preventing work from being performed on some of the sub-boards is supplied to each work machine, and it is determined whether or not work is required for each of the plurality of specific work areas. The necessity / unnecessity determination information for performing this is the unique information.
[0004]
As described above, in the multi-board, it is effective to treat each sub-board as a specific work area, but considering the specific work area is not only effective in the case of a multi-board. For example, when there is an electronic circuit component requiring particularly high mounting position accuracy in one circuit pattern, one or more reference marks are provided at a position on the circuit board near the position where the electronic circuit component is mounted. However, if the mounting operation is performed based on the position of the reference mark, the mounting position accuracy of the electronic circuit components can be increased. In this case, the electronic circuit components requiring particularly high mounting position accuracy can be improved. It is convenient to treat the mounted area as a specific work area.
[0005]
In the conventional electronic circuit production system, the above-described unique information is obtained by recognizing and acquiring itself for each work machine requiring the information, and each work machine is configured based on the acquired unique information. Had to do the scheduled work. On the other hand, according to Japanese Patent Application No. 2001-288617, the present applicant provides a bar code or a two-dimensional code representing an identification code of each circuit board on each circuit board, and reads these codes with a code reader or the like to thereby obtain individual circuit boards. The unique information of each circuit board is stored in a storage device of a computer that controls the electronic circuit component mounting system in association with the identification code, and the information is supplied to each work machine so that the circuit can be identified. It is proposed to use it for the manufacture of. In this way, if the upstream machine among the plurality of working machines constituting the electronic circuit production system acquires the unique information, the downstream working machine does not need to perform the work of acquiring the unique information. The work efficiency of the entire circuit production system is improved.
[0006]
Although the information specific to each circuit board has been described above, it may be effective to supply information common to circuit boards of the same type to each work machine in association with the identification code of each circuit board. For example, a program for mounting electronic circuit components on a circuit board is selected and executed based on the identification code of the circuit board. When the work of mounting electronic circuit components on a predetermined number of circuit boards is completed, the mounting program may be changed to one for the next type of circuit board. However, in this case, for example, if some circuit boards are removed from the board transfer device by an operator for some reason, there is a possibility that the mounting work may be performed by an incorrect mounting program. If the mounting program is selected based on the identification code of the circuit board, such a situation can be reliably avoided.
[0007]
Problems to be Solved by the Invention, Means for Solving Problems, and Effects
As described above, it is effective to assign an identification code to each circuit board, but in order to use a barcode or two-dimensional code as in the past, stick a sticker such as a barcode on the circuit board. Or, a device for printing a barcode or the like is required, and there is a problem that equipment cost is increased. Further, in recent years, circuit boards have been downsized along with downsizing of electronic devices, and it has become difficult to secure a space for providing a barcode or the like. Further, in order to recognize a barcode or the like, it is necessary to make the barcode or the like face a recognition device such as a barcode reader, which may take a long time to reduce the work efficiency.
[0008]
The present invention is based on the above circumstances, and it is possible to record information about a circuit board on a circuit board by using a small space of the circuit board, or by using an inexpensive device, or to store information about the circuit board. An object of the present invention is to make it possible to read without lowering work efficiency. According to the present invention, a circuit board management method, a tag chip mounting method, an electronic circuit production system, a taped tag chip, and the like of the following embodiments are provided. Is obtained. As in the case of the claims, each aspect is divided into sections, each section is numbered, and the number of another section is cited as necessary. This is for the purpose of facilitating the understanding of the present invention and should not be construed as limiting the technical features and combinations thereof described in the present specification to those described in the following sections. . In addition, when a plurality of items are described in one section, the plurality of items need not always be adopted together. It is also possible to select and adopt only some of the items. The electronic circuit assembly system is a component of the above-described electronic circuit production system, and is mainly configured by an electronic circuit component mounting machine that mounts electronic circuit components on a circuit board.
[0009]
In the following items, (1) corresponds to claim 1, (2) to claim 2, (3) to claim 3, (4) to claim 4, (5) ) Corresponds to claim 5, (6) to claim 6, and (12) to claim 7.
[0010]
(1) A circuit board management method for managing a circuit board by mounting a tag chip on a circuit board on which electronic circuit components are mounted and forming an electronic circuit, and reading information of the tag chip by wireless communication.
The tag chip is generally formed in a chip shape including a memory for storing information, a communication circuit, and a logic circuit connecting the memory and the communication circuit. It is desirable that the tag chip be mounted on the circuit board in the same state as other electronic circuit components. It is desirable that an adhesive is applied to the portion of the circuit board where the tag chip is to be mounted, as in the case where the electronic circuit component is mounted on the circuit board, and the tag chip is pressed against the adhesive and mounted. It is desirable that the mounting operation of the tag chip be the same as that of the electronic circuit component. It is desirable that the tag chip be taken out from a feeder or tray having the same configuration as that for supplying the electronic circuit components by a component mounting device for mounting the electronic circuit components and mounted on a circuit board. However, the tag chip can be mounted by applying an adhesive to the back surface of the tag chip, or by attaching a double-sided adhesive tape to the circuit board, or by using a mounting device dedicated to the tag chip.
[0011]
Various information can be stored in the memory of the tag chip. In the present invention, at least information on the circuit board is stored. Information about circuit boards includes information common to a plurality of circuit boards (common information), such as the type of circuit board, manufacturer, lot number, and specifications, and identification codes of individual circuit boards. At least one of the information (specific information) can be included. The common information can be used to determine, for example, a work of applying a high-viscosity fluid such as a creamy solder or an adhesive to the circuit board or a work of mounting an electronic circuit component. In addition, the unique information may include “information on a relative position of each daughter board on the circuit board” and “information indicating a work unnecessary area” in the multi-board.
[0012]
In addition, the unique information can be used for recording a production history and the like. The production history includes, for example, the above-mentioned common information, information on production facilities such as a factory that produced the circuit board, a production line, a production apparatus (for example, a mounting apparatus, etc.), and a work apparatus that has performed an operation on the circuit board. Production condition information such as operating conditions, working environment conditions such as ambient temperature, production date and time, production time information such as time required for various operations, worker name, ID, years of experience, nationality and other worker information, special notes There is information on matters. The special information refers to the electronic circuit component mounting machine that failed to mount the component mounting device, or the circuit board that was not mounted because the specific electronic circuit component to be supplied was lost. When a circuit component is mounted, information such as the type of the re-mounted electronic circuit component and the mounting position, a suction failure (including a suction error), a mounting failure (including a case where the electronic component is not mounted), and the like occur. This is information on the feeder of the component supply device, the nozzle of the component mounting device, etc. It is also possible to classify information such as feeders and nozzles into production equipment information.
[0013]
As a use form of the unique information, for example, a computer that controls an electronic circuit component mounting system can record a production history in association with an identification code of each circuit board. The production history can be stored in the tag chip as information unique to each circuit board. In the former case, since the information amount of the production history associated with the identification code may be large, it is easy to record various production histories and use the information for controlling the electronic circuit component mounting system. Become. For example, if the inspection result of the manufactured electronic circuit and the production history are used in combination, more accurate control of the electronic circuit component mounting system can be performed. Furthermore, based on the statistics of the production history, etc., it is necessary to evaluate productivity (production efficiency such as yield, production efficiency such as production speed, etc.) by product, factory, line, person in charge, and temperature. It is possible to obtain productivity management information, which can be used for management of production equipment and workers. On the other hand, when the production history is recorded on the tag chip, it is effective to record effective information when the electronic circuit is used, repaired, replaced, or the like later. For example, when it is permitted to selectively mount a plurality of types of electronic circuit components on the same mounting point of one type of circuit board, if the type of the actually mounted electronic circuit component is recorded on the tag chip, It is convenient for using and repairing the electronic circuit.
[0014]
The tag chip may have a function of storing readable information, but may also be a semiconductor chip (IC chip) including an integrated circuit such as an IC capable of calculating input information and outputting the result. , As long as it has unique information. Further, it may store information and output a calculation result based on the stored information and the input information.
[0015]
The tag chip may be attached to the circuit board before the circuit board is supplied to the electronic circuit production system, or may be attached after being supplied to the system. In the latter case, for example, if the electronic circuit production system includes one or more circuit board feeders, high-viscosity fluid applicators, electronic circuit component mounting machines, etc., the tag chip is located at the most upstream part of the system. It may be mounted on a circuit board, may be mounted in the middle part of the system, or may be mounted in the most downstream part. However, if the electronic component is mounted on an electronic circuit component mounting machine, the tag chip can be mounted using a component mounting device that mounts the electronic circuit component on a circuit board. Can be achieved.
[0016]
(2) The circuit board management method according to (1), wherein the information includes an identification code of a circuit board on which the tag chip is mounted.
(3) The circuit board management method according to (1) or (2), wherein after the information is recorded on the tag chip, the tag chip is mounted on the circuit board.
If necessary information is recorded on the tag chip before the tag chip is mounted on the circuit board, it is not essential to provide an information recording device in the electronic circuit component mounting system.
(4) The circuit board management method according to (1) or (2), wherein the information is recorded on the tag chip after the tag chip is mounted on the circuit board.
The tag chip may be mounted on the circuit board before or after the circuit board is supplied to the electronic circuit production system, but the recording of information on the tag chip is performed when the circuit board is supplied to the electronic circuit production system. Done after being done. Note that another information may already be recorded on the tag chip at that time. Further, for example, when recording the production history on the tag chip, it is also possible to record the production history of each circuit board in the computer of the electronic circuit production system, and later record the production history on the tag chip of each circuit board outside the system. It is also possible to provide a recording device in the electronic circuit production system and record the production history directly on the tag chip.
[0017]
(5) In an electronic circuit component mounting machine for mounting an electronic circuit component supplied from a component supply device on a circuit board by a component mounting device to assemble an electronic circuit, a tag chip is formed by the component supply device in the same form as the electronic circuit component. A tag chip mounting method of supplying the tag chip and mounting the tag chip on the circuit board in the same form as the electronic circuit component by the component mounting apparatus.
(6) An electronic circuit production system including at least an electronic circuit component mounting machine that mounts an electronic circuit component supplied from a component supply device on a circuit board by a component mounting device to assemble an electronic circuit,
A tag chip mounting device that stores information, and mounts the tag chip capable of transmitting the information wirelessly to the circuit board,
An information reading device for reading by receiving information transmitted from the tag chip; and
An electronic circuit production system comprising:
The electronic circuit production system only needs to include at least one electronic circuit component mounting machine, and the simplest system includes only one electronic circuit component mounting machine. However, in many cases, it is configured as an electronic circuit assembly line that includes one or more circuit board feeders, high-viscosity fluid applicators, electronic circuit component mounting machines, and the like, or further includes a reflow oven or an adhesive curing oven. Included as an electronic circuit production line. In this case, the tag chip mounting device and the information reading device may be provided in any of the above working machines, or may be provided in a peripheral device such as a substrate transfer device connecting the working machines. When the tag chip mounting device is provided upstream of the high-viscosity fluid applicator, the tag chip mounting device may include a coating device that applies a high-viscosity fluid to one of the circuit board and the tag chip. desirable.
(7) The electronic circuit component placement machine includes a tag chip supply unit in which the component supply device supplies the tag chip in the same manner as the electronic circuit component, and the component placement device supplies a tag chip supplied from the tag chip supply unit to the tag chip supply unit. The electronic circuit production system according to the above mode (6), which is mounted on a circuit board and functions as the tag chip mounting apparatus.
[0018]
(8) The electronic circuit production system according to (6) or (7), including an information recording device that records the information on the tag chip by wireless communication.
If the information recording device is provided in the electronic circuit production system, it becomes possible to record necessary information on the tag chip after the circuit board is supplied to the system. For example, it is possible to record an identification code and a production history of a circuit board.
[0019]
(9) The tag chip supply unit includes:
(A) a tag chip capable of storing information and transmitting the information wirelessly, (b) a carrier tape having a plurality of accommodation recesses in the longitudinal direction, and accommodating the tag chip in the accommodation recesses, and (c) the carrier. A tape accommodating device that accommodates a taped tag chip including a cover tape attached to a tape and closing the accommodating recess,
A feeder that pulls out the taped tag chip from the tape storage device, feeds the tag chip in the longitudinal direction, and positions each of the plurality of storage recesses at a chip supply position;
The electronic circuit production system according to the above mode (7) or (8), including a tag chip feeder provided with:
(10) The tag chip supply unit includes:
A tray support member for supporting a tag chip supply tray containing the tag chips in each of the plurality of storage recesses of the tray having a generally dish shape;
A tray positioning device for positioning each of the storage recesses at a chip supply position;
The electronic circuit production system according to any one of the above modes (7) to (9), including a tray-type supply unit provided with:
(11) The tag chip supply unit includes:
A tag chip storage device that stores the tag chips in bulk,
A chip feeding device for aligning the tag chips from the tag chip storage device and sending the chips to a chip supply position;
The electronic circuit production system according to any one of the above modes (7) to (10), including a bulk feeder provided with:
[0020]
(12) a tag chip capable of storing information and transmitting the information wirelessly;
A plurality of receiving recesses in the longitudinal direction, a carrier tape that stores the tag chip in the receiving recesses,
A cover tape attached to the carrier tape and closing the housing recess;
A tag chip including a tape tag.
If the tag chip is a taped tag chip, it is possible to supply the tag chip using a tape feeder for supplying a taped electronic circuit component.
(13) a tag chip capable of storing information and transmitting the information wirelessly;
A tray having a generally dish-like shape, a plurality of storage recesses, and one of the tag chips stored in each of the storage recesses;
Including tag chip supply tray.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 shows an electronic circuit production system according to one embodiment of the present invention. The electronic circuit production system includes a solder coating machine (for example, a screen printing machine) 10 for applying creamy solder to a circuit board from an upstream side (left side in FIG. 1) to a downstream side, and an electronic circuit component (hereinafter, referred to as a screen printing machine). , Components), and a reflow furnace 16 for soldering the components mounted on the circuit board. Then, between the above-mentioned working machines, a board transfer machine 18 for connecting each of them, a board loader 20 for loading a circuit board into the present system upstream of the solder coating machine 10, and a downstream of the reflow furnace 16 are provided. A board unloader 22 for unloading a circuit board from the present system is provided, and a system controller 24 mainly composed of a computer for centrally managing these working machines is provided outside the line. The upstream electronic circuit component mounting machine 12 (hereinafter, abbreviated as the component mounting machine 12 and referred to as the "first mounting machine 12" to distinguish it from the electronic circuit component mounting machine 14) includes a plurality of mounting heads that make one turn. This is a rotary head type mounting machine having a component mounting device that can be turned around an axis. The electronic circuit component mounting machine 14 (component mounting machine 14, "second mounting machine 14") on the downstream side has a mounting head of an XY robot. Is an XY robot-type mounting machine having a component mounting device that is moved by, for example, the first mounting machine 12 mounts relatively small components, and the second mounting machine 14 mounts relatively large or irregularly shaped components. And perform a component mounting operation on one circuit board. In the present embodiment, unique information associated with the board ID is used between these two mounting machines 12 and 14.
[0022]
FIG. 2 is a plan view of the first mounting machine 12, and FIG. 3 is a partial cross-sectional side view mainly showing a component mounting apparatus of the first mounting machine 12. The first mounting machine 12 mainly includes a work machine main body 50, a board fixing device 54 provided on the work machine main body 50 to fix the circuit board 52, and a board fixing device 54 provided on the work machine main body 50. An XY table device 56 that moves in the axial direction and the Y-axis direction, a component supply device 58 disposed in the back (upper in FIG. 2) of the XY table device 56 of the work machine main body 50, and a board fixing of the work machine main body 50 A component mounting device 60 disposed above the device 54 and the component supply device 58 for mounting components, and a CCD camera disposed in front of the component mounting device 60 so as to be able to image the surface (mounting surface) of the circuit board 52. It is composed of a board imaging device 62 as an imaging device, and a first mounting device control device 64 (see FIG. 4) for controlling these devices. The mounting machine is configured in substantially the same manner as that described in the unpublished Japanese Patent Application No. 2001-172915 by the present applicant, and the component mounting device 60 is described in Japanese Patent Application Laid-Open No. 6-342998. Japanese Patent Application Publication No. 2000-164958 filed by the present applicant and Japanese Patent Application No. 2000-164958, and the component supply device 58 have substantially the same configuration as that described in Japanese Patent Publication No. 8-21791. Therefore, only a brief explanation is given here.
[0023]
The board fixing device 54 holds and fixes the circuit board 52 at a position substantially planned in the mounting operation, and includes a carry-in conveyor and a carry-out conveyor (not shown) connected to the upstream and downstream substrate transporters 18. (Omitted). The XY table device 56 supports the substrate fixing device 54 and moves the substrate fixing device 54 in the Y-axis direction. The XY table device 56 supports the Y table device 72 and moves the Y table device 72 in the X-axis direction. An X table device 74 is provided. Each of the Y table device 72 and the X table device 74 has a servomotor serving as a driving source, a ball screw mechanism, and the like. The component supply device 58 mainly includes two component supply tables 78, a component supply table moving device 80 that moves the component supply tables 78 independently of each other in the X-axis direction, and a component supply table 78. A plurality of tape feeders 82 (a tape feeder arranged in parallel with one of the component supply tables 78 is not shown) which can sequentially send out the components held on the tape, at a predetermined component supply position. Then, a predetermined component can be taken out according to the mounting order.
[0024]
The component mounting device 60 mainly includes an index table 86 and a plurality of mounting heads 88 held around the index table 86 at right angles to the circuit board 52. Each of the mounting heads 88 has a suction nozzle 92 for holding a component 90 at a distal end thereof. The suction nozzle 92 is connected to a negative pressure source (not shown), and suctions the component 90 by negative pressure. The mounting heads 88 are held at equal angular intervals by an index table 86, and the index table 86 is intermittently rotated by a constant angle by a table intermittent rotation device 94, so that each mounting head 88 The moving path including the station C and the component mounting station D can be sequentially moved. Further, the component mounting device 60 has a mounting head elevating device (not shown) and a mounting head rotating device 98 shown in FIG. 4, and each mounting head 88 is moved up and down at the component supply station C and the component mounting station D. And, if necessary, rotated about its own axis.
[0025]
A component imaging station S exists on the movement path of the mounting head 88, and a component imaging device 102 (an imaging device is a CCD camera) for imaging the component 90 sucked and held from below the suction nozzle 92 is provided. The image data obtained by the imaging is processed by a component image processing unit 104 (see FIG. 4, which is included in the first mounting device control device 64), which is an image processing device. Is to be obtained. The holding position error includes a position error in the X-axis and Y-axis directions of the component relative to the mounting head 88 at a predetermined reference point, for example, a center point, and a rotation position error of the mounting head 88 around the rotation axis. A head rotation station T is further provided on the movement path of the mounting head 88, where the mounting head rotating device 98 rotates the mounting head 88 based on the rotation position error information in the holding position error information, The rotational position error is corrected.
[0026]
The position of the board imaging device 62 is fixed, and an arbitrary position on the surface of the circuit board 52 can be imaged by the movement of the circuit board 52 by the XY table device 56. The image data obtained by the board image pickup device 62 is processed by a board image processing unit 106 (see FIG. 4, which is included in the first mounting device control device 64), which is an image processing device, and the board fixing position information of the circuit board 52 is provided. Is obtained. The board fixing position information includes a position error in the X-axis and Y-axis directions of a reference point set in advance on the circuit board 52 with respect to the reference coordinates of the first mounting machine 12, and a rotational position error around the reference point (circuit board 52 inclination).
[0027]
FIG. 4 shows a block diagram of the first mounting machine control device 64 for controlling the first mounting machine 12, focusing on parts that are deeply related to the present invention. The first mounting device control device 64 is mainly composed of a computer 130 having a CPU 120, a ROM 122, a RAM 124, an input / output interface 126, and a bus 128 connecting them. The board fixing device 54, the XY table device 56, the component supply device 58, the table intermittent rotating device 94, and the mounting head rotating device are connected to the input / output interface 126 via respective driving circuits 132 in the first mounting device control device 64. The device 98 and the like are connected. The mounting head elevating device is driven by a driving source of the intermittent table rotation device 94 in synchronization with the intermittent rotation of the index table 86. In addition, the component imaging device 102 is connected to the input / output interface 126 via the component image processing unit 104, and the board imaging device 62 is connected via the board image processing unit 106, respectively. The holding posture information and the board fixing position information of the circuit board 52 are acquired. Further, an input device 134 mainly composed of a keyboard or the like for operating the first mounting machine 12 is connected, and is also connected to a system control device 24 for controlling the entire system. The ROM 122 stores a basic operation program of the first mounting machine 12 and the like, and the RAM 124 includes a component mounting program corresponding to a circuit board to be processed, the holding posture information, Positional information and the like are stored. The operation of the mounting machine 12 during the mounting operation is substantially the same as that described in Japanese Patent Publication No. 8-21791, and the description is omitted here.
[0028]
FIG. 5 shows a plan view of the second mounting machine 14, FIG. 6 shows a side view, and FIG. 7 shows the component mounting apparatus and its periphery. The second mounting machine 14 is mainly composed of a work machine main body 150, a board fixing device 152 provided on the work machine main body 150 to fix the circuit board 52, and a front side of the board fixing device 152 (a lower side in FIG. 5). , A tray-type component supply device 156 disposed on the back side (upper side in FIG. 5) of the substrate fixing device 152, a mounting unit 158 for mounting components, and a work machine. An XY robot device 160 provided on the main body 150 for moving the mounting unit 158 along a plane parallel to the circuit board 52 in a space above the two component supply devices 154 and 156 and the substrate fixing device 152; Board photographing using a CCD camera that can be moved by the robot device 160 and image the surface (mounting surface) of the circuit board 52 as an imaging device A device 162, and a second mounting device controller 164 for controlling these devices (see Fig. 8). The component mounting device 166 is configured by the mounting unit 158 and the XY robot device 160. This mounting machine is configured substantially in the same manner as that described in Japanese Patent No. 2824378, and the tray-type component supply device 156 is substantially similar to that described in Japanese Patent Publication No. 2-57719. The mounting unit 158 has substantially the same configuration as that described in Japanese Patent No. 30933339, and will be described only briefly here.
[0029]
The board fixing device 152 is a device that fixes the circuit board 52 conveyed by the board conveyer 170 at a substantially planned position for mounting work. The feeder-type component supply device 154 includes a plurality of tape feeders 172 arranged on a component supply table in the X-axis direction (the left-right direction in FIG. 5). Each of the tape feeders 172 is held by a tape. The supplied parts are sequentially sent out and supplied. A plurality of trays 174 storing a plurality of components are stacked in the tray-type component supply device 156, and these trays 174 are sequentially moved so that the mounting unit 158 can take out components from each tray 174. Supply of parts.
[0030]
As shown in FIG. 7, the mounting unit 158 mainly holds the mounting unit main body 180 and a suction nozzle 182 capable of sucking and holding the component 90 at the distal end portion, and holds the mounting unit main body 180 rotatably and vertically. Mounting head 184, a mounting head lifting / lowering device 188 that raises / lowers the mounting head 184 using the electric motor 186 as a driving source, and a mounting head rotating device that uses the electric motor (not shown) as a driving source and rotates the mounting head 184 around its axis. 190. The mounting head 184 is moved up and down by the mounting head elevating device 188 at the component supply position and the component mounting position, and sucks and holds the component 90 or mounts the component 90 on the surface of the circuit board 52. The mounting head 184 is rotated around its own axis by the head rotating device 190 in order to correct the posture according to the holding posture of the held component 90. The suction nozzle 182 is connected to a negative pressure source (not shown), and suctions the component 90 by the negative pressure.
[0031]
The XY robot device 160 includes an X slide 204 movable on the work machine main body 150 in the X axis direction, an X slide moving device 206 for moving the X slide 204 in the X axis direction, and a Y slide movable on the X slide 204 in the Y axis direction. A slide 208 and a Y slide moving device 210 for moving the slide 208 in the Y axis direction are provided. Each of the X slide moving device 206 and the Y slide moving device 210 has a servomotor as a driving source and has a ball screw mechanism. The mounting unit 158 is provided on the Y slide 208.
[0032]
The X slide 204 is provided with a component imaging device 220 (see FIG. 8; only a reflection mirror 222 constituting the light guide device is shown in FIG. 5) using a CCD camera as an imaging device. The component imaging device 220 captures an image of the component 90 held by the mounting head 184 when the mounting head 184 passes above the reflecting mirror 222. The obtained image data is processed by the component image processing unit 224 (see FIG. 8; included in the second mounting device control device 164), which is an image processing device, and the holding position error information of the component 90 is obtained. ing. The board imaging device 162 is provided on the Y slide 208 and is moved by the XY robot device 160 so that an arbitrary position on the surface of the circuit board 52 can be imaged. The image data obtained by the board image pickup device 162 is processed by a board image processing unit 226 (see FIG. 8, which is included in the second mounting device control device 164) as an image processing device, and the board individual position of the circuit board 52 is determined. Information is obtained.
[0033]
FIG. 8 shows a block diagram of the second mounting machine control device 164 for controlling the second mounting machine 14, focusing on portions that are deeply related to the present invention. The second mounting device control device 164 is mainly composed of a computer 240 having a CPU 230, a ROM 232, a RAM 234, an input / output interface 236, and a bus 238 connecting them. The input / output interface 236 is connected to the substrate fixing device 152, the XY robot device 160, the feeder type component supply device 154, the tray type component supply device 156, and the respective drive circuits 242 in the second mounting device control device 164. The mounting head elevating device 188 and the mounting head rotating device 190 are connected. Further, the component imaging device 220 is connected to the input / output interface 236 via the component image processing unit 224, and the substrate imaging device 162 is connected via the substrate image processing unit 226. Position error information and substrate individual fixed position information are acquired. Further, an input device 244 mainly including a keyboard for operating the second mounting machine 14 and a system control device 24 for controlling the entire system are connected. The ROM 232 stores a basic operation program of the second mounting machine 14 and the like. The RAM 234 stores a component mounting work program corresponding to the circuit board 52 to be worked, the above-described holding position error information, The substrate individual position information and the like are stored. The operation of the mounting machine 14 during the mounting operation is substantially the same as that described in the aforementioned Japanese Patent No. 2824378 and the application specification of Japanese Patent Application No. 2000-343641 by the present applicant. Omitted.
[0034]
FIG. 9 shows an example of a circuit board to be worked in this embodiment. The present circuit board 52 is a so-called multi-board in which four daughter boards are provided side by side, and is a circuit board also called a multi-panel board. After the production of the electronic circuit by the present electronic circuit production system is completed, it is separated into four daughter boards. Therefore, the circuit board 52 has four child board portions 260 as shown in the figure. Incidentally, although the four sub-board portions 260 are omitted in the drawing, their circuit patterns (wiring patterns) are the same, and both the mounting operation in the first mounting machine 12 and the mounting operation in the second mounting machine 14 are one. The mounting of the components 90 of the four sub-board units 260 is possible by the mounting program of the sub-board units 260.
[0035]
The circuit board 52 has a board position reference mark 262 at each of two diagonally located corners, and a portion of the circuit board 52 where the board position reference mark 262 is provided becomes a board reference display section. . The board position reference mark 262 is used to acquire board fixed position information that is information on the fixed position when the circuit board 52 is fixed by the board fixing devices 54 and 152 in the first and second mounting machines 12 and 14. Used for That is, two substrate position reference marks 262 are imaged by the substrate imaging devices 62 and 162, and the obtained image data is processed by the substrate image processing units 106 and 226, which are image processing devices, thereby fixing the fixed circuit. The amount of displacement in two directions (X-axis direction, Y-axis direction) orthogonal to each other in a plane parallel to the surface of the circuit board of the substrate 52 and the rotational direction (hereinafter referred to as “θ-axis direction”) in the plane is detected. It is done. In the mounting operation, the positional deviation is corrected based on the positional deviation amount, and the individual components 90 are mounted.
[0036]
Further, on the circuit board 52, a sub-board position reference mark 266, which is an area position reference mark, is provided at each of two corners located at a diagonal of each sub-board part 260. Each sub-board position reference mark 266 has an accurate relative position with respect to the circuit pattern of the sub-board section 260 to which it is attached. By grasping the positional relationship between the board position reference mark 262 and the daughter board position reference mark 266, the relative position of each daughter board part 260 with respect to the circuit board 52 with respect to the board position reference mark 262 can be grasped. . In other words, it can be said that the child board position defining information, which is the relative positional relationship information between the two types of marks 262 and 266, relates the position of the child board part 260 to the position of the board position reference mark 262. Similarly to the substrate position reference mark 262, the child substrate position reference mark 266 is imaged by the substrate imaging devices 62 and 162, and the obtained image data is processed by the substrate image processing units 106 and 226 which are image processing devices. As a result, the area position definition information of each of the sub-board portions 260 in the X-axis direction, the Y-axis direction, and the θ-axis direction, that is, the sub-board position specification information is obtained.
[0037]
The circuit board 52 is also provided with pads 290 for fixing the tag chip 300 by soldering. The pad 290 is formed by a conductor layer formed by electrochemical plating simultaneously with the formation of the substrate position reference mark 262 and the circuit pattern. On the other hand, a similar conductor layer is also formed on the back surface of the tag chip 300. The tag chip 300 is formed in a chip shape, and the component 90 and the tag chip 300 are mounted on the circuit board 52 by the common component mounting device 60 in the first mounting machine 12 described above. As shown in FIG. 11, the tag chip 300 mainly includes a memory 302, a communication circuit 304 for wireless communication, and a logic circuit 306 connecting the memory 302 and the wireless communication circuit 304. The information stored in the memory 302 can be transmitted to the writer by wireless communication, or the received information can be stored in the memory 302. Although various information can be stored in the memory 302, in the present embodiment, an identification code including a board ID for identifying each circuit board is stored.
[0038]
In the first mounting machine 12, a tag chip feeder 312 as a tag chip supply device for supplying the tag chip 300 is provided. The tag chip feeder 312 is configured in the same manner as the above-described tape feeder 82. As shown in FIG. 12, the tag chip feeder 312 holds a tag chip 300 on a carrier tape 314 and accommodates the tag chip 300 in the form of a tag chip 316. A feeding device that feeds the tag chips 316 in the longitudinal direction and positions the tag chips 300 one by one in the supply unit. As shown in FIG. 2, the tag chip feeder 312 is disposed on the component supply table 78 of the first mounting machine 12 such that its supply unit is aligned with the supply unit of the tape feeder 82 along a straight line. .
[0039]
The first and second mounting machines 12 and 14 are provided with reader / writers 310 and 311 as reading / writing devices for information on the tag chip 300, respectively. In the first mounting machine 12, as shown in FIGS. 2 and 10, the reader / writer 310 is fixedly supported by a frame (not shown) at a position where it does not interfere with the component mounting device 60. The reader / writer 310 is provided so as to be communicable when the tag chip 300 is located below the reader / writer 310. The tag chip 300 is mounted on the circuit board 52, and the reader / writer 310 can communicate below the reader / writer 310. Information can be read and written when located in the area. As shown in FIG. 4, the reader / writer 310 is connected to the input / output interface 126 of the first placement machine control device 64, and transmits the identification code of the circuit board 52 to the tag chip 300 according to the instruction of the first placement machine control device 64. Write to.
[0040]
In the second mounting machine 14, as shown in FIG. 7, a reader / writer 311 is provided on the Y slide 208, and can be moved together with the mounting unit 158 to an arbitrary position in a horizontal plane. Also in the second mounting machine 14, communication is enabled and the identification code stored in the memory 302 is read when the tag chip 300 is located below the reader / writer 311.
[0041]
Next, an operation of mounting the component 90 in the electronic circuit production system will be described. The operation of applying the creamy solder by the solder application machine 10 and the operation of soldering in the reflow furnace 16 are not directly related to the present invention, and therefore the description thereof is omitted, and only the parts deeply related to the present invention are detailed. Will be described.
[0042]
When the circuit board 52 is carried into the first mounting machine 12, the board position reference mark 262 and the child board position reference mark 266 are imaged by the board imaging device 62. Based on the positions of the reference marks 262 and 266, board fixing position information of the circuit board 52 and child board position defining information are acquired, and the RAM 124 of the first mounting device control device 64 is used as unique information unique to the circuit board 52. Is stored. Next, the tag chip 300 is mounted on the circuit board 52. In the present embodiment, a chip mounting position where the tag chip 300 is mounted is set near the substrate position reference mark 262, and cream solder is applied in advance by a solder application machine. The tag chip 300 is taken out from the tag chip feeder 312 by the suction nozzle 92 and is mounted on the circuit board 52, and thereafter, the circuit board 52 is positioned in the communicable area of the reader / writer 310 by the XY table device 56. Is positioned as follows. In this state, the identification code of the circuit board 52 is written to the tag chip 300, and the identification code is transmitted to the system control device 24 and stored in association with the above-described unique information.
[0043]
Next, the components 90 are mounted on the circuit board 52 in a predetermined order. At this time, which tape feeder 82 supplied each component 90, which mounting head 88 or suction nozzle 92 was used to mount the component 90, who was the operator, and the magnitude of the holding position error of the component 90 by the suction nozzle 92 are as follows. A production history such as how much it was or whether there was a special situation such as occurrence of a suction error of the component 90 by the suction nozzle 92 is stored in the RAM 124 of the first mounting machine control device 64 in association with the identification code of the circuit board 52. Are further supplied to and stored in the system controller 24. When the mounting operation of the component 90 in the first mounting machine 12 is completed, the circuit board 52 is transferred to the second mounting machine 14 by the board transfer machine 18. If the circuit board 52 is positioned and supported by the second mounting machine 14, first, the board imaging device 162 captures an image of the board position reference mark 262, and the board fixing position of the second mounting machine 14 is acquired. Next, the identification code recorded on the tag chip 300 is read by the reader / writer 311 and transmitted to the system control device 24 through the second mounting device control device 164.
[0044]
Here, various kinds of information including the above-described unique information of the circuit board 52 are stored in the system control device 24, and the unique information associated with the identification code acquired this time is called out. In the unique information, the board fixing position information of the circuit board 52 and the child board position defining information are stored, and among them, the child board position defining information which is information on the relative positions of the two reference marks 262 and 266. The position of the child board position reference mark 266 in the second placement machine 14 is obtained based on the above and the board position reference mark 262 imaged in the second placement machine 14 described above. It is not necessary to image the substrate position reference mark 266. The mounting position of the component 90 is corrected and mounted according to the positions of the circuit board 52 and the sub-board 260 obtained as described above. At this time, the production history is supplied to the system control device 24 via the second mounting device control device 164 in the same manner as in the first mounting device 12, and is stored in association with the identification information of the circuit board 52. You. When the component mounting operation is completed in the second mounting machine 14, the circuit board 52 is transferred to the reflow furnace 16 and soldering is performed. Thus, the electronic circuit component mounting work by the present system is completed.
[0045]
As is clear from the above description, in the present electronic circuit production system, the component mounting device 60 configures a “tag chip mounting device”, and the reader / writers 310 and 311 configure an “information reading device”.
[0046]
According to the present embodiment, once the unique information of the circuit board 52 is obtained and associated with the identification code of each circuit board 52, the position of the child board unit 260 can be easily obtained in the downstream working machine. it can. Further, by using the tag chip 300, the space to be used on the circuit board can be reduced as compared with a case where a bar code or a two-dimensional code is provided on each circuit board as an indicator representing the identification code. Furthermore, since the tag chip 300 can be mounted by a mounting machine that is common to a mounting machine that mounts the component 90 on the circuit board 52, a dedicated attaching device such as a bar code or a two-dimensional code can be used. There is no need to provide a printing device. In addition, since the production history information is recorded in association with the identification code of the circuit board 52, the result of the later electronic circuit inspection is matched with the information of the tape feeder 82, the suction nozzle 92, the worker, and the like. Appropriate management of the first and second mounting machines and workers can be performed.
[0047]
In the above embodiment, for simplicity of description, only the first and second mounting machines are used. However, if the electronic circuit production system includes more mounting machines, It is also possible to use the identification code of the tag chip 300 also in the mounting machine of (1). In addition, at least one work machine is provided with an inspection device for inspecting the result of the work by the work machine, or an inspection machine is provided downstream of at least one work machine, and the inspection results are stored in the production history information. It is also possible to record as a kind. For example, when it is recorded that any one of the sub-board parts 260 has become defective, the work on the sub-board part 260 is prevented from being performed in a work machine located on the downstream side.
[0048]
Further, the tag chip 300 is temporarily fixed to the circuit board 52 by creamy solder, and then is fixed to the circuit board 52 in earnest by being soldered in the reflow furnace 16. In a case where it is sufficient that the conductor layer can be used in a working machine installed before the reflow furnace 16 such as a mounting machine, a conductor layer is not formed on the circuit board 52 or the tag chip 300, and soldering is performed in the reflow furnace 16. It is also possible to prevent it. Further, when the electronic circuit production system includes an adhesive applicator, the tag chip 300 can be mounted on the circuit board 52 by the adhesive applicator. The tag chip 300 can be fixed to the circuit board 52 without forming a conductor layer.
[0049]
In the above embodiment, after the tag chip 300 is mounted on the circuit board 52, the identification code is stored in the memory 302 of the tag chip 300. However, the identification code and other information are stored in the tag chip 300 in advance. Is also good. In the latter case, for example, the first mounting machine 12 acquires the unique information of the circuit board 52 and reads the identification code stored in the tag chip 300 in advance by the reader / writer 310, and then reads the unique information. And the identification code are transmitted to and stored in the system controller 24 in association with each other.
[0050]
In the embodiment, since the tag chip 300 is attached to a portion other than the child board part 260 of the circuit board 52, the tag chip 300 is not attached to the child board after separation. A tag chip 300 may be attached to each of them, and each of the separated sub-substrates may include the tag chip 300. By doing so, it is possible to use the information of the tag chip 300 for the inspection after the completion of the child substrate, and for the later use, inspection, maintenance and the like. If the circuit board is not a multi-board, one tag chip 300 can be used similarly if it is attached.
[0051]
The identification code is stored in the tag chip 300, and the production history information is stored in the system controller 24, the placement machine controllers 64, 164, etc. in association with the identification code. Information generated in the electronic circuit production system may be stored in the tag chip 300. In this case, it is often easy to use the production history information.
[0052]
Further, the writing operation and the reading operation by the reader / writers 310 and 311 may be performed in parallel with other operations. For example, the process may be performed while the component 90 is mounted. Specifically, when the mounting position of the circuit board 52 corresponds to the component mounting position of the component mounting device 56, the tag chip 300 can communicate. When it is located within the area, the writing operation is performed, and the second mounting machine 14 can perform the reading operation in parallel with the imaging operation by the board imaging device 162.
[0053]
In the embodiment, the tag chip 300 is supplied by the tag chip feeder 316, but may be supplied in another mode. For example, the tag chips 300 may be supplied by a tray-type supply device, or may be supplied by a bulk feeder that supplies the tag chips 300 one by one while holding them in bulk.
[0054]
As described above, some embodiments of the present invention have been described in detail. However, these are merely examples, and the present invention has been described in the section [Problems to be Solved by the Invention, Problem Solving Means and Effects]. Various modifications and improvements can be made based on the knowledge of those skilled in the art, including the embodiments.
[Brief description of the drawings]
FIG. 1 is a front view showing an electronic circuit production system according to an embodiment of the present invention.
FIG. 2 is a plan view showing a first mounting machine of the system.
FIG. 3 is a partial side sectional view showing an enlarged view of the component mounting device of the first mounting machine.
FIG. 4 is a block diagram showing a control device of the first mounting machine.
FIG. 5 is a plan view showing a second mounting machine of the system.
FIG. 6 is a side view showing the second mounting machine.
FIG. 7 is an enlarged front view showing a main part of the second mounting machine.
FIG. 8 is a block diagram showing a control device of the second mounting machine.
FIG. 9 is a plan view showing an example of a circuit board used as an electronic circuit in the system.
FIG. 10 is an enlarged perspective view showing a reader / writer of the first mounting machine and a peripheral portion thereof.
FIG. 11 is a block diagram conceptually showing a tag chip.
FIG. 12 is a perspective view showing a tag chip feeder.
[Explanation of symbols]
10: Solder coating machine 12: Electronic circuit component mounting machine (component mounting machine, first mounting machine) 14: Electronic circuit component mounting machine (component mounting machine, second mounting machine) 16: Reflow furnace 18: substrate transfer machine 20: Substrate loader 22: Substrate unloader 24: System control device 52: Circuit board 60: Component mounting device 64: First mounting machine control device 90: Electronic circuit component (component) 158: Mounting unit 260: Substrate portion 262: Substrate position reference Mark 266: Reference mark of child board position 300: Tag chip 302: Memory 304: Communication circuit 306: Logic circuit 310, 311: Reader / writer 312: Tag chip feeder

Claims (7)

A circuit board management method for managing a circuit board by mounting a tag chip on a circuit board on which electronic circuit components are mounted and forming an electronic circuit, and reading information of the tag chip by wireless communication. 2. The circuit board management method according to claim 1, wherein the information includes an identification code of the circuit board on which the tag chip is mounted. 3. The circuit board management method according to claim 1, wherein the tag chip is mounted on the circuit board after the information is recorded on the tag chip. 3. The circuit board management method according to claim 1, wherein the information is recorded on the tag chip after the tag chip is mounted on the circuit board. In an electronic circuit component mounting machine for mounting an electronic circuit component supplied from a component supply device on a circuit board by a component mounting device to assemble an electronic circuit, the component supply device supplies a tag chip in the same form as the electronic circuit component, A tag chip mounting method for mounting the tag chip on the circuit board in the same form as the electronic circuit component by the component mounting apparatus. An electronic circuit production system including at least an electronic circuit component mounting machine that assembles an electronic circuit by mounting an electronic circuit component supplied from a component supply device on a circuit board by a component mounting device,
A tag chip mounting device that stores information, and mounts the tag chip capable of transmitting the information wirelessly to the circuit board,
An electronic circuit production system, comprising: an information reading device that receives and reads information transmitted from the tag chip. A tag chip that can store information and transmit the information wirelessly;
A plurality of receiving recesses in the longitudinal direction, a carrier tape that stores the tag chip in the receiving recesses,
A tag chip comprising a cover tape attached to the carrier tape and closing the housing recess.

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