JP2004077270A - Apparatus and method for measuring film thickness - Google Patents

Apparatus and method for measuring film thickness Download PDF

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JP2004077270A
JP2004077270A JP2002237727A JP2002237727A JP2004077270A JP 2004077270 A JP2004077270 A JP 2004077270A JP 2002237727 A JP2002237727 A JP 2002237727A JP 2002237727 A JP2002237727 A JP 2002237727A JP 2004077270 A JP2004077270 A JP 2004077270A
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Prior art keywords
film
thickness
measuring
light
work
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JP2002237727A
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Japanese (ja)
Inventor
Shigeaki Nawa
名和　成明
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Toppan Edge Inc
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Toppan Forms Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for measuring film thickness, for example, accurately measuring thickness of a film formed on a work on the production line without being substantially effected by surface roughness or surface oscillation. <P>SOLUTION: In this apparatus for measuring the thickness of a film 11 formed on a work 10, a material forming a film contains a predetermined luminescent material. The apparatus is provided with an emitting part 1 for emitting illuminating light with a predetermined wavelength onto the film, an optical detection part 2 for detecting light from the film, and a shielding part 4 for shielding unnecessary light coming onto the film from outside. The thickness of the film is measured on the basis of output from the optical detection part at a processing part 3. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、膜厚測定装置および方法に関し、特にワーク上に塗布された糊やシリコンやインキなどの膜厚の測定に関するものである。
【０００２】
【従来の技術】
たとえばラベルシートの製造に際して、剥離紙にシリコンのような剥離剤を塗布したり、ラベルに糊のような接着剤を塗布したりする。この場合、シリコンの膜厚が大きすぎるとコスト高を招き、シリコンの膜厚が小さすぎると剥離紙がラベルから剥がれ難くなる。
【０００３】
また、糊の膜厚が大きすぎるとラベルから糊がはみ出したり乾燥が遅くなったりし、糊の膜厚が小さすぎると十分な接着力が得られなくなる。したがって、ラベルシートの製造ラインにおいてシリコンの膜厚を正確に測定することは重要である。
【０００４】
一般に、たとえば連続用紙のようなワーク上に塗布した物質（糊やシリコンなど）の厚さを測定する従来の装置として、レーザや超音波やＸ線などを用いる測定装置が知られている。また、ハンディータイプのオフライン測定装置として、ワークに印刷されたインキの色分解により濃度を計測し、ひいては膜厚を測定する印刷濃度計が知られている。
【０００５】
【発明が解決しようとする課題】
しかしながら、レーザや超音波やＸ線などを用いる従来の測定装置は、非常に高価であって、ワークの平面平滑度（表面粗さ）や、ワークの搬送振動などによる測定面の変動（表面揺れ）などが測定値に大きな影響を与えるため、オンラインでの測定信憑性が低いという不都合があった。
【０００６】
一方、印刷濃度計のような従来の測定装置は、製造ラインを経て仕上がった製品の抜取り検査用のものであり、移動するワークに適用することができないので、製造ライン上での全品検査に使用することはできないという不都合があった。
【０００７】
本発明は、前述の課題に鑑みてなされたものであり、表面粗さや表面揺れなどの影響を実質的に受けることなく、たとえば製造ライン上のワークに形成された膜の厚さを正確に測定することのできる膜厚測定装置および方法を提供することを目的とする。
【０００８】
【課題を解決するための手段】
前記課題を解決するために、本発明では、ワーク上に形成された膜の厚さを測定する装置において、
前記膜を形成する物質は所定の発光材料を含有し、
前記膜からの光を検出するための光検出部を備え、
前記光検出部の出力に基づいて前記膜の厚さを測定することを特徴とする膜厚測定装置を提供する。
【０００９】
本発明の好ましい態様によれば、前記発光材料は蛍光材であり、前記膜に所定波長の照明光を照射するための照射部をさらに備えている。また、外部から前記膜に達する不要光を遮るための遮蔽部をさらに備えている。さらに、前記光検出部はＣＣＤカメラであり、前記ＣＣＤカメラで検出した輝度情報に基づいて前記膜の厚さを算出するための処理部をさらに備えていることが好ましい。
【００１０】
また、本発明の別の局面によれば、ワーク上に形成された膜の厚さを測定する方法において、
前記膜を形成すべき物質に所定の発光材料を予め含有させ、
前記所定の発光材料を含有する物質で前記膜を形成し、
前記膜から検出した光の情報に基づいて前記膜の厚さを測定することを特徴とする膜厚測定方法を提供する。
【００１１】
【発明の実施の形態】
本発明の実施形態を、添付図面に基づいて説明する。
図１は、本発明の実施形態にかかる膜厚測定装置の構成を概略的に示す図である。本実施形態では、一例として、ラベルシートの製造ラインにおいて剥離紙に塗布されるシリコンの膜厚測定に対して本発明を適用している。
【００１２】
図１を参照すると、たとえば連続用紙の形態を有するワークとしての剥離紙１０の表面には、蛍光材を予め含有（均一に混入）させたシリコンが塗布され、図中斜線部で示すように所定厚さのシリコン膜１１が形成されている。本実施形態の膜厚測定装置は、ラベルシートの製造ラインにおいて搬送される剥離紙１０の表面に形成されたシリコン膜１１の厚さを測定するために、一対の光照射部１ａおよび１ｂと、ＣＣＤカメラ２と、処理部３と、遮蔽部４とを備えている。
【００１３】
ここで、一対の光照射部１ａおよび１ｂは、蛍光材の特性に応じた所定波長の照明光をシリコン膜１１に照射するように構成されている。また、ＣＣＤカメラ２は、所定波長の照明光の照射を受けてシリコン膜１１から発生する蛍光を検出するための光検出部を構成している。
【００１４】
さらに、処理部３は、後述するように、ＣＣＤカメラ２で検出したシリコン膜１１の輝度情報に基づいて、シリコン膜１１の厚さを算出するように構成されている。また、遮蔽部４は、一対の光照射部１ａおよび１ｂの全体およびＣＣＤカメラ２の先端部を包囲するボックス状の形態を有し、外部からシリコン膜１１に達する不要光を遮るように構成されている。
【００１５】
本実施形態では、一対の光照射部１ａおよび１ｂにより所定波長の照明光をシリコン膜１１に照射し、所定波長の照明光の照射を受けてシリコン膜１１から発生する蛍光をＣＣＤカメラ２により検出する。このとき、遮蔽部４の作用により不要光が外部からシリコン膜１１に達するのを遮るので、シリコン膜１１から発生する蛍光は一対の光照射部１ａおよび１ｂからの照明光によって励起された蛍光に限られることになる。
【００１６】
こうして、処理部３では、ＣＣＤカメラ２により検出（計測）された輝度情報に基づいてシリコン膜１１の厚さを算出する。具体的には、処理部３は、輝度と膜厚との対応情報を有するテーブル３ａを参照し、計測した輝度がｎ１（ｃｄ／ｍ２：カンデラ）である場合にはシリコン膜１１の膜厚がｍ１（μｍ）であると算出し、計測した輝度がｎ２（ｃｄ／ｍ２）である場合にはシリコン膜１１の膜厚がｍ２（μｍ）であると算出する。
【００１７】
以上のように、本実施形態では、所定の発光材料を予め含有させたシリコンを用いて、ワークである剥離紙１０の上にシリコン膜１１を形成する。そして、シリコン膜１１から検出した蛍光の輝度情報に基づいてシリコン膜１１の膜厚を測定する。この場合、シリコン膜１１から検出する蛍光の輝度情報は、剥離紙１０の平面平滑度（表面粗さ）や剥離紙１０の搬送振動などによる測定面の変動（表面揺れ）などに影響されることがない。
【００１８】
その結果、本実施形態の膜厚測定装置では、レーザや超音波やＸ線などを用いて直接的に膜厚を測定する従来技術とは異なり、表面粗さや表面揺れなどの影響を実質的に受けることなく、剥離紙１０に形成されたシリコン膜１１の厚さを正確に測定することができる。また、本実施形態では、光照射部１とＣＣＤカメラ２とで簡素な構成を有する膜厚測定装置を安価に構築することができる。
【００１９】
さらに、本実施形態では、光検出部としてＣＣＤカメラ２を用いているので、シリコン膜１１の全体または一部に亘って二次元的な輝度分布を計測することができ、ひいてはシリコン膜１１の複数点における膜厚を同時算出することができる。その結果、複数点計測の平均化効果により、オンラインでの測定信憑性をさらに向上させることができる。
【００２０】
なお、上述の実施形態では、一対の光照射部１ａおよび１ｂにより照明光をシリコン膜１１に照射しているが、光照射部の数および配置については様々な変形例が可能である。また、上述の実施形態では、処理部３がテーブル３ａを参照しているが、輝度と膜厚とが所定の相関関係を有する場合、たとえば線形比例関係を有する場合には、テーブル３ａの利用を省略することができる。
【００２１】
さらに、上述の実施形態では、発光材料として蛍光材を用いているが、これに限定されることなく、他の適当な発光材料を用いることができる。また、上述の実施形態では、光検出部としてＣＣＤカメラを用いているが、これに限定されることなく、他の適当な光検出手段を用いることができる。
【００２２】
さらに、上述の実施形態では、遮蔽部４を設けて外部からシリコン膜１１に達する不要光を遮っているが、測定環境に応じて遮蔽部４の設置を省略することもできる。また、上述の実施形態では、ラベルシートの製造ラインにおいて剥離紙１０に塗布されるシリコンの膜厚測定に対して本発明を適用しているが、これに限定されることなく、一般にワーク上に形成された膜の厚さを測定する装置に対して本発明を適用することもできる。
【００２３】
【発明の効果】
以上説明したように、本発明では、所定の発光材料を予め含有させた物質を用いてワーク上に膜を形成し、膜から検出した光の情報に基づいて膜厚を測定するので、表面粗さや表面揺れなどの影響を実質的に受けることなく、たとえば製造ライン上のワークに形成された膜の厚さを正確に測定することのできる膜厚測定装置および方法を実現することができる。
【図面の簡単な説明】
【図１】本発明の実施形態にかかる膜厚測定装置の構成を概略的に示す図である。
【符号の説明】
１ａ，１ｂ　光照射部
２　ＣＣＤカメラ
３　処理部
３ａ　参照テーブル
４　遮蔽部
１０　剥離紙（ワーク）
１１　シリコン膜[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an apparatus and a method for measuring a film thickness, and more particularly to a method for measuring a film thickness of a paste, silicon, ink, or the like applied on a work.
[0002]
[Prior art]
For example, when manufacturing a label sheet, a release agent such as silicone is applied to release paper, or an adhesive such as glue is applied to a label. In this case, if the thickness of the silicon is too large, the cost is increased, and if the thickness of the silicon is too small, the release paper is difficult to peel off from the label.
[0003]
On the other hand, if the film thickness of the paste is too large, the paste will protrude from the label or the drying will be delayed, and if the film thickness of the paste is too small, sufficient adhesive strength will not be obtained. Therefore, it is important to accurately measure the silicon film thickness in a label sheet manufacturing line.
[0004]
In general, as a conventional apparatus for measuring the thickness of a substance (such as glue or silicon) applied to a work such as continuous paper, a measuring apparatus using laser, ultrasonic waves, X-rays, or the like is known. Further, as a handy type off-line measuring device, there is known a print densitometer which measures density by color separation of ink printed on a work and thus measures film thickness.
[0005]
[Problems to be solved by the invention]
However, conventional measuring devices using lasers, ultrasonic waves, X-rays, and the like are very expensive, and the work surface has a flatness (surface roughness) and fluctuations in the measurement surface due to work conveyance vibrations (surface sway). ) Greatly affects the measured values, and thus has the disadvantage of low online measurement credibility.
[0006]
On the other hand, conventional measuring devices such as print densitometers are used for sampling inspection of products finished through a production line and cannot be applied to moving workpieces. There was an inconvenience that you could not do that.
[0007]
The present invention has been made in view of the above-described problems, and accurately measures, for example, the thickness of a film formed on a work on a production line without substantially being affected by surface roughness, surface fluctuation, and the like. It is an object of the present invention to provide an apparatus and a method for measuring the thickness of a film that can be performed.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides an apparatus for measuring the thickness of a film formed on a work,
The substance forming the film contains a predetermined light emitting material,
A light detection unit for detecting light from the film,
There is provided a film thickness measuring device for measuring the thickness of the film based on the output of the light detection unit.
[0009]
According to a preferred aspect of the present invention, the luminescent material is a fluorescent material, and further includes an irradiating unit for irradiating the film with illumination light having a predetermined wavelength. Further, a shielding portion for shielding unnecessary light reaching the film from the outside is further provided. Further, it is preferable that the light detection unit is a CCD camera, and further includes a processing unit for calculating the thickness of the film based on luminance information detected by the CCD camera.
[0010]
According to another aspect of the present invention, there is provided a method for measuring a thickness of a film formed on a work,
A predetermined light emitting material is previously contained in the substance to be formed with the film,
Forming the film with a substance containing the predetermined light emitting material,
A thickness measuring method is provided, wherein the thickness of the film is measured based on information of light detected from the film.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a diagram schematically showing a configuration of a film thickness measuring apparatus according to an embodiment of the present invention. In the present embodiment, as an example, the present invention is applied to measurement of the film thickness of silicon applied to release paper in a label sheet manufacturing line.
[0012]
Referring to FIG. 1, for example, a surface of a release paper 10 as a work in the form of a continuous paper is coated with silicon containing a fluorescent material in advance (uniformly mixed), and a predetermined amount is indicated by a hatched portion in the figure. A silicon film 11 having a thickness is formed. The film thickness measuring apparatus according to the present embodiment includes a pair of light irradiation units 1a and 1b for measuring the thickness of the silicon film 11 formed on the surface of the release paper 10 conveyed in the label sheet manufacturing line; The camera includes a CCD camera 2, a processing unit 3, and a shielding unit 4.
[0013]
Here, the pair of light irradiators 1a and 1b are configured to irradiate the silicon film 11 with illumination light having a predetermined wavelength according to the characteristics of the fluorescent material. Further, the CCD camera 2 constitutes a light detection unit for detecting the fluorescence generated from the silicon film 11 by receiving the irradiation of the illumination light of a predetermined wavelength.
[0014]
Further, the processing unit 3 is configured to calculate the thickness of the silicon film 11 based on luminance information of the silicon film 11 detected by the CCD camera 2 as described later. The shielding portion 4 has a box-like form surrounding the entire pair of light irradiation portions 1a and 1b and the tip of the CCD camera 2, and is configured to block unnecessary light reaching the silicon film 11 from outside. ing.
[0015]
In the present embodiment, the silicon film 11 is irradiated with illumination light of a predetermined wavelength by the pair of light irradiation units 1a and 1b, and the fluorescence generated from the silicon film 11 upon receiving the illumination light of the predetermined wavelength is detected by the CCD camera 2. I do. At this time, the action of the shielding portion 4 blocks unnecessary light from reaching the silicon film 11 from the outside, so that the fluorescence generated from the silicon film 11 is reduced to the fluorescence excited by the illumination light from the pair of light irradiation portions 1a and 1b. Will be limited.
[0016]
In this way, the processing unit 3 calculates the thickness of the silicon film 11 based on the luminance information detected (measured) by the CCD camera 2. Specifically, the processing unit 3 refers to the table 3a having information on the correspondence between the luminance and the film thickness, and when the measured luminance is n 1 (cd / m 2 : candela), the film of the silicon film 11 The thickness is calculated to be m 1 (μm), and when the measured luminance is n 2 (cd / m 2 ), the thickness of the silicon film 11 is calculated to be m 2 (μm).
[0017]
As described above, in the present embodiment, the silicon film 11 is formed on the release paper 10 which is a work, using silicon containing a predetermined light emitting material in advance. Then, the thickness of the silicon film 11 is measured based on the luminance information of the fluorescence detected from the silicon film 11. In this case, the luminance information of the fluorescence detected from the silicon film 11 is affected by the planar smoothness (surface roughness) of the release paper 10 and the fluctuation of the measurement surface (surface fluctuation) due to the conveyance vibration of the release paper 10 and the like. There is no.
[0018]
As a result, the film thickness measuring apparatus according to the present embodiment substantially differs from the prior art in which the film thickness is directly measured using laser, ultrasonic waves, X-rays, or the like, and is substantially free from the influence of surface roughness and surface shaking. The thickness of the silicon film 11 formed on the release paper 10 can be accurately measured without receiving. Further, in the present embodiment, it is possible to inexpensively construct a film thickness measuring device having a simple configuration including the light irradiation unit 1 and the CCD camera 2.
[0019]
Further, in the present embodiment, since the CCD camera 2 is used as the light detection unit, a two-dimensional luminance distribution can be measured over the entire or a part of the silicon film 11, and a plurality of the silicon films 11 can be measured. The film thickness at a point can be calculated simultaneously. As a result, the credibility of online measurement can be further improved due to the averaging effect of the multi-point measurement.
[0020]
In the above-described embodiment, the illumination light is applied to the silicon film 11 by the pair of light irradiation units 1a and 1b. However, various modifications can be made to the number and arrangement of the light irradiation units. In the above-described embodiment, the processing unit 3 refers to the table 3a. However, when the luminance and the film thickness have a predetermined correlation, for example, when the luminance and the film thickness have a linear proportional relationship, the table 3a is not used. Can be omitted.
[0021]
Further, in the above-described embodiment, the fluorescent material is used as the light emitting material. However, the present invention is not limited to this, and another appropriate light emitting material can be used. In the above-described embodiment, the CCD camera is used as the light detection unit. However, the present invention is not limited to this, and another appropriate light detection unit can be used.
[0022]
Further, in the above-described embodiment, the shielding portion 4 is provided to block unnecessary light reaching the silicon film 11 from the outside. However, the installation of the shielding portion 4 may be omitted according to the measurement environment. Further, in the above-described embodiment, the present invention is applied to the measurement of the film thickness of the silicon applied to the release paper 10 in the label sheet manufacturing line. However, the present invention is not limited to this, and is generally applied to a work. The present invention can also be applied to an apparatus for measuring the thickness of a formed film.
[0023]
【The invention's effect】
As described above, in the present invention, a film is formed on a work using a substance containing a predetermined luminescent material in advance, and the film thickness is measured based on information of light detected from the film. For example, it is possible to realize a film thickness measuring apparatus and method capable of accurately measuring the thickness of a film formed on a work on a production line, for example, without being substantially affected by turbulence or surface fluctuation.
[Brief description of the drawings]
FIG. 1 is a diagram schematically showing a configuration of a film thickness measuring apparatus according to an embodiment of the present invention.
[Explanation of symbols]
1a, 1b Light irradiation unit 2 CCD camera 3 Processing unit 3a Look-up table 4 Shielding unit 10 Release paper (work)
11 Silicon film

Claims (5)

ワーク上に形成された膜の厚さを測定する装置において、
前記膜を形成する物質は所定の発光材料を含有し、
前記膜からの光を検出するための光検出部を備え、
前記光検出部の出力に基づいて前記膜の厚さを測定することを特徴とする膜厚測定装置。In an apparatus for measuring the thickness of a film formed on a work,
The substance forming the film contains a predetermined light emitting material,
A light detection unit for detecting light from the film,
A film thickness measuring device for measuring a thickness of the film based on an output of the light detection unit. 前記発光材料は蛍光材であり、
前記膜に所定波長の照明光を照射するための照射部をさらに備えていることを特徴とする請求項１に記載の膜厚測定装置。The light emitting material is a fluorescent material,
The film thickness measuring device according to claim 1, further comprising an irradiation unit for irradiating the film with illumination light having a predetermined wavelength. 外部から前記膜に達する不要光を遮るための遮蔽部をさらに備えていることを特徴とする請求項１または２に記載の膜厚測定装置。The film thickness measuring device according to claim 1, further comprising a shielding unit for shielding unnecessary light reaching the film from outside. 前記光検出部はＣＣＤカメラであり、
前記ＣＣＤカメラで検出した輝度情報に基づいて前記膜の厚さを算出するための処理部をさらに備えていることを特徴とする請求項１乃至３のいずれか１項に記載の膜厚測定装置。The light detection unit is a CCD camera,
4. The film thickness measuring apparatus according to claim 1, further comprising a processing unit for calculating a thickness of the film based on luminance information detected by the CCD camera. . ワーク上に形成された膜の厚さを測定する方法において、
前記膜を形成すべき物質に所定の発光材料を予め含有させ、
前記所定の発光材料を含有する物質で前記膜を形成し、
前記膜から検出した光の情報に基づいて前記膜の厚さを測定することを特徴とする膜厚測定方法。In a method for measuring the thickness of a film formed on a work,
A predetermined light emitting material is previously contained in the substance to be formed with the film,
Forming the film with a substance containing the predetermined light emitting material,
A film thickness measuring method, comprising: measuring a thickness of the film based on information of light detected from the film.
JP2002237727A 2002-08-19 2002-08-19 Apparatus and method for measuring film thickness Pending JP2004077270A (en)

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JP2007057497A (en) * 2005-08-26 2007-03-08 Matsushita Electric Works Ltd System and method for inspecting phosphor film thickness
JP2008145300A (en) * 2006-12-11 2008-06-26 Sharp Corp Phosphor layer thickness determination method and manufacturing method of light-emitting device
JP2008545140A (en) * 2005-06-30 2008-12-11 エイエムオー・ウェーブフロント・サイエンシーズ・リミテッド・ライアビリティ・カンパニー System and method for measuring curvature of optical surfaces
JP2010025904A (en) * 2008-07-24 2010-02-04 Central Japan Railway Co Coating thickness measurement method
JP2011053013A (en) * 2009-08-31 2011-03-17 Nof Corp Method of inspecting nanoimprint molding laminate
JP2016188801A (en) * 2015-03-30 2016-11-04 東京エレクトロン株式会社 Film thickness measurement device and film thickness measuring method
CN107179065A (en) * 2017-04-19 2017-09-19 常州市盛士达汽车空调有限公司 A kind of method of quick detection automobile air-conditioning pipe joint glue coating thickness

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JP2008545140A (en) * 2005-06-30 2008-12-11 エイエムオー・ウェーブフロント・サイエンシーズ・リミテッド・ライアビリティ・カンパニー System and method for measuring curvature of optical surfaces
JP2007057497A (en) * 2005-08-26 2007-03-08 Matsushita Electric Works Ltd System and method for inspecting phosphor film thickness
JP2008145300A (en) * 2006-12-11 2008-06-26 Sharp Corp Phosphor layer thickness determination method and manufacturing method of light-emitting device
JP2010025904A (en) * 2008-07-24 2010-02-04 Central Japan Railway Co Coating thickness measurement method
JP2011053013A (en) * 2009-08-31 2011-03-17 Nof Corp Method of inspecting nanoimprint molding laminate
JP2016188801A (en) * 2015-03-30 2016-11-04 東京エレクトロン株式会社 Film thickness measurement device and film thickness measuring method
CN107179065A (en) * 2017-04-19 2017-09-19 常州市盛士达汽车空调有限公司 A kind of method of quick detection automobile air-conditioning pipe joint glue coating thickness
CN107179065B (en) * 2017-04-19 2020-01-17 常州市盛士达汽车空调有限公司 Method for rapidly detecting thickness of glue applied to automobile air conditioner pipe joint

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