JP2003338478A - Separating method of brittle material and hard plate as well as separating device employing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily separate a brittle material bonded to a hard plate and avoid cracks or damages on the brittle material upon separating. <P>SOLUTION: The brittle material 10 is bonded to the hard plate 11 through an adhesive double coated sheet 12. The brittle material 10 is provided on the outer periphery of the same with a first notch 14 for locating while the hard plate 11 is provided with a second notch 16, configured so as to be substantially same as the first notch 14. The first and the second notches 14, 16 are respectively opposite and the brittle material 10 is bonded and fixed to the hard plate 11 through the adhesive double coated sheet 12 so as to expose the respective notches 14, 16. Thereafter, a stress is loaded on the exposed part of the adhesive double coated sheet 12 to separate the brittle material 10. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for peeling a brittle material, a hard plate used for the method, and a peeling device. TECHNICAL FIELD The present invention relates to a method for peeling a quality material, a hard plate used for the method, and a peeling device.

[0002]

2. Description of the Related Art Conventionally, a semiconductor wafer having a circuit pattern formed on its surface has been widely used in the electronic industry, the optical industry, and the like. Conventionally, the thickness of this semiconductor wafer has been ground to about 200 μm to 300 μm, but due to the recent demand for smaller and thinner IC chips, processing to an extremely thin thickness of about 50 μm is becoming mainstream. . Therefore, when the semiconductor wafer after grinding is stored and transported, the semiconductor wafer is likely to be cracked or scratched.
Therefore, before carrying out the grinding process, the semiconductor wafer is reinforced,
Moreover, in order to secure the handling property of the semiconductor wafer,
A method of fixing a semiconductor wafer to a hard plate such as a glass plate may be adopted. When fixing a semiconductor wafer to a hard plate, a method of sticking these via a wax is known.

[0003]

However, when sticking via the wax, it is difficult to apply the wax to a uniform thickness and it is difficult to smooth and grind the semiconductor wafer. In addition, the wax tends to stick out from the edge of the hard hard plate, which causes a problem in workability. Furthermore, after peeling the semiconductor wafer from the hard plate, it must be washed with an organic solvent, which is not preferable in that it causes pollution of the natural environment.

[0004] Therefore, the applicant of the present invention, Japanese Patent Laid-Open No. 2000-1
As disclosed in Japanese Patent No. 36362, there is proposed a method of sticking a hard plate and a semiconductor wafer using a double-sided pressure-sensitive adhesive sheet having pressure-sensitive adhesive layers on both sides of a heat-shrinkable film instead of wax.

However, when the sheet is stuck using the above-mentioned sheet, there arises a disadvantage that it cannot be used in a certain step of heat treatment after the grinding process. Moreover, since such a sheet is usually set to have substantially the same plane size as the semiconductor wafer, it is difficult to create a trigger to start peeling when the semiconductor wafer is peeled from the hard plate. Therefore, there is a problem that an excessive force is required in the initial stage of peeling and the semiconductor wafer is damaged, or peeling cannot be performed when careful operation is performed without applying force.

[0006]

SUMMARY OF THE INVENTION The present invention has been devised in view of such inconvenience, and an object thereof is to easily peel off a brittle material such as a semiconductor wafer attached to a hard plate, Another object of the present invention is to provide a brittle material peeling method capable of preventing the brittle material from cracking or scratching during peeling, a hard plate used for the method, and a peeling device.

[0007]

In order to achieve the above-mentioned object, the present invention peels off a brittle material having a first notch on the outer periphery while being fixedly attached to a hard plate via a double-sided adhesive sheet. In the method described above, the hard plate is provided with a second notch of substantially the same shape on the outer periphery of the first notch, the first and second notches face each other, and the hard notch is exposed to each notch. As to be put out, the double-sided adhesive sheet is arranged, the brittle material is stuck and fixed to the hard plate through this, and the brittle material is peeled off by applying stress to the exposed portion of the double-sided adhesive sheet. I am collecting. According to such a method, the end of the brittle material can be peeled off without applying an excessive force, and the peeled part is used as a trigger to peel off the peeled region between the brittle material and the double-sided pressure-sensitive adhesive sheet so as to gradually expand. Therefore, the load on the brittle material at the time of peeling can be reduced. Therefore, even a brittle material whose rigidity has decreased due to ultra-thinning can be easily peeled off from the hard plate, and cracking of the brittle material and the hard plate can be prevented. Moreover, since peeling can be performed without using an organic solvent as in the conventional case, it is possible to cope with recent environmental problems.

In the peeling method, when peeling the brittle material, a peeling promoting means may be interposed between the double-sided pressure-sensitive adhesive sheet and the brittle material. With such a method, the peeling resistance acting on the brittle material can be further reduced, and the peeling area between the brittle material and the double-sided pressure-sensitive adhesive sheet can be gradually peeled while gradually expanding.

Further, the brittle material in the present invention can be applied to a semiconductor wafer. By applying the present invention to such a semiconductor wafer, it is possible to sufficiently meet strict requirements for processing accuracy. Moreover, since the semiconductor wafer is generally provided with the first notch portion such as a notch indicating the directionality of the crystal, the semiconductor wafer can be peeled off by utilizing the notch without special processing.

Further, the present invention can be applied to a semiconductor wafer, which has been bonded and fixed to the hard plate, and then has a release surface ground to be processed into a thin thickness.

Further, according to the present invention, in a hard plate for fixing a brittle material having a first cutout on the outer circumference, a second cutout having substantially the same shape is provided in the first cutout. Is adopted. With such a structure, the double-sided pressure-sensitive adhesive sheet can be easily partially held when the brittle material is peeled off.

Further, in the peeling device according to the present invention, the brittle material having the first cutout portion on the outer periphery is provided with the second cutout portion having substantially the same shape as the first cutout portion via the double-sided adhesive sheet. In a peeling device for peeling the brittle material from a unit that is attached and fixed to a hard plate provided with, a fixing table that fixes the brittle material or hard plate side of the unit, and the first and second units. A structure is provided in which a stress applying means capable of applying stress to the double-sided pressure-sensitive adhesive sheet portion where the front and back surfaces are exposed is provided in the region of the notch.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a schematic perspective view of a hard plate and a brittle material before being attached via a sheet to which the method according to the present invention is applied, and FIG. 2 shows the hard plate and the pole. An enlarged cross-sectional view after applying the thin member is shown. In these figures, the brittle material 10 is attached to the plane of the hard plate 11 (the upper surface in FIG. 2) via the double-sided adhesive sheet 12.

The brittle material 10 has a first notch 14 on the outer periphery (on the right end side in FIG. 1). Such brittle material 10 includes, for example, a semiconductor wafer, a thin plate such as ceramics or glass, and in particular, a semiconductor wafer that is ground and has a thickness of about 100 μm or less is targeted. The semiconductor wafer usually has one V notch formed for positioning that indicates the orientation of the crystal, and this V notch is referred to as the first notch 14.

As the hard plate 11, for example, a glass plate, a quartz plate, a plastic plate such as an acrylic plate, a polyvinyl chloride plate, a polyethylene terephthalate plate, a polypropylene plate or a polycarbonate plate can be used. The hardness of the hard plate defined by ASTM D 883 is preferably 70 MPa or more. The thickness of the hard plate depends on its material, but is usually about 0.1 to 10 mm. Also,
When an ultraviolet curable adhesive is used for the adhesive layer of the double-sided adhesive sheet 12, the hard plate is made of an ultraviolet-transparent material. A second cutout portion 16 corresponding to the first cutout portion 14 is formed on the outer periphery (right end side in FIG. 1) of the hard plate 11. The shape of this second notch 16 is the first
It is processed so as to have substantially the same shape as the notch portion 14.

The double-sided pressure-sensitive adhesive sheet 12 used in the present invention comprises a base film 18, a pressure-sensitive adhesive layer 19 formed by coating on the side of the base film 18 to be attached to the brittle material 10, and the hard plate 1.
The pressure-sensitive adhesive layer 19 ′ is applied and formed on the side to be attached to 1. A polyester film such as a polyethylene terephthalate film or a polyethylene naphthalate film is preferably used because the base film 18 has excellent dimensional stability and heat resistance. The pressure-sensitive adhesive layers 19 and 19 ′ are not particularly limited as long as they are removable pressure-sensitive adhesives, but include rubber-based, acrylic-based, silicone-based, polyurethane-based, polyvinyl ether-based removable pressure-sensitive adhesives and An ultraviolet curable adhesive or a water-swellable adhesive is used.
Among the pressure-sensitive adhesive layers 19 and 19 ', the pressure-sensitive adhesive layer provided on the side of the adherend (brittle material 10 or hard plate 11) that is peeled first when the peeling operation is performed is a UV-curable pressure-sensitive adhesive. Particularly preferably, the agent comprises an agent. If the pressure-sensitive adhesive layer is a UV-curable pressure-sensitive adhesive and UV-cured before the peeling operation, even if the pressure-sensitive adhesive surface comes into contact with the adherend during the peeling operation, it will not re-adhere. The pressure-sensitive adhesive layer provided on the opposite surface of the pressure-sensitive adhesive layer (the side to be peeled off later) can use the above-mentioned pressure-sensitive adhesive, and the pressure-sensitive adhesive layers provided on both sides may be the same type of pressure-sensitive adhesive, May be different.

Hard plate 1 through the double-sided adhesive sheet 12
The brittle material 10 attached to No. 1 has, for example, FIGS.
The peeling device 21 shown in FIG. The peeling device 21 includes a fixed table 22 provided to hold and hold the brittle material 10, and first and second cutouts 14 and 16.
Pin 2 that can press the double-sided adhesive sheet 12 part in the area of
Between the stress applying means 24 having the No. 3 and the brittle material 10 and the double-sided pressure-sensitive adhesive sheet 12 as the separation promoting means
And a nozzle 26 (see FIG. 4) capable of ejecting air. The pin 23 and the nozzle 26 are supported by a robot arm (not shown) or the like, and are provided so as to be movable relative to the vicinity of the position facing the notches 14 and 16 on the fixed table 22. In addition, each device constituting the peeling device 21 and the like are wholly controlled by a control device (not shown).

As described above, by inserting the compressed air A between the brittle material 10 and the double-sided pressure-sensitive adhesive sheet 12, the double-sided pressure-sensitive adhesive sheet 12 can be easily peeled off from the periphery of the pressing position so as to gradually expand the peeling region. And brittle material 10
It is possible to minimize the peeling resistance between the double-sided adhesive sheet 12 and. Moreover, since the double-sided pressure-sensitive adhesive sheet 12 is partially exposed in the first and second notches 14 and 16,
The brittle material 10 can be peeled off by pressing the double-sided pressure-sensitive adhesive sheet 12 reasonably and firmly.

In the above description, the brittle material 10 is held by the fixed table 22 and the brittle material 10 is peeled from the double-sided adhesive sheet 12 together with the hard plate 11, but the present invention is not limited to this. Instead of holding the hard plate 11 by a fixed table 22,
After peeling the double-sided pressure-sensitive adhesive sheet 12 from the hard plate 11 together with the brittle material 10, the double-sided pressure-sensitive adhesive sheet 12 may be peeled from the brittle material 10. However, the method of peeling the interface between the brittle material 10 and the double-sided pressure-sensitive adhesive sheet 12 is advantageous in that the number of steps can be reduced.

Further, the pin 2 which is the stress applying means 24.
Although the case where 3 is pushed up from the lower portion of the fixed table 22 has been described, the present invention is not limited to this, and pins are pressed from the upper portion of the fixed table 22 or the fixed table 22 is moved.
Both the fixed table 22 and the holding means 24 may be moved to peel off the brittle material 10. In short, according to the present invention, the stress applying means 24 is provided to the brittle material 10 with respect to the exposed portion of the double-sided pressure-sensitive adhesive sheet 12 located in the notches 14 and 16.
It suffices to be able to move relative to each other so as to peel off.

Further, the pin 23 constituting the stress applying means 24 is not limited to the illustrated constitutional example, but stress can be applied to the double-sided adhesive sheet 12 in the first and second notches 14 and 16. If possible, for example, a hook or a chuck may be substituted.

Further, compressed air A is used as the peeling promoting means.
However, a liquid such as water, water vapor, a wire, or a spatula-shaped thin plate may be used as long as it exhibits the same action and effect.

Further, instead of interposing the peeling promoting means, stress is applied to the exposed portion of the double-sided pressure-sensitive adhesive sheet 12 located in the first and second notches 14 and 16 to apply the stress to the double-sided pressure-sensitive adhesive sheet 12. After peeling off the end portion, an adhesive sheet having a larger area than that of the brittle material 10 is attached to the brittle material 10 side, and the adhesive sheet is separated from the hard plate 11 to remove the brittle material 10 from the hard plate. You may peel by transferring from 11 to an adhesive sheet.

Further, the brittle material 10 and the hard plate 11 were attached via the double-sided pressure-sensitive adhesive sheet 12, and the sheet is an explanatory concept corresponding to the brittle material 10 having a wide surface. It also includes an elongated tape.

[0026]

According to the present invention, the double-sided pressure-sensitive adhesive sheet is arranged so as to be exposed in the first cutout portion of the brittle material and the second cutout portion of the hard plate, and is provided in the exposed portion of the double-sided pressure-sensitive adhesive sheet. By applying stress and peeling the brittle material, it is possible to peel the brittle material and the double-sided pressure-sensitive adhesive sheet so that the peeling area gradually expands, and it is possible to peel the brittle material with less load. Become. Thereby, the brittle material can be easily peeled off from the hard plate, and cracks, scratches, etc. of the brittle material can be effectively avoided.

[0027]

EXAMPLES A specific peeling method of the present invention will be described below.

First, as the material to be the brittle material 10, 2
Semiconductor silicon wafer 10 having a diameter of 00 mm and a thickness of 725 μm
(With a V notch (first notch 14) having a size of about 2 mm) was used. As will be described later, the silicon wafer 1
A brittle material was obtained by grinding 0 to 50 μm. As the hard plate 11, a glass plate 11 (soda lime glass) having a diameter of 200 mm and a thickness of 700 μm was used, and one end of the outer peripheral portion was shaved to form a second cutout portion 16 having a size of about 2 mm. The double-sided pressure-sensitive adhesive sheet 12 has a polyethylene naphthalate (PEN, thickness 25 μm), which has a UV-curable pressure-sensitive adhesive layer made of an acrylic polymer having a UV-curable functional group.
A double-sided UV-curable double-sided pressure-sensitive adhesive sheet having a thickness of 20 μm formed on both sides of the base film 18 made of m) was used. First, using a tape laminator (Adwill RAD3500 / m12 manufactured by Lintec Co., Ltd.), one side of the double-sided pressure-sensitive adhesive sheet 12 is attached to the silicon wafer 10 (mirror side), and the double-sided pressure-sensitive adhesive sheet 12 is then attached.
Was cut along the outer periphery of the silicon wafer 10 (on the extension of the arc, excluding the notches 14 and 16). Next, double-sided sticking device (Adwill RAD8 manufactured by Lintec Corporation)
001LA) to the glass plate 1 on the opposite side of the adhesive.
1 and a silicon wafer 1 as shown in FIG.
0 was fixed on the glass plate 11. Next, the silicon wafer 10 fixed to the glass plate 11 was mounted on a grinding machine (Disco, DFG-840), and the silicon wafer 10 was ground until the finished thickness became 50 μm. Next, an ultraviolet irradiation device (Adwill, manufactured by Lintec Co., Ltd.)
RAD2000 / m8) is used to irradiate ultraviolet rays from the glass plate 11 side to form each pressure-sensitive adhesive layer 1 of the double-sided pressure-sensitive adhesive sheet 12.
Both 9 and 19 'were cured. Next, as shown in FIG. 3, after the silicon wafer 10 and the glass plate 11 are turned upside down and the silicon wafer 10 is placed and held on the fixed table 22, the pins 23 and the nozzles 26 as the stress applying means 24 are moved to the first position. The pin 23 moves to the vicinity of the first and second notches 14 and 16, and the pin 23 moves the first and second notches 14 and 16.
The double-sided pressure-sensitive adhesive sheet 12 in 16 was lifted to apply stress. At this time, the silicon wafer 10 and the double-sided adhesive sheet 12
When a gap S is generated between the nozzle 2 and the nozzle 2
From No. 6, compressed air A as a separation promoting means was interposed.
In this way, the pin 23 was moved upward while the compressed air A was interposed, and the silicon wafer 10 was peeled from the double-sided adhesive sheet 12. The silicon wafer 10 could be separated from the glass plate 11 without being damaged.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing a state before a brittle material to which the method of the present invention is applied is attached to a hard plate via a sheet.

FIG. 2 is a schematic cross-sectional view showing a state in which a brittle material and a hard plate are attached.

FIG. 3 is a cross-sectional view showing a state before peeling a brittle material and a hard plate.

FIG. 4 is an enlarged cross-sectional view showing an intermediate state in which a brittle material and a hard plate are separated.

[Explanation of symbols]

10 Brittle materials (semiconductor silicon wafers) 11 Hard plate (glass plate) 12 Double-sided adhesive sheet 14 First notch 16 Second notch 21 Peeling device 22 Fixed table 23 pin 24 Stress adding means 26 nozzles A Compressed air (Peeling promoting means)

Continued front page    (72) Inventor Hideo Senoo             23-23 Honmachi, Itabashi-ku, Tokyo Lintec Co., Ltd.             Inside the company

Claims (6)

[Claims] 1. A method of peeling a brittle material having a first cutout portion on the outer periphery while being fixed to a hard plate via a double-sided adhesive sheet, wherein the hard plate is the first cutout portion. A second cutout portion having substantially the same shape on the outer circumference, the first and second cutout portions are opposed to each other, and the double-sided pressure-sensitive adhesive sheet is arranged so as to be exposed in each cutout portion. A method for peeling a brittle material, which comprises: sticking and fixing the brittle material to a hard plate via the sheet, and applying stress to the exposed portion of the double-sided pressure-sensitive adhesive sheet to peel the brittle material. 2. The method for peeling a brittle material according to claim 1, wherein a peeling promoting means is interposed between the double-sided pressure-sensitive adhesive sheet and the brittle material when peeling the brittle material. 3. The method for peeling a brittle material according to claim 1, wherein the brittle material is a semiconductor wafer. 4. The method for peeling a brittle material according to claim 3, wherein the semiconductor wafer is obtained by sticking and fixing the semiconductor wafer to the hard plate and then grinding the release surface to reduce the thickness. 5. A hard plate for fixing a brittle material having a first cutout portion on the outer periphery thereof, wherein the first cutout portion is provided with a second cutout portion having substantially the same shape. And a hard plate. 6. A brittle material having a first cutout on its outer periphery is attached to a hard plate having a second cutout of substantially the same shape as the first cutout via a double-sided adhesive sheet. In a peeling device for peeling the brittle material from a unit fixedly attached and fixed, a fixing table for fixing the brittle material or hard plate side of the unit, and front and back surfaces in the regions of the first and second cutouts. A peeling device comprising: a stress applying means capable of applying stress to a double-sided pressure-sensitive adhesive sheet portion whose surface is exposed.