JP2003326640A - Adhesion structure of metal panel and adhesion method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an adhesion structure and an adhesion method adapted to the adhesion of a metal panel 1 to a porous member 4 such as a particle board, wood or the like, having heat-resistant adhesiveness and easily peeling a metal panel by heating to sort and discard the same. <P>SOLUTION: An adhesive layer 3 is provided on the porous member 4 and a thermally peelable layer 2 containing a thermally peelable component generating expansion or gas by heating is provided on the adhesive layer 3 and a metal panel is provided on the thermally peelable layer 2. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding structure and a bonding method for a metal panel on a cooktop or sink of a system kitchen and a top panel around a stove.

[0002]

2. Description of the Related Art In a kitchen kitchen tabletop, a top panel around a sink and a stove, a metal panel such as stainless steel or painted steel plate is bonded with an adhesive on a porous member such as particle board or wood. . Since the cooked pot or frying pan is placed directly on the cooktop of the system kitchen, the adhesive used for such joining is required to have heat resistance. Generally, an acrylic adhesive or epoxy with good heat resistance is required. A reactive adhesive such as a system adhesive is used.

On the other hand, although the reduction of waste has become a problem in industry in recent years, many system kitchens use different materials such as metal panels such as stainless steel plates and porous members such as particle boards and wood as described above. It is bonded with a reactive adhesive like this. Since reactive adhesives have good durable adhesion,
It is difficult to disassemble, and it is difficult to disassemble the metal panel and the porous member when disposing of the cooking table and the like of the system kitchen, and it is not possible to separately dispose of these.

As an adhesive that can be easily peeled off by heating when separating and discarding,
A pressure-sensitive adhesive prepared by blending expandable microspheres that expand by heating (Japanese Patent Laid-Open No. 56-61468) or a polymer having controlled dynamic viscoelasticity with a foaming agent (Japanese Patent No. 2970963). Gazette) is proposed. However, these adhesives can easily be peeled off by the contact of heated cooking utensils such as pots and pans that can occur normally, so they can be used to join the top panel in the cooktop of the system kitchen. It wasn't an adhesive that could.

In addition, when a metal panel is adhered by applying an adhesive containing a component that expands or generates gas by heating on a porous member such as particle board or wood, heat it for separate disposal. Even when peeling, the stress due to expansion and gas generation in the adhesive layer is not sufficiently generated between the porous member and the metal panel, and the metal panel cannot be peeled easily. It is considered that this is because expansion in the adhesive layer is relaxed by the porous member, or gas generated in the adhesive layer escapes through the porous member.

An object of the present invention is an adhesive structure and an adhesive method for adhering a metal panel on a porous member such as particle board or wood, which has heat-resistant adhesiveness and easily peels off the metal panel by heating. It is an object of the present invention to provide a bonding structure and a bonding method for a metal panel that can be separately sorted and discarded.

[0007]

An adhesive structure for a metal panel of the present invention is an adhesive structure for adhering a metal panel on a porous member, and an adhesive layer provided on the porous member and the adhesive. It is characterized by comprising a heat-peelable layer provided on the layer and containing a heat-peelable component that expands or generates a gas when heated, and a metal panel provided on the heat-peelable layer.

In the present invention, the heat-peelable layer containing a heat-peelable component which expands or generates gas by heating is
It is provided on the adhesive layer provided on the porous member. Therefore, the adhesive layer is present between the heat release layer and the porous member. Since the porous portion of the surface of the porous member is filled with the adhesive layer, the expansion or gas generation generated in the heat peeling layer is given to the adhesive layer, and the stress required for peeling is applied. Can be generated.

In the present invention, the heat-peelable component contained in the heat-peelable layer is preferably a component which expands or generates a gas at a temperature of 200 ° C. or higher. By using such a component, it is possible to impart the heat resistance required for the cooking table of the system kitchen. Therefore, it is possible to prevent peeling from occurring due to contact with a heated cooking utensil such as a pot or a frying pan that normally occurs.

As the heat-peelable component which expands at a temperature of 200 ° C. or higher, thermally expanded graphite can be mentioned. Thermal expansion graphite is
Not only expansion by heating, but also gas is generated,
It is particularly useful as a heat peeling component used in the present invention.

Examples of the heat-peeling component that generates gas at 200 ° C. or higher include metal hydroxides such as aluminum hydroxide and magnesium hydroxide. The adhesive used for the adhesive layer in the present invention is not particularly limited, but an acrylic adhesive and an epoxy adhesive are preferably used. These adhesives have the heat resistant adhesiveness required for a cooking table or the like. Among these, a two-liquid mixed type adhesive that is curable at room temperature is particularly preferably used. Further, a urethane-based adhesive can also be used as the two-liquid mixed type adhesive. Further, a moisture curing type urethane adhesive, a reactive hot melt adhesive, etc. can be used. As a two-component mixed type adhesive, a two-component mixed type acrylic adhesive (generally S
(Called GA) is particularly preferably used.

The heat-peelable layer in the present invention generally contains a binder together with the heat-peelable component. The binder is not particularly limited as long as it has good adhesiveness to the adhesive layer and the metal panel. As the binder having good compatibility with the adhesive layer, one having a structure similar to that of the adhesive used for the adhesive layer is preferably used. The adhesive layer
For example, when it is formed from a two-liquid mixed type adhesive, it is preferable to use at least one component of the adhesive as the binder of the heat treatment layer. In this case, it is not necessary that the components are completely the same, as long as they have similar structures. For example, when an acrylic adhesive is used for the adhesive layer, an acrylic monomer or acrylic oligomer can be used. When an epoxy adhesive is used for the adhesive layer, an epoxy resin (liquid bisphenol A type epoxy resin or bisphenol F type epoxy resin) is used.
Can be used.

The content of the heat-peelable component contained in the heat-peelable layer can be appropriately selected in consideration of the kind of the heat-peelable component to be used. The content of the heat peeling component is generally preferably about 1 to 60 parts by weight, more preferably 10 to 40 parts by weight, based on 100 parts by weight of the total of the binder and the solvent forming the heat peeling layer. is there. When the content of the heat peeling component is low, the effect of peeling during heating may not be sufficiently obtained. Further, when the content of the heat-peelable component is large, the viscosity of the heat-peelable agent for forming the heat-peelable layer becomes high, and therefore the thickness of the heat-peelable layer becomes large, and the adhesiveness of the metal panel becomes insufficient, It may cause a problem in terms of durability.

The heat-peelable layer may contain a component other than the above-mentioned heat-peelable component. For example, a thixotropic agent such as organic bentonite or fumed silica may be added for the purpose of preventing sedimentation and separation of the heat-peelable component. Further, the heat release agent for forming the heat release layer may contain a solvent.

FIG. 1 is a schematic sectional view showing a bonding structure of a metal panel according to the present invention. As shown in FIG. 1, the adhesive layer 3 is provided on the porous member 4, and the heat release layer 2 is provided on the adhesive layer 3. The metal panel 1 is provided on the heat release layer 2. In the present invention, the heat-peelable layer 2 contains a heat-peelable component that expands or generates gas when heated.

The method for adhering a metal panel of the present invention is a method for adhering a metal panel on a porous member, which comprises a step of applying an adhesive on the porous member and the above heat peeling on the metal panel. A step of applying a heat release agent containing components, and a step of bonding a metal panel coated with the heat release agent onto the porous member so that the application surface of the heat release agent overlaps the application surface of the adhesive. It is characterized by having.

As the adhesive and the heat release agent, the same ones as those used in the above-mentioned metal panel adhesive structure of the present invention can be used. The bonding structure of the metal panel of the present invention is not limited to that formed by the above-described bonding method of the present invention. For example, a heat release agent may be applied on a metal panel, an adhesive agent may be applied thereon, and then a porous member may be attached thereon.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail based on Examples of the present invention. However, the present invention is not limited to the following Examples and the scope is not changed. It can be implemented by appropriately changing it.

<Preparation of Heat Release Agent> The following heat release agents were used as the binder of the heat release agent to prepare the heat release agents of Formulation Examples 1 and 2. -Nippon Paint Co., Ltd. "Power Tight SGA-707" A agent: Two-component acrylic adhesive A agent, viscosity 6000 mP
a ・ s (20 ℃, BH type rotational viscometer No.6 rotor 1
(0 rotation)

(Formulation Example 1) 20 parts by weight of MEK (methyl ethyl ketone) and 40 parts by weight of thermally expanded graphite were added to 80 parts by weight of the above binder, and the mixture was uniformly dispersed with a stirrer to obtain the heat release agent of the formulation example 1. Prepared.

(Formulation Example 2) To 80 parts by weight of the above-mentioned binder, 20 parts by weight of MEK (methyl ethyl ketone) and 40 parts by weight of aluminum hydroxide were added and uniformly dispersed with a stirrer to prepare the heat release agent of Preparation Example 2. Prepared.

<Adhesion of Stainless Panel> The following adhesives were used as the adhesives, and Examples 1 and 2 and Comparative Examples 1 and 2 were used.
A metal panel was bonded to the particle board as shown in 2.・ "Paintight SGA-705" manufactured by Nippon Paint Co., Ltd .:
Two-component acrylic adhesive, each viscosity of agent A and agent B 22,000 mPa · s (20 ° C, BH type rotational viscometer N
o. 6 rotors 10 rotations)

Example 1 Compounding Example 1 for Stainless Panel
The heat release agent of was applied so that the thickness after drying would be 150 μm, and then left at room temperature for 20 minutes to volatilize and dry MEK. The thickness of the above adhesive is 4 on the particle board.
After coating so as to have a thickness of 00 μm, the stainless panel coated with the above heat release agent is placed on the particle board so that its coated surface overlaps with the adhesive layer, and the temperature is kept at room temperature for 20 minutes.
After fixing for a minute, a stainless panel was attached to the particle board.

(Example 2) Compounding example 2 for stainless steel panel
The heat release agent of was applied so that the thickness after drying would be 150 μm, and then left at room temperature for 20 minutes to volatilize and dry MEK. The thickness of the above adhesive is 4 on the particle board.
After coating so as to have a thickness of 00 μm, the stainless panel coated with the above heat release agent is placed on the particle board so that its coated surface overlaps with the adhesive layer, and the temperature is kept at room temperature for 20 minutes.
After fixing for a minute, a stainless panel was attached to the particle board.

Comparative Example 1 An adhesive 100 was added to the above adhesive.
Aluminum hydroxide was mixed so as to be 40 parts by weight with respect to parts by weight, and this was mixed on a particle board with a thickness of 55
After being applied so as to have a thickness of 0 μm, the stainless panel was left as it was (that is, without applying the heat release agent), and Example 1 was applied.
It stuck in the same manner as.

(Comparative Example 2) The above adhesive was applied to a particle board so as to have a thickness of 400 μm, and then the stainless panel was left as it was (that is, without applying the heat release agent) in the same manner as in the above Example 1. Pasted together

<Evaluation of Heat Resistance> Joining of Stainless Panel and Particle Board Joined in Examples 1-2 and Comparative Examples 1-2 A frying pan containing 160 ° C. tempura oil was placed on the stainless panel of plywood for 1 hour. Then, the presence or absence of peeling of the bonded plywood after that was evaluated.

The heat resistance was evaluated according to the following criteria. ○: No peeling ×: peeling The evaluation results are shown in Table 1.

<Evaluation of releasability after heating> The stainless panel side of the bonding plywood of the stainless panel and the particle board bonded in Examples 1-2 and Comparative Examples 1-2 was heated to 400 ° C. with a direct-type burner. It was heated so that it was cooled to room temperature, and the peeled state at that time was observed. The peelability after heating was evaluated according to the following criteria.

◯: The stainless steel panel is peeled off. X: Partly peeled, but there is adhesive force and the members cannot be easily separated. Table 1 shows the above evaluation results.

[0031]

[Table 1]

As is clear from the results shown in Table 1, both Examples 1 and 2 and Comparative Examples 1 and 2 have good heat resistance, but in Comparative Examples 1 and 2, heating by a direct type burner is used. Could not be peeled off easily. In Comparative Example 1, although the adhesive layer contained the heat release agent, it could not be easily released.
It is considered that this is because the gas generated from the heat release agent escaped to the porous portion of the particle board, and the stress for peeling did not occur.

[0033]

According to the present invention, the metal panel can be easily separated and separated and discarded by heating at the time of disposal without impairing the heat resistance in practical use.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a bonding structure of a metal panel according to the present invention.

[Explanation of symbols]

1 ... Metal panel 2 ... Heat release layer 3 ... Adhesive layer 4 ... Porous member

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C09J 163/00 C09J 163/00 (72) Inventor Takahiro Nakano 19-17 Ikedanaka-cho, Neyagawa-shi, Osaka Japan Into Inc. F-term (Reference) 4F100 AA17C AA37C AB00B AB04 AK25G AK53G AR00C AS00G BA03 BA07 BA10A BA10B DJ00A EC18 EC182 EH46 EH462 EJ86 EJ862 GB81 GB90 JJ03 JL11 JL14 JL14C YY00C 4J040 PA01 001

Claims (6)

[Claims] 1. An adhesive structure for adhering a metal panel onto a porous member, comprising: an adhesive layer provided on the porous member; and an adhesive layer provided on the adhesive layer and expanded or heated by heating. An adhesive structure for a metal panel, comprising: a heat release layer containing a heat release component to be generated; and a metal panel provided on the heat release layer. 2. The adhesive structure for a metal panel according to claim 1, wherein the heat-peelable component is a component that expands or generates gas at a temperature of 200 ° C. or higher. 3. The adhesion of a metal panel according to claim 1, wherein the heat-peelable component is thermally expanded graphite that expands by heating and / or metal hydroxide that generates gas by heating. Construction. 4. The adhesive structure for a metal panel according to claim 1, wherein the adhesive layer is formed of an acrylic adhesive or an epoxy adhesive. 5. The adhesive layer is formed of a two-liquid mixed type adhesive, and the heat release layer contains at least one component of the adhesive as a binder. The adhesive structure for a metal panel according to claim 1. 6. A method for adhering a metal panel on a porous member, the step of applying an adhesive on the porous member, and a heat-peeling component for expanding or generating gas by heating on the metal panel. A step of applying a heat release agent containing, and a step of laminating a metal panel coated with the heat release agent on the porous member so that the application surface of the heat release agent overlaps the application surface of the adhesive. A method of bonding a metal panel, comprising: