JP2003304086A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a water cooling structure ensuring stabilized liquid circulation to the increase in heat being generated from heat generating elements incident to the enhancement of processing performance of a mobile electronic apparatus. <P>SOLUTION: Piping is extended to the central position of the tank of a water cooling system on the side where cooling water flows out from the tank. Furthermore, protrusions and recesses are provided in the vicinity of inlet part of the piping through which the cooling water flows out. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device equipped with a cooling device that circulates water through a heat-generating element to cool the element.

[0002]

2. Description of the Related Art The prior art is, for example, Japanese Patent Application Laid-Open No. 7-14288, which describes a movable electronic device having a water cooling device.
6 and JP 2001-24372. Further, as an example in which a tank is arranged in a piping system of a water cooling module for cooling a heat generating portion of an electronic device, for example, JP-A-6-125188 and JP-A-9-26838.
No. 6 publication is cited. Further, as a structure in which the pump does not suck air even if the water level in the tank fluctuates, JP-A-2-209685 and JP-A-5-312143 are known.
The gazette is given. In particular, as seen in JP-A-5-312143, in order to avoid air inclusion in a fuel tank of an automobile or the like, a discharge port of a submersible pump with a float in a water receiving tank and a filter are connected by a hose, It is designed to be able to move up and down according to the water level in the tank.

[0003]

None of the above-mentioned publicly known examples considers air inclusion when the position of the tank is changed (upside down). That is, when the position of the tank changes, gas such as air may be sucked into the pump. In this case, there is also a problem that the cooling performance of the water cooling system is significantly deteriorated, and the heating element cannot be cooled sufficiently.

It is an object of the present invention to provide an electronic device provided with a cooling device capable of stably supplying liquid circulation in response to an increase in the amount of heat generated by a heating element due to improvement in processing performance of a movable electronic device. is there.

[0005]

The above object is to provide a water cooling jacket thermally connected to a heat generating element, a heat radiation pipe connected to the water cooling jacket, a tank connected to the heat radiation pipe, and a tank connected to the tank. In an electronic device in which the liquid driving means is housed in a case, the discharge port is provided at the center of the tank, and the surface tension generating portion is provided at the center of the tank.

Further, the above object is to provide a water cooling jacket thermally connected to the heating element, a heat radiation pipe connected to the water cooling jacket, and a tank connected to the heat radiation pipe.
In an electronic device in which a liquid driving means connected to the tank is housed in a case, a discharge port is provided at the center of the tank, and an uneven portion is provided at the center of the tank.

Further, the above object is to provide a water cooling jacket thermally connected to the heating element, a heat radiation pipe connected to the water cooling jacket, and a tank connected to the heat radiation pipe.
In an electronic device in which a liquid driving means connected to the tank is housed in a case, a discharge port is provided in the central portion of the tank, and a portion other than the central portion of the tank is a water repellent portion.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Electronic devices, so-called personal computers, are required to be smaller and have higher performance, and accordingly, elements (C
PU) heat generation temperature is high. By the way, conventionally, forced air cooling by a fan is generally used for cooling this electronic device. However, it is the current situation that the fan installation space has been exhausted due to the miniaturization and that the air cooling system using the fan has a limit to cooling. Certainly, if you rotate the fan at high speed, it can be supported to some extent,
Rotating at high speed creates a new noise problem.

As a cooling method that replaces the forced air cooling method, there is a water cooling method in which water or the like is circulated for cooling. This water cooling system has been used for cooling large computers that process a large amount of information such as companies and banks. This cooling device is a large-scale cooling facility in which water is circulated by a pump to cool the CPU and the hot water is cooled by an outdoor dedicated cooling device.

Such a water cooling / cooling facility cannot be simply connected to a personal computer having a high movement frequency. Therefore,
The inventors of the present invention have been able to introduce a water cooling device into a personal computer by utilizing an ultra-small pump, heat dissipation of the personal computer housing, and the like. Specifically, a cooling unit in which a water cooling jacket in contact with the CPU, a pump for supplying water to the water cooling jacket, a water storage tank, and a heat radiation pipe are connected by flexible tubes is incorporated in a personal computer. .

However, a new problem occurs when the water cooling device is installed in a personal computer. That is, since the personal computer is small, it is highly mobile and can be moved frequently.
In particular, notebook computers may even be upside down due to the spread of mobile. If the water is turned upside down, the water in the tank is biased to one side, and the pump sucks gas, which prevents the water from being circulated.

Therefore, the inventors of the present invention have installed a pipe on the side where the cooling water flows out from the tank by extending it to the center position of the tank, and further mounting the cooling water inflow / outlet port portion of the pipe extended to the center position of the tank. An uneven portion is provided on the nearby wall.

The details of the present invention will be described below with reference to the drawings. An embodiment of the present invention is shown in FIG. FIG. 1 is a perspective view of the electronic device of this embodiment. In FIG. 1, the electronic device is
It is composed of a main body case 1 and a display case 2 having a display, a keyboard 3 installed in the main body case 1, a wiring board 4 having a plurality of elements mounted thereon, a hard disk drive 5, an auxiliary storage device (for example, floppy (registered trademark)). Disk drive, CD drive, etc.) 6 etc. are installed. On the wiring board 4, an element such as a CPU (central processing unit) 7 having a particularly large heat generation amount (hereinafter, CPU)
Will be installed. A water cooling jacket 8 is attached to the CPU 7. The CPU 7 and the water cooling jacket 8 are connected via a flexible heat conducting member (for example, Si rubber mixed with a heat conducting filler such as aluminum oxide). Further, on the back surface (inside the case) of the display case 2, a metal heat dissipation plate 10 to which a heat dissipation pipe 9 is connected is installed. The display case 2 itself may be made of metal (for example, an aluminum alloy or a magnesium alloy), and the metal heat dissipation plate 10 may be omitted, and the heat dissipation pipe 9 may be directly connected to the display case 2.

Further, a pump 11 which is a liquid transportation means is provided in the main body case 1, and a reservoir tank 1 for storing cooling water is provided.
3 is installed in the display case 2. The water cooling jacket 8, the radiating pipe 9, the pump 11, and the reservoir tank 13 are connected by a flexible tube 12, and cooling water (for example, water, antifreeze liquid, etc.) sealed inside by the pump 11 circulates. The heat generated by the CPU 7 is transmitted to the cooling water flowing in the water cooling jacket 8, and is radiated to the outside air from the metal heat radiating plate 10 installed on the back surface of the display through the surface of the display case 2 while passing through the heat radiating pipe. The cooling water whose temperature has dropped due to this is pump 1
It is again sent to the water cooling jacket 8 via 1.

FIG. 2 is a schematic view of the reservoir tank 13 of the water cooling system shown in FIG. In FIG. 2, the reservoir tank 13 has a cooling water fluid region 20 and a gas region 21, and a boundary 22 between them, and has a lid 14 that opens when cooling water is injected and that prevents cooling water leakage. It should be noted that the fluid inlet 19 is provided on the right side 16 toward the front side 15 of the electronic device of FIG.
There is a piping hole that is. Also, on the left side 17 is a hollow tube 23 having a fluid outlet 18. The fluid flow direction 27 is from the fluid inlet 19 to the fluid outlet 18. Fluid outlet 1
The hollow tube 23 of 8 extends to the center of the reservoir tank 13.

An uneven portion 35 is formed on the wall surface near the middle space 23 extending to the center. By providing this uneven portion 35, the fluid always exists in the fluid outlet 18 due to the surface tension of the wall surface. Further, due to the uneven portion 35, the fluid outlet 18
Increase the flow velocity in the vicinity, increase the pressure, and keep the air layer away. Therefore, the water cooling system does not suck air and has a high reliability. Moreover, the amount of water vapor passing through the wall surface can be suppressed by the uneven portion provided in the tank.

FIG. 3 shows a plan view of the reservoir tank 13 during normal operation of the electronic device. In FIG. 3, the display is in a substantially vertical state during normal operation. Front side 1
The hollow tube 23 extends to the center of the reservoir tank 13 when viewed from 5. The boundary surface 22 which is the water surface is the hollow tube 23.
Since it is located below the water surface, only cooling water can flow out without discharging air, and a stable cooling water flow rate of the water cooling system can be supplied. Although the position of the fluid inlet 19 is located at the bottom of the right side surface 16, it may be provided at any position on any side surface.

As in the case of FIG. 2, there is an uneven portion 35 on the wall surface near the middle space 23 extending to the center. This uneven portion 3
By providing 5, the fluid always exists in the fluid outlet 18 due to the surface tension of the wall surface. Furthermore, due to the uneven portion 35,
The flow velocity near the fluid outlet 18 is increased, the pressure is increased, and the air layer is not attracted. Therefore, the water cooling system does not suck air and has a high reliability.

FIG. 4 shows a plan view of the reservoir tank 13 when the electronic device is fully opened. In FIG. 4, the movable electronic device may use the display opened 180 degrees. The fluid region 20 of the reservoir tank 13 at that time
And the position of the boundary surface 22 of the gas region 21. Figure 3
Different from the normal operating status in case of. The boundary surface 22 is visible on the right side surface side 16 and the left side surface side 17. Even in this case, the hollow tube 23 of the fluid outlet 18 is below the water surface.

Therefore, only the cooling water can flow out without discharging the air, and the stable cooling water flow rate of the water cooling system can be supplied. As in the case of FIG.
The position of the fluid inlet 19 is located at the center of the right side surface 16, but it may be provided at any position on any side surface. Figure 2
As in the case of, the uneven surface 35 is provided on the wall surface near the middle space 23 extending to the center. By providing this uneven portion 35, the fluid always exists in the fluid outlet 18 due to the surface tension of the wall surface. Further, the uneven portion 35 increases the flow velocity near the fluid outlet 18, increases the pressure, and prevents the air layer from approaching. Therefore, the water cooling system does not suck air and has a high reliability.

FIG. 5 shows a plan view of the reservoir tank 13 when the boundary surface 22 between the fluid region 20 and the air region 21 is inclined. In FIG. 5, the boundary surface 22 appears on the front side 15, but the same can be said when the boundary surface 22 appears on the right side 16 and the left side 17. Even if the boundary surface 22 is oblique, the hollow tube 23 of the fluid outlet 18 is below the water surface. This boundary surface 2
The state in which 2 is oblique occurs when the electronic device is moving. At this time, a case of sloshing in which the boundary surface 22 changes in a wave shape is included. Therefore, even if the boundary surface 22 is oblique, only the cooling water can flow out without discharging the air, and a stable cooling water flow rate of the water cooling system can be supplied. The position of the fluid inlet 19 is 1 on the right side.
Although it is located at the bottom of 6, it may be provided at any position on any side surface. As in the case of FIG. 2, the middle space 2 extending to the center
There is an uneven portion 35 on the wall surface in the vicinity of 3. This uneven portion 35
By providing, the fluid always exists in the fluid outlet 18 due to the surface tension of the wall surface. Further, the uneven portion 35 increases the flow velocity near the fluid outlet 18 to increase the pressure,
Keep the air layer away. Therefore, the water cooling system does not suck air and has a high reliability.

In FIG. 6, when the inner surface of the reservoir tank 13 is subjected to the water repellent treatment, the wall surface near the central portion is masked so that the water repellent treated portion 36 is not formed. As a result, the wall surface water repellent part 36
The cooling water is always present in the fluid outlet 18, and the uneven portion 35 increases the flow velocity near the fluid outlet 18 to increase the pressure and prevent the air layer from approaching. Therefore, the water cooling system does not suck air and has a high reliability.

[0023]

According to the present invention, it is possible to provide an electronic device provided with a cooling system capable of stably supplying water, since the pipe on the side where the cooling water flows out in the tank is always under the water surface.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic device equipped with the present invention.

FIG. 2 is a schematic perspective view of a reservoir tank of the present invention.

FIG. 3 is a plan view of a reservoir tank according to the present invention (during normal operation of an electronic device).

FIG. 4 is a plan view (when the electronic device is fully opened) of the reservoir tank of the present invention.

FIG. 5 is a plan view of the reservoir tank of the present invention (first time when moving the electronic device).

FIG. 6 is a plan view of the reservoir tank of the present invention (when the electronic device is moved, part 2).

[Explanation of symbols]

1 ... Main body case, 2 ... Display case, 3 ... Keyboard, 4 ... Wiring board, 5 ... Hard disk drive, 6
... Auxiliary storage device, 7 ... CPU, 8 ... Water cooling jacket, 9
... Radiation pipe, 10 ... Radiation metal plate, 11: Pump, 1
2: flexible tube, 13: reservoir tank, 1
4 ... Lid, 15 ... Front side, 16 ... Right side, 17 ... Left side, 18 ... Liquid outlet, 19 ... Liquid inlet, 20 ... Fluid region, 21 ... Air region, 22 ... Boundary surface, 23 ... Hollow tube, 27 ... Fluid flow direction, 35 ... Concavo-convex portion, 36 ... No water repellent treatment.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Rintaro Minatani             502 Kintatemachi, Tsuchiura City, Ibaraki Japan             Tate Seisakusho Mechanical Research Center (72) Inventor Takashi Naganawa             502 Kintatemachi, Tsuchiura City, Ibaraki Japan             Tate Seisakusho Mechanical Research Center (72) Inventor Yuji Yoshitomi             502 Kintatemachi, Tsuchiura City, Ibaraki Japan             Tate Seisakusho Mechanical Research Center (72) Inventor Masato Nakanishi             502 Kintatemachi, Tsuchiura City, Ibaraki Japan             Tate Seisakusho Mechanical Research Center (72) Inventor Yasuhiko Sasaki             502 Kintatemachi, Tsuchiura City, Ibaraki Japan             Tate Seisakusho Mechanical Research Center (72) Inventor Takeshi Nakagawa             810 Shimo-Imaizumi Stock Exchange, Ebina City, Kanagawa Prefecture             Hitachi Platform Platform             Home Office F-term (reference) 5E322 AA07 DA01

Claims (3)

[Claims] 1. A water cooling jacket thermally connected to a heating element, a heat radiating pipe connected to the water cooling jacket, a tank connected to the heat radiating pipe, and a liquid driving means connected to the tank in a case. In the accommodated electronic device, an outlet is provided in the central part of the tank, and a surface tension generating part is provided in the central part of the tank. 2. A water cooling jacket thermally connected to the heating element, a heat radiation pipe connected to the water cooling jacket, a tank connected to the heat radiation pipe, and a liquid driving means connected to the tank in a case. In the electronic device housed, an outlet is provided in the central part of the tank, and an uneven part is provided in the central part of the tank. 3. A water cooling jacket thermally connected to the heating element, a heat radiating pipe connected to the water cooling jacket, a tank connected to the heat radiating pipe, and a liquid driving means connected to the tank in a case. In the accommodated electronic device, an outlet is provided in the central part of the tank, and a water repellent part is provided except for the central part of the tank.