JP2003281936A - Electrically conductive ink and radio frequency identification medium using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrically conductive ink which prevents deforming or cracking of hardened materials forming a land portion or a jumper portion, stabilizes electrical characteristics suppressing an increase in electrical resistance, and maintains a stable adhesive bonding, when the land portion is heated or pressed for installing an integrated circuit chip on it or the jumper portion is heated or pressed for forming it, and to provide a radio frequency identification medium using the electrically conductive ink. <P>SOLUTION: The electrically conductive ink which comprises a vehicle consisting mainly of thermosetting resin and an electrically conductive material of 55 to 70 wt.% for a sum of the vehicle and the electrically conductive material, is used. The radio frequency identification medium is manufactured by forming an electrically conductive connecting portion on a prescribed portion of a base plate using the electrically conductive ink. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a conductive ink and an RF-ID (Radio Frequency) using the same.
CY IDentification) media, and more specifically, a thin ink recording medium such as an information recording medium such as a conductive ink and a non-contact IC card, a label, a tag, a foam, and an information recording member such as an interposer and an inlet sheet. The present invention relates to an RF-ID medium such as an information transmission / reception type recording medium.

[0002]

2. Description of the Related Art A conventional process for forming an RF-ID medium will be described with reference to FIG. First, as shown in FIG. 1A, a base material 1 is prepared. Then, as shown in FIG. 1B, a thermosetting conductive ink is screen-printed on a predetermined portion of the base material 1 and heated to cure the conductive ink to form the antenna portion 3. At the same time, by printing and curing the conductive ink, the antenna part 3 in a completed state is formed.
The land portions 2a and 2b are integrally formed at the positions which should be the both end portions, and the independent land portion 5 is formed in the vicinity of the land portion 2b.

Next, as shown in FIG. 1C, a thermosetting insulating ink is formed so as to straddle the coil-shaped antenna portion 3 between the land portion 2a of the antenna portion 3 and the independent land portion 5. Is screen-printed and heated to cure the insulating ink to form the resist portion 6. Next, as shown in FIG. 1D, a thermosetting conductive ink is crossed over the resist portion 6 so as to connect the independent land portion 5 and the land portion 2a at one end of the antenna portion 3 to each other. Screen printing is performed and the conductive ink is cured by heating to form the jumper portion 8. In this way, the independent land portion 5 connected to the land portion 2a at one end of the antenna portion 3 by the jumper portion 8 and the land portion 2b at the other end of the antenna portion 3 are arranged at the close positions. Therefore, as shown in FIG. 1E, the IC chip 9 is mounted so that the connection terminals (not shown) are in contact with the land portion 2a and the independent land portion 5, respectively.

Through the above steps, as shown in FIG. 1 (e), the antenna part 3 and the land parts 2a, 2 are formed on the predetermined part of the base material 1.
b, 5, the resist portion 6 and the jumper portion 8 are formed,
An RF-ID medium on which the IC chip 9 is mounted is formed.

Conventionally, the antenna part 3 and the land part 2
The conductive ink used for forming a, the land portion 2b, and the land portion 5 is, for example, Japanese Patent Laid-Open No. 5-1421 in order to reduce the electric resistance as much as possible and enhance the conductivity.
As described in Japanese Patent Publication No. 89, a conductive material such as silver powder or silver compound powder for imparting conductivity to a resin component is 80% by mass with respect to the total amount of the resin component and the conductive material. The conductive ink blended as described above has been used. However, when a conductive ink containing 80% by mass or more of a conductive substance is used, the conductivity is excellent, but when the IC chip is mounted on the land, it is heated or pressed, and the jumper part is formed. When heated during heating, the hardened material that composes the land and jumper will be deformed or cracked, increasing the electrical resistance and making the electrical characteristics unstable, or the adhesive strength unstable. There was a problem that became. Also, in order to prevent the occurrence of cracks due to pressure when mounting the IC chip on the land portion, if the pressure is lowered, the connection terminals (bumps) of the IC chip will not come into good contact with the land portion, so delicate pressure control is necessary. Met.

[0006]

SUMMARY OF THE INVENTION A first object of the present invention is to solve the conventional problems and to heat or apply pressure when mounting an IC chip on a land portion or to form a jumper portion. Even if it is heated, the hardened material that composes the land and jumper will not be deformed or cracked, and the connection terminals (bumps) of the IC chip will make good contact with the land even if delicate pressure control is not performed. , The electric resistance does not increase,
A second object of the present invention is to provide a conductive ink having stable electric properties and stable adhesive force, and a second object of the present invention is to provide a substrate surface using such a conductive ink. It is an object of the present invention to provide an RF-ID medium provided with a conductive connecting portion such as a land portion and a jumper portion formed on a predetermined portion of the.

[0007]

The inventors of the present invention have conducted extensive studies to solve the above-mentioned problems, and as a result, as a conductive ink for forming a conductive connection portion such as a land portion or a jumper portion, a thermosetting material is used. In a vehicle containing resin as a main component, 80% of the conductive material is added to the total amount of the vehicle and the conductive material.
The conductive ink blended in a specific range of less than mass% may be used, and the antenna part and the like may be formed, for example, using a conventional conductive ink having a conductive substance of 80 mass% or more and having excellent conductivity. Therefore, they have found that the above problems can be solved, and completed the present invention.

That is, the conductive ink according to claim 1 of the present invention is a conductive ink in which a conductive substance is mixed in a vehicle containing a thermosetting resin as a main component, and the vehicle and the conductive substance are included. And the total amount of conductive material is 55
It is characterized by being mixed in an amount of up to 70% by mass.

According to a second aspect of the present invention, there is provided an RF-ID medium characterized in that a conductive connecting portion formed by using the conductive ink according to the first aspect is formed on a predetermined portion of a base material surface. is there.

The third aspect of the present invention is the RF according to the second aspect.
In the ID medium, the conductive connection portion is a land portion or a jumper portion.

In the present invention, as a conductive ink for forming a conductive connection portion such as a land portion or a jumper portion, a vehicle containing a thermosetting resin as a main component is used as a conductive substance, and the conductive substance is mixed with the vehicle. 55 to the total amount of
A conductive ink containing 70% by mass is used. Then, for the antenna part and the like, for example, an etching method or a conductive material is used.
If formed by using a conventional conductive ink having a high conductivity of 0% by mass or more, even if the IC chip is mounted on a land part or heated or pressed when forming a jumper part, There is no deformation or crack in the hardened material that composes the land or jumper, and the connection terminals (bumps) of the IC chip often make contact with the land without delicate pressure control, increasing the electrical resistance. The electrical characteristics are stable and the adhesive strength is also maintained stably. Moreover, since the ratio of closing in the electric circuit of the land part and jumper part is small, the electric resistance of the electric circuit is not increased so much and the reliability is improved. It is possible to provide high-quality RF-ID media.

[0012]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram illustrating a method for forming an embodiment of an RF-ID medium of the present invention. First, as shown in FIG. 1A, a base material 1 is prepared. Then, as shown in FIG. 1B, a conventional thermosetting conductive ink containing 80% by mass or more of a conductive substance is screen-printed on a predetermined portion of the base material 1 and heated to form the conductive ink. The antenna part 3 is formed by curing. Then, the conductive ink of the present invention, in which 55 to 70 mass% of the conductive substance is blended with respect to the total amount of the vehicle and the conductive substance, is screen-printed in the vehicle containing the thermosetting resin as a main component, The conductive ink is cured by heating, and the land portion 2a is formed at a position which should be both ends of the antenna portion 3 in a completed state.
2b is integrally formed, and an independent land portion 5 is formed near the land portion 2b.

Next, as shown in FIG. 1C, a thermosetting insulating ink is formed so as to straddle the coil-shaped antenna portion 3 between the land portion 2a of the antenna portion 3 and the independent land portion 5. Is screen-printed and heated to cure the insulating ink to form the resist portion 6. Next, as shown in FIG. 2D, a thermosetting resin is used as a main component so as to connect the independent land portion 5 and the land portion 2a at one end of the antenna portion 3 across the resist portion 6. In the vehicle, the amount of the conductive material is 55 to 70 relative to the total amount of the vehicle and the conductive material.
The thermosetting conductive ink of the present invention, which is blended by mass%, is screen-printed and heated to cure the conductive ink to form the jumper portion 8.

In this way, the independent land portion 5 connected to the land portion 2a at one end of the antenna portion 3 by the jumper portion 8 and the land portion 2b at the other end of the antenna portion 3 are arranged in the proximity position. ing. Therefore, as shown in FIG. 1 (e), an IC chip mounting machine (not shown) is used.
The chip 9 has a connection terminal (not shown) whose land portion 2a
Also, the antenna part 3 is mounted on a predetermined part of the base material 1 by pressing and heating so that the antenna part 3 and the independent land part 5 come into contact with each other.
RF-I in which the IC chip 9 is mounted and the land portions 2a, 2b, 5 and the resist portion 6 and the jumper portion 8 are formed.
D media is formed.

Even when the IC chip 9 is mounted on the lands 2b, 5 or heated or pressed when the jumper 8 is formed, the lands 2b, 5 and the lands 2a and the jumper 8 are formed. Deformation and cracks do not occur in the cured product, and the IC chip 9 does not require delicate pressure control.
The connection terminals (bumps not shown) of FIG. 3 are in good contact with the lands 2b and 5, the electric resistance is not increased and the electric characteristics are stable, and the adhesive force is also stably maintained.
An F-ID medium is formed.

The material of the substrate 1 used in the present invention is a woven fabric, a non-woven fabric, a mat, a paper made of inorganic or organic fibers such as glass fiber, alumina fiber, polyester fiber, polyamide fiber, or a combination thereof, or Composite base material formed by impregnating these with resin varnish, polyamide-based resin base material, polyester-based resin base material,
Polyolefin resin substrate, polyimide resin substrate, ethylene / vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate ,
Plastic base materials such as polycarbonate resin base materials, acrylonitrile butadiene styrene copolymer resin base materials, and polyether sulfone base resin base materials, or corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma It is possible to select and use from known ones such as those subjected to surface treatment such as treatment and ozone treatment.

The antenna part can be formed by a known method. For example, a conventional method of printing conductive ink by screen printing or inkjet printing to dry and immobilize, attachment of coated or uncoated metal wire, etching, dispensation, attachment of metal foil, direct vapor deposition of metal, metal vapor deposition. Examples include, but are not limited to, film transfer and conductive polymer layer formation.

The mounting of IC chips includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.

The thermosetting resin used in the present invention is composed of a relatively low molecular weight substance (liquid or solid) before curing and exhibits fluidity at room temperature or by heating, but it is cured by the action of a curing agent, a catalyst or heat. There is no particular limitation as long as it can cause a change to an insoluble and infusible cured resin. Specific examples include phenolic resins, urea-based resins, melamine-based resins, unsaturated polyester-based resins, epoxy-based resins, diallylphthalate-based resins, polyurethane-based resins, and mixtures of two or more thereof. .

Specific examples of the epoxy resin include, for example, bisphenol A type epoxy compound, bisphenol F type epoxy compound and tetrabromobisphenol A.
-Type epoxy compounds, phenol novolac-type epoxy compounds, cresol novolac-type epoxy compounds, glycidyl ester-type epoxy compounds, alicyclic epoxy compounds, hydantoin-type epoxy compounds, etc., and reactive dilution as necessary to a mixture of two or more of these. Compounding agent
Phenol novolac resins, cresol novolac resins, naphthol-modified phenol resins, dicyclopentadiene-modified phenol resins, paraxylene-modified phenol resins and other phenol resins, acid anhydrides, amine compounds and the like may be used.

The thermosetting resin used in the present invention contains, in addition to a solution type dissolved in a solution, an aqueous emulsion type, a hot melt type which is solidified by heating, melting and coating and then cooling, and a liquid oligomer or monomer. Etc., but either can be used.

The conductive substance used in the present invention is silver powder, a conductive metal other than silver, for example, powder of gold, platinum, palladium, rhodium or the like, and is not particularly limited. Specifically, for example, the following items a to j can be exemplified. a. Silver powder Dowa Mining Co., Ltd. G-10,11,12,13,1
5-H, 15H, 18, Chemical Flake Co., Ltd. Tokuriki Main Store TCG-1, 1A, 5, 7, 11
N, 7V, TC-12, 20E, 20V, 25A, J-
20, E-20, G-1, H-1, AgF-5S, Ag
F-10S manufactured by Tanaka Kikinzoku Kogyo Co., Ltd. AY-6010, 6080 b. Conductive carbon black Mitsubishi Chemical Corporation Ketjen Black EC, EC-
600JD Denki Kagaku Co., Ltd. Acetylene Black Cabot Co., Ltd. Vulcan XC-72 Columbia Chemical Co., Ltd. Conductex-97
5, Conducttex-SC c. Copper powder Dowa Mining Co., Ltd. DC-50, 100, 200, 3
00 d. Nickel powder Dowa Mining Co., Ltd. DNI-20, 50 e. Gold powder Co., Ltd. Tokoriki main store TA-1, 2 f. Platinum powder Co., Ltd. Tokoriki main store TP-1, Tanaka Kikinzoku Kogyo Co., Ltd. AY-1010, 1020 g. Palladium powder TPd-1 manufactured by Tokoriki Head Office AY-4010, 4030 manufactured by Tanaka Kikinzoku Kogyo Co., Ltd. h. Silver-palladium alloy powder manufactured by Tokuriki Head Office AP-10, 30 i. Zinc powder j. Aluminum powder

The conductive ink of the present invention is a conductive ink in which a conductive substance is mixed in a vehicle containing a thermosetting resin as a main component, and the conductive ink is based on the total amount of the vehicle and the conductive substance. The conductive substance is blended in an amount of 55 to 70% by mass, preferably 60 to 65% by mass. If the amount of the conductive substance is less than 55% by mass, the adhesiveness will be improved, but the electrical resistance will be high, which may hinder the conductivity, and if it exceeds 70% by mass, the electrical resistance will be low, but it will be easily deformed to give a cured product. There is a possibility that cracks may occur in the electrical characteristics, the electrical characteristics may become unstable, and the IC chip mounting yield may decrease.

In the conductive ink used in the present invention, if necessary, silica, alumina, glass, talc, various rubbers,
Alternatively, known additives such as surface treatment agents, fillers, pigments, dyes and stabilizers can be added.

The above description of the embodiments is for explaining the present invention, and does not limit the invention described in the claims or reduce the scope thereof. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

[0026]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. (Example 1) 30 parts by mass of a vehicle [Product name: Byron 500, manufactured by Toyobo Co., Ltd.] containing a thermosetting resin as a main component, and a conductive substance [Product name: Silver powder Silvest E-20 (made by Tokuriki Co., Ltd.)] And product name: Silver powder Silvest TCG-7 (manufactured by Tokuriki Co., Ltd.) mixed at 80/20 (mass ratio)] 70 parts by mass and solvent [isophorone and butyl cellosol acetate at 1/9 (mass ratio)]. Mixed] 1
0 parts by mass was blended and mixed to prepare the conductive ink of the present invention. The conductive ink of the present invention was screen-printed on the surface of a base material to form a fine line pattern having a width of 1 mm and a length of 1 cm, heated at 150 ° C. for 30 minutes, and then the electric resistance (Ω) was measured. Then, using a metal rod with a diameter of 10 mm, 230
After heating and pressurizing at 0 ° C, 0.8 MPa for 5 seconds, the electrical resistance (Ω) was measured in the same manner. Table 1 shows the measured electric resistances (Ω).

On the other hand, 80 parts by mass of the conductive substance and 10 parts by mass of the solvent are mixed with 20 parts by mass of the vehicle,
A conventional conductive ink was prepared by mixing. And FIG.
As shown in (a), a base material 1 is prepared, and a conventional conductive ink is screen-printed on a predetermined portion of the base material 1 as shown in FIG. 1 (b) and heated to cure the conductive ink. Then, the antenna portion 3 is formed, and the conductive ink of the present invention is screen-printed, and the conductive ink is cured by heating to integrally form the land portions 2a and 2b, and in the vicinity of the land portion 2b. The independent land portion 5 was formed. next,
As shown in FIG. 1C, the land portion 2 a of the antenna portion 3
-Shaped antenna part 3 between the land part 5 and the independent land part 5
The thermosetting insulating ink is screen-printed so as to cross over the insulating ink, and the insulating ink is cured by heating to form the resist portion 6. Next, as shown in FIG.
The conductive ink of the present invention is screen-printed across the top so as to connect the independent land portion 5 and the land portion 2a at one end of the antenna portion 3, and the conductive ink is cured by heating, and the jumper portion 8 is formed. Was formed. Then, as shown in FIG. 1E, an IC chip mounting machine (not shown) is used.
The chip 9 is mounted by pressurizing (0.8 MPa) and heating (230 ° C.) for 5 seconds so that the connection terminals (not shown) come into contact with the land portion 2 a and the independent land portion 5, respectively. The RF-ID medium shown in 1 (e) was formed. Table 1 shows the ID chip mounting yield (%).

(Examples 2 to 4) The conductive ink of the present invention was prepared by using the same vehicle, conductive substance and solvent as in Example 1 with the composition shown in Table 1 and heating in the same manner as in Example 1. The electric resistance (Ω) before and after pressurization and after pressurization is measured and shown in Table 1. Table 1 shows the ID chip mounting yield (%) when the RF-ID medium shown in FIG. 1E was formed in the same manner as in Example 1.

Comparative Example 1 A conventional conductive ink prepared by blending and mixing 20 parts by mass of the vehicle used in Example 1 with 80 parts by mass of the conductive substance and 10 parts by mass of the solvent was used. In the same manner as in Example 1, the electric resistance (Ω) before and after heating and pressurization was measured and shown in Table 1. Then, using this conventional conductive ink, an antenna part, each land part, and a jumper part were formed in the same manner as in Example 1 to form a comparative RF-ID medium as shown in FIG. Table 1 shows the ID chip mounting yield (%).

(Comparative Examples 2 to 3) Comparative conductive inks were prepared by using the same vehicle, conductive material and solvent as in Example 1 with the formulations shown in Table 1 and heating in the same manner as in Example 1, The electric resistance (Ω) before pressurization, after heating and after pressurization is measured and shown in Table 1. Then, in the same manner as in Example 1, I when forming a comparative RF-ID medium as shown in FIG.
Table 1 shows the D chip mounting yield (%).

[0031]

[Table 1]

From Table 1, the conductive inks of the present invention of Examples 1 to 4 were tested for electric resistance (Ω) before and after heating and pressurization.
It can be seen that there is no change in the electrical characteristics, the electrical characteristics are stable, and the ID chip mounting yield is high. On the other hand, the comparative conductive inks of Comparative Examples 1 and 2 have electric resistance (Ω) before heating and pressurization.
However, the electric resistance (Ω) increases after heating and pressurization, the electric characteristics are unstable, and the ID chip mounting yield is poor.
The comparative conductive ink of Comparative Example 3 has no change in electric resistance (Ω) before and after heating and pressurization, and has stable electric characteristics, but the yield of ID chip mounting is poor.

[0033]

The conductive ink according to claim 1 of the present invention contains 55 to 55% of the conductive substance in the total amount of the vehicle and the conductive substance in the vehicle containing the thermosetting resin as a main component.
Since 70% by mass is blended, the conductive ink according to claim 1 of the present invention is used to form a conductive connection portion such as a land portion or a jumper portion, and the antenna portion or the like is formed by, for example, an etching method or If it is formed by using the conventional conductive ink having a conductive material blended in an amount of 80% by mass or more, the IC chip is mounted on the land part, heated when the jumper part is formed, or heated. Even if pressure is applied, deformation or crack does not occur in the hardened material that composes the land part or the jumper part, and the connection terminals (bumps) of the IC chip make good contact with the land part without delicate pressure control, The electrical characteristics do not increase, the electrical characteristics are stable, the adhesive strength is stable, and the area of the land or jumper area in the electrical circuit is small. The electrical resistance without significantly increasing, a marked effect of being able to provide a reliable RF-ID media.

The RF-ID medium according to the second aspect of the present invention has a conductive connecting portion formed by using the conductive ink according to the first aspect on a predetermined portion of the surface of the base material. It is simple and inexpensive, has stable electrical characteristics, maintains stable adhesive force, and has a small proportion of the conductive connection in the electric circuit, so the electric resistance of the electric circuit is low and the reliability is high. It has a remarkable effect that it can be used as an information recording medium such as a non-contact IC card, a label, a tag, a form, and a thin information transmission / reception recording medium such as an information recording member such as an interposer and an inlet sheet.

A third aspect of the present invention is the RF according to the second aspect.
-In the ID medium, since the conductive connection portion is a land portion or a jumper portion, the RF according to claim 2-
In addition to the same effect as the ID medium, it has a further remarkable effect that the configuration is simpler, the cost is lower, and the reliability is higher.

[Brief description of drawings]

1A to 1E are explanatory views showing a process of forming an RF-ID medium.

[Explanation of symbols]

1 base material 2a, 2b, 5 land parts 3 antenna 6 Registration section 8 jumper 9 IC chip

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Claims (3)

[Claims] 1. A conductive ink comprising a vehicle containing a thermosetting resin as a main component and a conductive substance mixed therein,
A conductive ink comprising 55 to 70% by mass of a conductive substance with respect to the total amount of a vehicle and a conductive substance. 2. An RF-ID medium, characterized in that a conductive connection portion formed by using the conductive ink according to claim 1 is formed on a predetermined portion of a base material surface. 3. The RF- according to claim 2, wherein the conductive connection portion is a land portion or a jumper portion.
ID media.