JP2003231220A - Cover film for electronic component carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cover film for electronic component carrier tape excellence in adhesive properties between each layer that consists of the cover film without an adhesive agent such as an anchor coat agent. <P>SOLUTION: The cover film 10 for the electronic component carrier tape has a base material layer (I) 11 made up of a base material and the composition layer (II) 12 of a polyolefin based resin composition (B) that comes in contact with the base material layer (I) and contains 100-80 mass percent of ethylene copolymer (A) and 0-20 mass percent of another polyolefin based resin (B) and has the heat seal layer (III) of a styrene based resin material. The copolymer (A) is produced under the presence of a single site based catalyst and whose density is 0.86-0.97 g/cm<SP>3</SP>and melt flow rate is 0.01-200 g/10 minutes. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover film for an electronic component carrier tape, which is used as a cover material for a carrier tape containing electronic components and the like,
More specifically, the present invention relates to a cover film for an electronic component carrier tape, which has excellent adhesiveness between layers constituting the cover film without using an adhesive such as an anchor coating agent.

[0002]

2. Description of the Related Art With the miniaturization of electronic equipment, electronic components used are also becoming smaller and higher in performance. In the assembly process of such electronic devices, electronic components are automatically mounted on a printed circuit board. The electronic components used for such automatic mounting are packaged in taping so that the electronic components are automatically and sequentially supplied.

As such a taping package, for example, an electronic component carrier tape as shown in FIG. 6 is used. This electronic component carrier tape 20 is
A carrier tape main body 22 having recesses 21 for accommodating electronic components 30 at regular intervals, and a cover film 23 having both ends heat-sealed in the longitudinal direction on the upper surface of the carrier tape main body 22. is there.

As the cover film 23, a base layer 24 made of a base material made of a biaxially stretched film such as polyethylene terephthalate (PET), and a base layer 24 made of the base material, an anchor coat made of an anchor coating agent. What is generally used is composed of an intermediate layer 26 made of an olefin resin, which is adhered via a layer 25, and a heat seal layer 27 made of a styrene resin, which is in contact with the intermediate layer 26.

The electronic component 30 housed in the electronic component carrier tape 20 composed of the cover film 23 and the carrier tape main body 22 as described above is the cover film 23.
After being peeled off by the automatic peeling device, it is taken out from the recess 21 of the carrier tape body 22 by an automatic take-out machine and mounted on a printed circuit board or the like.

[0006]

This cover film 2
PE used for the base material layer 24 made of a base material in No. 3
Since the biaxially stretched film such as T and the olefin resin used for the intermediate layer 26 have poor adhesiveness, they need to be laminated via an anchor coating agent. However, since this anchor coating agent contains a solvent, there is a problem that the working environment is deteriorated by the volatilized solvent when the cover film 23 is manufactured. Moreover, since the solvent is used, it is necessary to pay close attention to fire prevention. Further, it is necessary to prepare ventilation equipment, and there is a problem that the manufacturing cost becomes high due to the burden on such equipment.

Therefore, an object of the present invention is to provide a cover film for an electronic component carrier tape, which is excellent in the adhesiveness between the layers constituting the cover film without using an adhesive such as an anchor coating agent. .

[0008]

That is, the cover film for an electronic component carrier tape of the present invention comprises a base material layer (I) made of a base material and a base material layer (I) made of the base material. Ethylene (co) polymer (A) 100 to 2
0 mass% and other polyolefin resin (B) 0-8
A composition layer (II) made of a polyolefin resin composition containing 0% by mass, and a heat seal layer (III) made of a styrene resin material in contact with the composition layer (II),
The ethylene (co) polymer (A) is produced in the presence of a single site catalyst, and the ethylene (co) polymer (A) has a (a) density of 0.86 to 0.97.
g / cm ³ , (b) melt flow rate of 0.01 to 2
It is characterized in that it is 00 g / 10 minutes.

Further, it is desirable that the heat seal layer (III) has an antistatic property. Further, the polyolefin resin composition of the composition layer (II) desirably further contains an epoxy compound (C).

Further, the ethylene (co) polymer (A)
Preferably satisfies the following requirements (a) to (d). (A) Density of 0.86 to 0.97 g / cm ³ , (b) Melt flow rate of 0.01 to 200 g / 10
Min, (c) molecular weight distribution (Mw / Mn) of 1.5 to 4.5, (d) total 25 determined from the integrated elution curve of elution temperature-elution amount curve by continuous temperature rising elution fractionation method (TREF) The difference T ₇₅ -T ₂₅ between the temperature T _{25 at} which 100% elutes and the temperature T _{75 at} which 75% of the whole elutes, and the density d satisfy the following equation (equation 1) (equation 1) T ₇₅ -T ₂₅ ≤ -670 x d + 644

Further, the ethylene (co) polymer (A)
Preferably further satisfies the following requirement (e). (E) The difference between the temperature T _{25 at} which 25% of the whole is eluted and the temperature T _{75 at} which 75% of the whole is obtained, which is obtained from the integral elution curve of the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF) T ₇₅ -T ₂₅ and density d satisfy the following to satisfy the relation of (formula 2) (formula 2) d <when ^{_{0.950g / cm 3 T 75 -T 25}} ≧ -300 × d + 285 d ≧ 0.950g / Cm ³ T ₇₅ −T ₂₅ ≧ 0

Further, the ethylene (co) polymer (A)
Is an ethylene (co) polymer (A1) that further satisfies the requirements (f) and (g) below, or an ethylene (co) polymer (A2) that further satisfies the requirements (h) and (i) below. ) Is desirable. (F) Ortho-dichlorobenzene (ODC at 25 ° C)
B) Soluble content X (mass%), density d and melt flow rate (MFR) satisfy the relationships of the following (formula 3) and (formula 4) (formula 3) d-0.008log MFR ≧ 0.93 When X <2.0 (Equation 4) d−0.008 log MFR <0.93 When X <9.8 × 10 ³ × (0.9300−d + 0.008
logMFR) ² +2.0 (g) Elution temperature by continuous temperature-rising elution fractionation method (TREF) There are multiple peaks on the curve (h) Elution temperature by continuous temperature-rising elution fractionation method (TREF) -elution The number curve has only one peak (i) has one or more melting point peaks, and the highest melting point T _ml and the density d satisfy the relationship of the following (Formula 5) (Formula 5) ) T _ml ≧ 150 × d-19

The ethylene (co) polymer (A2) preferably further satisfies the following requirement (j). (J) Melt tension (MT) and melt flow rate (MFR) satisfy the following (formula 6) (formula 6) logMT ≦ −0.572 × logMFR +
0.3

In the cover film for electronic component carrier tape of the present invention, it is desirable that the content of halogen (k) in the ethylene (co) polymer (A) is 10 ppm or less.

Further, it is desirable that the polyolefin resin composition is not blended with (l) the additive, or is blended with the additive which does not substantially affect the contacted object.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.
FIG. 1 is a sectional view showing an example of a cover film for an electronic component carrier tape of the present invention. The cover film 10 for an electronic component carrier tape includes a base material layer (I) 11 made of a base material and a base material layer (I) made of the base material.
A composition layer (II) 12 composed of a polyolefin resin composition, which is in contact with 11, and is in contact with the composition layer (II) 12,
Heat seal layer (III) 13 made of styrene resin material
And is roughly configured.

Substrate layer (I) comprising a substrate in the present invention
The substrate used for includes a film or sheet, a plate-like body and the like. Examples of such a substrate include polypropylene-based resins, polyamide-based resins, polyester-based resins, saponified ethylene-vinyl acetate copolymers, polyvinylidene chloride, plastic films or sheets such as polycarbonate (these stretched products and printed materials). , Secondary processed films such as metal deposits, and sheets), aluminum, iron, copper, metal foils or plates such as alloys containing these as the main components, cellophane, paper,
Woven cloth, non-woven cloth and the like are used.

Among them, a polyester resin such as polyethylene terephthalate (hereinafter abbreviated as PET) is particularly preferable as a base material for the cover film 10 for the electronic component carrier tape from the viewpoints of excellent heat resistance, tensile strength, tear strength and the like. A biaxially stretched film of a polyamide resin such as nylon 6 and a polypropylene resin is preferably used.

The composition layer (II) in the present invention makes the heat and pressure applied to the interface between the heat seal layer (III) and the main body of the carrier tape for electronic parts uniform during heat sealing so that the heat seal layer (III) and the carrier are It is a layer which also has a role of making the heat seal strength between the tape body and the tape body uniform, and the ethylene (co) polymer (A) 100 to 20.
Mass% and other polyolefin resin (B) 0-80
It is composed of a polyolefin resin composition containing mass%. The ethylene (co) polymer (A) used in the composition layer (II) is produced in the presence of a single-site catalyst, and the ethylene (co) polymer (A) ( a) the density is 0.86 to 0.97 g / cm ³ ,
(B) Melt flow rate is 0.01 to 200 g / 10
What is a minute.

The ethylene (co) polymer (A) is obtained by copolymerizing ethylene homopolymer or ethylene with an α-olefin having 3 to 20 carbon atoms, preferably 3 to 12 carbon atoms. . As the α-olefin having 3 to 20 carbon atoms, propylene, 1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene, 1-
Octene, 1-decene, 1-dodecene and the like can be mentioned. Further, it is desirable that the total content of these α-olefins is selected in the range of usually 30 mol% or less, preferably 3 to 20 mol% or less.

The (a) density of the ethylene (co) polymer (A) is in the range of 0.86 to 0.97 g / cm ³ , preferably 0.90 to 0.94 g / cm ³ , and more preferably It is in the range of 0.91 to 0.93 g / cm ³ . If the density is less than 0.86 g / cm ³ , rigidity (strength of the waist) and heat resistance will be poor. Also, the density is 0.97 g / cm ^3.
If it exceeds, the tear strength and impact resistance may be deteriorated.

The (b) melt flow rate (hereinafter referred to as MFR) of the ethylene (co) polymer (A) is 0.01 to.
The range is 200 g / 10 minutes, preferably 0.1 to 1
00 g / 10 minutes, more preferably 0.5 to 80 g / minute. If the MFR is less than 0.01 g / 10 minutes,
Molding workability is poor. Also, MFR is 200g
If it exceeds / 10 minutes, the tear strength and impact resistance will be poor.

The ethylene (co) polymer (A) preferably further satisfies the following requirements (c) and (d). The (c) molecular weight distribution (Mw / Mn) of the ethylene (co) polymer (A) is preferably 1.5.
To 4.5, more preferably 2.0 to 4.0, and still more preferably 2.5 to 3.0. Mw / Mn is 1.
If it is less than 5, the moldability may be deteriorated. If Mw / Mn exceeds 4.5, tear strength, impact resistance, etc. may be insufficient. Here, for the molecular weight distribution (Mw / Mn) of the ethylene (co) polymer, the mass average molecular weight (Mw) and the number average molecular weight (Mn) are determined by gel permeation chromatography (GPC), and their ratio (Mw). It can be obtained by calculating / Mn).

The ethylene (co) polymer (A) is, for example,
As shown in FIG. 2, (d) continuous temperature rising elution fractionation method (TRE
The difference T ₇₅ -T ₂₅ and the density d between the temperature T _{25 at} which 25% of the whole is eluted and the temperature T _{75 at} which 75% of the whole is obtained, which is obtained from the integrated elution curve of the elution temperature-elution amount curve by F), are Those satisfying the relationship of the following (formula 1) are preferable. (Equation 1) When T ₇₅ −T ₂₅ ≦ −670 × d + 644 T ₇₅ −T ₂₅ and the density d do not satisfy the relation of the above (Equation 1), the low temperature heat sealability may be deteriorated.

The method of measuring this TREF is as follows. First, a sample is added to ODCB to which an antioxidant (for example, butylhydroxytoluene) is added so that the sample concentration becomes 0.05% by mass, and heated and dissolved at 140 ° C. 5 ml of this sample solution is injected into a column filled with glass beads and cooled to 25 ° C. at a cooling rate of 0.1 ° C./min to deposit the sample on the surface of the glass beads. Next, while flowing ODCB at a constant flow rate through this column, the column temperature was raised to 50 ° C.
The sample is sequentially eluted while the temperature is raised at a constant rate of / hr. At this time, the concentration of the sample eluted in the solvent is continuously detected by measuring the absorption of the asymmetric stretching vibration of methylene at a wave number of 2925 cm ⁻¹ with an infrared detector.
From this value, the concentration of the ethylene (co) polymer in the solution is quantitatively analyzed to determine the relationship between the elution temperature and the elution rate. TRE
According to the F analysis, the change in the elution rate with respect to the temperature change can be continuously analyzed with an extremely small amount of sample, and thus relatively fine peaks that cannot be detected by the fractionation method can be detected.

Further, the ethylene (co) polymer (A) was further analyzed by (e) the total temperature of the total 2 obtained from the integrated elution curve of the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF).
The difference T ₇₅ -T ₂₅ and the density d of the temperature T ₇₅ 5% 75% of the total temperature T ₂₅ eluting elutes preferably satisfy the following relationship (Equation 2). (Equation 2) When d <0.950 g / cm ³ , T ₇₅ −T ₂₅ ≧ −300 × d + 285 When d ≧ 0.950 g / cm ³ T ₇₅ −T ₂₅ ≧ 0 T ₇₅ −T ₂₅ and the density d is By satisfying the relationship of the above (formula 2), heat seal strength and heat resistance are further improved.

The ethylene (co) polymer (A) is an ethylene (co) polymer (A1) satisfying the requirements (f) and (g) described below, or (h) and (i) described further below. Ethylene (co) polymer (A
It is preferable that it is either of 2).

(F) 2 of ethylene (co) polymer (A1)
ODCB soluble content X (mass%) and density d at 5 ° C
And MFR satisfy the relationship of the following (formula 3) and (formula 4), and when (formula 2) d-0.008logMFR ≧ 0.93, X <2.0 (formula 3) d-0. When 008 log MFR <0.93, X <9.8 × 10 ³ × (0.9300−d + 0.008)
logMFR) ² +2.0, preferably, when d−0.008logMFR ≧ 0.93, X <1.0 When d−0.008logMFR <0.93, X <7. 4 x 10 ³ x (0.9300-d + 0.008
logMFR) ² +2.0, more preferably, if d-0.008logMFR ≧ 0.93, X <0.5 If d-0.008logMFR <0.93, X <5 .6 × 10 ³ × (0.9300-d + 0.008
The relationship of logMFR) ² +2.0 is satisfied.

Here, the amount X of the ODCB-soluble component at 25 ° C. is measured by the following method. Sample 0.5
g in 20 ml ODCB at 135 ° C. for 2 hours,
After the sample is completely dissolved, it is cooled to 25 ° C. After leaving this solution at 25 ° C. overnight, it is filtered with a Teflon (registered trademark) filter to collect a filtrate. The absorption peak intensity of this filtrate, which is a sample solution, near the wave number 2925 cm ⁻¹ of the asymmetric stretching vibration of methylene is measured by an infrared spectroscope, and the sample concentration is calculated from a calibration curve prepared in advance. From this value, the ODCB soluble content at 25 ° C. can be obtained.

The ODCB-soluble component at 25 ° C. is a highly branched component and a low molecular weight component contained in the ethylene (co) polymer, which causes deterioration of heat resistance and stickiness of the surface of the molded product, which is a problem of hygiene. It is desirable that the content is small, because it causes the blocking of the inner surface of the molded body. O
The amount of DCB-soluble matter is influenced by the content and molecular weight of α-olefin in the entire copolymer, that is, the density and MFR. Therefore, these indices are density and MFR and OD
When the amount of the CB-soluble component satisfies the above relationship, it means that the uneven distribution of α-olefin contained in the entire copolymer is small.

The ethylene (co) polymer (A1) is
(G) A plurality of peaks are present in the elution temperature-elution amount curve obtained by the continuous temperature rising elution fractionation method (TREF). It is particularly preferable that the peak on the high temperature side among the plurality of peak temperatures exists between 85 ° C and 100 ° C. The presence of this peak raises the melting point, raises the crystallinity, and improves the heat resistance and rigidity of the molded body.

Here, the ethylene (co) polymer (A1)
Is a continuous temperature rising elution fractionation method (TR
It is a special ethylene (co) polymer having a plurality of peaks substantially in the elution temperature-elution amount curve determined by EF). On the other hand, the ethylene (co) polymer in FIG. 4 has substantially one peak in the elution temperature-elution amount curve obtained by the continuous temperature rising elution fractionation method (TREF).
This is a polymer, and an ethylene (co) polymer with a typical conventional metallocene catalyst corresponds to this.

In the present invention, the ethylene (co) polymer (A
In 2), as shown in FIG. 5, (h) the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF) has one peak. The ethylene (co) polymer (A2) having one peak in the elution temperature-elution amount curve by TREF has further improved heat resistance.

Further, the ethylene (co) polymer (A2) in the present invention has (i) one or more melting point peaks, and the highest melting point T _ml and density d among them are as follows (formula 5). Satisfy the relationship. (Equation 5) T _ml ≧ 150 × d−19 If the melting point T _m1 and the density d do not satisfy the relationship of the above (Equation 5), the heat resistance may deteriorate.

Among the ethylene (co) polymers (A2), ethylene (co) polymers further satisfying the requirement (j) below are preferable. (J) Melt tension (MT) and melt flow rate (MFR) satisfy the relationship of (Equation 6) below (Equation 6) logMT ≦ −0.572 × logMFR +
When 0.3 MT and MFR satisfy the relationship of the above (formula 6), moldability such as film molding becomes good.

Here, the ethylene (co) polymer (A2)
As shown in FIG. 5, although the number of TREF peaks is one, the ethylene (co) polymer with the conventional typical metallocene-based catalyst does not satisfy the above (formula 2), and It is distinguished from an ethylene (co) polymer using a metallocene catalyst.

The ethylene (co) polymer (A) is a linear ethylene (co) polymer obtained by homopolymerizing ethylene or copolymerizing ethylene and α-olefin in the presence of a single site catalyst. It is united. Such a linear ethylene (co) polymer has excellent adhesiveness to a substrate or the like. In addition, since the molecular weight distribution and composition distribution are narrow,
It is a polymer with excellent mechanical properties, heat sealing properties, heat blocking properties, and heat resistance.

Examples of the single-site catalysts in the present invention include CGC catalysts and the like in addition to typical conventional metallocene catalysts. An organic cyclic compound having at least a conjugated double bond and a transition of Group IV of the periodic table. Examples of the catalyst include a metal compound, and it is particularly desirable that the ethylene (co) polymer (A) of the present invention is produced by a catalyst obtained by mixing the following compounds a1 to a4.

The catalyst obtained by mixing the above compounds a1 to a4 will be described in detail below. a1: a compound represented by the general formula Me ¹ R ¹ _p R ² _q (OR ³ ) _r X ¹ _4-pqr (wherein Me ¹ represents zirconium, titanium, and hafnium, and R ¹ and R ³ are each a carbon number). 1 to
24 hydrocarbon groups, R ² is 2,4-pentanedionato ligand or a derivative thereof, benzoylmethanato ligand,
A benzoylacetonato ligand or a derivative thereof, X ¹ represents a halogen atom, and p, q, and r are each 0 ≦ p
≤4, 0 ≤ q ≤ 4, 0 ≤ r ≤ 4, 0 ≤ p + q + r ≤ 4) a2: a compound represented by the general formula Me ² R ⁴ _m (OR ⁵ ) _n X ² _zmn . (In the formula, Me ² is a group I to III element of the periodic table, R ⁴
And R ⁵ are each a hydrocarbon group having 1 to 24 carbon atoms, X
² is a halogen atom or a hydrogen atom (however, when X ² is a hydrogen atom, Me ² is limited to the group III element of the periodic table), z is the valence of Me ² , and m and n are Each is an integer satisfying the ranges of 0 ≦ m ≦ z and 0 ≦ n ≦ z, and 0 ≦ m + n ≦ z) a3: an organic cyclic compound having a conjugated double bond a4: an Al—O—Al bond Modified organoaluminum oxy compound and / or boron compound containing

Further details will be described below. The catalyst component a1
In the formula of the compound represented by the general formula Me ¹ R ¹ _p R ² _q (OR ³ ) _r X ¹ _4-pqr , Me ¹ represents zirconium, titanium or hafnium, and the kinds of these transition metals are limited. A plurality of zirconium compounds can be used, but zirconium, which has excellent weather resistance of the copolymer, is particularly preferably contained. R ¹ and R ³ are each a hydrocarbon group having 1 to 24 carbon atoms, preferably 1 to 12 carbon atoms, and more preferably 1 to 8 carbon atoms. Specifically, an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, and a butyl group;
Alkenyl groups such as vinyl and allyl; phenyl,
Aryl groups such as tolyl group, xylyl group, mesityl group, indenyl group and naphthyl group; benzyl group, trityl group,
Examples thereof include an aralkyl group such as a phenethyl group, a styryl group, a benzhydryl group, a phenylbutyl group and a neophyl group. These may have branches. R ² is 2,
A 4-pentanedionate ligand or a derivative thereof, a benzoylmethanato ligand, a benzoylacetonato ligand or a derivative thereof is shown. X ¹ represents a halogen atom such as fluorine, iodine, chlorine and bromine. p and q are 0 ≦ p ≦ 4, 0 ≦ q ≦ 4, 0 ≦ r ≦ 4, and 0 ≦ p + q, respectively.
It is an integer that satisfies the range of + r ≦ 4.

Examples of the compound represented by the general formula of the catalyst component a1 include tetramethylzirconium, tetraethylzirconium, tetrabenzylzirconium, tetrapropoxyzirconium, tripropoxymonochlorozirconium, tetraethoxyzirconium, tetrabutoxyzirconium, tetrabutoxytitanium. , Tetrabutoxyhafnium and the like, and particularly Z such as tetrapropoxyzirconium and tetrabutoxyzirconium.
The r (OR) ₄ compound is preferable, and two or more kinds thereof may be mixed and used. Further, specific examples of the 2,4-pentanedionato ligand or its derivative, benzoylmethanato ligand, benzoylacetonato ligand or its derivative include tetra (2,4-pentanedionato) zirconium. , Tri (2,4-pentanedionato)
Chloride zirconium, di (2,4-pentanedionato) dichloride zirconium, (2,4-pentanedionato) trichloride zirconium, di (2,4-pentanedionato) dietoxide zirconium, di (2,4-) Pentandionato) di-n-propoxide zirconium, di (2,4-pentanedionato) di-n
-Butoxide zirconium, di (2,4-pentanedionato) dibenzylzirconium, di (2,4-pentanedionato) dineofoylzirconium, tetra (dibenzoylmethanato) zirconium, di (dibenzoylmethanato) die Toxide zirconium, di (dibenzoylmethanato) di-n-propoxide zirconium, di (dibenzoylmethanato) di-n-butoxide zirconium, di (benzoylacetonato) dietoxide zirconium, di (benzoylacetonato) ) Di-n-propoxide zirconium, di (benzoylacetonato)
Examples thereof include di-n-butoxide zirconium.

The catalyst component a2 of the general formula Me ² R ⁴ _m (O
R ⁵⁾ wherein Me ² in _n X ² compound represented by _zmn represents the periodic table I~III group element, lithium, sodium,
Potassium, magnesium, calcium, zinc, boron,
Such as aluminum. R ⁴ and R ⁵ are each a hydrocarbon group having 1 to 24 carbon atoms, preferably 1 to 1 carbon atoms
2, more preferably 1 to 8, specifically, an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group and a butyl group; an alkenyl group such as a vinyl group and an allyl group; a phenyl group, a tolyl group, Examples thereof include aryl groups such as xylyl group, mesityl group, indenyl group and naphthyl group; aralkyl groups such as benzyl group, trityl group, phenethyl group, styryl group, benzhydryl group, phenylbutyl group and neophyl group. These may have branches. X ² represents a halogen atom such as fluorine, iodine, chlorine and bromine, or a hydrogen atom. However, when X ² is a hydrogen atom, Me ² is limited to a group III element of the periodic table exemplified by boron, aluminum and the like. Further, z represents the valence of Me ² , m and n are integers satisfying the ranges of 0 ≦ m ≦ z and 0 ≦ n ≦ z, and 0 ≦ m + n ≦ z.

Examples of the compound represented by the general formula of the catalyst component a2 include organic lithium compounds such as methyllithium and ethyllithium; organic magnesium compounds such as dimethylmagnesium, diethylmagnesium, methylmagnesium chloride and ethylmagnesium chloride; dimethyl. Organozinc compounds such as zinc and diethylzinc; Organoboron compounds such as trimethylboron and triethylboron; Trimethylaluminum, triethylaluminum, tripropylaluminum, triisobutylaluminum, trihexylaluminum, tridecylaluminum, diethylaluminum chloride, ethylaluminum dichloride , Ethyl aluminum sesquichloride, diethyl aluminum ethoxide, diethyl aluminum Derivatives of organoaluminum compounds such as Idoraido the like.

The above-mentioned organic cyclic compound having a conjugated double bond of the catalyst component a3 is a ring having two or more conjugated double bonds, preferably 2 to 4 and more preferably 2 to 3 or one ring. A cyclic hydrocarbon compound having two or more and having a total carbon number of 4 to 24, preferably 4 to 12; the cyclic hydrocarbon compound partially has 1 to 6 hydrocarbon residues (typically, carbon A cyclic hydrocarbon compound substituted with an alkyl group or an aralkyl group of the formula 1 to 12; 2 or more, preferably 2 to 4, more preferably 2 to 2 conjugated double bonds.
Have 1 or 2 or more rings with 3 and have 4 total carbon atoms
An organosilicon compound having a cyclic hydrocarbon group of -24, preferably 4 to 12; the cyclic hydrocarbon group is partially substituted with 1 to 6 hydrocarbon residues or an alkali metal salt (sodium or lithium salt). Included organosilicon compounds. Particularly preferably, one having a cyclopentadiene structure in any of the molecules is desirable.

Examples of the above-mentioned suitable compounds include cyclopentadiene, indene, azulene or their alkyl, aryl, aralkyl, alkoxy or aryloxy derivatives. Moreover, the compound which these compounds couple | bonded (bridge | crosslink) through the alkylene group (The carbon number is 2-8 normally, Preferably 2-3) is also used suitably.

The organosilicon compound having a cyclic hydrocarbon group can be represented by the following general formula. A _L SiR _4-L where A represents a cyclopentadienyl group, a substituted cyclopentadienyl group, an indenyl group, or a cyclic hydrogen group exemplified by the substituted indenyl group, and R represents a methyl group, an ethyl group, or a propyl group. Groups, alkyl groups such as isopropyl group, butyl group; alkoxy groups such as methoxy group, ethoxy group, propoxy group, butoxy group; aryl groups such as phenyl group; aryloxy groups such as phenoxy group; aralkyl groups such as benzyl group Is shown and represents a hydrocarbon residue or hydrogen having 1 to 24 carbon atoms, preferably 1 to 12 and L is 1
≦ L ≦ 4, preferably 1 ≦ L ≦ 3.

Specific examples of the organic cyclic hydrocarbon compound of the above component a3 include cyclopentadiene, methylcyclopentadiene, ethylcyclopentadiene, propylcyclopentadiene, butylcyclopentadiene, 1,3-dimethylcyclopentadiene, 1-methyl-3-. Ethylcyclopentadiene, 1-methyl-3-propylcyclopentadiene, 1-methyl-3-butylcyclopentadiene, 1,2,4-trimethylcyclopentadiene, pentamethylcyclopentadiene, indene, 4-methyl-
1-indene, 4,7-dimethylindene, cycloheptatriene, methylcycloheptatriene, cyclooctatetraene, azulene, fluorene, cyclopolyene having 5 to 24 carbon atoms such as methylfluorene or substituted cyclopolyene, monocyclopenta Examples thereof include dienylsilane, biscyclopentadienylsilane, triscyclopentadienylsilane, monoindenylsilane, bisindenylsilane and trisindenylsilane.

The modified organoaluminum oxy compound containing an Al--O--Al bond of the catalyst component a4 is reacted with an alkylaluminum compound and water to obtain a modified organoaluminum oxy compound usually called aluminoxane, The molecule usually contains 1 to 100, preferably 1 to 50 Al-O-Al bonds. The modified organoaluminum oxy compound may be linear or cyclic.

The reaction of organoaluminum with water is usually carried out in an inert hydrocarbon. As the inert hydrocarbon,
Aliphatic, alicyclic and aromatic hydrocarbons such as pentane, hexane, heptane, cyclohexane, benzene, toluene and xylene are preferable. The reaction ratio of water and the organoaluminum compound (water / Al molar ratio) is usually 0.25 / 1 to 1.2.
/ 1, preferably 0.5 / 1 to 1/1.

Examples of the boron compound include triethylaluminum tetra (pentafluorophenyl) borate and triethylammonium tetra (pentafluorophenyl).
Borate, dimethylanilinium tetra (pentafluorophenyl) borate, dimethylanilinium tetra (pentafluorophenyl) borate, butylammonium tetra (pentafluorophenyl) borate, N, N-
Examples include dimethylanilinium tetra (pentafluorophenyl) borate, N, N-dimethylanilinium tetra (3,5-difluorophenyl) borate, trityl tetrakispentafluoroborate, ferrocenium tetrakispentafluoroborate, trispentafluoroborane. To be Among them, N, N'-dimethylanilinium tetra (pentafluorophenyl) borate, trityltetrakispentafluoroborate, ferrocenium tetrakispentafluoroborate, and trispentafluoroborane are preferable.

The above catalysts may be used by mixing and contacting a1 to a4, but it is preferable to use them by supporting them on an inorganic carrier and / or a particulate polymer carrier (a5). Examples of the inorganic carrier and / or the particulate polymer carrier (a5) include carbonaceous materials, metals, metal oxides, metal chlorides, metal carbonates or mixtures thereof, or thermoplastic resins, thermosetting resins and the like. Suitable metals that can be used for the inorganic carrier include iron, aluminum, nickel and the like. Specifically, Si
O ₂ , Al ₂ O ₃ , MgO, ZrO ₂ , TiO ₂ , B ₂ O ₃ ,
Examples thereof include CaO, ZnO, BaO, ThO _{2 and the} like, or a mixture thereof. SiO ₂ —Al ₂ O ₃ , SiO ₂ —V
₂ O ₅ , SiO ₂ —TiO ₂ , SiO ₂ —V ₂ O ₅ , SiO ₂ —
MgO, etc. SiO ₂ -Cr ₂ O ₃ and the like. Of these, those containing, as a main component, at least one component selected from the group consisting of SiO ₂ and Al ₂ O ₃ . Further, as the organic compound, either a thermoplastic resin or a thermosetting resin can be used, and specifically, particulate polyolefin, polyester, polyamide, polyvinyl chloride, poly (meth) acrylate, polystyrene, poly Examples include norbornene, various natural polymers, and mixtures thereof.

The above inorganic carrier and / or particulate polymer carrier can be used as they are, but preferably, as a pretreatment, these carriers are treated with an organoaluminum compound or a modified organoaluminum compound containing an Al--O--Al bond. It can also be used as the component a5 after the contact treatment.

The ethylene (co) polymer (A) can be produced by a gas phase polymerization method, a slurry polymerization method, a solution polymerization method or the like in the presence of the above-mentioned catalyst, which is substantially free of a solvent. Butane, pentane,
In the presence or absence of an inert hydrocarbon solvent exemplified by aliphatic hydrocarbons such as hexane and heptane, aromatic hydrocarbons such as benzene, toluene and xylene, and alicyclic hydrocarbons such as cyclohexane and methylcyclohexane. Manufactured in. The polymerization conditions are not particularly limited, but the polymerization temperature is usually 15 to 350 ° C., preferably 20 to 200 ° C., more preferably 50 to 110 ° C., and the polymerization pressure is usually atmospheric pressure to 70 kg / cm ^{2 in} the case of the low and medium pressure method. G, preferably normal pressure to 20 kg / cm ² G, usually 15 in the case of high pressure method
00 kg / cm ² G or less is desirable. In the case of the low and medium pressure method, the polymerization time is usually 3 minutes to 10 hours, preferably about 5 minutes to 5 hours. In the case of the high pressure method, it is usually 1 minute to 30 minutes, preferably 2 minutes to 20 minutes. The polymerization is not limited to the one-step polymerization method, and is not particularly limited to a two-step or more multi-step polymerization method in which the polymerization conditions such as hydrogen concentration, monomer concentration, polymerization pressure, polymerization temperature and catalyst are different from each other. As a particularly preferable manufacturing method, Japanese Patent Application Laid-Open No. 5-132518
The method described in Japanese Patent Laid-Open Publication is cited.

The ethylene (co) polymer (A) has a halogen concentration (k) of at most 10 p by using a halogen-free catalyst such as chlorine in the above catalyst components.
pm or less, preferably 5 ppm or less, more preferably substantially 2 ppm or less (ND: Non-Det)
ect). By using a halogen-free ethylene (co) polymer such as chlorine, the conventional acid neutralizer (halogen absorber)
It is possible to provide a clean cover film which does not need to be used, has excellent chemical stability, and is particularly suitable for use as an electronic component carrier tape.

Another polyolefin resin (B) of the present invention
Examples include low-density polyethylene (LDPE) obtained by a high-pressure radical polymerization method, an ethylene / vinyl ester copolymer, a copolymer of ethylene and an α, β-unsaturated carboxylic acid or its derivative, a Ziegler-based catalyst, and Phillips. Density 0.9 by high / medium / low pressure method using system catalyst
4 to 0.97 g / cm ³ high density polyethylene, density 0.91 to 0.94 g / cm ³ linear low density polyethylene, density 0.88 to 0.91 g / cm ³ ultra low density polyethylene , Ethylene (co) polymer rubbers, polypropylene resins and the like.

The MFR of the LDPE is 0.01 to 20.
0 g / 10 minutes, preferably 0.1-100 g / 10 minutes,
More preferably, it is in the range of 0.5 to 80 g / 10 minutes. Within this range, the melt tension will be in an appropriate range, and the moldability will be improved. The density of LDPE is 0.91 to 0.94 g / cm ³ , and more preferably 0.91 to 0.935 g / cm ³ . Within this range, the melt tension will be in an appropriate range, and the moldability will be improved. The melt tension of LDPE is
The amount is 1.5 to 25 g, preferably 3 to 20 g, and more preferably 3 to 15 g. Also, the molecular weight distribution M of LDPE
w / Mn is 3.0 to 12, preferably 4.0 to 8.0.
Is. The molecular weight distribution Mw / Mn of LDPE is
It is 3.0 to 12, preferably 4.0 to 8.0.

The above-mentioned ethylene / vinyl ester copolymer means vinyl propionate, vinyl acetate, vinyl caproate, vinyl caprylate, vinyl laurate, vinyl stearate containing ethylene as a main component, which is produced by a high-pressure radical polymerization method. , A copolymer with a vinyl ester monomer such as trifluorovinyl acetate. Among them, vinyl acetate is particularly preferable. Further, ethylene 50 to 99.5% by mass, vinyl ester 0.5 to 50% by mass, and other copolymerizable unsaturated monomer 0
A copolymer composed of ˜49.5 mass% is preferred. In particular,
The content of vinyl ester is in the range of 3 to 30% by mass, preferably 5 to 25% by mass. The MFR of the ethylene / vinyl ester copolymer is 0.01 to 200 g / 10 minutes,
The range is preferably 0.1 to 100 g / 10 minutes, and more preferably 0.5 to 80 g / 10 minutes.

The copolymer of ethylene with an α, β-unsaturated carboxylic acid or its derivative is ethylene.
(Meth) acrylic acid or its alkyl ester copolymer may be mentioned, and examples of these comonomers include acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, methacrylic acid. Propyl, isopropyl acrylate, isopropyl methacrylate, acrylic acid n-
Butyl, n-butyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, lauryl acrylate, lauryl methacrylate, stearyl acrylate,
Examples thereof include stearyl methacrylate, glycidyl acrylate, glycidyl methacrylate and the like. Among these, particularly preferred are alkyl esters of (meth) acrylic acid such as methyl and ethyl. In particular, the content of (meth) acrylic acid ester is 3 to
It is in the range of 30% by mass, preferably 5 to 25% by mass.
The MFR of a copolymer of ethylene and an α, β-unsaturated carboxylic acid or its derivative is 0.01 to 200 g / 10 minutes,
It is preferably 0.1 to 100 g / 10 minutes, more preferably 0.5 to 80 g / 10 minutes.

As a high-density polyethylene having a density of 0.94 to 0.97 g / cm ³ by a Ziegler type catalyst, a Phillips type catalyst, etc., an ethylene homopolymer, ethylene.α-
Examples thereof include olefin copolymers.

The density is 0.91 to 0.94 g / c.
The linear low-density polyethylene having a m < ³ is a copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms, and the α-olefin having 3 to 20 carbon atoms includes propylene, 1-pentene, 4-methyl-1-pentene, 1-
Examples include hexene, 1-octene, 1-decene, 1-dodecene. Further, it is desirable that the total content of these α-olefins is selected in the range of usually 30 mol% or less, preferably 3 to 20 mol% or less.

The density is 0.88 to 0.91 g / c.
m³ Low density polyethylene with less than Ziegler type catalyst
(VLDPE) has a density of 0.86-0.91g /
cm ³ , Preferably 0.88 to 0.905 g / cm³ of
Range ethylene / α-olefin copolymer, LL
DPE and ethylene / α-olefin copolymer rubber (EP
R, EPDM), a polyethylene having intermediate properties.
It

The ethylene (co) polymer rubber is an ethylene / propylene copolymer rubber having a density of 0.86 to less than 0.91 g / cm ³ , and ethylene / propylene.
Examples of the ethylene / propylene rubber include a diene copolymer rubber, and a random copolymer (EPM) containing ethylene and propylene as main components, and a diene monomer (dicyclopentadiene, ethylidene norbornene, etc.) as a third component. ) Is included as a main component of a random copolymer (EPDM).

Examples of polypropylene resins include propylene homopolymers and propylene-α-olefin copolymers, such as propylene-ethylene random copolymers and propylene-ethylene block copolymers.

The composition layer (II) in the present invention is a polyolefin resin composition containing 100 to 20% by mass of an ethylene (co) polymer (A) and 0 to 80% by mass of another polyolefin resin (B). It consists of When the ethylene (co) polymer (A) is less than 20% by mass, or when the other polyolefin-based resin (B) exceeds 80% by mass, low-temperature heat-sealing property and adhesive strength may decrease. .

The polyolefin resin composition used in the composition layer (II) may further contain an epoxy compound (C). The epoxy compound (C) includes at least two epoxy groups (oxirane groups) in the molecule.
A polyepoxy compound having a molecular weight of 3,000 or less, which contains, is preferably used. With an epoxy compound having one epoxy group in the molecule, the effect of improving the adhesiveness to the substrate cannot be expected so much. The molecular weight of this epoxy compound is 300.
0 or less is preferable, and 1500 or less is particularly preferable. When the molecular weight is more than 3,000, there is a possibility that sufficient effect of improving the adhesiveness may not be obtained when the composition is formed into a composition.

Examples of such an epoxy compound include phthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, terephthalic acid diglycidyl ester, adipic acid diglycidyl ester, trimethylolpropane triglycidyl ether, polyglycerol polyglycidyl ether, Pentaerythritol polyglycidyl ether, butanediol diglycidyl ether, hydrogenated bisphenol A diglycidyl ether,
Examples include phenol novolac polyglycidyl ether and epoxidized vegetable oil. Of these, epoxidized vegetable oils are preferable from the viewpoints of ease of handling and safety when used in food packaging materials.

Here, the epoxidized vegetable oil is an epoxidized unsaturated double bond of natural vegetable oil using peracid or the like, and examples thereof include epoxidized soybean oil, epoxidized linseed oil, epoxidized olive oil, and epoxy. Safflower oil, epoxidized corn oil and the like can be mentioned. These epoxidized vegetable oils are available, for example, from Asahi Denka Kogyo Co., Ltd.
Made, O-130P (epoxidized soybean oil), O-180A
(Epoxidized linseed oil) and the like. It should be noted that the presence of an unepoxidized or insufficiently epoxidized oil component, which is a by-product when the vegetable oil is epoxidized, does not hinder the action and effect of the present invention.

The addition amount of the epoxy compound (C) includes an ethylene (co) polymer (A) and another polyolefin resin (B) and an olefin resin (D) having a functional group which reacts with an epoxy group if desired. 0.01 to 20 parts by mass, preferably 0.01 to 1 part, relative to 100 parts by mass of the resin component.
The amount is 0 parts by mass, and more preferably 0.05 to 5 parts by mass. If the addition amount of the epoxy compound (C) is less than 0.01 parts by mass, the effect of improving the adhesiveness to the substrate is insufficient,
If it exceeds 20 parts by mass, the adhesiveness will be improved, but problems such as blocking due to stickiness and generation of odor may occur.

The polyolefin resin composition used in the composition layer (II) may further contain an olefin resin (D) having a functional group which reacts with an epoxy group in the molecule. The olefin resin (D) having this functional group is not essential, but by adding this, the adhesiveness to the substrate can be further improved. This is because a reaction occurs between the epoxy group and a functional group capable of reacting with the epoxy group, and the epoxy compound (C) grafted to the resin component increases.

The amount of the olefin resin (D) having a functional group that reacts with an epoxy group is such that the ethylene (co) polymer (A), another polyolefin resin (B) and an olefin resin having a functional group are used. It is preferably less than 30% by mass, more preferably 1 to 25% by mass, and further preferably 3 to 20% by mass based on the total mass of the resin (D). Addition of 30% by mass or more of the olefin resin (D) has an effect of improving adhesion, but is not economical.

Examples of the functional group which reacts with the epoxy group include a carboxyl group or a derivative thereof, an amino group, a phenol group, a hydroxyl group and a thiol group. Among them, an olefin resin (D) having in the molecule at least one group selected from the group consisting of an acid anhydride group, a carboxyl group and a carboxylic acid metal salt is preferably used in view of the balance between reactivity and stability. The method of introducing the functional group that reacts with the epoxy group mainly includes a copolymerization method and a graft method.

For example, as the olefin resin (D) having a functional group capable of reacting with an epoxy group produced by a copolymerization method, a multi-component copolymer of ethylene and a compound capable of reacting with ethylene can be mentioned. Examples of the compound used for the copolymerization include α, β-unsaturated carboxylic acids such as (meth) acrylic acid and α, β-such as sodium (meth) acrylate.
Unsaturated carboxylic acid metal salts, unsaturated carboxylic acid anhydrides such as maleic anhydride, itaconic anhydride, citraconic anhydride,
Examples thereof include hydroxyl group-containing compounds such as hydroxyethyl (meth) acrylate and (meth) allyl alcohol, unsaturated amino compounds such as allylamine, and the like, but are not limited thereto. Further, in addition to these unsaturated compounds, vinyl alcohol esters such as (meth) acrylic acid ester, vinyl acetate, vinyl propionate and the like can be copolymerized and used. These compounds can be used as a mixture of two or more kinds in a copolymer with ethylene, and two or more kinds of copolymers with these compounds and ethylene can be used in combination.

On the other hand, the olefin resin (D) having a functional group capable of reacting with an epoxy group introduced by graft modification is
In general, a polyolefin, a free radical generator such as a peroxide, and a modifying compound are allowed to act in a molten or solution state for production. As the polyolefin used for the graft modification, LDPE, linear low density polyethylene (LLDPE), high density polyethylene (HDPE),
In addition to polypropylene (PP), ethylene-propylene copolymer, propylene-butene-1 copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene- (meth) acrylic acid copolymer (E (M) A), ethylene-vinyl acetate- (meth) acrylic acid ester copolymer and the like. These may be used alone or in combination of two or more. Further, for example, ethylene- (meth)
A copolymer such as an acrylic acid ester-maleic anhydride copolymer which already contains an acid or a derivative thereof may be further graft-modified and used.

The type of the free radical generator used in the graft modification is not particularly limited, but, for example, a general organic peroxide is used as the free radical generator, and among them, good reactivity and easy handling are preferable. From the viewpoint of ease, dicumyl peroxide, 2,5-dimethyl-2,5-bis (t-butylperoxy) hexane, 1,3-bis (2-t-butylperoxyisopropyl) benzene, benzoyl peroxide, etc. It is preferably used.

As the unsaturated compound for modification, the same unsaturated compound as the compound copolymerizable with ethylene used in the above-mentioned copolymerization method is used, and the carboxylic acid group or carboxylic acid anhydride group and its metal are used. Basically, it can be used as long as it has an unsaturated group capable of radical reaction such as salt, amino group, and hydroxyl group. Examples of the unsaturated compound for modification include unsaturated carboxylic acids such as (meth) acrylic acid, unsaturated carboxylic acid metal salts such as sodium (meth) acrylate, maleic anhydride or itaconic anhydride, and anhydrous Examples thereof include, but are not limited to, unsaturated carboxylic acid anhydrides such as citraconic acid, hydroxyethyl (meth) acrylate, unsaturated hydroxyl group-containing compounds such as (meth) allyl alcohol, and unsaturated amino compounds such as allylamine.

If desired, conventional additives may be added to the ethylene resin composition used in the composition layer (II), but preferably, an antioxidant, an antiblocking agent, a lubricant and an antistatic agent are used. Agent, antifogging agent, ultraviolet absorber, organic or inorganic pigment, nucleating agent, cross-linking agent, or other known additives, or even if the resin composition contains additives It is desirable that the compounded additive is an additive that does not substantially affect the contacted object such as an electronic component. Therefore, in the present invention,
(L) Additives that are substantially not blended with or that elute or ooze out to the outside, for example, in the case of electronic components, adversely affect electronic components such as corrosion of electronic components. It is possible to provide a clean cover film for electronic component carrier tapes, because the ethylene-based resin composition does not contain an additive that may be given or an additive that is unevenly distributed on the film surface over time. Becomes

As an additive which does not adversely affect the contacted material in the present invention, hydrotalcite or the like can be added within a range that does not corrode the contacted material and does not substantially impair the characteristics of the resin sheet of the present invention. Although it is an additive, it is preferable that substantially no additive is blended because such an additive lowers the adhesive strength.

The polyolefin resin composition of the present invention comprises
The above ethylene (co) polymer (A) and other polyolefin resin (B), and optionally an epoxy compound (C)
And the polar group-containing olefin resin (D) are mixed by a Henschel mixer, a ribbon mixer, or the like, or the mixed product is further kneaded by using an open roll, a Banbury mixer, a kneader, an extruder, or the like. . The kneading temperature is usually from the melting point of the resin to 350 ° C.

The heat seal layer (III) in the present invention is
This layer is made of a styrene resin material. As the styrene-based resin material, a styrene-based resin conventionally used as a heat-sealing layer of a cover film for an electronic component carrier tape, and a composition containing the same can be used. Examples of the styrene resin include a styrene-butadiene copolymer, a styrene-isoprene copolymer, and hydrogenated products thereof. Examples of the composition containing a styrene resin include a composition containing the above-mentioned styrene resin and an olefin polymer.

The styrene resin material has a styrene content of 10 in that it has a sufficient low-temperature heat-sealing property, the peel strength is less dependent on the seal temperature, and the peel strength is uniform. 50% by mass or more
Less than 10 to 90% by mass of a block copolymer (S1) of styrene and a conjugated diene compound, and a styrene content of 5
Block copolymer (S2) of styrene and conjugated diene compound (S2) of 10 mass% to 95 mass%, and impact-resistant polystyrene resin (S3) of 0-2.
A resin composition containing a styrene resin composition containing 5 mass% and an olefin polymer in an amount of 10 to 100 parts by mass with respect to 100 parts by mass of the styrene resin composition is preferably used.

Examples of styrene in the block copolymer of styrene and a conjugated diene compound include styrene and α-methylstyrene. Further, examples of the conjugated diene compound include butadiene and isoprene.

As a block copolymer of styrene and a conjugated diene compound, an elastomeric block copolymer (S1) having a styrene content of 10% by mass to less than 50% by mass and a styrene content of 50% by mass to 95% by mass. %, Two types of resinous block copolymers (S2) are used. The content of the block copolymer (S1) is in the range of 10 to 90 mass% in the styrene resin composition, and the content of the block copolymer (S2) is 90 to 10 mass in the styrene resin composition. % Range. If the content of the block copolymer (S1) exceeds 90% by mass, the tackiness will remarkably increase, making it difficult to form a film, and if it is less than 10% by mass, the low temperature heat sealability will be insufficient. Further, if the content of the block copolymer (S2) is less than 10% by mass, it becomes difficult to form a film. Can cause.

As the impact-resistant polystyrene resin (S3), a styrene-butadiene graft copolymer, so-called high-impact polystyrene resin is used. The content of the impact resistant polystyrene resin (S3) is preferably 0 to 25% by mass in the styrene resin composition. When the content of the impact-resistant polystyrene resin (S3) exceeds 25% by mass,
Although it becomes easy to form a film, the desired transparency cannot be obtained. In addition, the peel strength becomes more dependent on the seal temperature, resulting in nonuniform peel strength. The content of the impact-resistant polystyrene resin (S3) may be 0% by mass, and even if the content of the impact-resistant polystyrene resin (S3) is small or absent, at least 10 parts by weight of the olefin polymer is used so as not to affect the film forming property. By using more than parts by mass, the film-forming property can be improved.

As the olefin polymer, LDPE,
Ethylene polymers such as LLDPE and HDPE or ethylene-α-olefin random copolymers, propylene polymers, ethylene-propylene elastomers, ethylene-propylene-diene ternary copolymer elastomers, styrene-
Ethylene graft copolymer, styrene-propylene graft copolymer, styrene-ethylene-butadiene block copolymer, ethylene-vinyl ester copolymer, ethylene-acrylic acid alkyl ester copolymer, ethylene-acrylic acid copolymer, etc. Is mentioned. Examples of the α-olefin copolymerized with ethylene include propylene, butene,
Examples include penten and hexene, butene among them
A copolymer with 1 or propylene-1 is preferable in the present invention.

The olefin polymer contains an ethylene-vinyl ester copolymer, an ethylene-acrylic acid copolymer or an ethylene-acrylic acid alkyl ester copolymer in an amount of 10% by mass or more in the olefin polymer. It may be. The ethylene-vinyl ester copolymer is preferably an ethylene-vinyl acetate copolymer. Examples of the alkyl group of the ethylene-acrylic acid alkyl ester copolymer include ethyl, propyl, isopropyl and butyl, and the ethyl group is particularly preferable. The ethylene-vinyl ester copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid alkyl ester copolymer has a content of vinyl ester, acrylic acid, and acrylic acid alkyl ester copolymerized with ethylene of 5 to 35% by mass. Ranged.

The content of the olefin polymer is 10 to 100 parts by mass with respect to 100 parts by mass of the styrene resin composition. When the content of the olefin-based polymer is less than 10 parts by mass, it is difficult to obtain a sealing condition for imparting good easy-opening property, and when it exceeds 90 parts by mass, whitening of the film becomes remarkable and transparency is impaired. The ethylene-vinyl ester copolymer, the ethylene-acrylic acid copolymer, or the ethylene-acrylic acid alkyl ester copolymer is preferably contained in the olefin polymer in an amount of 10% by mass or more. When the content of the resin is 10% by mass or more, the low temperature heat sealability becomes good.

The heat seal layer (III) may also have antistatic properties. As a method of imparting antistatic performance to the heat seal layer (III), the heat seal layer (II
Examples of the method include kneading an antistatic agent into the styrene resin material used in I) or coating the surface of the heat seal layer (III) with the antistatic agent. As the antistatic agent when kneading, anionic antistatic agents such as alkyl sulfonates and phosphoric acid ester salts; cationic antistatic agents such as amide cations; amphoteric antistatic agents such as alkivetaines; fatty acid monoglycerides, diesters Nonionic antistatic agents such as-(2-hydroxyethyl) alkylamine; conductive fine powder and the like.

As the antistatic agent for coating, anionic antistatic agents such as alkylsulfonates and alkylsulfate salts; cationic antistatic agents such as choline acyl chloride and alkyltrimethylammonium salts;
Amphoteric antistatic agents such as imidazoline type and alanine type; Nonionic antistatic agents such as polyoxyethylene alkylamine and polyoxyethylene alkylphenyl ether;
Examples include conductive fine powder dispersion solutions.

As a method of coating on the surface, there may be mentioned a method of adding water, an organic solvent or the like to a coating solution or suspension containing an antistatic agent, coating on a film and heating and drying. The coating can be performed by a known coating method such as an air knife coating method, a curtain coating method, a gravure coating method or a spray coating method.

The surface resistivity of the heat-sealing layer (III) after the antistatic treatment thus obtained is 10 ¹ to 1
The range of 0 ¹² Ω / □ is general, and 10 ⁶ to 10 ¹² Ω /
The range of □ is preferable, and 10 ⁸ to 10 ¹² Ω / □ is more preferable. As the antistatic agent, anionic, cationic, amphoteric, nonionic, etc. antistatic agents are preferable because they do not significantly impair the transparency of the film, and as an antistatic treatment method, coating is performed on the surface. The method is preferable because it can be used in a relatively small amount.

As a method for producing a cover film for an electronic component carrier tape of the present invention, an ethylene-based resin composition and a styrene-based resin material are coextruded on a base material to form a base material layer (I) comprising the base material. A method of laminating the composition layer (II) and the heat-sealing layer (III) on the composition layer; the base material layer (I) made of a base material and the composition layer (II) are laminated by dry lamination molding to form the composition layer (II A method of laminating the heat-sealing layer (III) by dry laminating or extrusion laminating a styrene resin material thereon; a coextrusion method and the like.

The molding temperature for extrusion-laminating the polyolefin resin composition on the substrate is in the range of 240 to 330 ° C, preferably 260 to 320 ° C, more preferably 280 to 310 ° C. In addition, particularly when laminating at a relatively low temperature of about 300 ° C. or less, it is desirable to oxidize the molten resin on the bonding surface with the base material with air, ozone, or the like. In addition, it is desirable that the bonding surface of the base material is subjected to surface treatment such as corona discharge treatment. If the molding temperature is lower than 240 ° C., the adhesive strength may not be sufficient, and if it exceeds 330 ° C., the resin is deteriorated, which is not preferable.

The ozone treatment amount is based on the type of substrate, conditions, etc.
5g / Nm depending on ³× 1 Nm³/ Hr ~
100 g / Nm³× 20 Nm³/ Hr range, preferably
10 g / Nm³× 1.5 Nm³/ Hr ~ 70g / Nm³× 1
0 Nm³/ Hr, more preferably 15 g / Nm³× 2N
m³/ Hr-50g / Nm³× 8 Nm³Select in the range of / hr
Is selected. The corona discharge treatment amount is 1 to 300w
/ M² Range, preferably 5 to 200 w min / m² , Further
Preferably 10 to 100 w min / m² Selected in the range of
Is desirable. Especially ozone treatment and corona discharge treatment
By using together, the adhesive strength is dramatically improved.
be able to.

In such a cover film for a carrier tape for electronic parts, the ethylene resin composition used in the composition layer (II) is directly laminated on the substrate by extrusion lamination or the like as described above. As a result, practically sufficient adhesive strength is exhibited, and therefore it is not necessary to use an anchor coating agent. Therefore, the working environment is not polluted by the use of the solvent. Further, since the anchor coating agent is not used, the residual solvent in the cover film for electronic component carrier tape is reduced. Moreover, since sufficient adhesive strength can be obtained without using an anchor coating agent, high-speed molding becomes possible. Further, since it is not necessary to use the anchor coating agent, the cost is reduced. Further, since the adhesive strength is high, the occurrence of troubles due to delamination is reduced.

[0095]

EXAMPLES The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

The test method in the present invention is as follows. [Density] Based on JIS K6760. [MFR] Based on JIS K6760. [Mw / Mn] GPC (150C type manufactured by Waters)
Was used, and ODCB at 135 ° C. was used as a solvent. As the column, Showdex HT806M was used. With the [TREF] column kept at 135 ° C, a sample was injected into the column and the temperature was lowered to 25 ° C at 0.1 ° C / min to deposit the polymer on the glass beads, and then the column was subjected to the following conditions. The temperature was raised and the polymer concentration eluted at each temperature was detected with an infrared detector. (Solvent: ODCB, flow rate: 1 ml /
Min, temperature rising rate: 50 ° C./hr, detector: infrared spectroscope (wavelength 2925 cm ⁻¹ ), column: 0.8 cmφ × 12 cm
L (filled with glass beads), sample concentration: 0.05% by mass) [Measurement of T _ml by DSC] A sheet having a thickness of 0.2 mm was formed by hot pressing, and a sample of about 5 mg was punched out from the sheet. This sample was kept at 230 ° C. for 10 minutes and then cooled to 0 ° C. at 2 ° C./minute. Then 170 again at 10 ° C / min
The temperature was raised to 0 ° C., and the temperature at the peak of the highest temperature peak that appeared was defined as the highest peak temperature T _ml . [ODCB soluble content] 0.5 g of the sample was added to 20 ml of ODC.
In addition to B, the sample was heated at 135 ° C. for 2 hours to completely dissolve the sample, and then cooled to 25 ° C. This solution was left overnight at 25 ° C. and then filtered through a Teflon (registered trademark) filter to collect a filtrate. By infrared spectroscopy, wave number 2925 cm of asymmetric stretching vibration of methylene in the filtrate which is the sample solution
The absorption peak intensity around ^-1 was measured, and the sample concentration in the filtrate was calculated from the calibration curve prepared in advance. From this value, the amount of ODCB-soluble matter at 25 ° C was determined. [Melt Tension (MT)] It was determined by measuring the stress when the molten polymer was stretched at a constant rate with a strain gauge. The measurement sample was granulated into pellets and was measured using an MT measuring device manufactured by Toyo Seiki Seisakusho. Orifice used has a hole diameter of 2.09
mmφ, length 8 mm, measurement conditions: resin temperature 190
℃, cylinder descending speed 20mm / min, winding speed 15
m / min. [Halogen concentration] 10ppm measured by fluorescent X-ray method
When the above chlorine was detected, this was taken as the analytical value. When it was lower than 10 ppm, it was measured by a TOX-100 type chlorine / sulfur analyzer manufactured by Dia Instruments Co., Ltd., and when it was 2 ppm or less, it was regarded as substantially non-containing, and was designated as ND (non-detect).

Various components used in the examples are as follows. The ethylene copolymer (A11) was polymerized by the following method. [Preparation of solid catalyst] [Solid catalyst (a)] In a catalyst preparation device equipped with an electromagnetic induction stirrer, 1000 ml of toluene purified under nitrogen, 26 g of tetrapropoxyzirconium (Zr (OPr) ₄ ) and 22 g of indene and methylbutylcyclo 88 g of pentadiene was added, 100 g of tripropylaluminum was added dropwise over 100 minutes while maintaining the temperature at 90 ° C., and then the mixture was reacted at the same temperature for 2 hours. After cooling to 40 ° C,
Toluene solution of methylalumoxane (concentration 3.3 mmo
(24 ml) was added and the mixture was stirred for 2 hours. Next, 2000 g of silica (surface area 300 m ² / g) calcined in advance at 450 ° C. for 5 hours was added, and after stirring at room temperature for 1 hour, nitrogen blowing and reduced pressure drying were performed at 40 ° C. ) Got.

[Gas phase polymerization] Continuous fluidized bed gas phase polymerization apparatus
Polymerization temperature 65 ° C, total pressure 20 kgf / cm ² At G
Copolymerization of ethylene and 1-hexene was performed. The solid touch
The medium (a) is continuously supplied, and ethylene, 1-hexene and
And hydrogen, etc. are supplied so as to maintain a predetermined molar ratio for polymerization.
Then, two kinds of ethylene copolymers (A11) were obtained. That
The measurement results of the physical properties of the copolymer are shown in Table 1.

The ethylene copolymer (A12) was polymerized by the following method. [Preparation of solid catalyst] [Solid catalyst (b)] To a catalyst preparation device equipped with an electromagnetic induction stirrer, 1000 ml of toluene purified under nitrogen, 31 g of tetrabutoxyzirconium (Zr (OBu) ₄ ) and 74 g of indene were added, and 90 127 g of triisobutylaluminum was added dropwise while maintaining the temperature at 100 ° C. over 100 minutes, and then reacted at the same temperature for 2 hours. After cooling to 40 ° C., a toluene solution of methylalumoxane (concentration: 3.
24 mmol (3 mmol / ml) was added and stirred for 2 hours. Next, 2000 g of silica (surface area 300 m ² / g) calcined in advance at 450 ° C. for 5 hours was added, and the mixture was stirred at room temperature for 1 hour, followed by nitrogen blowing and vacuum drying at 40 ° C. ) Got.

[Gas Phase Polymerization] Copolymerization of ethylene and 1-hexene was carried out using a continuous fluidized bed gas phase polymerization apparatus at a polymerization temperature of 70 ° C. and a total pressure of 20 kgf / cm 2 G. Polymerization was carried out by continuously feeding the solid catalyst (b) and feeding ethylene, 1-hexene and hydrogen at a predetermined molar ratio to obtain two ethylene copolymers (A12). . The measurement results of the physical properties of the copolymer are shown in Table 1.

The ethylene copolymer (A2) was polymerized by the following method. [Preparation of solid catalyst] [Solid catalyst (c)] To a catalyst preparation device equipped with an electromagnetic induction stirrer, 1000 ml of toluene purified under nitrogen, 26 g of tetrapropoxyzirconium (Zr (OPr) ₄ ) and 74 g of indene and methylpropylcyclo 78 g of pentadiene was added, 100 g of tripropylaluminum was added dropwise over 100 minutes while maintaining the temperature at 90 ° C., and then the mixture was reacted at the same temperature for 2 hours. After cooling to 40 ° C,
Toluene solution of methylalumoxane (concentration 3.3 mmo
2133 ml was added and the mixture was stirred for 2 hours. Next, 2000 g of silica (surface area 300 m ² / g) calcined in advance at 450 ° C. for 5 hours was added, and after stirring at room temperature for 1 hour, nitrogen blowing and reduced pressure drying were performed at 40 ° C. to obtain a solid catalyst (ha ) Got.

[Gas Phase Polymerization] Continuous fluidized bed gas phase polymerization apparatus
Polymerization temperature 80 ° C, total pressure 20 kgf / cm ²At G
Copolymerization of ethylene and 1-hexene was performed. The solid touch
The medium (c) is continuously supplied, and ethylene, 1-hexene and
And hydrogen are supplied to maintain the specified molar ratio for polymerization.
And two ethylene copolymers (A2) were obtained. Its weight
The measurement results of the physical properties of the coalesced are shown in Table 1.

[Production of ethylene / hexene-1 copolymer (A3) by metallocene catalyst] Purified toluene was placed in a pressure reactor equipped with a stirrer and purged with nitrogen, then 1-hexene was added, and bis ( A mixture of n-butylcyclopentadienyl) zirconium dichloride and methylalumoxane (MAO) was added (Al / Zr molar ratio = 200).
After adding, the temperature was raised to 80 ° C. to adjust the metallocene catalyst. Next, ethylene was added, and while continuously polymerizing ethylene, the total pressure was maintained at 8 kg / cm ³ , and the polymerization was performed.
An ethylene / hexene-1 copolymer (A3) was produced.
The measurement results of the physical properties of the copolymer are shown in Table 1.

(A4) Linear low-density polyethylene (LLDPE) with commercially available Ziegler type catalyst: Density: 0.910 g / cm ³ , MFR:
10 g / 10 min, comonomer: 4-methyl-1-pentene Table 1 shows the physical properties of the ethylene copolymer.

[0105]

[Table 1]

The following were used as the other polyolefin resin (B). [(B1) Commercially available high-pressure radical polymerization branched low-density polyethylene (LDPE-1)] Density: 0.919 g / cm ³ , MFR: 8.1 g / 10
Min, trade name: JH607D, Japan Polyolefin Co., Ltd.
[(B2) Commercially available branched low-density polyethylene (LDPE-2) by high-pressure radical polymerization method] Density: 0.919 g / cm ³ , MFR: 5 g / 10 minutes,
Product name: JA506N, manufactured by Nippon Polyolefin Co., Ltd.

As the styrene resin material used for the heat seal layer (III), the following materials were used. [Polystyrene sealant (abbreviated as PS)] Styrene-butadiene block copolymer 40 parts by mass / styrene-
50 parts by mass of block copolymer elastomer / 10 parts by mass of impact polystyrene resin

The following were used as other components. [Epoxy compound (C)] Epoxidized soybean oil: (Molecular weight: 938, trade name; Adeka Sizer, manufactured by Asahi Denka Co., Ltd.) [Other resins] Ethylene-butene-1 copolymer rubber (EB
(Abbreviated as R) (trade name: Toughmer A4090, manufactured by Mitsui Chemicals, Inc.)

Example 1 70 parts by mass of ethylene (co) polymer sLLDPE-1 (A11) impregnated with epoxidized soybean oil (hereinafter abbreviated as ESO) in the proportion shown in Table 2 was added to LDPE-1 ( B1) 30 parts by mass are blended, and an antioxidant and a halogen absorber (calcium stearate)
After dry blending with a tumbler mixer without adding, the mixture was pelletized at 170 ° C. to obtain an ethylene resin composition.

[Production of Cover Film] Corona treatment (6
12 μm thick biaxially stretched polyethylene terephthalate film (hereinafter abbreviated as OPET) having Kw min / m ² ).
And a polystyrene-based sealant film having a thickness of 30 μm (hereinafter abbreviated as PS), the ethylene resin composition (hereinafter abbreviated as sLLDPE) under the following conditions:
Extrusion lamination with a thickness of 20 μm (laminating conditions (90
mmφ (L / D = 32) extruder, molding temperature 32
0 ° C, molding speed 150m / min), OPET / sLL
A cover film of DPE / PS was produced. After aging the obtained cover film at 40 ° C. for 48 hours,
A strip sample with a width of 15 mm was cut out from the cover film, and the tensile speed was 30 in accordance with JIS K6854.
T-peel under conditions of 0 mm / min, OPET and sLLD
The peel strength between PE and between sLLDPE and PS was measured, and this peel strength was taken as the adhesive strength. The results are shown in Table 2.

Example 2 In Example 2, the ethylene (co) polymer sLLDPE-1 (A in Example 1 was used.
11) is an ethylene (co) polymer sLLDPE-2 (A1
2) LDPE-1 (B1) to LDPE-2 (B2)
A cover film was produced in the same manner as in Example 1 except that the adhesive strength was measured. The results are shown in Table 2.

[Examples 3 to 4] The ethylene (co) polymer sLLDPE-1 (A11) in Example 1 was replaced with the ethylene (co) polymer sLLDPE-3 (A2) and mLLD.
A cover film was produced in the same manner as in Example 1 except that PE (A3) was used, and the adhesive strength was measured. The results are shown in Table 2.

[Example 5] sLLDPE-1 (A11)
A cover film was produced according to Example 1 at 100% by mass (without using ESO), and the adhesive strength was measured. The results are shown in Table 2.

[Examples 6 to 8] A cover film was produced according to Example 1, Example 2 and Example 3 except that ESO was not used, and the adhesive strength was measured. The results are shown in Table 2.

[Comparative Example 1] The ethylene (co) polymer sLLDPE-1 (A11) in Example 1 was used as a linear low density polyethylene zLLDPE (A with a Ziegler type catalyst).
A cover film was produced and the adhesive strength was measured in the same manner as in Example 1 except for changing to 4). The results are shown in Table 2.

[Comparative Example 2] The ethylene (co) polymer sLLDPE-1 (A11) in Example 1 was replaced with LDPE-.
A cover film was manufactured in the same manner as in Example 1 except that the adhesive strength was measured in the same manner as in Example 1 (B1). The results are shown in Table 2.

[Comparative Example 3] 90% by mass of LDPE-1 (B1) was mixed with 10% by mass of EBR to prepare a cover film according to Example 1, and the adhesive strength was measured. The results are shown in Table 2.

[Comparative Example 4] A cover film was produced in the same manner as in Example 1 except that a composition comprising 80% by mass of LDPE-1 (B1) and 20% by mass of EBR was used, and the adhesive strength was measured. The results are shown in Table 2.

[Comparative Example 5] sLLDPE-1 (A11)
A cover film was produced in the same manner as in Example 1 except that 10% by mass and 90% by mass of LDPE-1 (B1) were used.
The adhesive strength and heat seal strength were measured. The results are shown in Table 2.

[0120]

[Table 2]

[Experimental Examples 1 to 9] 70 parts by mass of ethylene / α-olefin copolymers (A11), (A12), (A2) and (A3) and 30 parts by mass of (B1) LDPE were blended. After dry blending with a tumbler mixer without adding an additive such as an antioxidant, the mixture was pelletized at 170 ° C. to obtain a resin composition. Then, using an extrusion laminate molding machine (manufactured by Modern Machinery Co., Ltd.) having an extruder with a diameter of 90 mm, the resin composition is melt-extruded at a molding temperature of 315 ° C., a laminating speed of 100 m / min, a laminate thickness of 30 μm, and a coat width of 860 mm. Then, aluminum foil (# 30) which is a base material, terephthalate (PET: 3)
0 μm) and extrusion laminated to obtain a laminate. Test pieces were taken from these laminates and the adhesive strength was examined. Further, (A11) ethylene / α-olefin copolymer is
0 parts by mass and (B1) LDPE 30 parts by mass are blended,
Additives such as antioxidants, calcium stearate, hydrotalcite, etc. were added, dry blended with a tumbler mixer, and pelletized at 170 ° C. to obtain a resin composition. Then, in the same manner as in Experimental Example 1, extrusion lamination was performed to obtain a laminate. A test piece was sampled from this laminate to examine the adhesive strength. The results are shown in Table 3.

[0122]

[Table 3]

As shown in Experimental Examples 1 to 4 and Experimental Examples 5 to 9 in Table 3 above, it is understood that the addition of the additive significantly reduces the adhesive strength.

[0124]

As described above, the cover film for an electronic component carrier tape of the present invention comprises a base material layer (I) made of a base material and a base material made of the base material. Ethylene (co) polymer (A) 10 in contact with layer (I)
0 to 20% by mass and other polyolefin resin (B) 0
A composition layer (II) composed of a polyolefin resin composition containing 80 to 80% by mass, and a heat seal layer (III) composed of a styrene resin material, which is in contact with the composition layer (II). The ethylene (co) polymer (A) is produced in the presence of a single-site catalyst, and the ethylene (co) polymer (A) has a (a) density of 0.86 to 0.97.
g / cm ³ , (b) melt flow rate of 0.1 to 20
Since it is 0 g / 10 minutes, the adhesiveness between the layers constituting the cover film is excellent without using an adhesive such as an anchor coating agent.

If the heat-sealing layer (III) has antistatic properties, accidents due to electrification during high-speed molding can be prevented and workability can be greatly improved. Further, if the base material is a biaxially stretched film, the heat resistance and tear strength of the film are improved, and tape breakage or the like is prevented.

Further, when the halogen content in the ethylene (co) polymer is 10 ppm or less, it becomes possible to provide a clean cover film for electronic component carrier tape, and in the case where no additive is compounded, The adhesive strength can be maintained at a high level.

[Brief description of drawings]

FIG. 1 is a sectional view showing an example of a cover film for an electronic component carrier tape of the present invention.

FIG. 2 is a graph showing an elution temperature-elution amount curve of the ethylene (co) polymer (A) according to the present invention.

FIG. 3 is an ethylene (co) polymer (A1) according to the present invention.
3 is a graph showing an elution temperature-elution amount curve of.

FIG. 4 is a graph showing an elution temperature-elution amount curve of an ethylene (co) polymer with a metallocene catalyst.

FIG. 5: Elution temperature of ethylene (co) polymer (A2)-
It is a graph which shows a dissolution amount curve.

FIG. 6 is a cross-sectional view showing an example of a conventional electronic component carrier tape.

[Explanation of symbols]

10 Electronic component carrier tape cover film 11 Base material layer (I) 12 Composition layer (II) 13 Heat seal layer (III)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hiroshi Kasahara             2-3-2 Yokou, Kawasaki-ku, Kawasaki-shi, Kanagawa               Japan Polyolefin Co., Ltd.             Research and Development Center F term (reference) 4F100 AK01A AK03B AK04B AK12C                       AK42 AK53B AL01B AL05B                       BA03 BA10A BA10C JA06B                       JA07B JA13B JB08B JG03C                       JK06 JL12C YY00B                 4J002 BB03W BB03X BB04W BB04X                       BB05X BB06X BB07X BB08X                       BB10X BB11X BB15X DE286                       FD056 FD076 FD096 FD106                       FD146 FD176 FD206 GF00                       GG02 GQ00

Claims (10)

[Claims] 1. A base material layer (I) composed of a base material, and 100 to 20% by mass of an ethylene (co) polymer (A) in contact with the base material layer (I) composed of the base material and other polyolefin-based materials. A composition layer (II) comprising a polyolefin resin composition containing 0 to 80% by mass of the resin (B), and the composition layer (I
I) and a heat seal layer (III) made of a styrene resin material, and the ethylene (co) polymer (A) is produced in the presence of a single site catalyst. The ethylene (co) polymer (A) has a density (a) of 0.86 to 0.97.
g / cm ³ , (b) melt flow rate of 0.01 to 2
A cover film for an electronic component carrier tape, which is 00 g / 10 minutes. 2. The cover film for an electronic component carrier tape according to claim 1, wherein the heat seal layer (III) has an antistatic property. 3. The cover film for electronic component carrier tape according to claim 1, wherein the polyolefin resin composition of the composition layer (II) further contains an epoxy compound (C). . 4. The electronic component according to claim 1, wherein the ethylene (co) polymer (A) satisfies the following requirements (a) to (d). Cover film for carrier tape. (A) Density of 0.86 to 0.97 g / cm ³ , (b) Melt flow rate of 0.01 to 200 g / 10
Min, (c) molecular weight distribution (Mw / Mn) of 1.5 to 4.5, (d) total 25 determined from the integrated elution curve of elution temperature-elution amount curve by continuous temperature rising elution fractionation method (TREF) The difference T ₇₅ -T ₂₅ between the temperature T _{25 at} which 100% elutes and the temperature T _{75 at} which 75% of the whole elutes, and the density d satisfy the following equation (equation 1) (equation 1) T ₇₅ -T ₂₅ ≤ -670 x d + 644 5. The cover film for an electronic component carrier tape according to claim 4, wherein the ethylene (co) polymer (A) further satisfies the following requirement (e). (E) The difference between the temperature T _{25 at} which 25% of the whole is eluted and the temperature T _{75 at} which 75% of the whole is obtained, which is obtained from the integral elution curve of the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF) T ₇₅ -T ₂₅ and density d satisfy the following to satisfy the relation of (formula 2) (formula 2) d <when _{^{0.950g / cm 3 T 75 -T 25}} ≧ -300 × d + 285 d ≧ 0.950g / Cm ³ T ₇₅ −T ₂₅ ≧ 0 6. The ethylene (co) polymer (A) is an ethylene (co) polymer (A1) further satisfying the following requirements (f) and (g):
Alternatively, the cover film for an electronic component carrier tape according to claim 5. (F) Ortho-dichlorobenzene (ODC at 25 ° C)
B) Soluble content X (mass%), density d and melt flow rate (MFR) satisfy the relationships of the following (formula 3) and (formula 4) (formula 3) d-0.008log MFR ≧ 0.93 When X <2.0 (Equation 4) d−0.008 log MFR <0.93 When X <9.8 × 10 ³ × (0.9300−d + 0.008
logMFR) ² +2.0 (g) Multiple peaks on the elution temperature-elution volume curve by continuous temperature rising elution fractionation (TREF) 7. The ethylene (co) polymer (A) is an ethylene (co) polymer (A2) further satisfying the following requirements (h) and (i):
Alternatively, the cover film for an electronic component carrier tape according to claim 5. (H) One peak of the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF). (I) One or more melting point peaks, and the highest melting point _Tml and density d satisfies the following relationship (Equation 5) (Equation 5) T _ml ≧ 150 × d−19 8. The ethylene (co) polymer (A2) is
The cover film for an electronic component carrier tape according to claim 7, which further satisfies the following requirement (j). (J) Melt tension (MT) and melt flow rate (MFR) satisfy the following (formula 6) (formula 6) logMT ≦ −0.572 × logMFR +
0.3 9. The carrier tape for electronic parts according to claim 1, wherein the ethylene (co) polymer (A) has a (k) halogen content of 10 ppm or less. Cover film. 10. The polyolefin-based resin composition,
(L) An additive which is substantially not added, or an additive which does not substantially affect a contacted object is added, wherein the additive is added. Cover film for electronic component carrier tape.