JP2003163480A - Cooling structure of casing of electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling structure capable of effectively utilizing the limited packaging space of electronic equipment and effectively cooling the equipment. <P>SOLUTION: Outside air is sucked from a suction port 7 into the casing 1 of the electronic equipment by driving a fan unit 3 provided with a plurality of fans 3-1, passed through a space between plug-in units arranged on the upper part of the fan unit 3, run into a wind direction board 5 to which heat generated from a power supply device packaged in a dead space formed between the wind direction board 5 and the ceiling part of the casing 1 is transmitted to execute heat exchange and heat-exchanged air is induced by the board 5 and discharged from an exhaust port 8 to the outside. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air-cooling structure for an electronic equipment casing, and more particularly to an efficient cooling structure which can effectively use a limited mounting space of the electronic equipment casing.

[0002]

2. Description of the Related Art In a communication device, an electronic circuit constructed in consideration of expandability and maintainability is often made into a plug-in unit, has a structure compatible with function expansion, and is often forcedly cooled by a fan.

Particularly, as the functionality and the integration of electronic circuits increase, the scale of the circuit mounted on each plug-in unit increases, and high-density mounting is inevitable. On the other hand, the communication device apparatus can be made smaller and the power consumption can be reduced. It is indispensable and burdens the designer.

Further, the scale of the circuit mounted in each plug-in unit is increased, the communication equipment is mounted at a high density, the power is saved, the power supply is simplified due to the miniaturization, and the mounting space is reduced.
It is also necessary to suppress the amount of heat generated and take measures for heat dissipation.

As a countermeasure against such a background,
As shown in FIG. 7, the fan unit 3 is arranged below the electronic circuit mounting area (including the plug-in unit housing portion and the power supply device) 2 in the electronic equipment housing, and the wind direction plate is arranged above the plug-in unit housing portion 2. 5, the outside air is sucked through the intake port at the bottom of the electronic device casing by the operation of the fan, and after passing through the air flow path formed between the plug-in units, the electronic device casing is guided by the wind direction plate 5. There is a cooling system in which the air is exhausted from the exhaust port on the back of the body (first conventional technique).

Further, a plurality of shelves having a plurality of plug-in units mounted therein are mounted, a box body is formed, and a front and back partition plate is opened in the box body to form intake and exhaust ports, and a fan is provided at a lower portion. The intake / exhaust part with the unit is mounted on the upper part of the multi-staged shelf, the power supply device etc. is installed on the upper part of the intake / exhaust part, and the bottom part of the multi-staged shelf forms a box with a front-down partition. An air intake / exhaust unit that has a plate and whose front and back surfaces are open to form an intake / exhaust port is installed. Japanese Patent Laid-Open No. 6-204676 discloses a cooling structure for an electronic device that is forcedly air-cooled and naturally cools a power supply device mounted on the upper part of the intake / exhaust part by outside air introduced from the intake port of the intake / exhaust part. Obedience of 2 Technology).

Further, a cabinet main body having an exhaust port at the top of the back surface, electronic equipment mounted in the cabinet main body, and a fan disposed near the top of the cabinet main body and sucking air from the lower side and blowing the air upward A plurality of fan units arranged in two rows from the front to the rear in the left-right direction, and an inclined deflection plate that directs the air flow blown from the fan units to the exhaust port,
A deflection plate duct for preventing air flow interference between a fan group arranged in the front row and a fan group arranged in the rear row of the fan unit is arranged on the lower surface of the deflection plate, and the fans of the front and rear rows are individually arranged. A cabinet type that facilitates fan failure detection by air volume detection by arranging partition plates that prevent air flow interference on the bottom surface of the deflection plate and the surface of the deflection plate duct to prevent mutual interference between multiple fans. An electronic device is disclosed in Japanese Patent Laid-Open No. 6-314892 (third prior art).

[0008]

As described above, the first
In the related art, a fan unit is arranged in the lower part of a plug-in unit housing (including a power supply device) in an electronic equipment casing, and a wind direction plate is arranged in the upper part of the plug-in unit housing so that a fan is operated. A structure in which outside air is sucked in through an intake port at the bottom of the electronic device casing, passes through an air flow path formed between plug-in units, and then is guided to the wind direction plate to be discharged to the outside through an exhaust port on the rear surface of the electronic device casing. In addition, since the power supply device is mounted together with the plug-in unit in which the electronic circuit is mounted in the plug-in unit housing portion, the mounting area of the plug-in unit is reduced, which causes an increase in the size of the electronic device housing.

Further, there is a risk that the heat generation of the power supply device promotes the temperature rise of the plug-in unit and causes a failure of the plug-in unit.

Further, the space formed between the wind direction plate and the ceiling of the electronic equipment casing becomes a dead space, and the mounting space of the electronic equipment casing cannot be used effectively due to the limited space.

In the second prior art, a plurality of shelves in which a plurality of plug-in units are mounted are mounted in multiple stages, and a box body is formed. The upper and lower parts of the shelf, which has a fan unit at the bottom, is mounted on the upper part of the multi-stage shelf, and the power supply device is mounted on the upper part of the intake and exhaust port of the intake and exhaust part. The air intake / exhaust unit that has a front and back partitioning plate that opens in the front and back to form an intake / exhaust unit is installed in the box body, sucks outside air from the intake port of the intake / exhaust unit, and then to the exhaust port of the intake / exhaust unit. The plug-in unit is forcibly air-cooled by the air flow path to be exhausted, and the power supply device mounted on the upper part of the intake / exhaust part is naturally air-cooled by the outside air introduced from the intake port of the intake / exhaust part. To implement To compress the mounting space of the child circuit (plug-in unit).

Further, since the space formed in the upper part of the intake / exhaust portion is used as a natural air-cooled outside air intake port, it does not become a dead space, but cannot be used as a mounting space for an electronic circuit.

A third conventional technique is to install a cabinet main body having an exhaust port at the back top, electronic equipment mounted in the cabinet main body, and a cabinet near the top of the cabinet main body to suck air from the lower side. The fan unit that is blown upward has a plurality of fan units arranged side by side in two rows from the front to the rear of the cabinet body, and an inclined wind direction plate that directs the air flow blown from the fan unit to the exhaust port, An airflow direction duct that prevents interference of the air flow between the fan group arranged in the front row of the fan unit and the fan group arranged in the rear row is arranged on the lower surface of the wind direction plate, and the individual fans in each of the front and rear rows are arranged. A partition plate that prevents air flow interference is placed on the lower surface of the wind direction plate and the surface of the wind direction duct,
By preventing mutual interference between multiple fans,
This is a configuration that facilitates fan failure detection by air volume detection, and the space formed between the wind direction plate and the top plate of the cabinet-type electronic device becomes a dead space, so that the cabinet mounting space can be used effectively. Can not.

An object of the present invention is to provide an air-cooling structure for an electronic equipment casing, which can effectively use a limited mounting space and can perform effective air-cooling.

[0015]

An air-cooling structure for an electronic device housing according to the present invention is an air-cooling structure for an electronic device housing in which a plurality of electronic circuits are mounted. An exhaust port in the upper rear portion, a heating element is mounted on the upper surface inside the electronic device casing, and a wind direction plate for guiding an air flow inside the electronic device casing is provided in the vicinity of the exhaust port. In order to prepare for, a plurality of electronic circuits having a plug-in unit structure are mounted on the lower part of the wind direction plate, and a fan unit composed of one or a plurality of fans is provided on the lower part of the electronic circuit and above the suction port. It is characterized in that it is mounted, sucks the outside air from the suction port by the operation of the fan, and guides the air flow passing between the electronic circuits to the exhaust port by the lower surface of the wind direction plate and discharges it to the outside. .

Further, the wind direction plate is inclined at a predetermined angle from the upper part of the exhaust port to the front side on the rear ceiling part of the electronic device housing, and the wind direction plate and the ceiling part of the electric device housing. It is characterized in that the heating element is housed inside the space formed between the heating element and the heating element.

Further, the heating element is fixed to the wind direction plate by a predetermined method with a heat transfer member interposed.

Further, the heat transfer member is a heat dissipation grease.

The heating element is a power supply device.

Further, the heat source inside the power supply device is fixed inside the bottom face of the casing of the power supply device, and the bottom face of the casing is fixed to the wind direction plate through the heat transfer member. To do.

Further, the heat source inside the power supply device is fixed inside the upper surface of the casing of the power supply device, and the bottom face of the casing is fixed to the wind direction plate with the heat transfer member interposed. To do.

The heat source may be a rectifying circuit and / or a direct current stabilizing circuit.

Further, the heating element is a heating unit containing a heating source having a large heating value.

The heat source inside the heat generating unit is fixed inside the bottom surface of the housing of the heat generating unit, and the bottom surface of the housing is fixed to the wind direction plate with the heat transfer member interposed. To do.

The heat source inside the heat generating unit is a memory circuit.

Further, the heat source inside the heat generating unit is a power amplifier circuit.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a schematic structure of an electronic equipment casing of the present invention, FIG. 2 is a side view of the electronic equipment casing of the first embodiment of the present invention, and FIG. 3 is a first embodiment. It is a figure which shows the state of the dead space of a form, (A) shows mounting of the power supply device in a dead space, (B) is a figure for demonstrating a heat dissipation state, FIG. 4 is the 2nd Example of this invention. FIG. 5 is a cross-sectional view of the electronic device casing of the embodiment, FIG. 5 is a view showing a state of the dead space of the second embodiment, (A) shows mounting of the power supply device in the dead space, and (B) shows FIG. 6 is a diagram for explaining a heat radiation state, and FIG. 6 shows mounting of a heat generating unit in a dead space according to the third embodiment. Next, an embodiment of the present invention will be described with reference to the drawings. First, a first embodiment will be described with reference to FIGS. 1, 2 and 3.

The electronic equipment housing 1 shown in FIG. 1 has an air inlet 7 at the lower front portion of the housing and an exhaust opening 8 at the upper rear portion of the housing.
And a front cover 4, and a plurality of plug-in type printed circuit board units or module units (hereinafter referred to as “plug-in units”) 2 in a substantially central portion inside the housing.
Plug-in unit housing 2 for housing 1 vertically
And a fan unit 3 in which a plurality of fans 3-1 arranged in the lower part of the plug-in unit housing 2 are mounted, and from the ceiling of the back of the housing to the front of the housing above the plug-in unit housing 2. An airflow direction plate 5 that is inclined at a predetermined angle toward the airflow direction plate 5 and guides the air inside the case to the exhaust port 8 on the rear side of the case;
And a power supply device 6 disposed in a dead space 9 formed between the housing and the ceiling portion of the housing. Although not shown, the plug-in unit housing 2 includes a shelf (shelf board) having rails for guiding the insertion and removal of the plug-in unit up and down and a backboard on the back of which a socket for connecting the plug-in unit is arranged. It is fixed to the housing by a predetermined method.

As shown in FIG. 2, the outside air introduced into the inside of the casing from the inlet 7 at the lower front of the casing by the operation of the fan unit 3 rises between the plug-in units 2-1 and the wind direction plate. 5 is discharged to the outside of the housing through the exhaust port 8 on the upper back surface of the housing.

On the other hand, the housing of the power supply device 6 disposed in the dead space 9 formed between the wind direction plate 5 and the ceiling portion of the housing has thermal conductivity as shown in FIG. 3 (A). It is fixed to the wind direction plate 5 by a predetermined method, for example, a screw or the like, with an excellent member 10 such as heat dissipation grease 10 interposed.

The heat source 6-1 inside the power supply device 6 is
For example, a rectifying circuit or a DC stabilizing circuit, which are fixed to the bottom surface of the casing of the power supply device 6 by a predetermined method, and the heat generated by these heat sources 6-1 is transferred through the heat radiating grease 10 as shown in FIG. 3B. And transmitted to the wind direction plate 5.

The heat generated by the power supply device 6 transmitted to the wind direction plate 5 is exchanged by the air flow passing through the inside of the electronic equipment casing 1 and hitting the wind direction plate 5, and the heat-exchanged hot air is transmitted to the wind direction plate 5. It is guided and discharged from the exhaust port 8 to the outside.

In this way, the plug-in unit storage section 2
Only the plug-in unit 2-1 is mounted in the housing, and the power supply device 6 having the largest heat generation amount is mounted in the dead space above the wind direction plate disposed above the housing to suppress the temperature rise inside the housing. As a result, the reliability of the device is improved.

Further, since a mounting space can be provided in the plug-in unit accommodating portion 2, it is easy to add the plug-in unit 2-1 for function expansion.

Further, it becomes easy to expand the system by mounting the electronic equipment casing configured as described above on the rack in multiple stages.

Next, the second embodiment will be described with reference to FIGS.
Will be described with reference to.

As shown in FIG. 4, the power supply device 6 disposed in the dead space 9 formed between the wind direction plate 5 of the electronic equipment casing 1 and the ceiling portion of the casing is an internal heat source. 6-1 is fixed inside the upper surface of the casing of the power supply device, and these heat sources 6-
The heat generated by No. 1 is transmitted to the housing of the power supply device 6.

As with the first embodiment, the power supply device 6 is attached to the wind direction plate 5 through the member 10 having excellent heat conductivity, for example, the heat radiating grease 10, as in the first embodiment. It is fixed by a method such as a screw.

As shown in FIG. 5, the heat generated by the heat source 6-1 is transmitted through the casing of the power supply device 6 to the wind direction plate 5, and the heat generation of the power supply device 6 transmitted to the wind direction plate 5 is performed by the electronic device. Equipment housing 1
The airflow that passes through the inside of the fan and rises hits the wind direction plate 5 and is heat-exchanged, and the heat-exchanged hot air is guided to the wind direction plate 5 and discharged from the exhaust port 8 to the outside.

Therefore, the heat source 6-1 is fixed to the top surface of the power source device 6 instead of the bottom surface of the housing.
Even in this case, the same effect as that of the first embodiment can be obtained.

Next, a third embodiment will be described with reference to FIG.

As shown in FIG. 6, a heat generating unit 11 other than the power supply device is arranged in a dead space 9 formed between the wind direction plate 5 and the ceiling of the electronic device casing, and the casing of the heat generating unit is provided. Has excellent thermal conductivity, for example, radiating grease 10
Is fixed to the wind direction plate 5 by a predetermined method, for example, a screw or the like.

Heat source 11-1 inside heat generating unit 11
Is a component that generates a large amount of heat, such as a memory circuit or a power amplifier circuit, and is mounted inside the housing as a measure against EMC.

The memory circuit and the power amplifier circuit, which generate a large amount of heat, are fixed to the inside of the bottom surface of the casing, and the generated heat is conducted to the wind direction plate 5 and passes through the air flow path inside the electronic equipment casing 1 at the wind direction plate 5. The heat is exchanged by the generated air flow and is discharged to the outside through the exhaust port 8.

In this way, the plug-in unit storage section 2
By mounting only the plug-in unit 2-1 that generates a relatively small amount of heat in the above, and by mounting the parts (units) that generate a large amount of heat other than the power supply device in the dead space above the wind direction plate that is also disposed above the housing, The temperature rise inside the housing can be further suppressed as compared with the case of the first embodiment, and the reliability of the device is improved.

Further, since the mounting space formed in the plug-in unit accommodating portion 2 can be further increased as compared with the first embodiment, the function can be easily expanded.

[0048]

As described above, the first embodiment of the present invention is provided with the air inlet port at the lower front portion of the casing, the exhaust port at the upper rear portion of the casing, and the front cover. A plug-in unit accommodating portion for accommodating a plurality of plug-in units vertically and horizontally in a substantially central portion inside the body, a fan unit including a plurality of fans disposed below the plug-in unit accommodating portion, and a plug The upper part of the in-unit storage section is composed of a wind direction plate that is inclined at a predetermined angle from the ceiling of the back of the housing to the front of the housing and guides the airflow inside the housing to the exhaust port on the back of the housing. Since the heating element is mounted inside the dead space formed between the wind direction plate and the ceiling portion of the housing, the limited mounting space of the electronic device housing can be effectively used.

Further, by mounting a heating element such as a power supply device in the dead space above the wind direction plate, a wide mounting space for the plug-in unit can be secured, so that the plug-in unit can be mounted in each plug-in unit in accordance with high integration. It is possible to support high-density mounting of plug-in units accompanying the increase in circuit scale, higher functionality, and higher performance.

Further, by expanding the mounting space of the plug-in unit, it is possible to expand the function by adding the plug-in unit to the high-density mounting and downsize the device.

Efficient air cooling is possible by mounting only the plug-in unit in the plug-in unit accommodating section and mounting the power supply unit with the largest heat generation in the dead space above the wind direction plate installed in the upper part of the case. Therefore, the temperature rise inside the housing can be suppressed, and the reliability of the device is improved.

The second embodiment can also be applied to power supply devices having different mounting methods for heat sources.

In the third embodiment, the temperature rise inside the housing is increased by mounting a heat generating unit including a component other than the power source, which generates a large amount of heat, in the dead space above the wind direction plate as in the case of the power source device. This can be suppressed further than in the case of the first embodiment, and the reliability of the device is improved.

Further, since the mounting space formed in the plug-in unit accommodating portion 2 can be further increased as compared with the first embodiment, it is possible to expand the function by adding the plug-in unit and further downsize the device.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic structure of an electronic device housing of the present invention.

FIG. 2 is a side view of the electronic device casing according to the first embodiment of the present invention.

FIG. 3 is a diagram showing a state of a dead space according to the first embodiment of the present invention, (A) showing mounting of a power supply device in the dead space, and (B) showing a heat radiation state. It is a figure.

FIG. 4 is a side view of the electronic device housing according to the second embodiment of the present invention.

FIG. 5 is a diagram showing a state of a dead space according to a second embodiment of the present invention, (A) showing mounting of a power supply device in the dead space, and (B) showing a heat radiation state. It is a figure.

FIG. 6 is a diagram showing mounting of a heat generating unit in a dead space according to a third embodiment of this invention.

FIG. 7 is a side view of a conventional electronic device housing.

[Explanation of symbols]

1 Electronic device housing 2 Plug-in unit storage 2-1 Plug-in unit 3 fan unit 3-1 fan 4 Front cover 5 wind direction plate 6 power supply 6-1 Heat source 7 suction port 8 exhaust port 9 dead space 10 Thermal grease 11 Heating unit 11-1 Heat source

Claims (12)

[Claims] 1. An air-cooling structure for an electronic device housing in which a plurality of electronic circuits are mounted, wherein the electronic device housing has an inlet port in a lower front portion and an exhaust port in an upper rear portion. In the inside of the, a heating element is mounted on the upper surface and an airflow direction plate for guiding an air flow inside the electronic device housing is provided in the vicinity of the exhaust port, and a plurality of plug-in unit structures are provided under the airflow direction plate. An electronic circuit is mounted, and a fan unit including one or a plurality of fans is mounted below the electronic circuit and above the position of the suction port, and external air is sucked from the suction port by the operation of the fan. An air-cooling structure for an electronic equipment casing, wherein the air flow passing between the electronic circuits is guided to the exhaust port by the lower surface of the wind direction plate and discharged to the outside. 2. The wind direction plate is tilted at a predetermined angle from the top of the exhaust port toward the front side of the rear ceiling part of the electronic device housing, and the wind direction plate and the ceiling part of the electronic device housing are provided. The air-cooling structure for an electronic device casing according to claim 1, wherein a heating element is housed inside a space formed between the heating element and the heating element. 3. The air-cooling structure for an electronic device casing according to claim 2, wherein the heating element is fixed to the wind direction plate by a predetermined method with a heat transfer member interposed. 4. The air-cooling structure for an electronic device casing according to claim 3, wherein the heat transfer member is a heat dissipation grease. 5. The air-cooling structure for an electronic device casing according to claim 4, wherein the heating element is a power supply device. 6. A heat source inside the power supply device is fixed inside a bottom surface of a casing of the power supply device, and the bottom surface of the casing is fixed to the wind direction plate with the heat transfer member interposed therebetween. The air-cooling structure for an electronic device casing according to claim 5. 7. A heat source inside the power supply device is fixed inside a top surface of a casing of the power supply device, and a bottom surface of the casing is fixed to the wind direction plate with the heat transfer member interposed therebetween. The air-cooling structure for an electronic device casing according to claim 5. 8. The air-cooling structure for an electronic device casing according to claim 5, wherein the heat source is a rectifying circuit and / or a DC stabilizing circuit. 9. The air-cooling structure for an electronic device casing according to claim 2, wherein the heating element is a heating unit containing a heating source that generates a large amount of heat. 10. A heat source inside the heat generating unit is fixed inside a bottom surface of a housing of the heat generating unit, and the bottom surface of the housing is fixed to the wind direction plate with the heat transfer member interposed therebetween. The air-cooling structure for an electronic device casing according to claim 9. 11. The air-cooling structure for an electronic device casing according to claim 10, wherein the heat source inside the heat generating unit is a memory circuit. 12. The air-cooling structure for an electronic equipment casing according to claim 11, wherein the heat source inside the heat generating unit is a power amplifier circuit.