JP2003162703A - Ic card and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card whose IC module side connection terminal and whose antenna side connection terminal are electrically connected with high reliability. <P>SOLUTION: In this IC card equipped with both a means for executing mutual communication with external equipment in a contact state and a means for executing it in a non-contact state, this IC card main body is provided with an antenna for non-contact communication and an IC module (3) having an IC chip, which is embedded in the IC card main body with its terminal for electric connection disposed on the card surface. Then, an antenna side connection terminal (24) of this IC card main body is electrically connected to an IC module side connection terminal (34) of the IC module by a conductive elastic body (41) presenting elasticity in a three-dimensional structure using a conductive wire. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention transmits and receives electric power and exchanges signals with an external device such as a terminal device in a contact state via electric contacts, or receives and transmits electric power and transmits and receives signals. The present invention relates to an IC card that is performed in a non-contact state by an electromagnetic coupling method and a method of connecting an IC module to a card body when manufacturing the IC card. Therefore, the present invention can be applied to an IC card having both contact and non-contact communication means, but also to a non-contact IC card that can be used by previously incorporating an antenna in the card body and connecting the IC module to the card surface. It is applicable.

[0002]

2. Description of the Related Art Conventionally, ICs have been used for the purpose of storing and processing important and large amounts of data such as cash cards and ID cards.
IC cards using chips are in widespread use. in recent years,
Not only the contact type IC card that is used by connecting the terminal electrode of the IC card and the external device, but also the built-in antenna and the non-contact type that exchanges data with the external device in a contactless manner by radio waves or electrostatic coupling The demand for IC cards is increasing because of the increased use of IC cards, the need for removing and inserting cards, and reduced maintenance of external devices. In addition, a composite IC card having a contact-type function with the former terminal electrode and a non-contact-type function for communicating data by wireless communication for the purpose of supporting a more versatile use with one card is also available. Invented.

FIG. 12 is a diagram showing a structure found in an example of a conventional IC card. As shown in FIG. 12, the IC card (1) is an IC module (3) having an IC chip (not shown) and a terminal electrode for contact communication in a card body (2) equipped with an antenna (23) for contactless communication. By connecting to each other, mutual communication is performed with an external device either in contact or non-contact. If the terminal electrode for contact communication of the IC module is not provided or not used, it can be used only as a non-contact type IC card alone.

In FIG. 13, (a) is an explanatory view of a conventional process of burying an IC module in a card body,
(B) is an explanatory view of a conventional IC card to which an IC module is connected. As shown in FIG. 13, in the IC card, an IC module embedding hole (26) is formed in the card body (2) in which the antenna is built in advance, and I is formed in the embedding hole formed.
It is manufactured by housing the C module (3). The antenna side connection terminal (24) built in the card body (2) is exposed in the IC module embedding hole (26) in the process of forming the IC module embedding hole (26), and the IC module (3) is embedded. When this is done, it will be electrically connected to the IC module side connection terminal (34). Normally, the IC module is connected by connecting the IC module side connection terminal and the antenna side connection terminal with a conductive adhesive (5).
Then, the peripheral portion of the IC module (not shown) and the card body are connected by an insulating adhesive material.

[0005]

By the way, FIG.
When an external stress X is applied to the card as shown in (a), the card base material is deformed, and the conductive adhesive (5) connecting the IC module side connection terminal and the antenna side connection terminal also receives a force. Will join. When the external stress X becomes large, the elasticity of the thermosetting conductive adhesive (5) that is normally used cannot follow the deformation, and a gap such as Y in FIG. There is a problem that the reliability of the electrical connection between the connection terminal (34) and the antenna-side connection terminal (24) is reduced.

The present invention has been made in order to solve the above problems, and its object is to have sufficient electrical connection reliability between the IC module side connection terminal and the antenna side connection terminal. Is to provide an IC card.

[0007]

In order to solve the above-mentioned problems, the present invention relates to a first aspect of the invention, in an IC card for performing mutual communication with an external device in a non-contact manner, the non-contact communication with the main body of the IC card. And an IC module having an IC chip and a part or the whole of the IC chip embedded in the IC card body.
The antenna-side connection terminal of the card body and the IC-module-side connection terminal of the IC module are electrically connected by a conductive elastic body that exhibits elasticity due to a three-dimensional structure using a conductive wire. It is an IC card that does.

According to a second aspect of the present invention, in an IC card having both contact means and non-contact means for mutual communication with an external device, the IC card body is provided with an antenna for non-contact communication. And an IC module having terminals for electric contacts embedded in the IC card body on the card surface and having an IC chip, the antenna-side connection terminal of the IC card body, and the IC module of the IC module. The IC card is characterized in that the side connection terminals are electrically connected by a conductive elastic body exhibiting elasticity by a three-dimensional structure using a conductive wire.

Further, in the invention of claim 3, the exposed portion of the antenna-side connection terminal is dug down as compared with the portion where the outer peripheral portion of the IC module is installed. This is the IC card described in Crab.

According to a fourth aspect of the invention, there is provided the IC card according to any one of the first to third aspects, characterized in that the wire diameter of the conductive wire is within 760 μm.

According to the invention of claim 5, the material of the conductive wire is metal, and the IC card according to any one of claims 1 to 4 is provided.

According to a sixth aspect of the present invention, the IC card according to any one of the first to fourth aspects is characterized in that the conductive wire material is an insulating wire material plated. .

According to a seventh aspect of the invention, there is provided the IC card according to any one of the first to sixth aspects, wherein the conductive wire is formed in a block shape.

According to the invention of claim 8, the conductive wire is rust-proofed, and the IC card according to any one of claims 1 to 7 is provided.

According to a ninth aspect of the present invention, the IC card according to any one of the first to eighth aspects is characterized in that the conductive wire is integrated with an organic resin.

According to a tenth aspect of the invention, the conductive elastic body is integrated with an insulating adhesive sheet, and the IC card according to any one of the first to ninth aspects is provided. Is.

According to the invention of claim 11, an IC in which the IC card body has an antenna for non-contact communication and an IC chip, and a part or the whole of the IC chip is embedded in the IC card body. A method for manufacturing an IC card, which comprises a module and performs mutual communication with an external device in a contactless manner, comprising: an antenna-side connection terminal of the IC card body;
A method for manufacturing an IC card, characterized in that the IC module-side connection terminal of the C module is electrically connected by using a conductive elastic body exhibiting elasticity by a three-dimensional structure using a conductive wire. Is.

According to a twelfth aspect of the present invention, an antenna for contactless communication is provided in the IC card body, and terminals for electrical contacts embedded in the IC card body are arranged on the card surface, and the IC is provided.
A method of manufacturing an IC card, comprising: an IC module having a chip; and a function of performing mutual communication with an external device both by contact and by contactless.
The antenna-side connection terminal of the card body and the IC-module-side connection terminal of the IC module are electrically connected by using a conductive elastic body that exhibits elasticity due to a three-dimensional structure using a conductive wire. The manufacturing method of the IC card is as follows.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below.

FIG. 1 is a diagram showing the structure of an example of the IC card of the present invention. As shown in FIG. 1, the IC card (1) of the present invention has a card body (2) equipped with an antenna (23) for contactless communication, and an IC chip (not shown).
By connecting the C module (3), mutual communication is performed with an external device either in contact or non-contact.

FIG. 2 (a) shows an IC module mounted on the IC card of the present invention, and FIG. 2 (b) is a sectional view in the vicinity of XX '. The IC module (3) is provided with a terminal electrode (32) for contact communication with an external device on one surface by etching a copper foil on a substrate (31) made of glass epoxy, polyimide or the like. A pattern for mounting an IC chip and an IC module side connection terminal (34) are formed on one surface. Both surfaces are plated with nickel or gold after etching, and the IC chip is mounted on one surface by wire bonding or flip chip mounting. The IC chip is electrically connected to the terminal electrode for contact communication by a through hole (not shown), and is electrically connected to the IC module side connection terminal by a pattern. The IC chip is usually resin-sealed with a sealing resin (35) such as an epoxy resin.

The card body of the present invention is manufactured as follows. By etching the metal foil on the plastic sheet (22) as shown in FIG. 3, an antenna sheet (21) having an antenna (23) for non-contact communication and an antenna side connection terminal (24) is formed. . Vinyl chloride, polyethylene terephthalate or the like is used as the material of the plastic sheet, and copper or aluminum is mainly used as the material of the metal foil. Also, instead of an antenna made of metal foil, a winding antenna sheet in which a conducting wire made of copper or the like is wound around a plastic sheet to form an antenna and an antenna side connection terminal, or a printed antenna in which a conductive paste is printed on the plastic sheet Sheets can also be used.

As shown in FIG. 4, the antenna sheet (21) on which the non-contact communication antenna (23) and the antenna-side connection terminal (24) are formed is a card substrate (25, 25 ').
The card body (2) having the antenna (23) built therein is formed by being sandwiched by and heat-laminated. As the card base material, vinyl chloride, polyethylene terephthalate, ABS or the like can be used.
In the figure, the card body is shown as a layered structure including two card base materials and one antenna sheet, but the present invention is not limited to this.

As shown in FIG. 5 (a), the card body (2) having the antenna built therein is provided with a buried hole (2) for the IC module.
6) is formed by counterboring. At this time, the two antenna-side connection terminals (24) for electrical connection with the IC module are exposed at the IC module embedding hole (26) in the card body (2). Further, as shown in FIG. 2B, in order to fix the conductive elastic body to be mounted in the next step on the antenna-side connection terminal (24), when the IC module embedding hole (26) is formed, the IC module Buried hole (26)
The exposed portion X of the antenna side connection terminal (24) is dug by H as compared with the portion Y where the outer peripheral portion of the IC module is installed. The height H is usually about 20 to 100 μm, though it depends on the structure of the card.

Next, as shown in FIG. 6 (a), a conductive wire is placed on the antenna-side connection terminal (24) exposed in the IC module embedding hole (26) of the card body (2). A block-shaped conductive elastic body (41) exhibiting elasticity according to the three-dimensional structure used is installed, and an IC module (3) separately manufactured is connected as shown in FIGS. The card body (2) and the IC module (3) are connected to each other by connecting the IC module side connection terminal (34) of the IC module (3) and the antenna side connection terminal (2) of the card body (2).
4) The conductive elastic bodies (41) installed on top are connected so as to overlap. That is, through the conductive elastic body (41),
The IC module side connection terminal (34) and the antenna side connection terminal (24) are electrically connected. Here, the important point is that the conductive elastic body (41) is retracted and stored in the state of FIG. 6C as compared with the state of FIG. 6B. This point will be described later.

As shown in FIG. 7, by providing an insulating adhesive layer (36) on the outer peripheral portion of the IC module (3) mounting surface of the IC chip (33), the IC module (3) and the card main body are provided. Strongly adheres to (2). IC
After embedding the module (3), heat and pressure are applied from the terminal electrode side (32) of the IC module by a thermocompression bonding machine (not shown) to complete the adhesion between the IC module (3) and the card body (2). As the insulating adhesive layer (36), a thermoplastic or thermosetting liquid or sheet adhesive can be used. Hot melt type adhesives are often used in IC cards. For example, if a polyester hot melt sheet is used, it will be about 150
The IC module (3) and the card body (2) can be bonded to each other by applying a temperature of ° C for several seconds.

As shown in FIG. 8A, external stress X is applied to the completed IC card. In the case of an IC card that is electrically connected using a conventional conductive adhesive (5), a gap Y as shown in FIG. 14B should occur (see FIG. 14). In the invention, since the conductive elastic body (41) as described above is used for electrical connection between the IC module side connection terminal (34) and the antenna side connection terminal (24), the card base material is deformed. Also, since the conductive elastic body (41) is contracted and stored in advance, as shown in FIG. The antenna side connection terminal (24) can be continuously electrically connected.

As the conductive wire used for the block-shaped conductive elastic body (41) exhibiting elasticity by a three-dimensional structure, for example, metal such as iron, copper, copper alloy or the like is formed as shown in FIG. 9 (a). In addition, it is possible to use a wire rod carved with a thickness of about 25 μm. The material of the conductive wire is not limited, and it can be used as long as it has conductivity. Therefore, an insulating wire made of synthetic fiber or the like having a wire diameter of φ = 20 μm as shown in FIG. It is also possible to use the prepared one. The thickness of the wire material is such that the conductive wire material in which the antenna-side connection terminal and the IC module-side connection terminal are formed in a block shape contracts to maintain electrical connection, and the thickness of a normal IC card is 760 μm.
Considering that, a thickness of about 20 μm to 100 μm is suitable.

As the conductive elastic body, as shown in FIG. 10 (a), a conductive wire material is usually woven into a block-shaped three-dimensional structure. Even if the wire is not regularly knitted, it is also possible to use a non-woven fabric by stacking the wire as shown in FIG. The size of the block shape must be such that it can be installed on the antenna side connection terminal (24) and the IC module side connection terminal (34). The shape of the conductive elastic body is not particularly limited, and the state shown in FIG. 10C before the stress X is added after the stress X is removed by applying the stress X as shown in FIG. Any shape can be used as long as it has a three-dimensional structure exhibiting elasticity so that it can return to. For example, the wire rods may be simply intertwined with each other, or several or individual wire rods may be used. The Young's modulus of the conductive elastic body is not particularly limited, but if it is about 10 ⁶ N / m ² ,
As described above, even when external stress is applied to the IC card, the IC module side connection terminal (34) and the antenna side connection terminal (24) can be continuously electrically connected.

When considering the use of long-term cards,
It is preferable that the conductive wire is rustproofed. This is because the portion of the IC card in which the conductive wire is stored is not in a vacuum state, so the conductive wire rusts and the IC module side connection terminal (34) and the antenna side connection terminal (2
This is because the reliability of electrical connection with 4) is reduced. Therefore, as shown in FIG. 10A, for example, only the side surface (area indicated by X) of the conductive elastic body is subjected to rust prevention treatment. Although it is partially insulated by the anticorrosion treatment, FIG.
As shown in (a), if the wire material in the portion contacting the IC module side connection terminal (34) and the wire material in the portion contacting the antenna side connection terminal (24) are not rust-proofed, they are connected to each other. It can be electrically conducted.

Although the method of anticorrosion treatment is not limited,
For example, a rust preventive effect can be obtained by forming a resin layer of urethane, formal, polyester, polyimide or the like on the wire by a baking method, a chemical vapor deposition method, or an electrodeposition method.

Further, as shown in FIG. 10 (e), the block-shaped conductive wire is made of epoxy or silicone,
It is also possible to solidify them with a resin such as polyester and integrate them. Also in this case, as shown in FIG. 10 (e), the wire material of the portion contacting the IC module side connection terminal (34),
If the portion of the wire that contacts the antenna-side connection terminal (24) is not covered with resin, electrical connection can be established between the terminals. When integrated with a rubber-like resin, it becomes an elastic body having conductivity itself, and the IC module side connection terminal and the antenna side connection terminal can be connected with high reliability.

The conductive elastic body is not installed on the antenna side connection terminal (24) as described above, but it is described in I above.
It may be installed on the IC module (3) side together with the insulating adhesive layer (36) formed on the outer peripheral portion of the C module. For example, a conductive elastic body (41) is previously attached to an insulating adhesive sheet (41) as shown in FIG.
A sheet in which is embedded is produced, and the sheet is temporarily attached to the IC module (3) and then adhered to the card body. By embedding it in an insulating adhesive sheet, a rust preventive effect can also be obtained by the insulating adhesive.

[0034]

The present invention will be described in detail below with reference to examples.

In order to manufacture the IC card (1) as shown in FIG. 1, first, the IC module (3) was manufactured.

As shown in FIG. 2, the IC module (3) comprises a substrate (3) made of glass epoxy having a thickness of 100 μm.
1) By etching the upper copper foil having a thickness of 20 μm, a terminal electrode (32) for contact communication with an external device is provided on one surface, and an IC chip is mounted on the other surface. Pattern and IC module side connection terminal (3
4) was formed. Gold plating was performed on both surfaces, and the IC chip (33) was mounted on one surface by flip chip mounting. The IC chip (33) was resin-sealed with epoxy resin as the sealing resin (35).

The card body (2) was manufactured as follows. First, a copper foil having a thickness of 25 μm formed on a plastic sheet (22) made of vinyl chloride having a thickness of 400 μm as shown in FIG. 3 is etched to form an antenna (23) for non-contact communication and an antenna-side connection terminal. An antenna sheet (21) having (24) was produced.
Next, as shown in FIG. 4, an antenna sheet (21) having a thickness of 1
Base material (25, 2, 2) that is a vinyl chloride sheet of 80 μm
It is sandwiched by 5 '), laminated and antenna (23)
A card body (2) with a built-in was obtained. Further, as shown in FIG. 5, an IC module embedding hole (26) is formed in the card body (2) by counterboring, and the two antenna side connection terminals (24) are exposed in the IC module embedding hole (26). It was As shown in FIG. 4B, the conductive elastic body (41) mounted in the next step is connected to the antenna side connection terminal (2).
4) When the IC module embedding hole is formed, the antenna side connection terminal (2) of the IC module embedding hole is fixed in order to fix it on top.
The exposed portion X of 4) is dug down by H = 80 μm compared with the portion Y where the outer peripheral portion of the IC module is installed.

Next, as shown in FIG. 6 (a), a conductive elastic body (on the antenna side connection terminal (24) exposed in the IC module burying hole (26) of the card body (2) is formed. Four
1) was installed, and the separately manufactured IC module was connected as shown in FIGS. Card body and IC
The module includes an IC module side connection terminal (34) and an antenna side connection terminal (2) via a conductive elastic body (41).
4) was connected so as to be electrically connected.

For the conductive elastic body, copper was cut into a wire having a shape as shown in FIG. 9A to have a thickness of 20 μm.
As shown in FIG. 10A, a block having a thickness of 100 μm was used, and as shown in FIG. 10E, the organic resin (44) was solidified and integrated with silicon resin.

In FIG. 6B, the thickness of the copper foil of the IC module side connecting terminal (34) is 20 μm, and as described above, the antenna side connecting terminal (24) of the IC module burying hole (26) of FIG. Since the exposed portion X is dug down by H = 80 μm as compared with the portion Y where the outer peripheral portion of the IC module is installed, the conductive elastic body (41) is shrunk to a thickness of 60 μm in the state of FIG. It will be stored inside.

The IC chip (3) of the IC module (3)
3) As shown in FIG. 7, an insulating adhesive layer (36) is provided on the outer peripheral portion of the mounting surface with a hot melt adhesive, and after embedding the IC module (3), an IC is bonded by a thermocompression bonding machine (not shown). Heat and pressure were applied from the terminal electrode (32) side of the module to bond the IC module (3) and the card body (2).

When 1000 cards as described above were prepared and a communication test was conducted, all communication was possible in the contact and non-contact states. IC module side connection terminal (34)
In order to confirm the reliability of electrical connection between the antenna-side connection terminal (24) and the antenna-side connection terminal (24), a bending test was performed on the IC card. The bending test was performed 1000 times according to the test method specified in JIS X6305 (1995) 6.1. Even if the IC card of the present invention was subjected to the bending test, none of the IC cards could not communicate. Further, a bending test was conducted while performing a non-contact communication inspection by an external device, but none of the communication was interrupted in the middle.

Next, a salt spray test was conducted to confirm the anticorrosive effect of the silicone resin. JIS salt spray test
According to the test method specified in X6305 (1995) 5.8, the test was carried out for 100 hours, but there was no communication failure. Further, when the IC module was removed from the card body after the test and the conductive wire formed in a block shape was observed, it was not possible to confirm rust on the wire integrated with the silicone resin.

Therefore, it can be proved that the IC card of this embodiment is an IC card in which the IC module side connection terminal and the antenna side connection terminal have sufficient electrical connection reliability.

[0045]

The effects of the present invention will be described below for each claim.

According to a first aspect of the invention, the antenna side connection terminal and the IC module side connection terminal are made of conductive wire.
Since they are electrically connected by a conductive elastic body that exhibits elasticity due to the three-dimensional structure, the IC module side connection terminal and the antenna side connection terminal can be kept electrically connected when an external stress is applied to the IC card. Therefore, there is an effect that the IC module is connected with high electrical connection reliability and mutual communication with an external device can be performed without contact.

According to a second aspect of the present invention, the antenna side connection terminal and the IC module side connection terminal use conductive wire.
Since they are electrically connected by a conductive elastic body that exhibits elasticity due to the three-dimensional structure, the IC module side connection terminal and the antenna side connection terminal can be kept electrically connected when an external stress is applied to the IC card. Therefore, there is an effect that the IC module is connected with high electrical connection reliability, and mutual communication with an external device can be performed by contact or non-contact.

According to the third aspect of the invention, the exposed portion of the antenna-side connection terminal is deeper than the portion where the outer peripheral portion of the IC module is installed. Therefore, the three-dimensional structure using the conductive wire makes it elastic. A conductive elastic material that exhibits
Since the IC module can be fixed on the antenna side connection terminal, the IC module can have higher electrical connection reliability.

Since the wire diameter of the conductive wire is within 760 μm, the conductive elastic body having elasticity due to the three-dimensional structure using the conductive wire has a thickness of 760.
It can be stored in an IC card with a standard thickness of μm.

According to the fifth aspect of the present invention, since the material of the conductive wire is a metal having a high conductivity, the reliability of the electrical connection between the IC module side connection terminal and the antenna side connection terminal is high, and the IC This has the effect that the module can have higher electrical connection reliability.

According to the sixth aspect of the present invention, since the conductive wire is an insulating wire plated with a metal having a high conductivity,
The reliability of the electrical connection between the IC module side connection terminal and the antenna side connection terminal is high, and the IC module has the effect of having a higher level of electrical connection reliability.

According to the invention of claim 7, since the conductive wire is formed in a block shape, even if it is a thin conductive wire, I
A conductive elastic body having sufficient elasticity for connecting the C module side connection terminal and the antenna side connection terminal can be used, and even if a part of the wire is broken, the other part is connected to electrically connect. The effect is that it can be maintained.

The invention of claim 8 has an effect that the conductive wire is not rusted and loses conductivity because the conductive wire is rust-proofed.

Since the conductive wire is integrated with the organic resin, the conductive wire and the organic resin are integrated into a conductive elastic body exhibiting elasticity. Further, there is an effect that the organic resin can have corrosion resistance.

According to the tenth aspect of the present invention, since the conductive elastic body is integrated with the insulating adhesive sheet, it is possible to install the conductive elastic body excellent in processability on the antenna side connection terminal. After being temporarily attached to the IC module in advance, it can be adhered to the card body, and the insulating adhesive also has the effect of obtaining rust prevention.

According to the invention of claim 11, mutual communication with an external device can be carried out in a non-contact manner, and when an external stress is applied, the IC is applied.
There is an effect that the module side connection terminal and the antenna side connection terminal can be continuously electrically connected, and an IC card to which the IC module is connected with high electrical connection reliability can be manufactured.

According to a twelfth aspect of the present invention, mutual communication with an external device can be performed in contact or non-contact, and when external stress is applied, the IC module side connection terminal and the antenna side connection terminal are continuously electrically connected. Therefore, it is possible to manufacture an IC card in which the IC module is connected with high electrical connection reliability.

As described above, the present invention has the effect of providing an IC card in which the IC module side connection terminal and the antenna side connection terminal have sufficient electrical connection reliability.

[Brief description of drawings]

FIG. 1 is a diagram showing a structure of an example of an IC card of the present invention.

FIG. 2A is a plan view of an IC module mounted on the IC card of the present invention. (B) It is sectional drawing of the IC module mounted in the IC card of this invention.

FIG. 3 is a plan view of an antenna sheet housed in a card body of an IC card.

FIG. 4 is an explanatory diagram of a process of incorporating an antenna sheet in a card body of an IC card.

FIG. 5A is an example of forming an IC module embedding hole of an IC card. (B) It is an enlarged view of the vicinity of the antenna side connection terminal (A) of the IC module embedding hole.

FIG. 6 (a) is an explanatory diagram of a step of installing a conductive wire on the antenna side terminal electrode. (B) It is explanatory drawing of the process of connecting a card main body and an IC module. (C) It is a figure explaining the IC card to which the IC module was connected.

FIG. 7 is an explanatory diagram of an area where an insulating adhesive layer of the IC module is formed.

FIG. 8A is a sectional view of the IC card in a state where an external stress X is applied. (B) An enlarged view of the vicinity of a block-shaped conductive elastic body (A) in a state where an external stress X is applied.

FIG. 9A is an example of a conductive wire. (B) An example of a conductive wire.

FIG. 10A is a diagram illustrating an example in which a conductive wire is processed into a block-shaped conductive elastic body. (B) It is a figure explaining an example which processed the electroconductive wire into the block-shaped electroconductive elastic body. (C) It is a figure explaining the electroconductive elastic body before applying an external stress. (D) It is a figure explaining the electroconductive elastic body when an external stress is added. (E) It is a figure explaining the electroconductive elastic body by the electroconductive wire rod integrated with the organic resin.

FIG. 11 is a diagram illustrating a conductive elastic body integrated with an insulating adhesive.

FIG. 12 is a diagram showing a structural example of a conventional IC card.

FIG. 13A is an explanatory diagram of a process of connecting an IC module of a conventional IC card. (B) It is explanatory drawing of the conventional IC card to which the IC module was connected.

FIG. 14 (a) Conventional I with external stress X applied
It is a sectional view of a C card. (B) It is an enlarged view near the antenna side connection terminal of the conventional IC card in the state where the external stress X was applied.

[Explanation of symbols]

1 ... IC card 2… Card body 3 ... IC module 4 ... Conductive wire 5: Conductive adhesive 21 ... Antenna sheet 22 ... Plastic sheet 23 ... Antenna 24 ... Antenna side connection terminal 25 ... Card base material 25 '... Card base material 26 ... Buried hole for IC module 31 ... IC module substrate 32 ... Terminal electrodes of IC module 33 ... IC chip 34 ... IC module side connection terminal 35 ... Sealing resin 36 ... Insulating adhesive layer 41 ... Conductive elastic body 42 ... Insulating wire 43 ... Metal plating layer 44 ... Organic resin 45 ... Insulating adhesive sheet

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2C005 MA07 MA31 MB10 NA02 NA06                       NA09 NA41 NB03 NB15 NB16                       NB22 NB37 PA02 PA03 PA04                       PA19 PA33 RA04 RA17 RA22                 5B035 BA03 BB09 CA01 CA08 CA23

Claims (12)

[Claims] 1. An IC for performing non-contact mutual communication with an external device.
In the card, an antenna for contactless communication is provided on the IC card body, and
An IC module having an IC chip and a part or the whole of the IC chip embedded in the IC card body, and an antenna side connection terminal of the IC card body and an IC module side connection of the IC module An IC card, wherein terminals are electrically connected by a conductive elastic body that exhibits elasticity by a three-dimensional structure using a conductive wire. 2. An IC card having both contact means and non-contact means for performing mutual communication with an external device, wherein the IC card body has a non-contact communication antenna and the IC.
An IC module having an IC chip, which is embedded in the card body and has terminals for electrical contacts arranged on the surface of the card, and an antenna side connection terminal of the IC card body and an IC module side connection terminal of the IC module However, the IC card is electrically connected by a conductive elastic body exhibiting elasticity by a three-dimensional structure using a conductive wire. 3. The exposed portion of the antenna-side connection terminal is I
3. The IC card according to claim 1, wherein the outer peripheral portion of the C module is dug down as compared with the installed portion. 4. The IC card according to claim 1, wherein the conductive wire has a wire diameter of 760 μm or less. 5. The IC card according to claim 1, wherein the material of the conductive wire is metal. 6. The IC card according to claim 1, wherein the conductive wire is an insulating wire plated. 7. The IC card according to claim 1, wherein the conductive wire is formed in a block shape. 8. The IC according to claim 1, wherein the conductive wire is rustproofed.
card. 9. The IC card according to claim 1, wherein the conductive wire is integrated with an organic resin. 10. The conductive elastic body is integrated with an insulating adhesive sheet.
The IC card according to any one of 1. 11. An IC module having a non-contact communication antenna and an IC chip in the IC card body, wherein a part or the whole of the IC chip is embedded in the IC card body. A method for manufacturing an IC card in which mutual communication with an external device is performed in a non-contact manner, wherein an antenna-side connection terminal of the IC card body and an IC-module-side connection terminal of the IC module are made of a conductive wire material. A method of manufacturing an IC card, which comprises electrically connecting using a conductive elastic body exhibiting elasticity by a three-dimensional structure. 12. The IC card main body is provided with an antenna for non-contact communication, and an IC module having terminals for electrical contacts embedded in the IC card main body on the card surface and having an IC chip. A method of manufacturing an IC card having both a contactless function and a contactless function for performing mutual communication with an external device, comprising: an antenna-side connection terminal of the IC card body; and an IC module side of the IC module. A method of manufacturing an IC card, comprising electrically connecting a connection terminal with a conductive elastic body that exhibits elasticity by a three-dimensional structure using a conductive wire.