JP2003142790A - Electronic system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent latching up which occurs when an electronic component mounting board is inserted into a connector, and to raise reliability of products. SOLUTION: On both surfaces of an SBC board 1 used for a personal computer, a plurality of electrodes 1a are formed near one major side. The electrodes 1a are provided with a power source voltage electrode 1a1 to which a power source voltage VCC is connected, and a reference potential electrode 1a2 to which a reference potential VSS is connected, respectively. A signal electrode 1a3 into/from which various signals are inputted/outputted is provided between the electrodes 1a1 and 1a2 . The electrodes 1a1 and 1a2 are longer than another signal electrode 1a3 so as to protrude about 1/3. So, when the electrode 1a of the SBC board 1 is inserted in an edge connector 3, the electrodes 1a1 and 1a2 contact first to a corresponding terminal 3a of the edge connector 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic system, and more particularly to a technique effective when applied to a connection of a board on which an electronic component is mounted with a connector.

[0002]

2. Description of the Related Art As one form of a mother board on which basic components of a personal computer such as a microprocessor and a memory are mounted, a so-called SBC (Single) is used.
e Board Computer) boards are known.

The SBC board is provided with a plurality of electrodes along a certain side, and the electrodes of the SBC board are inserted into a connector provided on a base board or the like to make an electrical connection. ing.

According to a study by the present inventor, SB
The electrodes formed on the C board have a rectangular shape, etc., and the electrodes located at both ends serve as a power supply voltage (VCC) terminal and a reference potential (VSS) terminal. In the meantime, it serves as a signal terminal for inputting and outputting various signals.

As an example in which the mounting technique of this kind of electronic component is described in detail, August 3, 1994,
Published by Industrial Research Institute Co., Ltd., Hybrid Microelectronics Association (ed.), "Electronics Packaging Technology Basic Lecture <Vol. 4> Packaging and Assembly Technology" P11-P1
No. 3, there is described in this document, a semiconductor device and a mounting form of an electronic component.

[0006]

However, the present inventor has found that the connection technique using the connector as described above has the following problems.

That is, the electrodes formed on the SBC board and the like have the same shape. When the SBC board is inserted into a connector such as a base board, the signal terminals are If the contact is made before the reference potential terminal, there is a problem that the potential for latch-up becomes extremely high.

An object of the present invention is to provide an electronic system capable of preventing the latch-up that occurs when the electronic component mounting board is inserted into the connector and greatly improving the reliability of the product.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, in the electronic system of the present invention, electronic components are mounted, and a plurality of connection electrodes are provided along at least one surface of the board mounting end portion along the board mounting end portion. The electronic component mounting board and the connector having electrodes corresponding to the plurality of connecting electrodes of the electronic component mounting board are mounted, and the connecting electrode is inserted into the connector to mount the electronic component mounting board. Of the plurality of connection electrodes, the power supply connection electrode and the reference potential connection electrode are formed so as to protrude more than the other connection electrodes, and the plurality of connection electrodes are inserted into the connector. When fitted, the power supply connection electrode and the reference potential connection electrode are connected to the electrodes of the connector prior to the other connection electrodes.

In the electronic system of the present invention, electronic components are mounted, and a plurality of connection electrodes are provided along at least one surface of the board mounting end along the board mounting end. The electronic component mounting board and the connector having electrodes corresponding to the plurality of connecting electrodes of the electronic component mounting board are mounted, and the connecting electrode is inserted into the connector to mount the electronic component mounting board. Of the plurality of connection electrodes, the power supply connection electrode to which the power supply voltage is connected and the reference potential connection electrode to which the reference potential is connected are 1/100% more than the other connection electrodes.
When a plurality of connecting electrodes are formed so as to project three or more and are inserted into the connector, the power supply connecting electrode and the reference potential connecting electrode are connected to the connector electrode before the other connecting electrodes. It is connected.

Further, in the electronic system of the present invention, an electronic component is mounted, and a plurality of connecting electrodes are provided on one surface and the other surface of the board mounting end along the board mounting end. A board and an edge connector having electrodes corresponding to a plurality of connecting electrodes of the electronic component mounting board are mounted, and a base on which the electronic component mounting board is mounted by inserting the connecting electrodes into the edge connector. And a reference potential connection electrode to which a reference potential is connected, among the plurality of connection electrodes.
When a plurality of connecting electrodes that are formed so as to project above are inserted into the edge connector, the power supply connecting electrode and the reference potential connecting electrode are connected to the electrode of the edge connector before the other connecting electrodes. Is connected to.

As described above, the latch-up that occurs when the electronic component mounting board is mounted on the base board can be significantly reduced, and the reliability of the electronic system can be improved.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is an explanatory diagram of a PBP board mounted on a personal computer according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of an SBC board mounted on the PBP board of FIG. 1, and FIG. 2 is an enlarged explanatory view of each electrode formed on the SBC board of FIG. 2, and FIG. 4 is an enlarged explanatory view of an edge connector to which the SBC board of FIG. 2 is mounted.

In the present embodiment, the SBC board (electronic component mounting board) 1 is a mother board used in, for example, a personal computer (electronic system) and similar in shape to a general expansion board. As shown in FIG. 1, the SBC board 1 is a PB that serves as a base board.
It is mounted on a P (Passive Back Plane) board (base substrate) 2.

The PBP board 2 is provided with a plurality of edge connectors (connectors) 3, which are one of the expansion slots, and these edge connectors 3 are connected to the SBC board 1 and PCI (Peripheral Compo).
Nent Interconnect bus, or ISA (Iudustry Standard Arc)
expansion board such as a bus is inserted.

As shown in FIG. 2, the SBC board 1 has a rectangular shape, and a CPU (electronic component) 4 is provided on the right side. The CPU 4 controls all controls in the SBC board 1.

On the left side of the CPU 4, memories (electronic parts) 5 to 8 are provided. Memories 5-8 are RAM
(Random Access Memory), RO
It consists of M (Read Only Memory), and various memories such as a cache memory.

Below the memories 5 to 8, controllers (electronic parts) 9 and 10 and an electronic part 11 are provided. The controllers 9 and 10 perform various controls such as image processing, arithmetic processing, and memory management. The electronic component 11 includes various active electronic components such as a capacitor and a resistor.

In the vicinity of the long side portion (board mounting end portion) below the SBC board 1, a plurality of electrodes (connecting electrodes) 1 corresponding to the individual connectors of the edge connector 3 are provided along the long side direction.
a is formed. Each electrode 1a is connected to a predetermined electronic component via a wiring pattern formed on the SBC board 1.

The electrodes 1a are the SBC board 1
Is a so-called dual in-line formed along the lower long side direction on the component mounting surface and the opposite surface.

Then, the PBC board 2 and the SBC board 1
When mounting, the electrode 1a of the SBC board 1 is inserted into the edge connector 3. Therefore, the SBC board 1
It is mounted perpendicularly to the mounting surface of the edge connector 3 of the PBP board 2.

Here, the shapes of the electrodes 1a formed on the SBC board 1 and the terminals (electrodes) 3a of the edge connector 3 will be described.

The electrode 1a formed on the SBC board 1 is
A power supply voltage electrode (power supply connection electrode) 1a ₁ to which the power supply voltage VCC is connected, and a reference potential electrode (reference potential connection electrode) 1a _{2 to} which the reference potential VSS is connected are respectively provided. The remaining electrodes are signal electrodes (signal connection electrodes) 1a ₃ for inputting and outputting various signals.

The power supply voltage electrode 1a ₁ is the SBC board 1
The reference potential electrode 1a ₂ is provided on the left end of the SBC board 1, and the reference potential electrode 1a ₂ is also provided on the right end of the SBC board 1. Then, these power supply voltage electrodes 1a ₁
Between the reference potential electrode 1a ₂ and the reference potential electrode 1a _2.
a ₃ are formed at equal intervals.

As shown in FIG. 3, the power supply voltage electrode 1a ₁ and the reference potential electrode 1a ₂ are longer than the remaining signal electrodes 1a _{3 in the} long side direction. Power supply voltage electrode 1a ₁ and reference potential electrode 1
The length of a ₂ is, for example, about 4/3 that of the signal electrode 1a ₃ .
The length is about 1/3, and the length of about 1/3 projects from the signal electrode 1a ₃ and approaches the lower long side of the SBC board 1.

Further, as for the terminal 3a of the edge connector 3, as shown in FIG. 4, when the SBC board 1 is inserted, the electrode 1a of the SBC board is sandwiched,
They are electrically connected, and all have the same size and shape as the signal electrode 1a ₃ .

When the electrode 1a of the SBC board 1 is inserted into the edge connector 3, the power source voltage electrode 1a ₁ and the reference potential electrode 1a must be placed before the signal electrode 1a _3.
2 contacts the corresponding terminal 3a of the edge connector 3.

Therefore, the SBC board 1 has a power supply voltage V
Since various signals and the like are input / output after CC is supplied, the occurrence of latch-up can be prevented.

As a result, according to the present embodiment, it is possible to prevent the latch-up that occurs when the SBC board 1 is inserted and removed from the edge connector 3, and the S
It is possible to prevent a failure or malfunction of the BC board 1 and improve the reliability of the personal computer.

Further, although the technique for preventing the latch-up of the SBC board 1 is described in the present embodiment, for example, an additional memory module, a LAN (Loc), etc.
alArea Network adapter, USB (U
The reliability of the personal computer can be further improved by using the electrode of the present invention for all the expansion boards that use the edge connector 3 such as the universal serial bus interface.

Although the invention made by the present inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. It goes without saying that it can be changed.

For example, in the above-described embodiment, the case where the present invention is applied to a personal computer has been described. However, in addition to the personal computer, a printed wiring board on which electronic components such as a semiconductor integrated circuit device are mounted and a print thereof. The present invention can be applied to an electronic system having a configuration in which a wiring board is mounted and connected, or a wafer prober for testing the electrical characteristics of an electronic circuit formed on a semiconductor substrate.

In the case of the wafer prober, as shown in FIG. 5, in order to connect the electrodes 12a formed on the semiconductor substrate 12 to the test circuit, the conductive probe pins 13 are connected to the probes according to the arrangement of the electrodes 12a. It is arranged on the card.

Also in this probe pin 13, the probe pin 13a to which the power supply voltage VCC is connected and the reference potential V
A probe pin 13b connected to the SS and a plurality of probe pins 13c for inputting / outputting various test signals.
have.

The probe pins 13a and 13b are longer than the other probe pins 13c, and when the probe pins 13a to 13c of the probe card come into contact with the electrodes 12a of the semiconductor substrate 12, the probe pins 13c. The probe pins 13a and 13b come into contact with each other earlier than before.

The length of the probe pins 13a and 13b is about 3/4 of that of the probe pin 13c, as in the above embodiment.
It is about the length.

This also makes it possible to prevent the latch-up of electronic circuits, semiconductor elements, etc. formed on the semiconductor substrate 12 during the probe test, and improve the manufacturing yield of semiconductor devices.

[0041]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.
It is as follows.

(1) Since latch-up that occurs when the electronic component mounting board is mounted on the base substrate can be prevented, malfunctions and failures of electronic components such as semiconductor devices mounted on the electronic component mounting board can be prevented. Can be significantly reduced.

(2) By the above (1), the reliability of the electronic system using the electronic component mounting board can be improved.

[Brief description of drawings]

FIG. 1 is a mounting explanatory diagram of a PBP board provided in a personal computer according to an embodiment of the present invention.

2 is an explanatory diagram of an SBC board mounted on the PBP board of FIG. 1. FIG.

FIG. 3 is an enlarged explanatory diagram of each electrode formed on the SBC board of FIG.

FIG. 4 is an enlarged explanatory view of an edge connector to which the SBC board of FIG. 2 is attached.

FIG. 5 is an explanatory diagram of probe pins provided on a wafer prober according to another embodiment of the present invention.

[Explanation of symbols]

1 SBC board (electronic component mounting board) 1a electrode (connection electrode) 1a ₁ power supply voltage electrode (power supply connection electrode) 1a ₂ reference potential electrode (reference potential connection electrode) 1a ₃ signal electrode (signal connection) Electrode 2 PBP board (base substrate) 3 Edge connector (connector) 3a Terminal (electrode) 4 CPU (electronic component) 5-8 Memory (electronic component) 9,10 Controller (electronic component) 11 Electronic component 12 Semiconductor substrate 12a Electrode 13 probe pins 13a to 13c probe pins

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masahiko Adachi             3-3 Fujibashi, Ome City, Tokyo 2 Hitachi Higashi             Inside Kyo Electronics Co., Ltd. (72) Inventor Hidetaka Ono             3-3 Fujibashi, Ome City, Tokyo 2 Hitachi Higashi             Inside Kyo Electronics Co., Ltd. F-term (reference) 5E023 BB19 BB25 CC12 CC22 EE21                       HH08 HH30                 5E317 AA07 GG20                 5E344 AA08 BB02 BB06 BB13 CC23                       CD18 DD08 EE30

Claims (3)

[Claims] 1. An electronic component mounting board having an electronic component mounted thereon, wherein a plurality of connecting electrodes are provided along one side or the other side of the substrate mounting end along the substrate mounting end. A base board on which the electronic component mounting board is mounted by mounting a connector having electrodes corresponding to the plurality of connecting electrodes of the electronic component mounting board, and inserting the plurality of connecting electrodes into the connector Of the plurality of connection electrodes, a power supply connection electrode to which a power supply voltage is connected, and a reference potential connection electrode to which a reference potential is connected are formed so as to respectively project from other connection electrodes. When the plurality of connection electrodes are inserted into the connector, the power supply connection electrode, and the reference potential connection electrode, of the connector prior to the other connection electrodes. Electronic system, characterized in that it is connected to the pole. 2. An electronic component mounting board having an electronic component mounted thereon, wherein a plurality of connection electrodes are provided along at least one surface of the board mounting end portion along the board mounting end portion. A base board on which the electronic component mounting board is mounted by mounting a connector having electrodes corresponding to the plurality of connecting electrodes of the electronic component mounting board, and inserting the plurality of connecting electrodes into the connector Among the plurality of connection electrodes, the power supply connection electrode to which the power supply voltage is connected and the reference potential connection electrode to which the reference potential is connected are 1/3 or more than the other connection electrodes. When the plurality of connecting electrodes that are respectively formed to project are inserted into the connector, the power supply connecting electrode and the reference potential connecting electrode are arranged in front of the other connecting electrodes. Electronic system characterized in that it is connected to the electrode of the connector. 3. An electronic component mounting board on which electronic components are mounted, and a plurality of connecting electrodes are provided on one surface and the other surface of the board mounting end portion along the board mounting end portion, and the electronic component. An edge connector having electrodes corresponding to a plurality of connection electrodes of a mounting board is mounted, and by inserting the plurality of connection electrodes into the edge connector, a base board on which the electronic component mounting board is mounted is provided. Of the plurality of connection electrodes, a power supply connection electrode to which a power supply voltage is connected and a reference potential connection electrode to which a reference potential is connected are projected by 1/3 or more than other connection electrodes. When each of the plurality of connection electrodes formed is inserted into the edge connector, the power supply connection electrode, and the reference potential connection electrode, the connection electrode prior to the other connection electrodes. Electronic system characterized in that it is connected to the electrode of Jjikonekuta.