JP2003142015A - Planar display device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a planar display device suitably suppressing drop in electron emission amount or electron emission efficiency of an electron emission element and obtaining bright display. SOLUTION: A high melting point particle layer 38 present in a part where an X direction bus conductor 24 and a Y direction bus conductor 26 are mutually crossed is an aggregate of porous high melting point particles, has extremely large surface area, and functions as a getter adsorbing gas inside a space between a front side substrate 12 and a rear side substrate 14 after sealing. For example, if particles having a high adsorbing function such as zirconia particles are selected, the function is made noticeable. The contamination of the electron emission element is reduced, drop in electron emission amount or electron emission efficiency is suppressed, and bright display is sufficiently obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a front substrate and a rear substrate which are arranged in parallel with each other with a small space therebetween.
A large number of electron-emitting devices that are selectively operated by a combination of a plurality of X-direction bus conductors and Y-direction bus conductors that intersect each other on the rear substrate are arranged, and the front substrate is formed by the electrons emitted from the electron-emitting devices. The present invention relates to a flat-panel display device of a type which selectively emits a large number of phosphors provided in the display device and a manufacturing method thereof.

[0002]

2. Description of the Related Art In the field of electronic components, a plurality of Xs are provided on a rear substrate, the front substrate and the rear substrate being arranged in parallel with each other with a small space therebetween.
Arranging a number of electron-emitting devices that are selectively activated by a combination of directional bus conductors and Y-direction bus conductors,
There is a flat-panel display device of a type in which a large number of phosphors provided on the back surface of the front substrate are selectively made to emit light by electrons emitted from the electron-emitting device. For example, SED (Surface
-Conduction Electron-Emitter Display) It is a display device.

In the flat-panel display device as described above, the intersections of a plurality of X-direction bus conductors and Y-direction bus conductors that intersect each other function as aggregates such as high-melting glass frit and ceramic powder. A thick-film dielectric layer (thick-film insulating layer) is formed by applying a thick-film dielectric paste formed by mixing inorganic powder and a low-melting-point glass frit that functions as a binder with a liquid resin and a solvent by screen printing or the like. 2) is formed, a second thick film conductor is formed on the thick film dielectric layer and is fired simultaneously with or separately from the thick film dielectric layer to form a crossover.

[0004]

By the way, the wiring resistance of the X-direction bus conductor and the Y-direction bus conductor is made as low as possible in order to reduce the variation in the amount (current) of the electrons emitted from the electron-emitting device. Therefore, it is desired to use a thick film conductor made of a material having low electric resistance such as silver and having a large film pressure, and it is necessary to print a plurality of times at the intersection of the X-direction bus conductor and the Y-direction bus conductor. Insulation needs to be performed using an insulating layer (dielectric layer) having a sufficient thickness. For this reason, it is unavoidable that printing and firing on the rear substrate are repeated, and the surface of the electron-emitting device that is previously fixed to the rear substrate is contaminated, so that the electron emission amount or the electron emission amount can be increased initially or over time. There is a disadvantage that the emission efficiency is lowered and, for example, sufficient display brightness cannot be obtained.

The present invention has been made in view of the above circumstances, and an object of the present invention is to suitably suppress a decrease in electron emission amount or electron emission efficiency of an electron-emitting device and obtain a bright display. The present invention is to provide a flat panel display device.

[0006]

In order to achieve such an object, the gist of the first invention is to provide a front substrate and a rear substrate which are arranged in parallel with each other with a predetermined space therebetween, A plurality of Xs intersecting each other on the rear substrate
Arranging a number of electron-emitting devices that are selectively activated by a combination of directional bus conductors and Y-direction bus conductors,
A flat-panel display device of a type in which a large number of phosphors provided on a front substrate are selectively caused to emit light by electrons emitted from the electron-emitting device, wherein the X-direction bus conductor and the Y-direction bus conductor intersect each other. The high-melting-point particle layer formed by fixing particles having a melting point higher than the firing temperature of the X-direction bus conductor and the Y-direction bus conductor is interposed in the portion to be made.

[0007]

According to this structure, the particles having a melting point higher than the firing temperature of the X-direction bus conductor and the Y-direction bus conductor are present at the portion where the X-direction bus conductor and the Y-direction bus conductor intersect each other. A non-sintered high-melting point particle layer composed of is interposed. This high-melting-point particle layer is an aggregate of high-melting-point particles and has a high porosity and acts as if a space exists. Therefore, even if the X-direction bus conductor and the Y-direction bus conductor are thick film conductors containing silver as a main component, there is no deterioration in insulation due to diffusion of silver,
Since high electrical reliability is obtained, a decrease in the electron emission amount or electron emission efficiency is suppressed and sufficient display brightness can be obtained.

Further, the high melting point particle layer is an aggregate of high melting point particles having a high porosity and has an extremely large surface area. Therefore, after the sealing, the space between the front substrate and the rear substrate is increased. It functions as a getter that adsorbs the gas in the space.
For example, when particles having a particularly excellent adsorption function such as zirconia are selected, the action becomes remarkable. Therefore, the pollution of the electron-emitting device is reduced, the decrease in the electron emission amount or the electron emission efficiency is suppressed, and the display brightness is sufficiently obtained.

[0009]

According to another aspect of the first aspect of the present invention, preferably, at a portion where the X-direction bus conductor and the Y-direction bus conductor intersect each other, one of the X-direction bus conductor and the Y-direction bus conductor is formed. The thick film conductor is covered with an insulating protective film. By doing so, the insulation and reliability between the X-direction bus conductor and the Y-direction bus conductor can be further improved.

[0010]

In order to achieve the above object, the gist of the second invention is to provide a front substrate and a rear substrate which are arranged in parallel with each other with a predetermined space therebetween. , A plurality of electron-emitting devices which are selectively operated by a combination of a plurality of X-direction bus conductors and Y-direction bus conductors intersecting each other on the rear side substrate, and the front side by electrons emitted from the electron-emitting devices. A method of manufacturing a flat-panel display device in which a large number of phosphors provided on a substrate are selectively emitted, comprising: (a) an element electrode base for forming the electron-emitting device on one surface of the rear substrate. And (b) the X-direction bus intersecting with each other on a peeling layer formed by bonding particles having a melting point higher than the first temperature formed on a predetermined substrate with a resin. Guide And a thick film sheet forming step of forming a thick film sheet by applying a Y-direction bus conductor and firing at the first temperature, and (c) the thick film sheet formed by the thick film sheet forming step described above. After peeling from the peeling layer, it is placed on one surface of the rear substrate to which the element electrode base is fixed in the element electrode base fixing step, and is connected to each of the element electrode bases via a conductive paste that can be fixed at low temperature. A connecting step, and (d) a seal for sealing the front substrate and the rear substrate to each other with the spacers arranged on the thick film sheet connected to the element electrode base on the rear substrate by the connecting process. And a dressing step.

[0011]

According to the second aspect of the invention, a thick film sheet forming step of forming a thick film sheet by applying the X-direction bus conductor and the Y-direction bus conductor intersecting each other and firing at a first temperature Since a thick film sheet is created by printing and firing independently of the element electrode base fixing step of fixing the element electrode base for forming the electron-emitting device, after the element electrode base is fixed, Since it is possible to reduce the number of times of printing and firing of the side substrate,
Contamination of electron-emitting devices formed on the rear substrate is reduced as much as possible. For this reason, a decrease in the electron emission amount or the electron emission efficiency of the electron-emitting device in the initial stage or with the passage of time is suppressed, and sufficient display brightness can be obtained.

[0012]

According to another aspect of the second aspect of the present invention, preferably, in the thick film sheet forming step, the X-direction bus conductor and the Y-direction bus conductor are formed at intersections of the X-direction bus conductor and the Y-direction bus conductor. A high melting point particle layer forming step for interposing a high melting point particle layer constituted by fixing particles having a melting point higher than the first temperature between
It is also included. By doing so, the high-melting-point particle layer is an aggregate of high-melting-point particles having a high porosity and has an extremely large surface area. Therefore, after sealing, the space between the front substrate and the rear substrate is high. Functions as a getter that adsorbs the gas in the space. For example, when inorganic particles having an excellent adsorption function such as zirconia and alumina are selected, the action becomes remarkable. Therefore, the pollution of the electron-emitting device is reduced, the decrease in the electron emission amount or the electron emission efficiency is suppressed, and the display brightness is sufficiently obtained.

Preferably, in the thick film sheet forming step, insulation for covering one of the X-direction bus conductor and the Y-direction bus conductor at an intersection of the X-direction bus conductor and the Y-direction bus conductor. It further includes an insulating protective layer forming step of forming a protective layer. With this configuration, the thickness of one of the X-direction bus conductor and the Y-direction bus conductor, which is fixed to the rear substrate, at the portion where the X-direction bus conductor and the Y-direction bus conductor intersect each other. Since the film conductor is covered with the insulating protective film, the insulation and reliability between the X-direction bus conductor and the Y-direction bus conductor are further enhanced.

Preferably, in the connecting step, the thick film sheet formed in the thick film sheet forming step is peeled from the peeling layer and inverted, and then the element electrode base fixing step is performed. Is placed on the rear side substrate to which is adhered and is connected to the element electrode base via a conductive paste which can be adhered at a low temperature. In this way, since the thick film sheet placed on one surface of the rear substrate is inverted, the upper surface of the thick film sheet has a flat shape with little unevenness, so that the front substrate and the rear substrate are It becomes easy to position the spacer for interposing between the above and the above one of the X-direction bus conductor and the Y-direction bus conductor constituting the thick film sheet, and the assembly becomes easy. Generally, this spacer is arranged at a position where it does not hinder display or light emission, that is, above the X-direction bus conductor or the Y-direction bus conductor, and below the black stripe of the front substrate.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below in detail with reference to the drawings.

1 and 2 show a flat panel display device S.
FIG. 1 is a diagram illustrating a configuration of an EC display device 10, FIG. 1 is a cross-sectional view of a main part, and FIG. 2 is a plan view of a main part of a rear substrate 14.
The SED display device 10 includes a front substrate 12 and a rear substrate 14 that are fixed or sealed in parallel to each other at a predetermined interval, for example, an interval of about 1 mm, and a predetermined space in a vacuum space 16 between them. A height of about 1 mm and a position of 0.
Spacer 18 having a thickness of about 05 to 0.1 mm
A phosphor layer 20 fixed to a large number of points on the back surface of the front substrate 12, that is, the surface facing the rear substrate 14, and provided with a metal back (back surface metal thin film) not shown, and the front surface of the rear substrate 14. On the surface facing the front substrate 12,
A large number of electron-emitting devices 2 fixed at regular and equal density (equal spacing) positions corresponding to the large number of phosphor layers 20.
2 and a plurality of X-direction bus electrodes 24 and Y-direction bus electrodes 26 that are connected to the electron-emitting devices 22 and are orthogonal to each other in order to selectively operate the electron-emitting devices 22.

The front substrate 12 is, for example, 400 × 2.
It is a transparent substrate made of glass, such as soda glass or heat-resistant glass, which forms a rectangle with a size of about 00 × 2.0 (mm). The rear substrate 14 is also 400 × 200 ×, for example.
Although it has a rectangular shape with a size of about 2.0 (mm), it is not necessarily transparent and is made of, for example, soda glass, heat-resistant glass, alumina ceramics, forsterite, steatite, or the like. The front substrate 12 and the rear substrate 14 have a melting point sufficiently higher than a thick film baking temperature (first temperature) described later and do not deform at that temperature. The X-direction bus electrode 24 and the Y-direction bus electrode 2
No. 6 is formed to have a thickness of about 10 to 15 μm by firing a thick film conductor paste containing silver or the like as a main component of a metal component.

As shown in FIG. 2, the electron-emitting device 22 is used.
Is a pair of element electrode bases 28, 30 made of a metal thin film made of platinum Pt and ITO and formed in a rectangular shape by vapor deposition, sputtering, etc. And a circular element electrode 32 formed so as to overlap with.
The element electrode 32 is a metal thin film containing palladium oxide PdO or the like as a main component, and a very narrow slit 34 of about several nm is formed in the center thereof by, for example, discharge breakdown. In such an element electrode 32, when a predetermined voltage value, for example, 10 V or more is applied, electrons are efficiently emitted due to the tunneling effect and scattering. The electrons emitted from the device electrode 32 are accelerated by a voltage applied to a metal back (not shown), which is an aluminum thin film fixed to the back surface of the phosphor layer 20, and collide with the phosphor layer 20 to emit light. Let
That is, when a voltage is selectively applied to a desired one of the large number of device electrodes 32, the phosphor layer 20 located corresponding to the desired device electrode 32 is caused to emit light and a desired image is displayed. Is displayed. It should be noted that three adjacent phosphors made up of three types of phosphors that respectively emit the three primary colors of RGB.
When each phosphor layer 20 constitutes one pixel, color display is performed.

The X-direction bus conductor 24 and the Y-direction bus conductor 26 are three-dimensionally crossed so as to be orthogonal to each other, and a glassy insulating protection layer 36 and the aforesaid insulating protection layer 36 are provided so that mutual insulation can be maintained. High melting point particle layer 3 which is an aggregate of high melting point particles having a melting point sufficiently higher than the thick film baking temperature
And 8 are interposed between the two in a laminated state.

The SED display device 1 configured as described above
0 is manufactured, for example, according to the process chart shown in FIG.
In FIG. 3, P1 to P10 indicate the rear substrate manufacturing process, and P4 to P10 perform thick film printing and thick film baking at a place different from the rear substrate 14 to form the X-direction bus electrode 2
4 shows a process for manufacturing a thick film sheet including the 4 and Y direction bus electrodes 26.

In the element electrode base fixing step P1, the element electrode base 28 made of, for example, platinum Pt or ITO,
30 is fixed on the rear substrate 14. Next, in the element electrode fixing step P2, the circular element electrodes 32 made of, for example, palladium oxide PdO are fixed in a state of being overlaid on the portions of the element electrode bases 28 and 30 which are close to each other.
FIG. 4 shows this state. The device electrode bases 28, 30 and the device electrode 32 are fixed to the entire surface by vapor deposition or sputtering in a vacuum chamfer with a thickness of about several microns and then unnecessary portions are etched through a photomask so that a predetermined pattern shape can be obtained. It is formed into a predetermined pattern shape by being removed or vapor-deposited or sputtered through a photomask in which the pattern portion is removed. Then, in the low-temperature conductor paste applying step P3, as shown by a broken line in FIG. 4, an adhesion position for electrically connecting to a thick film sheet described later, that is, an X direction bus electrode 24 and a Y direction forming the thick film sheet. The low temperature conductor paste is applied to the bonding positions for connecting the bus electrodes 26 to the device electrode bases 28 and 30. The low-temperature conductor paste is, for example, a paste-like adhesive containing silver fine powder as a main component, and is cured at a temperature sufficiently lower than a thick film baking temperature (first temperature) described later, for example, 300 ° C.

In the peeling layer forming step P4, as shown in FIG. 5, inorganic particles such as alumina powder having a melting point higher than the thick film baking temperature (first temperature) of about 750 to 800 ° C. and a paste having an appropriate viscosity are used. The release layer 42 is formed on the entire upper surface of the substrate 40 by screen printing using a release paste formed by kneading a decomposable resin such as ethyl cellulose and a solvent such as butyl carbitol acetate or terpineol for forming a shape. It is formed. This substrate 40 is used to manufacture a thick film sheet at a place different from the rear substrate 14, and is made of, for example, alumina, steatite, forsterite or the like, which is heat resistant and does not soften at the above thick film baking temperature. Sintered with high material. Next, in the X- and Y-direction bus conductor forming step P5, metal powder such as silver, palladium, and platinum, a glass frit that melts at the thick film firing temperature (first temperature) to bond them, and ethyl cellulose and the like. The resin and a solvent such as butyl carbitol acetate or terpineol are screen-printed using a thick film conductor paste kneaded in a highly viscous fluid state, so that as shown in FIG. The Y-direction bus conductor 26 is formed.

Next, in the insulating protective layer forming step P6, the inorganic filler constituting the dielectric, the glass frit which is melted at the thick film firing temperature (first temperature) to bind them, and the resin such as ethyl cellulose. And a solvent such as butyl carbitol acetate or terpineol are screen-printed using a thick film conductor paste kneaded in a highly viscous fluid state, and as shown in FIG. An insulating protection layer 36 is formed on a portion intersecting with the directional bus conductor 26. In the high melting point particle layer forming step P7, inorganic particles having a melting point higher than the thick film baking temperature (first temperature) of about 750 to 800 ° C. and having an adsorption function, such as zirconia powder or alumina powder, and an appropriate amount of On the X-direction bus conductor 24, screen-printing is performed by using a peeling paste formed by kneading a erasable resin such as ethyl cellulose and a solvent such as butyl carbitol acetate or terpineol for forming a viscous paste. The high melting point particle layer 38 is formed on the intersecting portion, that is, on the insulating protection layer 36. Next, in a crossover conductor forming step P8, by screen printing using a thick film conductor paste, as shown in FIG. 5, it is superposed on the high melting point particle layer 38 on the intersecting portion on the X-direction bus conductor 24. , Crossover conductor 4
4 is formed. FIG. 5 shows this state. The crossover conductor 44 connects the Y-direction bus conductor 26 printed in the process P2, and
It constitutes a part of the directional bus conductor 26.

In the subsequent firing step P9, the substrate 40 on which the X-direction bus conductor 24 and the Y-direction bus conductor 26, the insulating protective layer 36, the high melting point particle layer 38, and the crossover conductor 44 are sequentially printed and dried, For example, 750 to 8
The film is baked at a thick film baking temperature (first temperature) of about 00 ° C.
Therefore, the X-direction bus conductor 24 and the Y-direction bus conductor 2
6, the insulating protective layer 36, the high melting point particle layer 38, and the crossover conductor 44 are bonded to each other by melting and sintering the glass frit contained therein as soon as the resin and solvent contained therein disappear. In the exfoliation layer 42 and the high melting point particle layer 38, which contain little or no glass frit, the high melting point particles are aggregated with a relatively loose bonding force. Then, the thick film sheet peeling reversal step P
10, the thick film sheet including the X-direction bus conductor 24 and the Y-direction bus conductor 26, the insulating protection layer 36, the high melting point particle layer 38, and the crossover conductor 44, which are coupled to each other, is peeled from the peeling layer 42 and inverted. Then, the low temperature conductor paste is applied on the rear substrate 14 of FIG. 4 to which the low temperature conductor paste is applied in the low temperature conductor paste applying step P3. At this time, the X-direction bus conductors 24 and Y forming the thick film sheet
The directional bus conductor 26 is positioned on top of the low temperature conductor paste applied. Next, in the fixing step P11, the low-temperature conductor paste is cured by being treated at a temperature of, for example, about 300 ° C., so that the X-direction bus conductors 24 and the Y-direction bus conductors 26 constituting the thick film sheet become the element electrodes. Bases 28 and 30 and connection conductor layer 46
Are connected to each other. This fixing step P11 also functions as a connecting step, and the connecting conductor layer 4 is formed.
No. 6 is a cured product of the low temperature conductor paste.

When the rear substrate 14 is completed as described above, in the spacer installation step P12, a position on the rear substrate 14 where light emission or display is not impaired, for example, on the X-direction bus conductor 24, is shown in FIG. As spacer 1
8 is installed upright. Then, in the subsequent vacuum sealing step P13, the front substrate 12 to which the phosphor layer 20 and the metal back (not shown) are previously fixed is mutually sealed while being placed on the rear substrate 14, and the space 1
6 is sealed in a vacuumed state. The slit 3
2 is, for example, the device electrode 3 whose breakdown voltage is individual in this state.
It is formed by being applied to No. 4.

As described above, according to this embodiment, the thick film of the X-direction bus conductor 24 and the Y-direction bus conductor 26 is formed in the portion where the X-direction bus conductor 24 and the Y-direction bus conductor 26 intersect each other. A non-sintered high melting point particle layer 38 made of particles having a melting point higher than the firing temperature is interposed. The high-melting-point particle layer 38 is an aggregate of high-melting-point particles and has a high porosity and acts as if a space exists.
Even if the direction bus conductor 26 is a thick film conductor containing silver as its main component, the insulation is not deteriorated due to the diffusion of silver, and high electrical reliability is obtained, so that the electron emission amount or the electron emission efficiency is reduced. The brightness of the display is suppressed and sufficient display brightness can be obtained.

Further, since the high melting point particle layer 38 is an aggregate of high melting point particles having a high porosity and has an extremely large surface area, after the sealing, the front substrate 12 and the rear substrate 14 are separated from each other. It functions as a getter that adsorbs the gas in the space 16 between them. For example, when particles having a particularly excellent adsorption function such as zirconia are selected, the action becomes remarkable. Therefore, the pollution of the electron-emitting device 22 is reduced, the decrease of the electron emission amount or the electron emission efficiency is suppressed, and the display brightness is sufficiently obtained.

In this embodiment, the X-direction bus conductor 24 is also used.
Since the thick film conductor of one of the X-direction bus conductor 24 and the Y-direction bus conductor 26 is covered with the insulating protective film 36 in the portion where the Y-direction bus conductor 26 and the Y-direction bus conductor 26 intersect each other. , X-direction bus conductor 24 and Y-direction bus conductor 26 are further improved in insulation and reliability.

Further, in the present embodiment, a thick film sheet forming step of forming a thick film sheet by applying the X-direction bus conductors 24 and the Y-direction bus conductors 26 intersecting with each other by printing and firing at the first temperature. P4 to P10 are element electrode bases 28 for forming the electron-emitting device 22,
Since a thick film sheet is created by printing and firing independently of the element electrode base fixing step P1 and the element electrode fixing step P2 for fixing the element 30, the rear substrate to which the element electrode bases 28, 30 are fixed Since the number of times of printing and firing of 14 can be reduced, contamination of the electron-emitting device 22 formed on the rear substrate 14 is reduced as much as possible. For this reason, a decrease in the amount of electron emission or the efficiency of electron emission of the electron-emitting device 22 in the initial stage or with time is suppressed, and sufficient display brightness can be obtained.

In the present embodiment, the thick film sheet forming steps P4 to P10 are performed between the X-direction bus conductor 24 and the Y-direction bus conductor 26 at the intersection of the X-direction bus conductor 24 and the Y-direction bus conductor 26. At the high melting point particle layer forming step (adsorption layer forming step) P7 for interposing the high melting point particle layer (adsorption layer) 38 constituted by fixing particles having a melting point higher than the first temperature
Is included. The high-melting-point particle layer 38 is an aggregate of high-melting-point particles having a high porosity and has an extremely large surface area. Therefore, after the sealing, the space 16 between the front substrate 12 and the rear substrate 14 is closed. Since it functions as a getter for adsorbing the gas, the contamination of the electron-emitting device 22 is reduced, the decrease of the electron emission amount or the electron emission efficiency is suppressed, and sufficient display brightness can be obtained.

Further, in this embodiment, in the thick film sheet forming steps P4 to P10, one of the X-direction bus conductor 24 and the Y-direction bus conductor 26 is formed at the intersection of the X-direction bus conductor 24 and the Y-direction bus conductor 26. Insulating protective layer forming step P6 for forming an insulating protective layer 36 for covering
Therefore, in the portion where the X-direction bus conductor 24 and the Y-direction bus conductor 26 intersect with each other, the insulation property and reliability between them are further enhanced.

Further, in this embodiment, in the fixing step (connection step) P11, the thick film sheet prepared in the thick film sheet forming steps P4 to P10 is peeled from the peeling layer 42 and inverted, and then the element electrode base is formed. The rear substrate 14 to which the element electrode bases 28 and 30 are fixed by the fixing process P1
It is placed on the device electrode and is connected to the element electrode bases 28 and 30 via a conductive paste which can be fixed at a low temperature. Since the thick film sheet placed on the rear substrate 14 is inverted from the posture on the substrate 40 on which it is manufactured, the upper surface of the thick film sheet has a flat shape with little unevenness, so that the front substrate The spacer 18 for interposing between the substrate 12 and the rear substrate 14 constitutes the thick film sheet X
It is easy to position on one of the directional bus conductor 24 and the Y-direction bus conductor 26, and the assembly is easy. Generally, the arrangement position of the spacer 18 is set at a position that does not hinder display or light emission, that is, on the X-direction bus conductor 24 or the Y-direction bus conductor 26.
Located under two black stripes.

Next, another embodiment of the present invention will be described. In the following description, the same parts as those in the above-described embodiment will be designated by the same reference numerals and the description thereof will be omitted.

FIGS. 6 and 7 show a SEC field electron emission display (FED), that is, an SEC display 50.
Rear substrate 5 which is a thick film wiring substrate in which a large number of surface conduction electron-emitting devices are arranged in a matrix for use in
2 is shown. FIG. 6 shows a cross-sectional view of the main part of the rear substrate 52. 7A and 7B are perspective views for explaining the manufacturing process of the rear substrate 52. FIG. 7A shows a state in which a large number of pairs of device electrodes 54a and 54b forming an electron-emitting device are formed, and FIG. 7B shows an X direction. The state where the bus conductor 24 is formed, (c) is the state where the high melting point particle layer 38 is formed, (d)
Shows the state where the Y-direction bus conductor 26 is formed.

As shown in FIG. 6, the rear substrate 52 is formed on the glass plate functioning as a substrate at the intersection X of the plurality of X-direction bus conductors 24 and the plurality of Y-direction bus conductors 26 at the X portion. High melting point particle layer 3 for each directional bus conductor 24
8 is provided between the X-direction bus conductor 24 and the Y-direction bus conductor 26 so that the Y-direction bus conductor 26 straddles the X-direction bus conductor 24 and is fixed to the device electrode 54b. Thick film conductor) 56. The rear substrate 52 is manufactured through the manufacturing process described below.

First, a large number of pairs of device electrodes 54a and 54b are formed on the glass rear substrate 52. The device electrodes 54a and 54b are made of palladium oxide (Pd
O) to a thin film having a thickness of about 10 nm, which is attached by sputtering or the like and patterned by photoetching. In addition, the pair of element electrodes 5
10 nm for electron emission between 4a and 54b
A slit of a certain degree is formed by applying a high voltage to both. FIG. 7A shows this state. Then, the thick-film conductor paste is directly screen-printed and dried to form a plurality of X-direction bus conductors 24 and device electrode bases 56 at positions where the device electrodes 54a and 54b overlap the ends thereof. To be done. FIG. 7B shows this state. Then, the release layer paste is directly screen-printed and dried, so that the high melting point particle layer 38 sufficiently crosses the intersection A of the X direction bus conductor 24 and the intersection A of the Y direction bus conductor 26. It is formed so as to cover. FIG. 7 (c) shows this state. Subsequently, the thick-film conductor paste is directly screen-printed and dried, so that the Y-direction bus conductor 26 intersects with the X-direction bus conductor 24, that is, the element electrode bases 56 are electrically connected to each other. Formed on layer 38. FIG. 7D shows this state. The thick film conductor paste has a low resistance value used as a conductor after firing, printability capable of fine line, and device electrodes 54a and 54 made of palladium oxide.
The one with a good match with b is used. Then, the back side substrate 52 shown in FIG. 6 is obtained by performing thick film firing in a firing process (not shown).
According to this embodiment, since the high melting point particle layer 38 is provided between the X-direction bus conductor 24 and the Y-direction bus conductor 26, the same effect as that of the above-described embodiments can be obtained.

Although the present invention has been described in detail above with reference to the drawings, the present invention can be implemented in other modes.

For example, the rear substrates 14 and 5 of the above-described embodiment.
2, the X-direction bus conductor 24 and the Y-direction bus conductor 26
Although and have been made to intersect at the intersection A, they may not necessarily be orthogonal and may intersect at an angle smaller than a right angle.

Further, in the above-described embodiment, the X-direction bus conductor 24 and the Y-direction bus conductor 26, the insulating protection layer 36, and the high melting point particle layer 38 are fired simultaneously, but they are fired individually. Good.

Although the spacer 18 is erected on the X-direction bus conductor 24 in the embodiments shown in FIGS. 1 to 3, it may be erected on the Y-direction bus conductor 26. Further, the X-direction bus conductor 24 and the Y-direction bus conductor 26 may be arranged in reverse. Further, the insulating protective layer 36 and the high melting point particle layer 38, which are laminated on each other, may be upside down. The insulating protection layer 36 does not necessarily have to be provided.

Further, in the above-mentioned embodiment, the electron emitting element 22 for emitting electrons from the slit 34 is provided, but an element for emitting electrons from the tip such as carbon nanotube may be provided.

Although not specifically exemplified, the present invention is
Various changes can be made without departing from the spirit of the invention.

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating a main part configuration of a flat panel display device according to an embodiment of the present invention.

FIG. 2 is a plan view illustrating a main part of a rear substrate of the embodiment of FIG.

3A to 3C are process diagrams illustrating a manufacturing process of the flat panel display device of FIG.

FIG. 4 is a perspective view showing a rear substrate of the flat panel display of FIG. 1, in which an element electrode base and an element electrode are formed.

5 is a perspective view illustrating a thick film sheet used for the rear substrate of FIG. 1. FIG.

FIG. 6 is a cross-sectional view illustrating a main part of a rear substrate according to another embodiment of the present invention.

7A and 7B are views for explaining the manufacturing process of the embodiment of FIG. 6, where FIG. 7A is a state in which a large number of pairs of device electrodes forming an electron-emitting device are formed, and FIG. 7B is an X-direction bus conductor. Is formed, (c) is the state where the high melting point particle layer is formed, (d)
Shows the state where the Y-direction bus conductor is formed.

[Explanation of symbols]

10: SEC display device (flat display device) 12: Front substrate 14: rear substrate 24: X-direction bus conductor 26: Y-direction bus conductor 36: Insulation protection layer 38: High melting point particle layer 42: Release layer P1: Element electrode base fixing process P4 to P10: Thick film sheet making process P6: Insulation protection layer forming step P7: High melting point particle layer forming step P11: Fixing process (connection process) P13: Vacuum sealing process (sealing process)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Susumu Sakamoto             2160 Yatsunami, Sanjo, Yasu-cho, Asakura-gun, Fukuoka Prefecture             Address Noritake Electronics Co., Ltd. Yasu Factory             Within F term (reference) 5C027 BB01                 5C036 EE01 EE14 EE19 EF01 EF06                       EF09 EG02 EG29 EH10 EH11

Claims (6)

[Claims] 1. A front substrate and a rear substrate which are arranged in parallel with a predetermined space therebetween, and are selected by a combination of a plurality of X-direction bus conductors and Y-direction bus conductors which intersect each other on the rear substrate. A flat display device of a type in which a large number of electron-emitting devices that are operated in an array are arranged, and a large number of phosphors provided on a front substrate are selectively emitted by electrons emitted from the electron-emitting devices, High melting point particles formed by fixing particles having a melting point higher than the firing temperature of the X-direction bus conductor and the Y-direction bus conductor at a portion where the X-direction bus conductor and the Y-direction bus conductor intersect each other. A flat-panel display device characterized in that layers are interposed. 2. The thickness of one of the X-direction bus conductor and the Y-direction bus conductor, which is fixed to the rear substrate, at a portion where the X-direction bus conductor and the Y-direction bus conductor intersect each other. The flat panel display device according to claim 1, wherein the film conductor is covered with an insulating protective film. 3. A front substrate and a rear substrate which are arranged in parallel with each other with a predetermined space therebetween, and are selected by a combination of a plurality of X-direction bus conductors and Y-direction bus conductors which intersect each other on the rear substrate. A method of manufacturing a flat-panel display device of a type in which a large number of electron-emitting devices that are activated electrically are arranged, and a large number of phosphors provided on a front substrate are selectively emitted by electrons emitted from the electron-emitting devices. An element electrode base fixing step of fixing an element electrode base for constituting the electron-emitting device on one surface of the rear substrate, and particles having a melting point higher than a first temperature formed on a predetermined substrate. A thick film sheet for forming a thick film sheet by applying the X-direction bus conductor and the Y-direction bus conductor intersecting each other on a release layer formed by bonding with a resin and firing at the first temperature. And the step of forming the thick film sheet, the thick film sheet formed in the step of forming the thick film sheet is peeled from the release layer, and then placed on one surface of the rear substrate to which the element electrode base is fixed in the element electrode base fixing step. A connecting step of connecting to the element electrode base via a conductor paste that can be fixed at a low temperature, and a state in which spacers are arranged on the thick film sheet connected to the element electrode base on the rear substrate by the connecting step. 2. A method of manufacturing a flat panel display device, comprising: a sealing step of mutually sealing the front substrate and the rear substrate. 4. The thick film sheet forming step has a melting point higher than the first temperature between the X-direction bus conductor and the Y-direction bus conductor at an intersection of the X-direction bus conductor and the Y-direction bus conductor. 4. The method for manufacturing a flat-panel display device according to claim 3, further comprising a high-melting point particle layer forming step for interposing a high-melting point particle layer formed by fixing the included particles. 5. The thick film sheet forming step forms an insulating protective layer for covering one of the X-direction bus conductor and the Y-direction bus conductor at an intersection of the X-direction bus conductor and the Y-direction bus conductor. 5. The method for manufacturing a flat panel display device according to claim 3, further comprising an insulating protective layer forming step. 6. In the connecting step, after the thick film sheet formed in the thick film sheet forming step is peeled from the peeling layer and inverted, the element electrode base is fixed in the element electrode base fixing step. 6. The method for manufacturing a flat-panel display device according to claim 3, wherein the flat-panel display device is placed on a rear substrate and connected to the element electrode bases via a conductive paste that can be fixed at a low temperature.