JP2003136628A - Metallic oxide laminated film, metallic oxide laminate, and method for manufacturing them - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a metallic oxide-laminated film which has no voids and a high conductivity of a metallic layer with satisfactory high frequency properties and can deal with the miniaturization of electrical parts. SOLUTION: A metallic oxide layer is directly coated on a film constituted of a base material, a release layer and a metallic vapor-deposited film layer and thus the metallic oxide-laminated film is formed. Next, the metallic vapor- deposited film layer and the metallic oxide layer are released from the release layer to obtain a metallic oxide laminate. One piece or two pieces or more of the metallic oxide laminate are baked inside a high-temperature furnace, however, after laminating and contact-bonding in the latter case.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal oxide laminated film which is a member for producing ceramic electronic parts such as glass electrodes, oxygen concentration measuring electrodes, surface acoustic wave filters, ceramics such as ceramic resistors and capacitors. And a metal oxide laminate and a method for producing the same.

[0002]

2. Description of the Related Art FIG. 5 is a schematic cross-sectional view showing a structure of a metal oxide laminated film in a manufacturing process of a conventional glass electrode, oxygen concentration measuring electrode, ceramic capacitor or the like.

In FIG. 5, a conventional metal oxide laminated film comprises a base film 7 such as a polyethylene terephthalate film coated with a release layer 8 such as a silicone resin, and a metal oxide such as BaTiO ₃ and polyvinyl. A metal oxide layer 4 is formed by applying a slurry containing a binder made of an organic substance such as butyral acrylate, and a metal powder and a conductive resin layer made of an organic substance that binds the metal powder to the metal oxide 4 (conductive layer). Resin paste 9 is printed by a screen printing method to form a laminate of a base film / release layer / metal oxide layer / conductive resin layer.

FIG. 6 is a schematic cross-sectional view showing the structure of a multi-layer laminate in which the metal oxide laminate is multi-layered after the base film / release layer is peeled off from the metal oxide laminate film of FIG. It is a figure.

In FIG. 6, a multi-layer laminate of metal oxide laminates is a metal oxide layer consisting of metal oxide layer 4 / conductive resin layer 9 peeled from base film 7 / release layer 8 of FIG. It is a multi-layered product laminate and is fired at a high temperature after the multi-layered product is laminated. In the process of firing, the organic substances in the metal oxide and the conductive resin are thermally decomposed and removed, and the metal layer in which the metal particles in the conductive resin are continuously formed into particles on the fired layer of the metal oxide by firing. A metal oxide layered body in which the layers are laminated is produced. (For example, Japanese Patent Laid-Open No. 2000-34045
See Japanese Unexamined Patent Publication No. 0, 2001-76965. )

[0006]

However, in the above-mentioned conventional method, since the formed metal layer is not a continuous body but a fired body in which metal particles are connected, the conductivity is low, resulting in a large equivalent series resistance and a large current. Does not flow, and the high frequency characteristics are poor. Further, from the trend of miniaturization of electric product shape, miniaturization of electric parts, especially thinness is demanded, but in the above-mentioned conventional method, if the metal layer is thinned, conductivity is further improved. It becomes low and the electric characteristics deteriorate. On the other hand, the metal oxide layer tends to be thinner and thinner, and the thinning of the metal layer has become the rate-determining factor for miniaturization of electric parts.

An object of the present invention is to provide a metal oxide laminated film and a metal oxide laminated body which have no voids, high conductivity of a metal layer and good high frequency characteristics and which can be applied to miniaturization of electric parts. Especially.

Another object of the present invention is a member suitably used for miniaturizing electronic parts such as glass electrodes, oxygen concentration measuring electrodes, surface acoustic wave filters, ceramic resistors or capacitors, that is, metal oxides. The object of the present invention is to provide an object laminated film and a metal oxide laminated body.

Still another object of the present invention is to provide a method for producing the above metal oxide laminated film and metal oxide laminated body.

[0010]

The metal oxide laminated film of the present invention is a metal oxide laminated film having a basic structure in which a substrate / release layer / metal vapor deposition film layer / metal oxide layer are laminated in this order. There is a metal oxide laminated film of the present invention,
The following preferable embodiments are included. (1) The above metal oxide layer is made of a dried product of a slurry containing a binder made of a metal oxide and an organic material. (2) The vapor-deposited metal layer is a transition metal, Al or Zn.
A vapor deposition film of at least one metal selected from the group consisting of or a vapor deposition film of an alloy of the metal. (3) The above metal vapor deposition film layer is a vapor deposition film of at least one metal selected from the group consisting of Au, Ag, Pd, Ni and Cu. (4) The thickness of the metal vapor deposition film layer is 0.1 μm or more and 2 μm
Must be m or less. (5) An adhesive layer is provided between the metal vapor deposition film layer and the metal oxide layer. (6) The adhesive layer is made of the same material as the organic binder contained in the metal oxide layer. (7) The release layer is made of one or more resins of acrylic resin, melamine resin, epoxy resin or silicone resin. (8) The softening point temperature of the release layer is 60 ° C or higher. (9) The above base material is a film made of a polymer resin.

The metal oxide laminate of the present invention is a metal oxide laminate in which the metal vapor deposition film layer / metal oxide layer of the above-mentioned metal oxide laminate film is peeled from the release layer. Two or more oxide laminates can be laminated to form a metal oxide multilayer laminate. The metal oxide laminated film of the present invention includes the following preferred embodiments. (10) The metal oxide layer is a sintered metal oxide layer (ceramic layer) obtained by firing a dried product of a slurry containing a binder made of a metal oxide and an organic material at a high temperature.

In the above metal oxide laminated film of the present invention, a resin is coated on a substrate to form a release layer,
It can be manufactured by depositing a metal on the release layer to form a vapor deposition film layer, and then applying a slurry containing a binder composed of a metal oxide and an organic substance on the vapor deposition film layer.

As another method of the metal oxide laminated film of the present invention, a resin is coated on a substrate to form a release layer, and then a metal is vapor-deposited on the release layer. To form a vapor deposition film layer, then apply an organic substance contained in the metal oxide layer on the vapor deposition film layer to form an adhesive layer, and then bond the metal oxide and the organic substance on the adhesive layer. It can also be manufactured by applying a slurry containing a material.

Further, the metal oxide laminate or the metal oxide multilayer laminate of the present invention comprises a metal vapor deposition film layer / metal oxide layer or metal vapor deposition obtained from the release layer of the metal oxide laminate film obtained above. After peeling off the film layer / adhesive layer / metal oxide layer,
Alternatively, it can be produced by laminating two or more layers of the metal vapor deposition film layer / metal oxide layer or the metal vapor deposition film layer / adhesive agent layer / metal oxide layer that have been peeled off, press-bonded, and then fired in a high temperature furnace or the like. In addition, the following preferable modes are included in the above firing. (11) At a temperature at which the organic substance or / and the adhesive in the slurry decomposes by heat before firing, the organic substance or / or
And baking after removing the adhesive by pyrolysis

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to a metal oxide laminated film suitable for manufacturing a small-sized ceramic electronic component,
The present invention relates to a metal oxide laminate and a metal oxide multilayer laminate, and has a basic structure in which a base material / release layer / metal vapor deposition film layer / metal oxide layer are laminated in this order.

FIG. 1 is a schematic cross-sectional view of the constitution in one embodiment for explaining the metal oxide laminated film of the present invention in detail. In FIG. 1, the metal oxide laminated film includes a substrate 1, a release layer 2, and a metal vapor deposition film layer 3.
And the metal oxide layer 4 is composed of the basic constituent elements laminated in this order.

The base material used in the present invention is preferably paper or a film-shaped base material such as a polymer film such as a polyester film, a polypropylene film or a polyphenylene sulfide film. In particular, polyethylene terephthalate film, polyethylene naphthalate film and polyphenylene sulfide film are particularly preferably used because they are less likely to wrinkle during metal deposition. In particular, a film made of polyethylene terephthalate having smoothness, toughness and heat resistance is preferably used.

In the present invention, the thickness of the substrate is preferably 20 μm to 100 μm, more preferably 25 μm.
˜50 μm. If the thickness of the substrate is less than 100 μm, heat is lost when the metal layer is deposited and curling occurs. In addition, even if the thickness is thicker than 100 μm,
It just increases costs.

The release layer used in the present invention may be any layer as long as it does not melt at the time of vapor deposition of metal and the vapor-deposited metal film is easily peeled off. From these points, acrylic resin, melamine resin, epoxy resin or silicone is used. It is preferably composed of one or more resins. It is particularly preferable to use a resin having a softening point temperature of 60 ° C. or higher because the adhesive force of the metal vapor deposition film increases when the surface layer of the release layer is melted or softened during metal vapor deposition.

In the present invention, the thickness of the release layer is preferably 0.1 μm to 1.0 μm, more preferably 0.
It is 3 μm to 0.8 μm. Release layer thickness is 0.1μm
If it is thinner, a sufficient peeling force cannot be obtained, and the metal vapor deposition film layer and the metal oxide layer cannot be peeled from the resin substrate when laminated.
Further, when the thickness is more than 1.0 μm, the peel strength at the time of peeling the metal vapor deposition film layer / metal oxide layer is only the same strength, and the cost is simply increased.

The metal constituting the metal vapor deposition film layer used in the present invention is a transition metal having high conductivity, Al or Z.
n or an alloy is preferable, and is particularly resistant to oxidation A
One or more metals selected from u, Ag, Pd, Ni and Cu are particularly preferable.

The thickness of the vapor-deposited metal film is appropriately determined depending on the application, but since the vapor-deposited metal film has good conductivity, it may be about 0.1 μm or more and 2 μm or less. In addition, the thickness of 0.2 μm or more and 1 μm or less is particularly preferable for the purpose of making the electric component smaller.

The metal oxide of the metal oxide layer used in the present invention is appropriately selected according to the application. However, because of its high dielectric properties and dielectric breakdown voltage, silicon oxide, zirconia oxide, TiBaO ₃ or the like is used. A metal oxide containing titanium oxide as a main component is more preferable. In addition, an organic material such as a partially or completely saponified resin of poly (vinyl acetate) or polyvinyl butyral may be added to the metal oxide layer as a binder. The type and amount of organic substances are appropriately determined as needed. A plasticizer such as diethyl phthalate, dibutyl phthalate or butyl benzyl phthalate may be added to impart plasticity to the dried product of the slurry containing the binder made of a metal oxide and an organic substance, and to further improve the coatability of the slurry. A dispersant such as glycerin, octadecylamine, trichloroacetic acid, oleic acid, ethyl oleate, glyceryl monooleate, glyceryl trioleate, and glyceryl tristearate may be added.

FIG. 2 is a schematic cross-sectional view showing a preferred constitution of another metal oxide laminated film of the present invention. The metal oxide laminated film of FIG. 2 has the same basic constitution as the metal oxide laminated film of FIG. In order to improve the adhesiveness between the metal vapor deposition layer 3 and the metal oxide layer 4, an adhesive layer 5 is provided between the metal vapor deposition layer 3 and the metal oxide layer 4. The composition component of the adhesive layer 5 may be any one as long as it enhances the adhesion between the metal vapor deposition layer and the metal oxide layer. For example, an alkoxysilane, a titanate compound, or a binder in the metal oxide layer can thin the adhesive layer. Therefore, it is preferably used. In particular, the organic material, which is the binder in the metal oxide layer, is thin and has a strong adhesive force, and is therefore more preferably used.

The thickness of the adhesive layer of the present invention is preferably 0.3 μm or less. The thickness is more preferably 0.
It is 3 to 0.1 μm. If the thickness of the adhesive layer is more than 0.3 μm, the processability is impaired, and if it is 0.1 μm or less, effective adhesiveness cannot be obtained.

FIG. 3 is a schematic view showing the structure of a metal oxide multilayer laminate in which the base material 1 and the release layer 2 are peeled off from the metal oxide laminate film of FIG. FIG. Specifically, in FIG. 1, the metal vapor deposition layer 3 / metal oxide layer 4 is peeled from the substrate 1 / release layer 2,
Further, the metal vapor deposition layer 3 / metal oxide layer 4 is one layer, and the metal vapor deposition layer 3 / metal oxide layer 4 is further laminated thereon.

FIG. 4 shows the metal oxide multilayer laminate of FIG. 3 fired at a high temperature. When the metal oxide layer is fired on the metal vapor deposition layer 3, organic substances such as a binder are decomposed and disappeared and the metal is removed. This is a multi-layered product in which the layers in which the fired metal oxide layers 6 in which oxides are fired are laminated are laminated in multiple layers. The fired metal oxide layer shrinks by firing in the range of 10% to 20%.

Next, a method for manufacturing the metal oxide laminated film or the like of the present invention will be described.

In the metal oxide laminated film of the present invention, the release layer 2 is formed by applying a resin for forming a release layer on the base material 1 and drying it.
After the formation, a metal is vapor-deposited on the release layer 2 to form a metal vapor deposition film layer 3, and then a slurry containing a binder made of a metal oxide and preferably an organic substance is formed on the metal vapor deposition film layer 3. It can be manufactured by coating and drying to form a metal oxide layer.

The method for forming the release layer is not particularly limited, and a direct gravure method, a Meyer bar method, a reverse roll coater method, an offset gravure method and the like can be used.

The method for depositing the metal for forming the metal vapor deposition film layer is not particularly limited, and an induction heating method using a crucible, an electron beam vapor deposition method, a sputtering method or the like can be used. Since the transition metal has a high melting point, the electron beam evaporation method and the sputtering method are more preferable. Further, since the sputtering method uses plasma, the surface of the release layer may be modified and the adhesion may be improved to make it difficult to peel off the deposited metal film layer.However, the electron beam method has such a problem. It is particularly preferably used because it is not present and the amount of vapor deposition is large and vapor deposition can be performed at high speed.

In the method for producing a metal oxide laminated film of the present invention, since the metal oxide layer is directly coated on the metal vapor deposition film layer, air or the like does not enter between the metal vapor deposition film layer and the metal oxide layer. Therefore, it has an excellent advantage that voids and the like between the metal oxide film layer and the metal layer, which are seen when the metal oxide film layer and the metal layer are laminated by lamination or the like and fired, do not occur.

When the metal oxide laminate is produced in the present invention, the base material (and the release layer) is removed from the metal oxide laminate film of the present invention to obtain the metal oxide laminate. Further, the metal oxide multilayer laminate can be manufactured by laminating two or more layers of the obtained metal oxide laminate and press-bonding. Further, if necessary, the metal oxide laminate or the metal oxide multilayer laminate is cut lengthwise and crosswise to be divided into individual chip-shaped laminates.

Then, the metal oxide laminate or the metal oxide multilayer laminate is placed in a high temperature furnace and fired. The firing atmosphere can be appropriately determined depending on the material, but firing in a reducing atmosphere is more preferable. As an example of atmospheric gas,
For example, a mixed gas of nitrogen gas and hydrogen gas can be humidified before use. Furthermore, in order to improve the adhesion between the metal vapor deposition film layer and the metal oxide layer, or to prevent the reduction of the metal oxide, the oxygen partial pressure of the firing atmosphere is 1 × 10 ⁻⁸ to 1 ×.
More preferably, it is set to 10 ^-12 atm. If the oxygen partial pressure is too high, there is a problem that the degree of oxidation of the metal vapor deposition film is too high.

The holding temperature during firing is 900 to 140.
0 degreeC is preferable, More preferably, it is 1000 degreeC-1380.
℃. If the holding temperature is too low, the densification will be insufficient, and if the holding temperature is too high, the capacitance-temperature characteristic will be deteriorated due to electrode breakage due to abnormal firing of the metal deposition film or diffusion of the metal deposition film. As an example of the firing conditions, the rate of temperature rise is preferably 50 to 500 ° C./hour, more preferably 2
The temperature holding time is preferably 0.5 to 8 hours, more preferably 1 to 3 hours, and the cooling rate is preferably 50 to 500 ° C / hour, more preferably 200 to 300 ° C / hour. Time.

In the present invention, it is preferable to remove the organic substance and / or adhesive by thermal decomposition at a temperature at which the organic substance and / or adhesive in the slurry is decomposed by heat before firing. Pyrolysis may be performed under normal conditions. For example, when a base metal such as Ni or Ni alloy is used as the metal vapor deposition film, the temperature rising rate is preferably 5 to 300 ° C./hour in an air atmosphere, more preferably Is 10 to 100 ° C./hour, and the holding temperature is preferably 180
C. to 500.degree. C., more preferably 300 to 400.degree. C., and the temperature holding time is preferably 0.5 to 24 hours, more preferably 1 to 10 hours.

The metal oxide laminated film, the metal oxide laminated body and the metal oxide multilayer laminated body obtained in the present invention include a glass electrode, an oxygen concentration measuring electrode, a surface acoustic wave filter,
It is suitable as a member for manufacturing ceramic electronic parts such as ceramics such as ceramic resistors or capacitors.

[0038]

Example 1 A melamine resin is coated on a base material of a 25 μm-thick polyester film (“Lumirror” (registered trademark) manufactured by Toray Industries, Inc.) to have a thickness of 1.0.
A μm release layer was formed. Then, in a vacuum vapor deposition machine evacuated to 5 × 10 ⁻³ Pa, a nickel vapor deposition film having a thickness of 0.3 μm is vapor-deposited on the release layer of the base material with the release layer by an electron beam vapor deposition method to form a metal vapor deposition film. Layers were formed. Then, (alumina + borosilicate glass) -based dielectric material, an acrylic binder component, dioctyl phthalate as a plasticizer component, and γ-butyrolactone as a solvent component are mixed to prepare a slurry, and then the Ni vapor deposition is performed. Coating on the film, drying,
A metal oxide slurry dried product composed of (alumina + borosilicate glass) was provided to prepare a metal oxide laminated film.

From the laminated film thus obtained, the laminate of the Ni vapor deposition film layer / the dried metal oxide slurry was peeled off. Two layers of the separated Ni vapor-deposited film layer / dried metal oxide slurry were laminated and pressure-bonded, and then organic matter in the metal oxide slurry under the conditions of a temperature rising rate of 100 ° C / hour, a holding temperature of 400 ° C, and a temperature holding time of 2 hours. Was pyrolyzed. Following the thermal decomposition, firing was performed under the conditions of a temperature rising rate of 200 ° C./hour, a holding temperature of 1100 ° C. and a temperature holding time of 2 hours. The interface between the baked Ni vapor deposition film layer / the fired metal oxide layer made of alumina + borosilicate glass was observed with a transmission electron microscope. As a result, voids were observed both inside the metal vapor deposition film and at the interface between the metal vapor deposition film and the fired metal oxide layer. Was not observed. (Comparative Example 1) On a base material of a polyester film having a thickness of 25 μm (manufactured by Toray Industries, Inc .: “Lumirror” (registered trademark)) used in Example 1,
A dry product of the (alumina + borosilicate glass) -based metal oxide slurry used in Example 1 was provided without forming a release layer, and a conductive paste containing Ni metal particles was further screen-printed thereon. Was printed and dried to prepare a metal oxide slurry dry sheet with a paste electrode. When two layers of the metal oxide slurry dry sheet with the paste electrode were laminated and fired under the conditions of Example 1, the inside of the Ni electrode layer and the Ni electrode layer (alumina + borosilicate glass)
About 30% of voids were generated at the interface with the layer.

[0040]

As described above, according to the present invention, it is possible to eliminate the generation of voids at the interface between the metal oxide serving as the electrode and the metal oxide, which was a problem in the conventional method. That is, it is possible to obtain a member such as a metal oxide laminated film or a metal oxide laminated body which has no voids, has a high conductivity of the metal layer, has excellent high frequency characteristics, and can be applied to miniaturization of electric parts.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a preferable constitution of a metal oxide laminated film of the present invention.

FIG. 2 is a schematic cross-sectional view showing a preferable constitution of another metal oxide laminated film of the present invention.

FIG. 3 is a schematic diagram showing a structure of a metal oxide multilayer laminate in which the metal oxide laminate is multilayered after the base material / release layer is peeled off from the metal oxide laminate film of FIG. FIG.

FIG. 4 is a sintered metal oxide in which the metal oxide multilayer laminate of FIG. 3 is fired at a high temperature, the metal oxide layer decomposes and eliminates organic substances such as a binder, and the metal oxide is sintered. It is a schematic sectional drawing of a multilayer laminated body in the state of having become a layer.

FIG. 5 is a schematic cross-sectional view showing a configuration of a metal oxide laminated film during a manufacturing process of a conventional glass electrode, oxygen concentration measuring electrode, ceramic capacitor, or the like.

6 is a schematic cross-sectional view showing the structure of a multilayer laminate in which the metal oxide laminate is multilayered after the polymer film / release layer is peeled off from the metal oxide laminate film of FIG. Is.

[Explanation of symbols]

1: Base material 2: Release layer 3: Metal vapor deposition film layer 4: Metal oxide layer 5: adhesive layer 6: Sintered metal oxide layer 7: Base film 8: Release layer 9: Conductive resin layer

Continued front page    (72) Inventor Kenji Hatada             1-1-1 Sonoyama, Otsu, Shiga Prefecture Toray shares             Company Shiga business site (72) Inventor Toro Kobayashi             3-16 Nihonbashi Honishicho, Chuo-ku, Tokyo             Toyo Metalizing Co., Ltd. Tokyo head office (72) Inventor Masaru Suzuki             Toyo Metalai, 33 Nagabushi, Mishima City, Shizuoka Prefecture             Jing Co., Ltd. Mishima Factory F term (reference) 4D075 AE03 BB05Z BB28Z CA22                       CA48 DA04 DB18 DB36 DB40                       DB55 DC18 EA10 EB22 EB33                       EB39 EB42 EB53 EC10                 4F100 AA17D AB01C AB10C AB16C                       AB17C AB18C AB23C AB25C                       AK01A AK25B AK36B AK52B                       AK53B AT00A BA04 BA10A                       BA10D BA25C CC00 EH66C                       EJ482 GB41 JA04B JK06B                       JL14B YY00B YY00C                 4K029 AA11 AA25 BA04 BA05 BA08                       BA12 BB02 CA01 DB03 EA01                       GA01 GA05

Claims (16)

[Claims] 1. A metal oxide laminated film having a basic structure in which a substrate, a release layer, a metal vapor deposition film layer, and a metal oxide layer are laminated in this order. 2. The metal oxide laminated film according to claim 1, wherein the metal oxide layer is made of a dried product of a slurry containing a binder made of a metal oxide and an organic material. 3. The vapor deposition film layer is a vapor deposition film of at least one metal selected from the group consisting of transition metals, Al and Zn, or a vapor deposition film of an alloy of the metals. The metal oxide laminated film according to 1 or 2. 4. The metal vapor deposition film layer comprises Au, Ag, Pd, N.
The metal oxide laminated film according to any one of claims 1 to 3, which is a vapor-deposited film of at least one metal selected from the group consisting of i and Cu. 5. The metal vapor deposition film layer has a thickness of 0.1 μm or more,
It is 2 micrometers or less, The metal oxide laminated film in any one of Claim 1 to 4 characterized by the above-mentioned. 6. The metal oxide laminated film according to claim 1, further comprising an adhesive layer between the metal vapor deposition film layer and the metal oxide layer. 7. The metal oxide laminated film according to claim 6, wherein the adhesive layer is made of the same material as the organic binder contained in the metal oxide layer. 8. The metal oxide laminate according to claim 1, wherein the release layer is made of at least one resin selected from acrylic resin, melamine resin, epoxy resin and silicone resin. Film. 9. The metal oxide laminated film according to claim 1, wherein the release layer has a softening point temperature of 60 ° C. or higher. 10. The metal oxide laminated film according to claim 1, wherein the base material is a film made of a polymer resin. 11. A metal oxide laminate in which the metal vapor deposition film layer / metal oxide layer of the metal oxide laminate film according to claim 1 is peeled from a release layer, or a peeled metal oxide laminate is 2 A metal oxide multilayer laminate formed by laminating at least one layer. 12. The metal oxide layer is a sintered metal oxide layer obtained by firing a dried product of a slurry containing a binder made of a metal oxide and an organic material at a high temperature. 11. The metal oxide laminate or the metal oxide multilayer laminate according to item 11. 13. A resin is applied on a substrate to form a release layer, a metal is vapor-deposited on the release layer to form a vapor deposition film layer, and then a metal oxide film is formed on the vapor deposition film layer. 13. A method for producing a metal oxide laminated film according to claim 1, wherein a slurry containing a binder composed of an organic substance and an organic substance is applied. 14. A resin is applied on a substrate to form a release layer, a metal is vapor-deposited on the release layer to form a vapor deposition film layer, and then a metal oxide is formed on the vapor deposition film layer. The organic material contained in the material layer is applied to form an adhesive layer, and then a slurry containing a binder made of a metal oxide and an organic material is applied onto the adhesive material layer. 14. The method for producing a metal oxide laminated film according to any one of 13 above. 15. A metal vapor deposition film layer / metal oxide layer or a metal vapor deposition film layer / adhesive layer / metal oxide from the release layer of the metal oxide laminated film obtained by the production method according to claim 13 or 14. Characterized in that after peeling off the material layer, or two or more layers of the metal vapor deposition film layer / metal oxide layer or the metal vapor deposition film layer / adhesive agent layer / metal oxide layer which have been peeled off are laminated and pressure-bonded, they are baked. A method for producing a metal oxide laminate or a metal oxide multilayer laminate. 16. After removing the organic matter and / or adhesive in the slurry by pyrolysis at a temperature at which the organic matter and / or adhesive in the slurry decomposes by heat before firing,
The method for producing a metal oxide laminate or a metal oxide multilayer laminate according to claim 15, which comprises firing.