JP2003108957A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card suitably used for formation of an image using a thermal transfer printer, provided with excellent quality and preservability of the image, and prevented from forgery and alteration. SOLUTION: This IC card 20 is provided with a card type lamination body 5, which is constructed of a front face base material 1 and a back face base material 2 each principally consisting of a polyester resin and an IC module 4, and a transparent resin sheet 6 principally consisting of a polyester resin with a softening point of 50-140 deg.C and having a reverse visible image formed on at least its one face, and the transparent resin sheet 6 is layered on the surface of the card type lamination body 5 while having the reverse visible image formation face inside. The transparent resin sheet 6 is bonded to the card type lamination body 5 by thermo-compression bonding. In a part or the whole of one face in the transparent resin sheet 6, a dye receiving layer 9 is formed. The polyester resin forming the transparent resin sheet 6 contains 5 mole% or more of a cyclohexane dimethanol residue. In the transparent resin sheet 6, the transmittance to visible light with a wavelength of 400-750 nm is 75% or more.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, and more particularly, it prints an image such as a photograph and character information with high image quality, which is required for an IC card having an IC chip which is a large capacity variable recording medium. The present invention relates to a printable IC card.

[0002]

2. Description of the Related Art Conventionally, a magnetic card utilizing magnetic characteristics has been used as an information recording medium, but in recent years, due to the development of the IC card, the IC card is shifting from a magnetic card as a large capacity variable recording medium. IC cards are roughly classified into contact type and non-contact type. In the contact type IC card, information is exchanged between the IC chip and an external data processing device via a contact terminal electrically and mechanically connected to the IC chip.

On the other hand, the non-contact type IC card is a transceiver that wirelessly communicates information with the outside through an antenna inside the card by radio waves. Since the communication means is a non-contact type using radio waves, it is not necessary to insert a magnetic card such as a commuter pass into a contact type reading device at a ticket gate of a station, and the IC card is kept in a bag or the like. It is possible to pass through the ticket gate. Further, since it is non-contact, there is no problem due to contact between the IC card and the reading device, for example, poor conveyance of the IC card, wear of the head of the reading device, etc., and the maintenance cost of the reading device can be significantly reduced. Is possible.

An IC card has a surface base material formed of an electrically insulating resin film and a back surface base material having an IC chip laminated on one surface thereof, which are laminated with a hot melt adhesive. . In addition, the IC card is an IC
Since the recording of information on the chip is electric recording, a special writing change device is required to update the information on the IC chip from the outside, and therefore it is also excellent in terms of confidentiality.

In recent years, thermal printers, particularly thermal transfer printers capable of printing clear full-color images, have been receiving attention. Among them, a sublimation heat transfer printer is a sublimation heat transfer dye sheet having a dye layer containing a dye that migrates by sublimation or melt diffusion by heating, and an image receiving sheet on which a dye receiving layer for receiving a dye is formed on one surface of a film substrate. And a predetermined amount of the dye in the dye layer is transferred onto the dye receiving layer by heat supplied from a thermal head or the like to form an image. This sublimation thermal transfer printer has a characteristic that it is particularly advantageous for forming a high gradation photographic full color image.

On the other hand, in the fusion thermal transfer printer, a transfer film coated with an ink which is melted by heating (hereinafter referred to as "ink sheet") and an image receiving sheet are pressed against each other by a platen roll and heated from the back surface of the ink sheet. Then, the ink is instantly melted to form characters and images on the image receiving sheet. As a feature of printing by such a melt thermal transfer printer, since it is not a method of thermally diffusing ink, a sharp and highly concentrated image with an edge effect is obtained, and since a robust pigment type ink is used, Excellent image light resistance and chemical resistance. From the above, the melt thermal transfer printer is preferably used particularly for printing and printing character information.

By the way, in the use of ID cards such as membership cards and employee ID cards, it is preferable that image information such as a facial photograph is printed in order to recognize an individual. As a method of forming an image such as a photograph, the sublimation thermal transfer method is particularly excellent in terms of its photographic gradation, operability of printing equipment, high reliability, and the like. Therefore, in printing an ID card, first, a face photograph or the like is printed in full color by a sublimation heat transfer method, and then a character is clearly printed by a fusion heat transfer method.

A sublimation / melt thermal transfer combined printer capable of simultaneously performing such different printing methods is already known. In this printer, first, the dye-coated surface of an ink sheet coated with sublimable yellow, magenta, and cyan dyes and a heat-melt transfer ink (particularly black) (in some cases, a protective layer called an overlay layer) is applied. , The surface of the image receiving sheet on which the dye receiving layer is formed is superposed. Then, in response to an electric signal corresponding to a desired image and character, heat and heat supplied from the thermal head transfer dye and ink from the ink sheet to the image receiving sheet from a required position in a predetermined amount and dye the image or image. Form a character.

[0009]

Such an ID card has a sufficient function in a normal use state, but it is not always sufficient in terms of storability and prevention of forgery. For example, in order to prevent tampering, a photographic sheet body in which a transparent sheet is joined on a fiber sheet so that the image receiving sheet is on the inside after forming a character image or a person image on the receiving layer of the transparent sheet. Have been proposed (Japanese Patent Application Laid-Open Nos. 1-182095 and 1-22).
5595 publication).

As the card base material, for example, a material whose main resin is polyvinyl chloride (hereinafter abbreviated as "PVC") or polyethylene terephthalate (hereinafter abbreviated as "PET") is generally used. In addition, PET having a low softening point, which is easy to mold, has also been proposed (JP-A-9-
66590, JP-A-11-100541). However, a satisfactory thermal transfer image is always obtained when a transparent sheet produced using a normal PET or the like as a main component is used to form a transparent sheet layer having an image on the surface of a card having a normal PET as a base material. No
An adhesive was required to bond the card base material, the moldability was insufficient, and curling was apt to occur.

The present invention has been made in view of the above circumstances, and is an IC card having a transparent resin sheet adhered to the surface thereof, which is suitable for forming an image using a thermal transfer printer and is adhered to the surface of the card. Using a transparent resin sheet that is easy to
An IC that has excellent image quality and storability, and is difficult to forge or alter
The challenge is to provide a card.

[0012]

[Means for Solving the Problems] The above-mentioned problems are as follows:
A card-shaped laminated body in which an IC chip and a back surface substrate are laminated in this order, and a transparent resin sheet containing a polyester resin having a softening point of 50 to 140 ° C. as a main component and having a reverse visible image formed on at least one surface thereof. In the IC card, the front surface base material and the back surface base material have a polyester resin as a main component, and a surface of the transparent resin sheet on which an inverted visible image is formed is an inner side of a card-shaped laminate. It can be solved by the IC card laminated on the surface. It is preferable that the transparent resin sheet is thermocompression bonded to the surface of the card-shaped laminate. It is preferable that a part or all of one surface of the transparent resin sheet is provided with a dye receiving layer containing a dye-dyeing resin. The polyester resin forming the transparent resin sheet preferably contains 5 mol% or more of cyclohexanedimethanol residues among residues derived from polyhydric alcohol. The transparent resin sheet has a transmittance of visible light having a wavelength of 400 to 750 nm of 75%.
The above is preferable.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below.
FIG. 1 is a sectional view showing an example of the IC card of the present invention. This IC card 20 includes a front surface base material 1 and a back surface base material 2.
And an adhesive layer 3 formed on one surface 1a of the front surface base material 1 and bonding the front surface base material 1 and the back surface base material 2 together,
A card-shaped laminated body 5 having an IC module 4 composed of an IC chip or the like held on one surface 2a side of the back surface base material 2, and a transparent resin sheet 6 laminated on the other surface 1b of the front surface base material 1. And a sublimation dye layer 10 and / or a melt heat transfer ink layer 11 formed on one surface 6a of the transparent resin sheet 6 and a protective layer 12 for protecting the sublimation dye layer 10 and / or the melt heat transfer ink layer 11. It is configured.

The surface base material 1 is made of a resin film containing a polyester resin as a main component. The polyester resin is produced by a polycondensation reaction of a dicarboxylic acid and a diol. As the dicarboxylic acid component
Terephthalic acid, isophthalic acid, orthophthalic acid, 2,6
-Aromatic dicarboxylic acids such as naphthalenedicarboxylic acid, aliphatic dicarboxylic acids such as succinic acid, adipic acid, azelaic acid, sebacic acid, dodecadioic acid, etc., and one or more of these may be used alone or in combination. Used. Examples of the diol component include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, diethylene glycol, dipropylene glycol and neopentyl glycol. Aliphatic glycols, alicyclic glycols such as 1,4-cyclohexanedimethanol and 1,3-cyclohexanedimethanol, 4,4'-dihydroxybiphenyl, 2,2-bis (4'-hydroxyphenyl)
Aromatic glycols such as propane, bisphenol A
Examples thereof include diol compounds having a skeleton, and one kind or two or more kinds thereof are used alone or in combination. Preferably, the same softening point as the transparent resin sheet 6 is 5
A polyester resin at 0 to 140 ° C. is used, and as the diol component, ethylene glycol and cyclohexanedimethanol are used in combination.

A thermoplastic resin may be added to the polyester resin forming the surface base material 1. At this time, it is preferable to add the following thermoplastic resins to the polyester resin within a range that does not impair the effects of the present invention. As the thermoplastic resin added to the polyester resin, a resin having high compatibility with the polyester resin is preferable. For example, a polyester resin other than the polyester resin obtained by polycondensation of the above-mentioned dicarboxylic acid and diol, polyvinyl formal resin, polyacetal resin such as polyvinyl butyral, polyvinyl chloride resin, polyvinylidene chloride resin, polystyrene resin, acrylonitrile-styrene copolymerization Combined resin, polyethylene resin, polypropylene resin, polymethylmethacrylate resin, methylmethacrylate-styrene copolymer resin, polyamide resin, ethyl cellulose resin, cellulose acetate resin, polycarbonate resin, polyurethane resin, ethylene-vinyl acetate copolymer resin, etc. These are used alone or in combination of two or more. By adding these thermoplastic resins, the processability and heat resistance of the polyester resin are improved. Particularly, for the purpose of imparting heat resistance, it is preferable to add a polycarbonate resin.

The polyester resin forming the surface substrate 1 includes magnesium oxide, titanium oxide, aluminum oxide, calcium carbonate, magnesium carbonate as inorganic pigments,
Calcium silicate, barium sulfate, silicon oxide, clay,
One or more of talc and silica may be contained. Such an inorganic pigment is blended to give the IC card 20 hiding power, and a white pigment is preferably used. Among them, titanium oxide, which is inexpensive and excellent in hiding power, is preferably used. Further, the polyester resin, zinc stearate as a stabilizer and a lubricant, zinc laurate, metal soap such as zinc ricinoleate, a dispersant such as various surfactants, an antioxidant, an antistatic agent, a whitening agent, One or more kinds of various additives such as an ultraviolet absorber and a colored pigment may be contained.

The method for molding the surface base material 1 is not particularly limited, and can be appropriately selected from known methods for molding. For example, a single-layer or multi-layer T die or I die connected to a screw type extruder is used to extrude a molten resin containing a polyester resin as a main component into a sheet, cast molding, calendar molding, rolling molding, inflation molding. Etc. can be used for molding.

As the back substrate 2, an insulating resin sheet is used. Examples of the resin sheet having insulating properties include PET resin, acrylonitrile-butadiene-styrene resin, polybutylene resin, polyvinyl chloride resin, polycarbonate resin, paper, and synthetic paper, and one or more of these may be used. Used alone or in combination.

The back substrate 2 may be made of the same material as the front substrate 1. By using the same type of resin sheet for the front surface substrate and the back surface substrate, there is no difference in heat shrinkage in the bonding step between them, so that it is possible to obtain an IC card having no curl and a good appearance. it can. Further, from the viewpoint of adjusting the thickness of the IC card and preventing thermal deformation after image printing, the back surface base material 2 may be a resin sheet made of a material different from that of the front surface base material 1.

In the present invention, it is preferable that the adhesive layer 3 is provided between the front substrate 1 and the back substrate 2 of the card-shaped laminate 5. The material forming the adhesive layer 3 is not particularly limited, and examples thereof include urea resin, melamine resin, phenol resin, epoxy resin,
Vinyl acetate resin, vinyl acetate-acrylic copolymer resin,
EVA resin, acrylic resin, polyvinyl ether resin, vinyl chloride-vinyl acetate copolymer resin, polystyrene resin, polyester resin, polyurethane resin, polyamide resin, chlorinated polyolefin resin,
Add adhesives such as polyvinyl butyral resin, acrylic ester copolymer resin, methacrylic ester copolymer resin, cyanoacrylate resin, silicone resin, and tackifier resin such as rosin and rosin ester to natural rubber. Emulsion type, solvent type and hot melt type adhesives such as rubber type adhesives and urethane type adhesives can be used. Moreover, you may add additives, such as a tackifier, a crosslinking agent, a pigment, a ultraviolet absorber, a plasticizer, a filler, and an antioxidant, to the adhesive layer 3 as needed.

[0021] In particular, when strong adhesive strength is required, among the above-mentioned adhesives or pressure-sensitive adhesives, a chemically reactive adhesive of the type that cures or polymerizes by a chemical reaction is preferably used. As the chemical reaction type adhesive, for example, thermosetting type such as epoxy resin and resol type phenol resin,
2-Cyanoacrylate ester resin, silicone resin, alkyl titanate resin, etc., moisture curing type, acrylic oligomer resin, etc., anaerobic curing type, epoxy resin
Addition reaction type such as polyurethane resin, UV curing type,
Radical polymerization type adhesives and the like can be mentioned.

The adhesive layer 3 is applied to one surface 1a of the surface base material 1.
As a method for forming the upper surface or one surface 2a of the back surface substrate 2, a method of laminating a sheet-shaped hot melt adhesive on these surfaces is preferably performed. Further, the thickness of the adhesive layer 3 is appropriately set according to the thickness of the IC module.

The IC module 4 is not particularly limited, and one having a thickness of 50 to 500 μm is used. Usually, a substantially flat plate-shaped antenna coil (not shown) and one surface of this antenna coil are used. And an IC chip (not shown) arranged so as to project on a substrate (not shown). Then, both ends of the antenna coil are connected by anisotropic conductive tape (not shown), and the antenna coil and the IC are connected.
The tip and the chip remain electrically conductive. Further, the antenna coil may be a plate antenna formed on the substrate.

An insulating base film having a thickness of 20 to 400 μm is used as the substrate forming the IC module 4. As the insulating base material, PET resin, polyester resin having a softening point other than PET resin of 50 to 140 ° C., acrylonitrile-butadiene-styrene copolymer resin,
Examples thereof include polybutylene resin, polyvinyl chloride resin, polycarbonate resin, paper, and synthetic paper, and one or more of these may be used alone or in combination. Then, as a method of forming the antenna coil on this substrate, a method of attaching a coil made of a wire such as silver or copper, a method of etching copper or aluminum into a coil shape, a coil using conductive ink or the like is used. There is a method of printing in a shape. As a method of forming the plate-shaped antenna, there are a method of printing using a conductive ink and a method of depositing a metal such as copper and aluminum. Moreover, as the IC chip, one having a length and width of 0.5 to 10 mm and a thickness of about 50 to 300 μm is usually used.

FIG. 2 is a sectional view showing an example of a transparent resin sheet constituting the IC card of the present invention. The transparent resin sheet 6 includes a polyester resin film 7 containing a polyester resin having a softening point of 50 to 140 ° C. as a main component, and an undercoat coating layer 8 formed on one surface of the polyester resin film 7 and containing an aqueous polymer resin. And this undercoat coating layer 8
A dye receiving layer 9 containing a dye-dyeing resin formed on the upper side is generally configured.

The polyester resin having a softening point of 50 to 140 ° C. is produced by a polycondensation reaction of a dicarboxylic acid and a diol, like the polyester resin forming the surface substrate 1, and has a dicarboxylic acid component and a diol component. Is the same as the polyester resin forming the surface base material 1. A particularly preferable combination is a terephthalic acid as the dicarboxylic acid component, ethylene glycol and cyclohexanedimethanol as the diol component, and a copolyester resin comprising repeating units of terephthalic acid, ethylene glycol, and cyclohexanedimethanol is preferable.

The polyester resin in which a part of the diol component is cyclohexanedimethanol is polycondensed by changing the mixing ratio of cyclohexanedimethanol, and the physical properties of the obtained polyester resin, for example, the softening point,
The crystallinity and heat resistance can be changed. By thus changing the blending ratio of the monomers and performing the polycondensation, it is possible to control the softening point of the polyester resin within a predetermined temperature range. In order to set the softening point of the polyester resin film 7 forming the transparent resin sheet 6 to the range of 50 to 140 ° C., cyclohexane is used among the residues derived from the polyhydric alcohol in the polyester resin (here, the polyhydric alcohol is a diol). The dimethanol residue is preferably 5 mol% or more, more preferably 5 to 70 mol%, further preferably 10 to 50 mol%, and most preferably 25 to 40 mol%.
Mol%. When the cyclohexane dimethanol residue is less than 5 mol%, the softening point of the polyester resin is 50 to 14
It cannot be in the range of 0 ° C.

Particularly, when the diol component is composed of ethylene glycol and 1,4-cyclohexanedimethanol, 5 to 70 mol% of 1,4-cyclohexanedimethanol residues in the diol component and ethylene glycol residues are contained. Is preferably 95 to 30 mol%. More preferably, 10 to 50 mol% of 1,4-cyclohexanedimethanol residues, 90 to 50 mol% of ethylene glycol residues, and particularly preferably 25 to 40 mol% of 1,4-cyclohexanedimethanol residues. The ethylene glycol residue has a blending ratio of 75 to 60 mol%. The polyester resin as described above can also be obtained by polycondensing a dicarboxylic acid ester such as dimethyl dicarboxylate or a chloride with a diol.

When the softening point of the polyester resin forming the polyester resin film 7 is 50 to 140 ° C., after the undercoat coating layer 8 and the dye receiving layer 9 are coated on the polyester resin film 7, the polyester is dried. Unevenness and wrinkles do not occur on the resin film 7, and the polyester resin film 7 does not stretch due to the tension during coating, which is preferable. When the softening point of the polyester resin forming the polyester resin film 7 is less than 50 ° C., the polyester resin film 7 may be elongated by heating during processing,
Since the temperature during drying cannot be increased, the polyester resin film 7, the undercoat coating layer 8 and the dye receiving layer 9
There is a risk that the adhesiveness with Softening point 140 ℃
If it exceeds, the processability of the polyester resin film 7 may be deteriorated and curling may occur.

Here, the softening point is the temperature at which the resin viscosity (ratio of stress to plastic flow velocity) becomes 10 ¹² P (poise), and if the resin is left at this temperature, it will flow within 10 seconds. Temperature, which is measured according to JIS K7196. The method of measuring the softening point measured in the static load control mode (F control mode) using the viscoelasticity measuring device DMS6100 manufactured by Seiko Instruments Inc. will be described below. As the measuring method, first, a sample of a resin film of 1 cm × 4 cm is prepared. Next, the distance between the chucks is set to 2 cm, and the sample is set in the viscoelasticity measuring device. Next, with a load of 100 g and a temperature rising rate of 5 ° C./min, a temperature range of −20 to 20
The displacement of the resin film at 0 ° C is measured. The relationship between the displacement and temperature of the resin film at this time, the vertical axis is the displacement,
It is drawn as a displacement-temperature curve in which the horizontal axis indicates temperature. Next, in this displacement-temperature curve, an extension line that extends a straight line portion on the low temperature side from the point where the resin film begins to soften to the high temperature side and an extension line that extends the tangent line at the point where the displacement is maximum to the low temperature side. The point of intersection with the line is the softening point.

The polyester resin film 7 may contain the same thermoplastic resin as the surface base material 1, inorganic pigments, various additives and the like. The method for molding the polyester resin film 7 is not particularly limited, and like the surface base material 1, it can be appropriately selected from known methods and molded.

The polyester resin film 7 may be a multilayer film formed by laminating a plurality of resin films. Multilayer the polyester resin film 7,
When used as a multilayer film, two or more layers of the polyester resin film 7 may be laminated, or one or more other base film may be laminated on the polyester resin film 7 in one or more layers. In this case, an adhesive agent, a pressure-sensitive adhesive agent or the like may be used for lamination, if necessary. As the other base material film to be laminated on the polyester resin film 7, a transparent film is preferable, and examples thereof include crystalline polyester resin, acrylonitrile-butadiene-styrene copolymer resin, polycarbonate resin, polypropylene resin and other resin films, biodegradation. Resin film and the like. When another base material film is laminated on the polyester resin film 7 to form the transparent resin sheet 6, the polyester resin film 7 side is the image forming surface. Further, the undercoat coating layer 8 may be provided on the surface of the polyester resin film 7.

The method of laminating such resin films is not particularly limited, but for example, an adhesive obtained by mixing a curing agent such as an epoxy type or polyisocyanate type in a polyether resin or a polyester resin, or Epoxy based on acrylic resin and polyurethane resin,
There are a dry laminating method using a pressure-sensitive adhesive containing a curing agent such as polyisocyanate, and a sandwich laminating method in which a polyolefin resin is melt extruded and laminated between films to form an adhesive layer. Alternatively, a plurality of base material sheets may be laminated and thermocompression-bonded without using an adhesive or a pressure-sensitive adhesive.

By thus forming the polyester resin film 7 in multiple layers, the processability, heat resistance and solvent resistance of the polyester resin film 7 can be improved.

Further, the polyester resin film 7 includes
In order to improve the adhesiveness and wettability, known treatments such as corona discharge treatment, anchor coat treatment, antistatic treatment and the like may be performed within a range that does not impair the transparency of the polyester resin film 7.

On one side of the polyester resin film 7,
A dye receiving layer 9 may be provided, and an undercoat coating layer 8 is formed between the dye receiving layer 9 and the polyester resin film 7 to improve adhesiveness and solvent resistance of the polyester resin film 7. You may. The material forming the undercoat coating layer 8 contains a water-soluble or water-dispersible aqueous polymer resin as a main component. As the aqueous polymer resin, carboxymethyl cellulose, casein, dextrin, starch, modified starch, polyvinyl alcohol, modified polyvinyl alcohol, polyethylene oxide, polyvinyl pyrrolidone, polyvinyl methyl ether, polyacrylic acid, polyacrylamide, acrylic resin, polyester resin , Polyurethane resins and the like.
It is appropriately selected from these resins in consideration of solvent resistance, adhesiveness and the like.

Further, the undercoat coating layer 8 may contain a pigment within a range not impairing transparency. When the undercoat coating layer 8 contains a pigment, blocking resistance is improved when the undercoat coating layer 8 is formed and wound. As the pigment to be contained in the undercoat coating layer 8, a usual inorganic or organic pigment can be appropriately used. For example, oxides, hydroxides, sulfides, carbonates, sulfates, silicate compounds of various metals such as magnesium, calcium, zinc, barium, titanium, aluminum, antimony and lead,
Solid polymer fine powders such as polystyrene, polyethylene, and polyvinyl chloride are included. Among them, Kaolin,
The use of inorganic pigments such as talc, silica, gypsum, barite powder, alumina white, satin white, titanium oxide, and calcium carbonate improves the blocking resistance when the undercoat layer 8 is formed and wound up, which is preferable.

The amount of pigment contained in the undercoat coating layer 8 is
Adhesiveness of the undercoat coating layer 8, solvent resistance, it is appropriately determined in consideration of transparency, preferably 250 mass% or less in terms of solid content relative to the polymer resin forming the undercoat coating layer 8,
It is more preferably 200% by mass or less. When the content of the pigment exceeds 250% by mass, the solvent resistance of the undercoat coating layer 8 becomes insufficient, and the polyester resin film 7 may deteriorate due to the organic solvent and the transparency may decrease.

In the organic solvent which dissolves the polymer resin forming the undercoat layer 8, polyhydric alcohols such as ethylene glycol, glycerin, trimethylol propane and diethylene glycol, and polyalcohols such as polyethylene glycol and polypropylene glycol. Water-soluble plasticizers such as alkylene glycols, further inorganic salts, fillers, defoamers, wetting agents, leveling agents, curing agents, thickeners,
One or more of various additives such as a lubricant and a film-forming aid may be contained.

Further, the coating amount of the undercoat coating layer 8 is preferably 0.2 to 10 g / m ² by dry weight, more preferably from 0.5 to 3 g / m ^2. When the coating amount is less than 0.2 g / m ² , the solvent resistance is poor and the polyester resin film 7 may be deteriorated by the organic solvent. Coating amount is 10g / m
^If it exceeds ² , the effect is saturated and it is uneconomical.

The dye receiving layer 9 is formed on the undercoat coating layer 8 provided on one side of the polyester resin film 7, and dyes and fixes a sublimable dye which is thermally transferred from an ink sheet (ink ribbon). The dye-dyeable resin is included as a main component. Examples of the dye-dyeing resin forming the dye receiving layer 9 include polyester resin, vinyl chloride-vinyl acetate copolymer resin, polycarbonate resin, polyurethane resin, polyether resin, polyamide resin,
An acrylic resin, a cellulose derivative resin, etc. are mentioned.

The dye-dyeing resin forming the dye-receiving layer 9 preferably contains a cross-linking agent, a lubricant, a release agent, etc. as appropriate. By adding these, it is possible to prevent the transparent resin sheet 6 and the ink ribbon from being fused when the ink ribbon is heated by the thermal head to print on the dye receiving layer 9. In addition, the dye-dyeing resin that forms the dye-receiving layer 9 may include an antioxidant,
Additives such as pigments and ultraviolet absorbers may be added. These various additives may be mixed in advance with the polymer resin forming the dye receiving layer 9 and coated or printed on the undercoat coating layer 8. It may be formed on the layer 9.

The coating amount of the dye receiving layer 9 is preferably 1 to 12 g / m ^{2 on} a dry basis, and more preferably 2 to 8 g.
It is g / m ² . When the coating amount is less than 1 g / m ² , the image quality of the image printed on the dye receiving layer 9 may deteriorate or the gloss of the printed screen may decrease. If the coating amount exceeds 12 g / m ² , the dye receiving layer 9 may be too thick and the printing density may decrease, and it is uneconomical.

The undercoat coating layer 8 and the dye receiving layer 9
Is formed on the polyester resin film 7 by a coating method or a printing method. In the coating method, various devices such as an air knife coater, a rod blade coater, a gravure coater, a bar coater, a blade coater, a roll coater, a size press coater, and a slot die coater are appropriately used. In the printing method, various printing devices used for screen printing, offset printing, gravure printing, etc. are appropriately used. In particular,
When the undercoat coating layer 8 and the dye receiving layer 9 are partially formed on the polyester resin film 7, each layer can be formed at a predetermined position, and thus the printing method is preferable.

The transparent resin sheet 6 has a wavelength of 400 to
The transmittance of visible light of 750 nm is preferably 75% or more, more preferably 80% or more. Wavelength 40
If the transmittance of visible light of 0 to 750 nm is less than 75%, an inverted visible image described below becomes unclear and becomes difficult to recognize.
The thickness of the transparent resin sheet 6 is preferably 30 to 500 μm, more preferably 50 to 300 μm.
Is. When the thickness is less than 30 μm, the heat insulating property and elasticity are insufficient, and the density of the image printed by the thermal transfer printer may be low. On the other hand, if the thickness exceeds 500 μm, the thickness of the IC card produced using the transparent resin sheet 6, the front surface base material 1 and the back surface base material 2 increases, which is not preferable in practice.

Further, a reverse visible image can be printed on the dye receiving layer 9 of the transparent resin sheet 6 by a thermal transfer method. The reverse visible image printing method is to supply the reverse electric signal obtained by converting the information of a certain image or character to the information of the image or character inverted by 180 ° to the thermal head of the thermal transfer printer, and the heat supplied from this thermal head. The dye and the ink are transferred from the ink sheet to the dye receiving layer 9 in a predetermined amount from a required position and are dyed to form an image or a character to print a reverse visible image. An inverted visible image printed by such an inversion method is recognized as a normally identifiable visible image when viewed from the side where the dye receiving layer 9 is not formed.

In the IC card 20, the inverted visible image is formed by the sublimation dye layer 10 and / or the fused thermal transfer ink layer 11. The sublimation dye layer 10 and / or the fused thermal transfer ink layer 11 is printed on one surface 6a of the transparent resin sheet 6 by thermal transfer. Sublimation dye layer 10
Is formed using a sublimation transfer printer. The formation method is as follows. A sublimation transfer dye sheet having a dye layer containing a dye of yellow, magenta, or cyan that migrates by sublimation or melting diffusion by heating is superposed on the dye receiving layer 9, and the dye at a required position of the dye layer is stacked. Is transferred onto the dye receiving layer 9 by a predetermined amount by heat supplied from a thermal head or the like. The melt heat transfer ink layer 11 is formed using a melt heat transfer printer. The formation method is as follows: an ink sheet coated with an ink that melts by heating is pressed onto the dye receiving layer 9
It is formed by heating from the back surface of the ink sheet to instantly melt the hot melt transferable ink (particularly black) and transfer it onto the dye receiving layer 9. Further, by using a sublimation / melt heat transfer combined printer, the dye coated surface of the ink sheet coated with the sublimable dye and the heat melt transfer ink is superposed on the dye receiving layer 9, and the sublimation dye layer 10 and the melt heat transfer ink. The layer 11 may be formed. Since the transparent resin sheet 6 has the dye receiving layer 9 as described above, a high quality and clear image can be formed by using a sublimation / melt thermal transfer combined printer.

On the transparent resin sheet 6, a sublimation dye layer 10 and / or a melt thermal transfer ink layer 11 for forming an inverted visible image are printed on the dye receiving layer 9, and then a protective layer 12 is formed on the image forming surface thereof. It may be formed. Protective layer 1
Examples of the material forming 2 include polyester resin, acrylic resin, vinyl chloride-vinyl acetate copolymer resin, polyvinyl acetal resin such as polyvinyl butyral, cellulose resin such as cellulose acetate butyrate, S
Examples thereof include BR latex, NBR latex, acrylic emulsion, starch, and aqueous resins such as polyvinyl alcohol. In addition, the material forming the protective layer 12 includes clay, calcium carbonate, titanium dioxide, alumina hydroxide, satin white, as long as the transparency is not impaired.
Inorganic pigments such as silica, magnesium oxide and barium sulfate may be contained.

The method of forming the protective layer 12 is carried out by forming the protective layer 12 on the sublimation dye layer 10 and / or the melt thermal transfer ink layer 11 formed on the dye receiving layer 9 which constitutes the transparent resin sheet 6, and forming the protective layer 12 on the substrate. A method of forming a protective layer 12 by superimposing a transfer protective layer made of the above resin and transferring the transfer protective layer onto the sublimation dye layer 10 and / or the molten thermal transfer ink layer 11 by heating (hereinafter, referred to as " Transfer method)), a method in which a transparent resin film is adhered and laminated on the sublimation dye layer 10 and / or the molten thermal transfer ink layer 11 (hereinafter, also referred to as “adhesion method”).

As a transfer method, a sublimable dye and /
Alternatively, a transfer protection layer is provided on an ink sheet coated with the heat-melt transfer ink, and the sublimation dye layer 10 is formed by a printer.
Immediately after printing the melt heat transfer ink layer 11 and / or the sublimation dye layer 10 and / or the melt heat transfer ink layer 1
1. A method of transferring the protective layer for transfer onto 1 to form the protective layer 12, the protective layer for transfer is provided on a resin film different from the ink sheet, and the sublimation dye layer 10 and / or the melt thermal transfer ink layer 11 is formed. After printing, there is a method in which the transfer protective layer provided on the resin film is heated and transferred onto the sublimation dye layer 10 and / or the melt thermal transfer ink layer 11 by a printer or the like to form the protective layer 12. The resin film used here is not particularly limited as long as it is a resin film generally used for an ink sheet, such as a PET film.

The protective layer 12 has a wavelength of 300 to 40.
It is preferable that a UV absorber that absorbs 0 nm UV is blended. By blending an ultraviolet absorber, it is possible to prevent the sublimation dye layer 10 and / or the fused thermal transfer ink layer 11 that have been printed from being deteriorated by ultraviolet rays. Examples of the ultraviolet absorber include benzophenone-based compounds, triazole-based compounds, salicylate-based compounds and the like, and these are appropriately selected and used. Further, the protective layer 12 may be blended with a fluorescent dye, a fluorescent pigment, a phosphorescent pigment, or the like. If these dyes and pigments are mixed, forgery of the IC card can be prevented. It is also possible to form a thermal transfer image by providing a dye receiving layer on the surface base material 1 of the card-shaped laminate 5 if necessary.

Further, in the IC card 20, a back surface coating layer may be formed on the exposed surface 5b of the card-shaped laminate 5. By forming the back cover layer, it is possible to prevent static electricity from being generated in the IC card 20.

Examples of the resin forming the back surface coating layer include acrylic resins, epoxy resins, polyester resins, phenol resins, alkyd resins, urethane resins, melamine resins, and reaction cured products of these resins.

The back coating layer may contain various conductive agents for the purpose of preventing static electricity. As the conductive agent, polyethyleneimine, an acrylic polymer containing a cationic monomer, a cation-modified acrylamide polymer, and a cationic polymer such as cationized starch are preferably used. The coating amount of the back surface coating layer is preferably 0.3 to 15 g / m ² in terms of dry mass, more preferably 0.
It is 5 to 5 g / m ² . When the coating amount is less than 0.3 g / m ² , the antistatic effect is insufficient, and the coating amount is 15
If it exceeds g / m ² , the effect is saturated and it is uneconomical.

Further, in the IC card 20, the sublimation dye layer 1
Since the inverted visible image composed of 0 and / or the fused thermal transfer ink layer 11 is laminated on the inner layer side, the image storability is good and it is difficult to rewrite the image.
It is difficult to falsify or forge IC cards.

The outline of the method of manufacturing the IC card 20 will be described below. As a first method, first, the IC module 4 is mounted on one surface 1a of the front surface base material 1 or on one surface 2a of the back surface base material 2. Next, the front surface base material 1 or the back surface base material 2 on which the IC module 4 is not mounted is overlapped. Next, the front surface 1 and the back surface 2 of the laminate are sandwiched between two metal plates. Next, the laminate sandwiched between the metal plates is provided in a hot press machine, and is pressure-bonded under a predetermined press condition (press temperature, press pressure, press time) to be bonded. After cooling to room temperature in the pressed state, the obtained laminated body is taken out and molded into a card shape by a punching machine to obtain a card-shaped laminated body 5. Next, a reverse visible image composed of the sublimation dye layer 10 and / or the melt thermal transfer ink layer 11 is formed on the surface of the transparent resin sheet 6 by using a sublimation / melt thermal transfer combined printer, and subsequently, on the reverse visible image. Then, the protective layer 12 is thermally transferred. Next, the transparent resin sheet 6 is superposed on the surface of the surface base material 1 of the card-shaped laminate 5 so that the surface of the dye receiving layer 9 on which the inverted visible image is formed is the inner side. Next, this laminated product is sandwiched between two metal plates. Next, the laminate sandwiched between the metal plates is provided in a hot press machine, and is pressure-bonded under a predetermined press condition (press temperature, press pressure, press time) to be bonded. After being cooled to room temperature in the pressed state, it is peeled off from the metal plate to obtain the IC card 20.

For the lamination of the card-shaped laminate 5 and the transparent resin sheet 6, not only the above-mentioned thermocompression bonding but also a known adhesive or pressure-sensitive adhesive may be used.
Hot melt glue or the like is preferably used. According to the thermocompression bonding method, the transparency of the transparent resin sheet 6 is not impaired by the adhesive or the pressure-sensitive adhesive, and as a result,
There is no deterioration in the image quality of the inverted visible image, a clear image is obtained, and sufficient adhesive strength is obtained.

The conditions of hot pressing are as follows:
It can be appropriately set according to the material of the back surface substrate 2, the transparent resin sheet 6, the type of the adhesive layer 3, the type of the IC module 4, and the like. The pressing temperature can be arbitrarily set between 20 ° C. and 250 ° C., but the pressing temperature when the adhesive is used as the adhesive layer 3 is preferably 60 to 200 ° C., and when the adhesive is used, the pressing temperature is 20 to 20 ° C. 100 ° C. is preferred.

[0059]

EXAMPLES The effects of the present invention will be clarified below with reference to specific examples.

(Example 1) (Preparation of transparent resin sheet) A transparent PETG film (trade name: Diafix PG-CHI, thickness 100 μm) comprising a terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer resin as a substrate. A general type (polycondensate of dimethyl terephthalate 100 mol%, ethylene glycol 70 mol%, 1,4-cyclohexanedimethanol 30 mol%), softening point 69 ° C., manufactured by Mitsubishi Plastics, Inc.) is prepared. The composition of (Paint-1)
Print using a screen printer (trade name: PC605, manufactured by Tokai Shoji Co., Ltd.) so that the dry mass is 2 g / m ^2, and dry to coat the undercoat layer (1 screen: 30 mm × 40 m).
m) was formed. Next, (Paint-2) having the following composition is printed on this undercoat coating layer using a screen printer (trade name: PC605, manufactured by Tokai Shoji Co., Ltd.) so that the dry mass is 4 g / m ^2. Then, the dye receiving layer was formed by drying to obtain a transparent resin sheet. (Paint-1) Polyvinyl alcohol resin (trade name: Gohsenol NL05, saponification degree 100%, manufactured by Nippon Synthetic Chemical Industry) 100 parts by weight Butyl cellosolve-based wetting agent (trade name: Dapro U99, manufactured by San Nopco) 0.5 parts by weight (Paint-2) Polyester resin (Brand name: Byron 200, manufactured by Toyobo Co., Ltd.) 100 parts by mass Silicone oil (Brand name: KF393, manufactured by Shin-Etsu Silicon Co., Ltd.) 1 part by mass Isocyanate (Brand name: Takenate D-110N, Takeda Pharmaceutical Co., Ltd.) 5 parts by mass Toluene 200 parts by mass

(Formation of Reversed Visible Image) Commercially available thermal transfer color printer for card (trade name: NCP100, manufactured by Nozaki Printing Paper Co., Ltd., ribbon: yellow, magenta, cyan (sublimation) + black (melting) + over-lamination, Nozaki (Printed by the Printing Paper Industry Co., Ltd.) is used to supply a reversal electric signal consisting of characters, a solid portion and a facial photograph to a thermal head of a thermal transfer color printer, and the thermal head gradually heats the ink ribbon to cause characters, An inverted visible image consisting of a solid image and a facial photograph was thermally transferred onto the surface of the dye receiving layer of the transparent resin sheet. Using this thermal transfer color printer for cards, the energy supplied to the ink ribbon from the thermal head is changed stepwise to obtain a black 10 gradation image obtained by mixing sublimation transfer dyes of yellow, magenta and cyan. Heat transfer was performed on the surface of the dye receiving layer of the transparent resin sheet.

(Production of Inlet) An insulating substrate film (trade name: Tetron S, thickness 175 μm, material: polyethylene terephthalate, Teijin Ltd.) was prepared. First,
On the back side of this insulating substrate film, the (paint-
3) was applied and dried so that the dry mass was 1 g / m ² , to form an antistatic layer. Next, a 3-turn winding antenna and a circuit were formed on the front surface side of this insulating substrate film using a silver paste by a screen printing method. An IC chip (model number: SLE44R31, thickness 185 μm, manufactured by Siemens) was mounted by face bonding at a predetermined position on the winding antenna and the circuit via an anisotropic resin to obtain an inlet. (Paint-3) Acrylic resin (trade name: Ricabond SAR-615A, manufactured by Chuo Rika Co., Ltd.) 100 parts by mass Epoxy curing agent (trade name: Ricabond SAR-615B, manufactured by Chuo Rika Co., Ltd.) 5 parts by mass Conductive agent (trade name: ST2000H, manufactured by Mitsubishi Petrochemical Co., Ltd.) 75 parts by mass Silica pigment (trade name: P78A, manufactured by Mizusawa Chemical Co., Ltd.) 30 parts by mass

(Preparation of card-like laminate) A highly concealing white PETG film (trade name: Diafix PG-WHI) made of terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer resin with titanium oxide added as a surface substrate. , 100 μm thick, general type, softening point 69 ° C., manufactured by Mitsubishi Plastics, Inc.) were prepared. In addition, a highly concealed white PETG film (trade name: Deiafix PG-WHI, thickness 200 μm, general type, softened) made of terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer resin to which titanium oxide was added as a back surface substrate. 69 ° C., manufactured by Mitsubishi Plastics Co., Ltd.) was prepared. Next, the back surface substrate, sheet-shaped polyester adhesive, inlet,
The sheet-shaped polyester adhesive and the surface base material were laminated in this order. Next, this laminate is sandwiched between matte-finished stainless steel plates, and the press temperature is 120 ° C. and the pressure is 5 kg.
It was held at f / cm ² for 10 minutes and bonded. next,
The laminated body thus laminated was cooled to room temperature, peeled off from the stainless steel plate, and the obtained laminated body was molded into a card mold (55 mm in length × 85 mm in width) by a punching machine to obtain a card-shaped laminated body. The thickness of the obtained card-shaped laminate is 760 μm.
Met.

(Production of IC Card) The transparent resin sheet is brought into contact with the surface of the surface substrate of the card-shaped laminate so that the surface of the dye receiving layer on which the inverted visible image is formed is in contact, and the receiving layer portion is the card surface. Overlap so that it is almost in the center of
This laminate is sandwiched between matt-finished stainless steel plates and pressed at a temperature of 120 ° C. and a pressure of 5 kgf / cm ² for 10 minutes.
It was held for a minute and laminated. Next, the laminated body thus laminated is cooled to room temperature and peeled off from the stainless steel plate,
I got an IC card. The thickness of the obtained IC card is 860
was μm.

(Example 2) (Preparation of transparent resin sheet) A transparent PETG film (trade name: Diafix PG-CHI, thickness 100 μm) comprising a terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer resin as a substrate. A general type (polycondensate of dimethyl terephthalate 100 mol%, ethylene glycol 70 mol%, 1,4-cyclohexanedimethanol 30 mol%), softening point 69 ° C., manufactured by Mitsubishi Plastics, Inc.) is prepared. Composition of (Paint-4)
Print using a screen printer (trade name: PC605, manufactured by Tokai Shoji Co., Ltd.) so that the dry mass is 2 g / m ^2, and dry to coat the undercoat layer (1 screen: 30 mm × 40 m).
m) was formed. Example 1 was then applied to this undercoat layer.
(Paint-2) is printed using a screen printing machine (trade name: PC605, manufactured by Tokai Shoji Co., Ltd.) so that the dry mass is 4 g / m ^2, and dried to form a dye receiving layer, which is transparent. A resin sheet was obtained. (Paint-4) Polyvinyl alcohol resin (trade name: Gohsenol GL05, saponification degree 87%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 100 parts by mass Butyl cellosolve-based paint (trade name: Dapro U99, manufactured by San Nopco Co., Ltd.) 0.5 parts by mass

(Formation of Inverted Visible Image) In the same manner as in Example 1, an inverted visible image consisting of characters, solid portions and a facial photograph was thermally transferred onto the surface of the dye receiving layer of the transparent resin sheet.
Further, in the same manner as in Example 1, a black 10 gradation image obtained by mixing sublimation transfer dyes was thermally transferred onto the surface of the dye receiving layer of the transparent resin sheet.

(Production of Inlet) An inlet was obtained in the same manner as in Example 1.

(Preparation of card-shaped laminate) A highly concealing white color composed of 75 parts by mass of a terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer resin containing titanium oxide as a surface substrate and 25 parts by mass of an aromatic polycarbonate resin. Using a modified PETG film (trade name: Diafix PG-WHT, thickness 100 μm, softening point 80 ° C., Mitsubishi Plastics Co., Ltd.), terephthalic acid-ethylene glycol-cyclohexanedimethanol to which titanium oxide was added as a back surface substrate. Highly concealed white modified P consisting of 75 parts by weight of a copolymer resin and 25 parts by weight of an aromatic polycarbonate resin
ETG film (Product name: Diafix PG-WH
A card-shaped laminate was obtained in the same manner as in Example 1 except that T, thickness 200 μm, softening point 80 ° C., manufactured by Mitsubishi Plastics, Inc. was used. The thickness of the obtained card-shaped laminate was 760 μm.

(Production of IC Card) An IC card was prepared in the same manner as in Example 1 except that the card-shaped laminate obtained above was used.
Got a card The thickness of the obtained IC card is 860 μm
Met.

(Example 3) (Production of transparent resin sheet) In the same manner as in Example 1, a transparent resin sheet was obtained. (Formation of inverted visible image) In the same manner as in Example 1, characters,
An inverted visible image consisting of a solid image and a facial photograph was thermally transferred onto the surface of the dye receiving layer of the transparent resin sheet. Further, in the same manner as in Example 1, a black 10 gradation image obtained by mixing sublimation transfer dyes was thermally transferred onto the surface of the dye receiving layer of the transparent resin sheet.

(Production of Inlet) An inlet was produced in the same manner as in Example 1. (Preparation of card-like laminate) Highly concealed white modified PETG consisting of 52 parts by mass of terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer resin to which titanium oxide was added as a surface substrate and 48 parts by mass of aromatic polycarbonate resin Film (trade name: Trepalloy UW, thickness 1
00 μm, softening point 128 ° C., manufactured by Toray Synthetic Film Co., Ltd.) was used, and a PETG film similar to the front surface substrate was used as the back substrate, except that the thickness was 200 μm. A card-shaped laminate was produced in the same manner as in Example 1 except for the above. The thickness of the obtained card-shaped laminate was 760 μm.

(Production of IC Card) An IC card was obtained in the same manner as in Example 1 except that the card-shaped laminate obtained above was used and the pressing temperature was 140 ° C. Obtained I
The thickness of the C card was 860 μm.

Example 4 (Preparation of transparent resin sheet) A modified transparent PETG film comprising 75 parts by mass of terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer resin and 25 parts by mass of aromatic polycarbonate resin as a substrate ( Trade name: Deiafix PG-CHT, thickness 100 μm, heat resistant type, softening point 80 ° C., manufactured by Mitsubishi Plastics Co., Ltd.) is prepared, and (Paint-4) of Example 2 is dried on one side with a dry mass of 2 g / m. ² was printed using a screen printer (trade name: PC605, manufactured by Tokai Shoji Co., Ltd.) and dried to form an undercoat coating layer (1 screen 30 mm × 40 mm). Next, the undercoat coating layer on, Example 1 of (paint -2) the dry mass 4g / m ² and composed as screen printing machine (trade name:
PC605, manufactured by Tokai Shoji Co., Ltd.) was used for printing and drying to form a dye receiving layer, and a transparent resin sheet was obtained.

(Formation of Inverted Visible Image) In the same manner as in Example 1, an inverted visible image consisting of characters, solid portions and a facial photograph was thermally transferred onto the surface of the dye receiving layer of the transparent resin sheet.
Further, in the same manner as in Example 1, a black 10 gradation image obtained by mixing sublimation transfer dyes was thermally transferred onto the surface of the dye receiving layer of the transparent resin sheet.

(Preparation of Inlet) An inlet was obtained in the same manner as in Example 1.

(Preparation of Card-Like Laminate) As a surface base material, a high concealment modifier comprising 75 parts by mass of terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer resin, 25 parts by mass of aromatic polycarbonate resin and 10 parts by mass of titanium oxide. Using a white PETG film (trade name: Deiafix PG-WHT, thickness 100 μm, heat-resistant type, softening point 80 ° C., manufactured by Mitsubishi Plastics Co., Ltd.), a terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer as a back substrate. Highly concealed modified white PETG film consisting of 75 parts by weight of resin, 25 parts by weight of aromatic polycarbonate resin, and 10 parts by weight of titanium oxide (trade name: Deiafix PG-WHT, thickness 200 μm, heat resistant type, softening point 8
A card-shaped laminate was obtained in the same manner as in Example 1 except that 0 ° C., manufactured by Mitsubishi Plastics, Inc. was used. The thickness of the obtained card-shaped laminate was 760 μm.

(Production of IC Card) An IC card was prepared in the same manner as in Example 1 except that the card-shaped laminate obtained above was used.
Got a card The thickness of the obtained IC card is 860 μm
Met.

(Example 5) In (Preparation of transparent resin sheet) of Example 1, the terephthalic acid-ethylene glycol-cyclohexanedimethanol co-polymer was used as a transparent resin sheet without forming the undercoat layer and the dye receiving layer. An IC was prepared in the same manner as in Example 1 except that a transparent PETG film made of a polymer resin (trade name: Diafix PG-CHI, thickness 100 μm, general type, softening point 69 ° C., manufactured by Mitsubishi Plastics, Inc.) was used as it was. Got a card Obtained I
The thickness of the C card was 860 μm.

(Example 6) Pellets of terephthalic acid-ethylene glycol-cyclohexanedimethanol copolymer resin (trade name: Easter DN003, dimethyl terephthalate 100 mol%) were used in Example 1 (Preparation of transparent resin sheet). Ethylene glycol 35 mol%, 1,
After vacuum-drying a polycondensate of 4-cyclohexanedimethanol 65 mol%, softening point 55 ° C., manufactured by Eastman Chemical Co., Ltd., it is fed to an extruder, melted by heating, extruded from a T-die, and cast in a semi-mirror form. Electrostatically charged (7KV) cast on drum, transparent P with thickness of 100μm
An ETG film was obtained. An IC card was produced in the same manner as in Example 1 except that the transparent PETG film obtained above was used as a transparent resin sheet without forming the undercoat layer and the dye receiving layer. The thickness of the obtained IC card was 860 μm.

(Comparative Example 1) In Example 1 (formation of an inverted visible image), an electric signal composed of characters and a facial photograph was supplied to a thermal head of a thermal transfer color printer by using a thermal transfer color printer for a card. A thermal head that heats the ink ribbon in stages to thermally transfer the image to the surface of the dye-receiving layer of the transparent resin sheet. Instead of using a reversal electric signal, a reversal process is not performed. An IC card was obtained in the same manner as in Example 1 except that a visible image was formed by supplying the electric signal of 1 to the thermal head. The thickness of the obtained IC card was 860 μm.

(Comparative Example 2) In (Preparation of IC card) of Example 1, a transparent resin sheet was provided on the surface of the surface substrate of the card-shaped laminate, and the surface of the dye-receiving layer on which the inverted visible image was formed was The same procedure as in Example 1 was repeated except that the surface of the dye receiving layer on which the reverse visible image of the transparent resin sheet was formed was the outer side instead of the inner side being laminated to form a laminate. I got an IC card. The thickness of the obtained IC card was 860 μm.

(Comparative Example 3) In (Preparation of transparent resin sheet) of Example 1, a transparent vinyl chloride resin film (trade name: HISHI) was used as a transparent resin sheet without forming an undercoat layer and a dye receiving layer. Rex MB-S, thickness 100
μm, manufactured by Mitsubishi Plastics Co., Ltd.) was used in the same manner as in Example 1 except that an IC card was obtained. The thickness of the obtained IC card was 860 μm.

(Comparative Example 4) In (Preparation of transparent resin sheet) of Example 1, a transparent polyethylene terephthalate resin film (trade name: Tetron) was used as a transparent resin sheet without forming an undercoat layer and a dye receiving layer. S, thickness 100 μm, softening point 200 ° C., manufactured by Teijin Ltd.) was used as it is, and in (manufacturing of IC card), the card-shaped laminate and the transparent resin sheet were bonded via a sheet-shaped polyester adhesive. An IC card was obtained in the same manner as in Example 1. The thickness of the obtained IC card was 910 μm.

(Comparative Example 5) In (Preparation of transparent resin sheet) of Example 1, a transparent polyethylene terephthalate resin film (trade name: Tetron S, thickness 10) was used as a substrate.
0 μm, softening point 200 ° C., manufactured by Teijin Ltd., (IC
An IC card was prepared in the same manner as in Example 1 except that the card-shaped laminate and the transparent resin sheet were bonded together via a sheet-shaped polyester adhesive.

(Comparative Example 6) A transparent polyethylene terephthalate resin film (trade name: Tetron S, thickness 10) was used as a substrate in (Preparation of transparent resin sheet) of Example 1.
An IC card was produced in the same manner as in Example 1 except that 0 μm, a softening point of 200 ° C., manufactured by Teijin Ltd. was used. However, in (Production of IC card), the transparent resin sheet on which the inverted visible image was formed and the card-shaped laminate could not be bonded and laminated, and an IC card could not be obtained.

Regarding the IC cards obtained in Examples 1 to 6 and Comparative Examples 1 to 6, the following items were evaluated. (1) Appearance Evaluation The printed state of characters, face photographs, etc. of the IC card on which the inverted visible image was formed was visually evaluated. Evaluation criteria
It is as follows. ◯: It could be easily identified. X: Characters and the like were reversed and it was difficult to identify.

(2) Frictional Strength A PET film is superposed on the surface of the IC card on which the inverted visible image is formed, and this PET film is tested for surface property (trade name: Haydon-14DR, Shinto Kagaku Co., Ltd. Manufactured by K.K.) was rubbed against the surface of the IC card on the side on which the inverted visible image was formed with a load of 100 g / cm ² for 50 reciprocations, and the state of scratches on the surface was visually evaluated. The evaluation criteria are as follows. ◯: The inverted visible image was not scratched. X: The inverted visible image was scratched.

(3) Printing Density With respect to a black 10 gradation image obtained by mixing sublimation transfer dyes printed on an IC card, the printing density was measured by a Macbeth reflection densitometer (trade name: RD-914, KOllMO).
RGEN) was used to measure the reflection density at different applied energies. The print density of the sublimation transfer dye was evaluated by the maximum black density value. Further, the reflection density of the solid image portion of the heat-melt transferable ink transfer portion printed on the IC card was measured using a Macbeth reflection densitometer (trade name: RD-914, manufactured by KOllmorgen). The print density of the heat-melt transfer ink was evaluated by the maximum black density value.

(4) Image uniformity Regarding the image uniformity of the recorded image in the gradation portion where the reflection density of black obtained by mixing the sublimation transfer dye is 1.0, the presence or absence of light and shade spots, the presence or absence of white spots, etc. Was visually evaluated. The evaluation criteria are as follows. ⊚: No shades or white spots were observed. ○: A slight amount of light and shade spots and white spots were observed. Δ: Light and dark spots and white spots were slightly observed. X: Conspicuous shading and white spots were observed.

(5) Combustion test The IC card was burned to evaluate whether or not harmful gas was generated. The evaluation criteria are as follows. ◯: No harmful gas was generated. X: A harmful gas containing chlorine was generated.

(6) IC card moldability When a transparent resin sheet is used and laminated in a card-like laminate, the one which can be thermocompression-bonded is designated as A, and the one which requires an adhesive such as hot melt glue is designated as B.

(7) Curl of IC Card The convex side of the IC card was left in contact with the horizontal surface, and the heights of the four corners from the flat surface were measured to obtain an average value.
The evaluation criteria are as follows. ◯: Curling of IC card is less than 3 mm ×: Curling of IC card is 3 mm or more, and evaluation results of (1) to (7) are shown in Table 1.

[0093]

[Table 1]

From the results shown in Table 1, it was confirmed that the IC cards of Examples 1 to 6 were excellent in image storability, thermal transfer printability, workability and the like.

[0095]

As described above, the IC card of the present invention comprises a card-shaped laminate having a front surface substrate, an IC chip and a back substrate laminated in this order, and a polyester resin having a softening point of 50 to 140 ° C. An IC card comprising a transparent resin sheet having a reverse visible image formed on at least one surface thereof as a main component, wherein the front surface base material and the back surface base material have a polyester resin as a main component, Since the surface on which the inverted visible image of the transparent resin sheet is formed is the inside, it is laminated on the surface of the card-shaped laminate,
It is possible to obtain an image having a good quality and similar to a silver salt photograph, and having an excellent storability even against abrasion. Therefore, it is possible to obtain an IC card that is difficult to be altered or forged. Since the transparent resin sheet is thermocompression-bonded to the surface of the card-shaped laminate, a clear image can be obtained without deterioration of image quality and sufficient adhesive strength can be obtained. Since a dye receiving layer containing a dye-dyeing resin is provided on part or all of one side of the transparent resin sheet, a sublimation dye and a heat-melt transfer ink are applied using a sublimation / melt heat transfer combined printer. Dye coated surface of the ink sheet,
By superimposing it on the dye receiving layer, a high quality image can be formed. Since the polyester resin forming the transparent resin sheet contains 5 mol% or more of cyclohexanedimethanol residues, the processability of the transparent resin sheet is improved and curling does not occur. The transparent resin sheet has a transmittance of visible light having a wavelength of 400 to 750 nm of 7
Since it is 5% or more, the image formed on the dye receiving layer of the transparent resin sheet can be clearly recognized.

[Brief description of drawings]

FIG. 1 is a sectional view showing an example of an IC card of the present invention.

FIG. 2 is a cross-sectional view showing an example of a transparent resin sheet constituting the IC card of the present invention.

[Explanation of symbols]

1 ... Front substrate, 2 ... Back substrate, 3 ... Adhesive layer, 4 ...
IC module, 5 ... Card-shaped laminate, 6 ... Transparent resin sheet, 7 ... Polyester resin film, 8 ... Undercoat coating layer, 9 ... Dye receiving layer, 10 ... Sublimation Dye layer, 11 ...
・ Melting heat transfer ink layer, 12 ... Protective layer, 20 ... IC card

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kyoko Uchida             Made by Oji 1-10-6 Shinonome, Koto-ku, Tokyo             Paper Co., Ltd. Shinonome Research Center F-term (reference) 2C005 MA02 MA11 MA12 PA03 PA04                       PA15 PA18 PA21 PA23 PA29                       RA04 RA09                 5B035 BA05 BB09 BB12 CA01

Claims (5)

[Claims] 1. A card-shaped laminate in which a front surface substrate, an IC chip and a back surface substrate are laminated in this order, and a softening point of 50 to 1
A transparent resin sheet containing a polyester resin at 40 ° C. as a main component and having a reverse visible image formed on at least one surface thereof;
An IC card comprising: a front-side base material and a back-side base material containing a polyester resin as a main component, wherein a surface of the transparent resin sheet on which an inverted visible image is formed is an inside. An IC card that is laminated on the surface of the body. 2. The IC card according to claim 1, wherein the transparent resin sheet is thermocompression bonded to the surface of the card-shaped laminate. 3. The IC card according to claim 1, wherein a part of or all of one surface of the transparent resin sheet is provided with a dye receiving layer containing a dye-dyeing resin. 4. The polyester resin forming the transparent resin sheet contains 5 mol% or more of cyclohexanedimethanol residues among residues derived from polyhydric alcohol. I described in crab
C card. 5. The transparent resin sheet has a wavelength of 400 to 7
5. The IC card according to claim 1, wherein the visible light of 50 nm has a transmittance of 75% or more.