JP2003108269A - Structure and method for cooling of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently cool a CPU or an electronic part as a heating element of high heating value installed in a personal computer. SOLUTION: In a structure for cooling of electronic part, a high temperature area 1 installs a CPU 8 given a central role of the personal computer, a chip set 9 placed adjacent to the CPU 8, a memory 10 placed adjacent to the CPU 8 and the chip set 9, and a graphic board 11. A low temperature area 2 installs a power supply 12 and drives 13, 14 and 15 driving an external storage medium, wherein the temperature area 1 and 2 are separated by a partition wall 3. The temperature area 1 is cooled by a CPU cooling fan 8a installed tightly in the CPU 8, a heatsink and an additional fan, and the temperature area 2 is cooled by a power supply fan 12a installed tightly in the power supply 12. The partition wall 3 is formed by a riser board 5 and a riser bracket 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure and a cooling method for cooling electronic components inside a personal computer, and more particularly to a cooling structure and a cooling method for cooling electronic components inside a compact desktop personal computer. Regarding

[0002]

2. Description of the Related Art With the spread of the Internet, SOHO
In small offices such as (small offices, home offices) and offices installed in private homes, the compactness of desktop personal computers is increasingly required to accommodate the small space. On the other hand, CP
With the evolution of U, the amount of heat generated from the CPU increases year by year,
As a result, the inside of the main body of the desktop personal computer is in a high temperature state.

In order to eliminate such a high temperature condition, conventionally, a cooling structure in which a cooling fin by heat conduction and a cooling fan by heat radiation are integrally formed, that is, a heat sink with a fan is closely mounted on a CPU for cooling. A structure has been proposed.

FIG. 10 is a plan view showing a cooling structure of the conventional desktop personal computer described above. In this conventional example, as shown in the same figure, a CPU 8 is arranged at one corner inside a personal computer, and is provided with a CPU cooling fan 8a for cooling the CPU 8. Also, C
A chipset 9 and a memory 10 are mounted adjacent to the PU 8, a graphic board 11 and a riser board 5 are mounted at a position slightly distant from the CPU 8, and electronic components of relatively low temperature are mounted on a part further distant from the CPU 8. . In addition, the power supply device 12 is placed at a position farthest from the CPU 8.
And is provided with a power supply fan 12a for cooling the power supply 12. A floppy (registered trademark) disk drive (hereinafter, referred to as FDD) 13, a hard disk drive (hereinafter, referred to as HDD) 14, a CD-ROM drive 1 are provided at a position slightly apart from the CPU 8.
Drives such as 5 are arranged.

Therefore, the cooling structure of the electronic component of this example is as follows.
The CPU 8 and the CPU 8 are provided by the CPU cooling fan 8a and the heat sink closely mounted on the CPU 8 and the power supply fan 12a closely mounted on the power supply 12.
A high heat generation chipset 9 mounted adjacent to
Due to the pattern, the memory 10 mounted adjacent to the CPU 8 and the chip set 9 and other various electronic components are cooled.

[0006]

However, in the above-described conventional cooling structure for electronic components, the entire inside of the personal computer is collectively cooled, so that C
With the CPU cooling fan and heat sink closely mounted on the PU, as described above, only the CPU that heats up at a higher temperature is cooled with the evolution of the CPU, and even the chipset and the memory adjacent to the CPU cannot be cooled. It was difficult to cool the electronic components mounted on the graphic board and riser board. Also,
For the above-mentioned reason, the power supply fan also only cools the power supply itself and cannot cool other electronic components.

Therefore, in the conventional cooling structure for electronic parts, in order to cool the entire inside of the personal computer, a large-scale heat sink and a fan must be provided, and there is a problem that downsizing cannot be realized. It was

The present invention has been made in view of the above-mentioned circumstances, and provides a cooling structure and a cooling method for efficiently cooling a CPU and other electronic parts which are high heat generating elements arranged inside a personal computer. Is intended.

[0009]

In order to solve the above-mentioned problems, the invention according to claim 1 relates to a cooling structure for electronic parts, and relates to a high temperature region and a low temperature region inside an information equipment terminal having a predetermined cooling device. It is characterized in that the predetermined cooling device is configured to individually cool each area.

According to a second aspect of the present invention, there is provided an electronic component cooling structure according to the first aspect, wherein the information equipment terminal is:
It is characterized by being a personal computer.

The invention according to claim 3 relates to a cooling structure for electronic parts according to claim 2, wherein the personal computer comprises a CPU (central processing unit), a CPU cooling fan for cooling the CPU, and / or It is characterized by comprising a heat sink, a power supply device, and a power supply device fan for cooling the power supply device.

According to a fourth aspect of the present invention, there is provided an electronic component cooling structure according to the third aspect, wherein the CPU cooling fan and / or the heat sink is used to cool the electronic component in the high temperature region, and The power supply fan is used to cool the electronic components in the low temperature region.

The invention according to claim 5 relates to the cooling structure for an electronic component according to claim 3 or 4, wherein the area separating means is a partition wall.

The invention according to claim 6 relates to the cooling structure for electronic parts according to claim 5, characterized in that the partition wall is composed of one rectangular flat plate.

The invention according to claim 7 relates to the cooling structure for electronic parts according to claim 5, wherein the partition wall comprises a riser board used as an expansion board and a riser bracket to which the riser board is attached. It is characterized by being.

The invention according to claim 8 relates to the cooling structure for an electronic component according to claim 7, characterized in that the riser bracket is formed of one rectangular flat plate.

The invention according to claim 9 relates to the cooling structure for electronic parts according to claim 8, wherein the riser bracket is formed by bending in accordance with the high temperature region and the low temperature region. I am trying.

The invention according to claim 10 is the invention according to claim 7.
In the cooling structure for an electronic component according to any one of 1 to 9, the riser bracket includes an L-shaped hook provided at one end in the widthwise center and a ridge provided at both ends in the widthwise direction. And a screw portion provided at the center of the other end in the width direction, the riser board has one end locked by the raised portion and the hook and the other end fixed by a screw. It is characterized by being.

The invention according to claim 11 is the invention according to claim 7.
The electronic component cooling structure according to any one of 1 to 9, wherein the riser board is attached to the riser bracket with a screw.

The invention according to claim 12 is the same as claim 3
13. The electronic component cooling structure according to any one of 1 to 11, wherein the personal computer includes a CPU cooling fan duct that is provided on the CPU cooling fan and sends air to the CPU cooling fan. I am trying.

The invention according to claim 13 is the same as claim 1.
According to the cooling structure of the electronic component described in 2, a plurality of ventilation holes are provided at predetermined positions on the top surface and side surfaces of the personal computer, and the CPU cooling fan duct communicates with the plurality of ventilation holes. It has a feature.

The invention according to claim 14 is the same as claim 3
According to the cooling structure for an electronic component described in any one of 1 to 13, the personal computer is characterized by including an additional fan on a side facing the CPU cooling fan.

The invention according to claim 15 is the same as claim 3
14. The cooling structure for an electronic component according to any one of 1 to 14, wherein the electronic component has an SMT (surface mounting technique).
ology) is characterized by being mounted on the board.

The invention according to claim 16 is the same as claim 3
The personal computer according to any one of claims 1 to 15, wherein the personal computer includes a memory for storing various programs and data, a chipset inserted between the CPU and the memory, and an external recording. A drive for driving the medium is further provided.

The invention described in claim 17 is the same as claim 1.
6. The cooling structure for electronic parts according to 6, wherein the CPU, the chipset, and the memory are mounted in the high temperature region, and the power supply device and the drive are mounted in the low temperature region. I am trying.

The invention according to claim 18 relates to a method for cooling an electronic component, wherein the inside of an information equipment terminal having a predetermined cooling device is separated into a high temperature region and a low temperature region, and each of the predetermined cooling devices is provided. It is characterized by adapting to each area and cooling each area individually.

The invention described in claim 19 is the same as claim 1.
According to the method of cooling an electronic component described in 8, the information device terminal is a personal computer.

The invention according to claim 20 is the same as claim 1
According to the method for cooling an electronic component as described in 9, the personal computer includes a CPU (central processing unit), a CPU cooling fan and / or a heat sink for cooling the CPU,
It is characterized by comprising a power supply device and a power supply device fan for cooling the power supply device.

The invention according to claim 21 is the same as claim 2
0. The electronic component cooling method according to 0, wherein the CPU cooling fan and / or the heat sink is used to cool the electronic component in the high temperature region, and the power supply fan is used to cool the electronic component in the low temperature region. It is characterized by cooling.

The invention according to claim 22 is the same as claim 2
The method for cooling an electronic component described in 0 or 21 is characterized in that the high temperature region and the low temperature region are separated by using a partition wall.

The invention of claim 23 is the same as that of claim 2
According to the method of cooling an electronic component described in 2, the partition wall is formed by a single rectangular flat plate.

The invention according to claim 24 is the same as claim 2
According to the method for cooling an electronic component as described in 2, the partition wall is formed by a riser board used as an expansion board and a riser bracket to which the riser board is attached.

Further, the invention of claim 25 is the same as claim 2
According to the method for cooling an electronic component described in 4, the riser bracket is formed by a single rectangular flat plate.

The invention of claim 26 is the same as that of claim 2.
According to the method for cooling an electronic component as described in 5, the riser bracket is formed by bending it according to the high temperature region and the low temperature region.

The invention according to claim 27 is the same as claim 2
The method for cooling an electronic component according to any one of 4 to 26, wherein the riser bracket is provided with an L-shaped hook provided at the center in the width direction of one end and provided at both ends in the width direction of the one end. Forming a raised portion and a screw portion provided at the center in the width direction of the other end, locking one end of the riser board with the raised portion and the hook, and fixing the other end with a screw Is characterized by.

The invention according to claim 28 is the same as claim 2
The method for cooling an electronic component described in any one of 4 to 26 is characterized in that the riser board is attached to the riser bracket with a screw.

The invention according to claim 29 is the same as claim 2
According to the method for cooling an electronic component described in any one of 1 to 28, the personal computer includes a CPU cooling fan duct that is provided on the CPU cooling fan and sends air to the CPU cooling fan. It has a feature.

The invention of claim 30 is the same as claim 2
According to a ninth aspect of the present invention, there is provided a method for cooling an electronic component, characterized in that a plurality of ventilation holes are provided at predetermined locations on a top surface and a side surface of the personal computer, and the CPU cooling fan duct is communicated with the plurality of ventilation holes. There is.

The invention of claim 31 is the same as that of claim 2.
According to the electronic component cooling method of any one of 0 to 30, the personal computer is characterized in that an additional fan is provided on a side facing the CPU cooling fan.

The invention according to claim 32 is the invention according to claim 2
According to the method for cooling an electronic component described in any one of 0 to 31, the electronic component is mounted on an SMT (surface mounting tec).
hnology) is characterized by mounting on a substrate.

The invention of claim 33 is the same as that of claim 2
The method for cooling an electronic component according to any one of 0 to 32, wherein the personal computer includes a memory that stores various programs and data, a chipset that is interposed between the CPU and the memory, and an external device. And a drive for driving the recording medium.

The invention according to claim 34 is the same as claim 3
According to the cooling method of the electronic component described in 3, in the above high temperature region,
The CPU, the chipset, and the memory are mounted,
The power supply device and the drive are mounted in the low temperature region.

[0043]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. The description will be made in detail using examples. First Embodiment First, with reference to FIG. 1, an electronic component cooling structure according to a first embodiment of the present invention will be described. FIG. 1 is a plan view showing the configuration of the cooling structure of this example. As shown in the figure, the cooling structure of this example includes a partition wall 3 that divides the inside of the personal computer into a high temperature region 1 and a low temperature region 2.
The high temperature region 1 is loaded with electronic components that relatively easily generate heat, and the low temperature region 2 is loaded with electronic components that are relatively hard to generate heat. The partition wall 3 is composed of a riser board 5 which is an expansion board and a riser bracket 4 which holds the riser board 5.

Next, with reference to FIG. 1, electronic components arranged in each region will be described. First, in the high temperature region 1, the CPU 8 that most easily generates heat inside the personal computer, the CPU cooling fan 8a that is closely mounted to the CPU 8 and cools the heat generated by the CPU 8, and the CPU 8 that is mounted close to the CPU 8 Chip set 9 consisting of LSI that controls basic functions
The memory 10 arranged adjacent to the CPU 8 and the chipset 9 and the graphic board 11 arranged at a position slightly apart from the CPU 8 are SMT (surface moun).
ting technology) mounted on the substrate 6. CPU
8, the chipset 9, and the memory 10 are components that easily generate heat, and the graphic board 11 is a component that relatively easily generate heat, and both are cooled by the CPU cooling fan 8a and a heat sink (not shown).

In the low temperature region 2, a power supply device 12
A power supply fan 12a closely mounted to the power supply 12 for cooling the power supply 12, a floppy disk drive (hereinafter, FDD) 13 for driving a floppy disk (hereinafter, FD), and a hard disk hardware (hereinafter, HD) A disk drive (hereinafter, referred to as HDD) 14 that drives a CD-ROM, a CD-ROM drive 15 that drives a CD-ROM, and other components that do not generate heat relatively.

Next, with reference to FIGS. 2 to 4, the partition wall of the cooling structure for electronic parts according to the first embodiment of the present invention will be described in detail. FIG. 2 is a top view (a) and a plan view (b) showing the structure of the riser bracket of the partition wall of this example. The riser bracket 4 of this example is made of a single flat plate, and includes a main body 4a and a raised portion 4b, a hook 4c, and a screw portion 4d provided on one surface of the main body, as shown in FIG. . The raised portion 4b, the hook portion 4c, and the screw portion 4d are provided at a predetermined distance, and the raised portion 4b and the hook 4c cooperate to hold one end portion of the riser board 5,
The other end of the riser board 5 is held by the screw portion 4d. As shown in FIG. 2B, the shape of each part is such that a hook part 4c is provided at the center of one end of the riser bracket 4 in the width direction,
The raised portion 4b is provided at two locations with the hook portion 4c interposed therebetween. The screw portion 4d is provided at one location in the widthwise center of the other end of the riser bracket 4, and the riser board 5
The riser board 5 is held by inserting a screw penetrating through the screw hole 4e into the screw hole 4e.

FIG. 3 is a plan view showing the structure of the riser board of the partition wall of this example. Riser board 5 in this example
Is composed of one flat plate, and as shown in the figure, has a notch 5a provided at one end and a screw hole 5b provided at the other end. The notch portion 5a is provided at the position of the hook portion 4c of the riser bracket 4 described above, and accommodates the hook portion 4c to prevent one end portion of the riser board 5 from above. The screw hole 5b has an inner diameter matching the screw hole 4e of the screw portion 4d of the riser bracket 4 described above, and the screw inserted from the screw hole 5b of the riser board 5 penetrates the screw hole 4e of the riser bracket 4. And is fixed to the screw portion 4d.

FIG. 4 is a top view (a) and a plan view (b) when the partition wall of this example is manufactured. The cooling structure of this example is manufactured by combining a riser bracket 4 and a riser board 5 as shown in the figure. First, align the cutout portion 5a and the screw hole 5b of the riser board 5 on the raised portion 4b and the screw portion 4d of the riser bracket 4, hold one end of the riser board 5 with the hook 4c, and screw the other end. 5c is fixed by penetrating the screw holes 5b and 4e.

As described above, according to the cooling structure of this example, the area separating member 3 separates the personal computer main body into the high temperature area 1 and the low temperature area, and the high temperature space 1 has the CPU cooling fan 8a. By applying the power supply device fan 12a to the low temperature space, an optimal cooling system for each region is adopted.

Second Embodiment Next, with reference to FIG. 5, an electronic component cooling structure according to a second embodiment of the present invention will be described. FIG. 5 is a plan view showing the configuration of the cooling structure of this example. As shown in the figure, the cooling structure of this example includes a partition wall 30 that divides the inside of the personal computer into a high temperature region 1 and a low temperature region 2. The high temperature region 1 is loaded with electronic components that relatively easily generate heat, and the low temperature region 2 is loaded with electronic components that are relatively hard to generate heat. The partition wall 30 includes a riser board 5 and a riser bracket 40 that holds the riser board 5. The riser bracket 40 used in this example is formed by bending the tip portion of the riser bracket 4 while the riser bracket 4 in the first embodiment described above is formed of a linear flat plate. different.

Next, with reference to FIG. 5, electronic components arranged in each area will be described. First, in the high temperature region 1, the CPU 8 that most easily generates heat inside the personal computer, the CPU cooling fan 8a that is closely mounted to the CPU 8 and cools the heat generated by the CPU 8, and the CPU 8 that is mounted close to the CPU 8 Chip set 9 consisting of LSI that controls basic functions
A memory 10 arranged adjacent to the CPU 8 and the chip set 9 and a graphic board 11 arranged at a position slightly apart from the CPU 8 are mounted on the SMT board 6. CPU 8, chip set 9, memory 10
Is a component that easily generates heat, and the graphic board 11
Is a component that relatively easily generates heat, and both are cooled by the CPU cooling fan 8a and a heat sink (not shown).

In the low temperature region 2, the power supply device 12 and
A power supply fan 12a closely mounted to the power supply 12 for cooling the power supply 12, and an FDD 1 for driving the FD
3, an HDD 14 for driving an HD, a de-CD-ROM live 15 for driving a CD-ROM, and other components that do not generate heat relatively.

Next, with reference to FIGS. 6 to 8, the partition wall of the cooling structure for electronic parts according to the second embodiment of the present invention will be described in detail. FIG. 6 is a top view (a) and a plan view (b) showing the structure of the riser bracket of the partition wall of this example. The riser bracket 40 of this example is made of one flat plate, and includes a main body 40a, a ridge 40b provided on one surface of the main body, a hook 40c, and a screw portion 40d, as shown in FIG. . Raised part 40b, hook part 40c
And the screw portion 40d are provided at a predetermined distance, and the raised portion 40b and the hook 40c cooperate with each other to hold one end of the riser board 5, and the screw portion 40d serves to raise the riser board 5.
Hold the other end of. As shown in FIG. 2B, the shape of each part is such that a hook portion 40c is provided at the center of one end of the riser bracket 40 in the width direction, and raised portions 40b are provided at two locations with the hook portion 40c interposed therebetween. Further, the screw portion 40d is provided at one place in the widthwise center of the other end of the riser bracket 40, and the screw penetrating from the riser board 5 is inserted into the screw hole 40e to hold the riser board 5. Further, the tip of the riser bracket 40 is, as shown in FIG. 4A, provided with a bent portion 40f formed by bending. This bent portion 40f has a high temperature region 1
It is provided to concentrate the cooling of.

FIG. 7 is a plan view showing the structure of the riser board for the partition wall of this example. Riser board 5 in this example
Is composed of one flat plate, and as shown in the figure, has a notch 5a provided at one end and a screw hole 5b provided at the other end. The cutout portion 5a is provided at the position of the hook portion 40c of the riser bracket 40 described above, and accommodates the hook portion 40c to restrain one end portion of the riser board 5 from above. The screw hole 5b has an inner diameter that matches the screw hole 40e of the screw portion 40d of the riser bracket 40 described above, and the screw inserted from the screw hole 5b of the riser board 5 corresponds to the screw hole 4 of the riser bracket 40.
It passes through 0e and is fixed to the screw portion 40d.

FIG. 8 is a top view (a) and a plan view (b) when the partition wall of this example is manufactured. The partition in this example is
As shown in the figure, it is manufactured by combining the riser bracket 40 and the riser board 5. First, the tip portion of the riser bracket 40 is bent to form a bent portion 40f, and the cutout portion 5 of the riser board 5 is formed on the raised portion 40b and the screw portion 40d of the riser bracket 40.
A and the screw hole 5b are aligned, one end of the riser board 5 is restrained by the hook 40c, and the other end is fixed by passing the screw 5c through the screw holes 5b and 40e.

As described above, according to the cooling structure of this example, the personal computer body is efficiently separated into the high temperature region 1 and the low temperature region by the region separating member 30, and the high temperature space 1 is cooled by the CPU. By applying the power supply fan 12a to the fan 8a and the low-temperature space, the optimal cooling method is adopted for each region, so that even if the electronic component reaches a high temperature, it can be efficiently dealt with.

Third Embodiment Next, with reference to FIG. 9, an electronic component cooling structure according to a third embodiment of the present invention will be described. FIG. 9 is a plan view showing the configuration of the cooling structure of this example. As shown in the figure, the cooling structure of this example includes a partition wall 30 that divides the inside of the personal computer into a high temperature region 1 and a low temperature region 2. The high temperature region 1 is loaded with electronic components that relatively easily generate heat, and the low temperature region 2 is loaded with electronic components that are relatively hard to generate heat. The partition wall 30 includes a riser board 5 and a riser bracket 40 that holds the riser board 5. Further, the riser bracket 40 is manufactured by bending the tip portion of the riser bracket 40, as in the second embodiment. Further, in the cooling structure of this example, in the second embodiment described above, a fan other than the CPU is not provided in the high temperature region 1, whereas an additional fan is provided in the high temperature region 1 on the side facing the CPU cooling fan 8a. It differs in that it has 16.

Next, with reference to FIG. 9, electronic components arranged in each region will be described. First, in the high temperature region 1, the CPU 8 that most easily generates heat inside the personal computer, the CPU cooling fan 8a that is closely mounted to the CPU 8 and cools the heat generated by the CPU 8, and the CPU 8 that is mounted close to the CPU 8 Chip set 9 consisting of LSI that controls basic functions
A memory 10 arranged adjacent to the CPU 8 and the chip set 9 and a graphic board 11 arranged at a position slightly apart from the CPU 8 are mounted on the SMT board 6. CPU 8, chip set 9, memory 10
Is a component that easily generates heat, and the graphic board 11
Is a component that relatively easily generates heat, and both are cooled by the CPU cooling fan 8a, the heat sink (not shown), and the additional fan 16.

In the low temperature region 2, a power supply device 12
A power supply fan 12a closely mounted to the power supply 12 for cooling the power supply 12, and an FDD 1 for driving the FD
3, an HDD 14 for driving an HD, a de-CD-ROM live 15 for driving a CD-ROM, and other components that do not generate heat relatively.

Since the riser bracket 40 and the riser board which are the area separating members of this example are the same as those of the second embodiment described above, their detailed construction will be omitted. As described above, according to the cooling structure of this example, the personal computer body is efficiently separated into the high temperature region 1 and the low temperature region by the region separating member 30, and the high temperature space 1 has the CPU cooling fan 8a, The additional fan 16 and the power supply fan 12a in the low temperature space
Since the optimum cooling method is applied to each area by applying, it is possible to efficiently cope with the situation where the electronic component reaches a higher temperature.

The embodiment of the present invention has been described in detail above with reference to the drawings. However, the specific configuration is not limited to this embodiment, and the design is changed within the scope not departing from the gist of the present invention. Even this is included in this invention. For example, in the above-mentioned embodiment, the partition wall 3 is manufactured by attaching the riser board 5 to the riser bracket 4, but the partition wall 3 is not limited to this, and the partition wall 3 can be manufactured using a single flat plate.

Further, in the above embodiment, the hook 4c of the riser bracket 4, the raised portion 4b, and the screw portion 4d.
The riser board 5 is attached to the riser bracket 4 by the notch portion 5a of the riser board 5 and the screw hole 5b. However, the riser board 5 is not limited to this, and can be attached only by screwing, or can be attached only by the hook. It can also be attached by gluing and any attachment method can be used.

Further, in the above-mentioned embodiment, the riser bracket 40 is manufactured by bending the tip thereof, but the invention is not limited to this, and the riser bracket 40 may be manufactured by variously deforming in accordance with the high temperature region 1 and the low temperature region 2.

In the above embodiment, the high temperature area 1 is cooled by the CPU cooling fan 8a, but the present invention is not limited to this, and a duct may be mounted on the CPU cooling fan for easy ventilation. It is also possible to provide cooling by providing a number of ventilation holes on the top and side surfaces of the housing.

Although the graphic board 11 is arranged near the partition walls 3 and 30 in the above embodiment, the invention is not limited to this, and the graphic board 11 may be arranged near the chassis 6.

[0066]

As described above, according to the configuration of the present invention, the personal computer main body is divided into the high temperature state and the low temperature state, and the optimum cooling system is adopted for each, so that efficient cooling is performed. You can Further, according to the configuration of the present invention, it is not necessary to install a fan that has been conventionally installed, and the desktop personal computer main body can be made compact. Further, according to the configuration of the present invention, even if a high temperature generating component such as a CPU is replaced with a component generating further higher temperature, an additional cooling device can be installed each time, so that it is possible to cope without remaking the casing structure, As a result, the manufacturing cost of the housing can be significantly reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing a cooling structure for an electronic component according to a first embodiment of the present invention.

FIG. 2 is a top view (a) and a plan view (b) showing a structure of a riser bracket of an electronic component cooling structure according to a first embodiment of the present invention.

FIG. 3 is a plan view showing a configuration of a riser board of a cooling structure for electronic parts according to a first embodiment of the present invention.

FIG. 4 is a top view (a) and a plan view (b) showing a partition wall of the electronic component cooling structure according to the first embodiment of the present invention.

FIG. 5 is a plan view showing a cooling structure for an electronic component according to a second embodiment of the present invention.

FIG. 6 is a top view (a) and a plan view (b) showing a structure of a riser bracket of a cooling structure for electronic parts according to a second embodiment of the present invention.

FIG. 7 is a plan view showing a configuration of a riser board of a cooling structure for electronic parts according to a second embodiment of the present invention.

FIG. 8 is a top view (a) and a plan view (b) showing a partition wall of an electronic component cooling structure according to a second embodiment of the present invention.

FIG. 9 is a plan view showing a cooling structure for an electronic component according to a third embodiment of the present invention.

FIG. 10 is a plan view showing a configuration of a conventional example.

[Explanation of symbols]

1 High temperature area 2 Low temperature region 3,30 bulkhead 4,40 riser bracket 4a, 40a body 4b, 40b ridge 4c, 40c hook 4d, 40d screw part 4e, 40e screw holes 5 riser board 5a Notch 5b screw hole 6 chassis 7 SMT substrate 8 CPU 8a CPU cooling fan 9 chipsets 10 memory 11 graphic board 12 power supply 12a power supply fan 13 FDD 14 HDD 15 CDD 16 additional fans 40f bending part

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 7/20 G06F 1/00 360B 360C

Claims (34)

[Claims] 1. A region separating means for separating the inside of an information equipment terminal having a predetermined cooling device into a high temperature region and a low temperature region, and the predetermined cooling device is configured to individually cool each region. The cooling structure for electronic parts is characterized by 2. The electronic component cooling structure according to claim 1, wherein the information equipment terminal is a personal computer. 3. The personal computer is a CPU
The central processing unit, a CPU cooling fan and / or heat sink for cooling the CPU, a power supply unit, and a power supply unit fan for cooling the power supply unit. Cooling structure for electronic components. 4. The electronic component in the high temperature region is cooled by using the CPU cooling fan and / or the heat sink, and the electronic component in the low temperature region is cooled by the fan for the power supply device. The cooling structure for an electronic component according to claim 3. 5. The cooling structure for an electronic component according to claim 3, wherein the area separating means is a partition wall. 6. The cooling structure for an electronic component according to claim 5, wherein the partition wall is composed of one rectangular flat plate. 7. The cooling structure for an electronic component according to claim 5, wherein the partition wall includes a riser board used as an expansion board and a riser bracket to which the riser board is attached. 8. The cooling structure for an electronic component according to claim 7, wherein the riser bracket is formed of one rectangular flat plate. 9. The cooling structure for an electronic component according to claim 8, wherein the riser bracket is formed by bending in accordance with the high temperature region and the low temperature region. 10. The riser bracket is provided with an L-shaped hook provided at one end in the widthwise center, raised portions provided at both ends in the widthwise direction at one end, and provided at the center in the widthwise direction at the other end. The riser board,
One end is locked by the raised portion and the hook,
The cooling structure for an electronic component according to claim 7, wherein the other end is fixed by a screw. 11. The cooling structure for an electronic component according to claim 7, wherein the riser board is attached to the riser bracket with a screw. 12. The personal computer according to claim 1, further comprising a CPU cooling fan duct which is provided on the CPU cooling fan and sends air to the CPU cooling fan. The cooling structure for the described electronic component. 13. A personal computer having a plurality of ventilation holes at predetermined positions on a top surface and a side surface of the personal computer.
The cooling structure for an electronic component according to claim 12, wherein a cooling fan duct communicates with the plurality of ventilation holes. 14. The electronic component cooling structure according to claim 3, wherein the personal computer includes an additional fan on a side facing the CPU cooling fan. 15. The electronic component is an SMT (surface moth).
15. The cooling structure for electronic components according to claim 3, wherein the cooling structure is mounted on a substrate. 16. The personal computer further comprises a memory for storing various programs and data, a chipset inserted between the CPU and the memory, and a drive for driving an external recording medium. The cooling structure for an electronic component according to any one of claims 3 to 15, wherein: 17. The high temperature region is mounted with the CPU, the chipset, and the memory, and the low temperature region is mounted with the power supply device and the drive. Cooling structure for electronic components. 18. The information equipment terminal having a predetermined cooling device is divided into a high temperature region and a low temperature region, the predetermined cooling device is adapted to each region, and each region is individually cooled. Cooling method for electronic components. 19. The method of cooling an electronic component according to claim 18, wherein the information equipment terminal is a personal computer. 20. The personal computer is a CP
The U (central processing unit), a CPU cooling fan and / or a heat sink for cooling the CPU, a power supply device, and a power supply device fan for cooling the power supply device are provided. Cooling method for electronic components. 21. Cooling electronic components in the high temperature region using the CPU cooling fan and / or heat sink,
21. The method of cooling an electronic component according to claim 20, wherein the fan for the power supply device is used to cool the electronic component in the low temperature region. 22. The high temperature region and the low temperature region are separated by using a partition wall.
A method for cooling an electronic component as described. 23. The method of cooling an electronic component according to claim 22, wherein the partition wall is formed of a single rectangular flat plate. 24. The partition wall is formed by a riser board used as an expansion board and a riser bracket to which the riser board is attached.
2. The method for cooling an electronic component according to 2. 25. The method of cooling an electronic component according to claim 24, wherein the riser bracket is formed of a single rectangular flat plate. 26. The method of cooling an electronic component according to claim 25, wherein the riser bracket is formed by bending it according to the high temperature region and the low temperature region. 27. In the riser bracket, an L-shaped hook is provided at one end in the widthwise center, raised portions at one end in the widthwise direction, and another end is provided at the widthwise center. 3. The riser board is formed with a threaded portion, and one end portion of the riser board is locked by the raised portion and the hook, and the other end portion is fixed by a screw.
27. The method for cooling an electronic component according to any one of 4 to 26. 28. The method of cooling an electronic component according to claim 24, wherein the riser board is attached to the riser bracket with a screw. 29. The personal computer according to claim 20, further comprising a CPU cooling fan duct which is provided on the CPU cooling fan and sends air to the CPU cooling fan. A method for cooling an electronic component as described. 30. A plurality of ventilation holes are provided at predetermined places on the top and side surfaces of the personal computer, and the CPU is provided.
30. The method of cooling an electronic component according to claim 29, wherein a cooling fan duct is communicated with the plurality of ventilation holes. 31. The personal computer according to claim 20, further comprising an additional fan on a side facing the CPU cooling fan.
The method for cooling an electronic component described in. 32. The SMT (surface mo
32. The cooling method for an electronic component according to claim 20, wherein the electronic component is mounted on a substrate. 33. The personal computer further comprises a memory for storing various programs and data, a chipset inserted between the CPU and the memory, and a drive for driving an external recording medium. 33. The method for cooling an electronic component according to claim 20, further comprising: 34. The high temperature area is mounted with the CPU, the chipset, and the memory, and the low temperature area is mounted with the power supply device and the drive. Cooling method for electronic components.